JP2010164652A - Local heating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a local heating apparatus which can efficiently and uniformly dry a coating liquid or a thermosetting member while preventing the influence of heating on the members other than a substrate being a heating object without applying surplus stress on the substrate. <P>SOLUTION: The local heating apparatus comprises: a conveying means conveying a substrate 1; and a substrate supporting member 4 where the circumferences of the side parts are surrounded to form spaces 11 having openings at the upper and the lower parts, and the whole circumference of the upper opening edge is contacted with the lower face of the substrate 1 to support the substrate 1. The apparatus is further provided with: a non-contact heating means 3 located at the inside of each space 11 in a state where the substrate supporting member 4 supports the substrate 1, jets a hot blast to the lower face side of the local position being the heating object of the substrate 1, and heats the local position in a non-contact state; and an exhaust means connected so as to be communicated with each space 11, and exhausts the air present in each space 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a local heating apparatus that forms a film by heating and drying a coating solution or a thermosetting member locally formed on a substrate.

  A technique for forming a thin film by applying a liquid or thermosetting member on a substrate and drying it has been used in many production apparatuses. Among them, a patterning technique that has been attracting attention in recent years is a patterning technique in which a required amount of liquid is applied to an arbitrary portion on a substrate and dried to form a film. Such a technique includes a technique using a dispenser or an inkjet. These are attracting attention as technologies that can be used in a vacuum removal process instead of a pattern generation method using a vacuum process by conventional photolithography.

  For example, as a production apparatus using an inkjet patterning technique, there is an apparatus for forming a color filter panel. In this apparatus, ink of each color of red (R), green (G), and blue (B) is landed in the RGB pixel area formed on the glass substrate. Then, a color filter (CF) is formed by filling each pixel. Here, the ink applied in the pixel region is dried to form a film by heating the entire substrate by an oven or the like.

  Such a patterning technique is widely used not only as a full-surface printing technique but also as a technique for repairing a defective portion such as color mixture, contamination, or adhesion. For example, in a CF panel, in the case of a defective pixel in which color mixing of ink occurs or a defective pixel in which impurities are mixed, the ink layer film in the defective area is removed, ink is applied again to the removed portion, and heat drying is performed. There is a technique for re-forming pixels.

  Patent Document 1 discloses a prior art document that discloses a method of drying an applied ink by heating the entire substrate with an oven or a hot plate. When heating the entire substrate, a dedicated large heating device or a transfer robot with excellent heat resistance is required. Moreover, in order to advance the heated substrate to the next process, a place and time for cooling are also required. For this reason, there are problems such as an increase in manufacturing cost and a longer manufacturing time.

  In particular, when there are few parts to be heated and dried, the production cost and the production time can be reduced by locally heating and drying. For this reason, there is a high expectation for a technique in which only the portion where the ink is applied is locally heated and dried.

  As a method of locally heating and drying, a method of drying by bringing a heating element used in a hot plate or the like close to the substrate can be considered. In addition, Patent Literature 2, Patent Literature 3 or Patent Literature 4 is a prior art document that discloses a method of heating a substrate using a laser, an infrared lamp (infrared heater), a halogen heater, or the like. Furthermore, as a method of heating from both the upper and lower surfaces of the substrate, there is Patent Document 5 or Patent Document 6 as a prior document disclosing a method of blowing hot air or a method of heating with a heater or the like.

  Patent Document 7 is a prior art document that discloses a heat treatment apparatus in which the heights of a plurality of support members that support the lower surface of the substrate are changed in order to stably support the substrate. Moreover, there is Patent Document 8 as a prior document disclosing a heating container including a chamber serving as a heating space.

  As a prior document disclosing a method for correcting a color filter, there is Patent Document 9. Patent Document 9 discloses a method of curing a color filter material by embedding a new color filter material in a defective portion of a color filter layer and bringing a heated member close to the defective portion from above. Further, in a solder melting apparatus that melts solder with hot air, there is Patent Document 10 or Patent Document 11 as a reference document that discloses a method for preventing hot air from reaching other than a target location.

JP 2004-160296 A JP 2004-95356 A JP 2004-165140 A JP 2006-224460 A JP 2000-315860 A JP 2005-223000 A JP 2006-237262 A JP 2005-530564 A Japanese Patent No. 4019475 JP-A-6-69641 Special table 2007-535120 gazette

  In the heating method using a laser described in Patent Document 2, since the temperature gradient between the heating place and the non-heating place on the substrate is steep, stress is applied to the substrate. As a result, there is a problem that the mechanical strength in the vicinity of the heating place is weakened. In general, in a method using a lamp, the temperature gradient between a heated place and an unheated place is gentler than that of a laser. However, since the frequency of lamp replacement is high, the device must be stopped each time. Therefore, there is a problem that the operation rate of the apparatus is lowered and the production efficiency is lowered.

  In the heating method using a heater or a high-frequency coil described in Patent Document 3, Patent Document 4 or Patent Document 9, the ink is not dried unless the gap between the heater or coil and the ink droplet is narrowed. On the other hand, if the gap is too narrow, the solvent vapor does not diffuse, resulting in a high-concentration solvent atmosphere, and there is a problem that drying is suppressed and drying time is lengthened. The heat treatment apparatus described in Patent Document 7 that supports a substrate on a heat treatment plate by a plurality of support members having different heights does not equalize the distance between the substrate and the heat treatment plate. There is a problem that is not constant.

In the heating methods described in Patent Document 5 and Patent Document 6, when the substrate is heated by the heater units arranged both above and below the substrate, the heat diffuses around the substrate. In the solder melting apparatus using hot air described in Patent Literature 10 and Patent Literature 11, a frame is provided around the heating portion so that the hot air does not spread around the heating portion. It is discharged upward from the section. For this reason, there is a problem that a part of the heating device is partially heated to cause thermal deformation, or the heat of the high temperature part affects the heating by the heater unit, and stable heating cannot be performed.

In the method for controlling solvent vapor described in Patent Document 1, a configuration in which a heating source is mounted on the control member is conceivable. In the method described in Patent Document 1, a plurality of holes are formed in the plate material in order to make the drying speed uniform. If this is applied in order to dry locally applied droplets, there is a problem that the drying speed varies depending on the relative positions of the plurality of holes and the application portion. In Patent Document 1, there is no description of means for solving this, and its application is difficult.

  Further, it is assumed that a heating source is attached to the plate material, and the plate material has a function as a heater. In this case, even if the gas (air) existing between the plate material and the substrate can be heated due to the presence of the plurality of holes, there is convection in which the heated air tends to rise upward in the vicinity of every hole. It happens. As a result, there is a problem that the flow of heated air hardly flows toward the application part, and the drying efficiency is lowered.

  The heating container described in Patent Document 8 includes a chamber as a container for storing an object to be heated, and has a structure suitable for heating food. However, since it is difficult to adjust conditions such as the airflow in the chamber, the heating temperature of the object to be heated cannot be kept constant.

  The present invention has been made in view of the above-mentioned problems, and it is possible to prevent the influence of heating on the substrate other than the substrate to be heated, and without applying excessive stress to the substrate, without applying an excessive stress to the substrate. An object of the present invention is to provide a local heating device that can efficiently and uniformly dry a member.

  The local heating device according to the present invention includes a transport means for transporting the substrate, and a space that is surrounded by the sides and has openings in the top and bottom, and the entire periphery of the upper opening end contacts the lower surface of the substrate to support the substrate. A substrate support member. In addition, the substrate support member is located in the space with the substrate supported, and hot air is sprayed to the lower surface side of the local position to be heated of the substrate to heat the local position in a non-contact state. Heating means and exhaust means connected to communicate with the space and exhausting air existing in the space are provided. Further, the local heating device positions the first height adjusting unit that adjusts the upper surface of the substrate support member that contacts the lower surface of the substrate to a predetermined height, and the non-contact heating unit at a local position of the substrate. Moving means.

  According to this local heating device, during heating, the upper surface of the substrate support member that is in contact with and supported by the lower surface of the substrate and the non-contact heating means are controlled to have a predetermined distance. For this reason, the curvature of a board | substrate can be reduced in the whole heating range which is supporting the board | substrate, and the distance which injects a hot air with respect to the lower surface of a board | substrate can be adjusted accurately.

  When heating using hot air, the heating temperature is not stable if the distance between the object to be heated and the non-contact heating means varies. By adjusting the distance between the substrate and the non-contact heating means, the heating temperature of the substrate can be stably managed. By drying at a suitable temperature, it is possible to improve the quality of a film formed from a coating solution on a substrate or a thermosetting member.

  Further, when heating, the non-contact heating means is located inside a space surrounded by the lower surface of the substrate and the substrate support member. Since the exhaust means is connected to the inside of this space, the hot air jetted from the non-contact heating means heats the lower surface of the substrate and is then discharged outside the local heating device. Therefore, in the local heating device, it is possible to prevent the portions other than the heating unit involved in heating from being heated and deteriorated by the hot air, and to stably heat the substrate by adjusting the heating atmosphere in the space.

  The local heating device may further include a second height adjusting unit that disposes the non-contact heating unit at a predetermined distance from the upper surface of the substrate support member. In this case, the distance between the substrate supported on the upper surface of the substrate support member and the non-contact heating means is set to a distance suitable for heating according to the type of coating solution or thermosetting member formed on the substrate. It can be adjusted with high accuracy.

  The exhaust means may be connected directly below the substrate supported by the substrate support member. In this case, it is possible to generate an air flow in the space such that the hot air jetted from the non-contact heating means is guided to the lower surface of the substrate, so that the heating efficiency of the substrate can be increased.

  The amount of air discharged from the exhaust means may be controlled to be larger than the amount of hot air injected from the non-contact heating means. In this case, it is possible to prevent the hot air from flowing out of the space and the parts other than the heating unit of the apparatus being heated and deteriorated.

  The substrate support member may further include an adsorption portion that adsorbs to the lower surface of the substrate and supports the substrate. In this case, since the substrate is twisted or the like, the gap that exists between the substrate support member and the substrate can be eliminated by adsorbing the substrate by the adsorption unit. For this reason, it can prevent that a hot air leaks from the clearance gap between a board | substrate support member and a board | substrate.

  The local heating device may be configured such that the non-contact heating unit and the substrate support member stand by in a standby region other than the region where the substrate transport unit is disposed, except when heating the substrate. In this case, unnecessary heating can be prevented for the substrate after the drying process. Further, it is possible to prevent the apparatus itself from being heated when the substrate is unloaded and there is no substrate in the apparatus.

  The substrate heating temperature by the non-contact heating means may be adjusted using a temperature calibration substrate including a temperature measuring device in the standby area. In this case, since the substrate heating temperature by the non-contact heating means can be adjusted based on the temperature measurement result of the heated temperature calibration substrate, the product substrate can be accurately heated to a predetermined temperature. .

  The local heating device may include a cooling device that cools the substrate from the lower surface side. In this case, the cooling rate of the substrate after the heat treatment can be increased to shorten the tact time of the heat drying process.

  The distance between the non-contact heating means and the cooling device relative to the lower surface of the substrate may be controlled independently. In this case, the non-contact heating means and the cooling device can be moved up and down independently. Therefore, after the non-contact heating means is moved away from the heat-treated substrate, cooling can be performed with the cooling device close to a predetermined distance to the substrate, so that the cooling efficiency of the substrate is improved and the cooling time is shortened. Can do.

  According to the present invention, with the substrate support member in contact with and supported on the lower surface of the substrate, a space is formed below the local position of the substrate, and the non-contact heating means and the exhaust means located in the space are adjusted. By heating the substrate, it is possible to adjust the heating atmosphere in the space while preventing the influence of heating from being exerted on other than the substrate to be heated. By heating in this way, the coating solution or the thermosetting member can be efficiently and uniformly dried without applying excessive stress to the substrate.

It is a plane schematic diagram of the local heating apparatus which concerns on Embodiment 1 of this invention. It is the cross-sectional schematic diagram seen from the II-II line arrow direction of FIG. (A) is sectional drawing which shows the state in which the board | substrate is supported by the conveyance roller, (B) is sectional drawing which shows the state in which the board | substrate is biased and supported by the conveyance roller. It is a cross-sectional schematic diagram which shows the state which supported the board | substrate with the board | substrate support member. It is a cross-sectional schematic diagram which shows the state which is heating, supporting a board | substrate with a board | substrate support member. It is a cross-sectional schematic diagram which shows the state which is heating the board | substrate without enclosing a non-contact heating means with a board | substrate support member as a comparative example with the local heating apparatus which concerns on the embodiment. (A) is a schematic cross-sectional view showing a state in which a gap between a pair of adjacent roller shafts is widened, and (B) is a cross-sectional view showing a state in which they are not widened. It is a cross-sectional schematic diagram which shows the structure which exhausts the air inside a space through the exhaust pipe arrange | positioned so that a hot air heater may be surrounded in the local heating apparatus which concerns on the embodiment. It is a cross-sectional schematic diagram which shows the local heating apparatus which concerns on Embodiment 2 of this invention. It is a cross-sectional schematic diagram which shows the state which has heated the board | substrate with a large curvature supported by the board | substrate support member. It is a cross-sectional schematic diagram which shows the local heating apparatus which concerns on Embodiment 4 of this invention. It is a top view which shows the movement range of the heating part of a local heating apparatus. It is a plane schematic diagram which shows the local heating apparatus which provided the standby area | region of the heating part based on Embodiment 5 of this invention. In the local heating apparatus which concerns on this Embodiment, after finishing the heat processing of a board | substrate, it is a plane schematic diagram which shows the state which has a board | substrate in a carrying-out position. It is a plane schematic diagram which shows the local heating apparatus which has arrange | positioned the board | substrate for temperature calibration to the waiting | standby area | region based on Embodiment 6 of this invention. It is a cross-sectional schematic diagram which shows the state which is heating the substrate for temperature calibration. It is a cross-sectional schematic diagram which shows the local heating apparatus which concerns on Embodiment 7 of this invention. It is a cross-sectional schematic diagram which shows the state which has cooled the board | substrate with the cooling device in the local heating apparatus which concerns on the embodiment. It is a cross-sectional schematic diagram which shows the local heating apparatus which concerns on Embodiment 8 of this invention.

  Hereinafter, a local heating device according to an embodiment of the present invention based on the present invention will be described with reference to the drawings.

Embodiment 1
FIG. 1 is a schematic plan view of a local heating device according to Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view seen from the direction of arrows II-II in FIG. As shown in FIG. 1, the local heating device according to the present embodiment is provided with a transport roller 5 for transporting the substrate 1. A plurality of conveying rollers 5 are arranged on the roller shaft 8 at a predetermined interval. A plurality of roller shafts 8 on which the transport rollers 5 are arranged are provided at predetermined intervals in the transport direction of the substrate 1. The direction in which the roller shafts 8 are arranged is the X direction, and the direction parallel to the roller shaft 8 is the Y direction. In FIG. 1, the substrate 1 is shown as being transparent.

  The substrate 1 is transferred to the transfer roller 5 by a rotational force of a motor (not shown) and the transfer roller 5 itself rotates to transfer the substrate 1 or a substrate holding member (not shown) that chucks the substrate 1. Is driven by a motor to transport the substrate 1 on the transport roller 5. The substrate holding member chucks the substrate 1 by means such as pressing and holding by an air cylinder or vacuum suction.

  An interval wider than the interval between the other adjacent roller shafts 8 is provided between the pair of adjacent roller shafts 8 so that the heating unit 2 that heats the substrate 1 can move. As shown in FIG. 2, the heating unit 2 includes a non-contact heating unit 3 and a substrate support member 4. As the non-contact heating means 3, for example, a hot air heater that jets hot air may be used. A direction perpendicular to both the X direction and the Y direction is referred to as a Z direction.

  The substrate support member 4 has a space penetrating in the Z direction inside. An exhaust cylinder 7 having an exhaust port 6 is provided on the inner periphery of the substrate support member 4 in contact with the space. An exhaust pipe 10 is connected to the exhaust cylinder 7, and an exhaust pump (not shown) is connected to the exhaust pipe 10. The air present in the exhaust tube 7 and the exhaust pipe 10 is exhausted by the exhaust pump, and further, the air present in the space inside the substrate support member 4 is exhausted from the exhaust port 6.

  3A is a cross-sectional view showing a state in which the substrate is supported by the transport roller, and FIG. 3B is a cross-sectional view showing a state in which the substrate is supported by the transport roller in a biased manner. As shown in FIG. 3A, the substrate 1 is deflected by its own weight and varies in height between adjacent transport rollers 5. Further, the height of the substrate 1 on the transport roller 5 varies depending on the accuracy of the apparatus itself such as the eccentricity of the transport roller 5 and the alignment of the roller shaft 8.

  As shown in FIG. 3B, the substrate 1 is supported in a cantilevered state by the transport roller 5 when the periphery of the substrate end is subjected to heat treatment. Therefore, a large deflection may occur due to the weight of the substrate 1 in the cantilevered state.

  When the substrate 1 is heated by the hot air heater, when the distance between the substrate 1 and the outlet of the hot air heater changes, the temperature of the substrate 1 during heating also changes. The film formed by drying the coating solution or the thermosetting member on the substrate 1 has different quality depending on the temperature at the time of heating the substrate 1, and therefore needs to be heated at an appropriate temperature. In order to form a high-quality film on the substrate 1, it is necessary to keep the temperature at which the substrate 1 is heated constant at a temperature suitable for film formation. For this purpose, it is desirable to heat the substrate 1 in a state where the distance between the substrate 1 and the outlet of the hot air heater is kept constant.

  Therefore, in order to keep the height of the substrate 1 at the heated position constant, the substrate support member 4 is brought into contact with the substrate 1 from below the substrate 1 to support the substrate 1. FIG. 4 is a schematic cross-sectional view showing a state in which the substrate is supported by the substrate support member. As described above, the cause of the variation in the height of the substrate 1 may be due to the deviation of the height of the conveyance roller 5 that supports the substrate 1.

  Therefore, in order to ensure that the height of the substrate 1 at the heating position is kept constant, as shown in FIG. 4, the height at which the transport roller 5 contacts and supports the substrate 1, slightly higher than the so-called pass line 9. It is desirable that the upper surface of the substrate support member 4 be in contact with and support the substrate 1 at a high position. Therefore, first height adjusting means is provided for adjusting the upper surface of the substrate support member 4 that contacts the lower surface of the substrate 1 so as to have a predetermined height. By doing in this way, the influence of the dispersion | variation in the support height of the board | substrate 1 of the conveyance roller 5 can be reduced, and the board | substrate 1 can be supported by fixed height in a heating position.

  FIG. 5 is a schematic cross-sectional view showing a state where the substrate is heated while being supported by the substrate support member. As shown in FIGS. 1 and 5, the substrate support member 4 is formed with a space 11 that is surrounded by the sides and has openings in the upper and lower sides, and the entire periphery of the upper opening end contacts the lower surface of the substrate 1 so To support. The non-contact heating means 3 such as a hot air heater is located inside the space 11 with the substrate support member 4 supporting the substrate 1 and injects hot air to the lower surface side of the local position to be heated of the substrate 1. Heat in a non-contact state.

  The substrate 1 is usually formed with a thickness of about 0.7 mm, has a small heat capacity, and is easily heated by heating. For this reason, even if the coating liquid or thermosetting member formed on the upper surface of the substrate 1 is heated from the lower surface of the substrate 1, there is almost no energy loss. Also, there is no problem in drying the coating liquid or the thermosetting member from the lower surface of the substrate 1 in terms of the drying quality.

  As indicated by the arrows in FIG. 5, the air present in the space 11 is discharged from the exhaust port 6 disposed in the space 11 through the exhaust tube 7 and the exhaust pipe 10. The local heating device may be provided with a second height adjusting unit (not shown) that arranges the non-contact heating unit 3 at a predetermined distance from the upper surface of the substrate support member 4 during heating. In this case, the distance between the substrate 1 supported by the substrate support member 4 and the non-contact heating means 3 is suitable for heating in accordance with the type of coating solution or thermosetting member formed on the substrate 1. Can be adjusted to distance.

  Further, the local heating device is provided with a moving means for positioning the non-contact heating means 3 at a local position of the substrate 1. As shown in FIG. 5, the non-contact heating means 3 may be positioned substantially at the center of the space inside the substrate support member 4. The heating unit 2 including the non-contact heating unit 3 and the substrate support member 4 is integral and can move in the Y direction.

  As the moving means, a first linear actuator (not shown) is used, and the heating unit 2 is configured to be movable in the Y direction. The linear actuator is composed of a combination of linear guide means and driving means such as a linear motor or a stepping motor, and a commercially available linear actuator can be used. As the first height adjusting means, a second linear actuator (not shown) is used, and the substrate support member 4 is configured to be movable in the Z direction. When the second height adjusting means is provided, a third linear actuator (not shown) is used, and the non-contact heating means 3 can be moved in the Z direction.

  Each of the substrate transfer means, the first linear actuator, the second linear actuator, and the third linear actuator has an encoder that detects the amount of movement. Therefore, it is possible to accurately control the positioning of the heating unit 2 relative to the substrate 1 in the X direction, the Y direction, and the Z direction.

  Hereinafter, a method of heating a local position on the substrate 1 in the local heating apparatus according to the present embodiment will be described. Before the substrate 1 is put into the local heating device, the coating liquid or thermosetting member is formed on the substrate 1 by the coating liquid or thermosetting member discharging device. Information such as the formation area and center position coordinates is assumed to be known.

  In the local heating apparatus according to the present embodiment, a position sensor (not shown) that detects the end face of the substrate 1 is mounted. When the substrate 1 is inserted, the end face of the substrate 1 is detected and the first actuator is controlled. Recognize the zero point of coordinates. Based on the center position coordinates of the substrate 1, the necessary feed amount in the X direction of the substrate 1 by the substrate transport means and the necessary movement amount in the Y direction of the heating unit 2 by the first linear actuator are calculated. According to this calculation result, the non-contact heating means 3 is positioned at a local position to be heated by moving the heating unit 2 including the substrate 1 and the non-contact heating means 3 relative to each other.

  After the positioning of the non-contact heating means 3 is completed, the substrate support member 4 is raised and brought into contact with the lower surface of the substrate 1. A terminal for detecting the contact state is provided near the upper surface of the substrate support member 4, and the contact position is recognized as a zero point of coordinates in the control of the second linear actuator. Thereafter, the substrate support member 4 is moved by the second linear actuator so as to raise the height of the substrate 1 in the vicinity of the heating position to a predetermined height. Alternatively, the height at which the substrate support member 4 supports the substrate 1 may be set in advance, and the substrate support member 4 may be moved by the second linear actuator to this set height.

  When the local heating device includes the second height adjusting means, the hot air heater outlet is disposed at a predetermined distance from the lower surface of the substrate 1 with the substrate 1 supported by the substrate support member 4. As described above, the hot air heater is moved in the Z direction by the third linear actuator.

  Thus, during heating, the upper surface of the substrate support member 4 that is in contact with and supported by the lower surface of the substrate 1 and the non-contact heating means 3 are controlled to have a predetermined distance. For this reason, the curvature of the board | substrate 1 can be reduced in the whole heating range which is supporting the board | substrate 1, and the distance which injects a hot air with respect to the lower surface of the board | substrate 1 can be adjusted with a sufficient precision. Therefore, during the heating, the coating liquid or the thermosetting member on the substrate 1 can be efficiently used while preventing the substrate 1 and the non-contact heating means 3 from being too close and applying excessive stress to the substrate 1. It can be dried uniformly. In the present embodiment, the substrate support member 4 itself does not perform heating that is the main heating element.

  FIG. 6 is a schematic cross-sectional view showing a state in which the substrate is heated without surrounding the non-contact heating means with the substrate support member as a comparative example with the local heating apparatus according to the present embodiment. As shown in FIG. 6, the substrate 1 is supported on the transport roller 5 and heated by a hot air heater as the non-contact heating means 3. The substrate 1 is transported by the transport roller 5 so that the hot air heater at the time of heating is disposed at a substantially middle position between the adjacent roller shafts 8.

  Since the hot air sprayed from the hot air heater and heated the substrate 1 has a temperature higher than that of the outside air, the specific gravity is lighter than the outside air and easily diffuses upward. However, since the upper side is blocked by the substrate 1, it diffuses along the lower surface of the substrate 1. Therefore, the heat of the hot air is transmitted to the transport roller 5 existing near the lower surface of the substrate 1.

  Since the transport roller 5 is in contact with the substrate 1, the transport roller 5 is formed of a resin material having a low hardness such as ultra-high molecular weight polyethylene so as not to damage the substrate 1 when the substrate is transported. However, when repeatedly affected by the heat of hot air, a resin material that does not have heat resistance deteriorates and changes its quality. For this reason, it is necessary to form the transport roller 5 using a heat-resistant polyimide resin or the like. However, since the heat-resistant resin material such as polyimide resin is expensive, the transport roller 5 is formed of a heat-resistant resin material. This causes an increase in apparatus cost, which is not preferable.

  The effect of the hot air sprayed from the hot air heater becomes more pronounced as the distance from the hot air heater is shorter. Although the heating temperature of the board | substrate 1 changes with kinds of the coating liquid or thermosetting member to dry, it may become a temperature close | similar to 300 degreeC. In this case, the hot air sprayed from the hot air heater and heating the substrate 1 still has a temperature close to 300 ° C.

  Therefore, a method of moving the conveying roller 5 away from the heating position where the hot air heater is located at the time of heating is also conceivable. FIG. 7A is a schematic cross-sectional view showing a state in which the interval between a pair of adjacent roller shafts is widened, and FIG. 7A and 7B show a state in which the substrate 1 is transported from right to left in the drawing.

  As shown in FIG. 7A, in order to increase the distance between the hot air heater and the transport roller 5, the interval L1 between a pair of adjacent roller shafts 8 is increased. In this case, when the board | substrate 1 is conveyed on the conveyance roller 5 and it transfers to the following conveyance roller 5 over the space | interval L1, the part used as the cantilever state of the board | substrate 1 becomes long, and a big deflection | deviation generate | occur | produces. As shown in FIG. 7B, in the substrate 1 in the case where the distance L2 between the roller shafts 8 is not widened, the deflection that occurs when moving to the next transport roller 5 beyond the distance L2 is small.

  When the substrate 1 is transferred to the next conveyance roller 5, it is desirable that the tip of the substrate 1 and the conveyance roller 5 are smoothly contacted. Specifically, the closer the contact position with the tip of the substrate 1 is to the upper end of the transport roller 5, the smaller the load applied to the substrate 1 at the time of contact. Conversely, as the position of contact with the tip of the substrate 1 moves away from the upper end of the transport roller 5, the load on the substrate 1 when transferring to the next transport roller 5 increases. When the conveyance speed is high, the load applied to the substrate 1 becomes an impact force, so that the substrate 1 may be broken. Therefore, it is not preferable to take measures against the thermal effect of hot air by increasing the distance between the hot air heater and the conveying roller 5.

  The heat effect of the hot air extends not only to the conveying roller 5 but also to the apparatus main body. For example, lubricating grease is used for the bearing portion of the guide shaft for driving the non-contact heating means. When this bearing portion is heated to a high temperature, the viscosity of the grease may decrease and the grease may flow out from the bearing portion. In this case, there is a possibility that the bearing portion that has lost the lubricity may cause seizure or the grease that has flowed out may adhere to the substrate 1. Further, due to the heat effect of the hot air, there is a possibility that the substrate conveying means or the fixed portion of the guide shaft for driving the non-contact heating means is distorted and the substrate 1 and the non-contact heating means cannot be positioned with high accuracy.

  The effect | action of the local heating apparatus which concerns on this Embodiment which reduces the thermal effect of the hot air injected from such a hot air heater is demonstrated. As shown in FIG. 5, after the arrangement of the substrate 1 and the heating unit 2 is completed, hot air is jetted from the hot air heater. At this time, the hot air heater is located inside the space 11 such that the upper surface of the substrate support member 4 is covered with the substrate 1. The temperature of the hot air sprayed from the hot air heater and heating the substrate 1 may be close to 300 ° C. This high temperature air is hotter than the outside air and has a specific gravity lighter than the outside air, so that it tends to accumulate above the space 11.

  In this way, hot air can be prevented from diffusing directly around by retaining hot air in the space 11. As described above, the exhaust means is connected so as to communicate with the space 11. The exhaust means includes an exhaust port 6 provided in the inner periphery of the substrate support member 4 and an exhaust cylinder 7 serving as a flow path for exhausting air from the exhaust port 6 to the outside of the substrate support member 4. Further, the exhaust means includes an exhaust pipe 10 connected to the exhaust cylinder 7 and an exhaust pump or an exhaust duct (not shown) connected to the exhaust pipe 10.

  Since high-temperature air flows into the exhaust cylinder 7, it is desirable that the exhaust cylinder 7 be formed of a heat-resistant metal pipe. Since the temperature of the exhausted air drops while passing through the exhaust tube 7, a Teflon (registered trademark) tube having heat resistance lower than that of metal is used for the exhaust tube 10 connected to the exhaust tube 7. Can be used. By generating a negative pressure with the exhaust pump, the hot air in the space 11 passes through the exhaust tube 7 and the exhaust pipe 10 from the exhaust port 6 and is discharged to the outside.

  As shown in FIG. 5, the space 11 is open at the bottom, but the high-temperature air is filled from above the space 11, so the high-temperature air from below the space 11 until the space 11 is full. Is hard to leak. Furthermore, since the exhaust means is connected to the space 11 to discharge the high-temperature air to the outside, the leakage of the high-temperature air from the lower side of the space 11 can be further suppressed. Even if the high-temperature air slightly diffuses from below the substrate support member 4, since the distance to reach the conveyance roller 5 is larger than that directly diffused from the hot air heater, the influence of heat is small. .

  In the present embodiment, the lower portion of the space 11 is open, but the lower portion of the substrate support member 4 may be covered with a sealing member (not shown) except for the portion where the hot air heater is located. Thus, the space 11 is substantially sealed by the substrate 1, the substrate support member 4, the sealing member, and the hot air heater. Therefore, it is possible to more reliably prevent high-temperature air from diffusing from the space 11.

  FIG. 8 is a schematic cross-sectional view showing a configuration in which the air inside the space is exhausted through an exhaust pipe arranged so as to surround the hot air heater in the local heating device according to the present embodiment. As shown in FIG. 8, the exhaust cylinder 7 has an opening serving as an exhaust port 6 on the upper side, and has a closed portion on the lower side, and an exhaust pipe 10 is connected to the closed portion. Even with such a configuration, the air inside the space 11 can be exhausted.

  Further, the outer periphery of the exhaust tube 7 may be provided so as to approach the inner periphery of the substrate support member 4 to reduce the open area below the space 11. In the case of such a configuration, the space 11 can be a substantially closed space, and high-temperature air can be prevented from diffusing outside.

  The local heating apparatus according to the present embodiment can heat the substrate with high accuracy while maintaining the accuracy of the apparatus by preventing the influence of the heating of the heating unit from affecting the apparatus main body by the above configuration. In addition, the heating atmosphere in the space formed below the local position of the substrate can be adjusted by adjusting the non-contact heating means and the exhaust means, and the substrate can be stably heated. In this way, by heating, the coating solution or thermosetting member on the substrate can be efficiently and uniformly dried without applying excessive stress to the substrate.

Embodiment 2
FIG. 9 is a schematic cross-sectional view showing a local heating device according to Embodiment 2 of the present invention. As shown in FIG. 9, in the local heating device according to the present embodiment, the exhaust port 6 of the exhaust tube 7 is arranged directly below the substrate 1 in a state where it is supported by the substrate support member 4.

  The hot air jetted from the hot air heater which is the non-contact heating means 3 stays inside the space 11 after heating the substrate 1. The air inside the space 11 is discharged to the outside by an exhaust means connected to the inside of the space 11. The path until the hot air jetted from the hot air heater reaches the exhaust port 6 varies depending on the arrangement of the exhaust port 6.

  When the exhaust port 6 is formed at a position far away from the substrate 1, a large amount of air outside the space 11 flows into the exhaust cylinder 7, and the high temperature air in the space 11 may not be exhausted sufficiently. . As a result, high-temperature air that could not be exhausted may leak from the space 11 to the outside, and the apparatus main body may be affected by heat. When the exhaust port 6 is provided below the hot air heater outlet, the hot air path in the space 11 is formed so as to go directly from the hot air heater to the exhaust port 6 without passing through the substrate 1. The heating efficiency of 1 may be reduced.

  Therefore, in the local heating device according to the present embodiment, as shown in FIG. 9, the exhaust means is connected directly below the substrate 1 in a state of being supported by the substrate support member 4. In this way, the hot air jetted from the hot air heater reaches the lower surface of the substrate 1, diffuses along the lower surface of the substrate 1, and flows into the exhaust cylinder 7 from the exhaust port 6. Therefore, the amount of high-temperature air that leaks from the lower side of the space 11 to the outside can be reduced. In addition, since the air flow in which the hot air jetted from the hot air heater is guided to the lower surface of the substrate 1 can be generated in the space 11, the substrate 1 is reliably heated, and the heating efficiency of the substrate 1 is reduced. Can be prevented. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

Embodiment 3
In order to operate a hot air heater which is a non-contact heating means, it is necessary to supply power as power and gas as a heating medium to the heater heating element. Generally, nitrogen or dry air is used as a gas serving as a heating medium. The low temperature gas supplied to the gas supply port of the hot air heater is heated and heated by a heating element that generates heat to a high temperature, and is injected as hot air from the gas outlet. The temperature of the injected hot air is monitored by a thermocouple provided in the hot air heater, and the amount of power supplied to the heating element is adjusted so as to be a predetermined temperature.

  As shown in FIG. 5, when the substrate 1 is heated, if the hot air injection amount Q1 of the hot air heater is larger than the discharge amount Q2 by the exhaust means, the exhaust capacity is insufficient and high-temperature air leaks from below the space 11. I will put it out.

  Therefore, control is performed so that the discharge amount Q2 by the exhaust means is larger than the injection amount Q1 of the hot air from the hot air heater. By setting in this way, the air in the space 11 can be reliably discharged outside by the exhaust means. By doing in this way, it can prevent that parts other than the heating part of an apparatus are heated and deteriorate, maintain an apparatus precision, and can heat a board | substrate accurately. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

Embodiment 4
FIG. 10 is a schematic cross-sectional view showing a state where a substrate with a large warp is supported by a substrate support member and heated. When the substrate 1 is supported by the substrate support member 4 even when the substrate 1 is bent by its own weight or is slightly warped, the upper surface of the substrate support member 4 and the lower surface of the substrate 1 are in contact with each other over almost the entire surface. To do. However, when the substrate 1 in which a large warp or twist is generated is supported by the substrate support member 4, the upper surface of the substrate support member 4 and the lower surface of the substrate 1 may only partially contact due to the influence of the warp or twist. is there. If heating is performed in this state, high-temperature air leaks from the gap between the substrate 1 and the substrate support member 4, and heat influence is exerted on the apparatus main body such as the transport roller 5.

  FIG. 11 is a schematic cross-sectional view showing a local heating device according to Embodiment 4 of the present invention. As shown in FIG. 11, the local heating device according to the present embodiment includes a suction portion that the substrate support member 4 sucks and supports the lower surface of the substrate 1. The suction part is composed of at least one suction hole 12 formed on the upper surface of the substrate support member 4, a suction pipe 13 connected to the suction hole 12, a pump (not shown) connected to the suction pipe 13, and the like. Composed.

  With the upper surface of the substrate support member 4 in contact with the lower surface of the substrate 1, the substrate 1 is adsorbed to the adsorption holes 12 by evacuating the adsorption pipe 13 using a pump or the like. In this way, by adsorbing the substrate 1 to the substrate support member 4, the substrate 1 and the substrate support member 4 can be brought into close contact with each other without any gap. Therefore, high temperature air can be prevented from leaking from above the space 11.

  In order to release the adsorption of the substrate 1 after the heat treatment, the adsorption can be easily released by supplying compressed air or nitrogen to the adsorption pipe 13. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

Embodiment 5
FIG. 12 is a plan view showing the moving range of the heating unit of the local heating device. As described above, the substrate 1 can be transported in the X direction by the substrate transport means. The heating unit 2 can be conveyed in the Y direction by the first linear actuator. As shown in FIG. 12, normally, the heating unit 2 only needs to be able to move by a distance corresponding to the width of the substrate 1 in the Y direction.

  However, in the local heating device according to the present embodiment, a hot air heater is used as the non-contact heating means 3. The hot air heater takes time until the temperature of the hot air heater is raised so that the substrate 1 can be heated after being supplied with electric power. Therefore, if electric power is supplied to the hot air heater after the substrate 1 is put into the local heating device, the time until the temperature of the hot air heater rises becomes a standby time, and the processing time until the end of the heat treatment becomes longer.

  Therefore, in order to shorten the heat treatment time of the substrate 1, it is effective to always supply power to the hot air heater. The local heating device according to the fifth embodiment of the present invention heats the substrate 1 in a state where hot air is always jetted from a hot air heater.

  When the hot air heater constantly injects hot air in a state where the movement range of the heating unit 2 is limited to the width of the substrate 1, the hot air heater is positioned at the local position of the substrate 1 after the substrate 1 is put into the local heating device. The hot air heater stands by at a position away from the lower surface of the substrate 1 until it is positioned at the position. The hot air jetted during this standby rises from below the lower surface of the substrate 1 and diffuses along the lower surface of the substrate 1. Therefore, the part which is not the heating target on the board | substrate 1 will be heated.

  Similarly, when unloading the substrate 1 after the heat treatment from the local heating device, the portion that is not the heating target on the substrate 1 is heated. When the substrate 1 is unloaded from the local heating device in a heated state with a high temperature, there is a risk of adversely affecting the substrate transfer means for sending the substrate 1 to the next process or the substrate processing process itself of the next process. In addition, even when the substrate 1 is not put into the local heating device, there is a possibility that the accuracy of the device may be reduced due to the influence of the hot air on the device body such as the substrate transfer means.

  FIG. 13 is a schematic plan view showing a local heating device provided with a standby region for a heating unit according to Embodiment 5 of the present invention. As shown in FIG. 13, in the local heating device according to Embodiment 5 of the present invention, heating unit 2 is movable outside the range corresponding to the width of substrate 1 in the Y direction. Further, the local heating device is provided with a standby area 14 other than the area where the substrate transfer means is disposed. Except when heating the substrate 1, the heating unit 2 including the hot air heater which is the non-contact heating means 3 and the substrate support member 4 is configured to wait in the standby region 14.

  Since the standby region 14 is provided in a region other than the region where the substrate transport unit is disposed, the substrate transport unit such as the transport roller 5 and the roller shaft 8 is heated while the heating unit 2 is on standby in the standby region 14. There is no. While the substrate 1 is put into the local heating device and the non-contact heating means 3 is positioned at the local position of the substrate 1, a portion that is not a heating target on the substrate 1 is heated. Unnecessary heating of the substrate 1 can be reduced as compared with the case where the heating unit 2 is waiting below.

  FIG. 14 is a schematic plan view showing a state in which the substrate is in the unloading position after the heating process of the substrate is completed in the local heating device according to the present embodiment. As shown in FIG. 14, when carrying out the substrate 1 after the heat treatment from the local heating apparatus, the substrate support member 4 is moved below the substrate 1 by the second linear actuator, and then the first linear actuator. The heating unit 2 is moved to the standby area 14 by the eta. Then, the board | substrate 1 is conveyed to a board | substrate carrying-out position by a board | substrate conveyance means, and also is carried out out of a local heating apparatus.

  On the other hand, when the substrate 1 is loaded into the apparatus, an operation opposite to that performed when the substrate is unloaded is performed. Therefore, by adopting such a configuration of the local heating device, the substrate 1 is not unnecessarily heated from the loading to the unloading of the substrate, and the substrate transfer means for sending the substrate 1 to the next process, or the substrate processing in the next process. The risk of adversely affecting the process itself can be reduced. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

Embodiment 6
FIG. 15 is a schematic plan view showing a local heating device according to a sixth embodiment of the present invention in which a temperature calibration substrate is arranged in a standby area. FIG. 16 is a schematic cross-sectional view showing a state where the temperature calibration substrate is heated. In the sixth embodiment of the present invention, a standby region is provided in the local heating device as in the fifth embodiment. As shown in FIG. 15, the temperature calibration substrate 15 is disposed in this standby area.

  As shown in FIG. 16, the temperature calibration substrate 15 is formed of the same material and thickness as the product substrate 1, and a thermocouple 16 is embedded as a temperature measurement device. Further, the temperature calibration substrate 15 is held by a holding member (not shown) with a slight degree of freedom in each of the X, Y, and Z directions at substantially the same height as the substrate 1 on the transport roller 5.

  Hereinafter, a method of adjusting the non-contact heating means 3 using the temperature calibration substrate 15 will be described. After moving the heating unit 2 to the standby area, the hot air heater as the non-contact heating means 3 is positioned at a position where the thermocouple 16 of the temperature calibration substrate 15 is embedded. As the first height adjusting means, the substrate support member 4 is moved by the second linear actuator until it contacts the lower surface of the temperature calibration substrate 15. The contacted position is recognized as a zero point of coordinates in the control of the second linear actuator. Thereafter, the substrate support member 4 is moved by the second linear actuator so as to raise the height of the temperature calibration substrate 15 to a predetermined height.

  As the second height adjusting means, the temperature calibration substrate 15 is supported by the substrate support member 4 so that the outlet of the hot air heater is disposed at a predetermined distance from the lower surface of the temperature calibration substrate 15. The hot air heater is moved by the third linear actuator.

  Thus, when heating the temperature calibration substrate 15, the distance between the upper surface of the substrate support member 4 that contacts and supports the lower surface of the temperature calibration substrate 15 and the non-contact heating means 3 determines the substrate 1 that is the product. It is controlled to be the same distance as when heating. In this state, the temperature calibration substrate 15 is heated by the hot air heater. The temperature of the temperature calibration substrate 15 is measured by a thermocouple 16.

  This measured temperature is the substrate temperature when the heat treatment is performed under substantially the same conditions as the substrate 1 as the product. Therefore, the temperature measured using the temperature calibration substrate 15 can be regarded as the substrate temperature when the substrate 1 to be a product is heat-treated.

  Here, the heating set temperature of the substrate of the non-contact heating means 3 is Tc1, and the substrate temperature measured by the temperature calibration substrate 15 is Tc2. The heating set temperature Tc1 is a temperature suitable for drying a coating solution or a thermosetting member formed on the substrate 1. Therefore, the set temperature of the hot air heater is calibrated manually or automatically so that the actual substrate temperature Tc2 becomes the set temperature Tc1. By setting the hot air heater to the set temperature after the calibration and heating the substrate 1, the substrate temperature at the local position can be managed to the target temperature.

  In this way, by controlling the substrate temperature at the local heating position during heating to the target temperature, it is possible to improve the quality of the film formed by the coating liquid after heat treatment or the thermosetting member. Further, since the calibration of the set temperature of the hot air heater is performed during the standby time until the substrate 1 is put into the apparatus, the tact time of the heating and drying process of the substrate 1 is not different from that of the local heating apparatus of the fifth embodiment. . In this embodiment, a substrate in which the thermocouple 16 is embedded is used as the temperature calibration substrate 15, but the substrate temperature of the temperature calibration substrate 15 may be measured in a non-contact manner using a radiation thermometer. . Since other configurations are the same as those in the first and fifth embodiments, description thereof is omitted.

Embodiment 7
FIG. 17 is a schematic cross-sectional view showing a local heating device according to Embodiment 7 of the present invention. As shown in FIG. 17, the local heating device according to the seventh embodiment of the present invention includes a cooling device that cools the substrate 1 from the lower surface side.

  The substrate 1 heated by the hot air heater may rise to a temperature close to 300 ° C. The substrate 1 after the heat treatment is transported to the unloading position by the substrate transport means. The transport roller 5 that supports the substrate 1 is made of a resin material having low hardness so as not to damage the substrate 1. When the high-temperature substrate 1 after the heat treatment moves or stops on the transport roller 5, a thermal effect is exerted on the portion of the transport roller 5 that contacts the substrate 1. Due to this thermal influence, the transport roller 5 may be deformed or the transport roller 5 may be altered and the trajectory of the transport roller 5 may adhere to the substrate 1. In addition, when the substrate 1 is unloaded from the apparatus while being heated to a high temperature, there is a risk of adversely affecting the substrate transfer means for sending the substrate 1 to the next process or the substrate processing process itself of the next process.

  The thickness of the substrate 1 is about 0.7 mm and the heat capacity per unit area is small. However, when the substrate 1 is heated to a temperature close to 300 ° C., it takes a long time until the substrate temperature is lowered to 40 ° C. or less suitable for carrying out by natural cooling. Cost. Therefore, in order to shorten the tact time of the heat drying process of the substrate 1, it is necessary to cool the substrate 1 after the heat treatment in a short time.

  Therefore, in the local heating device according to the present embodiment, as shown in FIG. 17, a cooling device that cools the substrate 1 from the lower surface side is provided inside the space 11. The cooling device includes, for example, an air nozzle 17, a pipe connected to the air nozzle 17, and a compressor connected to the pipe. As the cooling gas, compressed air or nitrogen compressed by a compressor can be used. As shown in FIG. 17, a hot air heater may be arranged at the center of the space 11 and an air nozzle 17 may be arranged around the hot air heater.

  FIG. 18 is a schematic cross-sectional view showing a state in which the substrate is cooled by the cooling device in the local heating device according to the present embodiment. As shown in FIG. 18, when the heating of the substrate 1 is completed, the substrate support member 4 is disposed below the substrate 1 by the second linear actuator that is the first height adjusting means. Similarly, the non-contact heating unit 3 is disposed below the substrate 1 by a third linear actuator which is a second height adjusting unit.

  Thereafter, the cooling gas is injected from the tip of the air nozzle 17 to the local position of the heated substrate 1. The cooling gas that has reached the lower surface of the substrate 1 removes heat from the substrate 1 and rapidly cools the substrate 1. Since hot air is being injected from the hot air heater during cooling, the flow rate Q3 of the cooling gas is set to be considerably larger than the injection amount Q1 of the hot air heater. Since the air nozzle 17 is disposed separately below the substrate 1, the cooling gas injection pressure is set high. By setting in this way, the substrate 1 can be sufficiently cooled even when hot air is jetted from the hot air heater during cooling.

  By configuring the local heating apparatus according to the present embodiment in such a configuration, it is possible to increase the cooling rate of the substrate 1 after the heat treatment, and to shorten the time for discharging the substrate to the next process. Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

Embodiment 8
FIG. 19 is a schematic cross-sectional view showing a local heating device according to Embodiment 8 of the present invention. When the substrate 1 is cooled as in the seventh embodiment, it is desirable to keep the hot air heater away from the substrate 1 and the air nozzle 17 near the substrate 1 in order to further improve the cooling rate. By doing so, the cooling gas can be intensively injected onto the lower surface of the local position of the substrate 1 with less influence of the hot air injected from the hot air heater, and the substrate 1 can be cooled more efficiently. Can do.

  In order to realize the above effect, the local heating device according to the present embodiment is configured to be able to independently control the heights of the cooling device and the non-contact heating means 3. The non-contact heating means 3 includes a third linear actuator that is a second height adjusting means, and is movable in the Z direction.

  The cooling device may be connected to the first height adjusting means and moved in the Z direction together with the substrate support member 4 by the second linear actuator. Alternatively, the cooling device may be provided with third height adjusting means different from the first height means so that the air nozzle 17 can be moved in the Z direction. A fourth linear actuator may be used as the third height adjusting means.

  The fourth linear actuator is composed of a combination of linear guide means and driving means such as a linear motor or a stepping motor, and a commercially available linear actuator can be used. The fourth linear actuator is also configured on the first linear actuator like the second and third linear actuators, and the position of the cooling device can be controlled in the Y direction simultaneously with the heating unit 2. Yes.

  Hereafter, the operation | movement at the time of the heating and cooling of the board | substrate 1 in the local heating apparatus which concerns on this Embodiment is demonstrated. The case where the cooling device includes the third height adjusting means will be described. When the substrate 1 is put into the local heating device, the substrate 1 is transported by the substrate transport means and positioned in the X direction. Next, the heating unit 2 and the cooling device are positioned in the Y direction by the first linear actuator so that the hot air heater is positioned at a local position of the substrate 1.

  Thereafter, the substrate support member 4 is moved in the Z direction by the second linear actuator to support the substrate 1 at a predetermined height. With the substrate support member 4 supporting the substrate 1, the hot air heater is moved in the Z direction by the third linear actuator, and the outlet of the hot air heater is disposed at a predetermined distance from the lower surface of the substrate 1. The The air nozzle 17 is disposed around the hot air heater. At this time, the local heating device is in a state shown in FIG. 17, and the substrate 1 is heated in this state.

  When the heating of the substrate 1 is completed, the hot air heater is separated below the substrate 1 by the third linear actuator. Next, the air nozzle 17 is moved in the Z direction by the fourth linear actuator, and the ejection port of the air nozzle 17 is brought close to the lower surface of the local position of the substrate 1. Also at this time, the hot air in the space 11 is exhausted outside the apparatus by the exhaust means connected to the space 11 after the heating. Therefore, the influence of hot air injected from the hot air heater can be further reduced. In this state, as shown in FIG. 19, the cooling gas is injected from the air nozzle 17 onto the lower surface of the local position of the substrate 1 to cool the substrate 1.

  With such a configuration of the local heating device, the influence of hot air jetted from the hot air heater can be reduced, and the air nozzle 17 can be arranged at a position suitable for cooling to cool the substrate 1. Even when the cooling device does not include the third height adjusting means, the same effect can be obtained by disposing the air nozzle 17 at a predetermined distance from the upper surface of the substrate support member 4 in advance. As a result, the cooling efficiency of the substrate can be increased and the cooling time can be shortened, and the tact time of the substrate heating and drying process can be reduced. Since other configurations are the same as those in the first and seventh embodiments, description thereof is omitted.

  In the embodiment of the present invention, the case where hot air is constantly sprayed from the hot air heater has been described. However, the electric power supply of the hot air heater may be turned on / off each time the substrate is heated.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiment, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Heating part, 3 Non-contact heating means, 4 Substrate support member, 5 Conveyance roller, 6 Exhaust port, 7 Exhaust cylinder, 8 Roller shaft, 9 Pass line, 10 Exhaust pipe, 11 Space, 12 Adsorption hole, 13 Piping for adsorption, 14 standby area, 15 temperature calibration substrate, 16 thermocouple, 17 air nozzle.

Claims (10)

An apparatus for locally heating a substrate,
Transport means for transporting the substrate;
A substrate support member that surrounds the periphery of the side portion and has an upper and lower opening, and supports the substrate by contacting the entire lower surface of the upper opening end with the lower surface of the substrate;
The substrate support member is positioned inside the space while supporting the substrate, and hot air is sprayed to the lower surface side of the local position to be heated of the substrate to heat the local position in a non-contact state. Non-contact heating means;
Exhaust means connected to communicate with the space and exhausting air existing in the space;
First height adjusting means for adjusting the upper surface of the substrate support member that contacts the lower surface of the substrate to have a predetermined height;
A local heating apparatus comprising: a moving unit that positions the non-contact heating unit at the local position of the substrate.   The local heating apparatus according to claim 1, further comprising a second height adjusting unit that disposes the non-contact heating unit at a predetermined distance from an upper surface of the substrate support member.   The local heating device according to claim 1, wherein the exhaust unit is connected immediately below the substrate in a state of being supported by the substrate support member.   The local heating device according to claim 1, wherein the amount of air discharged from the exhaust unit is controlled to be larger than the amount of hot air jetted from the non-contact heating unit.   The local heating device according to claim 1, wherein the substrate support member further includes an adsorption unit that adsorbs to a lower surface of the substrate and supports the substrate.   The local heating apparatus according to claim 1, wherein the non-contact heating unit and the substrate support member are on standby in a standby region other than a region where the substrate transport unit is disposed except when the substrate is heated.   The local heating apparatus according to claim 6, wherein a substrate heating temperature by the non-contact heating means is adjusted using a temperature calibration substrate including a temperature measuring device in the standby region.   The local heating device according to claim 7, wherein the temperature calibration substrate is a substrate including a thermocouple as the temperature measuring device.   The local heating apparatus of Claim 1 provided with the cooling device which cools the said board | substrate from the lower surface side.   The local heating device according to claim 9, wherein the distance between the non-contact heating unit and the cooling device with respect to the lower surface of the substrate can be controlled independently.

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