JP2010147051A5 - - Google Patents
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- Publication number
- JP2010147051A5 JP2010147051A5 JP2008319355A JP2008319355A JP2010147051A5 JP 2010147051 A5 JP2010147051 A5 JP 2010147051A5 JP 2008319355 A JP2008319355 A JP 2008319355A JP 2008319355 A JP2008319355 A JP 2008319355A JP 2010147051 A5 JP2010147051 A5 JP 2010147051A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- resist film
- forming
- opening
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008319355A JP2010147051A (ja) | 2008-12-16 | 2008-12-16 | 半導体集積回路装置および半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008319355A JP2010147051A (ja) | 2008-12-16 | 2008-12-16 | 半導体集積回路装置および半導体集積回路装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010147051A JP2010147051A (ja) | 2010-07-01 |
JP2010147051A5 true JP2010147051A5 (zh) | 2012-01-26 |
Family
ID=42567200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008319355A Pending JP2010147051A (ja) | 2008-12-16 | 2008-12-16 | 半導体集積回路装置および半導体集積回路装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2010147051A (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150171039A1 (en) * | 2013-12-13 | 2015-06-18 | Chipmos Technologies Inc. | Redistribution layer alloy structure and manufacturing method thereof |
JP6522980B2 (ja) * | 2015-02-18 | 2019-05-29 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152014A (ja) * | 2001-11-09 | 2003-05-23 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法及び半導体装置 |
JP5388422B2 (ja) * | 2007-05-11 | 2014-01-15 | スパンション エルエルシー | 半導体装置及びその製造方法 |
-
2008
- 2008-12-16 JP JP2008319355A patent/JP2010147051A/ja active Pending
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