CN206740262U - Hot process temperatures sensing device further - Google Patents
Hot process temperatures sensing device further Download PDFInfo
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- CN206740262U CN206740262U CN201720585732.0U CN201720585732U CN206740262U CN 206740262 U CN206740262 U CN 206740262U CN 201720585732 U CN201720585732 U CN 201720585732U CN 206740262 U CN206740262 U CN 206740262U
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- component
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- sensing device
- device further
- process temperatures
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Abstract
The utility model provides a kind of hot process temperatures sensing device further, include tested body, temperature sensing component, stick together component and fixing component, tested body has recess and at least one punchinged, this is punchinged through the surface of recess and formed under the surface of recess, temperature sensing component has induction end, induction end is connected to the surface of recess and thermally contacted in the surface of recess, stick together component and be arranged on the surface of the recess and stick together region, and coat the induction end, fixing component, which attaches to this, sticks together component and is fixed in this and punching, it is fixed on so that this is sticked together into component on the surface of the recess, it is not easy to come off from the surface of recess in the heating and cooling process of tested body so that sticking together component.
Description
Technical field
A kind of hot process apparatus is the utility model is related to, more particularly to a kind of hot process temperatures sensing device further.
Background technology
In industrial manufacturing process, generally require to carry out various heat treatments.It is by taking semiconductor industry as an example, it is necessary to logical
Thermal oxidation process, annealing, AI pressure sinterings, the round and smooth processing of heat, hardening by cooling etc. are crossed, semiconductor crystal wafer could be progressively made as
Finished product.And in order to control the temperature of heat treatment to reach expected manufacturing effect, and avoid the improper caused product damage of temperature
It is bad, generally by temperature-sensing device, to sense the temperature of processing procedure.
Existing temperature-sensing device is attached at the surface of temperature determinand usually using thermocouple.However, temperature is to be measured
Thing often can be because of the temperature change in heat treatment process, and produces and expand with heat and contract with cold, and further results in thermocouple from temperature determinand
Come off, so not only make it that the reliability of monitoring temperature is bad, in some instances it may even be possible to the temperature control of heat treatment can be further resulted in not
When, and have influence on the fine ratio of product of product.
Utility model content
Therefore, to solve the above problems, the purpose of this utility model is providing a kind of hot process temperatures sensing device further.
The utility model to solve problem of the prior art used by technological means a kind of hot process temperatures be provided sensed
Device, comprising：Tested body, have recess and it is at least one punching, this is punchinged through the surface of the recess and formed at this
Under the surface of recess；Temperature sensing component, has an induction end, the induction end be connected to the surface of the recess and thermally contact in
The surface of the recess；Component is sticked together, the region of sticking together being arranged on the surface of the recess, and coat the induction end；With
And fixing component, attach to this and stick together component and be fixed in this and punching, this is sticked together into the surface that component is fixed on the recess
On.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, this punchinges to be formed sticks together at this
Region, the fixing component are latch, and the fixing component wears to attach to this and stick together component and plug and is fixed in this and punchinges, and should
Stick together component and be fixed on the tested body.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, this punching can be two with
On, it is arranged at this and sticks together areas outside, and this two are punchinged and are connected for bottom, the fixing component is flexible fixing component, around
If attaching to, this sticks together component and winding is fixed in this at least two are punchinged, and this is sticked together into component and is fixed on the tested body.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, the tested body is for putting
The glove equipment of semiconductor.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, the tested body is semiconductor.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, this sticks together component to stick together material
Material.
A kind of hot process temperatures sensing device further is provided in an embodiment of the present utility model, in addition to second sticks together structure
Part, it is arranged on the recess.
Technological means used by via the utility model, stick together component and be not easy in the heating and cooling process of tested body certainly
The surface of recess comes off so that the induction end of temperature sensing component can more securely contact tested body, and sense exactly
The temperature of tested body, it is ensured that the fine ratio of product of product.
Specific embodiment used by the utility model, by by following embodiment and it is attached in schema make further
It is bright.
Brief description of the drawings
Fig. 1 is schematic perspective view of the display according to the hot process temperatures sensing device further of the utility model first embodiment.
Fig. 2 is diagrammatic cross-section of the display according to the hot process temperatures sensing device further of embodiment of the present utility model.
Fig. 3 is diagrammatic cross-section of the display according to the hot process temperatures sensing device further of the utility model second embodiment.
Fig. 4 is diagrammatic cross-section of the display according to the hot process temperatures sensing device further of the utility model 3rd embodiment.
Reference
100 hot process temperatures sensing device furthers
The hot process temperatures sensing device furthers of 100a
The hot process temperatures sensing device furthers of 100b
1 tested body
11 recesses
12 punching
12a punchinges
2 temperature sensing components
21 induction end
3 stick together component
4 fixing components
4a fixing components
5 second stick together component
5b second sticks together component
R sticks together region
Embodiment
Below according to Fig. 1 to Fig. 4, and illustrate embodiment of the present utility model.The explanation is not new to limit this practicality
The embodiment of type, and it is one kind of embodiment of the present utility model.
As shown in Figures 1 and 2, a kind of hot process temperatures sensing device further 100 of the utility model first embodiment, comprising：
Tested body 1, temperature sensing component 2, stick together component 3 and fixing component 4.
Tested body 1 has recess 11 and at least one punchinges 12.Punching 12 through recess 11 surface and formed
Under the surface of recess 11.In the present embodiment, tested body 1 is the glove load plate or equipment for putting semiconductor, but
The utility model not limited to this, in another example, tested body 1 is semiconductor.
Temperature sensing component 2 has induction end 21, and induction end 21 is connected to the surface of recess 11 and thermally contacted in recess 11
Surface.In the present embodiment, temperature sensing component 2 is thermocouple (Thermal Couple), but the utility model is unlimited
In this, temperature sensing component 2 or it is other can sensing temperature object, such as thermistor.
Stick together component 3 and be arranged on the surface of recess 11 and stick together region R, and coat induction end 21.In the present embodiment
In, stick together the adhesion material that component 3 is ceramic paste, but the utility model not limited to this, stick together component 3 or scolding tin or its
Its analog, as long as induction end 21 can be coated and induction end 21 is fixed on into tested body 1.
Fixing component 4, which attaches to, sticks together component 3 and being fixed in and punchinges 12, will stick together component 3 and be fixed on the table of recess 11
On face.In the present embodiment, 12 formation of punchinging sticking together region R, fixing component 4 are latch, and fixing component 4, which is worn, to be attached to
Stick together component 3 and plugging and be fixed in and punching 12, and component 3 will be sticked together and be fixed on tested body 1.
Fixed by fixing component 4 and stick together component 3 in tested body 1, stick together heating and cooling of the component 3 in tested body 1
It is not easy to come off from the surface of recess 11 in journey so that the induction end 21 of temperature sensing component 2 can more securely contact tested
Body 1, and the temperature of tested body 1 is sensed exactly.
Further, as shown in Fig. 2 after sticking together component 3 and sticking together cladding induction end 21, noggin piece can be added in recessed
In portion 11.Hot process temperatures sensing device further 100 also has second to stick together component 5, is arranged on recess 11.Second sticks together component
5 surface flushes with the surface of tested body 1, and sticks together component 3 and fixing component 4 with noggin piece covering, prevents foreign matter from entering
Enter in recess 11.In the present embodiment, noggin piece and second to stick together component 5 be all ceramic paste, but the utility model is unlimited
In this.
As shown in figure 3, according to hot process temperatures the sensing device further 100a and Fig. 2 of second embodiment of the present utility model
The hot process temperatures sensing device further 100 of one embodiment is similar, includes tested body 1, temperature sensing component 2 and sticks together component 3.
The Main Differences of two embodiments are that the 12a that punchinges of the present embodiment can be more than two, be arranged at the outside for sticking together region R,
And two 12a that punching are connected for bottom.Fixing component 4a is flexible fixing component, such as metal wire, and winding, which attaches to, sticks together
Simultaneously winding is fixed in two 12a that punching to component 3, and will stick together component 3 and be fixed on tested body 1.
As shown in figure 4, according to hot process temperatures the sensing device further 100b and Fig. 3 of 3rd embodiment of the present utility model
The hot process temperatures sensing device further 100a of two embodiments is similar, includes tested body 1, temperature sensing component 2, sticks together component 3
And fixing component 4.The Main Differences of two embodiments are that the second of hot process temperatures sensing device further 100b, which sticks together component 5b, sets
It is placed on recess 11 and convex in the surface of tested body 1.
Narration above and explanation are only the explanation of preferred embodiment of the present utility model, for those skilled in the art
When that can make other modifications according to claims below and above-mentioned explanation, it is new to still fall within this practicality for simply these modifications
The creation spirit of type and in interest field of the present utility model.
Claims (7)
1. a kind of hot process temperatures sensing device further, comprising：
Tested body, have recess and it is at least one punching, described punchinges through the surface of described recess and is formed
Under the surface of described recess；
Temperature sensing component, has induction end, and described induction end is connected to the described surface of described recess and thermo-contact
In the surface of described recess；
Component is sticked together, the region of sticking together being arranged on the surface of described recess, and coat described induction end；And
Fixing component, attach to it is described stick together component and be fixed in it is described punching, the described component that sticks together is fixed on
On the surface of described recess.
2. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that described punchinging to be formed to be sticked in described
Region, described fixing component is latch, and described fixing component, which wears to attach to, described stick together component and plug affixed
Punchinged in described, and the described component that sticks together is fixed on described tested body.
3. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that described punchinging can be more than two,
It is arranged at the described areas outside that sticks together, and described two are punchinged and are connected for bottom, described fixing component is flexible solid
Determine component, winding attach to it is described stick together component and winding is fixed in described at least two and punchinged, and described is sticked together
Component is fixed on described tested body.
4. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that described tested body is for putting
The glove equipment of semiconductor.
5. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that described tested body is semiconductor.
6. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that described sticks together component to stick together material
Material.
7. hot process temperatures sensing device further as claimed in claim 1, it is characterised in that also stick together component including second, set
On described recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720585732.0U CN206740262U (en) | 2017-05-24 | 2017-05-24 | Hot process temperatures sensing device further |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720585732.0U CN206740262U (en) | 2017-05-24 | 2017-05-24 | Hot process temperatures sensing device further |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206740262U true CN206740262U (en) | 2017-12-12 |
Family
ID=60566844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720585732.0U Active CN206740262U (en) | 2017-05-24 | 2017-05-24 | Hot process temperatures sensing device further |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206740262U (en) |
-
2017
- 2017-05-24 CN CN201720585732.0U patent/CN206740262U/en active Active
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