CN208520965U - Encapsulate chip testing heating device - Google Patents
Encapsulate chip testing heating device Download PDFInfo
- Publication number
- CN208520965U CN208520965U CN201821041390.7U CN201821041390U CN208520965U CN 208520965 U CN208520965 U CN 208520965U CN 201821041390 U CN201821041390 U CN 201821041390U CN 208520965 U CN208520965 U CN 208520965U
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- Prior art keywords
- heat
- socket
- conducting substrate
- thermal resistance
- adding thermal
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 56
- 238000012360 testing method Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000005538 encapsulation Methods 0.000 claims abstract description 65
- 239000007787 solid Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model provides a kind of encapsulation chip testing heating device, including socket, and encapsulation chip is set to inside socket, and is electrically connected with socket；Circuit board is set to below socket, and is electrically connected with socket；Heat-conducting substrate, and female contact, and it is fixed on the upper surface of circuit board；Adding thermal resistance is set in heat-conducting substrate；The controller for controlling the on/off of adding thermal resistance is electrically connected with adding thermal resistance.The preheating to encapsulation chip is realized by setting adding thermal resistance, shortens the time prepared before test；Heating equipment head is eliminated, encapsulation chip can be picked and placed directly on socket, further shortens the time prepared before test, while keeping the operation of device more convenient and reducing the cost of device；Finally, the on-off using temperature inductor with hop controller control adding thermal resistance power supply, accurately controls the heating temperature of encapsulation chip, substantially increases the accuracy rating of preheating temperature.
Description
Technical field
The utility model relates to encapsulate chip test system, filled more particularly to a kind of heating for encapsulating chip testing
It sets.
Background technique
Semiconductor technology continuous evolution, four design of production chip component needs, manufacture, encapsulation and test important streams
Journey all forms the field of respectively profession.By taking silicon wafer chip as an example, according to the Functional Design of initial chip, the manufacture of silicon wafer chip
Process includes element silicon being purified (99.999%) first, then be made into long silicon crystal bar, via forming one after cutting
Active and/or passive processing is carried out to it after a piece of very thin wafer of piece, and wafer is then divided into little particle again.What is formed is small
Microprocessor, memory etc. are reformed into after particle chip is encapsulated.Brilliant diameter of a circle is bigger, and required manufacturing technology is better, separately
Outside can also be miniature by the size of transistor and conducting wire, it allows on wafer and makes more crystal grain, reduce overall cost.
With the continuous development of chip technology, the measuring technology for encapsulating chip, which also becomes, guarantees production quality in electronic industry
And accelerate the important technology of production procedure crucial.Generally, the encapsulation chip for encapsulating completion needs to carry out in preset high temperature
Electrical testing, with the stability of decapsulation chip.Before encapsulating chip testing, it is necessary to be heated to encapsulation chip, tradition
Heating method be by air by heater formed hot wind, be then passed through again encapsulation chip on, as shown in Figure 1, be existing skill
A kind of encapsulation chip heating device of art including 1 ˊ of socket, 2 ˊ of encapsulation chip being connected in 1 ˊ of socket, is connect with 1 ˊ of socket
4 ˊ of heating equipment head of 1 ˊ of 3 ˊ of circuit board and seal socket, the device will be warm by 41 ˊ of transmission channel on 4 ˊ of heating equipment head
Wind is passed through on 1 ˊ of socket for being connected with encapsulation 2 ˊ of chip, realizes the heating to encapsulation 2 ˊ of chip, and this mode is encapsulated due to picking and placing
2 ˊ of chip needs mobile 4 ˊ of heating equipment head, is very inconvenient to operate；Heater heating air forms hot wind and needs to expend one
Fix time, at the same use 1 ˊ of hot air socket, preheat it is slower, so as to cause encapsulation the entire warm time-consuming of chip compared with
It is long, reduce working efficiency；The device needs heater to realize air heating, and the higher cost of heater improves testing cost.
Therefore a kind of encapsulation chip testing heating device how is provided, existing heating device is inconvenient for operation, adds to solve
The problem that heat takes a long time and installation cost is high is necessary.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of encapsulation chip testings to add
Thermal, for solving in the prior art, encapsulation chip heating device is inconvenient for operation, heating takes a long time and installation cost
High problem.
In order to achieve the above objects and other related objects, the utility model provides a kind of encapsulation chip testing heating device,
The test heating device includes:
Socket, encapsulation chip are set to inside the socket, and are electrically connected with the socket；
Circuit board is set to below the socket, and is electrically connected with the socket；
Heat-conducting substrate, and slotting side contacts, and it is fixed on the upper surface of the circuit board；
Adding thermal resistance is set in the heat-conducting substrate；
The controller of the on/off of the adding thermal resistance is controlled, the controller and the adding thermal resistance are electrically connected.
Preferably, the encapsulation chip testing heating device further includes the temperature inductor for monitoring the socket temperature, institute
Temperature inductor is stated to be set to the opposite sides of the heat-conducting substrate and be electrically connected with the controller, the controller foundation
The temperature of the socket of the temperature inductor measurement controls the on/off of the adding thermal resistance.
Further, the temperature inductor includes infrared temperature sensor.
Preferably, the heat-conducting substrate includes the heat-conducting substrate of hollow structure, and the socket is nested in the heat-conducting substrate
It is internal, wherein the inner wall shape of the heat-conducting substrate is consistent with the outer wall shape of the socket.
Further, the adding thermal resistance includes annular-heating resistance and circumferentially distributed along the heat-conducting substrate.
Preferably, the heat-conducting substrate includes the heat-conducting substrate of solid construction, the upper surface of the heat-conducting substrate with it is described
The upper surface of the circuit board is fixed in female contact, the lower surface of the heat-conducting substrate.
Further, the adding thermal resistance includes annular-heating resistance and is horizontally placed in the heat-conducting substrate.
Preferably, the adding thermal resistance includes resistive heater.
Preferably, the heat-conducting substrate includes ceramic substrate.
As described above, the encapsulation chip testing heating device of the utility model, has the advantages that
1, by setting adding thermal resistance realize to encapsulation chip preheating, due to solid heat transfer speed faster, shorten
The time prepared before test；
2, heating equipment head is eliminated, encapsulation chip can be picked and placed directly on socket, is prepared before further shortening test
Time, while make device operation it is more convenient and reduce device cost；
3, the on-off using temperature inductor with hop controller control adding thermal resistance power supply accurately controls encapsulation chip
Heating temperature substantially increases the accuracy rating of preheating temperature, and temperature can be made to be accurately controlled in 1 DEG C of range up and down of preheating temperature
It is interior.
Detailed description of the invention
Fig. 1 is shown as encapsulation chip testing heating device schematic diagram in the prior art.
Fig. 2 is shown as the cross-sectional view of the encapsulation chip testing heating device of an embodiment of the utility model.
Fig. 3 is shown as the top view of the encapsulation chip testing heating device of an embodiment of the utility model.
Fig. 4 is shown as the cross-sectional view of the encapsulation chip testing heating device of another embodiment of the utility model.
Fig. 5 is shown as the top view of the encapsulation chip testing heating device of another embodiment of the utility model.
Component label instructions
1,1 ˊ socket
2,2 ˊ encapsulate chip
3,3 ˊ circuit board
4 ˊ heating equipment heads
41 ˊ transmission channels
4 heat-conducting substrates
5 adding thermal resistances
6 controllers
7 temperature inductors
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Fig. 2 is please referred to Fig. 5.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, is not intended to limit the utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model
Revealed technology contents obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model
Scope.
As shown in Fig. 2, the utility model provides a kind of encapsulation chip testing heating device, the test heating device packet
It includes:
Socket 1, encapsulation chip 2 are set to inside the socket 1, and are electrically connected with the socket 1；
Circuit board 3 is set to below the socket 1, and is electrically connected with the socket 1；
Heat-conducting substrate 4 is contacted with the socket 1, and is fixed on the upper surface of the circuit board 3；
Adding thermal resistance 5 is set in the heat-conducting substrate 4；
The controller 6 of the on/off of the adding thermal resistance 5 is controlled, the controller 6 electrically connects with the adding thermal resistance 5
It connects, generally, the controller 6 is connect with the adding thermal resistance 5 by conducting wire.
Generally, the encapsulation chip 2 have chip pin, the socket 1 have socket pins, the chip pin with
The socket pins Ohmic contact realizes that the encapsulation chip 2 is electrically connected with the socket 1, in addition, the circuit board 3 and
The socket 1 cooperates plug to be electrically connected by socket, finally, realizes that the encapsulation chip 2 electrically connects with the circuit board 3
It connects.What needs to be explained here is that for the encapsulation chip 2 of different performance, default test temperature can difference, replace different envelopes
When cartridge chip 2, need to adjust the preset temperature of the controller 6.The control process of the controller 6 is, when the encapsulation core
When the temperature of piece 2 is lower than preset temperature, the controller 6 controls the power supply of the adding thermal resistance 5 to keep the adding thermal resistance 5
Power supply in an ON state, so as to continue to the encapsulation chip 2 heating；It is preset when the temperature of the encapsulation chip 2 is higher than
When temperature, the controller 6 controls the power supply of the adding thermal resistance 5 to disconnect the power supply of the adding thermal resistance 5；On in cycles
Two processes are stated, so that the temperature of the encapsulation chip 2 is maintained in preset temperature or more a certain range.
The encapsulation chip testing heating device further includes the temperature for monitoring 1 temperature of socket as a preferred method,
Inductor 7 is spent, the temperature inductor 7 is set to the opposite sides of the heat-conducting substrate 4 and electrically connects with the controller 6
It connects, i.e., there are two the temperature inductors 7 for setting on the described heat-conducting substrate 4, and the controller 6 is according to the temperature inductor 7
The temperature of the socket 1 of measurement controls the on/off of the adding thermal resistance 5.Specifically, the temperature inductor 7 will sensing
To temperature be transmitted to the controller 6, when the temperature sensed is lower than preset temperature, the controller 6 controls institute
The power supply of adding thermal resistance 5 is stated to keep the power supply of the adding thermal resistance 5 in an ON state；When the temperature sensed is higher than
When preset temperature, the controller 6 controls the power supply of the adding thermal resistance 5 to disconnect the power supply of the adding thermal resistance 5.Using institute
Stating temperature inductor 7 can be such that the temperature of the encapsulation chip 2 is maintained within the scope of the high-precision of 1 DEG C of preset temperature or more.
Preferably, the temperature inductor 7 may be configured as infrared temperature sensor.
The course of work of encapsulation chip testing heating device provided by the utility model is as follows, firstly, by the encapsulation core
Piece 2 and the socket 1 are electrically connected；Then the socket 1 is electrically connected to the circuit board 3；Connect the adding thermal resistance 5
Power supply, the adding thermal resistance 5 generates heat to heat the heat-conducting substrate 4, and the heat-conducting substrate 4 is by heat transmission to described
The encapsulation chip 2 in socket 1, to preheat the encapsulation chip 2；Meanwhile the temperature inductor 7 persistently senses the envelope
The temperature of cartridge chip 2, when preset temperature of the temperature of sensing lower than the encapsulation chip 2, the controller 6 keeps the electricity
In an ON state, when the temperature of sensing is higher than the preset temperature of the encapsulation chip 2, the controller 6 disconnects described in source
Power supply, in cycles, so that the temperature of the encapsulation chip 2 is maintained in preset temperature or more a certain range.
It should be noted that the mode that the effect of the heat-conducting substrate 4 in the present invention is logical heat transfer will be hot
Amount is transferred to the socket 1 being in contact with it, so when the heat-conducting substrate 4 is contacted with the socket 1, the heat-conducting substrate
4 can transfer heat to the socket 1.
As shown in figure 3, providing the way of contact of a kind of heat-conducting substrate 4 and the socket 1, the heat-conducting substrate 4 is wrapped
Include the heat-conducting substrate 4 of hollow structure, i.e., the middle section of the described heat-conducting substrate 4 be it is empty, the socket 1 is nested in described thermally conductive
Inside substrate 4, i.e., the described socket 1 is nested in the hollow space in the heat-conducting substrate 4, wherein the inner wall of the heat-conducting substrate 4
Shape is consistent with the outer wall shape of the socket 1, can guarantee the heat-conducting substrate 4 in this way and the socket 1 is gapless connects
Touching increases contact area, improves heat transference efficiency.As shown in Figure 3.The outer wall of the socket 1 is curved surface, the heat-conducting substrate 4
Inner wall shape be also curved surface, so the socket 1 gapless can be nested in inside the heat-conducting substrate 4；Certainly, work as institute
When the outer wall for stating socket 1 is plane, the inner wall shape of the heat-conducting substrate 4 is also plane, to guarantee that the socket 1 can be continuously
Gap is nested in inside the heat-conducting substrate 4.In practice, the outer wall shape of the socket 1 can change, then the heat-conducting substrate
As long as 4 inner wall shape is designed as consistent with the 1 outer wall shape of socket, the socket 1 can be achieved can be with gapless embedding
It covers inside the heat-conducting substrate 4.
More preferably, in conjunction with Fig. 2 and Fig. 3, the adding thermal resistance 5 is including annular-heating resistance 5 and along the heat-conducting substrate 4 weeks
To distribution.I.e. in the heat-conducting substrate 4 one weeks setting adding thermal resistances 5, being heated evenly for the heat-conducting substrate 4 can be improved
Degree can effectively ensure that the encapsulation chip 2 is evenly heated, then conducive to the envelope when the temperature of the entire heat-conducting substrate 4 is uniform
The electrical testing of cartridge chip 2 guarantees the accuracy of test result.
As shown in Figures 4 and 5, the way of contact of another heat-conducting substrate 4 and the socket 1 is provided, it is described thermally conductive
Substrate 4 includes the heat-conducting substrate 4 of solid construction, and the upper surface of the heat-conducting substrate 4 is contacted with the socket 1, the thermally conductive base
The upper surface of the circuit board 3 is fixed in the lower surface of plate 4.Since the heat-conducting substrate 4 is set to below the socket 1,
So setting solid construction for the heat-conducting substrate 4, the contact of the heat-conducting substrate 4 with the socket 1 can be effectively ensured
Area improves heat transference efficiency and homogeneous heating degree.As shown in figure 5, the surface area that the heat-conducting substrate 4 is generally arranged is greater than
The surface area of the socket 1, to increase contact area between the two.
More preferably, as shown in figure 4, the adding thermal resistance 5 includes annular-heating resistance 5 and is horizontally placed on the thermally conductive base
In plate 4.
The adding thermal resistance 5 can be any resistive element that can produce heat of existing design, it is preferable that the present embodiment
It is middle that select the adding thermal resistance 5 be resistive heater.
Since the effect of the heat-conducting substrate 4 mainly transmits heat to the socket 1, so for the heat-conducting substrate
The good material of the selection of 4 materials, preferably heating conduction is as heat-conducting substrate 4.In the present embodiment, the preferably described heat-conducting substrate 4 is
Ceramic substrate, ceramic substrate have good heat conductivity and are not easy the characteristic of deformation, and the thermally conductive speed of the heat-conducting substrate 4 can be improved
The service life of device can also be extended while spending.
In conclusion the utility model provides a kind of encapsulation chip testing heating device, including socket, encapsulation chip setting
It is electrically connected inside the socket, and with the socket；Circuit board is set to below the socket, and with the socket
It is electrically connected；Heat-conducting substrate, and the female contact, and it is fixed on the upper surface of the circuit board；Adding thermal resistance is set to institute
It states in heat-conducting substrate；The controller of the on/off of the adding thermal resistance is controlled, the controller and the adding thermal resistance are electrical
Connection.The utility model by setting adding thermal resistance realize to encapsulation chip preheating, due to solid heat transfer speed faster, contracting
The time prepared before short test；In addition, eliminating heating equipment head, encapsulation chip can be picked and placed directly on socket, further
The time prepared before test is shortened, while keeping the operation of device more convenient and reducing the cost of device；Finally, using temperature
On-off of the inductor with hop controller control adding thermal resistance power supply, accurately controls the heating temperature of encapsulation chip, greatly improves
The accuracy rating of preheating temperature can make temperature be accurately controlled in up and down within the scope of 1 DEG C of preheating temperature.So this is practical new
Type effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (9)
1. a kind of encapsulation chip testing heating device, which is characterized in that the test heating device includes:
Socket, encapsulation chip are set to inside the socket, and are electrically connected with the socket；
Circuit board is set to below the socket, and is electrically connected with the socket；
Heat-conducting substrate, and the female contact, and it is fixed on the upper surface of the circuit board；
Adding thermal resistance is set in the heat-conducting substrate；
The controller of the on/off of the adding thermal resistance is controlled, the controller and the adding thermal resistance are electrically connected.
2. encapsulation chip testing heating device according to claim 1, it is characterised in that: the encapsulation chip testing heating
Device further includes the temperature inductor for monitoring the socket temperature, and the temperature inductor is set to the opposite of the heat-conducting substrate
Two sides and with the controller be electrically connected, the temperature control for the socket that the controller is measured according to the temperature inductor
Make the on/off of the adding thermal resistance.
3. encapsulation chip testing heating device according to claim 2, it is characterised in that: the temperature inductor includes red
Outer temperature inductor.
4. encapsulation chip testing heating device according to claim 1, it is characterised in that: the heat-conducting substrate includes hollow
The heat-conducting substrate of structure, the socket are nested in inside the heat-conducting substrate, wherein the inner wall shape of the heat-conducting substrate and institute
The outer wall shape for stating socket is consistent.
5. encapsulation chip testing heating device according to claim 4, it is characterised in that: the adding thermal resistance includes annular
Adding thermal resistance and circumferentially distributed along the heat-conducting substrate.
6. encapsulation chip testing heating device according to claim 1, it is characterised in that: the heat-conducting substrate includes solid
The heat-conducting substrate of structure, the upper surface of the heat-conducting substrate and the female contact, the lower surface of the heat-conducting substrate is fixed on
The upper surface of the circuit board.
7. encapsulation chip testing heating device according to claim 6, it is characterised in that: the adding thermal resistance includes annular
It adding thermal resistance and is horizontally placed in the heat-conducting substrate.
8. encapsulation chip testing heating device according to claim 1, it is characterised in that: the adding thermal resistance includes heating
Resistance wire.
9. encapsulation chip testing heating device according to claim 1, it is characterised in that: the heat-conducting substrate includes ceramics
Substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821041390.7U CN208520965U (en) | 2018-07-03 | 2018-07-03 | Encapsulate chip testing heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821041390.7U CN208520965U (en) | 2018-07-03 | 2018-07-03 | Encapsulate chip testing heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208520965U true CN208520965U (en) | 2019-02-19 |
Family
ID=65337009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821041390.7U Expired - Fee Related CN208520965U (en) | 2018-07-03 | 2018-07-03 | Encapsulate chip testing heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208520965U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618375A (en) * | 2019-10-18 | 2019-12-27 | 天津津航计算技术研究所 | BGA test socket for rapid temperature change |
| CN110794895A (en) * | 2019-12-03 | 2020-02-14 | 杭州芯耘光电科技有限公司 | Temperature control assembly for keeping working temperature of chip and temperature control method thereof |
| CN111239586A (en) * | 2020-01-20 | 2020-06-05 | 西安交通大学 | Environment-controllable miniature test system |
-
2018
- 2018-07-03 CN CN201821041390.7U patent/CN208520965U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618375A (en) * | 2019-10-18 | 2019-12-27 | 天津津航计算技术研究所 | BGA test socket for rapid temperature change |
| CN110794895A (en) * | 2019-12-03 | 2020-02-14 | 杭州芯耘光电科技有限公司 | Temperature control assembly for keeping working temperature of chip and temperature control method thereof |
| CN111239586A (en) * | 2020-01-20 | 2020-06-05 | 西安交通大学 | Environment-controllable miniature test system |
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