JP6243162B2 - Light emitting element module - Google Patents

Light emitting element module Download PDF

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Publication number
JP6243162B2
JP6243162B2 JP2013162794A JP2013162794A JP6243162B2 JP 6243162 B2 JP6243162 B2 JP 6243162B2 JP 2013162794 A JP2013162794 A JP 2013162794A JP 2013162794 A JP2013162794 A JP 2013162794A JP 6243162 B2 JP6243162 B2 JP 6243162B2
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substrate
emitting element
light emitting
light
mounting surface
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JP2015032522A (en
Inventor
岩澤 優
優 岩澤
太期 康之
康之 太期
泰志 山▲崎▼
泰志 山▲崎▼
智思 芥川
智思 芥川
智文 大澤
智文 大澤
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3M Innovative Properties Co
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3M Innovative Properties Co
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Priority to JP2013162794A priority Critical patent/JP6243162B2/en
Priority to PCT/US2014/049765 priority patent/WO2015021038A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/10Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

本発明は、発光素子モジュールに関する。   The present invention relates to a light emitting element module.

防水性が要求される発光素子モジュールとして様々な構造が提案されている。例えば、特許文献1に記載の発光素子モジュールでは、光源が実装された基板を収容する筐体が、平板と、基板の周縁の一部との間に開口部を有して該基板を囲むように平板に立設された側板とを備えている。そして、基板の表面を覆うように、筐体の側板の内側に樹脂を充填している。   Various structures have been proposed as light emitting element modules that require waterproofness. For example, in the light-emitting element module described in Patent Document 1, the housing that houses the substrate on which the light source is mounted has an opening between the flat plate and a part of the periphery of the substrate so as to surround the substrate. And a side plate erected on the flat plate. And the resin is filled inside the side plate of the housing so as to cover the surface of the substrate.

特開2011−233356号公報JP 2011-233356 A

従来の発光素子モジュールでは、筐体の側板の内側の領域内において、基板の下側まで樹脂が封入されている。このような構造では、樹脂を乾燥させるために時間がかかってしまい、製造の容易性を更に向上することが求められる。すなわち、十分な防水性能を確保しつつも、製造も容易に行うことが求められる。以上より、容易に製造を行うことができると共に、十分な防水性能を確保できる発光素子モジュールが要請されている。   In the conventional light emitting element module, the resin is sealed to the lower side of the substrate in the region inside the side plate of the housing. In such a structure, it takes time to dry the resin, and it is required to further improve the ease of production. That is, it is required to easily manufacture while ensuring sufficient waterproof performance. As described above, there is a demand for a light-emitting element module that can be easily manufactured and can ensure sufficient waterproof performance.

本発明の一形態にかかる発光素子モジュールは、光を発生する発光素子と、発光素子が実装された基板と、基板の実装面側に配置され、発光素子で発生する光の出射の制御を行う光制御部と、基板の実装面側で、当該実装面に対して垂直方向に見て少なくとも発光素子を取り囲むように配置される封止部と、封止部に押圧力を付与する押圧構造と、を備え、封止部は、押圧力により、封止部の内周側における、少なくとも基板と光制御部との間の空間を封止する。   A light-emitting element module according to one embodiment of the present invention controls a light-emitting element that generates light, a substrate on which the light-emitting element is mounted, a mounting surface side of the substrate, and emission of light generated by the light-emitting element. A light control unit, a sealing unit disposed on the mounting surface side of the substrate so as to surround at least the light emitting element when viewed in a direction perpendicular to the mounting surface, and a pressing structure for applying a pressing force to the sealing unit; The sealing part seals at least the space between the substrate and the light control part on the inner peripheral side of the sealing part by a pressing force.

このような形態によれば、封止部は、基板の実装面側で、当該実装面に対して垂直方向に見て少なくとも発光素子を取り囲むように配置されている。また、封止部は、押圧構造によって付与される押圧力により、封止部の内周側における、少なくとも基板と光制御部との間の空間を封止する。すなわち、封止部は、基板と光制御部との間における発光素子周辺の空間を封止することで、当該空間に水が浸入することを防止できる。また、実装面に対して垂直方向に見て発光素子を取り囲むように封止部を配置すると共に押圧構造で押圧力を付与するだけの簡単な構造であるため、容易に製造を行うことができる。以上により、容易に製造を行うことができると共に、十分な防水性能を確保することができる。   According to such a form, the sealing portion is disposed on the mounting surface side of the substrate so as to surround at least the light emitting element when viewed in the direction perpendicular to the mounting surface. The sealing portion seals at least a space between the substrate and the light control portion on the inner peripheral side of the sealing portion by a pressing force applied by the pressing structure. That is, the sealing unit can prevent water from entering the space by sealing the space around the light emitting element between the substrate and the light control unit. In addition, since the sealing portion is disposed so as to surround the light emitting element when viewed in the direction perpendicular to the mounting surface and the pressing structure applies only a pressing force, the manufacturing can be easily performed. . As described above, manufacturing can be easily performed and sufficient waterproof performance can be ensured.

別の形態に係る発光素子モジュールにおいて、封止部は、光制御部を備える部材とは別体の封止部材によって構成されていてよい。   In the light emitting element module according to another aspect, the sealing portion may be constituted by a sealing member separate from the member including the light control portion.

別の形態に係る発光素子モジュールにおいて、封止部材は、光制御部側に粘着層を備えてよい。   In the light emitting element module according to another aspect, the sealing member may include an adhesive layer on the light control unit side.

別の形態に係る発光素子モジュールにおいて、封止部材は、発泡シリコーンによって構成されてよい。   In the light emitting element module according to another aspect, the sealing member may be made of foamed silicone.

別の形態に係る発光素子モジュールにおいて、封止部は、当該実装面に対して垂直方向に見て、光制御部と重なるように配置されてよい。   In the light emitting element module according to another aspect, the sealing portion may be disposed so as to overlap the light control portion when viewed in a direction perpendicular to the mounting surface.

別の形態に係る発光素子モジュールは、基板の実装面側を覆うカバー部材を更に備え、カバー部材には、内周側に光制御部が配置される開口部が形成され、開口部の内縁部と光制御部とが実装面と平行な方向に離間することで、基板の実装面の少なくとも一部が露出してよい。   A light emitting element module according to another aspect further includes a cover member that covers the mounting surface side of the substrate, and the cover member is formed with an opening in which the light control unit is disposed on the inner peripheral side, and the inner edge of the opening And the light control unit may be separated in a direction parallel to the mounting surface, so that at least a part of the mounting surface of the substrate may be exposed.

別の形態に係る発光素子モジュールは、基板の実装面側を覆うカバー部材を更に備え、締付部材によって基板とカバー部材とが連結されてよい。   The light emitting element module which concerns on another form is further provided with the cover member which covers the mounting surface side of a board | substrate, and a board | substrate and a cover member may be connected by the fastening member.

別の形態に係る発光素子モジュールにおいて、締付部材はネジであって、基板の実装面の反対側の面からカバー部材へ向かってネジを締めることによって、基板とカバー部材とが連結されてよい。   In the light emitting element module according to another aspect, the tightening member is a screw, and the substrate and the cover member may be coupled by tightening the screw from the surface opposite to the mounting surface of the substrate toward the cover member. .

本発明の一側面によれば、容易に製造を行うことができると共に、十分な防水性能を確保できる。   According to one aspect of the present invention, it is possible to easily manufacture and secure a sufficient waterproof performance.

図1は、実施形態に係る発光素子モジュールの斜視図である。FIG. 1 is a perspective view of the light emitting element module according to the embodiment. 図2は、実施形態に係る発光素子モジュールの平面図である。FIG. 2 is a plan view of the light emitting element module according to the embodiment. 図3は、実施形態に係る発光素子モジュールの平面側分解斜視図である。FIG. 3 is an exploded perspective view of the light emitting element module according to the embodiment on a plane side. 図4は、実施形態に係る発光素子モジュールの底面側分解斜視図である。FIG. 4 is an exploded perspective view of the bottom surface side of the light emitting element module according to the embodiment. 図5は、図2に示すV−V線に沿った断面図である。FIG. 5 is a cross-sectional view taken along line VV shown in FIG. 図6(a)は、封止部材付近の構造を示す概略図であり、(b)は粘着層を示した概略図である。FIG. 6A is a schematic view showing a structure near the sealing member, and FIG. 6B is a schematic view showing an adhesive layer. 図7は、変形例に係る発光素子モジュールの概略図である。FIG. 7 is a schematic view of a light emitting element module according to a modification. 図8は、実施例に係る発光素子モジュールのスペック及び評価結果を示す表である。FIG. 8 is a table showing specifications and evaluation results of the light-emitting element module according to the example. 図9は、実施例に係る発光素子モジュールの評価結果を示す表である。FIG. 9 is a table showing the evaluation results of the light emitting element module according to the example. 図10は、実施例に係る発光素子モジュールの評価結果を示す図である。FIG. 10 is a diagram illustrating an evaluation result of the light emitting element module according to the example.

以下、添付図面を参照しながら本発明の実施形態を詳細に説明する。なお、図面の説明において、同一又は同等の要素には同一の符号を付し、重複する説明を省略する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant description is omitted.

まず、図1〜図4を参照して、本実施形態に係る発光素子モジュール1の構成について説明する。発光素子モジュール1は、例えば、店舗の屋外に設置される看板やチャンネル文字などに用いられる発光素子モジュールである。屋外に設置される場合には、雨や冬場の結露等により発光素子モジュール1内に水が浸入することが問題となるところ、発光素子モジュール1はそのような水の侵入を防止するための十分な防水性能を有するものである。   First, with reference to FIGS. 1-4, the structure of the light emitting element module 1 which concerns on this embodiment is demonstrated. The light emitting element module 1 is, for example, a light emitting element module used for a signboard or a channel character installed outside a store. When it is installed outdoors, there is a problem that water enters the light emitting element module 1 due to rain, dew condensation in winter, etc., and the light emitting element module 1 is sufficient to prevent such intrusion of water. It has a good waterproof performance.

図1〜図5に示すように、発光素子モジュール1は、光を発生する発光素子11と、発光素子11が実装された基板12と、基板12の実装面12a側に配置されて発光素子11で発生する光の出射の制御を行う光制御部13と、基板12の実装面12a側で、当該実装面12aに対して垂直方向に見て少なくとも発光素子11を取り囲むように配置される封止部14と、基板12の実装面12a側を覆うカバー部材16と、封止部14に押圧力を付与する押圧構造17と、を備えている。なお、本実施形態において、「光軸」とは、発光素子モジュール1が出射する出射光の光軸であるものとする。また、各図に対してX軸、Y軸、Z軸を設定しているが、説明のために便宜的に設定されたものである。本実施形態では、光軸RLが延びる方向である光軸方向にZ軸が設定される。また、Z軸正方向に向かって発光素子モジュール1の光が出射されるものとし、光の出射側(すなわちZ軸正側)を「表」とし、反対側(すなわちZ軸負側)を「裏」であるものとして、これらの語を用いる。   As shown in FIGS. 1 to 5, the light emitting element module 1 includes a light emitting element 11 that generates light, a substrate 12 on which the light emitting element 11 is mounted, and a mounting surface 12 a side of the substrate 12. And a light control unit 13 that controls emission of light generated in step S4, and a seal that is disposed on the mounting surface 12a side of the substrate 12 so as to surround at least the light emitting element 11 when viewed in a direction perpendicular to the mounting surface 12a. Part 14, a cover member 16 that covers the mounting surface 12 a side of the substrate 12, and a pressing structure 17 that applies a pressing force to the sealing part 14. In the present embodiment, the “optical axis” is the optical axis of outgoing light emitted from the light emitting element module 1. In addition, although the X axis, the Y axis, and the Z axis are set for each drawing, they are set for convenience of explanation. In the present embodiment, the Z axis is set in the optical axis direction, which is the direction in which the optical axis RL extends. The light from the light emitting element module 1 is emitted in the positive direction of the Z axis, the light emission side (that is, the Z axis positive side) is “table”, and the opposite side (that is, the Z axis negative side) is “ These words are used as the “back”.

発光素子11は、駆動電力が供給されることにより光を発生させる発光体である。発光素子11としては、例えば、ガリウム砒素、窒化ガリウムなどの化合物に電流を流して光を発生させる発光ダイオード(LED:Light Emitting Diode)等が用いられる。なお、発光素子11として、LED自体の発光色以外の光を得るために蛍光体を備えたものを用いてよい。例えば、発光素子11として、蛍光体を混ぜ合わせた樹脂材料やシートでLEDを覆ったものを採用してよく、LEDの発光面に蛍光体を塗布したものを採用してよい。ここで、発光素子11は1個基板12に実装されても良いし、複数個基板12に実装されても良い。なお、発光素子11が1個の場合には、発光素子11は、基板12の実装面12a上において、その光軸が発光素子モジュール1の光軸RLと一致するように配置される。   The light emitting element 11 is a light emitter that generates light when supplied with driving power. As the light emitting element 11, for example, a light emitting diode (LED) that generates light by flowing a current through a compound such as gallium arsenide or gallium nitride is used. In addition, you may use the thing provided with the fluorescent substance in order to obtain lights other than the luminescent color of LED itself as the light emitting element 11. FIG. For example, the light-emitting element 11 may be one in which the LED is covered with a resin material or sheet mixed with a phosphor, or one in which a phosphor is applied to the light-emitting surface of the LED. Here, one light emitting element 11 may be mounted on the substrate 12, or a plurality of light emitting elements 11 may be mounted on the substrate 12. When the number of the light emitting elements 11 is one, the light emitting elements 11 are arranged on the mounting surface 12 a of the substrate 12 so that the optical axis thereof coincides with the optical axis RL of the light emitting element module 1.

基板12は、発光素子11が実装される矩形状の板状部材であり、例えばアルミニウム基板、銅基板、ガラスエポキシ基板、ガラスコンポジット基板などを用いることができる。なお、本実施形態では、基板12は、実装面12aが光軸RLと直交するようにX軸方向及びY軸方向に広がるように配置されており、Y軸方向が長手方向となるような長方形状の形状を有しているが、形状は特に限定されず、正方形状、円形状等、あらゆる形状を採用してよい。基板12の表面は、発光素子11や光制御部13を実装する実装面12aとして構成される。実装面12aには、銅箔からなる配線パターン(不図示)が設けられている。配線パターンは、発光素子11に駆動電力を供給する配線であり、基板12外部の電源(図示せず)に、ワイヤ21を介して電気的に接続されている。なお、ワイヤ21は、複数の発光素子モジュール1を直列または並列に電気的に接続するものである。なお、各図においては、配線パターンのうち、ワイヤ21と接続される電極部22のみが示されている。   The substrate 12 is a rectangular plate-like member on which the light emitting element 11 is mounted. For example, an aluminum substrate, a copper substrate, a glass epoxy substrate, a glass composite substrate, or the like can be used. In the present embodiment, the substrate 12 is disposed so that the mounting surface 12a extends in the X-axis direction and the Y-axis direction so as to be orthogonal to the optical axis RL, and the rectangle in which the Y-axis direction is the longitudinal direction. The shape is not particularly limited, and any shape such as a square shape or a circular shape may be adopted. The surface of the substrate 12 is configured as a mounting surface 12a on which the light emitting element 11 and the light control unit 13 are mounted. A wiring pattern (not shown) made of copper foil is provided on the mounting surface 12a. The wiring pattern is a wiring that supplies driving power to the light emitting element 11, and is electrically connected to a power source (not shown) outside the substrate 12 through the wire 21. The wire 21 is used to electrically connect the plurality of light emitting element modules 1 in series or in parallel. In each figure, only the electrode part 22 connected to the wire 21 is shown in the wiring pattern.

電極部22は、基板12の実装面12aの長手方向(Y軸方向)の両端側の位置に2つずつ設けられている(特に、図3を参照)。電極部22はワイヤ21と半田付けにより接続されており、当該半田付けによって半田部23が形成されている。各電極部22に接続されたワイヤ21は、基板12の長手方向(Y軸方向)の両側の縁部から外側へ向かって引き出されている。ただし、電極部22を設ける位置やワイヤ21の引き出し方向は特に限定されるものではなく、基板12の短手方向(X軸方向)の端部側に電極部22が設けられて短手方向(X軸方向)にワイヤ21が引き出されてもよい。なお、実装面12aの中心部には発光素子11と接続される電極部(不図示)が設けられる。この電極部に発光素子11が接続されることにより、発光素子11に駆動電力が供給される。   Two electrode portions 22 are provided at positions on both ends in the longitudinal direction (Y-axis direction) of the mounting surface 12a of the substrate 12 (see particularly FIG. 3). The electrode portion 22 is connected to the wire 21 by soldering, and a solder portion 23 is formed by the soldering. The wires 21 connected to the electrode portions 22 are drawn outward from the edge portions on both sides in the longitudinal direction (Y-axis direction) of the substrate 12. However, the position where the electrode portion 22 is provided and the direction in which the wire 21 is pulled out are not particularly limited, and the electrode portion 22 is provided on the end side in the short direction (X-axis direction) of the substrate 12 so that the short direction ( The wire 21 may be pulled out in the (X-axis direction). Note that an electrode portion (not shown) connected to the light emitting element 11 is provided at the center of the mounting surface 12a. By connecting the light emitting element 11 to this electrode portion, driving power is supplied to the light emitting element 11.

また、基板12の四隅には、半円状の切欠き部12cが形成されている(図3及び図5参照)。また、基板12には、押圧構造17を構成するネジ53A,53Bを挿通させるための貫通孔15A,15Bが形成されている。貫通孔15A,15Bの配置に関しては押圧構造17と合わせて後述する。また、基板12の実装面12aには、光制御部13を位置合わせするための有底穴12dが形成されている。ただし、本発明では当該形状は必須ではなく、本発明はこのような形態に限定されるものではない。   In addition, semicircular cutouts 12c are formed at the four corners of the substrate 12 (see FIGS. 3 and 5). Further, the substrate 12 is formed with through holes 15A and 15B through which the screws 53A and 53B constituting the pressing structure 17 are inserted. The arrangement of the through holes 15A and 15B will be described later together with the pressing structure 17. Further, a bottomed hole 12 d for aligning the light control unit 13 is formed in the mounting surface 12 a of the substrate 12. However, in the present invention, the shape is not essential, and the present invention is not limited to such a form.

光制御部13は、発光素子モジュール1が所望の特性に応じた出射光を出射できるように、発光素子11で発生する光の出射の制御を行うものである。すなわち、光制御部13は、発光素子11で発生する光を当該光制御部13内に透過させて、光の広がり方を制御すると共に、各配向角における光の強度を制御した状態で、出射するものである。なお、本明細書では、発光素子11で発生して光制御部13を透過する前段階の光を「発光素子で発生する光」と称する。なお、光制御部13で制御された状態で出射された光が、発光素子モジュール1として出射する「出射光」に該当する。光制御部13は、基板12の実装面12a側に配置される半球ドーム状のレンズによって構成される。発光素子モジュール1から出射される出射光を制御するために、光制御部13を凸状レンズにしてもよく、凸状レンズの一部を凹状レンズ形状に形成したレンズとしてもよい。光制御部13は、発光素子11の発光面側において、その中心軸が光軸RLと一致する位置で、当該発光素子11を覆うように配置される。光制御部13は、裏側(Z軸負側)に形成されて発光素子11で発生した光を入射させる入射面13aと、表側(Z軸正側)に形成されて光制御部13中を透過した光を出射光として出射する出射面13b(図5参照)と、を備えている。   The light control unit 13 controls emission of light generated by the light emitting element 11 so that the light emitting element module 1 can emit emitted light according to desired characteristics. That is, the light control unit 13 transmits the light generated in the light emitting element 11 into the light control unit 13 to control how the light spreads, and in the state where the light intensity at each orientation angle is controlled. To do. In the present specification, the light at the previous stage generated by the light emitting element 11 and transmitted through the light control unit 13 is referred to as “light generated by the light emitting element”. The light emitted in a state controlled by the light control unit 13 corresponds to “emitted light” emitted as the light emitting element module 1. The light control unit 13 is configured by a hemispherical dome-shaped lens disposed on the mounting surface 12 a side of the substrate 12. In order to control the emitted light emitted from the light emitting element module 1, the light control unit 13 may be a convex lens, or a lens in which a part of the convex lens is formed in a concave lens shape. The light control unit 13 is disposed on the light emitting surface side of the light emitting element 11 so as to cover the light emitting element 11 at a position where the central axis coincides with the optical axis RL. The light control unit 13 is formed on the back side (Z-axis negative side) and is incident on the incident surface 13a on which light generated by the light emitting element 11 is incident. The light control unit 13 is formed on the front side (Z-axis positive side) and transmits through the light control unit 13. And an emission surface 13b (see FIG. 5) for emitting the emitted light as emission light.

出射面13bは、略半球ドーム状に形成されており、被照明部材(例えば店舗の看板等)に向かうように光制御部13を透過した光を出射光として出射する面である。出射面13bは、任意の曲率半径で湾曲するように形成されているが、光軸RL付近において入射面13aと略平行に形成されている。出射面13bの形状は特に限定されるものではなく、発光素子モジュール1の用途や要求特性に応じて適宜変更してよく、例えば、曲率半径を変化させてもよく、入射面13aと平行な部分を設けなくともよい。   The emission surface 13b is formed in a substantially hemispherical dome shape, and is a surface that emits light that has passed through the light control unit 13 as emitted light so as to be directed to a member to be illuminated (for example, a signboard of a store). The exit surface 13b is formed to be curved with an arbitrary curvature radius, but is formed substantially parallel to the entrance surface 13a in the vicinity of the optical axis RL. The shape of the exit surface 13b is not particularly limited, and may be changed as appropriate according to the application and required characteristics of the light emitting element module 1. For example, the radius of curvature may be changed, and the portion parallel to the entrance surface 13a Need not be provided.

入射面13aは、平面状に形成される平面部13cと、平面部13cの中央位置において凹状に形成されるガイド部13dと、を備える(図4及び図5参照)。平面部13cは、基板12の実装面12aと平行に対向すると共に、当該実装面12aから離間した位置に配置される。平面部13cは、粗面(凸凹面)とされることにより、光を散乱させることができる。例えば、入射面13aの平面部13cが粗面ではない場合、光制御部13を透過せず出射面13bで反射した光が平面部13cで反射することで、光制御部13から出射した出射光の強度が、光軸RL付近における一部で高くなり(例えば、図10において二点鎖線で示す部分を参照)、リング状のムラが発生する可能性がある。一方、入射面13aの平面部13cを粗面とすることで、出射面13bで反射した光を平面部13cで散乱させることができ、これによって前述のようなリング状のムラの発生を抑制することができる。平面部13cの中心には、発光素子11が発生した光を出射面13b側にガイドするための窪みであるガイド部13dが形成されている。ガイド部13dは、光軸RLを中心軸として窪みとして構成される。発光素子11及び光制御部13が基板12の実装面12aに実装された状態において、ガイド部13dは発光素子11の直上に位置している。   The incident surface 13a includes a flat surface portion 13c formed in a flat shape and a guide portion 13d formed in a concave shape at the center position of the flat surface portion 13c (see FIGS. 4 and 5). The flat surface portion 13c faces the mounting surface 12a of the substrate 12 in parallel and is disposed at a position separated from the mounting surface 12a. The flat surface portion 13c can scatter light by being a rough surface (uneven surface). For example, when the flat surface portion 13c of the incident surface 13a is not a rough surface, the light that has not been transmitted through the light control portion 13 and reflected by the light emission surface 13b is reflected by the flat surface portion 13c, so that the emitted light emitted from the light control portion 13 May increase in part near the optical axis RL (see, for example, the part indicated by a two-dot chain line in FIG. 10), and ring-shaped unevenness may occur. On the other hand, by making the flat surface portion 13c of the incident surface 13a rough, the light reflected by the output surface 13b can be scattered by the flat surface portion 13c, thereby suppressing the occurrence of ring-shaped unevenness as described above. be able to. A guide portion 13d, which is a recess for guiding light generated by the light emitting element 11 to the emission surface 13b side, is formed at the center of the flat portion 13c. The guide portion 13d is configured as a depression with the optical axis RL as the central axis. In a state where the light emitting element 11 and the light control unit 13 are mounted on the mounting surface 12 a of the substrate 12, the guide unit 13 d is located immediately above the light emitting element 11.

光制御部13には、光制御部13の外縁部の全周にわたって形成された円環部26、及び円環部26から径方向外側へ張り出したフランジ部27A,27Bが形成されている。本実施形態では、光制御部13、円環部26、及びフランジ部27A,27Bは一体的に形成された一つの部材として構成されている。このような「光制御部を備える部材」を、以下の説明においては「レンズ部材28」と称する。レンズ部材28は金型を用いた成形、切削研磨などの方法によって製造されてよい。レンズ部材28の材料(すなわち光制御部13の材料)として、例えば、ガラス、アクリル樹脂、ポリカーボネート樹脂、シリコーン樹脂などを適用してよい。本実施形態では、例えば図6に示すように、平面部13cを外周側へ延ばした境界線L1を設定した場合、平面部13c及び境界線L1より出射面13b側(Z軸正側)の領域を光制御部13とみなしてよい。また、光軸方向から見て光制御部13の外縁よりも外周側へ突出する部分、すなわち図6に示す境界線L2よりも外周側の部分をフランジ部27A,27Bとみなしてよい。また、境界線L1と境界線L2との間の部分を円環部26とみなしてよい。ただし、本実施形態では当該部分を「円環部」と称して説明しているが、円状でなくとも矩形状やその他の多角形状であってもよい。また、「フランジ部」に関しても円状である必要はなく、矩形状やその他の多角形状であってもよい。   The light control unit 13 is formed with an annular part 26 formed over the entire circumference of the outer edge of the light control part 13 and flange parts 27A and 27B projecting outward from the annular part 26 in the radial direction. In this embodiment, the light control unit 13, the annular portion 26, and the flange portions 27A and 27B are configured as one member formed integrally. Such a “member including a light control unit” is referred to as a “lens member 28” in the following description. The lens member 28 may be manufactured by a method such as molding using a mold or cutting and polishing. As the material of the lens member 28 (that is, the material of the light control unit 13), for example, glass, acrylic resin, polycarbonate resin, silicone resin, or the like may be applied. In this embodiment, for example, as shown in FIG. 6, when a boundary line L <b> 1 that extends the flat portion 13 c to the outer peripheral side is set, an area on the emission surface 13 b side (Z-axis positive side) from the flat portion 13 c and the boundary line L <b> 1. May be regarded as the light control unit 13. Further, a portion protruding from the outer edge of the light control unit 13 to the outer peripheral side when viewed from the optical axis direction, that is, a portion on the outer peripheral side from the boundary line L2 shown in FIG. 6 may be regarded as the flange portions 27A and 27B. A portion between the boundary line L1 and the boundary line L2 may be regarded as the annular portion 26. However, in the present embodiment, the portion is referred to as an “annular portion”, but it may be a rectangular shape or other polygonal shape instead of a circular shape. Further, the “flange portion” does not need to be circular, and may be rectangular or other polygonal shapes.

円環部26は、平面部13cの外周を取り囲むように形成されている。本実施形態では、円環部26は、平面部13cよりも基板12側(Z軸負側)に突出している。フランジ部27A,27Bは、光制御部13の外縁部よりも径方向外側に円弧状に張り出した部分である。本実施形態では、一対のフランジ部27A,27Bが設けられている。フランジ部27A及びフランジ部27Bは光軸RLを挟んで、互いに対向する領域に設けられている。フランジ部27A,27Bは、押圧構造17の一部を構成しており、他の部材から押圧力を付与されることによって、フランジ部27を介してレンズ部材28全体が基板12側へ押し付けられる。なお、フランジ部27A,27Bの詳細な説明は、押圧構造17と合わせて後述する。本実施形態では、レンズ部材28(すなわち光制御部13)が基板12の実装面12aに実装された状態において、光制御部13の入射面13aと、基板12の実装面12aと、円環部26との間には、空間SPが形成される。   The annular portion 26 is formed so as to surround the outer periphery of the flat portion 13c. In the present embodiment, the annular portion 26 protrudes to the substrate 12 side (Z-axis negative side) from the plane portion 13c. The flange portions 27 </ b> A and 27 </ b> B are portions that project in an arc shape radially outward from the outer edge portion of the light control unit 13. In the present embodiment, a pair of flange portions 27A and 27B are provided. The flange portion 27A and the flange portion 27B are provided in regions facing each other across the optical axis RL. The flange portions 27 </ b> A and 27 </ b> B constitute a part of the pressing structure 17, and the entire lens member 28 is pressed toward the substrate 12 through the flange portion 27 when a pressing force is applied from another member. The detailed description of the flange portions 27A and 27B will be described later together with the pressing structure 17. In the present embodiment, in a state where the lens member 28 (that is, the light control unit 13) is mounted on the mounting surface 12a of the substrate 12, the incident surface 13a of the light control unit 13, the mounting surface 12a of the substrate 12, and the annular portion A space SP is formed between the space 26 and the terminal 26.

封止部14は、押圧構造17で付与される押圧力により、封止部14の内周側における、少なくとも基板12と光制御部13との間の空間SPを封止するものである。封止部14は、基板12と光制御部13との間の空間SPのうち、発光素子11が配置される領域である封止部14の内周側の領域を封止することによって、当該封止部14よりも外周側の領域からの水の浸入を防止する。封止部14は、光制御部13を有するレンズ部材28と基板12との間、すなわち光制御部13の入射面13a側であって基板12の実装面12a側の位置に配置される。封止部14は、環状に構成されており、その中心軸が光軸RLと一致するように配置される。光軸RL上には発光素子11が配置されているため、封止部14は、実装面12aに対して垂直方向に見て発光素子11を取り囲むように配置される。なお、実装面12aに段差が設けられることなどによって、光軸方向における発光素子11の位置と封止部14の位置とが上下にずれていてもよいが、このような場合であっても、実装面12aに対して垂直方向に見たときには、封止部14は発光素子11を取り囲むように配置される。   The sealing unit 14 seals at least the space SP between the substrate 12 and the light control unit 13 on the inner peripheral side of the sealing unit 14 by the pressing force applied by the pressing structure 17. The sealing unit 14 seals a region on the inner peripheral side of the sealing unit 14, which is a region where the light emitting element 11 is disposed, in the space SP between the substrate 12 and the light control unit 13. Intrusion of water from a region on the outer peripheral side of the sealing portion 14 is prevented. The sealing unit 14 is disposed between the lens member 28 having the light control unit 13 and the substrate 12, that is, at the position on the incident surface 13 a side of the light control unit 13 and on the mounting surface 12 a side of the substrate 12. The sealing portion 14 is configured in an annular shape, and is arranged so that its central axis coincides with the optical axis RL. Since the light emitting element 11 is disposed on the optical axis RL, the sealing portion 14 is disposed so as to surround the light emitting element 11 when viewed in the direction perpendicular to the mounting surface 12a. The position of the light emitting element 11 and the position of the sealing portion 14 in the optical axis direction may be shifted up and down by providing a step on the mounting surface 12a. When viewed in a direction perpendicular to the mounting surface 12 a, the sealing portion 14 is disposed so as to surround the light emitting element 11.

本実施形態では、封止部14は、レンズ部材28(光制御部13を備える部材)とは別体の封止部材29によって構成されている。封止部材29は、上述のような「封止部」として機能する部材であって、「光制御部を備える部材(すなわちレンズ部材)」から独立した一つの部品として構成されたものである。なお、請求項における「封止部」は、本実施形態では封止部材29に対応するが、その用語が網羅する範囲はこれに限定されず、例えば、レンズ部材と一体に形成されているときは当該レンズ部材の一部を指す場合もある(当該変形態様については後述する)。本実施形態の以降の説明においては、「封止部」と「封止部材」は同一のものを示す語であるものとして説明する。   In the present embodiment, the sealing portion 14 is configured by a sealing member 29 that is separate from the lens member 28 (a member including the light control unit 13). The sealing member 29 is a member that functions as the “sealing portion” as described above, and is configured as one component independent of the “member including the light control portion (that is, the lens member)”. Note that the “sealing portion” in the claims corresponds to the sealing member 29 in the present embodiment, but the scope of the term is not limited to this, for example, when it is formed integrally with the lens member May refer to a part of the lens member (the deformation mode will be described later). In the following description of the present embodiment, the “sealing portion” and the “sealing member” will be described as words indicating the same thing.

ここで、図6(a)を参照して、封止部材29の構造についてより詳細に説明する。なお、図6(a)は、封止部材29の周辺構造を拡大して示すと共に、概略的に示した概略図である。構造を理解し易くするために、図5に示す断面図に対して、平面部13cの粗さをデフォルメして示すと共に、一部を省略、変更して示している。   Here, the structure of the sealing member 29 will be described in more detail with reference to FIG. FIG. 6A is an enlarged schematic view of the peripheral structure of the sealing member 29 and a schematic view thereof. In order to facilitate understanding of the structure, the roughness of the flat surface portion 13c is shown deformed with respect to the cross-sectional view shown in FIG.

図6(a)に示すように、封止部材29は、円環状に形成された部材であり、光軸方向(Z軸方向)における両端面29a,29bが平面状に構成されている。封止部材29の表側(Z軸正側)の端面29aは、レンズ部材28と接触し、裏側(Z軸負側)の端面29bは、基板12と接触する。押圧構造17によって封止部材29に押圧力が付与されることにより、端面29aはレンズ部材28と密着すると共に、端面29bは基板12と密着する。これにより、封止部材29は、レンズ部材28との間の境界部から水が浸入することを防止し、基板12との間の境界部から水が浸入することを防止する。封止部材29は、光軸方向から見て、光制御部13と重なるように配置されている。従って、封止部材29の表側(Z軸正側)の端面29aは、粗面として構成されている平面部13cと面接触する。封止部材の裏側(Z軸負側)の端面29bは、基板12の実装面12aと面接触する。封止部材29の外径は平面部13cの外径(すなわち円環部26の内径)と略一致している。なお、図6のように封止部材29の外周面29cを円環部26の内周面26aから離間させてもよく、図5のように接触させてもよい。封止部材29の内径は、内周面29dが少なくとも発光素子11に対して径方向外側へ離間する寸法に設定されており、本実施形態ではガイド部13dの径よりも大きい。光制御部13、封止部材29及び発光素子11が基板12の実装面12aに実装された状態において、発光素子11は、封止部材29の内周面29dよりも内周側の領域に配置されている。すなわち、封止部材29は、基板12の実装面12a上において、実装面12aに対して垂直方向に見て発光素子11を取り囲むように配置されている。   As shown in FIG. 6A, the sealing member 29 is a member formed in an annular shape, and both end surfaces 29a and 29b in the optical axis direction (Z-axis direction) are planar. An end surface 29 a on the front side (Z-axis positive side) of the sealing member 29 is in contact with the lens member 28, and an end surface 29 b on the back side (Z-axis negative side) is in contact with the substrate 12. By applying a pressing force to the sealing member 29 by the pressing structure 17, the end surface 29 a comes into close contact with the lens member 28, and the end surface 29 b comes into close contact with the substrate 12. Accordingly, the sealing member 29 prevents water from entering from the boundary portion between the sealing member 29 and the lens member 28, and prevents water from entering from the boundary portion between the sealing member 29 and the substrate 12. The sealing member 29 is disposed so as to overlap the light control unit 13 when viewed from the optical axis direction. Therefore, the end surface 29a on the front side (Z-axis positive side) of the sealing member 29 is in surface contact with the flat portion 13c configured as a rough surface. An end surface 29b on the back side (Z-axis negative side) of the sealing member is in surface contact with the mounting surface 12a of the substrate 12. The outer diameter of the sealing member 29 substantially coincides with the outer diameter of the flat portion 13c (that is, the inner diameter of the annular portion 26). 6, the outer peripheral surface 29c of the sealing member 29 may be separated from the inner peripheral surface 26a of the annular portion 26, or may be brought into contact as shown in FIG. The inner diameter of the sealing member 29 is set such that the inner peripheral surface 29d is spaced at least radially outward with respect to the light emitting element 11, and is larger than the diameter of the guide portion 13d in this embodiment. In a state where the light control unit 13, the sealing member 29, and the light emitting element 11 are mounted on the mounting surface 12 a of the substrate 12, the light emitting element 11 is disposed in a region on the inner peripheral side with respect to the inner peripheral surface 29 d of the sealing member 29. Has been. That is, the sealing member 29 is arranged on the mounting surface 12a of the substrate 12 so as to surround the light emitting element 11 when viewed in the direction perpendicular to the mounting surface 12a.

押圧力が付与されていない状態における封止部材29の厚みは、空間SPの光軸方向の大きさ(平面部13cと基板12の実装面12aとの間の寸法であって、図6においてTで示す寸法)以上の寸法に設定される。従って、基板12とレンズ部材28との間に封止部材29を挟んだ状態で押圧構造17によってレンズ部材28を基板12へ押し付けることで、封止部材29が圧縮される。これにより、端面29aがレンズ部材28と密着すると共に、端面29bが基板12と密着する。   The thickness of the sealing member 29 in a state where no pressing force is applied is the size of the space SP in the optical axis direction (the dimension between the flat surface portion 13c and the mounting surface 12a of the substrate 12; (Dimensions indicated by) are set to the above dimensions. Therefore, the sealing member 29 is compressed by pressing the lens member 28 against the substrate 12 by the pressing structure 17 with the sealing member 29 sandwiched between the substrate 12 and the lens member 28. As a result, the end face 29 a comes into close contact with the lens member 28, and the end face 29 b comes into close contact with the substrate 12.

本実施形態では、封止部材29は、基板12側に基体層33を備え、光制御部13側に粘着層34を備えている。基体層33は、封止部材29の基体部に該当する層であり、弾性部材で構成されており、粘着層34を支持する機能も有している。基体層33の材料は耐熱性や色の変化などの観点から選択することができ、例えば、透明又は半透明のシリコーン、エラストマーなどを適用してよい。また、封止部材29の基体層33の硬度は、基板12の実装面12a上に形成される配線パターンによる凹凸形状に追従して変形し、実装面12aと密着できるように、ショアA硬度70以下としてよい。基体層33の厚みは、粘着層34よりも大きく設定されている。光軸方向からみて、基体層33と粘着層34は同一形状・同一の大きさに設定されているが、異なる形状、大きさであってもよい。   In the present embodiment, the sealing member 29 includes a base layer 33 on the substrate 12 side and an adhesive layer 34 on the light control unit 13 side. The base layer 33 is a layer corresponding to the base portion of the sealing member 29, is made of an elastic member, and has a function of supporting the adhesive layer 34. The material of the base layer 33 can be selected from the viewpoints of heat resistance and color change. For example, transparent or translucent silicone or elastomer may be applied. Further, the hardness of the base layer 33 of the sealing member 29 is deformed following the concavo-convex shape of the wiring pattern formed on the mounting surface 12a of the substrate 12, and the Shore A hardness is 70 so that it can be in close contact with the mounting surface 12a. The following may be used. The thickness of the base layer 33 is set larger than that of the adhesive layer 34. The base layer 33 and the adhesive layer 34 are set to have the same shape and the same size as viewed from the optical axis direction, but they may have different shapes and sizes.

粘着層34は、少なくとも表面部分の材料が所定値以上の粘度を有しており、接触面と密着して貼りつくことができるものである。すなわち、粘着層34は、封止部材29の端面29aを構成する層であって、光制御部13の粗面として構成されている平面部13cの凹凸形状に追従して変形し、当該平面部13cと密着することができる層である。本実施形態では、粘着層34として、基体層33上に設けられた両面テープ36が適用されている。当該両面テープ36は、図6(b)に示されるように、基体層33の端面33aに粘着する粘着層36aと、粗面である平面部13cに粘着する粘着層36bと、粘着層36a及び粘着層36bを隔てる基材36cと、を備えている。粘着層36aの粘着剤として、基体層33に対して粘着可能な粘着剤を適用すれば良く、例えばシリコーン系粘着剤などを用いることができ、粘着層36bの粘着剤として、光制御部13に対して粘着可能な粘着剤を適用すれば良く、例えばアクリル系粘着剤などを用いることができる。また、基材36cとして、例えばポリエステル又は不織布を用いることができる。粘着層36bは、粗面である平面部13cの凹凸形状に食い込むように平面部13cと密着することができる(例えば、図6(a)の粘着層34を参照)。そのため、接触面である粗面と接する面を大きくすることができる。なお、粘着層34として両面テープ36を例示したが、これに限定されず、単一の粘着剤によって形成される層としてもよい。   The adhesive layer 34 has a viscosity of at least a surface portion having a predetermined value or more, and can be adhered in close contact with the contact surface. That is, the adhesive layer 34 is a layer that constitutes the end surface 29a of the sealing member 29, and deforms following the uneven shape of the flat surface portion 13c that is configured as a rough surface of the light control portion 13, and the flat surface portion This is a layer that can be in close contact with 13c. In the present embodiment, a double-sided tape 36 provided on the base layer 33 is applied as the adhesive layer 34. As shown in FIG. 6B, the double-sided tape 36 includes an adhesive layer 36a that adheres to the end surface 33a of the base layer 33, an adhesive layer 36b that adheres to the flat surface portion 13c that is a rough surface, an adhesive layer 36a, And a base material 36c separating the adhesive layer 36b. An adhesive that can adhere to the base layer 33 may be applied as the adhesive of the adhesive layer 36a. For example, a silicone-based adhesive can be used, and the light control unit 13 can be used as an adhesive of the adhesive layer 36b. On the other hand, an adhesive that can be adhered may be applied. For example, an acrylic adhesive may be used. Moreover, as the base material 36c, polyester or a nonwoven fabric can be used, for example. The adhesive layer 36b can be in close contact with the flat surface portion 13c so as to bite into the uneven shape of the flat surface portion 13c which is a rough surface (see, for example, the adhesive layer 34 in FIG. 6A). Therefore, the surface which contacts the rough surface which is a contact surface can be enlarged. In addition, although the double-sided tape 36 was illustrated as the adhesion layer 34, it is not limited to this, It is good also as a layer formed with a single adhesive.

図1〜図5に戻り、カバー部材16の構成について説明する。カバー部材16は、光制御部13の出射面13bを露出させつつ、基板12の実装面12a側を覆うことで当該実装面12a上に実装される各構成要素を保護するものである。カバー部材16は、基板12の実装面12a側を覆う略矩形の板状部材であり、材料として、例えばポリカーボネート樹脂、アクリル樹脂、ABS樹脂などの合成樹脂を用いることができる。カバー部材16は、基板12の実装面12aを覆うベース部41と、基板12の外周を取り囲む側壁部42と、を備えている。ベース部41は、裏側(Z軸負側)の裏面41aが基板12の実装面12aと平行に対向するように配置される。ベース部41は、基板12と対応する形状を有しており、Y軸方向が長手方向となるような長方形状の形状を有しているが、基板12の形状に合わせて適宜変更してもよい。側壁部42は、ベース部41の四方の外周縁部から裏側(Z軸負側)へ延びることによって、基板12の四方の側面を覆うように形成される。すなわち、カバー部材16の長手方向(Y軸方向)で対向する側壁部42の内壁間の長さは基板12の長手方向における長さと略一致しており、カバー部材16の短手方向(X軸方向)で対向する側壁部42の内壁間の長さは基板12の短手方向における長さと略一致している。また、カバー部材16の四隅の側壁部42のうち、一の対角方向において対をなす切欠き部12cの半円状の形状に応じて、内側に突出した突出部42aが形成されている(図4参照)。該突出部42aにより、基板12に取り付けられたカバー部材16のXY軸方向のずれが規制される。なお、作業性向上のために、発光素子モジュール1全体をZ軸正方向にひっくり返してもカバー部材16に対する基板12の位置がずれないように、突出部42aに基板12を嵌め合い可能なラッチ構造を設けてもよい。   Returning to FIGS. 1 to 5, the configuration of the cover member 16 will be described. The cover member 16 protects each component mounted on the mounting surface 12a by covering the mounting surface 12a side of the substrate 12 while exposing the emission surface 13b of the light control unit 13. The cover member 16 is a substantially rectangular plate-like member that covers the mounting surface 12a side of the substrate 12, and a synthetic resin such as polycarbonate resin, acrylic resin, or ABS resin can be used as the material. The cover member 16 includes a base portion 41 that covers the mounting surface 12 a of the substrate 12, and a side wall portion 42 that surrounds the outer periphery of the substrate 12. The base portion 41 is disposed such that the back side (Z-axis negative side) back surface 41a faces the mounting surface 12a of the substrate 12 in parallel. The base portion 41 has a shape corresponding to the substrate 12 and has a rectangular shape whose longitudinal direction is the Y-axis direction. However, the base portion 41 may be appropriately changed according to the shape of the substrate 12. Good. The side wall part 42 is formed so as to cover the four side surfaces of the substrate 12 by extending from the four outer peripheral edge parts of the base part 41 to the back side (Z-axis negative side). That is, the length between the inner walls of the side wall portions 42 facing each other in the longitudinal direction (Y-axis direction) of the cover member 16 is substantially the same as the length in the longitudinal direction of the substrate 12. The length between the inner walls of the side wall portions 42 facing each other substantially coincides with the length in the short direction of the substrate 12. Further, of the four side wall portions 42 of the cover member 16, projecting portions 42 a projecting inward are formed in accordance with the semicircular shape of the notch portions 12 c paired in one diagonal direction ( (See FIG. 4). The protrusion 42a restricts displacement of the cover member 16 attached to the substrate 12 in the XY axis direction. In order to improve workability, a latch capable of fitting the substrate 12 to the protrusion 42a so that the position of the substrate 12 relative to the cover member 16 does not shift even if the entire light emitting element module 1 is turned in the positive direction of the Z axis. A structure may be provided.

カバー部材16のベース部41には、内周側に光制御部13が配置される開口部43と、半田部23周辺を充填材PTでポッティングするポッティング部44と、ワイヤ21を引き出すための引出部46と、が形成されている。また、ベース部41には、ネジ53A,53Bを締めるためのボス47A,47Bが設けられている。ボス47A,47Bの構成については押圧構造17の説明と合わせて後述する。   The base portion 41 of the cover member 16 has an opening 43 in which the light control unit 13 is disposed on the inner peripheral side, a potting portion 44 for potting the periphery of the solder portion 23 with the filler PT, and a drawer for pulling out the wire 21 Part 46 is formed. The base portion 41 is provided with bosses 47A and 47B for tightening the screws 53A and 53B. The configuration of the bosses 47A and 47B will be described later together with the description of the pressing structure 17.

開口部43は、ベース部41の表面41bと裏面41aとの間を貫通する貫通孔であって、ベース部41の中心位置に形成される。開口部43は、光軸方向から見て、光軸RLを中心とした円形状をなしている。開口部43の内周側には、レンズ部材28が配置されている。レンズ部材28の光制御部13は、開口部43を通過してベース部41の表面41bよりもZ軸正側へ突出している。開口部43の内径は、光制御部13の外径(最も径方向外側に広がっている部分の外径)よりも大きい。従って、開口部43の内縁部43aと光制御部13とが、基板12の実装面12aと平行な方向(すなわち、XY軸方向であり、光軸方向に直交する方向)に離間する。これによって、光軸方向からみて、開口部43の内縁部43aと光制御部13の外縁部との間の領域では、基板12の実装面12aの少なくとも一部が露出する(図2参照)。開口部43には、内縁部43aから内周側に突出した爪部51A,51Bが設けられている。爪部51A,51Bの構成については押圧構造17の説明と合わせて後述する。   The opening 43 is a through-hole penetrating between the front surface 41 b and the back surface 41 a of the base portion 41 and is formed at the center position of the base portion 41. The opening 43 has a circular shape centered on the optical axis RL when viewed from the optical axis direction. A lens member 28 is disposed on the inner peripheral side of the opening 43. The light control unit 13 of the lens member 28 passes through the opening 43 and protrudes to the Z axis positive side from the surface 41 b of the base unit 41. The inner diameter of the opening 43 is larger than the outer diameter of the light control unit 13 (the outer diameter of the portion that spreads most outward in the radial direction). Accordingly, the inner edge 43a of the opening 43 and the light control unit 13 are separated in a direction parallel to the mounting surface 12a of the substrate 12 (that is, the XY axis direction and the direction orthogonal to the optical axis direction). Thus, at least a part of the mounting surface 12a of the substrate 12 is exposed in a region between the inner edge 43a of the opening 43 and the outer edge of the light control unit 13 when viewed from the optical axis direction (see FIG. 2). The opening 43 is provided with claw portions 51A and 51B protruding from the inner edge portion 43a to the inner peripheral side. The configuration of the claw portions 51A and 51B will be described later together with the description of the pressing structure 17.

ポッティング部44は、基板12の実装面12aに設けられた半田部23に対応する位置、すなわち、カバー部材16の長手方向(Y軸方向)における両端側の位置にそれぞれ設けられている。ポッティング部44では、半田部23を充填材PT(図1及び図5においてグレーで色付けられている)でコーティングできるように、表面41bと裏面41aとの間で貫通した開口部48が形成されている。開口部48は光軸方向から見て矩形状をなしている。また、開口部48内に充填材PTを溜め易いように、開口部48の四方の縁部には、当該開口部48を取り囲むように表面41bから突出する側壁部49が形成される。充填材PTは防水性能を確保することができるものであれば特に限定されないが、例えば、シリコーン樹脂、変成シリコーン樹脂、ポリウレタン樹脂、アクリル樹脂などを用いることができる。   The potting portions 44 are respectively provided at positions corresponding to the solder portions 23 provided on the mounting surface 12 a of the substrate 12, that is, positions at both ends in the longitudinal direction (Y-axis direction) of the cover member 16. In the potting portion 44, an opening 48 penetrating between the front surface 41b and the back surface 41a is formed so that the solder portion 23 can be coated with the filler PT (colored in gray in FIGS. 1 and 5). Yes. The opening 48 has a rectangular shape when viewed from the optical axis direction. Further, in order to easily store the filler PT in the opening portion 48, side wall portions 49 protruding from the surface 41b so as to surround the opening portion 48 are formed at the four edge portions of the opening portion 48. The filler PT is not particularly limited as long as waterproof performance can be ensured. For example, a silicone resin, a modified silicone resin, a polyurethane resin, an acrylic resin, or the like can be used.

引出部46は、カバー部材16の長手方向(Y軸方向)における端部とポッティング部44との間に形成されている。引出部46は、ワイヤ21を半田部23から基板12の長手方向(Y軸方向)へ引き出すための複数のガイド溝51を備えている。引出部46に対応する領域は、ベース部41の表面41bよりも表側(Z軸正側)へ突出しており、当該突出した領域の裏面41a側にガイド溝51が形成される。なお、本実施形態では、一の引出部46に対して三つのガイド溝51が形成されているが、引き出されるワイヤ21は二本であるため、ガイド溝51は二つでもよい。ガイド溝51は、カバー部材16の長手方向(Y軸方向)へ延びる断面U字状の溝である。ガイド溝51の大きさ及び形状は、ワイヤ21に応じて設定される。なお、ガイド溝51はカバー部材16の側壁部42の外周面から、ポッティング部44の開口部48まで延びている。   The lead-out portion 46 is formed between the end portion in the longitudinal direction (Y-axis direction) of the cover member 16 and the potting portion 44. The lead portion 46 includes a plurality of guide grooves 51 for drawing the wire 21 from the solder portion 23 in the longitudinal direction (Y-axis direction) of the substrate 12. A region corresponding to the lead-out portion 46 protrudes to the front side (Z-axis positive side) from the surface 41b of the base portion 41, and a guide groove 51 is formed on the back surface 41a side of the protruding region. In the present embodiment, the three guide grooves 51 are formed with respect to the one extraction portion 46. However, since there are two wires 21 to be extracted, two guide grooves 51 may be provided. The guide groove 51 is a groove having a U-shaped cross section that extends in the longitudinal direction (Y-axis direction) of the cover member 16. The size and shape of the guide groove 51 are set according to the wire 21. The guide groove 51 extends from the outer peripheral surface of the side wall portion 42 of the cover member 16 to the opening 48 of the potting portion 44.

次に、押圧構造17について説明する。封止部14による、実装面12a(基板12)と入射面13a(光制御部13)との間の空間SPの封止は、封止部14に押圧力を付与する押圧構造17により実現されている。なお、請求項における「押圧構造」は、本実施形態では押圧構造17に対応するが、その用語が網羅する範囲はこれに限定されず、封止部14に押圧力を付与できる限りあらゆる構造を採用できる(変形態様については後述する)。具体的には、本実施形態の押圧構造17は、レンズ部材28のフランジ部27A,27Bと、フランジ部27A,27Bを基板12側へ押し付けるカバー部材16の爪部51A,51Bと、封止部14に付与するための押圧力を発生させる押圧力発生部52と、を備えている。   Next, the pressing structure 17 will be described. The sealing of the space SP between the mounting surface 12a (substrate 12) and the incident surface 13a (light control unit 13) by the sealing unit 14 is realized by a pressing structure 17 that applies a pressing force to the sealing unit 14. ing. The “pressing structure” in the claims corresponds to the pressing structure 17 in the present embodiment, but the range covered by the term is not limited to this, and any structure can be used as long as a pressing force can be applied to the sealing portion 14. It is possible to adopt (the deformation mode will be described later). Specifically, the pressing structure 17 of the present embodiment includes the flange portions 27A and 27B of the lens member 28, the claw portions 51A and 51B of the cover member 16 that presses the flange portions 27A and 27B toward the substrate 12, and the sealing portion. 14 and a pressing force generator 52 that generates a pressing force to be applied to.

レンズ部材28のフランジ部27A,27Bは、前述のように、光制御部13から径方向外側へ向かって張り出すように構成されている。フランジ部27A,27Bは、平面部13cと平行に広がる。フランジ部27A及びフランジ部27Bの周方向における大きさは、本実施形態では、光制御部13の全周の4分の1程度を占める大きさに設定されているが、特に限定されず、後述の爪部と十分に接触するだけの大きさを確保でる限り、いかなる大きさに設定してもよい。また、フランジ部27A及びフランジ部27Bの径方向に張り出す大きさは、後述の爪部との接触代を確保できる限り、いかなる大きさに設定してもよい。フランジ部27Aの表側(Z軸正側)には、周方向における中央位置にリブ31が設けられる。また、フランジ部27A及びフランジ部27Bの裏側(Z軸負側)には基板12側へ突出する円柱状の突出部32が設けられる。フランジ部27Aには2つの突出部32が設けられ、フランジ部27Bには1つの突出部32が設けられる。フランジ部27Aの2つの突出部32は、フランジ部27Aの周方向における両端部付近に設けられ、フランジ部27Bの1つの突出部32は、フランジ部27Bの周方向における中央位置に設けられる。ただし、突出部32の数量及び位置は特に限定されず、適宜変更してもよい。フランジ部27A及びフランジ部27Bに設けられた突出部32は、それぞれ基板12の実装面12aに形成された有底穴12dに挿入される。突出部32の先端は、有底穴12dの底面に近接することによって、レンズ部材28の光軸方向における位置決めが行われる。このように、光軸方向における位置決め構造を設けておくことで、封止部14に過剰な押圧力が付与されることを抑制できると共に、レンズ部材28が光軸RLに対して傾くこと、及び封止部材29に不均一な押圧力が付与されることも抑制できる。また、このような突出部32及び有底穴12dによって、組み立て時に、基板12に対するレンズ部材28の位置決めを容易に行うことができる。また、フランジ部27Aには表側(Z軸正側)にリブ31が設けられているところ、リブ31を目印とすることで容易に基板12にレンズ部材28を組み付けることができる。   As described above, the flange portions 27A and 27B of the lens member 28 are configured to project outward from the light control unit 13 in the radial direction. The flange portions 27A and 27B extend in parallel with the flat surface portion 13c. In the present embodiment, the size of the flange portion 27A and the flange portion 27B in the circumferential direction is set to a size that occupies about one quarter of the entire circumference of the light control unit 13, but is not particularly limited, and will be described later. Any size may be set as long as the size enough to make contact with the claw portion is secured. In addition, the size of the flange portion 27A and the flange portion 27B protruding in the radial direction may be set to any size as long as a contact allowance with a later-described claw portion can be secured. On the front side (Z-axis positive side) of the flange portion 27A, a rib 31 is provided at a central position in the circumferential direction. In addition, a columnar protruding portion 32 protruding toward the substrate 12 is provided on the back side (Z-axis negative side) of the flange portion 27A and the flange portion 27B. The flange portion 27A is provided with two protruding portions 32, and the flange portion 27B is provided with one protruding portion 32. The two protruding portions 32 of the flange portion 27A are provided in the vicinity of both end portions in the circumferential direction of the flange portion 27A, and the one protruding portion 32 of the flange portion 27B is provided at a central position in the circumferential direction of the flange portion 27B. However, the quantity and position of the protrusions 32 are not particularly limited, and may be changed as appropriate. The protrusions 32 provided on the flange portion 27A and the flange portion 27B are inserted into the bottomed holes 12d formed on the mounting surface 12a of the substrate 12, respectively. The tip of the protruding portion 32 is positioned close to the bottom surface of the bottomed hole 12d, whereby the lens member 28 is positioned in the optical axis direction. Thus, by providing the positioning structure in the optical axis direction, it is possible to suppress application of excessive pressing force to the sealing portion 14, and the lens member 28 is inclined with respect to the optical axis RL. It can also be suppressed that a non-uniform pressing force is applied to the sealing member 29. Moreover, the positioning of the lens member 28 with respect to the board | substrate 12 can be easily performed by such a protrusion part 32 and the bottomed hole 12d at the time of an assembly. The flange 27A is provided with a rib 31 on the front side (Z-axis positive side). By using the rib 31 as a mark, the lens member 28 can be easily assembled to the substrate 12.

基板12及びカバー部材16の一方の対角方向に延びる基準線L3を設定した場合(図2参照)、フランジ部27A,27Bは、基準線L3上に配置されるように、レンズ部材28が基板12に実装される。本実施形態では、フランジ部27A,27Bの周方向における中央位置が、基準線L3と一致するように、フランジ部27A,27Bが配置される。   When the reference line L3 extending in one diagonal direction of the substrate 12 and the cover member 16 is set (see FIG. 2), the lens member 28 is the substrate so that the flange portions 27A and 27B are disposed on the reference line L3. 12 is implemented. In the present embodiment, the flange portions 27A and 27B are arranged so that the center positions in the circumferential direction of the flange portions 27A and 27B coincide with the reference line L3.

爪部51A,51Bは、カバー部材16の開口部43の内縁部43aの上端側の位置から内周側に突出している。爪部51A,51Bの表側(Z軸正側)の面は、ベース部41の表面41bと一致しているが、一致していなくともよい。爪部51A,51Bの裏側(Z軸負側)の面はフランジ部27A,27Bの表側(Z軸正側)の面と接触する接触面として機能し(例えば図6(a)参照)、ベース部41の裏面41aよりも表側(Z軸正側)に配置される。光軸方向から見たとき、爪部51Aと爪部51Bは、光軸RLを挟んで互いに対向する位置に配置されている。爪部51A及び爪部51Bは、それぞれ基準線L3に対応する位置に形成されており、爪部51Aはフランジ部27Aを押圧可能な位置に設けられ、爪部51Bはフランジ部27Bを押圧可能な位置に設けられる。一のフランジ部27Aに対して二つの爪部51Aが設けられ、一のフランジ部27Bに対して二つの爪部51Bが設けられる。一対の爪部51Aは基準線L3に近接した位置において、互いに当該基準線L3と線対称となる形状及び位置に設けられる(図2参照)。一対の爪部51Bは基準線L3に近接した位置において、互いに当該基準線L3と線対称となる形状及び位置に設けられる(図2参照)。このように、一つのフランジ部27A,27Bに対して二つの爪部51A,51Bで押圧することにより、バランスよく押圧力を伝達することができる。また、爪部51A,51Bの先端部は、光制御部13の外周縁部付近と当接してもよく、光制御部13の位置合わせを行うことができる。   The claw portions 51 </ b> A and 51 </ b> B protrude from the position on the upper end side of the inner edge portion 43 a of the opening portion 43 of the cover member 16 to the inner peripheral side. The front-side (Z-axis positive side) surfaces of the claw portions 51A and 51B are coincident with the surface 41b of the base portion 41, but may not be coincident. The surface on the back side (Z-axis negative side) of the claw portions 51A, 51B functions as a contact surface that contacts the surface on the front side (Z-axis positive side) of the flange portions 27A, 27B (see, for example, FIG. 6A). The portion 41 is disposed on the front side (Z-axis positive side) with respect to the back surface 41a. When viewed from the optical axis direction, the claw portion 51A and the claw portion 51B are disposed at positions facing each other across the optical axis RL. The claw portion 51A and the claw portion 51B are formed at positions corresponding to the reference line L3, the claw portion 51A is provided at a position where the flange portion 27A can be pressed, and the claw portion 51B can press the flange portion 27B. Provided in position. Two claw portions 51A are provided for one flange portion 27A, and two claw portions 51B are provided for one flange portion 27B. The pair of claw portions 51A is provided at a position close to the reference line L3 and in a shape and a position that are symmetrical with the reference line L3 (see FIG. 2). The pair of claw portions 51B are provided in a shape and a position that are symmetrical to the reference line L3 at a position close to the reference line L3 (see FIG. 2). Thus, pressing force can be transmitted in a well-balanced manner by pressing the two flange portions 27A and 27B with the two claw portions 51A and 51B. Moreover, the front-end | tip part of nail | claw part 51A, 51B may contact | abut with the outer-periphery edge vicinity of the light control part 13, and can align the light control part 13. FIG.

押圧力発生部52は、締付部材によって基板12とカバー部材16とを連結することによって押圧力を発生させるものである。本実施形態では締付部材としてネジ53A,53Bを用いるものとする。なお、請求項における「締付部材」は、本実施形態ではネジ53A,53Bに対応するが、その用語が網羅する範囲はこれに限定されず、基板12とカバー部材16とを締め付けた状態で連結することができる限りあらゆる構造を採用でき、締付部材としてボルト及びナットを採用してもよく、リベットを採用してもよく、嵌め合い構造に係る部材(例えば、カバー部材16から突出する部材と基板12の貫通孔に嵌め合いによって基板12とカバー部材16とを連結する。この場合、基板12とカバー部材16とが締め付けられた状態で両部材を連結する)を採用してもよい。本実施形態では、押圧力発生部52は、基板12とカバー部材16とをネジ留めすることによって押圧力を発生させるものであり、具体的には、ネジ53A,53Bと、カバー部材16に形成されるボス47A,47Bと、基板12に形成される貫通孔15A,15Bと、を備える。本実施形態では、基板12の裏面12b(実装面12aの反対側の面)からカバー部材16へ向かってネジ53A,53Bを締めることによって、基板12とカバー部材16とが連結される。従って、カバー部材16のボス47A,47Bにネジ孔47aが形成され、基板12の貫通孔15A,15Bはネジ53A,53Bを通すための挿通孔となっている。ボス47A,47Bは、ベース部41の表面14aから表側(Z軸正側)へ突出している。これによってネジ孔47aの長さを十分に確保できる。なお、ボス47A,47Bを設けず、単にベース部41にネジ孔47aを形成するだけでもよい。カバー部材16のネジ孔47a(すなわちボス47A,47B)と基板12の貫通孔15A,15Bは、光軸方向からみて同一の位置に配置されている。ボス47A及び貫通孔15Aは、その中心が基準線L3上に配置され、爪部51Aの外周側の位置に設けられている(図2参照)。ボス47B及び貫通孔15Bは、その中心が基準線L3上に配置され、爪部51Bの外周側の位置に設けられている(図2参照)。   The pressing force generator 52 generates a pressing force by connecting the substrate 12 and the cover member 16 with a fastening member. In the present embodiment, screws 53A and 53B are used as the fastening members. The “clamping member” in the claims corresponds to the screws 53A and 53B in the present embodiment, but the scope of the term is not limited to this, and the substrate 12 and the cover member 16 are tightened. Any structure can be adopted as long as it can be connected, bolts and nuts may be adopted as fastening members, rivets may be adopted, and members according to the fitting structure (for example, members protruding from the cover member 16) The substrate 12 and the cover member 16 are connected by fitting into the through-holes of the substrate 12. In this case, the two members may be connected while the substrate 12 and the cover member 16 are tightened. In the present embodiment, the pressing force generator 52 generates pressing force by screwing the substrate 12 and the cover member 16, and specifically, formed on the screws 53 </ b> A and 53 </ b> B and the cover member 16. Bosses 47A and 47B and through holes 15A and 15B formed in the substrate 12 are provided. In the present embodiment, the board 12 and the cover member 16 are coupled by tightening the screws 53A and 53B from the back surface 12b of the substrate 12 (the surface opposite to the mounting surface 12a) toward the cover member 16. Accordingly, screw holes 47a are formed in the bosses 47A and 47B of the cover member 16, and the through holes 15A and 15B of the substrate 12 are insertion holes through which the screws 53A and 53B are passed. Boss 47A, 47B protrudes from the surface 14a of the base part 41 to the front side (Z-axis positive side). This ensures a sufficient length of the screw hole 47a. Note that the screw holes 47a may be simply formed in the base portion 41 without providing the bosses 47A and 47B. The screw holes 47a (that is, the bosses 47A and 47B) of the cover member 16 and the through holes 15A and 15B of the substrate 12 are arranged at the same position when viewed from the optical axis direction. The centers of the boss 47A and the through hole 15A are arranged on the reference line L3, and are provided at positions on the outer peripheral side of the claw portion 51A (see FIG. 2). The centers of the boss 47B and the through hole 15B are arranged on the reference line L3, and are provided at positions on the outer peripheral side of the claw portion 51B (see FIG. 2).

上述のような押圧構造17によれば、レンズ部材28の円環部26内の領域に封止部材29を装填した状態で、レンズ部材28を基板12の実装面12a上に実装し、基板12の実装面12aをカバー部材16で覆う。この状態では、封止部材29には押圧力は付与されていない。次に、基板12の裏面12b側から貫通孔15A,15Bを介してボス47A,47Bのネジ孔47aにネジ53A,53Bを締め付ける。当該締め付けによって、基板12とカバー部材16とが光軸方向に近接するように移動する。これに伴い、爪部51A,51Bも基板12の実装面12a側へ移動し、当該爪部51A,51Bでフランジ部27A,27Bが基板12側へ押し付けられることによって、レンズ部材28全体が基板12側へ移動する。以上によって、封止部材29には、基板12及びレンズ部材28で挟まれることによって、押圧力が付与される。なお、フランジ部27A,27B、爪部51A,51B、及びボス47A,47B等が基準線L3に近接する箇所に設けられている。従って、ネジ53A,53Bを締めることによって発生する押圧力が効率良く爪部51A,51B及びフランジ部27A,27Bへ伝達される。なお、基準線L3と交差する対角方向に設定される基準線L4側でもネジ留めを行ってもよいが、基準線L3側のみで行うことで、作業性を向上させることができ、部品点数を減らすことができる。   According to the pressing structure 17 as described above, the lens member 28 is mounted on the mounting surface 12a of the substrate 12 in a state where the sealing member 29 is loaded in the region in the annular portion 26 of the lens member 28, and the substrate 12 The mounting surface 12 a is covered with a cover member 16. In this state, no pressing force is applied to the sealing member 29. Next, the screws 53A and 53B are fastened from the back surface 12b side of the substrate 12 to the screw holes 47a of the bosses 47A and 47B through the through holes 15A and 15B. By the tightening, the substrate 12 and the cover member 16 are moved so as to be close to each other in the optical axis direction. Accordingly, the claw portions 51A and 51B are also moved to the mounting surface 12a side of the substrate 12, and the flange portions 27A and 27B are pressed against the substrate 12 side by the claw portions 51A and 51B, whereby the entire lens member 28 is moved to the substrate 12. Move to the side. Thus, a pressing force is applied to the sealing member 29 by being sandwiched between the substrate 12 and the lens member 28. The flange portions 27A and 27B, the claw portions 51A and 51B, the bosses 47A and 47B, and the like are provided at locations close to the reference line L3. Therefore, the pressing force generated by tightening the screws 53A and 53B is efficiently transmitted to the claw portions 51A and 51B and the flange portions 27A and 27B. In addition, although screwing may be performed also on the reference line L4 side set in the diagonal direction intersecting with the reference line L3, workability can be improved by performing only on the reference line L3 side, and the number of parts Can be reduced.

次に、本実施形態に係る発光素子モジュール1の作用・効果について説明する。   Next, functions and effects of the light emitting element module 1 according to the present embodiment will be described.

比較例に係る発光素子モジュールとして、基板及びレンズ(光制御部)がインサート成形された構造について説明する。このような発光素子モジュールは、インサート成形によって製造されているため成形時のコストがかさんでしまう。また、インサート成形は、金型との関係で、レンズの形状及び大きさが特定の1つに決まっている必要があるため、用途に応じてレンズをフレキシブルに変更することも困難である。   As a light emitting element module according to a comparative example, a structure in which a substrate and a lens (light control unit) are insert-molded will be described. Since such a light emitting element module is manufactured by insert molding, the cost at the time of molding is increased. In insert molding, since the shape and size of the lens need to be determined as a specific one in relation to the mold, it is difficult to change the lens flexibly according to the application.

また、他の比較例に係る発光素子モジュールとして、カバー部材に形成された開口部の内縁部とレンズ(光制御部)の外周縁部との間を、外側からポッティングすることによって防水性能を確保した構造について説明する。このような発光素子モジュールでは、光学特性が変わらないようにレンズ周りには正確にポッティングする必要があるため、ポッティングは手作業ではなく専用のロボットを用いる必要がありコストがかさんでしまう。また、ロボットを用いる場合には、レンズの形状や大きさの変更時にロボットの設定(プログラム)を変更する必要があり、手間とコストがかかってしまう。さらに、上述したレンズ周りのポッティングには、光学的な理由からポッティング用の充填材として着色したものを用いることができず、紫外線等による劣化に強く有利な光学特性を有する充填材(例えばシリコーン)を用いる必要があるが、このような充填材は乾きにくく(24時間程度)、作業性が悪い。また、上述したポッティング箇所以外のポッティング箇所(ワイヤーと基板の電極を接続した部分のポッティング箇所)では、光学特性が必要とされないにもかかわらず、作業性の観点から、レンズ周りのポッティングで用いられるのと同じ充填材が用いられており、作業性が悪い。すなわち、上述したいずれの比較例に係る発光素子モジュールにおいても、十分な防水性能と製造の容易性を両立することが困難であった。   Moreover, as a light emitting element module according to another comparative example, waterproof performance is ensured by potting from the outside between the inner edge of the opening formed in the cover member and the outer peripheral edge of the lens (light control unit). The structure made will be described. In such a light emitting element module, it is necessary to accurately pot around the lens so that the optical characteristics do not change. Therefore, it is necessary to use a dedicated robot instead of manual work, and the cost increases. In addition, when a robot is used, it is necessary to change the setting (program) of the robot when changing the shape and size of the lens, which takes time and cost. Further, in the potting around the lens described above, a colored material as a potting filler cannot be used for optical reasons, and a filler (for example, silicone) having advantageous optical characteristics that is strong against deterioration due to ultraviolet rays or the like. However, such fillers are difficult to dry (about 24 hours) and workability is poor. Further, in the potting locations other than the above-described potting locations (potting locations where the wires and the electrodes of the substrate are connected), optical properties are not required, but they are used for potting around the lens from the viewpoint of workability. The same filler is used and the workability is poor. That is, in any of the light emitting element modules according to any of the comparative examples described above, it is difficult to achieve both sufficient waterproof performance and ease of manufacture.

また、他の比較例に係る発光素子モジュールとして、筐体の内部領域に基板を配置し、筐体の内部領域に樹脂を充填することにより、基板全体を樹脂で覆うことで防水性能を確保する構造(例えば、特許文献1の構造)について説明する。このような構造では、基板の裏面に平板及び載置部が配置され、さらに基板の裏面側に充填材(樹脂)が封入されるため、放熱効果が低減してしまう場合がある。また、製品検査で不具合が見つかった場合に、交換や修理の作業性が低減し、リワーク性能を確保できない場合がある。また、封入する充填材の量が多い上、発光素子周辺も覆うため有利な光学特性を有する乾きにくい充填材を用いる必要がある。従って、充填材を乾燥させるために時間がかかってしまい、製造の容易性を向上することが求められる。   In addition, as a light emitting element module according to another comparative example, a substrate is disposed in an inner region of a housing, and a resin is filled in the inner region of the housing, thereby ensuring waterproof performance by covering the entire substrate with resin. The structure (for example, the structure of Patent Document 1) will be described. In such a structure, since the flat plate and the mounting portion are disposed on the back surface of the substrate and the filler (resin) is sealed on the back surface side of the substrate, the heat dissipation effect may be reduced. In addition, when a defect is found in the product inspection, workability for replacement and repair is reduced, and rework performance may not be ensured. In addition, since the amount of filler to be sealed is large and the periphery of the light emitting element is also covered, it is necessary to use a filler that has advantageous optical characteristics and is difficult to dry. Therefore, it takes time to dry the filler, and it is required to improve the ease of production.

それに対し、本実施形態に係る発光素子モジュール1では、封止部14は、基板12の実装面12a側で、当該実装面12aに対して垂直方向に見て少なくとも発光素子11を取り囲むように配置されている。また、封止部14は、押圧構造17によって付与される押圧力により、封止部14の内周側における、基板12と光制御部13との間の空間SPを封止する。すなわち、封止部14は、基板12の実装面12aと光制御部13の入射面13aとの間における発光素子11周辺の空間に水が浸入することを防止できる。従って、発光素子11に水が浸入することを防止できると共に、光制御部13の入射面13a側に水が浸入することによって光学特性に影響が及ぼされることを防止できる。また、実装面12aに対して垂直方向に見て発光素子11を取り囲むように封止部14を配置すると共に押圧構造17で押圧力を付与するだけの簡単な構造であるため、容易に製造を行うことができる。   On the other hand, in the light emitting element module 1 according to the present embodiment, the sealing portion 14 is disposed on the mounting surface 12a side of the substrate 12 so as to surround at least the light emitting element 11 when viewed in the direction perpendicular to the mounting surface 12a. Has been. Further, the sealing unit 14 seals the space SP between the substrate 12 and the light control unit 13 on the inner peripheral side of the sealing unit 14 by the pressing force applied by the pressing structure 17. That is, the sealing unit 14 can prevent water from entering the space around the light emitting element 11 between the mounting surface 12 a of the substrate 12 and the incident surface 13 a of the light control unit 13. Therefore, it is possible to prevent water from entering the light emitting element 11 and to prevent the optical characteristics from being affected by the water entering the light incident surface 13 a side of the light control unit 13. In addition, since the sealing portion 14 is disposed so as to surround the light emitting element 11 when viewed in the vertical direction with respect to the mounting surface 12a and the pressing structure 17 is used to apply a pressing force, the manufacturing is easily performed. It can be carried out.

また、このような簡単な構造を採用することで、上述の比較例に係る構造のように、インサート成型を用いる必要がなく、光制御部13に対してロボットを用いて高精度なポッティングを行う必要がないため、光制御部13の形状及び大きさを用途に応じてフレキシブルに選択することができる。また、ポッティングを行うことなく、光学特性に関わる発光素子11周辺に対する防水性能を確保できるため、上述の比較例に係る構造のように、乾きにくい充填材を用いる必要がない。更に、発光素子11周辺に対してポッティングを行っていないため、ワイヤ21を半田付けした半田部23のポッティング箇所(ポッティング部44)に対しては、例えば、変成シリコーン樹脂、ポリウレタン樹脂、アクリル樹脂などの安価で乾き易い充填材を採用することが可能となる。従って、充填材を乾かすための時間を短縮することができる。また、基板12の裏面12bは他の部材及び充填材で覆われない構造とすることができるため、放熱性能を高めることができる。また、製品検査で不具合が見つかった場合も、容易に交換作業や修理作業を行うことができるため、リワーク性能を向上させることができる。以上により、容易に製造を行うことができると共に、十分な防水性能を確保することができる。   Further, by adopting such a simple structure, it is not necessary to use insert molding as in the structure according to the comparative example described above, and high-precision potting is performed on the light control unit 13 using a robot. Since it is not necessary, the shape and size of the light control unit 13 can be flexibly selected according to the application. Moreover, since the waterproof performance with respect to the periphery of the light emitting element 11 related to the optical characteristics can be ensured without performing potting, it is not necessary to use a filler that is difficult to dry unlike the structure according to the above-described comparative example. Further, since the potting is not performed on the periphery of the light emitting element 11, the potting portion (potting portion 44) of the solder portion 23 to which the wire 21 is soldered is, for example, modified silicone resin, polyurethane resin, acrylic resin, or the like. It is possible to use a filler that is inexpensive and easy to dry. Therefore, the time for drying the filler can be shortened. Moreover, since the back surface 12b of the board | substrate 12 can be set as the structure which is not covered with another member and a filler, heat dissipation performance can be improved. In addition, even when a defect is found in the product inspection, the replacement work and the repair work can be easily performed, so that the rework performance can be improved. As described above, manufacturing can be easily performed and sufficient waterproof performance can be ensured.

また、本実施形態に係る発光素子モジュール1において、封止部14は、光制御部13を備えるレンズ部材28とは別体の封止部材29によって構成されている。このように、封止部14と光制御部13を備えるレンズ部材28とを別体の部材として構成することによって、封止部材29を用途によらない共通部品として用いる一方、光制御部13の形状及び大きさ(すなわち、レンズ部材28の形状及び大きさ)を用途に合わせてフレキシブルに選択することが可能となる。   Further, in the light emitting element module 1 according to the present embodiment, the sealing portion 14 is configured by a sealing member 29 that is separate from the lens member 28 including the light control unit 13. In this way, by configuring the sealing member 14 and the lens member 28 including the light control unit 13 as separate members, the sealing member 29 is used as a common component regardless of the application, while the light control unit 13 The shape and size (that is, the shape and size of the lens member 28) can be flexibly selected according to the application.

また、本実施形態に係る発光素子モジュール1において、封止部材29は、光制御部13側に粘着層34を備えている。封止部材29に対するレンズ部材28の接触面が粗面(平面部13c)である場合、封止部材29の粘着層34が粗面に接触する。これによって、封止部材29とレンズ部材28(光制御部13)と間の密着性が良くなるため、発光素子モジュール1の防水性能を更に向上させることができる。   Moreover, in the light emitting element module 1 according to the present embodiment, the sealing member 29 includes the adhesive layer 34 on the light control unit 13 side. When the contact surface of the lens member 28 with respect to the sealing member 29 is a rough surface (plane portion 13c), the adhesive layer 34 of the sealing member 29 contacts the rough surface. Thereby, since the adhesiveness between the sealing member 29 and the lens member 28 (light control unit 13) is improved, the waterproof performance of the light emitting element module 1 can be further improved.

ここで、本発明に係る発明者らは、鋭意研究の結果、光制御部13の入射面13aの外周側の一部に封止部14が配置されていても、十分な光学特性を確保することができることを見出した。従って、本実施形態に係る発光素子モジュール1において、封止部14は、実装面12aに対して垂直方向に見て、光制御部13と重なるように配置される。これにより、光軸方向から見たときに、封止部14を配置するためだけに必要となるスペースを確保する必要がない(例えば、光制御部13の外周側に封止部14を配置するための大きなフランジ部を設ける必要がない)ため、発光素子モジュール1が大きくなることを抑制することができる。   Here, the inventors of the present invention, as a result of intensive research, ensure sufficient optical characteristics even if the sealing portion 14 is disposed on a part of the outer peripheral side of the incident surface 13a of the light control portion 13. I found that I can do it. Therefore, in the light emitting element module 1 according to the present embodiment, the sealing portion 14 is disposed so as to overlap the light control portion 13 when viewed in the direction perpendicular to the mounting surface 12a. Thereby, when viewed from the optical axis direction, it is not necessary to secure a space necessary only for disposing the sealing portion 14 (for example, the sealing portion 14 is disposed on the outer peripheral side of the light control portion 13). For this reason, it is not necessary to provide a large flange portion for this purpose, so that the light emitting element module 1 can be prevented from becoming large.

また、本実施形態に係る発光素子モジュール1において、基板12の実装面12a側を覆うカバー部材16を更に備え、カバー部材16には、内周側に光制御部13が配置される開口部43が形成され、開口部43の内縁部43aと光制御部13とが実装面12aと平行な方向に離間することで、基板12の実装面12aの少なくとも一部が露出する。基板12は、発光素子11の発光の際に発熱する部材である。従って、カバー部材16と基板12との間に水が浸入しても、基板12の熱を用いることにより、基板12の実装面12aが露出した部分から水分を逃がすことができる。   The light emitting element module 1 according to the present embodiment further includes a cover member 16 that covers the mounting surface 12a side of the substrate 12, and the cover member 16 has an opening 43 in which the light control unit 13 is disposed on the inner peripheral side. And the inner edge 43a of the opening 43 and the light control unit 13 are separated in a direction parallel to the mounting surface 12a, so that at least a part of the mounting surface 12a of the substrate 12 is exposed. The substrate 12 is a member that generates heat when the light emitting element 11 emits light. Therefore, even if water permeates between the cover member 16 and the substrate 12, moisture can be released from the portion where the mounting surface 12 a of the substrate 12 is exposed by using the heat of the substrate 12.

また、本実施形態に係る発光素子モジュール1において、基板12の実装面12a側を覆うカバー部材16を更に備え、締付部材によって基板12とカバー部材16とが連結される。締付部材として、ネジ、ボルト及びナット、リベット、嵌め合い構造に係る部材などを採用することができる。これによって、容易に押圧構造17を構成することができる。   Moreover, the light emitting element module 1 according to the present embodiment further includes a cover member 16 that covers the mounting surface 12a side of the substrate 12, and the substrate 12 and the cover member 16 are connected by a fastening member. As the tightening member, a screw, a bolt and a nut, a rivet, a member related to a fitting structure, or the like can be employed. Thereby, the pressing structure 17 can be configured easily.

また、本実施形態に係る発光素子モジュール1において、締付部材はネジ53A,53Bであって、基板12の裏面12bからカバー部材16へ向かってネジ53A,53Bを締めることによって、基板12とカバー部材16とが連結される。例えば、カバー部材16側から基板12へ向かってネジを締める構成を採用した場合(なお、本発明はこのような形態も変形例として含んでよい)、基板12の貫通孔15A,15Bをネジ切る必要がある。しかしながら、ネジ切り作業が失敗した場合に、コストの高い基板12を破棄する必要が生じる。また、基板12は設計上の制約や材料上の制約があるため、ボスなどを設け難い。一方、基板12の裏面12bからカバー部材16へ向かってネジ53A,53Bを締める構成を採用した場合、カバー部材16の貫通孔をネジ孔47aとすればよい。カバー部材16は基板12に比してコストが安いため、ネジ切り作業が失敗したときのコストに対する影響が少ない。また、カバー部材16は基板12に比して設計上の制約や材料上の制約が少ないため、貫通孔(ネジ孔47a)に対応する部分にボス47A,47Bを設けることで、ネジ53A,53Bを十分に締め付けることができる。これにより、確実に押圧力を発生させることができる。   Further, in the light emitting element module 1 according to the present embodiment, the tightening members are screws 53A and 53B, and by tightening the screws 53A and 53B from the back surface 12b of the substrate 12 toward the cover member 16, the substrate 12 and the cover are covered. The member 16 is connected. For example, when a configuration in which a screw is tightened from the cover member 16 side toward the substrate 12 (the present invention may include such a form as a modification), the through holes 15A and 15B of the substrate 12 are threaded. There is a need. However, when the threading operation fails, it is necessary to discard the expensive substrate 12. Further, since the substrate 12 has design restrictions and material restrictions, it is difficult to provide a boss or the like. On the other hand, when the configuration in which the screws 53A and 53B are tightened from the back surface 12b of the substrate 12 toward the cover member 16 is employed, the through hole of the cover member 16 may be a screw hole 47a. Since the cost of the cover member 16 is lower than that of the substrate 12, there is little influence on the cost when the threading operation fails. Further, since the cover member 16 has fewer design restrictions and material restrictions than the substrate 12, the screws 53A and 53B are provided by providing bosses 47A and 47B at portions corresponding to the through holes (screw holes 47a). Can be tightened sufficiently. Thereby, a pressing force can be generated reliably.

以上、本発明をその実施形態に基づいて詳細に説明した。しかし、本発明は上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で様々な変形が可能である。例えば、封止部14と光制御部13の平面部13cとの密着性を向上させる構成として、封止部14の上面14aに両面テープ36が設けられた構成について説明したが、封止部とレンズの粗面との密着性を向上させる構成はこれに限定されない。   The present invention has been described in detail based on the embodiments. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. For example, the configuration in which the double-sided tape 36 is provided on the upper surface 14a of the sealing portion 14 has been described as a configuration for improving the adhesion between the sealing portion 14 and the flat portion 13c of the light control portion 13. The configuration for improving the adhesion with the rough surface of the lens is not limited to this.

すなわち、図7(a)に示されるように、封止部114を構成する封止部材129の材料として、光制御部13の入射面13a(粗面)に対して表面追従性の高い材料を用いることで、封止部材129と光制御部13の粗面との密着性を向上させてもよい。具体的に、封止部材129は、発泡シリコーンによって構成されてよい。これによって、両面テープ等の粘着層を設けなくともよく、単一の材料にて封止部114を構成することができる。また、図7(b)に示されるように、レンズ部材228自体を弾性材料で構成することで、光制御部13と封止部214を一体の部材としてもよい。   That is, as shown in FIG. 7A, a material having a high surface followability with respect to the incident surface 13a (rough surface) of the light control unit 13 is used as the material of the sealing member 129 constituting the sealing unit 114. By using, the adhesion between the sealing member 129 and the rough surface of the light control unit 13 may be improved. Specifically, the sealing member 129 may be made of foamed silicone. Thereby, it is not necessary to provide an adhesive layer such as a double-sided tape, and the sealing portion 114 can be formed of a single material. Further, as shown in FIG. 7B, the light control unit 13 and the sealing unit 214 may be formed as an integral member by forming the lens member 228 itself from an elastic material.

また、封止部は、光制御部と基板との間に配置されていなくともよい。例えば、光軸方向から見て、封止部が光制御部と重ならないように当該光制御部よりも外周側に配置され、フランジ部のみに重なるように配置されてもよい。この場合には、フランジ部は、封止部を配置するのに十分な大きさが確保され、光制御部の全周にわたって形成される。   Further, the sealing portion may not be disposed between the light control portion and the substrate. For example, when viewed from the optical axis direction, the sealing portion may be disposed on the outer peripheral side of the light control unit so as not to overlap the light control unit, and may be disposed so as to overlap only the flange portion. In this case, the flange portion has a sufficient size to arrange the sealing portion, and is formed over the entire circumference of the light control portion.

また、レンズ部材の形状は特に限定されず、あらゆる構成を採用してよい。例えば、上述した実施形態では、フランジ部27A,27Bの裏面は、光制御部の入射面である平面部13cよりも基板12側に配置されているが、これに限定されず、フランジ部の下面と光制御部の入射面とは同一面となってもよいし、フランジ部の下面が光制御部の入射面よりも基板から離れた位置に配置されてもよい。また、円環部が省略されており、光制御部に直接フランジ部が設けられていてよい。   Further, the shape of the lens member is not particularly limited, and any configuration may be adopted. For example, in the above-described embodiment, the back surfaces of the flange portions 27A and 27B are disposed closer to the substrate 12 than the flat surface portion 13c that is the incident surface of the light control unit. And the incident surface of the light control unit may be the same surface, or the lower surface of the flange portion may be disposed at a position farther from the substrate than the incident surface of the light control unit. Moreover, the annular part is abbreviate | omitted and the light control part may be provided with the flange part directly.

また、封止部を位置決めするための溝やガイド部を、基板や、フランジ部、光制御部に設けてもよい。ただし、光制御部に溝やガイド部を設ける場合は、光学特性に影響を及ぼさない位置、大きさとする。   Moreover, you may provide the groove | channel and guide part for positioning a sealing part in a board | substrate, a flange part, and a light-control part. However, when a groove or a guide part is provided in the light control unit, the position and size do not affect the optical characteristics.

また、押圧構造は、実施形態のようなネジを用いた構造にかぎられない。スライド構造を用いて押圧してもよいし、カバー部材と基板とを強く挟み込み、押圧力を残留させた状態で接着や溶着で固定してもよい。また、レンズ部材のフランジ部を大きく確保し、フランジ部と基板を直接ネジ留めしてもよい。   Further, the pressing structure is not limited to the structure using screws as in the embodiment. The pressing may be performed using a slide structure, or the cover member and the substrate may be firmly sandwiched and fixed by adhesion or welding with the pressing force remaining. Further, a large flange portion of the lens member may be secured, and the flange portion and the substrate may be directly screwed.

本発明に含まれるものではないが、参考形態として、本発明の封止部に代えて、発光素子のまわりに接着剤をリング状に塗布し、当該管状の接着剤でレンズ部材を基板に固定することによって、発光素子周辺の空間を封止する構造が挙げられる。   Although not included in the present invention, as a reference form, instead of the sealing portion of the present invention, an adhesive is applied around the light emitting element in a ring shape, and the lens member is fixed to the substrate with the tubular adhesive. By doing so, a structure for sealing the space around the light emitting element can be given.

[実施例]
以下、実施例に基づいて本発明の一形態に係る発光素子モジュールを具体的に説明するが、発光素子モジュールの構成は下記の実施例に限定されるものではない。
[Example]
Hereinafter, although the light emitting element module which concerns on one form of this invention based on an Example is demonstrated concretely, the structure of a light emitting element module is not limited to the following Example.

(防水性)
封止部材のショアA硬度、及び、封止部材に設けられる両面テープの有無についての条件を変えた発光素子モジュールを複数(実施例1〜3)準備し、それぞれに対して防水試験を実施し評価を行った。また、図7(a)に示すような封止部材を発泡シリコーンで構成した実施例4に係る発光素子モジュールを準備し、評価を行った。防水試験は、水深1mで60分又は24時間水に浸した際に浸水しているか否かを判定するものである。浸水の有無は、顕微鏡でレンズ内部を観察することにより確認した。実施例1〜3の構造は、封止部材の構図を除いては、図1などに示す実施例と同様である。
(Waterproof)
Prepare a plurality of light emitting element modules (Examples 1 to 3) with different conditions regarding the Shore A hardness of the sealing member and the presence or absence of the double-sided tape provided on the sealing member, and perform a waterproof test on each. Evaluation was performed. Moreover, the light emitting element module which concerns on Example 4 which comprised the sealing member as shown to Fig.7 (a) with foaming silicone was prepared, and evaluation was performed. The waterproof test is to determine whether or not the water is immersed when immersed in water at a depth of 1 m for 60 minutes or 24 hours. The presence or absence of water immersion was confirmed by observing the inside of the lens with a microscope. The structure of Examples 1-3 is the same as that of the Example shown in FIG. 1 etc. except the composition of a sealing member.

図8(a)に示されるように、実施例1に係る発光素子モジュールは、封止部材のショアA硬度を70とし、両面テープを設けていない。また、実施例2に係る発光素子モジュールは、封止部材のショアA硬度を50とし、両面テープを設けていない。また、実施例3に係る発光素子モジュールは、封止部材のショアA硬度を50とし、両面テープ(DIC社製:♯8625)を設けた。実施例4に係る発光素子モジュールは、封止部材を発光シリコーン(サンポリマー社製)で構成した。なお、各実施例において、発光素子、レンズ部材、カバー部材、及びポッティング部への充填材は、同一のものが用いられた。   As shown in FIG. 8A, the light emitting element module according to Example 1 has a Shore A hardness of 70 as the sealing member and is not provided with a double-sided tape. In the light emitting element module according to Example 2, the Shore A hardness of the sealing member is 50, and no double-sided tape is provided. In the light emitting element module according to Example 3, the sealing member had a Shore A hardness of 50, and a double-sided tape (manufactured by DIC: # 8625) was provided. In the light emitting element module according to Example 4, the sealing member was made of light emitting silicone (manufactured by Sun Polymer Co., Ltd.). In each example, the same filler was used for the light emitting element, the lens member, the cover member, and the potting portion.

上記実施例1〜3についての防水試験の結果は、図8(b)に示されるように、いずれの実施例においても、60分間の条件では、全サンプルについて浸水は確認されず合格であった。また、実施例3では、24時間の条件でも全サンプルについて浸水は確認されず合格であった。以上より、封止部材に両面テープを設けることによって、防水性能を更に向上できることが確認された。また、図9に示されるように、発泡シリコーンで構成される封止部材を用いる実施例4では、60分の条件でも24時間の条件でも、全サンプルについて浸水は確認されず合格であった。   As shown in FIG. 8 (b), the results of the waterproof test for Examples 1 to 3 were acceptable in all examples under the condition of 60 minutes, with no water immersion confirmed for all samples. . Moreover, in Example 3, water immersion was not confirmed about all the samples also on the conditions for 24 hours, but it was a pass. From the above, it was confirmed that the waterproof performance can be further improved by providing a double-sided tape on the sealing member. In addition, as shown in FIG. 9, in Example 4 using a sealing member made of foamed silicone, water immersion was not confirmed for all samples under both 60 minutes and 24 hours conditions, and passed.

(光学的特性)
比較例として実施例3に対して封止部材を省略した発光素子モジュールを準備し、当該比較例に係る発光素子モジュール及び実施例3に係る発光素子モジュールについて、配向角と光の強度の関係を測定した。なお、配向角とは、光軸RLに対する角度を示し図6においてαで示す角度である。結果は図10に示されるように、実施例3(実線で示されるグラフ)の光学的特性と比較例(点線で示されるグラフ)の光学的特性を比較した場合、実施例3のように光制御部の入射面と封止部材を接触させても、封止部材を配置しない比較例と略同等の光学的特性が得られていることが理解される。また、実施例3のグラフを参照しても、図10において二点鎖線で示すように部分的に光の強度が強くなる(この場合、出射光にリング状のムラができる)ポイントは確認されず、良好な光学的特性が得られていることが確認される。
(Optical characteristics)
As a comparative example, a light-emitting element module in which the sealing member is omitted from Example 3 is prepared. With respect to the light-emitting element module according to the comparative example and the light-emitting element module according to Example 3, It was measured. The orientation angle indicates an angle with respect to the optical axis RL and is an angle indicated by α in FIG. As shown in FIG. 10, when the optical characteristics of Example 3 (graph indicated by a solid line) and the optical characteristics of a comparative example (graph indicated by a dotted line) are compared, the result is as shown in FIG. It is understood that even if the entrance surface of the control unit and the sealing member are brought into contact with each other, substantially the same optical characteristics as those of the comparative example in which the sealing member is not disposed are obtained. Further, referring to the graph of Example 3, the point where the light intensity is partially increased as shown by the two-dot chain line in FIG. Thus, it is confirmed that good optical characteristics are obtained.

1…発光素子モジュール、11…発光素子、12…基板、12a…実装面、13…光制御部、14,214…封止部、16…カバー部材、17…押圧構造、28…レンズ部材、28,128…封止部材(封止部)、34…粘着層、36…両面テープ(粘着層)、43…開口部。   DESCRIPTION OF SYMBOLS 1 ... Light emitting element module, 11 ... Light emitting element, 12 ... Board | substrate, 12a ... Mounting surface, 13 ... Light control part, 14, 214 ... Sealing part, 16 ... Cover member, 17 ... Press structure, 28 ... Lens member, 28 128 ... sealing member (sealing part), 34 ... adhesive layer, 36 ... double-sided tape (adhesive layer), 43 ... opening.

Claims (7)

光を発生する発光素子と、
前記発光素子が実装された基板と、
前記基板の実装面側に配置され、前記発光素子で発生する光の出射の制御を行う光制御部と、
前記基板の前記実装面側で、当該実装面に対して垂直方向に見て少なくとも前記発光素子を取り囲むように配置される封止部と、
前記基板の前記実装面側を覆うカバー部材と、
前記基板と前記カバー部材とを連結する締付部材によって、前記封止部に押圧力を付与する押圧構造と、を備え、
前記封止部は、前記押圧力により、前記封止部の内周側における、少なくとも前記基板と前記光制御部との間の空間を封止する、発光素子モジュール。
A light emitting element for generating light;
A substrate on which the light emitting element is mounted;
A light control unit that is disposed on the mounting surface side of the substrate and controls emission of light generated by the light emitting element;
A sealing portion disposed on the mounting surface side of the substrate so as to surround at least the light emitting element when viewed in a direction perpendicular to the mounting surface;
A cover member covering the mounting surface side of the substrate;
A pressing structure that applies a pressing force to the sealing portion by a tightening member that connects the substrate and the cover member ;
The sealing unit is a light emitting element module that seals at least a space between the substrate and the light control unit on the inner peripheral side of the sealing unit by the pressing force.
前記封止部は、前記光制御部を備える部材とは別体の封止部材によって構成されている、請求項1に記載の発光素子モジュール。   The light emitting element module according to claim 1, wherein the sealing portion is configured by a sealing member separate from a member including the light control unit. 前記封止部材は、前記光制御部側に粘着層を備える、請求項2に記載の発光素子モジュール。   The light emitting element module according to claim 2, wherein the sealing member includes an adhesive layer on the light control unit side. 前記封止部材は、発泡シリコーンによって構成される、請求項2に記載の発光素子モジュール。   The light emitting element module according to claim 2, wherein the sealing member is made of foamed silicone. 前記封止部は、前記実装面に対して垂直方向に見て、前記光制御部と重なるように配置される、請求項1〜4の何れか一項に記載の発光素子モジュール。   The light emitting element module according to claim 1, wherein the sealing portion is disposed so as to overlap the light control portion when viewed in a direction perpendicular to the mounting surface. 前記基板の前記実装面側を覆うカバー部材を更に備え、
前記カバー部材には、内周側に前記光制御部が配置される開口部が形成され、
前記開口部の内縁部と前記光制御部とが前記実装面と平行な方向に離間することで、前記基板の前記実装面の少なくとも一部が露出する、請求項1〜5の何れか一項に記載の発光素子モジュール。
A cover member covering the mounting surface side of the substrate;
The cover member is formed with an opening on the inner peripheral side where the light control unit is disposed,
The inner edge part of the said opening part and the said light control part are spaced apart in the direction parallel to the said mounting surface, and at least one part of the said mounting surface of the said board | substrate is exposed. The light emitting device module according to 1.
前記締付部材はネジであって、
前記基板の前記実装面の反対側の面から前記カバー部材へ向かってネジを締めることによって、前記基板と前記カバー部材とが連結される、請求項に記載の発光素子モジュール。
The fastening member is a screw,
These screws toward the surface opposite to the mounting surface of the substrate to the cover member, the substrate and the said cover member is connected, the light emitting device module of claim 1.
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