JP2010189759A - Method for manufacturing machine component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component for a clock, the component having excellent shock resistance and high dimensional accuracy, and to provide a clock using the component. <P>SOLUTION: The component for a clock includes: a claw 101 that has a plurality of concavo-convex features 202 having faces opposing to a plane intersecting the longitudinal direction of the claw 101 and has a plurality of concavo-convex features 201 having faces opposing to a plane parallel to the longitudinal direction; and a pallet 102 that is tightly joined so as to engage with the plurality of concavo-convex features 202 having faces opposing to a plane intersecting the longitudinal direction. A clock 880 is provided, using the above component for a clock. The claw 101 and a shaft hole are formed in the same process. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a machine part.

As is well known, watch parts are required to have high dimensional accuracy and wear resistance. An ankle, which is one of the watch parts, has a claw fixed to it, but in order to allow the escapement to operate properly and adjust the amount of overlap, a particularly high precision is required for its fixing. The
In addition, since the claw has a sliding portion, it is required to be formed of a hard material. On the other hand, since the ankle is required to be lightweight, there is a method in which the ankle and the claw are formed of different materials and joined. It was adopted.

Conventionally, a shellac bond fixing method is known as a method for fixing a claw to an ankle.
However, shellac bonds are sensitive to the chemicals used to clean the movement, and the particles of shellac bond produced by the movement cleaning may affect the escapement and prevent normal operation. Moreover, since shellac bond is a natural substance, it has a difficulty in quality durability. Further, skilled work is required to fix the claw to the ankle using the shellac bond.
Therefore, as a method of joining the claws and ankles without using the shellac bond, there are a method using a shape memory alloy (for example, refer to Patent Document 1), or a method in which the surroundings of an artificial ruby or the like that becomes the claws are solidified by electroforming. It has been proposed (see, for example, Patent Document 2).

However, in the method described in Patent Document 1, since the claw is only fixed to the ankle by flat surface contact, there is a problem that the claw is inclined when subjected to an impact.
In the method of Patent Document 2, the claws and the ankles are joined in a flat region, so that they easily come off, and it is necessary to further fix them with an adhesive or the like in order to prevent misalignment.

Special table 2007-530929 JP 2005-290427 A

  An object of the present invention is to provide a method for manufacturing a machine part such as a timepiece part having excellent impact resistance and high dimensional accuracy.

According to the first aspect of the present invention, a first resist is applied on the silicon device forming layer on the substrate having the silicon device forming layer formed on the upper surface, and the first resist is later used as a first member. A first patterning step of performing a first patterning in accordance with a shape and a shape of a hole portion of a second member to be formed later; and etching using the first resist as a mask to form the silicon device forming layer An etching process for forming a convex portion or a concave portion on the side wall of the substrate, and removing the first resist to complete a first member made of the silicon device forming layer and a columnar portion corresponding to the hole portion And a second patterning step of applying a second resist on the substrate and performing a second patterning on the second resist in accordance with a desired shape of the second member; A metal material is grown by electroforming on the electrode exposed by the second patterning step, and is tightly joined so as to mesh with the first member, thereby forming the second member by an electroformed product surrounding the columnar portion. A second member forming step, and a removing step of removing portions other than the first member and the second member and taking out the first member and the second member. A manufacturing method is provided.
In the invention according to claim 2, the substrate is an SOI substrate in which a silicon device forming layer is formed on an oxide film, and in the etching step, the etching is performed until the oxide film is reached. The electrode is exposed by the second patterning by performing the second patterning step after performing a metal layer forming step of forming a metal layer to be the electrode on the oxide film. A method for manufacturing a machine part according to 1 is provided.
According to a third aspect of the invention, the silicon device forming layer is formed on the metal layer to be the electrode in the second member forming step, and the substrate reaches the metal layer in the etching step. The electrode is exposed by the second patterning by performing the second patterning process after exposing the metal layer to be the electrode until the etching is performed. A method for manufacturing the described machine part is provided.
According to a fourth aspect of the present invention, the first member is a claw, the second member is an ankle, and the mechanical component is a timepiece component. Or a method of manufacturing a machine part according to claim 3.

  According to the present invention, the hole of the second member is formed together with the formation of the first member, and the second member is formed so as to be tightly bonded to the convex portion or the concave portion of the first member. It is possible to provide a method for manufacturing a machine part such as a watch part that is excellent in dimensional accuracy and has high dimensional accuracy.

It is a figure which shows 1st Embodiment of a nail | claw and an ankle. It is the top view which looked at the nail | claw and the ankle joint part from the upper part, and a junction part sectional drawing. It is the figure which shows the relationship between the perspective view which expanded the nail | claw 101, and an ankle and a escape wheel. It is explanatory drawing about the manufacturing method of the timepiece components of 1st Embodiment. It is another explanatory drawing about the manufacturing method of the timepiece parts of a 1st embodiment. It is typical sectional drawing for demonstrating in detail the process of repeatedly performing isotropic etching in the formation process of a nail | claw. It is explanatory drawing about the manufacturing method of the timepiece components of 2nd Embodiment. It is another explanatory view about a manufacturing method of timepiece parts of a 2nd embodiment. It is explanatory drawing about 3rd Embodiment of a nail | claw. It is explanatory drawing about the 4th Embodiment of a nail | claw. It is explanatory drawing about the manufacturing method of the nail | claw shown in 3rd Embodiment. It is explanatory drawing which shows 5th Embodiment of a nail | claw. It is explanatory drawing which shows 6th Embodiment of a nail | claw. It is explanatory drawing about the manufacturing method of the nail | claw shown in 6th Embodiment. It is another explanatory drawing about the manufacturing method of a claw shown in a 6th embodiment. It is explanatory drawing about the manufacturing method of the components for timepieces of 7th Embodiment. It is another explanatory drawing about the manufacturing method of the timepiece parts of a 7th embodiment. It is explanatory drawing about the manufacturing method of the components for timepieces of 8th Embodiment. It is a schematic diagram explaining an electroforming process. It is a typical fragmentary sectional view of the timepiece which mounts the components for timepieces. It is a perspective view for demonstrating the nail | claw which concerns on 9th Embodiment. It is a figure for demonstrating the machine component which concerns on 10th Embodiment. It is a figure for demonstrating the machine component which concerns on 11th Embodiment. It is a figure for demonstrating the ankle which concerns on 12th Embodiment. It is a figure for demonstrating the manufacturing method of the ankle which concerns on 12th Embodiment. It is a figure for demonstrating the modification of the manufacturing method of the ankle which concerns on 12th Embodiment. It is a figure for demonstrating the modification of the manufacturing method of the ankle which concerns on 12th Embodiment. It is a figure for demonstrating the manufacturing method of the ankle which concerns on 13th Embodiment.

(1) Outline of Embodiment In the timepiece part of the present embodiment, at least one convex portion or concave portion is provided on the claw fixed to the ankle, and the ankle Ude is tightly joined so as to mesh with the convex portion or concave portion. . That is, it is tightly bonded so that the concave portion of the ridge meshes with the convex portion of the claw, or is tightly bonded so that the convex portion of the ridge is meshed with the concave portion of the claw.
Due to the surface formed by the projections or recesses of the claw and the surface of the udder that is tightly joined so as to mesh with the claw, the claw is displaced or inclined from the udder against an impact in a direction other than the direction parallel to the surface. It is prevented.

Two types of grooves (irregularities) are formed on the two surfaces having the claw longitudinal direction and thickness direction components in the present embodiment.
That is, a plurality of grooves (irregularities 202) along the claw thickness direction are formed in the longitudinal direction, and a plurality of grooves (irregularities 201) along the claw longitudinal direction are formed in the thickness direction.
The thickness direction of the claw is a direction perpendicular to the operation surface of the ankle and coincides with the axial direction of the escape wheel.
Grooves 210 along the longitudinal direction formed in the claws are also formed at the tips of the claws that mesh with the teeth of the escape wheel. As a result, the contact area of the sliding portion with the escape wheel & pinion can be reduced to reduce resistance and improve oil retention.

In addition, since the claws are formed of silicon, the claws can withstand high temperatures during the formation of the cured film, so that a cured film such as DLC, sapphire, or diamond can be formed on the claws. Durability is improved by forming it at the contact part with the hand-car.
In addition, the claw and the ankle are closely joined so as to mesh with each other and formed in a continuous process to improve the positional alignment accuracy between the claw and the ankle.

(2) Details of Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of a claw 101 and an ankle 102 having the structure of the first embodiment.
As shown in FIG. 1 (a), the ankle 102 includes a sao 103 extending in a direction opposite to the claw 101 and a ude 104 that holds the claw 101. It is tightly bonded so that 101 engages.

2A and 2B are plan views of the joint between the claw 101 and the ankle 102 as viewed from above, and FIG. 2C is a schematic cross-sectional view showing a cross section of the joint between the claw 101 and the ankle 102. It is.
As shown in FIG. 2A, the side surface of the claw 101 has a plurality of irregularities 202 (hereinafter referred to as irregularities 202 in the thickness direction) having a surface facing the surface intersecting the longitudinal direction. It has a shape and is tightly bonded so as to mesh with the ankle 102.

FIG. 2B shows an example in which the unevenness 202 in the thickness direction is rectangular.
As shown in FIG. 2B, in this embodiment, the shape of the surface seen from the thickness direction of the claw 101 is formed by exposure and development of a photoresist, which will be described later. Can be freely formed.

  Thus, the shape of the unevenness 202 in the thickness direction is not particularly limited, and may be a sharp shape, a gentle unevenness, a jagged shape, or a rectangular shape. In addition, it is not always necessary to provide a plurality of irregularities, and it is only necessary to have a surface that can resist a force from a necessary direction.

Moreover, as shown in FIG.2 (c), the side surface of the nail | claw 101 has the some unevenness | corrugation 201 (henceforth the unevenness | corrugation 201 of a longitudinal direction) provided with the surface facing a surface parallel to a longitudinal direction, The ankle 102 is tightly bonded so as to mesh with the projections and depressions 201 in the longitudinal direction of the claw 101.
In this way, the claw 101 and the ankle 102 are tightly joined so as to mesh with each other via the plurality of convex and concave portions, so that the force in the direction perpendicular to the longitudinal direction of the claw 101 and the horizontal direction in the longitudinal direction of the claw 101 are Even if this force is applied, it is possible to prevent the claw 101 from shifting from the ankle 102 against these.

3A is an enlarged perspective view of the claw 101, and FIG. 3B is a diagram showing the relationship between the claw 101 fixed to the ankle 102 and the escape wheel 809. As shown in FIG.
As shown in FIG. 3A, the claw 101 has unevenness 202 in the thickness direction, and has a jagged shape. In addition, there are projections and depressions 201 in the longitudinal direction, which have a stripe shape. Here, an example in which there are unevenness 201 in the longitudinal direction over the entire circumference of the claw 101 is shown.
The portions having the unevenness 202 in the thickness direction of the jagged shape and the unevenness 201 in the longitudinal direction of the stripe shape are tightly joined so as to mesh with the ankle 102.
For this reason, even if the impact from all directions including horizontal or vertical is received, the claw 101 does not come off or shift from the ankle 102.

  Here, in FIG. 1, FIG. 2 (a)-(c), and FIG. 3 (a), although the embodiment in the case of having both the unevenness 202 of the thickness direction and the unevenness 201 of a longitudinal direction was shown, In the case where the direction to receive an impact is determined, a form including only one of the unevenness 202 in the thickness direction and the unevenness 201 in the longitudinal direction may be adopted as necessary. In addition, as described above, the shapes of the unevenness 202 in the thickness direction and the unevenness 201 in the longitudinal direction are not particularly limited.

Further, as shown in FIG. 3B, the claw 101 fixed to the tip of the Ude 104 of the ankle 102 has a tip 810 of the escape wheel that is the tip of the escape wheel 809 at the tip. Operates in contact with. Therefore, it is more desirable that the claws 101 have a structure and material that are hard and highly durable at least in contact with the teeth 810 of the escape wheel.
In FIG. 3B, the illustration of the unevenness 202 in the thickness direction and the unevenness 201 in the longitudinal direction of the claw 101 is omitted because it is difficult to understand finely.

4 and 5 are views for explaining a method for manufacturing a timepiece part according to the first embodiment.
4 (a) to 5 (k) are schematic cross-sectional views showing the steps for manufacturing the timepiece part of the first embodiment, and FIGS. 4 (l) to 5 (n) are the first embodiment. It is a top view in the important point in the manufacturing process of a form.

As shown in FIG. 4A, an SOI substrate 310 having a buried oxide film 302 on a silicon substrate 301 and having a silicon device forming layer 303 on the buried oxide film 302 is prepared.
Next, as shown in FIG. 4B, a first photoresist 304 is applied on the silicon device formation layer 303.

Next, as shown in FIG. 4C, exposure and development are performed so that the first photoresist 304 is left on the silicon device formation layer 303 to be the tab 101 later. A plan view at this point is shown in FIG.
A plurality of first photoresists 304 on the silicon device forming layer 303 that will later become the claws 101 are provided with a surface facing the surface intersecting the longitudinal direction of the claws 101 in a region to be tightly bonded so as to be meshed with the ankle 102 later. It has a shape having the unevenness 202.

  Subsequently, as shown in FIG. 4D, the silicon device formation layer 303 is etched using the first photoresist 304 as a mask. Here, by repeating the steps of isotropic etching, protective film formation and bottom protective film removal, which will be described in detail later, or anisotropic etching is performed while changing the angle of the SOI substrate 310 with respect to the etching direction. Thus, a plurality of unevennesses having a surface facing the surface parallel to the longitudinal direction of the claw 101 appearing as a plurality of stripe-shaped unevenness in the cross-sectional shape, that is, the unevenness 201 in the longitudinal direction is formed.

Next, as shown in FIG. 4E, the first photoresist 304 is removed, and the tab 101 is completed. A plan view of this state as viewed from above is shown in FIG.
A surface made of a silicon device forming layer 303 and intersecting the longitudinal direction of the claw 101 with a plurality of projections and depressions 201 having a surface facing the surface parallel to the longitudinal direction of the claw 101 and a portion to be closely bonded so as to mesh with the ankle 102 later. A claw 101 having a plurality of unevennesses having a surface facing the surface, that is, unevennesses 202 in the thickness direction.

Next, as shown in FIG. 5F, an electrode 401 is formed on the buried oxide film 302 adjacent to the claw 101. The electrode 401 is made of a conductive metal material such as chromium, gold, copper, or titanium.
Next, as shown in FIG. 5G, a second photoresist 404 is applied on the electrode 401 and the buried oxide film 302. At this time, it is desirable that the thickness of the second photoresist 404 is approximately the same as the height of the claw 101.

Subsequently, as shown in FIG. 5H, the second photoresist 404 is exposed and developed so that the second photoresist does not remain in the portion where the ankle 102 will be formed later.
Next, as shown in FIG. 5I, an electroforming process is performed based on the exposed electrode 401 to grow an electroformed product 501. The electroformed product may be a metal material such as nickel, copper, cobalt, or gold, an alloy such as Ni—W or Ni—B, or a composite such as Ni—Al 2 O 3 or Ni—SiC. The electroforming process will be described in more detail later with reference to FIG.

Next, as shown in FIG. 5 (j), the upper surface is ground and polished so that the claws 101 and the ankles 102 have a desired thickness, and is flattened to finish the surface as a mirror surface.
Next, as shown in FIG. 5K, unnecessary portions such as the second photoresist 404, the electrode 401, the buried oxide film 302, and the silicon substrate 301 are removed.
As a result, a timepiece component that is tightly bonded so that the claw 101 and the ankle 102 are engaged with each other is completed.

A plan view seen from above at this time is shown in FIG.
A claw 101 made of silicon is formed by being tightly bonded so as to mesh with the tip of the undue 104 of the ankle 102 constituted by the sao 103 and the ude 104 made of the electroformed product 501.
Since the portion having the unevenness 202 in the thickness direction and the unevenness 201 in the longitudinal direction of the knurled claw 101 is intimately joined so as to mesh with the ankle 102, even if it receives an impact from all directions including horizontal or vertical The claw 101 does not come off or shift from the ankle 102.

6A to 6G are schematic cross-sectional views for explaining in detail the process of repeatedly performing isotropic etching in the process of forming the claw 101.
The formation process of the claw 101 shown in FIG. 4 (d) will be described in detail with reference to FIGS. 6 (a) to 6 (g).

As shown in FIG. 6A, a first photoresist 304 is patterned on a region on the silicon device formation layer 303 which will later become a claw 101.
Next, as shown in FIG. 6B, the silicon device formation layer 303 is etched to a predetermined depth by isotropic etching using the first photoresist 304 as a mask. By controlling the etching depth T1 once, the amount of digging in the horizontal direction changes, and the size of the stripe-shaped longitudinal unevenness 201 to be completed later can be changed.

Next, as shown in FIG. 6C, a protective film 305 made of a silicon oxide film or a silicon nitride film is formed on the etched bottom surface and side surface of the etched silicon device forming layer 303.
Next, as shown in FIG. 6D, only the protective film 305 formed on the bottom surface of the etching is removed by anisotropic etching, and the silicon device forming layer 303 is etched again with the side surface protective film 305 left. Expose to the bottom.

Subsequently, as shown in FIG. 6E, the silicon device forming layer 303 is etched by a predetermined amount by isotropic etching in the same manner as in FIG.
At this time, the side surface is covered with the protective film 305 and is not etched, and the etching proceeds isotropically only on the bottom surface side.
6B to 6D are repeated until the buried oxide film 302 of the SOI substrate 310 is reached, so that a plurality of uneven shapes are formed on the side surface as shown in FIG. A silicon device forming layer 303 is formed.

  Finally, the first photoresist 304 and the protective curtain 305 are removed to complete the claw 101 having the projections and depressions 201 in the longitudinal direction as shown in FIG.

  The example shown in FIGS. 6A to 6G is an example in which isotropic etching is repeatedly performed. Although illustration is omitted, the SOI substrate 310 is tilted at a desired angle with respect to the etching direction. The tab 101 having the projections and depressions 201 in the longitudinal direction can also be obtained by repeating the steps of performing a certain amount of anisotropic etching and then performing the anisotropic etching by tilting in the opposite direction.

7 and 8 are diagrams for explaining a method of manufacturing a timepiece part according to the second embodiment.
FIGS. 7A to 8K are schematic cross-sectional views showing a process for manufacturing the watch part of the second embodiment. FIGS. 7L, 7M, and 8N are as follows. It is a top view in the important point in the manufacturing process of 2nd Embodiment.
The difference from the first embodiment is that, instead of the SOI substrate 310, as shown in FIG. 7A, a metal layer 601 is provided on the silicon substrate 301, and a silicon device forming layer is provided on the metal layer 601. This is the point that an S-M-S substrate 320 having 303, or a S-M substrate 330 having a silicon device forming layer 303 on a metal layer 601 as shown in FIG.

The following is an example using the S-M-S substrate 320, and mainly the points different from the first embodiment will be described, and the same parts will be described with the same reference numerals in the drawings.
The processes shown in FIGS. 7B to 7D are as described in detail with reference to FIGS. 6A to 6G. By this step, the unevenness 201 in the longitudinal direction of the claw 101 is formed.
Next, as shown in FIG. 7E, the first photoresist 304 is removed, and the tab 101 is completed. A plan view of this state as viewed from above is shown in FIG.

Next, as shown in FIG. 8F, a second photoresist 404 is applied on the metal layer 601. At this time, it is desirable that the thickness of the second photoresist 404 is approximately the same as the height of the claw 101.
Unlike the case of the first embodiment shown in FIGS. 4 and 5, the role of the electrode serving as a base for electroforming is borne by the metal layer 601. Therefore, in the second embodiment, FIG. The step of forming the electrode 401 shown in FIG.

  Thereafter, the steps shown in FIGS. 8 (g) to 8 (j) are performed by the same steps as those shown in FIGS. 5 (h) to 5 (k), and the first steps shown in FIGS. In the same manner as in the embodiment, the timepiece part in which the claw 101 and the ankle 102 are in close contact with each other is completed.

A plan view seen from above at this time is shown in FIG.
A claw 101 is formed in close contact with the tip of the Ude 104 of the ankle 102 made of the Sao 103 and Ude 104.
Similarly to the first embodiment, the portion having the unevenness 202 in the thickness direction in the thickness direction and the unevenness 201 in the longitudinal direction of the claw 101 is tightly joined so as to mesh with the ankle 102, so that the horizontal or vertical direction is The claw 101 does not come off or shift from the ankle 102 even if it receives an impact from any direction including it.

FIG. 9 is a diagram showing a third embodiment of the claw 101.
FIG. 9A is a plan view showing a third embodiment of the claw 101, and FIG. 9B is a side view showing the third embodiment of the claw 101.
As shown in FIG. 9A, when the claw 101 is viewed from above, the thickness direction unevenness 202 is formed in a portion to be closely joined so as to mesh with the ankle 102. Further, as shown in FIG. 9B, the unevenness 201 in the longitudinal direction is formed only in the unevenness portion 202 in the thickness direction.
The third embodiment shown in FIGS. 9A and 9B shows a case where the unevenness 201 in the longitudinal direction is formed only on the unevenness 202 in the thickness direction that closely contacts and joins the ankle. In order to prevent the claw 101 from falling off the ankle 102, it is indicated that at least the unevenness 202 in the longitudinal direction should be formed on the unevenness 202 in the thickness direction.

FIG. 10 is a diagram showing a fourth embodiment of the claw 101 according to this embodiment.
FIG. 10A is a plan view showing the fourth embodiment of the claw 101, and FIG. 10B is a side view showing the fourth embodiment of the claw 101. FIG.
As shown in FIG. 10A, when viewed from above, the claw 101 is formed with unevenness 202 in the thickness direction at a portion where it is tightly joined so as to mesh with the ankle 102. Further, as shown in FIG. 10B, the unevenness 201 in the longitudinal direction is formed only in the unevenness 202 in the thickness direction, and the region other than the unevenness 202 in the thickness direction is made of DLC, sapphire, diamond, or the like. A cured film 701 is formed.

  In the fourth embodiment shown in FIGS. 10 (a) and 10 (b), the cured film 701 is at least in a region other than the unevenness 202 in the thickness direction on the portion that slides in contact with the escape wheel. It is good to be there. By providing the cured film 701 at the sliding portion, the durability and reliability of the timepiece component is improved.

FIG. 11 is a diagram for explaining a manufacturing method of the claw 101 shown in the third embodiment.
FIG. 11A to FIG. 11F are schematic cross-sectional views showing a process of forming the claw 101 having the longitudinal unevenness 201 only on the unevenness 202 in the thickness direction shown in the third embodiment. 11 (g) to FIG. 11 (i) are plan views at the main points of the step of forming the claw 101 having the longitudinal unevenness 201 only on the unevenness 202 in the thickness direction shown in the third embodiment.
11 (a) and 11 (b) are diagrams showing a process of forming the protective film 305. FIG. 11 (a) shows the unevenness 202 in the thickness direction, and FIG. 11 (b) shows the unevenness in the thickness direction. 2 is a schematic cross-sectional view showing a region other than 202. FIG. As shown in FIG. 11A, the protective film 305 is formed on the unevenness 202 in the thickness direction, and the protective film 305 is formed in a region other than the unevenness 202 in the thickness direction as shown in FIG. Not formed.
FIG. 11G is a plan view seen from above at this time.

11 (c) and 11 (d) are diagrams showing an annealing process, FIG. 11 (c) shows unevenness 202 in the thickness direction, and FIG. 11 (d) shows an area other than unevenness 202 in the thickness direction. It is a typical sectional view showing.
As shown in FIG. 11C, a protective film 305 is formed on the unevenness 202 in the thickness direction, and the shape does not change even after the annealing process.
On the other hand, as shown in FIG. 11D, the protective film 305 is not formed in the region other than the unevenness 202 in the thickness direction, and the silicon atoms self-diffusion by the high-temperature annealing process of 900 ° C. to 1400 ° C. Occurs, the surface is flattened, and the unevenness 201 in the longitudinal direction is eliminated.

FIG. 11 (h) is a plan view seen from above at this time.
11 (e) and 11 (f) are diagrams showing a process of removing the protective film 305, FIG. 11 (e) shows the unevenness 202 in the thickness direction, and FIG. 11 (f) shows the process in the thickness direction. 5 is a schematic cross-sectional view showing a region other than the unevenness 202. FIG. As shown in FIG. 11 (e), the unevenness 201 in the longitudinal direction remains on the unevenness 202 in the thickness direction, while the surface of the region other than the unevenness 202 in the thickness direction is flattened as shown in FIG. 11 (f). As a result, the unevenness 201 in the longitudinal direction is eliminated. FIG. 11I is a plan view seen from above at this time.
In order to prevent the claw 101 from falling off from the ankle 102, a third embodiment is shown in which it is only necessary that the unevenness 202 in the thickness direction be formed on the unevenness 202 in the thickness direction.

FIG. 12 is a view showing a fifth embodiment of the claw 101.
FIG. 12A is a plan view showing a fifth embodiment of the claw 101, and FIG. 12B is a side view showing the fifth embodiment of the claw 101. FIG.
As shown in FIG. 12 (a), when the claw 101 is viewed from above, an unevenness 202 in the thickness direction is formed at a portion where the claw 101 is in close contact with the ankle 102. Further, as shown in FIG. 12 (b), the longitudinal projections and depressions 201 are formed, and the entire claw 101 is covered with a cured film 701 made of DLC, sapphire, diamond, or the like.
Here, since the claw 101 is made of silicon, it can withstand a high temperature (for example, 1000 ° C. or more) for forming the cured film 701.

FIG. 13 is a view showing a sixth embodiment of the claw 101.
FIG. 13A is a plan view showing a sixth embodiment of the claw 101, and FIG. 13B is a side view showing the sixth embodiment of the claw 101.
As shown in FIG. 13A, when viewed from above, the claw 101 is formed with a concave and convex portion 202 in the thickness direction at a portion where the claw 101 is in close contact with the ankle 102. Further, as shown in FIG. 13B, unevenness 201 in the longitudinal direction is formed, and only a region other than the unevenness 202 in the thickness direction is covered with a cured film 701 made of DLC, sapphire, diamond, or the like.
Here, since the claw 101 is made of silicon, it can withstand a high temperature (for example, 1000 ° C. or more) for forming the cured film 701.

  As in the fifth embodiment shown in FIGS. 12 (a) and 12 (b), the entire claw 101 may be covered with a cured film 701. However, as shown in FIGS. 13 (a) and 13 (b). In addition, as in the sixth embodiment, it is effective that a cured film 701 is formed at least in a region other than the unevenness 202 in the thickness direction that becomes the sliding portion of the claw 101.

14 and 15 are views for explaining a method of manufacturing the claw 101 shown in the sixth embodiment.
In FIGS. 14A to 15G, only the region other than the unevenness 202 in the thickness direction shown in the sixth embodiment is covered with a cured film 701 made of DLC, sapphire, diamond, or the like. FIGS. 14 (h) to 15 (k) are schematic cross-sectional views showing the process of forming the claw 101, and only regions other than the unevenness 202 in the thickness direction shown in the sixth embodiment are DLC, sapphire, or It is a top view in the important point of the process of forming the nail | claw 101 covered with the cured film 701 which consists of diamonds.

FIG. 14A shows the claw 101 before the protective film 305 is formed. FIG. 15 (h) is a plan view seen from above at this time. FIG. 14 (b) and FIG. 14 (c) are diagrams showing a production process of the protective film 305, and FIG. FIG. 14C is a schematic cross-sectional view showing a region other than the unevenness 202 in the thickness direction. As shown in FIG. 14B, a protective film 305 is formed on the unevenness 202 in the thickness direction, and as shown in FIG. 14C, the protective film 305 is formed in a region other than the unevenness 202 in the thickness direction. Not formed. FIG. 14I is a plan view seen from above at this time.
FIGS. 15D and 15E are diagrams showing a process of forming the cured film 701 after the annealing process. FIG. 15D shows the unevenness 202 in the thickness direction, and FIG. It is typical sectional drawing which shows area | regions other than the unevenness | corrugation 202 of a vertical direction.

As shown in FIG. 15D, the protective film 305 is formed on the unevenness 202 in the thickness direction, and the cured film 701 is not formed. On the other hand, as shown in FIG. 15E, the protective film 305 is not formed in a region other than the unevenness 202 in the thickness direction, and a cured film 701 made of DLC, sapphire, diamond, or the like is formed on the surface. ing.
FIG. 15J is a plan view seen from above at this time.
15 (f) and 15 (g) are diagrams showing a process of removing the protective film 305. FIG. 15 (f) shows the unevenness 202 in the thickness direction, and FIG. 15 (g) shows the process in the thickness direction. 5 is a schematic cross-sectional view showing a region other than the unevenness 202. FIG.

As shown in FIG. 15 (f), the unevenness 201 in the longitudinal direction remains on the unevenness 202 in the thickness direction, while the surface of the region other than the unevenness 202 in the thickness direction is a cured film as shown in FIG. 15 (g). 701 is covered. FIG. 15 (k) is a plan view seen from above at this time.
Although not shown, after the step of removing the protective film 305 of the sixth embodiment shown in FIG. 15G, the same steps as those shown in FIGS. 5F to 5K are performed. As a result, only the region other than the unevenness 202 in the thickness direction can be formed in close contact with the claw 101 covered with the cured film 701 made of DLC, sapphire, diamond, or the like.

  In the sixth embodiment, the example of the manufacturing process in which the cured film 701 is formed after the formation of the claw 101 before being tightly joined in the form of being engaged with the ankle has been shown. A film 701 can also be formed.

16 and 17 are diagrams illustrating a method for manufacturing a timepiece part according to the seventh embodiment.
16 (a) to 17 (l) are schematic cross-sectional views showing a process for manufacturing the watch part of the seventh embodiment. FIGS. 16 (m) (n) and 17 (o) It is a top view in the important point in the manufacturing process of 7 embodiment.
Since the steps shown in FIGS. 16A to 16E are the same as those in the first embodiment shown in FIGS. 4A to 4E, the same reference numerals are added. Instead of explanation.

Next, as shown in FIG. 17 (f), a second photoresist 404 is applied on the buried oxide film 302 so as to be lower than the height of the claw 101.
Next, as shown in FIG. 17G, an electrode 401 is formed on the second photoresist 404 adjacent to the claw 101. The electrode 401 is made of a conductive metal material such as chromium, gold, copper, or titanium.

Next, as shown in FIG. 17H, a third photoresist 504 is applied on the electrode 401 and the second photoresist 404. At this time, it is desirable that the thickness of the third photoresist 504 be approximately the same as the height of the claw 101.
Subsequently, as shown in FIG. 17I, the third photoresist 504 is exposed and developed so that the third photoresist 504 does not remain in a portion where the ankle 102 will be formed later.
The subsequent electroforming process is the same as that of the first embodiment shown in FIGS. 5 (i) to 5 (j).

Next, as shown in FIG. 17L, unnecessary portions such as the third photoresist 504, the second photoresist 404, the electrode 401, the buried oxide film 302, and the silicon substrate 301 are removed.
As a result, a timepiece component in which the claws 101 and the ankles 102 are in close contact with each other is completed. As shown in FIG. 17L, the thickness of the ankle 102 made of the electroformed product 501 is smaller than the thickness of the claw 101.

A plan view seen from above is shown in FIG.
A claw 101 is formed by tightly joining the ankle 102 of the ankle 102 comprising the sao 103 and the ude 104 in a form of being engaged with each other, and in the seventh embodiment, the thickness of the ankle 102 is larger than the thickness of the claw 101. It is characterized by being thin.
Here, the thickness of the ankle 102 and the thickness of the claw 101 indicate the length in the longitudinal direction of the cross-sectional view of the ankle 102 and the claw 101 shown in FIG. 17 (l), and the thickness direction means FIG. The direction seen in the direction perpendicular to the paper surface in the plan view shown in (o).
By making the thickness of the ankle 102 thinner than the thickness of the claw 101, it is possible to reduce the weight of the ankle 102 while maintaining sufficient strength of the claw 101 as a sliding portion.

FIG. 18 is a diagram illustrating a method for manufacturing a timepiece part according to the eighth embodiment.
18 (g) to 18 (k) are schematic cross-sectional views showing a process for manufacturing the timepiece part of the eighth embodiment, and FIG. 18 (l) is the process end shown in FIG. 18 (k). FIG.
The eighth embodiment is characterized in that a punching portion 712 for reducing the weight is formed on the ankle 102.
A difference from the first embodiment shown in FIGS. 4A to 5N is that, as shown in FIG. 18H, the second photoresist remains in the portion where the ankle 102 is formed later. In order to reduce the weight of the ankle 102 when the second photoresist 404 is exposed and developed, a portion of the second photoresist 404 is formed so as to form a cutout 712 in an appropriate portion of the ankle 102. As a part, the resist 711 for the removed part is left.
Since the other points are the same as the steps shown in FIGS. 4A to 5K, the same reference numerals are added and the description is omitted.

As shown in FIG. 18 (l), the claw 101 is formed by tightly joining the ankle 102 of the ankle 102, which is made of the sao 103 and the Ude 104, so as to mesh with each other. Is formed.
As a result, the weight of the pallet fork 102 can be reduced while maintaining the necessary strength, and it is possible to contribute to the improvement of highly accurate motion performance and durability.

  In the eighth embodiment shown in FIG. 18, an example is shown in which a hole that penetrates the ankle 102 is provided as the extraction portion 712. However, in order to reduce the weight, a recess is used instead of the hole that completely penetrates the ankle 102. Alternatively, a method of partially thinning the film may be employed.

FIG. 19 is a schematic diagram for explaining the electroforming process.
FIG. 19A and FIG. 19B are schematic diagrams for explaining the electroforming process shown in FIG.
As shown in FIG. 19A, a substrate 905 having an electrode 906 that is held by a jig 904 and has a resist 907 formed at a place where metal growth is not desired by electroforming, and electroplating such as nickel is desired. An anode 902 formed of a metal material is disposed so as to face the electroforming liquid 903. The anode 902 and the electrode 906 are connected to each other via a power source 901 and are set so that a high voltage is applied to the electrode 906 on the anode 902 side. As a result, as shown in FIG. 14B, the metal required for electroforming is ionized from the anode 902 into the electroforming liquid 903, and the metal 908 deposited on the electrode 906 to be the negative electrode grows.

FIG. 20 is a schematic partial cross-sectional view of a timepiece equipped with the timepiece part according to the present embodiment.
The operation of the watch 880 is as shown in FIG. 20 after the rotation of the barrel gear (not shown) is accelerated through the speed increasing wheel train including the second wheel, the third wheel, and the fourth wheel. This is performed by being transmitted to the car 809 and transmitted to the balance 808 via the ankle 102.
Although not shown in FIG. 20 because it is fine, the claw 101 is fixed to the ankle 102 and is fixed so that the amount of overlap can be adjusted properly in order for the escape wheel 809 to operate properly. Requires a particularly high accuracy.

According to the embodiment of the ankle 102 and the claw 101 that are the timepiece parts according to the present embodiment, the claw 101 and the ankle 102 are continuously joined in close contact with each other by engaging the unevenness 202 in the thickness direction and the unevenness 201 in the longitudinal direction. Thus, the positional alignment accuracy between the claw 101 and the ankle 102 is improved, and they can be firmly fixed to each other without being displaced or tilted even when subjected to an impact.
Further, the longitudinal unevenness 201 provided on the claw 101 reduces the contact area of the sliding portion that meshes with the teeth of the escape wheel 809 and reduces resistance, and also improves oil retention and durability.
In addition, since the claw 101 is made of silicon, it can withstand the high temperature during the formation of a cured film, so that a cured film such as DLC, sapphire, or diamond can be formed on the claw 101, further improving durability. To do.
In this way, it is possible to obtain a timepiece having excellent impact resistance and durability and high operation accuracy.

FIG. 21 is a perspective view for explaining the claw 101 according to the ninth embodiment.
In the ninth embodiment, a single convex portion or concave portion is formed along the longitudinal direction of the claw (that is, extending in the longitudinal direction).
FIG. 21A is an example in which a convex portion 201a is formed along the longitudinal direction of the claw.
In the thickness direction of the claw, a groove along the direction (thickness unevenness 202) is formed in a jagged shape in the same way as in the first embodiment. Convex portions 201a are formed along.
The convex portion 201a is formed over the entire length in the longitudinal direction, and the ridge line of the convex and concave portion 202 in the thickness direction has a convex shape.

Then, the claw 101 is tightly joined so as to mesh with the ankle 102 (FIG. 1) at a portion having a rugged thickness-like convex and concave portion 202 and a longitudinal convex portion 201a.
For this reason, even if the impact from all directions including horizontal or vertical is received, the claw 101 does not come off or shift from the ankle 102.
It is also possible to form streak-like irregularities in the longitudinal direction on the surface of the convex portion 201a as in the first embodiment. In this case, the retention capability of the lubricating oil can be enhanced by the stripe-shaped unevenness.

FIG. 21B shows an example in which a recess 201b is formed along the longitudinal direction of the claw.
In the thickness direction of the claw, a groove along the direction (thickness unevenness 202) is formed in a jagged shape in the same way as in the first embodiment. A concave portion 201b is formed.
The concave portion 201b is formed over the entire length in the longitudinal direction, and the ridgeline of the concave and convex portion 202 in the thickness direction has a concave shape.

The claw 101 is tightly joined so as to mesh with the ankle 102 at a portion having a jagged thickness-shaped projection 202 and a longitudinal recess 201b.
For this reason, even if the impact from all directions including horizontal or vertical is received, the claw 101 does not come off or shift from the ankle 102.
In addition, since the recessed part 201b is carrying out the concave shape, the retention capability of lubrication is high.
Further, it is also possible to form streak-like irregularities in the longitudinal direction on the surface of the concave portion 201b as in the first embodiment. In this case, the retention capability of the lubricating oil can be further enhanced by the stripe-shaped unevenness.

FIG. 22 is a diagram for explaining the machine part according to the tenth embodiment.
Here, the gear 110 will be described as an example of a mechanical component.
FIG. 22A is a perspective view of the gear 110. As shown in the figure, the gear 110 includes a tooth portion 112 and a disk-shaped base portion 113 that holds the tooth portion 112 with respect to the rotation shaft. It is configured.
Similar to the claw 101 of the first embodiment, the tooth portion 112 is formed by etching the silicon device forming layer 303, and the base portion 113 is formed by growing an electroformed product by electroforming.

FIG. 22B is an enlarged view of region A in FIG.
A convex portion 116 having an arc-shaped cross section in the radial direction 114 (corresponding to the longitudinal direction) of the gear 110 is formed over the entire length in the thickness direction 115 at the joint portion of the tooth portion 112 with the base portion 113. On the other hand, a concave portion that is in close contact with the convex portion 116 is formed at a joint portion of the base portion 113 with the tooth portion 112. In addition, the convex part 116 may be a part instead of the entire length in the thickness direction 115.
The arc shape of the convex portion 116 is formed so that the center line of the arc shape exists inside the concave portion of the base portion 113 (center side of the gear 110 from the central line of the concave portion). 112 does not leave the base portion 113 in the radial direction 114 of the gear 110.

In addition, although not shown in the figure, on the cylindrical circumferential surface of the convex portion 116, streak-like irregularities similar to the longitudinal irregularities 201 of the first embodiment are formed in the circumferential direction (corresponding to the longitudinal direction). In addition, since the base portion 113 is tightly bonded to the unevenness, the tooth portion 112 does not leave in the thickness direction 115.
Thus, since the tooth part 112 does not move in the radial direction 114 and the thickness direction 115, the tooth part 112 is fixed with respect to the base part 113 and can function as one mechanical component. it can.

The gear 110 can be manufactured by using the method of manufacturing the claw 101 and the ankle 102 according to the first embodiment if the claw 101 is the tooth portion 112 and the ankle 102 is the base portion 113.
That is, the first photoresist 304 is applied to the surface of the SOI substrate 310 and patterned into the shape of the tooth portion 112.
Then, the SOI substrate 310 is etched until it reaches the buried oxide film 302, and the first photoresist 304 is removed, whereby the tooth portion 112 is formed.
At this time, for example, streaky irregularities can be formed around the convex portion 116 by using the method described in each drawing of FIG.

Next, an electrode 401 is formed on the buried oxide film 302, and a second photoresist 404 is applied on the electrode 401 so as to have substantially the same thickness as the tooth portion 112, and a portion where the base portion 113 is formed Is exposed to expose the electrode 401 in the portion concerned.
Next, an electroformed product is grown on the exposed electrode 401 by electroforming, and a structure in which the tooth portion 112 and the base portion 113 are tightly bonded is formed.
Then, parts other than the tooth part 112 and the base part 113 are removed, and the gear 110 is completed.
The size of the gear 110 is not particularly limited, but is particularly effective when it is small and requires high accuracy like the timepiece component of the first embodiment.
Further, the gear 110 is an example of a machine part. For other types of machine parts, a part in contact with another part can be formed by etching, and a part that holds the part can be formed by electroforming. it can.

  In the present embodiment, the convex portion 116 is configured to fit into the concave portion of the base portion 113, but conversely, a concave portion is formed in the tooth portion 112 and the convex portion of the base portion 113 fits into the concave portion. You may comprise as follows.

FIG. 23 is a diagram for explaining the mechanical component according to the eleventh embodiment.
The mechanical component according to the present embodiment will be described using the gear 110 as an example, as in the tenth embodiment.
FIG. 23 (a) is a front view of the gear 110. As in the tenth embodiment, the gear 110 is formed by etching the silicon device forming layer 303 and an electroformed product by electroforming. It is comprised by the base part 113 formed by.

FIG. 23B is an enlarged view of a region A in FIG.
A convex portion 116 extending in the radial direction 114 of the gear 110 is formed over the entire length in the thickness direction 115 at the joint portion of the tooth portion 112 with the base portion 113, while the tooth portion 112 of the base portion 113 is connected to the tooth portion 112. A concave portion that is in close contact with the convex portion 116 is formed in the joint portion. In addition, the convex part 116 may be a part instead of the entire length in the thickness direction 115.
On the side surface of the convex portion 116, as shown in the figure, irregularities similar to the irregularities 202 in the thickness direction of the first embodiment are formed in the thickness direction 115, and have a jagged shape. For this reason, the tooth part 112 does not detach from the base part 113 in the radial direction 114 of the gear 110.

In addition, the convex portion 116 is formed with streak-like irregularities similar to the concave and convex portions 201 in the longitudinal direction of the first embodiment in the radial direction 114 (corresponding to the longitudinal direction). Therefore, the tooth portion 112 is not detached in the thickness direction 115.
Thus, since the tooth part 112 does not move in the radial direction 114 and the thickness direction 115, the tooth part 112 is fixed with respect to the base part 113 and can function as one mechanical component. it can.
The gear 110 of the present embodiment can also be manufactured by the same method as the ankle 102 of the first embodiment.
In this case, the unevenness in the thickness direction 115 is defined by the patterning of the first photoresist 304.

FIG. 24 is a diagram for explaining the ankle 102 according to the twelfth embodiment.
The structure (shape) of the ankle 102 of the present embodiment is the same as that of the first embodiment. However, in this embodiment, the claw 101, the shaft hole 130, and the sword tip hole 131 are used in the manufacture of the ankle 102. It is formed in the same process.
The positional accuracy of the shaft hole 130 with respect to the claw 101 is important to ensure the clock accuracy, and high positional accuracy can be realized by forming these simultaneously in the same process.
Also, by forming other holes (sword tip holes 131 and the like) simultaneously with the formation of the shaft holes 130, the man-hours for forming these holes can be reduced.

FIG. 25 is a diagram for explaining a method of manufacturing the ankle 102 according to the twelfth embodiment.
25 (a) to (e), (f), and (g) correspond to FIGS. 4 (a) to (e), (l), and (m), respectively, and overlap with the description of FIG. The description will be simplified or omitted for the portions to be performed.
First, as shown in FIG. 25A, an SOI substrate 310 is prepared.
Next, as shown in FIG. 25B, a first photoresist 304 is uniformly applied on the upper surface of the silicon device forming layer 303.

Next, as shown in FIGS. 25C and 25F, the first photoresist 304 is exposed so that the shapes of the claw 101, the shaft hole 130, and the blade tip hole 131 are patterned.
FIG. 25F is a plan view. In FIG. 25C, the first photoresist 304 in the shape of the shaft hole 130 and the sword tip hole 131 is omitted.

Subsequently, as shown in FIG. 25D, the silicon device forming layer 303 is etched until reaching the buried oxide film 302 using the first photoresist 304 as a mask.
As a result, the claw 101 and a shaft hole columnar portion and a blade tip hole columnar portion, which are not shown, but serve as a mold for the shaft hole 130 and the blade tip hole 131 are formed on the buried oxide film 302.
Note that the method of forming the unevenness 201 in the longitudinal direction is the same as in the first embodiment.

Next, as shown in FIG. 25 (e), the first photoresist 304 is removed, and the tab 101, the shaft hole cylindrical portion 1000 (shaft hole type) corresponding to the shaft hole 130 and the sword tip hole 131, and the sword tip hole are used. A cylindrical portion 1001 (sword tip hole type) is completed. A plan view of this state as viewed from above is shown in FIG.
In this embodiment, the axial hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 are formed in a cylindrical shape. However, various patterns such as a quadrangular prism shape, a triangular prism shape, or an elliptical prism shape are formed by patterning the first photoresist 304. It can be formed in the shape of

The subsequent steps are the same as those in FIG.
That is, an electrode 401 is formed on the buried oxide film 302, and a second photoresist 404 is applied and patterned into the shape of the ankle 102.
When an electroformed product is grown on the electrode 401 by electroforming, the Ude 104 is formed so as to be tightly joined to the unevenness 202 in the thickness direction of the claw 101, and the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 are formed. An electroformed product is formed so as to be tightly bonded to the periphery of the substrate.
Thereafter, the claw 101 and the ankle 102 are taken out, and the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 are removed, and the shaft hole 130 and the sword tip hole are formed in the portion where the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 existed. 131 is formed.

Since the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001 are made of silicon, they can be removed by crushing, for example.
Further, after the claw 101 is covered with the photoresist, the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 may be removed by being melted by etching, or may be removed by laser irradiation.
In the present embodiment, the shaft hole 130 and the blade tip hole 131 formed in this way are used as they are.
Further, the shaft hole 130 and the sword tip hole 131 may be used as pilot holes for drilling.

The subsequent steps relating to the claw 101 are the same as those in FIG.
That is, an electrode 401 is formed on the buried oxide film 302, and a second photoresist 404 is applied and patterned into the shape of the ankle 102.
Then, when an electroformed product is grown on the electrode 401 by electroforming, the Ude 104 is formed so as to be tightly bonded to the unevenness 202 in the thickness direction of the claw 101, and the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 are formed. An electroformed product is formed so as to be tightly bonded to the periphery of the substrate.
Thereafter, when the ankle 102 and the ankle 102 are taken out and the shaft hole cylinder portion 1000 and the sword hole cylindrical portion 1001 are removed, the shaft hole 130 and the sword tip hole are formed in the portion where the shaft hole cylinder portion 1000 and the sword tip hole cylinder portion 1001 existed. 131 is formed.

Since the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001 are made of silicon, they can be removed by crushing, for example.
Further, after the claw 101 is covered with the photoresist, the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 may be melted and removed by etching.
In the present embodiment, the shaft hole 130 and the blade tip hole 131 formed in this way are used as they are.
Further, the shaft hole 130 and the sword tip hole 131 may be used as pilot holes for drilling.

Next, a modification of the method for forming the shaft hole 130 will be described. The sword tip hole 131 is formed in the same manner as the shaft hole 130.
First, as shown in FIG. 26 (h), the shaft hole cylindrical portion 1000 is covered with the fourth photoresist 306 to the base (that is, to the buried oxide film 302). FIG. 26 (m) is a plan view of FIG. 26 (h).
This is because the fourth photoresist 306 is uniformly applied on the buried oxide film 302 until the upper end of the shaft hole cylindrical portion 1000 is covered, and the periphery of the end portion of the shaft hole cylindrical portion 1000 remains by etching. This can be done by exposing and etching.

Next, as illustrated in FIG. 26I, an electrode 401 is formed on the upper surface of the buried oxide film 302.
Since the fourth photoresist 306 is formed up to the buried oxide film 302, the shaft hole columnar portion 1000 and the electrode 401 are not connected.
Next, as shown in FIG. 26J, a second photoresist 404 is applied to the upper surface of the electrode 401, and then the second photoresist 404 is formed on the ankle 102 as shown in FIG. It is exposed and removed so that it remains in shape.

Next, as shown in FIG. 26L, an electroformed product 501 is grown on the upper surface of the electrode 401 using the electrode 401 as a base. Although not shown, the electroformed product 501 is thereby tightly joined to the claw 101.
Next, as shown in FIG. 27 (n), the upper surface is ground and polished so that the claws 101 and the ankles 102 have a desired thickness, and the surface is mirror finished.

Next, as shown in FIG. 27O, unnecessary portions such as the second photoresist 404, the electrode 401, the buried oxide film 302, and the silicon substrate 301 are removed.
Next, as shown in FIG. 27 (p), when the fourth photoresist 306 is removed, the shaft hole cylindrical portion 1000 is separated from the electroformed product 501, and as shown in FIG. 27 (q), the shaft hole 130 is removed. Is formed.

FIG. 28 is a diagram for explaining another method of manufacturing the ankle 102 according to the thirteenth embodiment.
28 (a) to (e) and (k) to (m) correspond to FIGS. 7 (a) to (e) and (k) to (m), respectively, and overlap with the description of FIG. The description will be simplified or omitted for the portions to be performed.
First, similarly to the method for manufacturing a watch component of the second embodiment, an S-MS substrate 320 having a metal layer 601 on a silicon substrate 301 and further having a silicon device formation layer 303 thereon is provided. prepare.
Next, as shown in FIG. 28B, a first photoresist 304 is uniformly applied on the upper surface of the silicon device forming layer 303.

Next, as shown in FIGS. 28C and 28L, the first photoresist 304 is exposed so that the shapes of the claw 101, the shaft hole 130, and the sword tip hole 131 are patterned.
FIG. 28 (l) is a plan view, and in FIG. 28 (c), the first photoresist 304 in the shape of the shaft hole 130 and the blade tip hole 131 is omitted.

Subsequently, as shown in FIG. 28D, the silicon device forming layer 303 is etched until the metal layer 601 is reached using the first photoresist 304 as a mask.
Thereby, although not shown, the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001 corresponding to the shaft hole 130 and the blade tip hole 131 are formed on the metal layer 601 (not shown).
Note that the method of forming the unevenness 201 in the longitudinal direction is the same as in the first embodiment.
Next, as shown in FIG. 28 (e), the first photoresist 304 is removed to form the claw 101, the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001 that will be the mold of the shaft hole 130 and the blade tip hole 131. Complete. A plan view of this state as viewed from above is shown in FIG.

The subsequent steps are the same as those in FIG.
That is, since the metal layer 601 functions as an electrode, the second photoresist 404 is applied on the metal layer 601 and patterned into the shape of the ankle 102.
Then, when an electroformed product is grown on the metal layer 601 as an electrode by electroforming, the Ude 104 is formed so as to be tightly bonded to the unevenness 202 in the thickness direction of the claw 101, and the axial hole cylindrical portion 1000 and An electroformed product is formed so as to be tightly bonded around the sword tip hole cylindrical portion 1001.
Thereafter, the claw 101 and the ankle 102 are taken out, and the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 are removed, and the shaft hole 130 and the sword tip hole are formed in the portion where the shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 existed. 131 is formed.
Or you may form similarly to FIG.

  As described above, according to the twelfth and thirteenth embodiments, the shaft hole 130 and the blade tip hole 131 are formed simultaneously with the claw 101 in the first embodiment and the second embodiment. Similarly, in the third embodiment, the sixth embodiment, the seventh embodiment, and the eighth embodiment, similarly, the shaft hole 130 and the blade tip hole 131 are formed in the same process as the claw 101. Can be formed.

In the case of the third embodiment, the unevenness 202 in the thickness direction of the claw 101 is annealed by forming a protective film 305. The shaft hole cylindrical portion 1000 and the sword hole cylindrical portion 1001 may or may not be covered with a protective film.
When covered, the surface irregularities of the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001 remain after the annealing step, and when not covered, they are flattened.
In the case of the sixth embodiment, only the portion other than the unevenness 202 in the thickness direction of the claw 101 is covered with the cured film 701, the unevenness 201 portion in the longitudinal direction of the claw 101, the axial hole cylindrical portion 1000 and the sword hole cylinder. The portion 1001 is not covered with the cured film 701.

In the seventh embodiment, the second photoresist 404 is applied so as to be lower than the height of the claw 101 (the same as the height of the shaft hole cylindrical portion 1000 and the blade tip hole cylindrical portion 1001), and an electrode is formed thereon. 401 is formed. Further, a third photoresist 504 is applied to form an ankle 102 through patterning and electroforming.
Then, the ankle 102 thinner than the claw 101, the shaft hole cylindrical portion 1000, and the blade tip hole cylindrical portion 1001 is formed. Then, when the shaft hole cylindrical portion 1000, the sword hole cylindrical portion 1001, and other unnecessary portions are removed, a timepiece component having an ankle 102 thinner than the claw 101 is obtained.
In the eighth embodiment, the claw 101, the shaft hole 130, and the sword tip hole 131 (the type of the shaft hole 130 and the type of the sword tip hole 131) can be formed in the same process in the timepiece part having the punched portion 712. .

Further, in each of the embodiments described above for the timepiece parts, other mechanical parts such as the gear 110 are formed by making the portion formed by etching correspond to the claw 101 and making the portion formed by electroforming correspond to the ankle 102. Can be applied to.
Thereby, the part formed by the etching of other machine parts and the hole part (hole mold) of the electroformed product can be formed in the same process.
For example, the shaft holes of the tooth portion 112 and the base portion 113 in FIG. 22A can be formed in the same process to improve the shaft hole accuracy (the twelfth and thirteenth embodiments). Further, the surface of the tooth part 112 is flattened by an annealing process (third embodiment), a hardened film 701 is formed on the tooth part 112 (sixth embodiment), and the base part is formed from the tooth part 112. 113 can be made thin (seventh embodiment), or a cutout 712 can be provided in the base 113 (eighth embodiment).

The following effects can be obtained by the present embodiment and the modification described above.
(1) The claw 101 and the ankle 102 can be integrally formed on the silicon substrate.
(2) The claw 101 can be formed of silicon by etching.
(3) Thickness unevenness and longitudinal unevenness can be formed on the claw 101 by etching.
(4) By forming the ankle 102 by electroforming so as to be in close contact with the projections and depressions of the claw 101, a watch component in which the claw 101 and the ankle 102 are integrated can be formed.
(5) Like the claw 101 and the ankle 102, it is possible to produce a machine part in which one portion having irregularities is formed by etching and the other portion that is closely bonded to this is formed by electroforming.
(6) In a machine part, a part that comes into contact with another machine part is formed of etched silicon, and a part that holds the part is formed of an electroformed product that is tightly bonded to the part. Mechanical parts can be provided.
(7) Since the moment of inertia of the machine part is reduced, the operation accuracy of the machine to which the machine part is applied can be increased. When the machine parts are the claw 101 and the ankle 102, the accuracy of the timepiece is improved.
(8) By forming the shaft hole 130 and the sword tip hole 131 in the same process as the claw 101, the positional accuracy of the shaft hole 130 and the sword tip hole 131 with respect to the claw 101 can be increased, and the accuracy of the timepiece is improved.
(9) By forming the shaft hole 130 and the blade tip hole 131 in the same process as the claw 101, the process can be reduced.
(10) Since it is a timepiece component comprising a claw 101 having at least one convex part or a concave part and an ankle 102 that is tightly joined to engage with the convex part or the concave part provided in the claw 101, the convex part The claw 101 can be firmly fixed without being displaced or inclined from the ankle 102 against an impact from a direction facing the portion or the recess.
(11) By the claw 101 having a convex portion or a concave portion having a surface opposed to a surface parallel to the longitudinal direction, the contact area of the sliding portion meshing with the teeth of the escape wheel is reduced, the resistance is reduced, and the resistance is reduced. Oiliness is improved.
(12) Since the claws 101 are formed of silicon, the claws 101 can withstand the high temperatures during the formation of the cured film, so that a cured film such as DLC, sapphire, or diamond can be formed on the claws 101. The cured film is formed on at least a contact portion of the claw 101 with the escape wheel, and durability is improved.
(13) Since the claw 101 and the ankle 102 can be formed in a continuous process by being closely joined so as to mesh with each other, the positional alignment accuracy between the claw 101 and the ankle 102 is improved. Further, it is possible to save the trouble of inserting the claw 101 into the ankle 102 separately.
(14) By creating a small part by electroforming with silicon, the small part can be created with high accuracy.

The following configuration can be obtained by the embodiment and the modification described above.
The claw 101 has an uneven portion 201 in the longitudinal direction and an uneven portion 202 in the thickness direction, and the tooth portion 112 has an uneven portion on the cylindrical surface of the protruded portion 116 or the protruded portion 116, so that at least one protruded portion or recessed portion is formed. It functions as the 1st member which has.
Further, the ankle 102 and the base portion 113 are formed so as to be in close contact with each other by electroforming so as to mesh with the concavo-convex portions of the claw 101 and the tooth portion 112, so that the convex portions provided on the first member are provided. It functions as a second member formed so as to be tightly joined by electroforming in a form that meshes with the portion or the concave portion.
The timepiece part thus formed and the gear 110 function as a machine part including the first member and the second member.

  The first member can be a claw 101 for a timepiece component, and the second member can be an ankle 102 for a timepiece component.

  In addition, the unevenness 202 in the thickness direction functions as a protrusion or recess having a surface opposite to the surface intersecting the longitudinal direction, and the ankle 102 is tightly joined so as to mesh with the surface. A timepiece component composed of 101 and ankle 102 includes a first member (claw 101) having a convex portion or a concave portion having a surface opposed to a surface intersecting in the longitudinal direction, and a convex portion provided on the first member. And a second member (ankle 102) that is tightly joined in a form that meshes with the portion or the recess. The same applies to the gear 110.

  Further, the projections and depressions 201 in the longitudinal direction function as projections or recesses having a surface facing a plane parallel to the longitudinal direction, and the ankle 102 is tightly joined so as to mesh with the tabs 101. And the ankle 102 include a first member (claw 101) having a convex portion or a concave portion having a surface opposed to a surface parallel to the longitudinal direction, and a convex portion provided on the first member. Alternatively, it functions as a mechanical component including a second member (ankle 102) that is tightly joined in a form that meshes with the recess. The same applies to the gear 110.

  Further, the first member (claw 101, tooth portion 112) is made of etched silicon.

  Furthermore, a cured film such as DLC, sapphire, or diamond can be formed on the portion of the claw 101 that contacts the escape wheel.

  The thickness of the second member is smaller than the thickness of the first member, that is, the moment of inertia can be reduced by making the ankle 102 and the base portion 113 thinner than the claw 101 and the tooth portion 112.

  The timepiece part or the gear 110 including the claw 101 and the ankle 102 can be used for a timepiece.

  Further, the mechanical component includes a first resist on the silicon device forming layer on the substrate (the SOI substrate 310 or the S-MS substrate 320) on which the silicon device forming layer (silicon device forming layer 303) is formed on the upper surface. A first patterning step of applying (first photoresist 304) and performing a first patterning on the first resist in accordance with a shape that will later become a first member (claw 101 or tooth portion 112); Etching using the first resist as a mask to form protrusions or depressions (such as depressions and depressions 201 in the longitudinal direction and depressions and depressions 202 in the thickness direction) on the sidewalls of the silicon device forming layer, and the first resist And a first member completion step for completing the first member made of the silicon device forming layer, and a second resist (second layer) on the substrate. A second patterning step in which a second patterning is performed in accordance with the shape of a desired second member (ankle 102 or base 113), and the second patterning is applied. A metal material is grown on the electrode exposed by the process (the electrode 401 and the metal layer 601) by electroforming, and the second member is formed by the electroformed product that is tightly bonded so as to mesh with the first member. A method of manufacturing a mechanical component, comprising: a member forming step; and a removal step of removing portions other than the first member and the second member and taking out the first member and the second member. Manufactured.

  The substrate is an SOI substrate (SOI substrate 310) in which a silicon device forming layer is formed on an oxide film. In the etching step, the etching is performed until the oxide film (buried oxide film 302) is reached, Thereafter, a metal layer forming step of forming a metal layer (electrode 401) to be the electrode on the oxide film is performed, and then the second patterning step is performed, whereby the electrode is formed by the second patterning. It can be exposed.

  Further, the silicon device forming layer (silicon device forming layer 303) is formed on the metal layer (metal layer 601) serving as the electrode in the second member forming step, and the substrate includes the etching step. Etching is performed until the metal layer is reached, exposing the metal layer to be the electrode, and then performing the second patterning step so that the electrode is exposed by the second patterning. Can do.

  The first member may be a claw (claw 101), the second member may be an ankle (ankle 102), and the mechanical component may be a watch component.

Furthermore, the following configuration can also be provided.
On the silicon device forming layer on the substrate (on the SOI substrate 310 or the S-MS substrate 320) on which the silicon device forming layer (silicon device forming layer 303) is formed on the upper surface, a first resist (first Photoresist 304) is applied, and the first resist has a shape that will later become a first member (claw 101 or tooth portion 112) and a second member (ankle 102 or base portion 113) to be formed later. A first patterning step of performing a first patterning in accordance with the shape of the hole (shaft hole 130, blade hole 131, shaft hole of the base portion 113), and etching using the first resist as a mask; An etching step for forming a convex portion or a concave portion (such as a concave portion 201 in the longitudinal direction and a concave portion 202 in the thickness direction) on the side wall of the device forming layer; and removing the first resist. A first member completion step for completing a first member made of the silicon device forming layer and a columnar portion corresponding to the hole portion (shaft hole columnar portion 1000, blade tip hole columnar portion 1001, etc.); A second patterning step in which a second resist is applied to the second resist and a second patterning is performed in accordance with the shape of the desired second member. A metal material is grown by electroforming on the electrode exposed by the patterning step (on the electrode 401 and the metal layer 601), closely joined so as to mesh with the first member, and an electroformed product surrounding the columnar portion ( The electroformed product 501 grows so as to surround the shaft hole and the cylindrical portion 1000 and the tip of the blade and the cylindrical portion 1001), the second member forming step of forming the second member, the first member and the Removing portions other than the second member, said a first member and a removal step of removing said second member, having a method of manufacturing mechanical parts (first configuration).
The substrate is an SOI substrate in which a silicon device forming layer is formed on an oxide film, and in the etching step, the etching is performed until the oxide film is reached, and then the metal serving as the electrode is formed on the oxide film. After the metal layer forming step for forming a layer is performed, the second patterning step is performed, so that the electrode is exposed by the second patterning. Second configuration).
In the substrate, the silicon device forming layer is formed on the metal layer to be the electrode in the second member forming step, and in the etching step, the etching is performed until the metal layer is reached. After the metal layer to be exposed is exposed, the second patterning process is performed, whereby the electrode is exposed by the second patterning. Configuration).
The first member is a claw, the second member is an ankle, and the mechanical component is a watch component, or the manufacturing method of the mechanical component having the second configuration or the second configuration (Fourth configuration).

Moreover, the following structure can also be provided by this Embodiment demonstrated above.
A timepiece component (first configuration) comprising: a claw having at least one convex portion or a concave portion; and an ankle that is in close contact with the convex portion or the concave portion provided in the claw.
A claw having a convex portion or a concave portion provided with a surface opposite to a surface intersecting with the longitudinal direction, and an ankle that is in close contact with the convex portion or the concave portion provided in the claw, Watch component (second configuration).
A first configuration comprising: a claw having a convex portion or a concave portion provided with a surface opposed to a surface parallel to the longitudinal direction; and an ankle that is in close contact with the convex portion or the concave portion provided on the claw, or The timepiece component according to the second configuration (third configuration).
The claw is a timepiece component (fourth configuration) having any one of the first to third configurations made of silicon.
A timepiece component having a configuration of any one of the first configuration to the third configuration (fifth configuration) provided with a cured film at least in contact with the escape wheel of the claw.
A timepiece component (sixth configuration) having any one of the first to third configurations in which the ankle is thinner than the claw.
A timepiece having a timepiece component having any one of the first configuration to the sixth configuration (seventh configuration).
A step of applying a first resist on a silicon device forming layer on an SOI substrate, patterning the first resist in accordance with a shape that will later become a claw, and forming the silicon device using the first resist as a mask. Etching to form a convex or concave portion on the side wall of the layer; removing the first resist to complete a claw comprising the silicon device forming layer; and on the buried oxide film adjacent to the claw After forming the electrode, a step of applying a second resist, patterning the second resist in accordance with a desired ankle shape, and growing a metal material on the exposed electrode by electroforming, A step of forming the ankle by the electroformed product tightly joined so as to mesh with the claw, an unnecessary region is removed, and the claw and the ankle are Ri out and a step, a method of manufacturing watch parts (eighth configuration).

Furthermore, the following configuration can also be provided.
A first member and a second member (ankle 102 or base portion 113) joined to the first member by fitting a part of the first member (claw 101 or tooth portion 112); The fitting part of the first member and the second member is formed on one member of the first member and the second member. An uneven part that prevents the first member and the second member from being separated is formed by contacting the raised part with a recessed part formed on the other member. First configuration).
Since the unevenness 201 in the longitudinal direction and the unevenness 202 in the thickness direction are formed in all the separating directions (thickness direction, longitudinal direction), the uneven portion is formed so as to abut against all the separating directions. A mechanical component having a first configuration (second configuration).
The 1st member is formed in the location which touches other machine parts with silicon, The machine part of the 1st composition or the 2nd composition (3rd composition) characterized by the above-mentioned.

DESCRIPTION OF SYMBOLS 101 Claw 102 Ankle 103 Sao 104 Ude 201 Several unevenness | corrugation provided with the surface which faces a surface parallel to a longitudinal direction 202 Several unevenness | corrugation provided with the surface which opposes the surface which cross | intersects thickness direction 301 Silicon substrate 302 Embedded oxide film 303 Silicon Device Formation Layer 304 First Photoresist 305 Protective Film 310 SOI Substrate 320 S-MS Substrate 330 S-M Substrate 401 Electrode 404 Second Photoresist 501 Electroforming 504 Third Photoresist 601 Metal Layer 701 Cured film 711 Resist for punched portion 712 Pulled portion 808 Balance 809 Spur wheel 810 Spur tooth 880 Clock 901 Power source 902 Anode 903 Electroforming solution 904 Jig 905 Substrate 906 Electrode 907 Resist 908 Deposited metal 201a Convex 201b recess 3 6 a fourth photoresist 110 gear 112 teeth 113 base part 114 radially 115 thickness direction 116 protrusion 130 shaft hole 131 point of a sword hole

Claims (4)

A first resist is applied on the silicon device forming layer on the substrate having the silicon device forming layer formed on the upper surface, and the first resist is formed into a shape that will later become a first member, and a second that is formed later. A first patterning step of performing the first patterning in accordance with the shape of the hole of the member;
Etching using the first resist as a mask, and forming a convex or concave portion on the side wall of the silicon device forming layer; and
Removing the first resist and completing a first member comprising the silicon device forming layer and a columnar portion corresponding to the hole; and
A second patterning step of applying a second resist on the substrate and performing a second patterning on the second resist in accordance with the shape of a desired second member;
A metal material is grown by electroforming on the electrode exposed by the second patterning step, and is tightly bonded so as to mesh with the first member, thereby forming the second member by electroforming surrounding the columnar portion. A second member forming step,
A removal step of removing portions other than the first member and the second member, and taking out the first member and the second member;
A method for manufacturing a machine part, comprising: The substrate is an SOI substrate in which a silicon device forming layer is formed on an oxide film,
In the etching step, the etching is performed until the oxide film is reached,
After that, after performing a metal layer forming step of forming a metal layer to be the electrode on the oxide film, the second patterning step causes the electrode to be exposed by the second patterning. 2. A method of manufacturing a machine part according to claim 1, wherein In the substrate, the silicon device forming layer is formed on the metal layer to be the electrode in the second member forming step,
In the etching step, the etching is performed until the metal layer is reached, exposing the metal layer to be the electrode, and then performing the second patterning step, whereby the electrode is exposed by the second patterning. The method of manufacturing a machine part according to claim 1, wherein:   The machine according to claim 1, wherein the first member is a claw, the second member is an ankle, and the machine part is a watch part. A manufacturing method for parts.

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