CN213209303U - Temperature sensing sheet of hot melting machine - Google Patents
Temperature sensing sheet of hot melting machine Download PDFInfo
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- CN213209303U CN213209303U CN202022029440.3U CN202022029440U CN213209303U CN 213209303 U CN213209303 U CN 213209303U CN 202022029440 U CN202022029440 U CN 202022029440U CN 213209303 U CN213209303 U CN 213209303U
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Abstract
The utility model provides a hot melt machine temperature sensing piece connects on the temperature controller, include: the device comprises a substrate, a copper strip, a first lead and a second lead; the copper bar is fixedly arranged on the surface or inside the substrate; the first end of first wire and the first end of second wire all are connected with the copper bar, and the second end of first wire and the second end of second wire all are connected with the temperature controller. Fixedly arranging a copper strip on the surface or inside the substrate; the first conducting wire and the second conducting wire are both connected with the copper bar. During operation, the high temperature bonding department direct contact of temperature sensing piece and PCB panel, the copper bar has increased the regional area of temperature sensing piece perception temperature, has improved the accuracy that the temperature sensing piece detected the temperature to realize the accurate real-time temperature that reflects the hot melt counterpoint of temperature controller.
Description
Technical Field
The utility model relates to a temperature sensing piece technical field, concretely relates to hot melt machine temperature sensing piece.
Background
With the rapid development of the PCB industry, the traditional single-sided board or double-sided board can not meet the requirements of people, the PCB is developed towards the direction of a multilayer board, and when the number of layers of the board exceeds four, a hot melting alignment method is usually used. The hot-melting alignment method is characterized in that a high-frequency heating mode of a hot melting machine is adopted, copper blocks are arranged at positions where inner-layer core plates need to be bonded, high-frequency polarities are rapidly alternated, the temperature of the copper blocks is increased, the high-temperature copper blocks melt bonding sheets, all the inner-layer core plates are bonded together, and alignment of the inner-layer core plates is achieved.
However, when the temperature of the copper block is raised, the temperature of the copper block and the bonding sheet is difficult to be grasped, when the temperature is lower, the bonding sheet does not reach the optimal melting state, the bonding effect of the inner core plate is poor, and the inner core plate is easy to cause layer deviation by sliding when the plate is pressed, so that the alignment of the inner core plate fails; when the temperature is too high, the bonding sheet is burnt, the bonding part is carbonized, the bonding effect is poor, and the alignment precision of the inner core plate is influenced. This just needs to use the temperature sensing piece to carry out real-time supervision to hot melt temperature, and traditional temperature sensing piece all is two temperature sensing wire lug connection usually, and the link that will two temperature sensing wire again is fixed to be set up on the temperature sensing piece main part, detects the temperature in order to reflect on the temperature controller through the link of two temperature sensing wires. The detection area for measuring the temperature in the mode is too small, so that the temperature detected by the temperature sensing sheet is inaccurate, and the real-time temperature of hot melting alignment is difficult to accurately grasp.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a remedy above-mentioned technical insufficiency, provide a hot melt machine temperature sensing piece, solve among the prior art technical problem that the nail bed tool cost of manufacture is high.
The utility model provides a hot melt machine temperature sensing piece connects on the temperature controller, include: the device comprises a substrate, a copper strip, a first lead and a second lead;
the copper strip is fixedly arranged on the surface or inside the substrate;
the first end of the first lead and the first end of the second lead are both connected with the copper bar, and the second end of the first lead and the second end of the second lead are both connected with the temperature controller.
Compared with the prior art, the utility model discloses following beneficial technological effect has:
the utility model provides a temperature sensing sheet of a hot melting machine, wherein a copper bar is fixedly arranged on the surface or inside a substrate; the first conducting wire and the second conducting wire are both connected with the copper bar. During operation, the high temperature bonding department direct contact of temperature sensing piece and PCB panel, the copper bar has increased the regional area of temperature sensing piece perception temperature, has improved the accuracy that the temperature sensing piece detected the temperature to realize the accurate real-time temperature that reflects the hot melt counterpoint of temperature controller.
Drawings
Fig. 1 is a schematic structural view of a temperature-sensing chip according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a temperature-sensing chip according to another embodiment of the present invention.
Description of reference numerals:
10-a substrate; 20-copper bar; 30-a first wire; 40-second conductor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
The description in the present application relating to "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
An embodiment of the utility model provides a hot melt machine temperature sensing piece, as shown in fig. 1, include: a substrate 10, a copper strip 20, a first conductor 30 and a second conductor 40. The copper bar 20 is fixedly disposed on the surface or inside the substrate 10, the first end of the first wire 30 and the first end of the second wire 40 are both connected to the copper bar 20, and the second end of the first wire 30 and the second end of the second wire 40 are both connected to a temperature controller (not shown).
The first ends of the two wires are directly connected to the copper bar 20, and the two wires are connected through the copper bar 20. The second end of two wires is connected with the temperature controller to form a closed loop, and the temperature controller can reflect the real-time temperature detected by the temperature sensing piece in real time. Two wires can select to use nichrome also can use the zinc-copper alloy, and the material of wire has certain influence to the temperature sensing effect, also has certain influence to the temperature sensing structure. When the material of the wire is nichrome, as shown in fig. 2, the copper bar 20 is disposed inside the substrate 10, and particularly, may be disposed at the center of the substrate 10. When the material of the lead is a zinc-copper alloy, as shown in fig. 1, a copper bar 20 is disposed on the surface of the temperature-sensing chip. The two wires can also be made of different materials, and the resistance of the wires made of different materials changes differently with the rise of temperature, so that the external dimension and thickness of the copper bar 20 and the installation position on the substrate 10 also change.
When in hot melting alignment, one part of the temperature sensing piece is directly contacted with the PCB board needing high-temperature bonding and is placed in a high-temperature environment of hot melting alignment; the other part of the temperature sensing piece is arranged in an indoor temperature environment, so that the two parts of the temperature sensing piece can generate temperature difference, the temperature difference can generate potential difference, current can be formed in the closed loop, the temperature controller can translate the temperature of the PCB in the hot melting contraposition according to the change of the current, and the temperature is displayed on a display of the temperature controller. When the heat temperature exceeds or is less than a preset value, the temperature can be manually adjusted to reach the optimal hot melting temperature, and the alignment precision is ensured.
The copper bar 20 is fixedly disposed on the surface or inside of the substrate 10, and the first and second conductive lines 30 and 40 are connected to the copper bar 20. The temperature sensing piece directly contacts with the heating area of the PCB, so that the temperature change of the heating area is transmitted to the temperature sensing piece at the first time, the two wires can generate potential difference in time, and the speed of the temperature controller responding to the temperature is increased. The copper bar 20 increases the area of the temperature sensing piece sensing temperature, and improves the accuracy of the temperature sensing piece detecting temperature, so that the temperature controller can accurately reflect the real-time temperature of hot melt alignment, and the hot melt alignment precision is improved.
Optionally, in a specific implementation manner of the embodiment of the present invention, the surface of the substrate 10 is provided with a heat-resistant layer combining glass fibers and epoxy resin. The combination of the glass fiber and the epoxy resin has stable property in high temperature environment, and the combination of the glass fiber cloth and the epoxy resin can be selected as the temperature sensing sheet main body. The material of the lead is nickel-chromium alloy or zinc-copper alloy, the melting point of the copper bar 20 and the lead is far higher than the temperature of hot melting contraposition, and the manufacturing process can be carried out in a high-temperature environment in order to ensure the heat resistance of the final finished product temperature sensing piece.
Alternatively, in another specific implementation manner of the embodiment of the present invention, the substrate 10 has a rectangular outline shape. The temperature sensing piece is formed by punching the die, and the outline shape of the temperature sensing piece corresponds to the shape and the size of the groove of the die. The shape of the main body of the temperature sensing piece has no influence on the temperature sensing effect, and the shape and the size of the temperature sensing piece can be selected according to different use scenes. In the case of mass production, the rectangular shape is a shape that can be easily taken out from the mold, and therefore, in the present embodiment, the outline shape of the temperature-sensitive sheet is a selected rectangular shape.
Optionally, in a specific implementation manner of the embodiment of the present invention, the length of the substrate 10 is 40mm, and the width thereof is 20 mm; the copper bar 20 has a rectangular profile with a length of 25mm and a width of 5 mm. The area of the wire where the temperature is sensed is too small, so that a copper bar 20 may be provided on the substrate 10 to increase the area of the area where the temperature is sensed. The size of the copper bar 20 has a great influence on the temperature sensing effect, the undersize of the copper bar 20 cannot meet the requirement of increasing the area of the sensing area, and the oversize of the copper bar 20 can cause the temperature of the non-heating area to be possibly measured by the copper bar 20, so that the accuracy of temperature measurement is influenced.
The size of the substrate 10 can be designed according to the size of the heating area on the inner core board, in this embodiment, the size of the heating area of the inner core board is 7 × 25mm, the 7mm direction of the hot melting machine is adjustable, and the 25mm direction is fixed. Therefore, the size of the substrate 10 can be set to 40 × 20mm, and the copper bar 20 can be accommodated by adjusting the 7mm direction of the hot melting machine to 40 mm.
Optionally, in another specific implementation manner of the embodiment of the present invention, the substrate 10 further includes a teflon resin layer, and the teflon resin layer is disposed on a surface of the substrate 10. The polytetrafluoroethylene resin has the characteristics of acid resistance, alkali resistance and various organic solvents resistance, and is almost insoluble in all solvents; meanwhile, the polytetrafluoroethylene has the characteristic of high temperature resistance. The polytetrafluoroethylene resin layer is arranged on the surface of the temperature sensing piece, so that the surface of the temperature sensing piece is difficult to scale, the response speed of the temperature controller is improved, and the long-term effectiveness of the temperature sensing piece is guaranteed.
The above description of the present invention does not limit the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the scope of the claims of the present invention.
Claims (5)
1. The hot melt machine temperature sensing piece is connected on the temperature controller, its characterized in that includes: the device comprises a substrate, a copper strip, a first lead and a second lead;
the copper strip is fixedly arranged on the surface or inside the substrate;
the first end of the first lead and the first end of the second lead are both connected with the copper bar, and the second end of the first lead and the second end of the second lead are both connected with the temperature controller.
2. The thermofusible temperature-sensing fin according to claim 1, wherein a surface of the substrate is provided with a heat-resistant layer of glass fiber combined with epoxy resin.
3. The heat-fusion machine temperature sensing chip of claim 1, wherein the substrate is rectangular in outline.
4. The heat-fusible machine temperature-sensing sheet as claimed in claim 3, wherein the substrate has a length of 40mm and a width of 20 mm; the profile shape of copper bar is the rectangle, and its length is 25mm, and the width is 5 mm.
5. The heat-fusible machine temperature-sensing sheet of claim 1, wherein the substrate further comprises a polytetrafluoroethylene resin layer, the polytetrafluoroethylene resin layer being provided on a surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022029440.3U CN213209303U (en) | 2020-09-16 | 2020-09-16 | Temperature sensing sheet of hot melting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022029440.3U CN213209303U (en) | 2020-09-16 | 2020-09-16 | Temperature sensing sheet of hot melting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213209303U true CN213209303U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022029440.3U Active CN213209303U (en) | 2020-09-16 | 2020-09-16 | Temperature sensing sheet of hot melting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213209303U (en) |
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2020
- 2020-09-16 CN CN202022029440.3U patent/CN213209303U/en active Active
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| GR01 | Patent grant | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: 435000 No.88 Daqi Avenue, Wangren Town, Huangshi economic and Technological Development Zone, Hubei Province Patentee after: Chaoying Electronic Circuit Co.,Ltd. Address before: 435000 No.88 Daqi Avenue, Wangren Town, Huangshi economic and Technological Development Zone, Hubei Province Patentee before: DYNAMIC ELECTRONICS (HUANGSHI) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |