JP2010147000A - Lighting apparatus - Google Patents

Lighting apparatus Download PDF

Info

Publication number
JP2010147000A
JP2010147000A JP2008326407A JP2008326407A JP2010147000A JP 2010147000 A JP2010147000 A JP 2010147000A JP 2008326407 A JP2008326407 A JP 2008326407A JP 2008326407 A JP2008326407 A JP 2008326407A JP 2010147000 A JP2010147000 A JP 2010147000A
Authority
JP
Japan
Prior art keywords
mounting substrate
light emitting
heat conductive
conductive sheet
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008326407A
Other languages
Japanese (ja)
Other versions
JP5285417B2 (en
Inventor
Ryoji Yokoya
良二 横谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd filed Critical Panasonic Electric Works Co Ltd
Priority to JP2008326407A priority Critical patent/JP5285417B2/en
Publication of JP2010147000A publication Critical patent/JP2010147000A/en
Application granted granted Critical
Publication of JP5285417B2 publication Critical patent/JP5285417B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • F21V9/35—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material at focal points, e.g. of refractors, lenses, reflectors or arrays of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12—Combinations of only three kinds of elements
    • F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/38—Combination of two or more photoluminescent elements of different materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting apparatus which can remove heat from a light emitting device efficiently to an apparatus body, and in which the light emitting device is easily mounted on the apparatus body. <P>SOLUTION: The lighting apparatus 12 includes the light emitting device 10 with a light emitting element 1 mounted on one surface side of a mounting substrate 2, a plurality of fixing screws 61 for fixing the mounting substrate 2 of the light emitting device 10 on the apparatus body 6, and a heat conductive sheet 7 which is in pressure-contact between the other surface of the mounting substrate 2 and the apparatus body 6. A recessed part 6a for housing the heat conductive sheet 7 is arranged on at least one of the other surface of the mounting substrate 2 and the apparatus body 6 including a region on which the light emitting element 1 mounted on the mounting substrate 2 is projected to an apparatus body 6 side in a plane view. The recessed part 6a is larger than the heat conductive sheet 7, and has a depth dimension smaller than a thickness dimension of the heat conductive sheet 7 and has a larger dimension than an elastically deforming dimension of the heat conductive sheet 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ＬＥＤチップ（発光ダイオードチップ）などの発光素子を用いた発光装置を光源として備えた照明装置に関するものである。   The present invention relates to an illumination device including a light emitting device using a light emitting element such as an LED chip (light emitting diode chip) as a light source.

従来から、ＬＥＤチップと、当該ＬＥＤチップが一表面側に実装された実装基板と、実装基板の上記一表面側においてＬＥＤチップを囲む形で配置された封止部と、封止部を囲む形で配置され、ＬＥＤチップから放射された光によって励起されてＬＥＤチップの発光色とは異なる色の光を放射する蛍光体を含有した透光性材料により形成された色変換部材とを備えた発光装置が提案されている。この種の発光装置において、例えば、青色の光を放射するＬＥＤチップと、黄色の光を放射する蛍光体を含有する色変換部材とを採用することで、ＬＥＤチップから放射された青色の光と蛍光体から放射された黄色の光とが色変換部材の光出射面から放出されることにより、白色光を得ることができる。   Conventionally, an LED chip, a mounting substrate on which the LED chip is mounted on one surface side, a sealing portion arranged to surround the LED chip on the one surface side of the mounting substrate, and a shape surrounding the sealing portion And a color conversion member formed of a translucent material containing a phosphor that is excited by light emitted from the LED chip and emits light of a color different from that of the LED chip. A device has been proposed. In this type of light emitting device, for example, by adopting an LED chip that emits blue light and a color conversion member that contains a phosphor that emits yellow light, blue light emitted from the LED chip White light can be obtained by emitting the yellow light emitted from the phosphor from the light exit surface of the color conversion member.

この種の発光装置を照明装置に適用する場合は、ＬＥＤチップのジャンクション温度の上昇を抑制して入力電力を大きくすることで光出力の高出力化を図るために、ＬＥＤチップで発生した熱を効率よく外部に放熱させることが必要となる。   When this type of light emitting device is applied to a lighting device, the heat generated in the LED chip is used to increase the light output by suppressing the increase in the junction temperature of the LED chip and increasing the input power. It is necessary to efficiently dissipate heat to the outside.

一般に、パワートランジスタなど発熱量の大きな半導体素子を用いた電子機器分野において、半導体素子の自己発熱に起因して半導体素子の寿命が短くなる傾向があるため、半導体素子が搭載されたパッケージと放熱用のヒートシンクとの間に生じる隙間をなくすため、熱伝導性フィラーを含有する樹脂からなる熱伝導シートを設け、パッケージをヒートシンクに固定螺子で締め付けて固定することが知られている（例えば、特許文献１。）。   Generally, in the field of electronic equipment using a semiconductor element having a large heat generation amount such as a power transistor, the life of the semiconductor element tends to be shortened due to self-heating of the semiconductor element. In order to eliminate a gap generated between the heat sink and the heat sink, it is known to provide a heat conductive sheet made of a resin containing a heat conductive filler and fasten the package to the heat sink with a fixing screw (for example, patent document). 1.).

ところで、このような半導体素子の除熱をＬＥＤチップを用いた照明装置に応用する場合、ＬＥＤチップである発光素子が実装基板の一表面側に実装された発光装置は、図９の模式的断面図で示すように実装基板２の他表面と照明装置における器具本体６との間に、発光素子１で発生した熱を器具本体６に放熱させる熱伝導シート７を挟み、実装基板２の端部において、固定螺子６１でワッシャ１６を介して器具本体６に固定させることが考えられる。
特開２００８−１２４１２９号公報 By the way, when such heat removal of a semiconductor element is applied to an illumination device using an LED chip, the light emitting device in which the light emitting element which is an LED chip is mounted on one surface side of the mounting substrate is shown in the schematic cross section of FIG. As shown in the figure, a heat conductive sheet 7 for radiating heat generated in the light emitting element 1 to the fixture body 6 is sandwiched between the other surface of the mount substrate 2 and the fixture body 6 in the lighting device, and the end portion of the mount substrate 2 The fixing screw 61 may be fixed to the instrument body 6 via the washer 16.
JP 2008-124129 A

しかしながら、実装基板２と器具本体６とを固定するにあたり、固定螺子６１の締めが不十分だと熱伝導シート７の熱抵抗が大きくなり、使用により発光素子１の温度が上昇して、発光素子１の寿命が低下する場合がある。また、固定螺子６１を締めすぎた場合、実装基板２と器具本体６との間に挟まれた熱伝導シート７は、熱伝導シート７の弾性により熱伝導シート７の厚み方向において均一に変形しきれなくなる。そのため、固定螺子６１近傍の熱伝導シート７の厚さは薄く、固定螺子６１から離れた熱伝導シート７の厚みは厚くなる傾向にある。通常、器具本体６は実装基板２よりも強度が高いため、発光装置１０の実装基板２は、器具本体６に対して上方に盛り上がった弓状に変形する。   However, when the mounting board 2 and the instrument body 6 are fixed, if the fixing screw 61 is not sufficiently tightened, the heat resistance of the heat conductive sheet 7 increases, and the temperature of the light emitting element 1 rises due to use. 1 life may be reduced. If the fixing screw 61 is tightened too much, the heat conductive sheet 7 sandwiched between the mounting substrate 2 and the instrument body 6 is uniformly deformed in the thickness direction of the heat conductive sheet 7 due to the elasticity of the heat conductive sheet 7. I can't understand. Therefore, the thickness of the heat conductive sheet 7 in the vicinity of the fixed screw 61 is thin, and the thickness of the heat conductive sheet 7 away from the fixed screw 61 tends to be thick. Usually, since the instrument body 6 has higher strength than the mounting board 2, the mounting board 2 of the light emitting device 10 is deformed into a bow shape that rises upward with respect to the instrument body 6.

このような状況で、発光装置１０の点灯および消灯を繰り返すと、点灯および消灯に起因する昇温、降温の温度サイクルにより、実装基板２と器具本体６との熱膨張率の差により実装基板２の弓状に変形した部位に高い応力がかかることになる。   In such a situation, when the light emitting device 10 is repeatedly turned on and off, the mounting substrate 2 is caused by the difference in thermal expansion coefficient between the mounting substrate 2 and the instrument body 6 due to the temperature cycle of temperature rise and fall caused by turning on and off. A high stress is applied to the part deformed into an arcuate shape.

そのため、照明装置１２の器具本体６に発光装置１０を固定螺子６１で螺子止めした際には、外見上に不具合が見当たらなくとも、温度サイクルにより発光装置１０の実装基板２が破損する場合もある。   Therefore, when the light-emitting device 10 is screwed to the fixture body 6 of the lighting device 12 with the fixing screw 61, the mounting substrate 2 of the light-emitting device 10 may be damaged by the temperature cycle even if no defect is found on the appearance. .

また、実装基板２の端部において固定螺子６１で螺子止めした場合、固定螺子６１を締めすぎると実装基板２の変形により、固定螺子６１取り付け部間に位置する実装基板２の中央と、器具本体６とを密着させる熱伝導シート７の接続が不十分になり、発光素子１からの熱を効率よく放熱することができない場合がある。この場合、使用により発光素子１の温度が上昇して、発光素子１の寿命が低下するという問題がある。   Further, when the fixing screw 61 is screwed at the end of the mounting substrate 2, if the fixing screw 61 is tightened too much, the mounting substrate 2 is deformed and the center of the mounting substrate 2 located between the fixing screw 61 mounting portions and the instrument body 6 may be insufficiently connected, and heat from the light emitting element 1 may not be radiated efficiently. In this case, there is a problem that the temperature of the light emitting element 1 is increased by use, and the life of the light emitting element 1 is reduced.

さらに、照明装置１２に用いられる発光装置１０は、パワートランジスタなどと異なり、外部に光を効率よく放出する必要があり、螺子止めに起因する実装基板２の変形等で生じた発光素子１の光軸ずれを抑制する必要もある。   Further, unlike the power transistor or the like, the light emitting device 10 used for the lighting device 12 needs to efficiently emit light to the outside, and the light of the light emitting element 1 generated by deformation of the mounting substrate 2 due to screwing or the like. It is also necessary to suppress the axial deviation.

本発明は上記事由に鑑みて為されたものであり、その目的は、発光装置からの熱を器具本体へ効率よく除熱可能であると共に、発光装置を器具本体へ簡便に取り付け可能な照明装置を提供することにある。   The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide an illumination device that can efficiently remove heat from the light-emitting device to the fixture body and can easily attach the light-emitting device to the fixture body. Is to provide.

請求項１の発明は、発光素子が実装基板の一表面側に実装された発光装置と、該発光装置の実装基板を器具本体に固定させる複数個の固定具と、前記実装基板の他表面と前記器具本体との間に介在し前記複数個の固定具により実装基板を器具本体に固定することにより実装基板の他表面と器具本体との両方に圧接される熱伝導シートとを有する照明装置であって、平面視において前記実装基板に実装された前記発光素子を前記器具本体側へ向けて投影した領域を含み、前記実装基板の他表面、もしくは前記器具本体の少なくとも一方に、前記熱伝導シートを収納する凹部が設けられ、該凹部は、平面視形状において前記熱伝導シートよりも大きく、且つ、深さ寸法が前記熱伝導シートの厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きいことを特徴とする。   The invention of claim 1 is a light emitting device in which a light emitting element is mounted on one surface side of a mounting substrate, a plurality of fixtures for fixing the mounting substrate of the light emitting device to an instrument body, and the other surface of the mounting substrate. An illumination device having a heat conductive sheet interposed between the fixture body and fixed to the fixture body by means of the plurality of fixtures and pressed against both the other surface of the mount substrate and the fixture body. And a region where the light emitting element mounted on the mounting substrate in a plan view is projected toward the instrument body side, and the heat conduction sheet is provided on at least one of the other surface of the mounting substrate or the instrument body. Is formed in a plan view and is larger than the heat conductive sheet in a plan view, and the depth dimension is smaller than the thickness dimension of the heat conductive sheet, and the heat conductive sheet is plastically deformed. It is larger than the law.

この発明によれば、複数個の固定具により実装基板を熱伝導シートを介して器具本体に固定しても、熱伝導シートが熱伝導シートの弾性変形する範囲内で変形し、実装基板に無理な力がかからずに固定でき、実装基板と熱伝導シートが均一に圧接する。そのため、発光装置からの熱を器具本体へ効率よく除熱可能であると共に、発光装置を器具本体へ簡便に取り付け可能な照明装置を提供することができる。また、発光装置に用いられる実装基板の損傷も抑制しえる。発光装置の実装基板が熱伝導シートを均一に圧接し、安定した放熱性能を得ることが可能となる。さらに、実装基板の変形等で生じる発光素子の光軸ずれを抑制することができる。また、固定具として固定螺子を用いた場合には、固定螺子の締め付けトルク管理を厳密にする必要がないため照明装置の組み立てが容易となり製造コストを低減することが可能となる。   According to the present invention, even if the mounting substrate is fixed to the instrument body via the heat conductive sheet by a plurality of fixing tools, the heat conductive sheet is deformed within the range in which the heat conductive sheet is elastically deformed, so that the mounting substrate is impossible. It can be fixed without applying excessive force, and the mounting substrate and the heat conductive sheet are pressed uniformly. Therefore, it is possible to provide an illuminating device that can efficiently remove heat from the light emitting device to the fixture body and that can be easily attached to the fixture body. In addition, damage to the mounting substrate used in the light emitting device can be suppressed. The mounting substrate of the light emitting device can press the heat conductive sheet uniformly to obtain stable heat dissipation performance. Furthermore, the optical axis shift of the light emitting element caused by deformation of the mounting substrate can be suppressed. Further, when a fixing screw is used as a fixing tool, it is not necessary to strictly manage the tightening torque of the fixing screw, so that the lighting device can be easily assembled and the manufacturing cost can be reduced.

請求項２の発明は、請求項１の発明において、前記凹部は、平面視形状において前記実装基板よりも小さく、且つ前記実装基板の他表面側で覆われていることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the present invention, the concave portion is smaller than the mounting substrate in a plan view and is covered on the other surface side of the mounting substrate.

この発明によれば、実装基板からはみ出る熱伝導シートがないため、実装基板の端部で熱伝導シートが破損することを防止することができる。   According to this invention, since there is no heat conductive sheet which protrudes from a mounting board, it can prevent that a heat conductive sheet is damaged at the edge part of a mounting board.

請求項３の発明は、請求項１または請求項２の発明において、前記実装基板は、セラミック基板であって、前記熱伝導シートは、シリコーン樹脂あるいはアクリル系樹脂中に熱伝導性フィラーが含有されてなることを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the mounting substrate is a ceramic substrate, and the thermal conductive sheet contains a thermal conductive filler in a silicone resin or an acrylic resin. It is characterized by.

この発明によれば、セラミック基板を用いることで耐熱性に優れ、金属ベース基板と比較して熱膨張率も小さく実装基板の熱膨張に起因する発光素子の光軸ずれ等が生じることを抑制することができる。さらに、セラミック基板は樹脂基板と比較して機械的強度が高く、放熱性を向上させるため薄く形成することができる。また、シリコーン樹脂あるいはアクリル系樹脂中に熱伝導性フィラーが含有された熱伝導シートを用いることにより、発光素子が発した熱を効率よく外部に放熱することができる。   According to the present invention, the use of the ceramic substrate is excellent in heat resistance, and the coefficient of thermal expansion is smaller than that of the metal base substrate, so that the optical axis misalignment of the light emitting element caused by the thermal expansion of the mounting substrate is suppressed. be able to. Furthermore, the ceramic substrate has higher mechanical strength than the resin substrate and can be formed thin in order to improve heat dissipation. Further, by using a heat conductive sheet containing a heat conductive filler in a silicone resin or an acrylic resin, heat generated by the light emitting element can be efficiently radiated to the outside.

請求項１の発明では、平面視において前記実装基板に実装された前記発光素子を前記器具本体側へ向けて投影した領域を含み、前記実装基板の他表面、もしくは前記器具本体の少なくとも一方に、前記熱伝導シートを収納する凹部が設けられ、該凹部は、平面視形状において前記熱伝導シートよりも大きく、且つ、深さ寸法が前記熱伝導シートの厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きいことにより、発光装置からの熱を器具本体へ効率よく除熱可能であると共に、発光装置を器具本体へ簡便に取り付け可能な照明装置とすることができる。   In the invention of claim 1, including a region in which the light emitting element mounted on the mounting substrate in a plan view is projected toward the instrument body side, on the other surface of the mounting substrate, or at least one of the instrument body, A recess is provided for housing the heat conductive sheet, and the recess is larger in plan view than the heat conductive sheet, and the depth dimension is smaller than the thickness dimension of the heat conductive sheet, and the heat conductive sheet is plastic. By being larger than the dimension to deform | transform, while being able to remove the heat | fever from a light-emitting device efficiently to an instrument main body, it can be set as the illuminating device which can attach a light-emitting device to an instrument main body simply.

（実施形態１）
以下、本実施形態の照明装置について図１〜図４を参照して説明する。 (Embodiment 1)
Hereinafter, the illuminating device of this embodiment is demonstrated with reference to FIGS.

本実施形態の照明装置は、図１の断面図に示すように、照明装置１２の器具本体６が有底円筒状に形成されており、発光装置１０から放出される光の配光を制御する反射鏡８が器具本体６内に収納されている。反射鏡８は、椀状に形成され、底部に発光装置１０が挿入される開口部８ａを有している。なお、器具本体６は、金属材料（例えば、Ａｌなど）により形成されている。   In the illuminating device of this embodiment, as shown in the cross-sectional view of FIG. 1, the fixture body 6 of the illuminating device 12 is formed in a bottomed cylindrical shape, and controls the light distribution of light emitted from the light emitting device 10. A reflecting mirror 8 is accommodated in the instrument body 6. The reflecting mirror 8 is formed in a bowl shape and has an opening 8a into which the light emitting device 10 is inserted at the bottom. The instrument body 6 is made of a metal material (for example, Al).

発光装置１０は、ＬＥＤチップからなる発光素子１が実装基板２の一表面側に実装されており、発光装置１０を照明装置１２の器具本体６の内底面に固定具となる複数本の固定螺子６１，６１により、実装基板２の他表面と器具本体６とを発光素子１からの熱を伝導する熱伝導シート７を介して圧接して固定されている。   In the light emitting device 10, the light emitting element 1 made of an LED chip is mounted on one surface side of the mounting substrate 2, and a plurality of fixing screws that serve as a fixture on the inner bottom surface of the fixture body 6 of the lighting device 12. By 61 and 61, the other surface of the mounting substrate 2 and the instrument main body 6 are pressed and fixed via a heat conductive sheet 7 that conducts heat from the light emitting element 1.

発光装置１０が固定される器具本体６には、例えばシリカなどの熱伝導性フィラーが含有されたシリコーン樹脂からなる熱伝導シート７を収納し発光装置１０を固定する固定螺子６１，６１間に配される凹部６ａが設けられている。熱伝導シート７は、電気絶縁性を有すると共に熱伝導率が高く、その弾性により接着面での密着性が高い。そのため、熱伝導シート７と実装基板２および器具本体６の内底面との間に間隙が生じるのを防止することができ、密着不足による熱抵抗の増大を防止することができる。   The fixture main body 6 to which the light emitting device 10 is fixed contains a heat conductive sheet 7 made of a silicone resin containing a heat conductive filler such as silica, for example, and is arranged between fixing screws 61 and 61 for fixing the light emitting device 10. A recessed portion 6a is provided. The heat conductive sheet 7 has electrical insulation and high thermal conductivity, and its elasticity provides high adhesion on the adhesive surface. Therefore, it is possible to prevent a gap from being generated between the heat conductive sheet 7 and the mounting substrate 2 and the inner bottom surface of the instrument body 6, and it is possible to prevent an increase in thermal resistance due to insufficient adhesion.

また、照明装置１２には、器具本体６の開口縁との間に、反射鏡８の開口縁から外方へ延設された外鍔部８ｃと、器具本体６の開口内部を保護する透光性カバー１１とを狭持する形で保持する円環状の保持枠９を備えている。ここで、保持枠９は、器具本体６に対して複数本の取付螺子９１により固定されている。   Further, the lighting device 12 is provided with an outer flange portion 8 c extending outward from the opening edge of the reflecting mirror 8 between the opening edge of the instrument body 6 and a translucent light that protects the inside of the opening of the instrument body 6. An annular holding frame 9 for holding the cover 11 in a sandwiched manner is provided. Here, the holding frame 9 is fixed to the instrument body 6 by a plurality of mounting screws 91.

以下、本実施形態の各構成について、より具体的に詳述する。なお、照明装置の要部を示す図２と共通する構成要素には、図３および図４において同一の符号を付して説明してある。   Hereinafter, each configuration of the present embodiment will be described in more detail. In addition, the same code | symbol is attached | subjected and demonstrated to the component which is common in FIG. 2 which shows the principal part of an illuminating device in FIG.

本実施形態の照明装置１２に用いられる発光装置１０は、図２（ｂ）の平面図で示すように、平面視形状が長方形状である例えばセラミック基板からなる実装基板２上の略中央に発光素子１が実装されている。実装基板２上には平面視形状が円形状の凸レンズ状となる封止部３が長方形状の中央部に発光素子１を覆う形で設けられ、封止部３を覆う形で空気層５を介して平面視形状が封止部３よりも大きな円形状のドーム状となる色変換部材４が配置されている（図２（ａ）を参照）。   As shown in the plan view of FIG. 2B, the light emitting device 10 used in the illumination device 12 of the present embodiment emits light at substantially the center on the mounting substrate 2 made of, for example, a ceramic substrate having a rectangular shape in plan view. Element 1 is mounted. On the mounting substrate 2, a sealing portion 3 having a circular convex lens shape in plan view is provided so as to cover the light emitting element 1 at a rectangular central portion, and the air layer 5 is formed so as to cover the sealing portion 3. A color conversion member 4 having a circular dome shape whose plan view shape is larger than that of the sealing portion 3 is disposed (see FIG. 2A).

発光装置１０は、長方形状の実装基板２の四隅となる隅部で、発光素子１が実装された一表面側から器具本体６の内底面に対して固定部となる４本の固定螺子６１により、器具本体６の内底面で凹部６ａの外側に設けられた螺子孔に螺子止されている。なお、発光装置１０は、実装基板２上に形成された配線パターン（図示せず）に給電することで発光素子１が発光可能に構成されている。   The light emitting device 10 is formed by four fixing screws 61 serving as fixing portions from the one surface side on which the light emitting element 1 is mounted to the inner bottom surface of the instrument body 6 at the four corners of the rectangular mounting substrate 2. The inner bottom surface of the instrument body 6 is screwed into a screw hole provided outside the recess 6a. The light emitting device 10 is configured such that the light emitting element 1 can emit light by supplying power to a wiring pattern (not shown) formed on the mounting substrate 2.

照明装置１２に設けられる凹部６ａは、図２（ｂ）で示すように器具本体６の内底面に平面視形状が長方形状であって、発光装置１０の長方形状と直交する方向に設けられている。凹部６ａは、熱伝導シート７を収納し平面視において発光装置１０を固定する４本の固定螺子６１うち、実装基板２の長辺に沿って平行に配置された２本の固定螺子６１間に挟まれるように設けられている。そのため、凹部６ａの一部は、平面視において実装基板２の長辺から一部がはみ出ることになる。   As shown in FIG. 2B, the recess 6 a provided in the illumination device 12 has a rectangular shape in plan view on the inner bottom surface of the fixture body 6, and is provided in a direction orthogonal to the rectangular shape of the light emitting device 10. Yes. The recess 6a accommodates the heat conduction sheet 7 and fixes the light emitting device 10 in a plan view, and among the two fixing screws 61 arranged in parallel along the long side of the mounting substrate 2 among the four fixing screws 61. It is provided so that it may be pinched. For this reason, a part of the recess 6a protrudes from the long side of the mounting substrate 2 in plan view.

凹部６ａは、平面視において前記実装基板に実装された前記発光素子を前記器具本体側へ向けて投影した領域を含み、その平面視形状において熱伝導シート７よりも大きく形成されている。また、凹部６ｃの深さ寸法が熱伝導シート７の厚み寸法よりも小さく熱伝導シート７が塑性変形する寸法よりも大きく形成されている。そのため、凹部６ａ内に平面視形状が凹部６ａと相似形の熱伝導シート７を収納すると、熱伝導シート７はその厚み方向において器具本体６の内底面から一部が突出する。この熱伝導シート７の突出した一部は、発光装置１０を固定螺子６１で螺子止することにより、発光装置１０における実装基板２の他表面と圧接されることなる。   The concave portion 6a includes a region in which the light emitting element mounted on the mounting substrate is projected toward the instrument body side in a plan view, and is formed to be larger than the heat conductive sheet 7 in the plan view shape. Moreover, the depth dimension of the recessed part 6c is smaller than the thickness dimension of the heat conductive sheet 7, and is formed larger than the dimension in which the heat conductive sheet 7 is plastically deformed. Therefore, when the heat conductive sheet 7 having a shape similar to that of the concave portion 6a is accommodated in the recess 6a, a part of the heat conductive sheet 7 protrudes from the inner bottom surface of the instrument body 6 in the thickness direction. The protruding part of the heat conductive sheet 7 is brought into pressure contact with the other surface of the mounting substrate 2 in the light emitting device 10 by screwing the light emitting device 10 with the fixing screw 61.

なお、器具本体６の内底面に設けられた凹部６ａは、必ずしも器具本体６に直接設けるものだけに限られず、器具本体６の内底面に熱伝導シート７が収納可能な凹部６ａが形成された、例えば金属からなる板を平坦な器具本体６の内底面に配置させてもよいし、図３（ａ）に示すように発光装置１０と器具本体６との間に貫通孔を設けた別部材、例えば、器具本体６と同じ材料からなるスペーサ１３を配置し、貫通孔の側壁と器具本体６の内底面で熱伝導シート７を収納する凹部６ａを構成しても良い。また、凹部６ａの形状は、必ずしも平面視形状が長方形状に限られず、円形状（図４（ｂ）参照）、楕円形状や多角形状など種々選択することができる。凹部６ａの深さ寸法は、収納される熱伝導シート７の材料、その膜厚等により種々調整できるが、いずれにしろ、実装基板２と器具本体６との間で熱伝導シート７が破損なく圧接できる大きさとしてある。   In addition, the recessed part 6a provided in the inner bottom face of the instrument main body 6 is not necessarily restricted only to what is provided in the instrument main body 6 directly, The recessed part 6a in which the heat conductive sheet 7 can be accommodated in the inner bottom face of the instrument main body 6 was formed. For example, a plate made of metal may be disposed on the inner bottom surface of the flat instrument body 6, or another member provided with a through hole between the light emitting device 10 and the instrument body 6 as shown in FIG. For example, the spacer 13 made of the same material as that of the instrument body 6 may be disposed, and the recess 6 a that houses the heat conductive sheet 7 may be configured by the side wall of the through hole and the inner bottom surface of the instrument body 6. The shape of the recess 6a is not necessarily limited to a rectangular shape in plan view, and various shapes such as a circular shape (see FIG. 4B), an elliptical shape, and a polygonal shape can be selected. The depth dimension of the recess 6a can be variously adjusted depending on the material of the heat conduction sheet 7 to be accommodated, its film thickness, etc., but in any case, the heat conduction sheet 7 is not damaged between the mounting substrate 2 and the instrument body 6. The size can be pressed.

固定部は、実装基板２を器具本体６の内底面に固定可能なものであり、固定螺子６１だけに限られず、図４に示す如く平面視形状が長方形状の実装基板２の対向する短辺側に沿ってそれぞれ設けられた長方形状の固定平板１４により押圧し、固定平板１４の両端部にそれぞれ固定螺子６１で実装基板２を器具本体６の内底面に固定することもできる。   The fixing portion is capable of fixing the mounting substrate 2 to the inner bottom surface of the instrument main body 6 and is not limited to the fixing screw 61. The short side of the mounting substrate 2 having a rectangular shape in plan view as shown in FIG. The mounting board 2 can be fixed to the inner bottom surface of the instrument main body 6 by fixing screws 61 at both ends of the fixing flat plate 14, respectively, by pressing with the rectangular fixing flat plates 14 respectively provided along the side.

反射鏡８は、色変換部材４の光出射面から放射された光を透光性カバー１１側へ反射させ狭角配光が得られるように内側面の形状が設計されており、当該内側面がドーム状の色変換部材４の頂点を焦点とする放物面状に形成されている。なお、反射鏡８の内側面の形状は特に限定するものではなく、反射鏡８は、所望の配光特性に応じて、発光素子１の光軸方向において発光素子１から離れるにつれて開口面積が徐々に大きくなる椀状の形状などに形成することができる。   The reflecting mirror 8 is designed to have an inner surface shape so that light emitted from the light emitting surface of the color conversion member 4 is reflected toward the translucent cover 11 and a narrow-angle light distribution is obtained. Is formed in a parabolic shape with the vertex of the dome-shaped color conversion member 4 as a focal point. In addition, the shape of the inner surface of the reflecting mirror 8 is not particularly limited, and the reflecting mirror 8 gradually has an opening area as the distance from the light emitting element 1 increases in the optical axis direction of the light emitting element 1 according to desired light distribution characteristics. It can be formed into a bowl-like shape that becomes larger.

反射鏡８の材料としては、例えば、発光素子１や蛍光体から放射される光の波長を効率よく反射する金属（例えば、Ａｌやステンレスなど）や高耐熱性の樹脂（例えば、ＰＢＴなど）などが挙げられる。また、反射鏡８の内側面は、発光装置１０からの光を効率よく反射させるため、所望に応じて、Ａｇを蒸着したり、白色塗装することもできる。   Examples of the material of the reflecting mirror 8 include a metal (for example, Al and stainless steel) that efficiently reflects the wavelength of light emitted from the light emitting element 1 and the phosphor, a high heat resistant resin (for example, PBT), and the like. Is mentioned. Moreover, in order to reflect the light from the light-emitting device 10 efficiently, the inner surface of the reflecting mirror 8 can be vapor-deposited or painted white as desired.

透光性カバー１１は、器具本体６の開口内部に配置された発光装置１０や反射鏡８を外部から保護するために好適に設けられ、例えば、透光性の材料として、ガラスやアクリル樹脂などによって形成することができる。なお、透光性カバー１１は、平板状に形成するだけでなく発光装置１０からの光を所望の配光が得られるように凸レンズ形状や凹レンズ形状に形成してもよい。   The translucent cover 11 is suitably provided to protect the light emitting device 10 and the reflecting mirror 8 disposed inside the opening of the instrument body 6 from the outside. For example, as a translucent material, glass, acrylic resin, etc. Can be formed. The translucent cover 11 may be formed not only in a flat plate shape but also in a convex lens shape or a concave lens shape so that a desired light distribution can be obtained from the light emitting device 10.

また、本実施形態の発光装置１０では、発光素子１として、青色の光や紫外線を高出力に発光可能な窒化ガリウム系化合物半導体からなるＬＥＤチップを用い、蛍光体として、発光素子１から放出された光により励起されて、励起光よりも長波長の光を放出する粒子状の蛍光体（例えば、青色光により励起され発光波長域がブロードな黄色系の光を放出する蛍光体や紫外線により励起され青色、緑色および赤色をそれぞれ発光可能な３種類の蛍光体など）を用いている。発光装置１０からは、発光素子１からの光が色変換部材４の光出射面から拡散した配光となって白色光が出射される。なお、発光素子１は、所望に応じて実装基板２上に複数個設けることができ、各々を実装基板２上に設けた配線パターンを用いて電気的に直列接続、並列接続や直並列接続させてもよい。また、発光素子１は、例えば、ＬＥＤチップ上に蛍光体層を積層し、ＬＥＤチップ自体から白色光を発光することが可能なように構成しても良い。   Further, in the light emitting device 10 of the present embodiment, an LED chip made of a gallium nitride compound semiconductor capable of emitting blue light or ultraviolet light with high output is used as the light emitting element 1 and is emitted from the light emitting element 1 as a phosphor. Particulate phosphors that emit light with a wavelength longer than that of the excitation light (for example, phosphors that emit yellow light with a broad emission wavelength range excited by blue light or ultraviolet light) And three kinds of phosphors capable of emitting blue, green and red, respectively). From the light emitting device 10, the light from the light emitting element 1 is diffused from the light emitting surface of the color conversion member 4 to emit white light. A plurality of light emitting elements 1 can be provided on the mounting substrate 2 as desired, and each is electrically connected in series, in parallel, or in series-parallel using a wiring pattern provided on the mounting substrate 2. May be. In addition, the light emitting element 1 may be configured, for example, such that a phosphor layer is stacked on an LED chip so that white light can be emitted from the LED chip itself.

実装基板２は、セラミック基板（例えば、アルミナセラミック基板、窒化アルミニウム基板など）からなる絶縁性基板の一表面に金属材料（例えば、Ａｕなど）を用いた配線パターンが形成されたものを用いることができる。なお、実装基板２はセラミック基板に限られず、ガラスエポキシ樹脂基板や表面に絶縁層（例えば、ガラス結晶や金属酸化物など）が形成された金属からなる金属ベース基板を用いることもできる。また、実装基板２は、平面視が長方形状に限られず、例えば、円形状、楕円形状や多角形状でもよい。実装基板２に実装された発光素子１は、実装基板２上に設けられた配線パターンの一部からなるダイパッド部にＡｕＳｎ、半田や銀ペーストなどの接合材料を用いて接合することができる。なお、発光素子１は、実装基板上にサブマウントを介して実装させてもよい。   As the mounting substrate 2, a substrate in which a wiring pattern using a metal material (for example, Au) is formed on one surface of an insulating substrate made of a ceramic substrate (for example, an alumina ceramic substrate or an aluminum nitride substrate) is used. it can. The mounting substrate 2 is not limited to a ceramic substrate, and a glass epoxy resin substrate or a metal base substrate made of a metal having an insulating layer (for example, glass crystal or metal oxide) formed on the surface can also be used. Further, the mounting substrate 2 is not limited to a rectangular shape in plan view, and may be, for example, a circular shape, an elliptical shape, or a polygonal shape. The light emitting element 1 mounted on the mounting substrate 2 can be bonded to a die pad portion made of a part of a wiring pattern provided on the mounting substrate 2 using a bonding material such as AuSn, solder, or silver paste. The light emitting element 1 may be mounted on the mounting substrate via a submount.

封止部３は、発光素子１を保護し、発光素子１からの光を効率よく外部に取り出すため、シリコーン樹脂を採用した凸レンズ状に形成させている。なお、封止部材の透光性材料としては、シリコーン樹脂に限られず、エポキシ樹脂、アクリル樹脂やガラスなどを採用することもできる。   The sealing part 3 is formed in a convex lens shape that employs a silicone resin in order to protect the light emitting element 1 and to efficiently extract light from the light emitting element 1 to the outside. In addition, as a translucent material of a sealing member, it is not restricted to a silicone resin, An epoxy resin, an acrylic resin, glass etc. can also be employ | adopted.

また、色変換部材４は、シリコーン樹脂からなる透光性材料に発光素子１から放射された青色の光によって励起されて黄色の光を放射する粒子状の蛍光体を均一分布させた混合材料を用いてドーム状に形成されている。なお、色変換部材４の材料として用いる透光性材料は、シリコーン樹脂に限らず、例えば、エポキシ樹脂、アクリル樹脂、ポリカーボネート樹脂、ガラス、有機成分と無機成分とがｎｍレベルもしくは分子レベルで混合、結合した有機・無機ハイブリッド材料を採用してもよい。また、色変換部材４の材料として用いる透光性材料に含有させる蛍光体も、色調整や演色性を高めるなどの目的で複数種類の蛍光体を用いてもよく、例えば、赤色光を発光する蛍光体と緑色光を発光する蛍光体とを混合させた蛍光体を用いることで演色性の高い白色光を得ることができる。   The color conversion member 4 is made of a mixed material in which a particulate phosphor that emits yellow light by being excited by blue light emitted from the light emitting element 1 is uniformly distributed on a translucent material made of silicone resin. Used to form a dome. In addition, the translucent material used as the material of the color conversion member 4 is not limited to a silicone resin, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, glass, an organic component and an inorganic component are mixed at the nm level or the molecular level, A combined organic / inorganic hybrid material may be employed. Moreover, the phosphor contained in the translucent material used as the material of the color conversion member 4 may be a plurality of types of phosphors for the purpose of color adjustment and color rendering, for example, emitting red light. By using a phosphor in which a phosphor and a phosphor emitting green light are mixed, white light with high color rendering can be obtained.

また、空気層５は、封止部３と色変換部材４との間に形成され、発光素子１から放出され色変換部材４側に入射された発光素子１の光や色変換部材４内で蛍光体により波長変換された光が色変換部材４側から空気層５側に入射することを抑制し、発光装置１０内部での光吸収を抑制することで発光効率の向上に寄与することが可能となるものである。   The air layer 5 is formed between the sealing portion 3 and the color conversion member 4, and is emitted from the light emitting element 1 and incident on the color conversion member 4 side. It is possible to contribute to the improvement of luminous efficiency by suppressing the light wavelength-converted by the phosphor from entering the air layer 5 side from the color conversion member 4 side and suppressing the light absorption inside the light emitting device 10. It will be.

特に、実装基板２としてセラミック基板を用いた場合は、樹脂基板と比較して放熱性が高く、熱に強く強度に優れる。また、金属ベース基板と比較すると基板自体が絶縁性を有し、熱膨張率も小さく所望の形状に形成しやすいという特徴を備えている。そのため、セラミック基板を発光装置１０の実装基板２に用いることがより好ましい。しかしながら、セラミック基板をより大面積化あるいは、より薄膜化した場合、セラミック基板では負荷により割れやすい傾向がある。そのため、熱伝導シート７の熱膨張時や固定螺子６１で螺子止めする時において、熱伝導シート７の影響を小さくする凹部６ａを設けることで照明装置１２の信頼性を向上することができる。   In particular, when a ceramic substrate is used as the mounting substrate 2, the heat dissipation is higher than that of the resin substrate, and it is strong against heat and excellent in strength. Further, as compared with a metal base substrate, the substrate itself has an insulating property, has a low thermal expansion coefficient, and is easily formed into a desired shape. Therefore, it is more preferable to use a ceramic substrate for the mounting substrate 2 of the light emitting device 10. However, when the ceramic substrate has a larger area or a thinner film, the ceramic substrate tends to be easily broken by a load. Therefore, the reliability of the illuminating device 12 can be improved by providing the recessed part 6a that reduces the influence of the heat conductive sheet 7 when the heat conductive sheet 7 is thermally expanded or when the fixing screw 61 is screwed.

熱伝導シート７は、基材中に熱伝導性フィラーを含有させたシート状のものを用いることができる。基材としては、シリコーン樹脂あるいはアクリル系樹脂など電気絶縁性に優れた弾性体を用いることができる。熱導電性フィラーとしては、例えばシリカ、酸化チタンや酸化アルミニウム、窒化アルミニウムなどを用いることができる。熱伝導性フィラーの形状は、繊維状、針状、燐辺状や球状など種々の形状とすることができる。また、熱伝導性フィラーは、シランカップリング剤で表面処理してもよい。   As the heat conductive sheet 7, a sheet-like material in which a heat conductive filler is contained in a base material can be used. As the substrate, an elastic body excellent in electrical insulation such as silicone resin or acrylic resin can be used. As the thermally conductive filler, for example, silica, titanium oxide, aluminum oxide, aluminum nitride, or the like can be used. The shape of the heat conductive filler can be various shapes such as a fiber shape, a needle shape, a phosphorous shape, and a spherical shape. Moreover, you may surface-treat a heat conductive filler with a silane coupling agent.

なお、熱伝導シート７中において熱伝導性フィラーの含有量を多くすると発光素子１からの熱を効率よく伝達することができる。しかしながら、熱伝導性フィラーの含有量が多くなり過ぎると熱伝導シート７の可とう性が損なわれる。そのため、発光装置１０を照明装置１２の器具本体６に固定螺子６１で螺子止する場合、実装基板２には熱伝導シート７の厚みの分だけ掛かる負荷が大きくなる傾向にある。   In addition, if the content of the heat conductive filler is increased in the heat conductive sheet 7, heat from the light emitting element 1 can be efficiently transmitted. However, if the content of the heat conductive filler is excessive, the flexibility of the heat conductive sheet 7 is impaired. Therefore, when the light emitting device 10 is screwed to the fixture body 6 of the lighting device 12 with the fixing screw 61, the load applied to the mounting substrate 2 by the thickness of the heat conductive sheet 7 tends to increase.

また、熱伝導性フィラーの含有量が少なくなると熱伝導シート７の可とう性が高くなり発光装置１０を照明装置１２の器具本体６に固定螺子６１で、螺子止する場合の実装作業性や密着性が向上する。しかしながら、熱伝導性フィラーの含有量が少なくなり過ぎると、発光素子１からの熱を十分に放熱することができなくなる。また、発光装置１０の昇温に伴い熱伝導シート７が熱膨張する割合が大きくなり、実装基板２には、熱伝導シート７が熱膨張する分だけ掛かる負荷が増える傾向にある。   Further, when the content of the heat conductive filler is decreased, the flexibility of the heat conductive sheet 7 is increased, and the mounting workability and adhesion when the light emitting device 10 is screwed to the fixture body 6 of the lighting device 12 with the fixing screw 61 are improved. Improves. However, if the content of the heat conductive filler is too small, the heat from the light emitting element 1 cannot be sufficiently dissipated. Further, as the temperature of the light emitting device 10 increases, the rate of thermal expansion of the heat conductive sheet 7 increases, and the load applied to the mounting substrate 2 by the amount of thermal expansion of the heat conductive sheet 7 tends to increase.

そのため、熱伝導シート７に含有される熱伝導性フィラーの含有量は、熱伝導性や密着性等を考慮して種々調整することが望ましい。   Therefore, it is desirable to adjust variously the content of the heat conductive filler contained in the heat conductive sheet 7 in consideration of heat conductivity, adhesion, and the like.

本実施形態の照明装置１２においては、発光装置１０が実装される器具本体６の内底面に熱伝導シート７を収納可能な凹部６ａが設けられていることにより、発光装置１０からの熱を照明装置１２の器具本体６へ効率よく除熱可能であると共に、発光装置１０を器具本体６へ簡便に取り付け可能な照明装置１２とすることができる。   In the illuminating device 12 of this embodiment, the recessed part 6a which can accommodate the heat conductive sheet 7 is provided in the inner bottom face of the instrument main body 6 in which the light-emitting device 10 is mounted, thereby illuminating the heat from the light-emitting device 10. The lighting device 12 can efficiently remove heat from the device main body 6 of the device 12 and can easily attach the light emitting device 10 to the device main body 6.

（実施形態２）
本実施形態の照明装置１２の基本構成は実施形態１と略同一であり、図５に示すように器具本体６の内底面に設けられた凹部６ａは、平面視形状において実装基板２よりも小さく、且つ実装基板２の他表面となる裏面側で覆われた点が相違する。なお、実施形態１と同様の構成要素には、同一の符号を付して説明を適宜省略する。 (Embodiment 2)
The basic configuration of the illumination device 12 of the present embodiment is substantially the same as that of the first embodiment, and the recess 6a provided on the inner bottom surface of the instrument body 6 is smaller than the mounting substrate 2 in plan view as shown in FIG. And the point covered with the back surface side used as the other surface of the mounting board | substrate 2 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted suitably.

本実施形態の照明装置１２は、図５（ａ）に示すように器具本体６の内底面に熱伝導シート７を収納する凹部６ａの開口部が、平面視形状において発光装置１０の実装基板２よりも小さく、実装基板２を固定することで凹部６ａが覆われることになる（図５（ｂ）参照）。   As shown in FIG. 5A, the illumination device 12 of the present embodiment has a mounting substrate 2 of the light emitting device 10 in which the opening of the recess 6a that houses the heat conductive sheet 7 on the inner bottom surface of the fixture body 6 is in a plan view shape. The recessed portion 6a is covered by fixing the mounting substrate 2 (see FIG. 5B).

そのため、凹部６ａ内に熱伝導シート７を収納して発光装置１０を固定すると、熱伝導シート７が器具本体６の内底面に閉じ込められることになる。   Therefore, when the heat conductive sheet 7 is accommodated in the recess 6 a and the light emitting device 10 is fixed, the heat conductive sheet 7 is confined in the inner bottom surface of the instrument body 6.

発光装置１０を発光装置１０の四隅となる隅部で器具本体６に固定螺子６１で螺子止する際、固定螺子６１を締め過ぎても発光装置１０が押圧する熱伝導シート７には一様に圧力が掛かる。特に、実装基板２からはみ出る熱伝導シート７がないため、熱伝導シート７の変形も一様となり発光装置１０における実装基板２の端部で、実装基板２下部と実装基板２外との熱伝導シート７の変形量差が大きくなりすぎる結果生じる熱伝導シート７が破損することを防止することができる。   When the light emitting device 10 is screwed to the instrument main body 6 with the fixing screws 61 at the corners which are the four corners of the light emitting device 10, the light emitting device 10 is uniformly applied to the heat conductive sheet 7 pressed even if the fixing screws 61 are tightened excessively. Pressure is applied. In particular, since there is no thermal conductive sheet 7 protruding from the mounting substrate 2, the deformation of the thermal conductive sheet 7 is uniform, and heat conduction between the lower portion of the mounting substrate 2 and the outside of the mounting substrate 2 at the end of the mounting substrate 2 in the light emitting device 10. It can prevent that the heat conductive sheet 7 resulting from the deformation amount difference of the sheet | seat 7 becoming large too much is damaged.

（実施形態３）
本実施形態の照明装置１２の基本構成は実施形態２と略同一であり、図６に示すように器具本体６の内底面には、発光装置１０の実装基板２を収納する第２の凹部６ｂを備えた点が相違する。なお、実施形態２と同様の構成要素には同一の符号を付して説明を適宜省略する。 (Embodiment 3)
The basic configuration of the illuminating device 12 of the present embodiment is substantially the same as that of the second embodiment, and the second recess 6b that houses the mounting substrate 2 of the light emitting device 10 is provided on the inner bottom surface of the fixture body 6 as shown in FIG. Is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted suitably.

器具本体６の内底面には、図６（ｂ）に示すように平面視形状が矩形状であり熱伝導シート７が収納される第１の凹部６ａと、第１の凹部６ａを内部に備え発光装置１０の実装基板２が収納される第１の凹部６ａと略相似形で第１の凹部６ａよりも大きい矩形の第２の凹部６ｂとを有している。第１の凹部６ａの深さ寸法は、熱伝導シート７の厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きく形成してある。また、第２の凹部６ｂの深さ寸法は、実装基板２の厚み寸法と略同一に形成してある（図６（ａ）参照）。   As shown in FIG. 6B, the inner bottom surface of the instrument body 6 has a first recess 6a in which the shape in plan view is rectangular and the heat conductive sheet 7 is accommodated, and a first recess 6a. The first concave portion 6a in which the mounting substrate 2 of the light emitting device 10 is accommodated has a rectangular second concave portion 6b that is substantially similar to the first concave portion 6a and is larger than the first concave portion 6a. The depth dimension of the 1st recessed part 6a is formed smaller than the thickness dimension of the heat conductive sheet 7, and larger than the dimension which the said heat conductive sheet plastically deforms. Moreover, the depth dimension of the 2nd recessed part 6b is formed substantially the same as the thickness dimension of the mounting substrate 2 (refer Fig.6 (a)).

平面視形状において略長方形である第２の凹部６ｂの内側には、実装基板２の四隅のうち対角方向で一対の螺子孔が設けられており、螺子孔に固定螺子６１で螺子止めすることで実装基板２を器具本体６に固定することができる。また、第２の凹部６ｂは、螺子孔近傍で固定螺子６１の螺子頭が第２の凹部６ｂの外周端と当接することを防止するために矩形状から外側に広がった円弧状の切欠部を設けている。   A pair of screw holes are provided in the diagonal direction among the four corners of the mounting substrate 2 inside the second recess 6b which is substantially rectangular in a plan view shape, and is fixed to the screw holes with a fixing screw 61. Thus, the mounting substrate 2 can be fixed to the instrument body 6. The second recess 6b has an arc-shaped notch that extends outward from the rectangular shape to prevent the screw head of the fixing screw 61 from coming into contact with the outer peripheral end of the second recess 6b in the vicinity of the screw hole. Provided.

また、平面視形状が長方形状である発光装置１０の実装基板２には、図６（ｃ）の平面図で示すように、固定螺子６１の螺子頭が当接できるように実装基板２の四隅のうち対角方向に一対設けられた螺子止用の面取部１５が形成され、器具本体６の螺子孔が隠れることを防いでいる（図示しない）。これにより、固定螺子６１を実装基板２の面取部１５を挟んで第２の凹部６ｂに設けられた螺子孔に締めこむと、実装基板２は、固定螺子６１の裏側が実装基板２の面取部１５に接触して器具本体６の内底面に固定される。なお、固定螺子６１にワッシャ１６を装着して螺子止した場合、実装基板２は、ワッシャ１６の一部により実装基板２の面取部１５に接触して器具本体６の内底面に固定されても良い。   Further, as shown in the plan view of FIG. 6C, the four corners of the mounting board 2 are arranged so that the screw heads of the fixing screws 61 can come into contact with the mounting board 2 of the light emitting device 10 having a rectangular shape in plan view. Among them, a pair of chamfering portions 15 for screwing provided diagonally is formed to prevent the screw holes of the instrument body 6 from being hidden (not shown). As a result, when the fixing screw 61 is tightened into the screw hole provided in the second recess 6 b with the chamfered portion 15 of the mounting substrate 2 interposed therebetween, the mounting substrate 2 has the back side of the fixing screw 61 facing the surface of the mounting substrate 2. It contacts with the taking part 15 and is fixed to the inner bottom surface of the instrument body 6. When the washer 16 is attached to the fixing screw 61 and screwed, the mounting board 2 comes into contact with the chamfered portion 15 of the mounting board 2 by a part of the washer 16 and is fixed to the inner bottom surface of the instrument body 6. Also good.

面取部１５の形状は、必ずしも実装基板２の隅部を直線形状に切り取った形状だけでなく（図６（ｃ）参照）、固定螺子６１が当接できるように実装基板２の内側に向かい円弧状に湾曲して切り取った形状でもよい（図６（ｄ）参照）。   The shape of the chamfered portion 15 is not necessarily limited to a shape obtained by cutting the corner of the mounting substrate 2 into a straight shape (see FIG. 6C), and is directed toward the inside of the mounting substrate 2 so that the fixing screw 61 can come into contact therewith. A shape that is curved and cut off in an arc shape may be used (see FIG. 6D).

本実施形態の照明装置１２においては、発光装置１０が第２の凹部６ｂに収納され、発光装置１０の実装基板２に対角状に設けられた面取部１５で固定螺子６１により螺子止するだけで、発光装置１０を照明装置１２の本体に固定することができる。そのため、器具本体６への発光装置１０の位置決めが容易となり、発光装置１０を固定する場合における簡素化により組み立てコストを低減することができる。   In the illuminating device 12 according to the present embodiment, the light emitting device 10 is housed in the second recess 6b, and is screwed by the fixing screw 61 at the chamfered portion 15 provided diagonally on the mounting substrate 2 of the light emitting device 10. Only, the light emitting device 10 can be fixed to the main body of the lighting device 12. Therefore, positioning of the light emitting device 10 to the instrument body 6 is facilitated, and assembly cost can be reduced by simplification when the light emitting device 10 is fixed.

また、面取部１５を用いて固定螺子６１により螺子止しているため、実装基板２の縁となる最端部に固定螺子６１の螺子止箇所を設けることができる。そのため、実装基板２に螺子孔を設ける必要もなく、螺子孔周辺の実装基板２の強度を考慮する必要がない。そのため、実装基板２上に発光素子１に給電するための配線パターンが形成可能な面積を広くすることができ、配線パターンの自由度を向上させることができる。また、実装基板２の縁となる最端部が、螺子止め固定箇所として機能することにより、実装基板２をより小型化することもできる。   Further, since the chamfered portion 15 is used to screw the fixing screw 61, the fixing screw 61 can be provided at the outermost end portion of the mounting substrate 2. Therefore, it is not necessary to provide a screw hole in the mounting substrate 2 and it is not necessary to consider the strength of the mounting substrate 2 around the screw hole. Therefore, the area in which a wiring pattern for supplying power to the light emitting element 1 can be formed on the mounting substrate 2 can be increased, and the degree of freedom of the wiring pattern can be improved. In addition, the mounting substrate 2 can be further reduced in size by the fact that the endmost portion that becomes the edge of the mounting substrate 2 functions as a screwing fixing portion.

（実施形態４）
本実施形態の照明装置１２は、実施形態２と略同一であり、図７に示すように器具本体６の内底面に設けられる凹部６ａの代わりに、発光装置１０の実装基板２の他表面となる裏面側に熱伝導シート７を収納可能な凹部６ａを設けた点が相違する。 (Embodiment 4)
The illuminating device 12 of the present embodiment is substantially the same as that of the second embodiment, and instead of the recess 6a provided on the inner bottom surface of the instrument body 6, as shown in FIG. The point which provided the recessed part 6a which can accommodate the heat conductive sheet 7 in the back surface side which becomes is different.

本実施形態の照明装置１２は、図７で示すように、器具本体６と当接する実装基板２の他表面側には、平面視形状が長方形状の実装基板２の中央に熱伝導シート７が収納可能な矩形状の凹部６ａを設けている。実装基板２の他表面側に設けられた凹部６ａの深さ寸法は、熱伝導シート７の厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きく形成されている。実装基板２の四隅となる隅部に４本の固定螺子６１を器具本体６に螺子止め固定すると、実装基板２の他表面と器具本体６の内底面との間で熱伝導シート７が圧接されることになる。   As shown in FIG. 7, the lighting device 12 of the present embodiment has a heat conductive sheet 7 at the center of the mounting substrate 2 having a rectangular shape in plan view on the other surface side of the mounting substrate 2 in contact with the instrument body 6. A rectangular recess 6a that can be stored is provided. The depth dimension of the recess 6 a provided on the other surface side of the mounting substrate 2 is smaller than the thickness dimension of the heat conductive sheet 7 and larger than the dimension in which the heat conductive sheet is plastically deformed. When four fixing screws 61 are screwed and fixed to the instrument body 6 at the four corners of the mounting substrate 2, the heat conductive sheet 7 is pressed between the other surface of the mounting substrate 2 and the inner bottom surface of the instrument body 6. Will be.

なお、本実施形態においては、発光装置１０側に凹部６ａを設けることで、発光装置１０は、予め凹部６ａ内に熱伝導シート７が設けた一体構成とすることもでき、取扱を容易にすることもできる。   In the present embodiment, by providing the concave portion 6a on the light emitting device 10 side, the light emitting device 10 can be configured in advance with the heat conductive sheet 7 provided in the concave portion 6a, thereby facilitating handling. You can also.

（実施形態５）
本実施形態の照明装置１２は、実施形態２と略同一であり、図８に示すように、器具本体６の内底面および発光装置１０の実装基板２の他表面となる裏面側に熱伝導シート７を収納可能な凹部６ａをそれぞれ設けた点が相違する。 (Embodiment 5)
The illuminating device 12 of this embodiment is substantially the same as Embodiment 2, and as shown in FIG. 8, a heat conductive sheet is provided on the inner bottom surface of the instrument main body 6 and the back surface side that is the other surface of the mounting substrate 2 of the light emitting device 10. 7 is different from each other in that recesses 6a capable of storing 7 are provided.

本実施形態では、器具本体６の内底面および実装基板２の他表面側に凹部６ａがそれぞれ設けられ、熱伝導シート７が収納されている。平面視形状においては、それぞれの凹部６ａ，６ａの形状は、略同一形状であり、発光装置１０を器具本体６に固定する場合における開口端も合わせてある（図示せず）。また、器具本体６の内底面および実装基板２の他表面側に設けられた凹部６ａの深さ寸法の合計は、内部に収納される熱伝導シート７の厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きくしてあり、実装基板２を器具本体６に複数の固定螺子６１で固定することで熱伝導シート７が圧接される。   In the present embodiment, recesses 6 a are provided on the inner bottom surface of the instrument body 6 and the other surface side of the mounting substrate 2, and the heat conductive sheet 7 is accommodated. In the plan view shape, the shape of each of the recesses 6a, 6a is substantially the same, and the opening end when the light emitting device 10 is fixed to the instrument body 6 is also matched (not shown). Moreover, the sum total of the depth dimension of the recessed part 6a provided in the inner bottom face of the instrument main body 6 and the other surface side of the mounting substrate 2 is smaller than the thickness dimension of the heat conductive sheet 7 accommodated inside, and the said heat conductive sheet is. The size is larger than the dimension to be plastically deformed, and the mounting plate 2 is fixed to the instrument main body 6 with a plurality of fixing screws 61 so that the heat conductive sheet 7 is pressed.

なお、本実施形態においては、器具本体６に凹部６ａが形成されていることで、熱伝導シート７を器具本体６上に配置しやすい。また、発光装置１０は、実装基板２の他表面側に凹部６ａが設けられていることで、器具本体６の凹部６ａから突出した熱伝導シート７をガイドとして発光装置１０を実装しやすくなる。   In addition, in this embodiment, since the recessed part 6a is formed in the instrument main body 6, it is easy to arrange | position the heat conductive sheet 7 on the instrument main body 6. FIG. Further, since the light emitting device 10 is provided with the concave portion 6a on the other surface side of the mounting substrate 2, the light emitting device 10 can be easily mounted using the heat conductive sheet 7 protruding from the concave portion 6a of the instrument body 6 as a guide.

実施形態１の照明装置の概略断面図である。It is a schematic sectional drawing of the illuminating device of Embodiment 1. FIG. 同上の要部構成を示し、（ａ）は断面図、（ｂ）は平面図である。The main part structure same as the above is shown, (a) is sectional drawing, (b) is a top view. 同上の他の要部構成を示し、（ａ）は断面図、（ｂ）は平面図である。The other principal part structure same as the above is shown, (a) is sectional drawing, (b) is a top view. 同上の他の要部構成を示し、（ａ）は断面図、（ｂ）は平面図である。The other principal part structure same as the above is shown, (a) is sectional drawing, (b) is a top view. 実施形態２の要部構成を示し、（ａ）は断面図、（ｂ）は平面図である。The principal part structure of Embodiment 2 is shown, (a) is sectional drawing, (b) is a top view. 実施形態３の要部構成を示し、（ａ）は断面図、（ｂ）は平面図、（ｃ）および（ｄ）は発光装置の略平面図である。The principal part structure of Embodiment 3 is shown, (a) is sectional drawing, (b) is a top view, (c) And (d) is a schematic plan view of a light-emitting device. 実施形態４の要部構成を示し、（ａ）は断面図、（ｂ）は平面図である。The principal part structure of Embodiment 4 is shown, (a) is sectional drawing, (b) is a top view. 実施形態５の要部構成の概略断面図である。FIG. 10 is a schematic cross-sectional view of a main part configuration of Embodiment 5. 参考のための照明装置の要部構成を示す。The principal part structure of the illuminating device for reference is shown.

符号の説明Explanation of symbols

１ 発光素子
２ 実装基板
６ 器具本体
６ａ 凹部
７ 熱伝導シート
１０ 発光装置
１２ 照明装置
６１ 固定螺子（固定具） DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Mounting board 6 Instrument main body 6a Recessed part 7 Heat conduction sheet 10 Light emitting device 12 Illuminating device 61 Fixing screw (fixing tool)

Claims (3)

発光素子が実装基板の一表面側に実装された発光装置と、該発光装置の実装基板を器具本体に固定させる複数個の固定具と、前記実装基板の他表面と前記器具本体との間に介在し前記複数個の固定具により実装基板を器具本体に固定することにより実装基板の他表面と器具本体との両方に圧接される熱伝導シートとを有する照明装置であって、
平面視において前記実装基板に実装された前記発光素子を前記器具本体側へ向けて投影した領域を含み、前記実装基板の他表面、もしくは前記器具本体の少なくとも一方に、前記熱伝導シートを収納する凹部が設けられ、該凹部は、平面視形状において前記熱伝導シートよりも大きく、且つ、深さ寸法が前記熱伝導シートの厚み寸法よりも小さく前記熱伝導シートが塑性変形する寸法よりも大きいことを特徴とする照明装置。 A light emitting device having a light emitting element mounted on one surface side of the mounting substrate, a plurality of fixtures for fixing the mounting substrate of the light emitting device to the instrument body, and between the other surface of the mounting substrate and the instrument body A lighting device having a heat conductive sheet pressed against both the other surface of the mounting substrate and the instrument body by fixing the mounting substrate to the instrument body with the plurality of fixtures interposed,
The region includes a region in which the light emitting element mounted on the mounting substrate is projected toward the instrument main body in a plan view, and the thermal conductive sheet is stored on at least one of the other surface of the mounting substrate or the instrument main body. A recess is provided, and the recess is larger in plan view than the heat conductive sheet, and the depth dimension is smaller than the thickness dimension of the heat conductive sheet and larger than the dimension in which the heat conductive sheet is plastically deformed. A lighting device characterized by. 前記凹部は、平面視形状において前記実装基板よりも小さく、且つ前記実装基板の他表面側で覆われていることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein the concave portion is smaller than the mounting substrate in a plan view and is covered on the other surface side of the mounting substrate. 前記実装基板は、セラミック基板であって、前記熱伝導シートは、シリコーン樹脂あるいはアクリル系樹脂中に熱伝導性フィラーが含有されてなることを特徴とする請求項１または請求項２に記載の照明装置。
3. The illumination according to claim 1, wherein the mounting substrate is a ceramic substrate, and the heat conductive sheet contains a heat conductive filler in a silicone resin or an acrylic resin. 4. apparatus.
JP2008326407A 2008-12-22 2008-12-22 Lighting device Active JP5285417B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008326407A JP5285417B2 (en) 2008-12-22 2008-12-22 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008326407A JP5285417B2 (en) 2008-12-22 2008-12-22 Lighting device

Publications (2)

Publication Number Publication Date
JP2010147000A true JP2010147000A (en) 2010-07-01
JP5285417B2 JP5285417B2 (en) 2013-09-11

Family

ID=42567168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008326407A Active JP5285417B2 (en) 2008-12-22 2008-12-22 Lighting device

Country Status (1)

Country Link
JP (1) JP5285417B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102466162A (en) * 2010-11-18 2012-05-23 东芝照明技术株式会社 Lamp unit and lighting fixture
JP2012160335A (en) * 2011-01-31 2012-08-23 Toshiba Lighting & Technology Corp Lamp device and lighting fixture
JP2012182192A (en) * 2011-02-28 2012-09-20 Panasonic Corp Led unit and lighting apparatus using the same
WO2013039081A1 (en) * 2011-09-14 2013-03-21 株式会社日本触媒 Thermally conductive material
EP2481973A3 (en) * 2011-01-31 2013-04-17 Toshiba Lighting & Technology Corporation Lamp apparatus and luminaire
KR101261584B1 (en) 2011-02-15 2013-06-07 (주) 탑엘이디 LED lighting that light distribution is excellent
JP2014502062A (en) * 2011-01-09 2014-01-23 ブリッジラックス・インコーポレーテッド Photon configuration device with only top connection
JP2015529939A (en) * 2012-07-23 2015-10-08 グイジョウ ジーゼットジーピーエス カンパニー・リミテッド General-purpose LED bulb construction method, flange inner snap ring type LED bulb and its lamp
US9653437B2 (en) 2011-01-09 2017-05-16 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
JP2018110123A (en) * 2018-02-15 2018-07-12 日本精機株式会社 Lighting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183582A (en) * 2003-12-18 2005-07-07 Nec Corp Heat dissipating structure of semiconductor element and heatsink
JP2007150268A (en) * 2005-10-31 2007-06-14 Toyoda Gosei Co Ltd Light emitting device
JP2008040412A (en) * 2006-08-10 2008-02-21 Matsushita Electric Ind Co Ltd Image display device
JP4138863B1 (en) * 2008-02-22 2008-08-27 利男 平塚 Lighting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183582A (en) * 2003-12-18 2005-07-07 Nec Corp Heat dissipating structure of semiconductor element and heatsink
JP2007150268A (en) * 2005-10-31 2007-06-14 Toyoda Gosei Co Ltd Light emitting device
JP2008040412A (en) * 2006-08-10 2008-02-21 Matsushita Electric Ind Co Ltd Image display device
JP4138863B1 (en) * 2008-02-22 2008-08-27 利男 平塚 Lighting device

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2455651A3 (en) * 2010-11-18 2013-02-20 Toshiba Lighting & Technology Corporation Lamp unit and lighting fixture
JP2012109157A (en) * 2010-11-18 2012-06-07 Toshiba Lighting & Technology Corp Lamp device and lighting fixture
CN102466162A (en) * 2010-11-18 2012-05-23 东芝照明技术株式会社 Lamp unit and lighting fixture
CN102466162B (en) * 2010-11-18 2014-07-02 东芝照明技术株式会社 Lamp unit and lighting fixture
US9985004B2 (en) 2011-01-09 2018-05-29 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US9653437B2 (en) 2011-01-09 2017-05-16 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US11411152B2 (en) 2011-01-09 2022-08-09 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure
US10840424B2 (en) 2011-01-09 2020-11-17 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure
US10347807B2 (en) 2011-01-09 2019-07-09 Bridgelux Inc. Packaging photon building blocks with top side connections and interconnect structure
JP2014502062A (en) * 2011-01-09 2014-01-23 ブリッジラックス・インコーポレーテッド Photon configuration device with only top connection
US10325890B2 (en) 2011-01-09 2019-06-18 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US9893039B2 (en) 2011-01-09 2018-02-13 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US8894254B2 (en) 2011-01-31 2014-11-25 Toshiba Lighting & Technology Corporation Luminaire and lamp apparatus housing
JP2012160335A (en) * 2011-01-31 2012-08-23 Toshiba Lighting & Technology Corp Lamp device and lighting fixture
EP2481973A3 (en) * 2011-01-31 2013-04-17 Toshiba Lighting & Technology Corporation Lamp apparatus and luminaire
KR101261584B1 (en) 2011-02-15 2013-06-07 (주) 탑엘이디 LED lighting that light distribution is excellent
JP2012182192A (en) * 2011-02-28 2012-09-20 Panasonic Corp Led unit and lighting apparatus using the same
WO2013039081A1 (en) * 2011-09-14 2013-03-21 株式会社日本触媒 Thermally conductive material
JP2013225636A (en) * 2011-09-14 2013-10-31 Nippon Shokubai Co Ltd Thermoconductive material
JP2015529939A (en) * 2012-07-23 2015-10-08 グイジョウ ジーゼットジーピーエス カンパニー・リミテッド General-purpose LED bulb construction method, flange inner snap ring type LED bulb and its lamp
JP2018110123A (en) * 2018-02-15 2018-07-12 日本精機株式会社 Lighting device

Also Published As

Publication number Publication date
JP5285417B2 (en) 2013-09-11

Similar Documents

Publication Publication Date Title
JP5285417B2 (en) Lighting device
JP5327601B2 (en) Light emitting module and lighting device
JP3998027B2 (en) Lighting equipment using LED
TWI411747B (en) Light illumination device
JP5830697B2 (en) Lamp and lighting device
WO2007072919A1 (en) Illumination instrument using led
JP2006331817A (en) Light emitting device and luminaire using it
JP4715895B2 (en) Lighting equipment
JP2009071254A (en) Light-emitting device
JP5330985B2 (en) lighting equipment
JP2011014535A (en) Lighting system
JP2011054759A (en) Wavelength converting member-holding member and method of manufacturing the same, heat radiation structure of the wavelength converting member, and light-emitting device
JP2009037796A (en) Light source and illuminating device
JP5757214B2 (en) LED lighting device
JP5563407B2 (en) LED lighting unit
JP2007311760A (en) Led module
JP2011040238A (en) Led downlight lighting system
JP4816394B2 (en) Spotlight
JP2009277843A (en) Light-emitting device, illuminating apparatus with the same, and back light for liquid crystal display
JP5530321B2 (en) Lamp and lighting device
JP2009245643A (en) Lighting system
JP2012074148A (en) Light-emitting device and lighting fixture equipped with the same
JP2009076494A (en) Light emitting device
WO2013132566A1 (en) Lamp and illuminating apparatus
US8581278B2 (en) Light-emitting diode packaging structure

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100715

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110824

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120113

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130108

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130311

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130507

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130531

R150 Certificate of patent or registration of utility model

Ref document number: 5285417

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150