CN101325192A - Substrate easy to measure temperature and manufacturing method thereof - Google Patents
Substrate easy to measure temperature and manufacturing method thereof Download PDFInfo
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- CN101325192A CN101325192A CN200810110853.5A CN200810110853A CN101325192A CN 101325192 A CN101325192 A CN 101325192A CN 200810110853 A CN200810110853 A CN 200810110853A CN 101325192 A CN101325192 A CN 101325192A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention relates to a substrate, which facilitates temperature measurement, and a manufacturing method thereof. The substrate comprises at least one backing material, and a plurality of conducting terminals arranged on the backing material; wherein at least one conducting terminal has a spherical indent to mate with a temperature sensor, so that the temperature sensor can be fixed inside the spherical indent. The manufacturing method of the substrate comprises the steps of: providing the backing material; arranging the plurality of conducting terminals on the backing material, wherein at least one conducting terminal has the indent; providing the temperature sensor with a sensing bump; arranging the temperature sensor on at least one conducting terminal to allow the sending bump to be embedded inside the indent; adhering an anisotropic conductive film (ACF) in a region, wherein the conducting terminal is arranged; arranging conducting elements in the region in the positions corresponding to the conducting terminals; and fixedly connecting the conducting elements with the conducting terminals. The inventive substrate can be used for temperature measurement by an operator, with the advantages of simplified, convenient and rapid operation, and improve accuracy.
Description
Technical field
The present invention relates to a kind of substrate and manufacture method thereof, particularly relate to a kind of thermometric operation that is used for, can improve the accuracy of thermometric operation, can improve the speed of thermometric operation and the substrate and the manufacture method thereof that are easy to measure temperature of accuracy.
Background technology
Seeing also shown in Figure 1ly, is the schematic diagram of the substrate of existing known thermometric processing procedure.Have the substrate 10 of known thermometric processing procedure now, formed by base material 11 and conducting terminal 12.Concerning with electronic component that conducting terminal 12 is connected, according to the heat conduction phenomenon, the temperature of conducting terminal 12 can reflect temperature of electronic component.When substrate 10 when carrying out heating processing, (for example: wafer) be attached to conducting terminal 12, temperature is crossed and low wafer is bonded on the conducting terminal 12 effectively, the too high circuit characteristic that can be detrimental to again in the substrate 10 of temperature with electronic component.Therefore, set or during the cycle maintenance, need to seek or proofread and correct hot process conditions at hot process work bench, thus need a hot process parameter measuring fixture, to obtain suitable hot process parameter.In order to measure the variations in temperature of conducting terminal 12 in the heating process, normally adopt thermocouple 90 to measure, the tester can adjust the temperature and time of heating according to the result who measures.
This thermocouple 90 normally is interconnected into a loop by two kinds of metal wires, its junction point is arranged in the environment to be measured with particular temperature value, can produce thermo-electromotive force at the two ends of metal wire.The junction point of aforesaid two kinds of metal wires is sensing salient point 91, and this sensing salient point 91 is the outward appearances with convex, as shown in Figure 1.When carrying out the thermometric operation, this sensing salient point 91 will be arranged on the conducting terminal to be measured 12, with the measurement situation of the temperature change of conducting terminal 12 in the process of heating, and judge whether this temperature change falls within the predetermined scope.
Yet in this thermometric operation, the sensing salient point 91 with convex outward appearance is not easy the location, comes off from conduction electric terminal 12 to be measured easily, and temperature-measuring results was lost efficacy.In addition, owing to there is no any mark on the conducting terminal 12, the tester also must tell conducting terminal to be measured 12 all conducting terminals 21 from base material 11, and prolong the time of whole thermometric operation at the initial stage of thermometric operation.In addition, when the tester makes a mistake, can't obtain correct temperature-measuring results in the resolution process.
As mentioned above, for fear of the inefficacy of thermometric operation and simplify whole thermometric operation, be necessary to provide a kind of substrate, it is applicable in the thermometric operation, and simplified operation and improve the effect of accuracy.
This shows that the substrate of above-mentioned existing thermometric processing procedure and manufacture method thereof obviously still have inconvenience and defective, and demand urgently further being improved in product structure, manufacture method and use.For solving the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.For fear of the inefficacy of thermometric operation and simplify whole thermometric operation, be necessary to provide a kind of substrate, it is applicable in the thermometric operation, and can reaches the effect that simplifies the operation and improve accuracy.Therefore how to found a kind of new substrate and the manufacture method thereof that are easy to measure temperature, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that the substrate of above-mentioned existing thermometric processing procedure and manufacture method thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new substrate and the manufacture method thereof that are easy to measure temperature, can improve the defective of prior art, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective of the substrate existence of existing thermometric processing procedure, and provide a kind of substrate that is easy to measure temperature of new structure, technical problem to be solved is to make it can solve prior art problems, and be convenient to the tester and carry out the thermometric operation, be very suitable for practicality.
Another purpose of the present invention is, overcomes the defective that the manufacture method of existing substrate exists, and a kind of manufacture method of new substrate is provided, and technical problem to be solved is to make it can solve prior art problems, and can quicken the carrying out of thermometric operation.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of substrate that is easy to measure temperature that the present invention proposes, it comprises: a base material; And many conducting terminals, be arranged on this base material; Wherein, at least one those conducting terminals have a bulb-shaped recess, to cooperate with a temperature sensor, this temperature sensor are fixed in this bulb-shaped recess.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The aforesaid substrate that is easy to measure temperature, wherein said temperature sensor have a sensing salient point, and this sensing salient point is embedded in this bulb-shaped recess.
The aforesaid substrate that is easy to measure temperature, wherein said bulb-shaped recess is formed on those conducting terminals for adopting an etch process.
The aforesaid substrate that is easy to measure temperature, wherein said bulb-shaped recess are to be formed between 1/3 to 1/2 length of those conducting terminals.
The aforesaid substrate that is easy to measure temperature, it more comprises a dielectric layer, and it is between this base material and those conducting terminals, and this dielectric layer has another bulb-shaped recess, and its shape is corresponding to this bulb-shaped recess.
The aforesaid substrate that is easy to measure temperature, wherein said those conducting terminals comprise: a function terminal, an earth terminal and a pseudo-terminal, it has this bulb-shaped recess respectively.
The aforesaid substrate that is easy to measure temperature, wherein said those conducting terminals have a difference respectively and indicate, and this difference indicates and combines with the perforation number by color, pattern, perforation number or color, pattern, and distinguishes those conducting terminals.
The aforesaid substrate that is easy to measure temperature, wherein said temperature sensor are a thermocouple.
The aforesaid substrate that is easy to measure temperature, wherein said those conducting terminals are metal and transparency conducting layer composite construction, and this base material is a glass.
The aforesaid substrate that is easy to measure temperature, wherein said base material are a printed circuit board (PCB), and those conducting terminals are a metallic circuit.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The manufacture method of a kind of substrate that proposes according to the present invention may further comprise the steps: a base material is provided; Many conducting terminals are set on this base material, at least one those conducting terminals have a depression; One temperature sensor is provided, and those temperature sensors have a sensing salient point; This temperature sensor is set at least one those conducting terminals, this sensing salient point is embedded in this depression; Attach an aeolotropic conductive film in the zone that those conducting terminals are set; Contraposition is disposed a conducting element in this zone; And solidify this conducting element of connection to those conducting terminals.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid substrate, wherein said conducting element are membrane of flip chip encapsulation, winding encapsulation, a flexible PCB or a wafer.
The manufacture method of aforesaid substrate, wherein said conducting terminal comprises: a function terminal, an earth terminal and a pseudo-terminal, it has this depression respectively.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
For achieving the above object, one aspect of the present invention provides a kind of substrate that is easy to measure temperature, and this substrate comprises base material and many conducting terminals, and many conducting terminals are arranged on the base material.And at least one conducting terminal has a bulb-shaped recess (the side section of bulb-shaped recess is a camber line), and this bulb-shaped recess makes temperature sensor can be fixed in this bulb-shaped recess in order to cooperate a temperature sensor.The shape of the sensing part that for instance, the shape of bulb-shaped recess can rough corresponding temperature sensing element.
Need to prove that this bulb-shaped recess can be dome-type or not a half ball-type (the side section of depression is a minor arc), the sensing part of temperature sensor only needs being embedded in this bulb-shaped recess of part can reach fixed effect.
According to a preferred embodiment of the present invention, this temperature sensor can be a thermocouple, and this thermocouple has a salient point, and this salient point can be embedded in the bulb-shaped recess, makes the corresponding one by one setting of thermocouple and bulb-shaped recess.That is the shape of salient point meets the shape of bulb-shaped recess roughly, and salient point can be fixed in fact in the bulb-shaped recess, contacts closely between salient point and the bulb-shaped recess, makes temperature survey more accurate.
According to a preferred embodiment of the present invention, substrate can be liquid crystal module, and in this case, conducting terminal is the composite construction of metal and transparency conducting layer, and base material is a glass.In the process of the composite construction of formation multiple layer metal on glass and transparency conducting layer, optionally adopt etch process and on composite construction, form a bulb-shaped recess.Simultaneously, the generation type of bulb-shaped recess is not limited to the etching of skin-material, and bulb-shaped recess also can be formed on some material layers between base material and conducting terminal (for example dielectric layer), and the conducting terminal skin-material is uniform.
In addition, according to one embodiment of the invention, this conducting terminal comprises at least three kinds of terminals, and it is respectively function terminal, earth terminal and pseudo-terminal, and at least one in every kind of conducting terminal has bulb-shaped recess.And preferably, three kinds of conducting terminals have difference respectively and indicate, and it combines with the perforation number by color, pattern, perforation number or color, pattern, and distinguishes different types of conducting terminal.
In addition, another aspect of the present invention is that a kind of manufacture method of substrate is being provided, and with solving prior art problems, and can quicken the carrying out of thermometric operation.
For achieving the above object, the present invention also provides the manufacture method of another kind of substrate, comprises following step: a base material is provided, many conducting terminals is set on base material; On at least one conducting terminal, form a depression; Temperature sensor is provided, and temperature sensor has a salient point; Temperature sensor is set on conducting terminal, salient point is embedded in the depression; Attach aeolotropic conductive film in the zone that conducting terminal is set; Contraposition configuration conducting element is in the zone; And solidify the connection conducting element to conducting terminal.
By technique scheme, substrate and manufacture method thereof that the present invention is easy to measure temperature have following advantage and beneficial effect at least:
1, uses substrate of the present invention,, can prevent that the sensing salient point of temperature sensor breaks away from conducting terminal to be measured, and can improve the accuracy of thermometric operation by the bulb-shaped recess that is arranged on the conducting terminal.
2, in addition, the present invention can indicate by the difference on the conducting terminal, and distinguishes this a little terminals, can make things convenient for these a little terminals of tester's identification, and then can improve the speed and the accuracy of thermometric operation.
In sum, the invention relates to a kind of substrate and manufacture method thereof that is easy to measure temperature, substrate comprises a base material and many conducting terminals at least, many conducting terminal is arranged on this base material, at least one conducting terminal has a bulb-shaped recess to cooperate with temperature sensor, temperature sensor is fixed in the bulb-shaped recess substantially, and can improves the accuracy of temperature-measuring results.The substrate that is easy to measure temperature of the present invention can effectively solve the problem that prior art exists, avoid the inefficacy of thermometric operation and simplify whole thermometric operation, it is applicable in the thermometric operation, and have simplified operation and improve the effect of accuracy, can be convenient to the tester and carry out the thermometric operation.The manufacture method of substrate of the present invention can be quickened the carrying out of thermometric operation.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure, manufacture method or function, obvious improvement is arranged technically, and produced handy and practical effect, and the substrate of more existing thermometric processing procedure and manufacture method thereof have the outstanding effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram that has the substrate of known thermometric processing procedure now.
Fig. 2 is the vertical view of a kind of substrate of illustrating according to a preferred embodiment of the present invention.
Fig. 3 A is along A-A ' section among Fig. 2 and the end view of a kind of substrate of a preferred embodiment of the present invention that gets.
Fig. 3 B is along A-A ' section among Fig. 2 and the end view of the another kind of substrate of a preferred embodiment of the present invention that gets.
Fig. 4 is a kind of schematic diagram that is used for the substrate of hot pressing processing procedure according to a preferred embodiment of the present invention.
Fig. 5 is the flow chart according to the manufacture method of the substrate of another preferred embodiment of the present invention.
10: substrate 11: base material
20: substrate 21: conducting terminal
22: conducting terminal 23: conducting terminal
24: bulb-shaped recess 25: bulb-shaped recess
26: base material 27: dielectric layer
28: bulb-shaped recess 32: thermocouple
34: sensing salient point 44: aeolotropic conductive film
46: conducting element 48: heater
51～57: step 90: thermocouple
91: the sensing salient point
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to the substrate and its embodiment of manufacture method, structure, method, step, feature and the effect thereof that are easy to measure temperature that foundation the present invention proposes, describe in detail as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.By the explanation of embodiment, when can being to reach technological means that predetermined purpose takes and effect to get one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, be not to be used for the present invention is limited.
In preferred embodiment of the present invention, temperature sensor for example is a thermocouple, and it has the sensing salient point that expands, but the variation of sensing temperature and adjust its terminal voltage.Unlikelyly in conducting terminal in the process of thermometric, produce skew for the sensing salient point can be embedded, have influence on the accuracy of temperature, thus a bulb-shaped recess is set on conducting terminal to be measured, with fixing thermocouple.
Specify preferred embodiment of the present invention below, see also shown in Fig. 2 and Fig. 3 A, Fig. 2 is the vertical view of a kind of substrate of illustrating according to a preferred embodiment of the present invention, Fig. 3 A be in Fig. 2 A-A ' section and a kind of end view of substrate of a preferred embodiment of the present invention.This preferred embodiment of the present invention provides a substrate 20, and this substrate 20 comprises base material 26 and many conducting terminals 21,22,23.Many conducting terminal 21,22,23 is arranged on the base material 26.At least one conducting terminal 21,22,23 has sphere depression 24,25 to cooperate with temperature sensor, and temperature sensor is fixed in the bulb- shaped recess 24,25 substantially.The shape of the sensing part that for instance, the shape of bulb- shaped recess 24,25 can rough corresponding temperature sensing element.
In preferred embodiment of the present invention, temperature sensor for example is a thermocouple 32, and it has the sensing salient point 34 that expands, variation that can sensing temperature and adjust its terminal voltage.For can being embedded, sensing salient point 34 produces skew in conducting terminal 21,22,23 and in the unlikely process at thermometric, have influence on the accuracy of temperature, so a bulb- shaped recess 24,25 is set, on conducting terminal to be measured 21,22,23 with fixing thermoelectric lotus root 32.。
In order to further specify the structure of this bulb- shaped recess 24,25 and sensing salient point 34, A-A ' hatching in Fig. 2 and draw the profile of bulb-shaped recess 25, as shown in Figure 3A.Because the shape of this sensing salient point 34 can rough shape corresponding to bulb-shaped recess 25, therefore in whole thermometric operation, sensing salient point 34 is to be embedded in the bulb-shaped recess 25, so can avoid salient point to come off, and combine closely with conducting terminal 22, can improve the accuracy of temperature-measuring results.
In addition, can adopt etch process and form bulb-shaped recess 24,25 respectively on above-mentioned conducting terminal 21,22,23, bulb-shaped recess 24,25 can be in order to put the sensing salient point 34 (shown in Fig. 3 A and Fig. 3 B) of thermocouple 32, the present invention is not limited to this, also can adjust formation method, face shaping, number and the distributing position of bulb-shaped recess according to actual demand.
This base material 26 can be glass or printed circuit board (PCB), but the present invention is not limited to this, also can adjust number, size and the density distribution of substrate material or conducting terminal according to actual demand.
In preferred embodiment of the present invention, temperature sensor for example is a thermocouple 32, and it has the sensing salient point 34 that expands, but the variation of sensing temperature and adjust its terminal voltage.Unlikelyly in conducting terminal in the process of thermometric, produce skew for sensing salient point 34 can be embedded, have influence on the accuracy of temperature, therefore, arcuation depression 24,25 is set on conducting terminal to be measured 21,22,23, with fixing thermocouple 32.
In order to further specify the structure of this bulb-shaped recess 24,25 and sensing salient point 34, A-A ' hatching in Fig. 2 and draw the profile of bulb-shaped recess 25, as shown in Figure 3A.Because sensing salient point 34 is a salient point, and the shape of this salient point can rough shape corresponding to bulb-shaped recess 25, therefore in whole thermometric operation, sensing salient point 34 can be embedded in the bulb-shaped recess 25, so can avoid salient point to come off, and combine closely with conducting terminal 22, and can improve the accuracy of temperature-measuring results.
In addition, the present invention can adopt etch process and form bulb-shaped recess 24,25 respectively on conducting terminal 21,22,23, bulb-shaped recess 25 can be in order to put the sensing salient point 34 (shown in Fig. 3 A and Fig. 3 B) of thermocouple 32, yet the present invention is not limited to this, also can be according to formation method, face shaping, number and the distributing position of actual demand adjustment depression.
In addition, base material 26 can be glass or printed circuit board (PCB), but the present invention is not limited to this, also can adjust number, size and the density distribution of the material or the conducting terminal of base material 26 according to actual demand.
Thermometric processing procedure with liquid crystal module is an example, and this base material 26 can be glass, and conducting terminal 21,22,23 can be metal and transparency conducting layer composite construction, and this bulb-shaped recess 24,25 is formed on the conducting terminal 21,22,23, so that place thermocouple.For adjusting the heating-up temperature of humidifier, whether the temperature by the conducting terminal on the substrate of judging liquid crystal module is in preset range, for example 190 ± 20 ℃, if temperature-measuring results shows the temperature of conducting terminal and surpasses preset range, then can reduce the heating-up temperature of heater, otherwise, the heating-up temperature of the heater that then can raise, yet the Temperature numerical of preset range only is that the present invention is not limited to this for example herein.
In addition, be example with the thermometric processing procedure of printed circuit board (PCB), whether the temperature of the conducting terminal of printed circuit board (PCB) is in preset range in heating processing in order to measure, and base material 26 can be printed circuit board (PCB), and conducting terminal 21,22,23 can be metallic circuit or golden finger.Bulb-shaped recess 24,25 is formed on the conducting terminal 21,22,23, so that place thermocouple.
See also shown in Figure 2, in this embodiment, in order to improve the accuracy of thermometric operation, bulb-shaped recess the 24, the 25th is arranged between 1/3 to 1/2 length of conducting terminal 21,22,23, the temperature of the conducting terminal 21,22,23 in this length range is generally the highest, and the temperature value that thermocouple measured is also the most representative.
Yet, bulb-shaped recess of the present invention, be not restricted to be arranged between 1/3 to 1/2 length of conducting terminal 21,22,23, those skilled in the art with common knowledge, can be according to the characteristic of the demand of different thermometric processing procedures and conducting terminal to be measured and determine the position of bulb-shaped recess, to carry out the thermometric operation.
Electrical functionality according to conducting terminal 21,22,23 can be divided into function terminal, earth terminal and pseudo-terminal, and these three kinds of terminals at least one have bulb-shaped recess 24,25 respectively.These three kinds of terminals of tester's identification for convenience can be put on different colors, pattern, perforation number or color respectively with three kinds of conducting terminals, pattern combines with the perforation number, distinguishing those conducting terminals, and can improve the speed and the accuracy of thermometric operation.For instance, function terminal, earth terminal and pseudo-terminal can be put on redness, green and blue respectively.Perhaps, function terminal, earth terminal and pseudo-terminal are marked with different geometrical pattern respectively, for example circle, triangle and rectangle.In addition, function terminal, earth terminal and pseudo-terminal are marked with the perforation of different numbers respectively, for example one, two with three perforation; When perhaps function terminal, earth terminal and pseudo-terminal being marked with redness, green and blueness respectively, function terminal, earth terminal and pseudo-terminal are marked with different geometrical pattern respectively.
Thus, tester's the disconnected rate of erroneous judgement can be reduced, and the speed and the accuracy of thermometric processing procedure can be improved.
On the other hand, the formation position of bulb-shaped recess is not limited to the etching of skin-material, and bulb-shaped recess also can be formed on the material layer between base material and the conducting terminal (for example dielectric layer), and top layer (for example conductive terminal layer) material thickness is uniform.
Seeing also shown in Fig. 3 B, is along A-A ' section among Fig. 2 and the structure side view of the another kind of substrate of a preferred embodiment of the present invention that gets.The substrate of the another kind of structure that a preferred embodiment of the present invention illustrated, bulb-shaped recess 28 can adopt etch process and be formed on the dielectric layer 27 between base material 26 and the conducting terminal 22, and the thickness of conducting terminal 22 is uniform, so shape of the corresponding bulb-shaped recess 27 of the shape of bulb-shaped recess 25, that is this bulb-shaped recess 25 has similar shapes with bulb-shaped recess 27.The shape of the sensing salient point 34 of thermocouple 32 can rough shape corresponding to bulb-shaped recess 25, makes sensing salient point 34 be fixed in this bulb-shaped recess 25 substantially, so that conducting terminal 32 combines closely with sensing salient point 34.
Seeing also shown in Figure 4ly, is a kind of schematic diagram that is used for the substrate of hot pressing processing procedure according to a preferred embodiment of the present invention.This hot pressing processing procedure can be used in the module assembling process, for example: membrane of flip chip encapsulation (clip on film; COF), winding encapsulation (tape carrier package; TCP) flexible circuit board (flexible printed circuit; FPC) etc. with the pressing of glass substrate or circuit board; Glass flip chip encapsulation (clip on glass; COG) or wafer directly stick at circuit board process mode (clip onboard; COB) or the like, only be to illustrate various module assembling processes, but the present invention is not limited to this, can use according to actual demand herein.
In this embodiment, many conducting terminals 22 are arranged on the base material 26, and at least one conducting terminal 22 has a bulb-shaped recess (not illustrating), can be in the fixing thermocouple 32 of this bulb-shaped recess.Preferably, the shape of the sensing salient point (not illustrating) of thermocouple 32 can rough shape corresponding to bulb-shaped recess, and therefore in whole hot pressing processing procedure, the sensing salient point can be embedded in the bulb-shaped recess, and can avoid the sensing salient point to break away from conducting terminal 22.
And aeolotropic conductive film (ACF) 44 is attached to the zone that conducting terminal 22 is set on the base material 26, and in this zone, and contraposition configuration conducting element 46 makes the conducting terminal 22 on the conducting terminal electric property coupling base material 26 of conducting element 46.Conducting element 46 can be membrane of flip chip encapsulation, winding encapsulation, flexible circuit board or wafer, only be for example herein, but the present invention is not limited to this, and the technical staff that the technical field of the invention has common knowledge can select the classification of conducting element according to actual demand.After the contraposition operation is finished, adopt heater 48 to carry out hot pressing, to solidify aeolotropic conductive film 44, make conducting element 46 and corresponding conducting terminal electric property coupling each other.
In this hot pressing processing procedure, the heating time of heater 48 and temperature are very important to conducting element 46 with base material 26.If heating time is long and heating-up temperature is too high, then may cause the electronic component in the conducting element 46 to damage because of overheated.In addition,, then need prolong heating time, make the required time of overall process elongate, not meet cost benefit if heating-up temperature is low excessively.For the heating time and the temperature of regulating heater 48, the substrate that the tester can adopt preferred embodiment of the present invention to provide, and with reference to the different measurements of pairing thermocouple under different heating time and temperature, to judge the best heating time and the temperature of heater 48, be beneficial to the follow-up volume production of liquid crystal module.
Seeing also shown in Figure 5ly, is the flow chart according to the manufacture method of the substrate of another preferred embodiment of the present invention.In the manufacture method of the substrate of another preferred embodiment of the present invention, this substrate preferably is a liquid crystal module, and the manufacture method of this liquid crystal module comprises the following steps:
At first, in step 51, provide a base material, and many conducting terminals are set on base material;
Then, in step 52, at least one conducting terminal, form a depression;
Then, in step 53, provide temperature sensor, temperature sensing component has a salient point, and temperature sensor is set on conducting terminal, makes salient point be embedded at (step 54) in the depression;
Afterwards, in step 55, attach aeolotropic conductive film in the zone that conducting terminal is set, and at regional contraposition configuration conducting element (step 56).
At last, in step 57, solidify the connection conducting element to base material.
In addition, this liquid crystal module manufacture method in, three kinds of conducting terminals are set on base material, it is respectively function terminal, earth terminal and pseudo-terminal; At least one of these three kinds of terminals at least one have depression respectively.These three kinds of terminals of tester's identification for convenience, difference indicate and can adopt the combining distinguishing this a little terminals of different colors, pattern, perforation number or color, pattern and perforation number, and can improve the speed and the accuracy of thermometric operation.
By another preferred embodiment of the invention described above as can be known, use substrate of the present invention,, can prevent that the sensing salient point of thermocouple breaks away from conducting terminal to be measured, and can improve the accuracy of thermometric operation by the depression that is arranged on the conducting terminal.In addition, preferred embodiment of the present invention can be by indicating being incorporated on the conducting terminal of different colors, pattern or perforation number or color, pattern and perforation number, and distinguish this a little terminals, can make things convenient for these a little terminals of tester's identification, so can improve the speed and the accuracy of thermometric operation.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (13)
1, a kind of substrate that is easy to measure temperature is characterized in that it comprises:
One base material; And
Many conducting terminals are arranged on this base material;
Wherein, at least one those conducting terminals have a bulb-shaped recess, to cooperate with a temperature sensor, this temperature sensor are fixed in this bulb-shaped recess.
2, the substrate that is easy to measure temperature according to claim 1 is characterized in that wherein said temperature sensor has a sensing salient point, and this sensing salient point is embedded in this bulb-shaped recess.
3, the substrate that is easy to measure temperature according to claim 1 is characterized in that wherein said bulb-shaped recess is formed on those conducting terminals for adopting an etch process.
4, the substrate that is easy to measure temperature according to claim 1 is characterized in that wherein said bulb-shaped recess is to be formed between 1/3 to 1/2 length of those conducting terminals.
5, the substrate that is easy to measure temperature according to claim 1 is characterized in that it more comprises a dielectric layer, and it is between this base material and those conducting terminals, and this dielectric layer has another bulb-shaped recess, and its shape is corresponding to this bulb-shaped recess.
6, the substrate that is easy to measure temperature according to claim 1, it is characterized in that wherein said those conducting terminals comprise: a function terminal, an earth terminal and a pseudo-terminal, it has this bulb-shaped recess respectively.
7, the substrate that is easy to measure temperature according to claim 6, it is characterized in that wherein said those conducting terminals have a difference respectively and indicate, this difference indicates and combines with the perforation number by color, pattern, perforation number or color, pattern, and distinguishes those conducting terminals.
8, the substrate that is easy to measure temperature according to claim 1 is characterized in that wherein said temperature sensor is a thermocouple.
9, the substrate that is easy to measure temperature according to claim 1 is characterized in that wherein said those conducting terminals are metal and transparency conducting layer composite construction, and this base material is a glass.
10, the substrate that is easy to measure temperature according to claim 1 it is characterized in that wherein said base material is a printed circuit board (PCB), and those conducting terminals is a metallic circuit.
11, a kind of manufacture method of substrate is characterized in that it may further comprise the steps:
One base material is provided;
Many conducting terminals are set on this base material, at least one those conducting terminals have a depression;
One temperature sensor is provided, and those temperature sensors have a sensing salient point;
This temperature sensor is set at least one those conducting terminals, this sensing salient point is embedded in this depression;
Attach an aeolotropic conductive film in the zone that those conducting terminals are set;
Contraposition is disposed a conducting element in this zone; And
Solidify and connect this conducting element to those conducting terminals.
12, the manufacture method of substrate according to claim 11 is characterized in that wherein said conducting element is membrane of flip chip encapsulation, winding encapsulation, a flexible PCB or a wafer.
13, the manufacture method of substrate according to claim 11 is characterized in that described conducting terminal comprises: a function terminal, an earth terminal and a pseudo-terminal, it has this depression respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200810110853.5A CN101325192B (en) | 2008-06-13 | 2008-06-13 | Substrate easy to measure temperature and manufacturing method thereof |
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| CN200810110853.5A CN101325192B (en) | 2008-06-13 | 2008-06-13 | Substrate easy to measure temperature and manufacturing method thereof |
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| CN101325192A true CN101325192A (en) | 2008-12-17 |
| CN101325192B CN101325192B (en) | 2010-08-04 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346082A (en) * | 2011-07-30 | 2012-02-08 | 常州天合光能有限公司 | Method for measuring temperature of melted tin during welding of battery film |
| CN104299925A (en) * | 2013-07-18 | 2015-01-21 | 技鼎股份有限公司 | Temperature measuring device for semiconductor process |
| CN105489521A (en) * | 2014-10-09 | 2016-04-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature measurement wafer and preparation method of same |
| CN108168732A (en) * | 2017-12-21 | 2018-06-15 | 姜莉 | A kind of thermometric sample makes smelting tool |
| CN109974870A (en) * | 2017-12-27 | 2019-07-05 | 核动力运行研究所 | A kind of wave point formula metal outer wall temperature measurement device |
| CN110299310A (en) * | 2019-06-14 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
| CN111090013A (en) * | 2018-10-23 | 2020-05-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
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2008
- 2008-06-13 CN CN200810110853.5A patent/CN101325192B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346082A (en) * | 2011-07-30 | 2012-02-08 | 常州天合光能有限公司 | Method for measuring temperature of melted tin during welding of battery film |
| CN104299925A (en) * | 2013-07-18 | 2015-01-21 | 技鼎股份有限公司 | Temperature measuring device for semiconductor process |
| CN105489521A (en) * | 2014-10-09 | 2016-04-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature measurement wafer and preparation method of same |
| CN108168732A (en) * | 2017-12-21 | 2018-06-15 | 姜莉 | A kind of thermometric sample makes smelting tool |
| CN109974870A (en) * | 2017-12-27 | 2019-07-05 | 核动力运行研究所 | A kind of wave point formula metal outer wall temperature measurement device |
| CN111090013A (en) * | 2018-10-23 | 2020-05-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
| CN111090013B (en) * | 2018-10-23 | 2022-04-01 | 锋华科技股份有限公司 | Tape type chip on film testing device with pre-adjusted temperature |
| CN110299310A (en) * | 2019-06-14 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
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