JP2010078652A - Local heating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a local heating apparatus reduced in manufacturing cost, and reduced in energy loss during heating, and uniformly drying an application liquid or a thermosetting member. <P>SOLUTION: The local heating apparatus is provided with: a conveyance means for conveying a substrate 13: a non-contact heating means 1 for heating the substrate in a non-contact state therewith; a height adjusting means 3 for lifting up the substrate 13 and setting it to a reference height by a supporting member 2 supporting the substrate 13 by coming in contact with the substrate 13 at a plurality of points from the undersurface side of the local position which is a heating object of the substrate 13; and a moving means for positioning the non-contact heating means 1 and the height adjusting means 3 in the local position of the substrate 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a local heating apparatus that forms a film by heating and drying a coating solution or a thermosetting member locally formed on a substrate.

  A technique for forming a thin film by applying a liquid or thermosetting member on a substrate and drying it has been used in many production apparatuses. Among them, a patterning technique that has been attracting attention in recent years is a patterning technique in which a required amount of liquid is applied to an arbitrary portion on a substrate and dried to form a film. Such a technique includes a technique using a dispenser or an inkjet. These techniques are attracting attention as technologies that can be used in a vacuum removal process in place of a pattern generation method using a vacuum process by conventional photolithography.

  For example, as a production apparatus using an inkjet patterning technique, there is an apparatus for forming a color filter (CF) panel. In this apparatus, ink of each color of red (R), green (G), and blue (B) is landed in the RGB pixel area formed on the glass substrate. Then, a color filter (CF) is formed by filling each pixel. Here, the ink applied in the pixel region is dried to form a film by heating the entire substrate by an oven or the like.

  Such a patterning technique is widely used not only as a full-surface printing technique but also as a technique for repairing a defective portion such as color mixture, contamination, or adhesion. For example, in a CF panel, in the case of a defective pixel in which color mixing of ink occurs or a defective pixel in which impurities are mixed, the ink layer film in the defective area is removed, ink is applied again to the removed portion, and heat drying is performed. There is a technique for re-forming pixels.

As a method for heating and drying a coating solution on a substrate, a method of heating and drying the entire substrate with an oven or a hot plate has been conventionally used. When heating the entire substrate, a dedicated large heating device or a transfer robot with excellent heat resistance is required. Further, in order to advance the heated substrate to the next process, a place and time for cooling are required, and there is a problem that the manufacturing cost increases and the tact time becomes long. In particular, when there are few heat-drying places, locally heating and drying can reduce manufacturing cost and manufacturing time. Furthermore, since the amount of CO ₂ emission can be reduced, there is high expectation for a technique for locally heating and drying from the environmental viewpoint.

As a technique for drying by heating locally, a method of drying a heating element used in a hot plate or the like in proximity to the substrate can be considered. In addition, Patent Document 1 or Patent Document 2 is a prior document that discloses a method of heating a substrate using a laser, an infrared lamp (infrared heater), or the like. Further, as a method for heating a substrate, there is Patent Document 3 as a prior art document that discloses a method for heating from both the upper and lower surfaces of a substrate with a heater or the like in order to dissolve solder on the substrate. Furthermore, when heating a substrate using thermal radiation, a patent document is disclosed as a prior art document that discloses a method for supporting a substrate outer peripheral portion with a lift pin from the lower surface side to make the thermal history of the substrate uniform in the surface. There are four.
JP 2004-95356 A JP 2004-165140 A JP 2005-223000 A JP 2001-267217 A

  In the heating methods described in Patent Documents 1 to 3, even when the object to be heated is a narrow range of a part on the substrate, the stage that supports the substrate mounted during heating supports the entire substrate. It needs to be as large as the substrate or larger. Therefore, when the substrate is enlarged, there is a problem that the heating apparatus is enlarged and the apparatus cost is increased. In addition, since the contact area between the substrate and the stage that supports the substrate is large, heat during heating is lost to the stage side due to heat conduction, and a large energy loss occurs, and temperature uniformity in the heating range on the substrate is impaired. There was also a problem of being. The heating method described in Patent Document 4 can reduce energy loss because the contact area between the substrate and the pins supporting the substrate is small. However, since the outer periphery of the substrate is supported by pins, in the case of a large substrate, the substrate bends due to its own weight, and the heat history cannot be made uniform between the central portion and the outer periphery of the substrate. There was a problem that heat treatment could not be realized.

  The present invention has been made in view of the above problems, and can reduce the manufacturing cost, reduce energy loss during heating, and can uniformly dry the coating liquid or the thermosetting member. An object is to provide a local heating device.

  The local heating device according to the present invention is a device for locally heating a substrate, and is a heating unit that transports the substrate, a non-contact heating unit that heats the substrate in a non-contact state, and a heating target of the substrate. From a lower surface side of the local position, a height adjusting means that lifts the substrate to a reference height by a support member that contacts the substrate and supports the substrate at a plurality of points, and a non-contact heating means and a height adjusting means are provided. Moving means for positioning at a local position of the substrate.

  According to the present invention, the substrate is supported only at the periphery of the local heating position and is heated and dried, so that the manufacturing cost can be reduced by downsizing the heating device. Furthermore, by providing a height adjusting means having a support member that supports the substrate with a small contact area, the gap between the substrate and the non-contact heating means can be stabilized and heated. As a result, it is possible to provide a local heating device capable of reducing energy loss during heating and uniformly drying the coating liquid or the thermosetting member.

  Hereinafter, a local heating device according to an embodiment of the present invention based on the present invention will be described with reference to the drawings.

Embodiment 1
FIG. 1 is a perspective view showing the structure of a local heating device according to Embodiment 1 of the present invention. In the local heating device according to the first embodiment of the present invention, as shown in FIG. 1, transport rollers 9 for transporting the substrate are provided at predetermined intervals in the axial direction of the roller shaft 10. The roller shafts 10 are arranged at a predetermined interval in the substrate conveyance direction between the roller shaft support members 11 arranged in two rows in parallel in the substrate conveyance direction. On both outer sides of the two roller shaft support members 11, two slide device support members 12 are arranged in parallel in the direction perpendicular to the substrate transport direction. An upper surface side slide device 8 is bridged over the slide device support member 12. A mover 7 that is movable in the longitudinal direction of the upper surface side slide device 8 is provided on a side surface of the upper surface side slide device 8. Non-contact heating means 1 for heating the substrate in a non-contact state is connected to the front surface of the mover 7. A lower surface side slide device 6 is bridged under the slide device support member 12. A movable element 5 that is movable in the longitudinal direction of the lower surface side slide device 6 is provided on a side surface of the lower surface side slide device 6. A height adjusting means 3 for lifting the substrate and setting it to a reference height is connected to the front surface of the mover 5 via the lifting device 4. The height adjusting means 3 is formed with a plurality of support members 2 for supporting the substrate from the lower surface side.

  The substrate is transported by transmitting a driving force of a motor drive (not shown) to the roller shaft 10 via a belt or a gear and rotating the transport roller 9 on which the substrate is placed. As another substrate transport method, for example, the edge portion of the substrate not coated with ink is directly clamped, or a part of the substrate holder surrounding the substrate is clamped and slid in parallel with the transport direction. You may use the method of conveying a board | substrate with a slide axis | shaft.

  FIG. 2 is a cross-sectional view of the non-contact heating means of the local heating device according to the present embodiment as viewed from the side. After the substrate 13 is transported to a predetermined position, the height adjusting means 3 is formed with a coating solution or a thermosetting member on the substrate 13 by moving the mover 5 of the lower surface side slide device 6. Positioned just below the local position. Note that the coating liquid or thermosetting member on the substrate 13 is formed before the substrate 13 is put into the local heating device. For example, the coating liquid is an organic EL material ink, and the thermosetting member is a thermosetting polyimide ink. Information such as the area where the coating solution or thermosetting member is formed and the coordinates of the center position will be described as being known. The height adjusting means 3 has a structure capable of moving up and down by being connected to a lifting device 4 that adjusts the height by combining a motor drive and a ball screw. When the lifting device 4 is operated, the substrate 13 is lifted to the reference height by the positioned height adjusting means 3. The reference height is a reference height when the deflection due to the weight of the substrate 13 is corrected by supporting the substrate 13 from the lower surface. The support member 2 of the height adjusting means 3 in contact with the substrate 13 from the lower surface side has, for example, a plurality of rod-shaped portions that come into contact with the substrate 13 at a plurality of points in plan view so as to reduce the contact area. Formed from.

  With the substrate 13 set at the reference height, the mover 7 of the upper surface side slide device 8 moves, so that the non-contact heating means 1 is formed with a coating solution or a thermosetting member on the substrate 13. It is positioned almost directly above the local position. When the non-contact heating means 1 directly touches the surface side of the substrate 13, problems such as mechanical damage and stress, adhesion residue and transfer are likely to occur on the substrate 13 itself and the thin film formed on the surface of the substrate 13. It is not preferable. Therefore, the non-contact heating means 1 is preferably a hot air heater, a lamp heater, a laser, or the like that can be heated in a non-contact manner and has good heating efficiency. Among these, a hot air heater is particularly preferable because it is relatively easy to handle and can reduce running costs including replacement of consumables. Moreover, you may use what combined 2 or more selected from a hot-air heater, a lamp heater, and a laser. In the following embodiments, a case where a hot air heater is used as the non-contact heating means 1 will be described.

  After the non-contact heating unit 1 is positioned at a predetermined position, electric power from a power source (not shown) or gas as a heat transport medium is supplied from the heat source to the non-contact heating unit 1 to locally heat the substrate 13. . After the heating and drying of the substrate 13 is completed, the substrate 13 is lowered together with the height adjusting means 3 by the elevating device 4 and placed on the transport roller 9. Thereafter, the substrate 13 is transported by the transport roller 9, and at another location on the same substrate or after the processed substrate is discharged, a new substrate is carried in and the next heat treatment is performed.

  3A and 3B are schematic diagrams for explaining the positional relationship among the conveying roller, the non-contact heating unit, and the substrate in the local heating device, where FIG. 3A is a perspective view and FIG. 3B is a side view. When the height adjusting means 3 is not provided in the local heating device, the substrate 14 is supported in contact with the apex 9 a of the transport roller 9. The non-contact heating means 1 is disposed in the middle between the adjacent roller shafts 10. The distance between the substrate 14 and the non-contact heating means 1 is set to be a predetermined gap d. The gap d is determined by the thickness of the substrate 13, the type of coating liquid or thermosetting member formed on the substrate 13, the type of non-contact heating means 1, and the like. For example, when the non-contact heating means 1 is a general hot air heater, if the gap d is too small, the temperature gradient becomes steep in the heating range of the substrate 14 and uniform heating cannot be performed. If the gap d is too large, the temperature of the substrate 14 cannot be raised and the heating becomes insufficient. When the gap d is not constant around the local heating position on the substrate 14, the substrate temperature varies, and the quality of the formed film is degraded. The main causes of the gap d are the processing error of each component, the deflection due to the weight of the substrate 14, the deflection due to the weight of the roller shaft 10, the height deviation between the roller shafts 10, the eccentricity of the transport roller 9, etc. As mentioned. The gap d can be confirmed by measuring the positions of the substrate 14 and the non-contact heating means 1 using a laser displacement meter or the like.

  FIG. 4 is a schematic diagram for explaining the positional relationship between a transport roller, a heating unit, and a substrate in a local heating apparatus that does not have a height adjusting unit when heating the central portion of the substrate, (A) is a perspective view, (B) is a side view. As shown in FIG. 4, when the substrate 14 is bent and warped, the gap d between the non-contact heating means 1 and the substrate 14 varies. The position of the straight substrate 13 with no deflection is indicated by a two-dot chain line. FIG. 5 is a schematic diagram for explaining the positional relationship between the conveying roller, the heating unit, and the substrate in the local heating device that does not have the height adjusting unit when heating the substrate end, (A) is a perspective view, (B) is a side view. As shown in FIG. 5, when the substrate end 13 a is heated, if the substrate 13 is supported only by the transport roller 9, deflection occurs due to the weight of the substrate 13, and the gap between the substrate end 13 a and the non-contact heating unit 1. d increases. This deflection of the substrate 13 occurs not only in the substrate conveyance direction shown in FIG. 5B but also in the width direction of the substrate 13. Therefore, the gap d with the non-contact heating means 1 is more likely to vary at the four corners 13 b of the substrate 13.

  FIG. 6 is a schematic view showing height adjusting means in the local heating device according to the present embodiment. As shown in FIG. 6, the rod-shaped support member 2 that supports the substrate 13 has a curved front end portion 2 a that contacts the substrate 13, and the top surface of each front end portion 2 a faces the non-contact heating unit 1. Set to be on top. The gap d between the non-contact heating means 1 and the substrate 13 is always kept constant by allowing the substrate 13 to be lifted above the conveying roller 9 by the support member 2 from the lower surface side of the substrate 13. The In addition, by reducing the contact area with the substrate by making the tip portion 2a a curved surface, energy loss due to heat radiation from the substrate 13 to the support member 2 and occurrence of temperature unevenness in the heating range on the substrate 13 are reduced. If the substrate 13 and the tip portion 2a are in contact with each other in a range where the local heating position does not have a thermal effect, the temperature distribution on the substrate 13 in the heating range is more uniformly maintained.

  7 and 8 are schematic views showing examples of arrangement of support members in the local heating device according to the present embodiment. The axis passing through the local heating position on the substrate in the direction perpendicular to the surface facing the substrate is defined as the central axis O, and the plane passing through the central axis O and parallel to the substrate transport direction is the plane A, and the substrate transport direction passes through the central axis O. A plane perpendicular to the plane is defined as plane B. As shown in FIG. 7, the support members 2 are arranged in three regions divided by the surface A and the surface B, respectively, and symmetrically with respect to the surfaces A and B. FIG. 8 shows another example of the arrangement of the support members 2. The support members 2 are arranged in four areas divided by the plane A and the plane B, respectively, and symmetrically with respect to the plane A and the plane B, respectively. Has been. By disposing the support member 2 in this manner, the support member 2 supports the substrate with a surface composed of three or more points in any of the four regions divided by the surfaces A and B. The substrate can be stably held.

  FIG. 9 is a schematic view showing the arrangement of the height adjusting means when the heating position is the central portion of the substrate in the local heating device according to the present embodiment, and (A) shows the deflection state of the substrate. (B) is a top view. FIG. 10 is a schematic view showing the arrangement of the height adjusting means when the heating position is the end of the substrate in the local heating device according to the present embodiment, and (A) shows the deflection state of the substrate. (B) is a top view. FIG. 11 is a schematic view showing the arrangement of the height adjusting means when the heating position is at the four corners of the substrate in the local heating apparatus according to the present embodiment, and (A) shows the deflection state of the substrate. (B) is a top view. As shown in FIG. 9, when the heating position is at the center portion of the substrate 13, the entire support member 2 provided can come into contact with the substrate 13 to adjust the height. As shown in FIG. 10, when the heating position is at the end of the substrate 13, half of the provided support member 2 comes into contact with the substrate 13 to adjust the height. As shown in FIG. 11, when the heating position is at the four corners of the substrate 13, a quarter of the provided support member 2 comes into contact with the substrate 13 to adjust the height.

  FIG. 12 is a graph showing a change in the height of the substrate on the A axis parallel to the substrate transport direction when the heating position is at the center of the substrate as shown in FIG. The vertical axis shows the deviation from the reference height of the substrate 13, and the horizontal axis shows the distance from the contact position between the transport roller 9 and the substrate 13 located closest to the heating position. The height of the substrate 13 when the substrate 13 is lifted by the height adjusting means 3 is indicated by a solid line, and the height of the substrate 13 before the substrate 13 is lifted by the height adjusting means 3 is indicated by a broken line. Since the conveying rollers are provided at intervals of 200 mm, the height of the substrate 13 before being lifted by the height adjusting means 3 is 0 mm and 200 mm from the position of the conveying roller 9 where the substrate 13 and the conveying roller 9 are supported in contact with each other. It is the highest at the point. On the other hand, the height of the substrate 13 is lowered due to the deflection of the substrate 13 in the range of local heating. Even at the position on the conveyance roller 9 where the substrate 13 is supported, the height of the substrate 13 is deviated from the reference height due to the eccentricity of the conveyance roller 9 or the alignment accuracy of the roller shaft 10. Yes. As described above, when the height of the substrate 13 at the local heating position varies, the distance between the non-contact heating unit 1 and the substrate 13 also varies. As a result, the temperature distribution in the region of local heating on the substrate 13 varies, and the quality of the film formed after drying is not stable.

  As shown in FIG. 12, by lifting the substrate 13 by the height adjusting means 3, the height of the substrate 13 in the vicinity of the region to be locally heated can be corrected to the reference height. When the support member 2 of the height adjusting means 3 is disposed immediately below the local heating position on the substrate 13, the heat distribution from the substrate 13 to the support member 2 causes variations in the temperature distribution in the local heating range. End up. Therefore, the support member 2 of the height adjusting means 3 is provided in the periphery immediately below the local heating position on the substrate 13 in order to make it difficult for the local heating position to be affected by heat. As a result, at the position where the substrate 13 and the support member 2 are in contact with each other, the height of the substrate 13 is corrected to the reference height, and the height of the substrate 13 at the local heating position is slightly decreased due to deflection due to the weight of the substrate 13. Is recognized. However, in this case, the variation in the height of the substrate 13 is slight, and the heating temperature at the local heating position is not affected. Therefore, by raising the substrate 13 by the height adjusting means 3 and setting it to the reference height, the height of the substrate 13 in the region to be locally heated can be accurately maintained, so that it is formed on the substrate 13 after drying. The film quality can be stabilized.

  FIG. 13 is a graph showing a change in the height of the substrate on the B axis parallel to the substrate transport direction when the heating position is the end of the substrate as shown in FIG. The vertical axis shows the deviation from the reference height of the substrate 13, and the horizontal axis shows the distance from the contact position between the transport roller 9 and the substrate 13 located closest to the heating position. The height of the substrate 13 when the substrate 13 is lifted by the height adjusting means 3 is indicated by a solid line, and the height of the substrate 13 before the substrate 13 is lifted by the height adjusting means 3 is indicated by a broken line. As shown in FIG. 13, the height of the substrate 13 before being lifted by the height adjusting means 3 is highest at a point of 0 mm from the position of the conveyance roller 9 where the substrate 13 and the conveyance roller 9 are supported in contact with each other. ing. On the other hand, in the region where local heating is performed, the height of the substrate 13 is lowered due to deflection due to the weight of the substrate 13, but the substrate 13 is in a cantilever state because the local heating position is the end of the substrate 13. The deviation from the height is large. Also in this case, the substrate 13 is lifted by the height adjusting means 3 so that the height of the substrate 13 in the region to be locally heated can be accurately maintained. Therefore, the quality of the film formed on the substrate 13 after drying is improved. Can be stabilized.

  FIG. 14 is a graph showing changes in the height of the substrate on the C-axis parallel to the substrate transport direction when the heating position is at the four corners of the substrate as shown in FIG. The vertical axis shows the deviation from the reference height of the substrate 13, and the horizontal axis shows the distance from the contact position between the transport roller 9 and the substrate 13 located closest to the heating position. The height of the substrate 13 when the substrate 13 is lifted by the height adjusting means 3 is indicated by a solid line, and the height of the substrate 13 before the substrate 13 is lifted by the height adjusting means 3 is indicated by a broken line. As shown in FIG. 14, the height of the substrate 13 before being lifted by the height adjusting means 3 is highest at a point of 0 mm from the position of the transport roller 9 where the substrate 13 and the transport roller 9 are supported in contact with each other. ing. On the other hand, in the range of local heating, the height of the substrate 13 is lowered due to the deflection due to its own weight. However, since the local heating positions are the four corners of the substrate 13, the substrate 13 is most easily deflected from the reference height. The deviation is large. Also in this case, the substrate 13 is lifted by the height adjusting means 3 so that the height of the substrate 13 in the region to be locally heated can be accurately maintained. Therefore, the quality of the film formed on the substrate 13 after drying is improved. Can be stabilized.

  FIG. 15 is a schematic view showing an example of the arrangement position of the support member of the height adjusting means according to the present embodiment. As shown in FIG. 15, an axis passing through the local heating position of the substrate 13 in a direction perpendicular to the surface facing the substrate 13 is defined as a central axis O, and a surface parallel to the substrate transport direction through the central axis O is a surface A. A surface passing through the central axis O and perpendicular to the substrate transport direction is defined as a surface B. Three or more support members 2 are arranged in four areas separated by the plane A and the plane B orthogonal to each other. The distance R between the support member 2 farthest from the central axis O and the central axis O is appropriately determined from parameters such as the arrangement, spacing, and quantity of the support members 2. Moreover, all the supporting members 2 arranged in each area may not be equally spaced. 16 to 19 are schematic views showing other arrangement positions of the support members of the height adjusting means according to the present embodiment. As shown in FIG. 16, four support members 2 may be arranged in each area. As shown in FIG. 17, you may arrange | position so that the supporting member 2 may become equal intervals in each area. However, as shown in FIGS. 18 and 19, when the support members 2 are arranged in a straight line in each area, when the local heating positions are at the four corners of the substrate 13, the straight lines existing in one area The substrate 13 is supported only by the support members 2 arranged on the line. In this case, since the support of the substrate 13 is not stable, variations in the height of the substrate 13 are likely to occur, which is not preferable.

  As a material used for the front-end | tip part which contacts the board | substrate 13 of the supporting member 2 of the height adjustment means 3, the following materials with low heat conductivity are preferable, for example. Inorganic materials such as glass or ceramics. Heat resistant resin such as polyimide resin, PTFE (polytetrafluoroethylene) or phenol resin. Metal materials such as stainless steel or nickel alloy that have relatively low thermal conductivity among metals. You may comprise the front-end | tip part of the supporting member 2 from the material which combined 1 or 2 or more chosen from these materials. By configuring the tip of the support member 2 with a material having low thermal conductivity, the heat transmitted from the substrate 13 to the support member 2 can be reduced, and variations in temperature distribution in the heating range on the substrate 13 are reduced. be able to. For the same reason, the shape of the tip portion of the support member 2 is preferably such that the contact area with the substrate 13 is small. The shape of the support member 2 may be, for example, a spherical shape or a curved surface having a curvature similar to that of the conveying roller 9.

  FIG. 20 is a schematic view showing an example of the tip of the support member provided in the height adjusting means according to the present embodiment, in which (A) shows a state where the substrate and the support member are in contact with each other, (B) Is a state when the substrate is lifted by the support member, and (C) is a state when the substrate and the support member are lowered. As shown in FIG. 20, a spherical portion 2 b may be provided at the distal end portion of the support member 2 of the height adjusting means 3. In such a configuration, when the substrate 13 is lifted by the height adjusting means 3, the substrate 13 and the support member 2 are in rolling contact. As shown in FIGS. 20B and 20C, since the spherical portion 2b can freely rotate, the contact point between the spherical portion 2b and the substrate 13 moves in conjunction with each other while contacting. Therefore, unlike the sliding contact when the spherical portion 2b is not provided, it is possible to prevent the lower surface side of the substrate 13 from being damaged.

  FIG. 21 is a schematic view showing another example of the tip portion of the support member provided in the height adjusting means according to the present embodiment. As shown in FIG. 21, a flow path 3 a is provided inside the height adjusting means 3, and a flow path 2 c is provided inside the support member 2. With such a configuration, the inside of the flow paths 3a and 2c can be decompressed by an exhaust pump or the like (not shown), and the substrate 13 can be adsorbed from the opening of the distal end portion 2a of the support member 2. As a result, the substrate 13 can be reliably supported by the support member 2 of the height adjusting means 3, and the height of the substrate 13 can be set stably.

  According to the present embodiment, it is possible to accurately and efficiently correct the height position of the substrate 13 in the range of local heating. This correction is not only due to the weight of the substrate 13, but also due to factors such as processing errors of each component, deflection due to the weight of the roller shaft 10, misalignment between the roller shafts 10, and eccentricity of the transport roller 9. It is also effective in reducing variations in the height of the substrate 13.

Embodiment 2
FIG. 22 is a cross-sectional view of the non-contact heating unit of the local heating device according to the second embodiment of the present invention as viewed from the side. As shown in FIG. 22, the local heating device according to Embodiment 2 of the present invention includes another non-contact heating unit 15 that heats the local heating position on the substrate 13 from the lower surface side when the substrate 13 is heated. The height adjusting means 3 is provided. With such a configuration, the substrate 13 can be heated from both the upper and lower surfaces of the substrate 13 during heat drying. Therefore, the temperature of the substrate 13 at the local heating position can be raised at an early stage, and the drying time can be shortened. It is not preferable that the non-contact heating means 15 directly touches the lower surface side of the substrate 13 because mechanical damage or stress is given to the substrate 13 itself. The non-contact heating means 15 is preferably a hot air heater, a lamp heater, a laser, or the like that can be heated in a non-contact manner and has good heating efficiency. Among these, a hot air heater is particularly preferable because it is relatively easy to handle and can reduce running costs including replacement of consumables. Further, a combination of two or more selected from a hot air heater, a lamp heater, and a laser may be used. Since other configurations are the same as those of the first embodiment, the description thereof is omitted.

Embodiment 3
FIG. 23 is a cross-sectional view of the non-contact heating unit of the local heating device according to the third embodiment of the present invention as viewed from the side. In the local heating device according to Embodiment 3 of the present invention, as shown in FIG. 23, the height adjusting means 3 is provided with non-contact heating means 15 for heating the local heating position on the substrate 13 from the lower surface side. . Since no heating means is provided on the upper surface side of the substrate 13, it is possible to reduce the size of the local heating device and reduce the device cost. Since other configurations are the same as those in the first and second embodiments, the description thereof is omitted.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiment, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

It is a perspective view which shows the structure of the local heating apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which looked at the non-contact heating means of the local heating apparatus which concerns on the same embodiment from the side. It is the schematic explaining the positional relationship of the conveyance roller in a local heating apparatus, a non-contact heating means, and a board | substrate. It is the schematic explaining the positional relationship of the conveyance roller in the local heating apparatus which does not have a height adjustment means at the time of heating a board | substrate center part, a heating means, and a board | substrate, (A) is a perspective view, (B) It is a side view. It is the schematic explaining the positional relationship of the conveyance roller in the local heating apparatus which does not have a height adjustment means at the time of heating a board | substrate edge part, a heating means, and a board | substrate, (A) is a perspective view, (B) is It is a side view. It is the schematic which showed the height adjustment means in the local heating apparatus which concerns on the same embodiment. It is the schematic which showed the example of arrangement | positioning of the supporting member of the height adjustment means in the local heating apparatus which concerns on the same embodiment. It is the schematic which showed the example of arrangement | positioning of the supporting member of the height adjustment means in the local heating apparatus which concerns on the same embodiment. About the local heating device according to the embodiment, is a schematic diagram showing the arrangement of the height adjusting means when the heating position is the central portion of the substrate, (A) is a perspective view showing the deflection state of the substrate, (B) is a top view. About the local heating device according to the embodiment, is a schematic diagram showing the arrangement of the height adjusting means when the heating position is the end of the substrate, (A) is a perspective view showing the deflection state of the substrate, (B) is a top view. About the local heating device according to the embodiment, it is a schematic diagram showing the arrangement of the height adjusting means when the heating position is the four corners of the substrate, (A) is a perspective view showing the deflection state of the substrate, (B) is a top view. FIG. 10 is a graph showing changes in the height of the substrate on the A axis parallel to the substrate transport direction when the heating position is at the center of the substrate as shown in FIG. 9. FIG. 11 is a graph showing a change in the height of the substrate on the B axis parallel to the substrate transport direction when the heating position is an end portion of the substrate as shown in FIG. 10. 12 is a graph showing changes in the height of the substrate on the C axis parallel to the substrate transport direction when the heating position is at the four corners of the substrate as shown in FIG. It is the schematic which showed an example of the arrangement position of the supporting member of the height adjustment means based on the embodiment. It is the schematic which showed another arrangement position of the supporting member of the height adjustment means based on the embodiment. It is the schematic which showed another arrangement position of the supporting member of the height adjustment means based on the embodiment. It is the schematic which showed another arrangement position of the supporting member of the height adjustment means based on the embodiment. It is the schematic which showed another arrangement position of the supporting member of the height adjustment means based on the embodiment. It is the schematic which showed an example of the front-end | tip part of the supporting member provided in the height adjustment means based on the embodiment, (A) is the state which the board | substrate and the supporting member contacted, (B) is a board | substrate supporting The state when being lifted by the member, (C) is the state when the substrate and the supporting member are lowered. It is the schematic which showed another example of the front-end | tip part of the supporting member provided in the height adjustment means based on the embodiment. It is sectional drawing which looked at the non-contact heating means of the local heating apparatus which concerns on Embodiment 2 of this invention from the side surface. It is sectional drawing which looked at the non-contact heating means of the local heating apparatus which concerns on Embodiment 3 of this invention from the side surface.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Non-contact heating means, 2 support member, 2a tip part, 2b spherical part, 2c flow path, 3 adjustment means, 3a flow path, 4 raising / lowering apparatus, 5, 7 mover, 6 lower surface side slide apparatus, 8 upper surface side slide Device, 9 Conveying roller, 9a vertex, 10 Roller shaft, 11 Roller shaft support member, 12 Slide device support member, 13, 14 Substrate, 13a Substrate end, 13b Four corners, 15 Non-contact heating means.

Claims (9)

An apparatus for locally heating a substrate,
Transport means for transporting the substrate;
Non-contact heating means for heating the substrate in a non-contact state;
From the lower surface side of the local position to be heated of the substrate, a height adjusting means that lifts the substrate and sets it to a reference height by a support member that contacts the substrate and supports the substrate at a plurality of points;
Moving means for positioning the non-contact heating means and the height adjusting means at the local position of the substrate;
A local heating device. An axis passing through the local position of the substrate in a direction perpendicular to the surface facing the substrate is a central axis O, and a surface passing through the central axis O and parallel to the substrate transport direction is a surface A, and the substrate is transported through the central axis O. If the plane perpendicular to the direction is plane B,
2. The local heating device according to claim 1, wherein three or more of the supporting members are arranged in four regions divided by the surface A and the surface B and symmetrically with respect to the surfaces A and B, respectively.   The local heating device according to claim 1 or 2, wherein the non-contact heating means is one or a combination of two or more selected from a hot air heater, a lamp heater, and a laser.   The local heating device according to any one of claims 1 to 3, wherein the non-contact heating means is provided on one or both of the upper side and the lower side of the substrate.   The local heating device according to claim 1, wherein a tip portion of the support member that contacts the substrate has a curved surface.   The local heating device according to any one of claims 1 to 5, wherein a tip portion of the support member has a curvature that is substantially equal to a conveyance roller provided in the conveyance unit.   The local heating device according to claim 1, wherein an opening is provided at a tip of the support member, and a negative pressure is generated in the opening to adsorb the substrate.   The local heating device according to claim 1, wherein a spherical portion is formed at a distal end portion of the support member, and the spherical portion can freely rotate.   The local heating device according to any one of claims 1 to 8, wherein the non-contact heating unit and the height adjusting unit are movable in at least one axial direction.

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