JP2000047179A - Liquid crystal display element - Google Patents
Liquid crystal display elementInfo
- Publication number
- JP2000047179A JP2000047179A JP10216996A JP21699698A JP2000047179A JP 2000047179 A JP2000047179 A JP 2000047179A JP 10216996 A JP10216996 A JP 10216996A JP 21699698 A JP21699698 A JP 21699698A JP 2000047179 A JP2000047179 A JP 2000047179A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- temperature sensor
- sensor
- flexible substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は液晶表示素子の温
度センサの実装技術に関する。The present invention relates to a technology for mounting a temperature sensor for a liquid crystal display device.
【0002】[0002]
【従来の技術】液晶表示素子(LCD)は一般に温度に
よって最適駆動電圧が変化する。このため、温度センサ
を取付け、温度に応じて駆動電圧を変化できるようにし
ている。 (1)従来の温度センサの実装構造の第1の例を図2を
参照して説明する。ガラス基板1及び2が液晶(図示せ
ず)を挟んで張り合わされている。ガラス基板1の端部
はガラス基板2より突出延長されており、その延長部1
aの内面に液晶駆動用IC3が実装されると共に、延長
部1aの端部(延長端部と言う)に、配線用のフレキシ
ブル基板4の端部4aが異方性導電膜5により接続され
る。その端部4aとスリット4bにより分離され、更に
端部4aより突出された延長端部4cの裏面(ガラス基
板1側)に温度センサ6が半田付けにより実装されてい
る。温度センサ6はガラス基板1の延長部1aの内面に
接着剤7で固定される。なお、フレキシブル基板4の他
端に外部と接続するための電極(端子)を備えたコネク
タ部4dが形成されている。2. Description of the Related Art Generally, an optimum driving voltage of a liquid crystal display (LCD) changes depending on temperature. For this reason, a temperature sensor is attached so that the drive voltage can be changed according to the temperature. (1) A first example of a conventional mounting structure of a temperature sensor will be described with reference to FIG. Glass substrates 1 and 2 are bonded together with a liquid crystal (not shown) interposed therebetween. The end of the glass substrate 1 is protruded and extended from the glass substrate 2, and the extension 1
The liquid crystal driving IC 3 is mounted on the inner surface of the wiring board a, and the end 4 a of the wiring flexible substrate 4 is connected to the end of the extension 1 a (referred to as the extension end) by the anisotropic conductive film 5. . A temperature sensor 6 is mounted by soldering on the back surface (the glass substrate 1 side) of the extended end 4c which is separated from the end 4a and the slit 4b and further protrudes from the end 4a. The temperature sensor 6 is fixed to the inner surface of the extension 1 a of the glass substrate 1 with an adhesive 7. The other end of the flexible substrate 4 is provided with a connector portion 4d having electrodes (terminals) for connecting to the outside.
【0003】図2のLCDの温度センサ取付け構造の欠
点は、温度センサ6とガラス基板1との熱膨張係数の
相違によって接着箇所がはがれ易い点(はがれるとセン
サによる基板温度の測定が困難となったり、検出データ
の信頼性に問題がでてくる)、接着のためかなりの作
業工数が必要になる点である。 (2)従来の温度センサ実装構造の第2の例は、図3に
示すように、温度センサ6の一面を基板1の延長部1a
の内面に接着剤7で固定し、温度センサ6の他面に形成
されている電極とフレキシブル基板4とを導電ワイヤ8
で接続している。A drawback of the temperature sensor mounting structure of the LCD shown in FIG. 2 is that the bonded portion is easily peeled off due to a difference in the coefficient of thermal expansion between the temperature sensor 6 and the glass substrate 1 (if peeled off, it becomes difficult to measure the substrate temperature by the sensor). Or the reliability of the detected data may be problematic), and considerable work is required for bonding. (2) In the second example of the conventional temperature sensor mounting structure, as shown in FIG.
Is fixed to the inner surface of the temperature sensor 6 with an adhesive 7, and the electrodes formed on the other surface of the temperature sensor 6 and the flexible substrate 4 are connected to the conductive wires 8.
Connected with.
【0004】第2の例の欠点は、前記,に加えて、
更に導電ワイヤによる配線工数が必要となる点であ
る。 (3)従来の温度センサ実装構造の第3の例は、図4に
示すように、温度センサ6がフレキシブル基板4に実装
されているものである。この構造の欠点は、温度セン
サ6がガラス基板上に密着されず、フレキシブル基板4
上のガラス基板から離れた場所に実装されているため
に、基板温度の測定精度が悪い点である。The disadvantages of the second example are, in addition to the above,
In addition, wiring man-hours using conductive wires are required. (3) In a third example of a conventional temperature sensor mounting structure, as shown in FIG. 4, a temperature sensor 6 is mounted on a flexible substrate 4. The disadvantage of this structure is that the temperature sensor 6 is not adhered to the glass substrate and the flexible substrate 4
This is a point that the measurement accuracy of the substrate temperature is poor because it is mounted at a place away from the upper glass substrate.
【0005】[0005]
【発明が解決しようとする課題】この発明は、従来技術
の欠点である、温度センサが温度変化によって接着箇
所からはかれ易い点、接着の作業工数が大きい点、
導電ワイヤによる配線工数が必要となる点、温度セン
サがガラス基板から離れた場所に実装されているために
測定精度が悪い点を解決して、検出温度の信頼性と精度
を向上すると共に、LCDの生産性を向上することを目
的としている。SUMMARY OF THE INVENTION The present invention has the disadvantages of the prior art, namely, that the temperature sensor is easily separated from the bonding portion due to a temperature change, that the number of bonding steps is large,
In addition to improving the reliability and accuracy of the detection temperature, the LCD sensor solves the problem that the wiring man-hour by the conductive wire is required, and the measurement accuracy is poor because the temperature sensor is mounted away from the glass substrate. The aim is to improve productivity.
【0006】[0006]
【課題を解決するための手段】(1)請求項1の発明
は、2枚のガラス基板が液晶を挟んで張り合わされ、そ
の一方のガラス基板の端部が他方より突出延長され、そ
の延長部の内面に液晶駆動用ICが実装されると共に、
その延長部の端部(延長端部と言う)に、配線用のフレ
キシブル基板の端部が異方性導電膜により接続され、前
記延長部またはフレキシブル基板に温度センサが実装さ
れ、そのセンサの検出温度に応じて液晶駆動電圧を変化
させるようにした液晶表示素子に関する。請求項1では
特に、ガラス基板の延長端部に接続されたフレキシブル
基板の端部上に、温度センサが半田または導電性接着剤
により実装される。(1) According to a first aspect of the present invention, two glass substrates are bonded together with a liquid crystal interposed therebetween, and the end of one of the glass substrates is protruded and extended from the other, and the extended portion is provided. A liquid crystal driving IC is mounted on the inner surface of the
An end of a flexible substrate for wiring is connected to an end of the extension (referred to as an extension end) by an anisotropic conductive film, and a temperature sensor is mounted on the extension or the flexible substrate. The present invention relates to a liquid crystal display device in which a liquid crystal driving voltage is changed according to a temperature. In particular, the temperature sensor is mounted on the end of the flexible substrate connected to the extended end of the glass substrate by solder or conductive adhesive.
【0007】[0007]
【発明の実施の形態】この発明の実施例を図1に、図2
〜図4と対応する部分に同じ符号を付けて示し、重複説
明を省略する。この発明では、ガラス基板1の延長端部
1a1に接続されたフレキシブル基板4の端部4a上
に、温度センサ6が半田または導電性接着剤により実装
される。温度センサ6としてサーミスタ、熱電対等を用
いることができる。FIG. 1 shows an embodiment of the present invention, and FIG.
4 are denoted by the same reference numerals, and redundant description will be omitted. In the present invention, the temperature sensor 6 is mounted on the end 4a of the flexible substrate 4 connected to the extension end 1a1 of the glass substrate 1 by soldering or a conductive adhesive. As the temperature sensor 6, a thermistor, a thermocouple, or the like can be used.
【0008】[0008]
【発明の効果】この発明では、温度センサ6の固定に接
着剤7を用いないので、従来の技術の欠点であった、
温度変化によりセンサが接着箇所からはがれ易い点及
び、接着の作業工数が大きい点が自動的に解決され
る。またセンサの接続に導電ワイヤ8を用いないので、
導電ワイヤ8の配線工数が必要となる点も解決され
る。また、センサがガラス基板の延長端部1a1上に重
ねて接合されているフレキシブル基板の端部4a上に半
田付けされているので、従来のセンサが基板から離れた
場所に実装されているために測定精度が低下する点も自
動的に解決される。According to the present invention, since the adhesive 7 is not used for fixing the temperature sensor 6, it is a disadvantage of the prior art.
The point that the sensor is easily peeled off from the bonding portion due to the temperature change and the point that the number of steps of the bonding operation is large are automatically solved. Also, since the conductive wire 8 is not used to connect the sensor,
The point that the man-hour for wiring the conductive wire 8 is required is also solved. Further, since the sensor is soldered on the end portion 4a of the flexible substrate which is overlapped and joined on the extension end portion 1a1 of the glass substrate, the conventional sensor is mounted at a place away from the substrate. The point where the measurement accuracy is reduced is automatically resolved.
【0009】従って、この発明によれば、温度測定の信
頼性と精度を向上できると共に、LCDの生産性を向上
できる。Therefore, according to the present invention, the reliability and accuracy of the temperature measurement can be improved, and the productivity of the LCD can be improved.
【図1】この発明の実施例を示す図で、Aは正面図、B
は平面図。FIG. 1 is a view showing an embodiment of the present invention, wherein A is a front view, and B is
Is a plan view.
【図2】従来のLCDの一例を示す図で、Aは正面図、
Bは平面図。FIG. 2 is a diagram showing an example of a conventional LCD, wherein A is a front view,
B is a plan view.
【図3】従来のLCDの他の例を示す図で、Aは正面
図、Bは平面図。FIG. 3 is a view showing another example of a conventional LCD, wherein A is a front view and B is a plan view.
【図4】従来のLCDの更に他の例を示す正面図。FIG. 4 is a front view showing still another example of the conventional LCD.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2H089 HA17 JA11 KA15 NA60 QA06 QA12 SA14 TA03 TA06 2H093 NC46 NC57 NC63 ND02 ND45 ND58 NE03 5G435 AA07 AA12 AA14 AA17 BB12 EE32 EE35 EE40 EE42 EE43 FF00 GG21 HH12 KK02 KK09 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 2H089 HA17 JA11 KA15 NA60 QA06 QA12 SA14 TA03 TA06 2H093 NC46 NC57 NC63 ND02 ND45 ND58 NE03 5G435 AA07 AA12 AA14 AA17 BB12 EE32 EE35 EE40 EE42 EE43 HFF KK00 KK21
Claims (1)
わされ、その一方のガラス基板の端部が他方より突出延
長され、その延長部の内面に液晶駆動用ICが実装され
ると共に、その延長部の端部(延長端部と言う)に、配
線用のフレキシブル基板の端部が異方性導電膜により接
続され、前記延長部またはフレキシブル基板に温度セン
サが実装され、そのセンサの検出温度に応じて液晶駆動
電圧を変化させるようにした液晶表示素子において、 前記ガラス基板の延長端部に接続された前記フレキシブ
ル基板の端部上に、前記温度センサが半田または導電性
接着剤により実装されていることを特徴とする液晶表示
素子。1. A liquid crystal driving IC is mounted on an inner surface of one of the two glass substrates, the end of one of the glass substrates protruding and extending from the other. An end of the flexible board for wiring is connected to an end of the extension (referred to as an extension end) by an anisotropic conductive film, and a temperature sensor is mounted on the extension or the flexible board, and a temperature detected by the sensor is detected. In the liquid crystal display element adapted to change the liquid crystal drive voltage according to the above, the temperature sensor is mounted by solder or conductive adhesive on the end of the flexible substrate connected to the extended end of the glass substrate. A liquid crystal display device, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10216996A JP2000047179A (en) | 1998-07-31 | 1998-07-31 | Liquid crystal display element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10216996A JP2000047179A (en) | 1998-07-31 | 1998-07-31 | Liquid crystal display element |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000047179A true JP2000047179A (en) | 2000-02-18 |
Family
ID=16697191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10216996A Pending JP2000047179A (en) | 1998-07-31 | 1998-07-31 | Liquid crystal display element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000047179A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340925A (en) * | 2004-05-24 | 2005-12-08 | Nikon Corp | Imaging device |
JP2006235252A (en) * | 2005-02-25 | 2006-09-07 | Optrex Corp | Display device |
US7832616B2 (en) * | 2006-04-26 | 2010-11-16 | Watlow Electric Manufacturing Company | Methods of securing a thermocouple to a ceramic substrate |
JP2017074800A (en) * | 2017-02-07 | 2017-04-20 | エスアイアイ・プリンテック株式会社 | Liquid jet head and liquid jet device |
CN110299310A (en) * | 2019-06-14 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
CN113163537A (en) * | 2020-01-23 | 2021-07-23 | 夏普株式会社 | Self-luminous display device |
-
1998
- 1998-07-31 JP JP10216996A patent/JP2000047179A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340925A (en) * | 2004-05-24 | 2005-12-08 | Nikon Corp | Imaging device |
JP4539172B2 (en) * | 2004-05-24 | 2010-09-08 | 株式会社ニコン | Imaging device |
JP2006235252A (en) * | 2005-02-25 | 2006-09-07 | Optrex Corp | Display device |
US7832616B2 (en) * | 2006-04-26 | 2010-11-16 | Watlow Electric Manufacturing Company | Methods of securing a thermocouple to a ceramic substrate |
JP2017074800A (en) * | 2017-02-07 | 2017-04-20 | エスアイアイ・プリンテック株式会社 | Liquid jet head and liquid jet device |
CN110299310A (en) * | 2019-06-14 | 2019-10-01 | 武汉华星光电半导体显示技术有限公司 | Crystal grain soft mode encapsulation engagement thermometric jig and its setting method |
CN113163537A (en) * | 2020-01-23 | 2021-07-23 | 夏普株式会社 | Self-luminous display device |
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Legal Events
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