CN104299925A - Temperature measuring device for semiconductor process - Google Patents
Temperature measuring device for semiconductor process Download PDFInfo
- Publication number
- CN104299925A CN104299925A CN201310308482.2A CN201310308482A CN104299925A CN 104299925 A CN104299925 A CN 104299925A CN 201310308482 A CN201310308482 A CN 201310308482A CN 104299925 A CN104299925 A CN 104299925A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- recess
- temperature measuring
- measuring device
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 230000006698 induction Effects 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a semiconductor process temperature measuring device, which comprises a measured body and a temperature measuring component, wherein the measured body is provided with a concave part, a sensing end of the temperature measuring component is connected and in thermal contact with the measured body, and the sensing end is covered by an adhesion object adhered to the concave part, wherein the measured body is a placement body for placing a semiconductor, the placement body is in thermal contact with the semiconductor for placing the semiconductor, or the measured body is the semiconductor, so that the sensing end of the temperature measuring component is stably connected to the measured body, and the reliability of monitoring the semiconductor process temperature is enhanced.
Description
Technical field
System of the present invention about a kind of design of manufacture of semiconductor temperature measuring device, particularly about the manufacture of semiconductor temperature measuring device that a kind of reliability is good.
Background technology
Semiconductor can be used as the carrier of used in integrated circuits.The manufacturing process of semiconductor contains many kinds of processing modes, comprises emulsion coating, exposure, development, burn into and infiltration etc., to make the assembly with multilayer line, and via detection, encapsulation, and makes actual available integrated circuit finished product.
The manufacture process of semiconductor through the heat treatment repeatedly carried out, must comprise thermal oxidation process, annealing in process, AI pressure sintering, hot round and smooth process, hardening by cooling etc., to be progressively fabricated to finished product.And in order to control heat treated temperature to reach expection manufacturing effect, and the damage of product avoiding temperature improper produced, usually by a temperature measuring device, to measure the temperature of manufacture of semiconductor.
Known conductor temperature measuring equipment uses a thermocouple to be attached at the surface of a temperature determinand usually.But; temperature determinand often can because of the variations in temperature in heat treatment process; and generation is expanded with heat and contract with cold; and cause thermocouple to come off from temperature determinand further; so not only make the reliability of monitoring temperature not good; heat treated temperature even may be caused further to control improper, and have influence on the fine ratio of product of semiconductor.
In view of the above, how avoiding thermocouple equitemperature to measure component and depart from adjustment location originally, is an important research topic.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture of semiconductor temperature measuring device, effectively in fixed position measuring temperature, to improve the problem of known techniques.
The technological means that the present invention adopts for the problem solving known techniques is a kind of manufacture of semiconductor temperature measuring device, comprises a tested body and a measuring temp component.A recess is formed on tested body.One induction end of measuring temp component connect and thermo-contact in tested body, and induction end for sticking together object by one while coated with recess.Wherein tested body is the glove body for putting semiconductor, and glove body is for putting semiconductor and thermo-contact in semiconductor, or tested body is semiconductor.
In one embodiment of this invention, the upper surface that object is raised in the protuberance adjacent to recess is sticked together.
In one embodiment of this invention, the shape of recess be selected from linear, circular, same to heart shaped, polygon, radial formed group one of them or multiple.
In one embodiment of this invention, the width of recess in the depth direction by narrow gradually wide, by wide gradually narrow or wide.
In one embodiment of this invention, the distance between multiple induction end is identical.
In one embodiment of this invention, singlely stick together object and be attached to multiple recess.
In one embodiment of this invention, recess is formed at the surface of tested body.
In one embodiment of this invention, recess can be and formed with laser cutting mode, etching mode or milling mode.
Via the technology used in the present invention means, by the recess sticking together object and be attached to tested body, the induction end of measuring temp component is made to be that thermo-contact is connected to tested body.The thermal stress effect making by this to stick together between object and tested body is stronger, and makes to stick together object and be more sticked in recess, to allow induction end more effectively be fixed on tested body, to strengthen the reliability of monitoring temperature.Moreover, by set-up mode of the present invention, more induction end can be fixed on above the material be difficult to then, and wider reliable temperature measuring range can be had.In addition, the useful life of sticking together object and tested body further can be made longer.Regulate and control the ambient temperature of semiconductor by this and effectively, to promote fine ratio of product.
Accompanying drawing explanation
The display of Fig. 1 system is according to the stereogram of the manufacture of semiconductor temperature measuring device of one embodiment of the invention.
The display of Fig. 2 system is according to the stereogram of the manufacture of semiconductor temperature measuring device of another embodiment of the present invention.
The display of Fig. 3 system is according to the cutaway view of the manufacture of semiconductor temperature measuring device of another embodiment of the present invention.
The display of Fig. 4 system is according to the upward view of the tested body of another embodiment of the present invention.
The display of Fig. 5 system is according to the cutaway view of the manufacture of semiconductor temperature measuring device of another embodiment of the present invention.
The display of Fig. 6 system is according to the cutaway view of the manufacture of semiconductor temperature measuring device of another embodiment of the present invention.
The display of Fig. 7 system is according to the cutaway view of the manufacture of semiconductor temperature measuring device of one more embodiment of the present invention.
The display of Fig. 8 A to Fig. 8 F system is according to the end view of the recess of various embodiments of the present invention.
The display of Fig. 9 A to Fig. 9 H system is according to the top view of the recess of various embodiments of the present invention.
The display of Figure 10 A to Figure 10 D system is according to the allocation plan of the induction end of various embodiments of the present invention.
Symbol description
100,100a, 100b, 100c, 100d manufacture of semiconductor temperature measuring device
1, the tested body of 1b, 1c, 1d
11 recesses
12 protuberances
2 measuring temp components
21 induction end
3 stick together object
4 glove bodies
D1, D2 distance
L1, L1 center line
W semiconductor
Embodiment
Specific embodiment of the present invention, by by following embodiment and to be attachedly further described in graphic.
Refer to shown in Fig. 1, semiconductor process temperatures measuring equipment 100 according to one embodiment of the invention comprises tested body 1 and a measuring temp component 2, in the present embodiment, tested body 1 is semiconductor, and a glove body 4 is for putting tested body 1.Tested body 1 is formed with a recess 11, is formed at the upper surface of tested body 1.
One induction end 21 of measuring temp component 2 connect and thermo-contact in tested body 1, and induction end 21 is coated by sticking together object 3 by be attached to recess 11 one.In the present embodiment, measuring temp component 2 is a thermocouple (Thermal Couple), and to stick together object 3 be a ceramic paste.Such as, but the invention is not restricted to, measuring temp component 2 also can be other can the object of measuring temperature, thermistor, and stick together object 3 and also can be scolding tin or other analog, as long as can coated induction end 2 and induction end 2 is fixed on tested body 1.
The induction end 21 of measuring temp component 2, by sticking together the fixing of object 3 and thermo-contact in tested body 1, measures the temperature of tested body 1, by this to obtain the process temperatures of semiconductor further.And stick together object 3 for being attached among recess 11, thus in heat treatment process for tested body 1 or stick together the deformation effect expanded with heat and contract with cold that object 3 produces, and be not easy to cause and stick together object 3 and come off.On the contrary because in recess 11, the thermal stress effect of sticking together between object 3 and tested body 1 is stronger, and make to stick together object 3 and be more sticked in recess 11, and be more effectively fixed on tested body 1, and make the induction end 21 of measuring temp component 2 still closely thermo-contact in tested body 1, to maintain the measurement of process temperatures.
Please refer to shown in Fig. 2 to Fig. 4, it is the manufacture of semiconductor temperature measuring device 100a of display another embodiment of the present invention, the manufacture of semiconductor temperature measuring device 100a of the present embodiment is roughly the same with manufacture of semiconductor temperature measuring device 100, its difference is: in the present embodiment, tested body 1 is for putting semiconductor W, and the thermo-contact of tested body 1 is in semiconductor W, tested body 1 is formed with a recess 11.In the present embodiment, tested body 1 is a heating plate.Recess 11 is formed at the lower surface of tested body 1, and the upper surface system of tested body 1 is flat, and makes semiconductor W for thermo-contact closely and is equably in tested body 1.
More preferably, in the present embodiment, because single sticks together object 3 for being attached to multiple recess 11, the effect therefore engaged is stronger.And stick together the upper surface of height higher than the protuberance 12 adjacent to recess 11 of object 3 projection, therefore intactly can measure the induction end 21 of component 2 by temperature of plate, and make the effect of fixing better.Certainly, the present invention is not limited thereto, singlely stick together object 3 and only can be attached to single recess 11, and the induction end 21 of measuring temp component 2 also can fix and thermo-contact in the recess 11 of the tested body 1c of manufacture of semiconductor temperature measuring device 100c, as shown in Figure 6.
Refer to shown in Fig. 5, the manufacture of semiconductor temperature measuring device 100b of another embodiment of the present invention is roughly the same with manufacture of semiconductor temperature measuring device 100a, therefore identical assembly represents with identical symbol, its difference is: in the present embodiment, tested body 1b is a heating furnace case, semiconductor W is for being positioned among tested body 1b, and recess 11 is formed at the internal face of tested body 1b, and make to stick together object 3 and be attached to recess 11, and the induction end 21 of measuring temp component 2 is fixedly contacted with the internal face of tested body 1b, by this to obtain the process temperatures of semiconductor W.
Refer to shown in Fig. 7, the manufacture of semiconductor temperature measuring device 100d of one more embodiment of the present invention is roughly the same with manufacture of semiconductor temperature measuring device 100, therefore identical assembly represents with identical symbol, its difference is: in the present embodiment, tested body 1d is semiconductor, be formed with recess 11 by making semiconductor and make to stick together the mode that object 3 is attached to multiple recess 11, make the induction end 21 of measuring temp component 2 more firmly can be contacted with semiconductor, and obtain the temperature of semiconductor.
Refer to shown in Fig. 8 A to Fig. 8 F, the width of recess 11 can be by wide (Fig. 8 A), by wide gradually narrow (Fig. 8 B) or by narrow gradually wide (Fig. 8 C) in the depth direction.Or the surface of recess 11 also can be cambered surface (Fig. 8 D, Fig. 8 E), or other irregularly shaped (Fig. 8 F) etc.Refer to shown in Fig. 9 A to Fig. 9 H, the shape of recess 11 be selected from linear, circular, same to heart shaped, polygon, radial or other irregularly shaped formed group one of them or multiple.By this, the shape of recess 11 can be selected according to different demands.Further, recess 11 can for the recess formed with laser cutting mode, etching mode or milling mode.
Refer to Figure 10 A to Figure 10 D, it is the allocation plan of the induction end of display various embodiments of the present invention.The induction end 21 of measuring temp component 2 of the present invention can be configured at center (Figure 10 A), the edge (Figure 10 B) of tested body 1.Or induction end 21 also can configure and configure (Figure 10 C) along the centre line L 1 of tested body 1, L2, or with configured in array mode (Figure 10 D).And preferably, adjust the distance (e.g., distance D1, distance D2 are identical) between each sense terminals 21, the process temperatures of semiconductor can be measured by this equably.
Above describing is only preferred embodiment of the present invention and illustrates, is allly skillful in this those skilled in the art when can do other all improvement according to above-mentioned explanation, but these change and still belong in the spiritual and the scope of the claims that defines of invention of the present invention.
Claims (7)
1. a manufacture of semiconductor temperature measuring device, for measuring the process temperatures of semiconductor, is characterized in that, this manufacture of semiconductor temperature measuring device comprises:
One tested body, this tested body is formed with a recess; And
One measuring temp component, this measuring temp component one induction end system connect and thermo-contact in this tested body, and this induction end by be attached to this recess one stick together object institute coated,
Wherein this tested body is the glove body for putting this semiconductor, and this glove body for put this semiconductor and thermo-contact in this semiconductor, or this tested body is this semiconductor.
2. manufacture of semiconductor temperature measuring device as claimed in claim 1, it is characterized in that, this sticks together the upper surface that Object Side is raised in the protuberance adjacent to this recess.
3. manufacture of semiconductor temperature measuring device as claimed in claim 1, is characterized in that, the shape system of this recess be selected from linear, circular, same to heart shaped, polygon, radial formed group one of them or multiple.
4. manufacture of semiconductor temperature measuring device as claimed in claim 1, is characterized in that, the width of this recess be in the depth direction by narrow gradually wide, by wide gradually narrow or wide.
5. manufacture of semiconductor temperature measuring device as claimed in claim 1, is characterized in that, single individual this sticks together Object Side and can be attached to this recess more than one.
6. manufacture of semiconductor temperature measuring device as claimed in claim 1, it is characterized in that, this recess is formed at the surface of this tested body.
7. manufacture of semiconductor temperature measuring device as claimed in claim 1, it is characterized in that, this recess is the recess formed with laser cutting mode, etching mode or milling mode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102125803A TWI523136B (en) | 2013-07-18 | 2013-07-18 | Temperature measuring device for semiconductor manufacturing process |
| TW102125803 | 2013-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104299925A true CN104299925A (en) | 2015-01-21 |
Family
ID=52319597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310308482.2A Pending CN104299925A (en) | 2013-07-18 | 2013-07-22 | Temperature measuring device for semiconductor process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104299925A (en) |
| TW (1) | TWI523136B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11344386A (en) * | 1998-05-29 | 1999-12-14 | Sakaguchi Dennetsu Kk | Wafer with temperature detection element |
| JP2000058406A (en) * | 1998-08-04 | 2000-02-25 | Yamari Sangyo Kk | Temperature measuring equipment of plate-like member and recessed part forming method of the plate-like member |
| KR20000033717A (en) * | 1998-11-25 | 2000-06-15 | 김영환 | Wafer for temperature sensor |
| JP2002164291A (en) * | 2000-11-28 | 2002-06-07 | Kyocera Corp | Wafer heating equipment |
| TW558741B (en) * | 2001-09-20 | 2003-10-21 | Hamada Heavy Ind Ltd | Temperature sensor and thermocouple for semiconductor processing apparatus |
| JP2004233051A (en) * | 2004-04-07 | 2004-08-19 | Kyocera Corp | Wafer heating device |
| JP2005030792A (en) * | 2003-07-08 | 2005-02-03 | Okazaki Mfg Co Ltd | Temperature measuring wafer |
| CN101325192A (en) * | 2008-06-13 | 2008-12-17 | 友达光电（苏州）有限公司 | Substrate easy to measure temperature and manufacturing method thereof |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
-
2013
- 2013-07-18 TW TW102125803A patent/TWI523136B/en active
- 2013-07-22 CN CN201310308482.2A patent/CN104299925A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11344386A (en) * | 1998-05-29 | 1999-12-14 | Sakaguchi Dennetsu Kk | Wafer with temperature detection element |
| JP2000058406A (en) * | 1998-08-04 | 2000-02-25 | Yamari Sangyo Kk | Temperature measuring equipment of plate-like member and recessed part forming method of the plate-like member |
| KR20000033717A (en) * | 1998-11-25 | 2000-06-15 | 김영환 | Wafer for temperature sensor |
| JP2002164291A (en) * | 2000-11-28 | 2002-06-07 | Kyocera Corp | Wafer heating equipment |
| TW558741B (en) * | 2001-09-20 | 2003-10-21 | Hamada Heavy Ind Ltd | Temperature sensor and thermocouple for semiconductor processing apparatus |
| JP2005030792A (en) * | 2003-07-08 | 2005-02-03 | Okazaki Mfg Co Ltd | Temperature measuring wafer |
| JP2004233051A (en) * | 2004-04-07 | 2004-08-19 | Kyocera Corp | Wafer heating device |
| CN101325192A (en) * | 2008-06-13 | 2008-12-17 | 友达光电（苏州）有限公司 | Substrate easy to measure temperature and manufacturing method thereof |
| CN102695947A (en) * | 2009-12-18 | 2012-09-26 | 东京毅力科创株式会社 | Temperature measuring apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI523136B (en) | 2016-02-21 |
| TW201505114A (en) | 2015-02-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150121 |