JP5563407B2 - LED lighting unit - Google Patents

LED lighting unit Download PDF

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JP5563407B2
JP5563407B2 JP2010189951A JP2010189951A JP5563407B2 JP 5563407 B2 JP5563407 B2 JP 5563407B2 JP 2010189951 A JP2010189951 A JP 2010189951A JP 2010189951 A JP2010189951 A JP 2010189951A JP 5563407 B2 JP5563407 B2 JP 5563407B2
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circuit board
lighting unit
led lighting
led
translucent member
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JP2012048969A (en
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高明 片岡
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Description

本発明は、発光ダイオード(LED)チップを実装した回路基板に放熱部材が取り付けられたLED照明ユニットに関する。   The present invention relates to an LED lighting unit in which a heat dissipation member is attached to a circuit board on which a light emitting diode (LED) chip is mounted.

従来の、この種のLED照明ユニットについて図6、図7を参照して説明する。図6に示すように、LED照明ユニット100は、LEDチップ101が表面に実装された回路基板102と、この回路基板102の表面を覆う透光性部材103と、回路基板102の背面に設けられた放熱部材104とを備えている。透光性部材103は、LEDチップ101から出射される光を集光するレンズ部105と、レンズ部105を保持するレンズホルダ106から成り、アクリルなどの樹脂を用いて形成される。レンズホルダ106には、回路基板102の周縁部分と当接される鍔部107が形成されている。この鍔部107のビス孔にビス108を通して、放熱部材104に透光性部材103を締結することにより、回路基板102が透光性部材103と放熱部材104とでハウジングされる。   A conventional LED lighting unit of this type will be described with reference to FIGS. As shown in FIG. 6, the LED lighting unit 100 is provided on the circuit board 102 on which the LED chip 101 is mounted, a translucent member 103 that covers the surface of the circuit board 102, and the back surface of the circuit board 102. The heat radiating member 104 is provided. The translucent member 103 includes a lens portion 105 that collects light emitted from the LED chip 101 and a lens holder 106 that holds the lens portion 105, and is formed using a resin such as acrylic. The lens holder 106 is formed with a flange 107 that comes into contact with the peripheral portion of the circuit board 102. The circuit board 102 is housed by the translucent member 103 and the heat radiating member 104 by fastening the translucent member 103 to the heat radiating member 104 through the screw 108 in the screw hole of the flange portion 107.

このような従来のLED照明ユニット100においては、回路基板102を放熱部材104に押し付けるために、放熱部材104と鍔部107との間には所定の隙間dが必要となる。この隙間dは、回路基板102や透光性部材103の製造誤差により所望の寸法より大きくなることがある。このような状況下で透光性部材103を放熱部材104にビス108で締結しようすると、図7に示すように、鍔部107は大きく変形して割れが生じ易く、ビス108を強く締め付けることが難しい。そのため、回路基板102を放熱部材104に密着させることができないことがあり、回路基板102と放熱部材104との間に熱抵抗が生じて、LEDチップ101から発生する熱を十分に放熱することができないことがあった。   In such a conventional LED lighting unit 100, a predetermined gap d is required between the heat dissipation member 104 and the flange portion 107 in order to press the circuit board 102 against the heat dissipation member 104. This gap d may be larger than a desired dimension due to manufacturing errors of the circuit board 102 and the translucent member 103. If the translucent member 103 is fastened to the heat radiating member 104 with the screw 108 under such circumstances, the flange portion 107 is greatly deformed and easily cracked as shown in FIG. difficult. Therefore, the circuit board 102 may not be brought into close contact with the heat radiating member 104, and a thermal resistance is generated between the circuit board 102 and the heat radiating member 104, so that the heat generated from the LED chip 101 can be sufficiently radiated. There was something I couldn't do.

また、LED照明ユニットの他の例として、LEDチップが実装された回路基板を放熱部材にビスで直接固定するものがある(例えば、特許文献1参照)。ところが、このような構成では、回路基板にビス穴用のスペースが必要となり、基板サイズが上記のものより大きくなる。   Another example of the LED lighting unit is one in which a circuit board on which an LED chip is mounted is directly fixed to a heat radiating member with screws (see, for example, Patent Document 1). However, in such a configuration, a space for screw holes is required on the circuit board, and the board size becomes larger than the above.

特開2007−220465号公報JP 2007-220465 A

本発明は、上記問題を解決するためになされたものであり、LEDチップを実装した回路基板を透光性部材と放熱部材との締結により固定するLED照明ユニットにおいて、回路基板の放熱部材への密着性を高めてLEDの放熱特性を向上することを目的とする。   The present invention has been made to solve the above problems, and in an LED lighting unit that fixes a circuit board on which an LED chip is mounted by fastening a light-transmitting member and a heat radiating member, the circuit board is attached to the heat radiating member. It aims at improving the heat dissipation characteristic of LED by improving adhesiveness.

本発明のLED照明ユニットは、LEDチップが表面に実装された回路基板と、前記回路基板の表面を覆う、前記LEDチップから出射される光が通る透光性部材と、前記回路基板の背面に取り付けられる放熱部材とを備えたLED照明ユニットにおいて、前記回路基板の外側に設けられ、前記放熱部材に前記透光性部材をビス止めにより締結する締結手段と、前記締結手段の内側に設けられ、前記締結手段により前記放熱部材に前記透光性部材が締結された状態で前記回路基板と透光性部材との間に挟み込まれる弾性部材とを備え、前記弾性部材は、前記締結手段が締結状態にあるとき弾性変形され、その反発力により前記回路基板を前記放熱部材に押し付けるように作用することを特徴とする。 The LED lighting unit of the present invention includes a circuit board on which an LED chip is mounted, a translucent member that covers the surface of the circuit board and through which light emitted from the LED chip passes, and a back surface of the circuit board. In the LED lighting unit provided with a heat radiating member to be attached , provided on the outer side of the circuit board, fastening means for fastening the light transmissive member to the heat radiating member with screws , provided on the inner side of the fastening means, An elastic member sandwiched between the circuit board and the translucent member in a state in which the translucent member is fastened to the heat radiating member by the fastening means, and the elastic member is in a state in which the fastening means is fastened The circuit board is elastically deformed and acts to press the circuit board against the heat radiating member by the repulsive force.

このLED照明ユニットにおいて、前記回路基板は、熱伝導性の高い金属板と、この金属板上に被覆形成した絶縁膜と、この絶縁膜上に形成した、前記LEDチップを実装するための回路パターンとを備えることが好ましい。   In the LED lighting unit, the circuit board includes a metal plate having high thermal conductivity, an insulating film formed on the metal plate, and a circuit pattern for mounting the LED chip formed on the insulating film. It is preferable to comprise.

このLED照明ユニットにおいて、前記回路基板と前記放熱部材との当接面は平滑化されていることが好ましい。   In this LED lighting unit, it is preferable that the contact surface between the circuit board and the heat dissipation member is smoothed.

このLED照明ユニットにおいて、前記回路基板と放熱部材との間に、熱伝導率の高いグリスを介在したことが好ましい。   In this LED lighting unit, it is preferable that grease having high thermal conductivity be interposed between the circuit board and the heat dissipation member.

本発明のLED照明ユニットによれば、回路基板と透光性部材との間に挟み込まれた弾性部材の反発力で、回路基板を放熱部材に押し付けて両者を密着させることができるので、回路基板と放熱部材間での熱抵抗を低減し、LEDチップから発生する熱を放熱部材を通して効率良く放熱することが可能となる。また、LEDチップの放熱性が良くなることで、LEDチップにより大きな電流を流すことができ、光出力の高出力化が図れる。また、回路基板を透光性部材と放熱部材とでハウジングしてLEDチップを外部から保護することができるので、物理的衝撃によるLEDの破損や、人体接触によるLEDの静電気破壊を防止することができる。また、透光性部材や回路基板の製造バラツキによる寸法誤差を弾性部材により吸収しつつ回路基板をハウジングすることができるので、放熱部材と透光性部材とを強く締め付けたとしても、透光性部材に変形や割れが生じることが低減される。   According to the LED lighting unit of the present invention, the circuit board can be pressed against the heat dissipating member by the repulsive force of the elastic member sandwiched between the circuit board and the translucent member, so that both can be brought into close contact with each other. It is possible to reduce the thermal resistance between the heat radiating member and efficiently radiate the heat generated from the LED chip through the heat radiating member. Further, since the heat dissipation of the LED chip is improved, a large current can be passed through the LED chip, and the light output can be increased. In addition, since the circuit board can be housed with a translucent member and a heat radiating member to protect the LED chip from the outside, it is possible to prevent damage to the LED due to physical impact or electrostatic breakdown of the LED due to human contact. it can. In addition, since the circuit board can be housed while absorbing the dimensional error due to manufacturing variations of the translucent member and the circuit board by the elastic member, even if the heat radiating member and the translucent member are strongly tightened, the translucency The deformation and cracking of the member are reduced.

本発明の一実施形態に係るLED照明ユニットを天井に装着した状態を下方から視た外観図。The external view which looked at the state which mounted | wore the ceiling with the LED lighting unit which concerns on one Embodiment of this invention from the downward direction. 同ユニットの部分断面側面図。The partial cross section side view of the unit. 同ユニットの、LEDチップを実装した回路基板の側断面図。The sectional side view of the circuit board which mounted the LED chip of the unit. (a)は同ユニットの透光性部材をパッキンを介して回路基板に取り付けた状態での側断面図、(b)は透光性部材が取り付けれた回路基板を器具本体に載置した状態での側断面図、(c)は器具本体に透光性部材をビスにより締結した状態での側断面図。(A) is a sectional side view of the unit with the translucent member attached to the circuit board through the packing, and (b) is a state in which the circuit board with the translucent member attached is placed on the instrument body. (C) is a sectional side view in the state which fastened the translucent member to the instrument main body with the bis | screw. (a)乃至(c)は上記LED照明ユニットの変形例を示す側断面図。(A) thru | or (c) is a sectional side view which shows the modification of the said LED illumination unit. 従来のLED照明ユニットの側断面図。The sectional side view of the conventional LED lighting unit. 同ユニットの透光性部材に割れた生じた状態を示す、図6のX部の拡大図。The enlarged view of the X section of FIG. 6 which shows the state which the crack occurred in the translucent member of the unit.

本発明の一実施形態に係るLED照明ユニットについて図1乃至図4を参照して説明する。図1、図2に示すように、LED照明ユニット1は、ダウンライト型の照明器具であって、オフィスや工場など建物の天井部分に埋設されて使用される。LED照明ユニット1は、複数のLEDチップ2が表面に実装された回路基板3と、この回路基板3の表面を覆いLEDチップ2から出射される光が通る透光性部材4と、回路基板3を保持する器具本体5とを備える。器具本体5は、回路基板3の背面に放熱部材として取り付けられ、LEDチップ2から発生した熱を放散させるものとなっている。この器具本体5には、LEDチップ2から出射される光を反射する反射板6が設けられている。   An LED lighting unit according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the LED lighting unit 1 is a downlight type lighting fixture and is used by being embedded in a ceiling portion of a building such as an office or a factory. The LED lighting unit 1 includes a circuit board 3 on which a plurality of LED chips 2 are mounted, a translucent member 4 that covers the surface of the circuit board 3 and through which light emitted from the LED chip 2 passes, and a circuit board 3. And an instrument body 5 for holding the device. The appliance main body 5 is attached to the back surface of the circuit board 3 as a heat radiating member, and dissipates heat generated from the LED chip 2. The fixture body 5 is provided with a reflector 6 that reflects light emitted from the LED chip 2.

また、LED照明ユニット1は、器具本体5に透光性部材4を締結するビス7(締結手段)と、回路基板3と透光性部材4との間に設けられる弾力性を有したパッキン8(弾性部材)とを備える。さらに、LED照明ユニット1は、ユニットを天井9に固定するための保持具10を有し、天井9の開口9aにユニットを挿入したときに保持具10が開口9aの周縁を挟持するようになっている。この保持具10は、反射板6の光出射側の外縁部分に設けられている。   Further, the LED lighting unit 1 includes a screw 7 (fastening means) that fastens the translucent member 4 to the fixture body 5 and an elastic packing 8 provided between the circuit board 3 and the translucent member 4. (Elastic member). Furthermore, the LED lighting unit 1 has a holder 10 for fixing the unit to the ceiling 9, and when the unit is inserted into the opening 9a of the ceiling 9, the holder 10 holds the periphery of the opening 9a. ing. The holder 10 is provided at an outer edge portion of the light emitting side of the reflecting plate 6.

LEDチップ2は、例えば、白色のLEDチップを用いることができ、この場合、青色に発光するLED素子に、青色光を黄色光に波長変換する蛍光体を封止したものを用いるとよい。LEDチップ2の発光色は白色に限定されず、例えば、黄色や橙色などであってもよい。また、LEDチップ2の数量は特に限定されるものでなく、ユニット1の仕様に応じて適宜設定すればよい。   For example, a white LED chip can be used as the LED chip 2. In this case, a LED element that emits blue light and a phosphor that converts the wavelength of blue light into yellow light is preferably used. The emission color of the LED chip 2 is not limited to white, and may be, for example, yellow or orange. Further, the number of LED chips 2 is not particularly limited, and may be set as appropriate according to the specifications of the unit 1.

透光性部材4は、LEDチップ2からの出射光を集光するレンズ部41と、レンズ部41を保持するレンズホルダ42を有し、例えば、アクリルやポリカーボネイドなどの透光樹脂を用いて形成される。レンズ部41とレンズホルダ42とは一体形成されていてもよいし、互いに分離できるように形成されていてもよい。レンズ部41は、光取り出し方向と反対方向に凸状であるハイブリット型のレンズ体で構成され、複数のLEDチップ2のそれぞれに対応して配置されている。レンズホルダ42には、レンズ部41から離れる方向に延在した鍔部43が形成されており、この鍔部43はビス7の通る貫通穴を有する。   The translucent member 4 includes a lens portion 41 that collects light emitted from the LED chip 2 and a lens holder 42 that holds the lens portion 41, and is formed using a translucent resin such as acrylic or polycarbonate. Is done. The lens part 41 and the lens holder 42 may be integrally formed, or may be formed so as to be separable from each other. The lens portion 41 is configured by a hybrid lens body that is convex in a direction opposite to the light extraction direction, and is disposed corresponding to each of the plurality of LED chips 2. The lens holder 42 is formed with a flange portion 43 extending in a direction away from the lens portion 41, and the flange portion 43 has a through hole through which the screw 7 passes.

器具本体5は、放熱性に優れた部材、例えばアルミを用いて形成される。器具本体5にアルミ材料を用いる場合、器具本体5の形成方法は、ダイキャスト法を用いることができる。器具本体5は、略円筒状の外形とされ、その底部51にビス7用のネジ穴を有する。器具本体5と回路基板3との当接面は、バフ処理などより平滑化することが好ましい。これにより、回路基板3及び器具本体5の表面は、成型時には無数の凹凸が存在するが、このような凹凸を無くして、器具本体5と回路基板3とを、空気層を介在させることなく当接でき、熱抵抗を低減することが可能となる。器具本体5の外周部分には、放熱用のフィン52が複数設けられている。器具本体5の天板部分53には、LEDチップ2を点灯させるための電源装置11が設けられ、この電源装置11は、回路基板3と電源線12により接続される。   The instrument body 5 is formed using a member having excellent heat dissipation, such as aluminum. When an aluminum material is used for the instrument body 5, a die casting method can be used as a method for forming the instrument body 5. The instrument body 5 has a substantially cylindrical outer shape, and has a screw hole for the screw 7 at the bottom 51 thereof. The contact surface between the instrument body 5 and the circuit board 3 is preferably smoothed by buffing or the like. As a result, the surfaces of the circuit board 3 and the instrument body 5 have innumerable irregularities at the time of molding. However, such irregularities are eliminated so that the instrument body 5 and the circuit board 3 can be contacted without interposing an air layer. The thermal resistance can be reduced. A plurality of heat radiation fins 52 are provided on the outer peripheral portion of the instrument body 5. The top plate portion 53 of the instrument body 5 is provided with a power supply device 11 for lighting the LED chip 2, and the power supply device 11 is connected to the circuit board 3 by the power supply line 12.

パッキン8は、ビス7により器具本体5に透光性部材4が締結された状態で回路基板3と透光性部材4の鍔部43との間に挟み込まれるものとなっており、ここでは、リング状のものを用いている。パッキン8の材料には、例えば、発砲シリコンを用いることができる。パッキン8は、ビス7が締結状態にあるとき弾性変形され、その反発力により回路基板3を器具本体5に押し付けるように作用する。   The packing 8 is sandwiched between the circuit board 3 and the flange portion 43 of the translucent member 4 in a state where the translucent member 4 is fastened to the instrument main body 5 by screws 7, A ring-shaped one is used. For example, foamed silicon can be used as the material of the packing 8. The packing 8 is elastically deformed when the screw 7 is in a fastened state, and acts to press the circuit board 3 against the instrument body 5 by its repulsive force.

回路基板3は、図3に示すように、熱伝導性の高い金属板31と、この金属板31上に被覆形成した絶縁膜32と、この絶縁膜32上に形成した、LEDチップ2を実装するための回路パターン33とを有している。金属板31は、例えば、アルミ材料を用いて形成される。回路パターン33は、例えば、チタン(Ti)や金(Au)、銅(Cu)などの金属膜から成り、LEDチップ2の電極部21と電気接続される。回路パターン33の形成には、例えば、蒸着法やメッキ法、印刷法などを用いることができる。このような回路基板3を用いることにより、LEDチップ2から発生した熱を器具本体5に効率良く伝導し、LEDチップ2の放熱特性を高めることができる。   As shown in FIG. 3, the circuit board 3 is mounted with a metal plate 31 with high thermal conductivity, an insulating film 32 formed on the metal plate 31, and an LED chip 2 formed on the insulating film 32. And a circuit pattern 33 for this purpose. The metal plate 31 is formed using, for example, an aluminum material. The circuit pattern 33 is made of, for example, a metal film such as titanium (Ti), gold (Au), or copper (Cu), and is electrically connected to the electrode portion 21 of the LED chip 2. For the formation of the circuit pattern 33, for example, a vapor deposition method, a plating method, a printing method, or the like can be used. By using such a circuit board 3, heat generated from the LED chip 2 can be efficiently conducted to the instrument body 5 and the heat dissipation characteristics of the LED chip 2 can be enhanced.

次に、上記のように構成されたLED照明ユニット1において器具本体5に回路基板3と透光性部材4とを取り付ける手順を図4を用いて説明する。まず、図4(a)に示すように、LEDチップ2を実装した回路基板3と透光性部材4の鍔部43との間にパッキン8を配置し、回路基板3と透光性部材4とを接着材を用いてパッキン8に接着保持して、回路基板3に透光性部材4を係留するようにしておく。次に、図4(b)に示すように、回路基板3を器具本体5の底部51の取り付け面に載置する。このとき、回路基板3と器具本体5との間に、熱伝導率の高いグリスを介在させるようにすれば、回路基板3と器具本体5間での熱抵抗を軽減することができる。そして、ビス7を鍔部43の貫通穴に通してビス7の締め付けを行う。ここに、ビス7を締め付ける前では、鍔部43の端部と器具本体5との間に隙間dが設けられる。このビス7の締め付けにより、図4(c)に示すように、パッキン8が収縮し、同時にパッキン8の弾性力により回路基板3が器具本体5に押し付けられる。ビス7が完全に締め付けられたとき、隙間dがなくなり、鍔部43の端部が器具本体5に当接される。   Next, a procedure for attaching the circuit board 3 and the translucent member 4 to the fixture body 5 in the LED lighting unit 1 configured as described above will be described with reference to FIG. First, as shown in FIG. 4A, the packing 8 is disposed between the circuit board 3 on which the LED chip 2 is mounted and the flange portion 43 of the translucent member 4, and the circuit board 3 and the translucent member 4. Are bonded to the packing 8 using an adhesive, and the translucent member 4 is anchored to the circuit board 3. Next, as shown in FIG. 4B, the circuit board 3 is placed on the attachment surface of the bottom 51 of the instrument body 5. At this time, if a high thermal conductivity grease is interposed between the circuit board 3 and the instrument body 5, the thermal resistance between the circuit board 3 and the instrument body 5 can be reduced. Then, the screw 7 is passed through the through hole of the flange portion 43 to tighten the screw 7. Here, before the screw 7 is tightened, a gap d is provided between the end of the flange 43 and the instrument body 5. By tightening the screw 7, the packing 8 contracts as shown in FIG. 4C, and at the same time, the circuit board 3 is pressed against the instrument body 5 by the elastic force of the packing 8. When the screw 7 is completely tightened, the gap d is eliminated, and the end of the flange 43 is brought into contact with the instrument body 5.

このように本実施形態に係るLED照明ユニット1によれば、回路基板3と透光性部材4との間に挟み込まれた弾性部材の反発力で、回路基板3を器具本体5に押し付けて両者を密着させることができるので、回路基板3と器具本体5間での熱抵抗が低減され、LEDチップ2から発生する熱を器具本体5を通して効率良く放熱することが可能となる。また、LEDチップ2の放熱性が良くなることで、LEDチップ2により大きな電流を流すことができ、光出力の高出力化が図れる。また、回路基板3を透光性部材4と器具本体5とでハウジングしてLEDチップ2を外部から保護することができるので、器具の組み立てや補修の際、物理的衝撃によるLEDの破損や、人体接触によるLEDの静電気破壊を防止できる。また、透光性部材4や回路基板3の製造バラツキによる寸法誤差を弾性部材により吸収しつつ回路基板3をハウジングすることができるので、器具本体5と透光性部材4とを強く締め付けたとしても、透光性部材4に変形や割れが生じることが低減される。   As described above, according to the LED lighting unit 1 according to the present embodiment, the circuit board 3 is pressed against the instrument body 5 by the repulsive force of the elastic member sandwiched between the circuit board 3 and the translucent member 4. Since the heat resistance between the circuit board 3 and the instrument body 5 is reduced, the heat generated from the LED chip 2 can be efficiently radiated through the instrument body 5. Further, since the heat dissipation of the LED chip 2 is improved, a large current can be passed through the LED chip 2 and the light output can be increased. Further, since the circuit board 3 can be housed by the translucent member 4 and the instrument body 5 and the LED chip 2 can be protected from the outside, when assembling or repairing the instrument, The electrostatic breakdown of the LED due to human contact can be prevented. In addition, since the circuit board 3 can be housed while the dimensional error due to manufacturing variations of the translucent member 4 and the circuit board 3 is absorbed by the elastic member, the instrument body 5 and the translucent member 4 are strongly tightened. In addition, deformation and cracking of the translucent member 4 are reduced.

次に、図5を用いてLED照明ユニットの変形例について説明する。この変形例に係るLED照明ユニット1は、図5(a)に示すように、パッキン8に代えて、回路基板3の表面に設けられた一対の板バネから成るバネ体13を備える。透光性部材4の背面側には、バネ体13の板バネ間に挿入される係止片14が設けられる。この係止片14は、透光性部材4のレンズホルダ42から突出形成され、先端が凸状となっている。バネ体13は、各板バネが互いに対向配置され、かつ、これら板バネ間に挿入された係止片14の凸部を挟持できるように、互いの先端部分が袋状に屈曲された形となっている。このバネ体13は、銅などの金属を用いて形成されており、回路基板3の表面に半田付けなどにより固着される。   Next, a modification of the LED lighting unit will be described with reference to FIG. As shown in FIG. 5A, the LED lighting unit 1 according to this modification includes a spring body 13 including a pair of leaf springs provided on the surface of the circuit board 3 instead of the packing 8. A locking piece 14 to be inserted between the leaf springs of the spring body 13 is provided on the back side of the translucent member 4. The locking piece 14 is formed to project from the lens holder 42 of the translucent member 4 and has a convex tip. The spring body 13 has a configuration in which the respective leaf springs are arranged to face each other and the tip portions of each are bent into a bag shape so as to sandwich the convex portion of the locking piece 14 inserted between the leaf springs. It has become. The spring body 13 is formed using a metal such as copper, and is fixed to the surface of the circuit board 3 by soldering or the like.

このようなLED照明ユニット1において器具本体5に回路基板3と透光性部材4とを取り付ける際には、まず、図5(b)に示すように、回路基板3と透光性部材4とを対峙させ、バネ体13に透光性部材4の係止片14を挿入して挟持させることにより、回路基板3に透光性部材4を係留させるようにする。次に、図5(c)に示すように、回路基板3を器具本体5の底部51の取り付け面に載置し、ビス7を鍔部43の貫通穴に通してビス7の締め付けを行う。このビス7の締め付けにより、バネ体13は、互いのバネ片が外向きに変形し、同時にこのバネ片の弾性力により回路基板3が器具本体5に押し付けられる。ビス7が完全に締め付けられたとき、鍔部43の端部が器具本体5に当接される。   When attaching the circuit board 3 and the translucent member 4 to the fixture body 5 in such an LED lighting unit 1, first, as shown in FIG. 5 (b), the circuit board 3 and the translucent member 4 And the translucent member 4 is anchored to the circuit board 3 by inserting and holding the locking piece 14 of the translucent member 4 into the spring body 13. Next, as shown in FIG. 5C, the circuit board 3 is placed on the mounting surface of the bottom 51 of the instrument body 5, and the screw 7 is tightened by passing the screw 7 through the through hole of the flange 43. By tightening the screws 7, the spring pieces of the spring body 13 are deformed outward, and at the same time, the circuit board 3 is pressed against the instrument body 5 by the elastic force of the spring pieces. When the screw 7 is completely tightened, the end of the flange 43 is brought into contact with the instrument body 5.

このようなLED照明ユニット1であっても、上記と同様の作用効果が得られる。また、回路基板3に設けられたバネ体13に、透光性部材4の係止片14を挿入するだけで、回路基板3に透光性部材4を係止することができるので、接着保持する場合に比し、組み立て工数が削減できる。   Even with such an LED lighting unit 1, the same effect as described above can be obtained. In addition, the translucent member 4 can be locked to the circuit board 3 simply by inserting the locking piece 14 of the translucent member 4 into the spring body 13 provided on the circuit board 3, so that the adhesive holding is maintained. Compared to the case, the assembly man-hour can be reduced.

なお、本発明は、上記実施形態の構成に限られず、発明の趣旨を変更しない範囲で種々の変形が可能である。例えば、上記では、器具本体5を放熱部材として構成した例を示したが、これに限られず、放熱部材を器具本体5とは別に設けるようにしてもよい。   In addition, this invention is not restricted to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not change the meaning of invention. For example, although the example which comprised the instrument main body 5 as a heat radiating member was shown above, it is not restricted to this, You may make it provide a heat radiating member separately from the instrument main body 5. FIG.

また、LED光源モジュールの場合は、図4(a)に示した第1の実施形態の構成から、鍔部43(係留部)がない構成が一般的である。この場合、回路基板3を、鍔部43のない透光性部材4と、アルミダイカストの受け皿とで挟み込み、必要に応じて受け皿上に放熱シートを入れ、透光性部材4と受け皿とをネジ止め等することで、LED光源モジュールを構成していた。本願の発明によれば、パッキン8(弾性部材)の反発力によって、回路基板3を器具本体5(放熱部材)に押し付け、もって放熱特性を向上させることができるので、LED光源モジュールとして用いたときに、従来必要とされていたアルミダイカストの受け皿を省くことが可能となる。また、受け皿がないことで、LED光源モジュールの組み付け性や剛性を向上させることができるものである。   Further, in the case of the LED light source module, a configuration without the flange portion 43 (an anchoring portion) is common from the configuration of the first embodiment shown in FIG. In this case, the circuit board 3 is sandwiched between the translucent member 4 without the flange 43 and the aluminum die-casting tray, and if necessary, a heat dissipation sheet is placed on the tray, and the translucent member 4 and the tray are screwed together. The LED light source module is configured by stopping or the like. According to the invention of the present application, the circuit board 3 can be pressed against the instrument body 5 (heat dissipating member) by the repulsive force of the packing 8 (elastic member) to improve the heat dissipating characteristics, so that when used as an LED light source module In addition, it is possible to omit the aluminum die casting tray, which has been conventionally required. Moreover, the assembly property and rigidity of an LED light source module can be improved because there is no tray.

1 LED照明ユニット
2 LEDチップ
3 回路基板
31 金属板
32 絶縁膜
33 回路パターン
4 透光性部材
5 器具本体(放熱部材)
7 ビス(締結手段)
8 パッキン(弾性部材)
13 バネ体(弾性部材)
DESCRIPTION OF SYMBOLS 1 LED lighting unit 2 LED chip 3 Circuit board 31 Metal plate 32 Insulating film 33 Circuit pattern 4 Translucent member 5 Instrument main body (heat radiating member)
7 Screws (fastening means)
8 Packing (elastic member)
13 Spring body (elastic member)

Claims (4)

LEDチップが表面に実装された回路基板と、前記回路基板の表面を覆う、前記LEDチップから出射される光が通る透光性部材と、前記回路基板の背面に取り付けられる放熱部材とを備えたLED照明ユニットにおいて、
前記回路基板の外側に設けられ、前記放熱部材に前記透光性部材をビス止めにより締結する締結手段と、
前記締結手段の内側に設けられ、前記締結手段により前記放熱部材に前記透光性部材が締結された状態で前記回路基板と透光性部材との間に挟み込まれる弾性部材とを備え、
前記弾性部材は、前記締結手段が締結状態にあるとき弾性変形され、その反発力により前記回路基板を前記放熱部材に押し付けるように作用することを特徴とするLED照明ユニット。
A circuit board having an LED chip mounted thereon, a translucent member through which light emitted from the LED chip passes, covering the surface of the circuit board, and a heat dissipation member attached to the back surface of the circuit board In LED lighting unit,
Fastening means that is provided outside the circuit board and fastens the light transmissive member to the heat radiating member with screws .
An elastic member provided inside the fastening means, and sandwiched between the circuit board and the translucent member in a state where the translucent member is fastened to the heat dissipation member by the fastening means,
The LED lighting unit according to claim 1, wherein the elastic member is elastically deformed when the fastening means is in a fastening state, and acts to press the circuit board against the heat radiating member by a repulsive force.
前記回路基板は、熱伝導性の高い金属板と、この金属板上に被覆形成した絶縁膜と、この絶縁膜上に形成した、前記LEDチップを実装するための回路パターンとを備えることを特徴とする請求項1に記載のLED照明ユニット。   The circuit board includes a metal plate having high thermal conductivity, an insulating film formed on the metal plate, and a circuit pattern formed on the insulating film for mounting the LED chip. The LED lighting unit according to claim 1. 前記回路基板と前記放熱部材との当接面は平滑化されていることを特徴とする請求項1又は請求項2に記載のLED照明ユニット。   The LED lighting unit according to claim 1, wherein a contact surface between the circuit board and the heat radiating member is smoothed. 前記回路基板と放熱部材との間に、熱伝導率の高いグリスを介在したことを特徴とする請求項1乃至請求項3のいずれか一項に記載のLED照明ユニット。   The LED lighting unit according to any one of claims 1 to 3, wherein grease having high thermal conductivity is interposed between the circuit board and the heat dissipation member.
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JP2009231473A (en) * 2008-03-21 2009-10-08 Sharp Corp Lighting module and electronic apparatus using the same
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