JP2010147187A5 - - Google Patents

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Publication number
JP2010147187A5
JP2010147187A5 JP2008321463A JP2008321463A JP2010147187A5 JP 2010147187 A5 JP2010147187 A5 JP 2010147187A5 JP 2008321463 A JP2008321463 A JP 2008321463A JP 2008321463 A JP2008321463 A JP 2008321463A JP 2010147187 A5 JP2010147187 A5 JP 2010147187A5
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JP
Japan
Prior art keywords
relay substrate
semiconductor element
frame
wiring pattern
coaxial connector
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Application number
JP2008321463A
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English (en)
Japanese (ja)
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JP2010147187A (ja
JP5225825B2 (ja
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Priority to JP2008321463A priority Critical patent/JP5225825B2/ja
Priority claimed from JP2008321463A external-priority patent/JP5225825B2/ja
Publication of JP2010147187A publication Critical patent/JP2010147187A/ja
Publication of JP2010147187A5 publication Critical patent/JP2010147187A5/ja
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Publication of JP5225825B2 publication Critical patent/JP5225825B2/ja
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JP2008321463A 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法 Active JP5225825B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008321463A JP5225825B2 (ja) 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008321463A JP5225825B2 (ja) 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010147187A JP2010147187A (ja) 2010-07-01
JP2010147187A5 true JP2010147187A5 (enrdf_load_stackoverflow) 2011-12-01
JP5225825B2 JP5225825B2 (ja) 2013-07-03

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ID=42567310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008321463A Active JP5225825B2 (ja) 2008-12-17 2008-12-17 半導体素子収納用パッケージの製造方法及び半導体装置の製造方法

Country Status (1)

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JP (1) JP5225825B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094838B2 (ja) 1995-04-17 2000-10-03 住友金属工業株式会社 熱間仕上げ圧延における速度制御方法
JP2012011393A (ja) 2010-06-29 2012-01-19 Kobe Steel Ltd せん断用金型及びその製造方法
JP6166101B2 (ja) * 2013-05-29 2017-07-19 京セラ株式会社 光半導体素子収納用パッケージおよびこれを備えた実装構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3752473B2 (ja) * 2002-06-19 2006-03-08 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2006128323A (ja) * 2004-10-27 2006-05-18 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

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