JP2011054759A - Wavelength converting member-holding member and method of manufacturing the same, heat radiation structure of the wavelength converting member, and light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote cost reduction by simplifying a heat radiation structure of a wavelength conversion member by causing a holding member to function to conduct heat. <P>SOLUTION: The holding member 5 holds the wavelength conversion member 5 which is irradiated with laser light to convert it into light of a different wavelength and to radiate it and includes a holding part 6a holding the wavelength conversion member 5, and a plurality of fitting support parts 6b extended outward from the holding part 6a. The holding part 6a is integrated with the fitting support members 6b with a favorable heat conductive material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a holding member for a wavelength conversion member that receives a laser beam and converts it into light of a different wavelength and emits it, a method for manufacturing the same, a heat dissipation structure for the wavelength conversion member, and a light emitting device.

  Conventionally, a semiconductor laser element (LD), a bendable optical fiber that guides the laser light, and a wavelength that is irradiated with the laser light guided to the optical fiber and converted into light of a different wavelength and emitted. 2. Description of the Related Art A light-emitting device that includes a conversion member and includes a holding member that holds a wavelength conversion member at the end of the optical fiber is known (see Patent Document 1).

  In this light emitting device, since the semiconductor laser element is used as the light source, the luminance of the light emitted from the light source can be increased as compared with the case where a halogen lamp or the like is used as the light source.

  However, when the wavelength of the laser beam is converted by the wavelength conversion member, it is also partially converted into thermal energy, and heat is locally generated in the portion irradiated with the laser beam, and the wavelength conversion member is deteriorated (discolored or deformed). There is a case. For this reason, there is a problem that the lifetime of the light emitting device is shortened unless the heat of the wavelength conversion member is dissipated.

  Therefore, in Patent Document 1 described above, one end of a wire-like or pipe-like heat conducting member is thermally connected to the holding member, and the heat conducting member is stretched along the optical fiber, so that the wavelength converting member is used. A heat dissipating structure is disclosed in which generated heat is conveyed through a heat conducting member to dissipate heat.

JP 2007-335514 A (refer to claim 1, claim 4, FIG. 1 etc.)

  However, the heat dissipation structure of Patent Document 1 has a problem in that the number of parts is large and the structure is complicated because the heat conducting member is formed separately from the holding member. Further, since the heat conducting member is guided to the heat radiating side along the bendable optical fiber, there is a limitation on the structure, and there is a problem that sufficient heat radiation cannot be performed when the heat generation amount of the wavelength conversion member increases.

  In view of the above problems, the present invention allows the wavelength conversion member holding member to have both the function of the mounting member for attaching the wavelength conversion member to a predetermined position and the function of the heat conduction member to the heat radiating member. An object of the present invention is to simplify the heat dissipation structure and improve the heat dissipation effect.

  In order to achieve the above object, the present invention provides a holding member for holding a wavelength conversion member that receives a laser beam and converts it into light of a different wavelength and emits it, and holds the wavelength conversion member. And a mounting support portion protruding from the holding portion in the outer peripheral direction of the laser light irradiation optical axis, and the holding portion and the mounting support portion are integrally formed of a heat-conductive material. It is characterized by that.

  According to this configuration, since the holding portion of the holding member and the mounting support portion are integrally formed of a good heat conductive material, the heat generated by the wavelength conversion member is directly transmitted to the holding portion, and the integrally formed mounting Since heat is transferred in the support portion, the structure is simple and the heat dissipation efficiency is improved as compared with the case where the heat conducting member is formed separately from the holding member. Therefore, it is not necessary to join a heat radiating member to most of the wavelength conversion member, and a minimum area may be used as the joining surface, which is suitable for realizing a small light emitting point.

  In addition, when the mounting support portion is attached to the heat radiating member, the wavelength conversion member is positioned at a predetermined place, and at the same time, a heat radiating structure of the wavelength conversion member is obtained, and effective heat dissipation is achieved via the mounting support portion. It can be performed.

  In addition, since the space between the mounting support portions becomes a space, the weight does not increase, and even when the wavelength-converted light passes through the holding member, it does not hinder the passage of light so much and is suitable for the light emitting device. It becomes. Moreover, when the calorific value of the wavelength conversion member is large, it can be easily handled by slightly increasing the diameter of the mounting support part or increasing the number of mounting support parts.

  In the present invention, the holding member having the above-described structure is made of a heat transfer anisotropic material, and the direction of the mounting support portion is matched with the direction of high heat conductivity of the heat transfer anisotropic material. . According to this, the heat of the wavelength conversion member transmitted to the holding portion is quickly transferred from the holding portion in the protruding direction of the mounting support portion, and the heat is hardly transferred in the direction orthogonal to the protruding direction. Therefore, it is possible to reduce the fluctuation of the light passing through the warming of the air at the mounting support portion.

  Note that graphite can be suitably used as the heat transfer anisotropic material. Since the thermal conductivity of graphite is very large, the diameter of the mounting support portion can be reduced. As a result, the weight can be reduced, which contributes to the weight reduction of the light emitting device. In that case, by cutting out in the XY plane of the graphite block, it is possible to easily manufacture a holding member that matches the protruding direction of the mounting support portion with the direction of high thermal conductivity of the heat transfer anisotropic material. Graphite is a suitable heat transfer anisotropic material because it is less affected by aging due to rust and the like and has strength as a holding member.

  Moreover, the heat dissipation structure for a wavelength conversion member of the present invention is characterized in that the end portion of the mounting support portion of the holding member is thermally joined to the heat dissipation member. According to this heat dissipation structure, the heat generated by the wavelength conversion member is absorbed by the holding portion of the holding member, is transferred to the mounting support portion, and is radiated by the heat dissipation member. That is, since the holding member also functions as a heat conducting member, the heat dissipation structure of the wavelength conversion member can be simplified as compared with the heat conducting member configured separately from the holding member.

  The light emitting device of the present invention having the above heat dissipation structure includes a reflective member that emits light emitted from the wavelength conversion member in a predetermined external direction, and the reflective member is used as the heat dissipation member. It is a feature. According to this, the attachment support part of the holding member is thermally joined to the reflecting member. That is, since the reflecting member also serves as the heat radiating member, the cost can be reduced as compared with the case where the heat radiating member is prepared separately from the reflecting member. Moreover, since the reflecting member has a large area, the heat radiation area is large and the efficiency is good.

  Further, the light emitting device of the present invention having the above heat dissipation structure includes a reflection member that emits light emitted from the wavelength conversion member in a predetermined external direction, and the heat dissipation member matches the outer peripheral shape of the reflection member. The heat dissipating ring is fixed to the outer periphery of the reflecting member. According to this, since the reflecting member also serves as a member for fixing the heat radiating member, the structure for fixing the heat radiating member can be simplified. In addition, since the heat dissipating ring as the heat dissipating member is aligned with the outer periphery of the reflecting member, the design of the light emitting device is not deteriorated.

  In this case, the end of the mounting support portion can be easily thermally bonded to the heat dissipation member by press-fitting the holding member holding the wavelength conversion member into the heat dissipation ring.

  In the light emitting device of the present invention having the reflecting member as described above, a plurality of mounting support portions of the holding member protrude in the outer direction (periphery) of the wavelength conversion member, and the light emitted by the reflecting member is one. It is conceivable that the brightness of the emitted light is somewhat sacrificed by being shielded by the part mounting support part. However, it is set to the minimum number and thickness necessary to exhibit the function of the mounting support part, and the angle formed by the adjacent mounting support parts is a uniform central angle (in the case of three mounting support parts, the central angle is 120 °). If set to, the luminance of the emitted light as the light emitting device can be sufficiently secured.

  Moreover, the light emitting device of the present invention is characterized in that, in the light emitting device configured as described above, the wavelength converting member is irradiated with a laser beam emitted from a central portion of the reflecting member. According to this, the light emission efficiency from the reflecting member 8 is maximized, and the performance as a light emitting device is improved.

  The reflection surface of the reflection member is a paraboloid, and the wavelength conversion member is held by the holding member at a focal position of the paraboloid of the reflection member. According to this, since the light emitted from the wavelength conversion member is reflected as parallel light by the reflecting member, the light emitting device can be used as a headlamp.

  According to the present invention, since the holding portion of the holding member and the mounting support portion are integrally formed of a good heat conductive material, the heat generated by the wavelength conversion member is directly transmitted to the holding portion and is integrally formed. Since heat is transferred in the support portion, the structure is simple and the heat dissipation efficiency is improved as compared with the case where the heat conducting member is formed separately from the holding member. Therefore, it is not necessary to join a heat radiating member to most of the wavelength conversion member, and a minimum area may be used as the joining surface, which is suitable for realizing a small light emitting point.

  In addition, when the mounting support portion is attached to the heat radiating member, the wavelength conversion member is positioned at a predetermined place, and at the same time, a heat radiating structure of the wavelength conversion member is obtained, and effective heat dissipation is achieved via the mounting support portion. Can be done.

  In addition, since the space between the mounting support portions becomes a space, the weight does not increase, and even when the wavelength-converted light passes through the holding member, it does not hinder the passage of light so much and is suitable for the light emitting device. It becomes. Moreover, when the calorific value of the wavelength conversion member is large, it can be easily handled by slightly increasing the diameter of the mounting support part or increasing the number of mounting support parts.

It is the figure which showed schematically the structure of the illuminating device using the light-emitting device by one Embodiment of this invention. It is sectional drawing which showed the structure of the semiconductor laser apparatus of the light-emitting device by one Embodiment of this invention shown in FIG. It is sectional drawing which showed the structure of the semiconductor laser apparatus and heat radiating member of the light-emitting device by one Embodiment of this invention shown in FIG. It is sectional drawing which showed the positional relationship of the wavelength conversion member and optical fiber of the light-emitting device by one Embodiment of this invention shown in FIG. It is sectional drawing which showed the structure of the heat radiating member of the light-emitting device by one Embodiment of this invention shown in FIG. It is sectional drawing which showed the structure of the wavelength conversion member periphery of the light-emitting device by the 1st modification of this invention. It is sectional drawing which showed the structure of the wavelength conversion member periphery of the light-emitting device by the 2nd modification of this invention. It is sectional drawing which showed the structure of the wavelength conversion member periphery of the light-emitting device by the 3rd modification of this invention. It is sectional drawing which showed the structure of the wavelength conversion member periphery of the light-emitting device by the 4th modification of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  With reference to FIGS. 1-5, the structure of the light-emitting device by one Embodiment of this invention is demonstrated.

  As shown in FIG. 1, a light emitting device 1 according to an embodiment of the present invention includes a semiconductor laser device 2 including a semiconductor laser element 2a (see FIG. 2) and heat generated in the semiconductor laser device 2 (semiconductor laser element 2a). A heat radiating member 3 for radiating heat, an optical fiber 4 for guiding light emitted (oscillated) from the semiconductor laser element 2a, a wavelength converting member 5 to which light guided by the optical fiber 4 is irradiated, A holding member 6 for holding the wavelength conversion member 5 and radiating heat generated by the wavelength conversion member, and a heat radiating member 7 for radiating heat of the holding member 6 are provided. The reflection member 8 has a concave portion 8a that reflects light converted by the wavelength conversion member 5 in a specific direction, and is, for example, a metal parabolic mirror. Further, the wavelength conversion member 5 is disposed at the focal position of the reflection member 8. The light emitting device 1 is used, for example, for a vehicle headlamp.

  As shown in FIG. 2, the semiconductor laser device 2 includes a semiconductor laser element 2a functioning as a light source, a stem 2b on which the semiconductor laser element 2a is mounted, two external terminals 2c fixed to the stem 2b, and a stem 2b. A metal cylindrical portion 2d attached on top, a condensing lens 2e for condensing light (laser light) emitted from the semiconductor laser element 2a, and a lid member 2f attached to the opening of the cylindrical portion 2d It is constituted by.

  The back surface of the semiconductor laser element 2a is fixed to the stem 2b with a conductive adhesive (not shown). The back surface of the semiconductor laser element 2a is electrically connected to one external terminal 2c via a conductive adhesive (not shown). The upper surface of the semiconductor laser element 2a is electrically connected to the other external terminal 2c through a metal wire (not shown).

  The semiconductor laser element 2a oscillates light (laser light) having a wavelength of about 450 nm or less, for example. Specifically, the semiconductor laser element 2a has a function of oscillating, for example, blue light, blue violet light, or ultraviolet laser light. The blue laser beam is a laser beam having a center wavelength of about 450 nm, and the blue-violet laser beam is a laser beam having a center wavelength of about 405 nm. Further, the ultraviolet laser beam is a laser beam having a central wavelength in the range of about 10 nm to about 380 nm (about 360 nm to about 400 nm).

  The stem 2b has a larger diameter (outer diameter) than the cylindrical portion 2d. Further, as shown in FIG. 3, the stem 2 b is fixed to the heat radiating member 3 using screws 20 while being sandwiched between the metal plate 9 and the heat radiating member 3. The external terminal 2c (see FIG. 2) is inserted into a terminal socket (not shown) of the heat radiating member 3.

  In such a structure, heat radiation grease (not shown) may be applied between the stem 2 b and the heat radiation member 3. If comprised in this way, it is possible to improve the heat dissipation of the semiconductor laser apparatus 2 (semiconductor laser element 2a) more.

  Moreover, the heat radiating member 3 may use, for example, a heat radiating fin, a heat radiating plate (heat radiating block), a Peltier element, or the like.

  The condensing lens 2 e may have a shape having a function of condensing light (laser light) emitted from the semiconductor laser element 2 a onto the light input end face 4 a of the optical fiber 4. That is, for example, the condensing lens 2e may be convex on both surfaces (light incident surface and light emitting surface), or only one surface (light incident surface or light emitting surface) may be convex. In addition, by using the condensing lens 2e, it is possible to improve the utilization efficiency of the light emitted from the semiconductor laser element 2a.

  Further, the condenser lens 2e may be disposed in a state of being separated from the semiconductor laser element 2a and the optical fiber 4, or may be disposed so as to contact the semiconductor laser element 2a or the optical fiber 4.

  An insertion hole 2g into which the optical fiber 4 is inserted is formed in the lid member 2f. The portion on the light incident end face 4a side of the optical fiber 4 is held by the lid member 2f.

  The attachment structure of the optical fiber 4 to the semiconductor laser device 2 shown in FIGS. 2 and 3 is a structure called a pigtail type, and the optical fiber 4 and the semiconductor laser device 2 are integrally formed.

  As shown in FIG. 1, the optical fiber 4 is formed of, for example, plastic and can be bent. The optical fiber 4 may be formed using, for example, quartz glass. The optical fiber 4 has a diameter (D1) (see FIG. 2) of about 0.2 mm to about 1.0 mm, for example.

  As shown in FIG. 2, the optical fiber 4 includes a core 4b disposed at the center, a clad 4c covering the periphery of the core 4b, and a coating layer 4d covering the periphery of the clad 4c.

  As shown in FIG. 4, the wavelength conversion member 5 is provided with a light emission end face 4 e of the optical fiber 4. The wavelength conversion member 5 has a diameter (D2) larger than the diameter (D1) of the optical fiber 4, for example, is formed in a cylindrical shape. Further, the wavelength conversion member 5 is disposed at a position where light (laser light) emitted from the light emitting end face 4e is irradiated at a substantially right angle from a substantially central portion on the back surface. The temporary installation includes a configuration in which the light emitting surface 4 e is provided in contact with the wavelength conversion member 5.

  As shown in FIGS. 1 and 5, the holding member 6 includes a holding portion 6 a that holds the wavelength conversion member 5, and a plurality of attachment supports that protrude from the holding portion 6 a in the outer peripheral direction of the laser light irradiation optical axis. The holding portion 6a and the mounting support portion 6b are integrally formed of a good heat conductive material (in this embodiment, a heat transfer anisotropic material as will be described later). In this embodiment, the irradiation optical axis of the laser light passes through the center of the light emitting end surface 4e of the optical fiber 4 and becomes a line orthogonal to the surface 4e, and the outer peripheral direction is a radiation centered on the axis of the wavelength conversion member 5 Direction.

  The holding portion 6a is formed in, for example, a cylindrical shape having an inner diameter substantially the same as the diameter (D2) of the wavelength conversion member 5. The wavelength conversion member 5 is fitted on the inner periphery of the holding portion 6a. The optical fiber 4 side of the wavelength conversion member 5 is close to the light irradiation region S and generates a lot of heat. Therefore, it is preferable in terms of heat dissipation efficiency to arrange the holding portion 6a so that at least the outer peripheral portion in the vicinity of this portion is covered. The length of the holding portion 6a needs to be set shorter than the length of the wavelength conversion member 5 so that the light emitted from the wavelength conversion member 5 is not significantly diminished. The thickness of the holding part 6a is selected to an appropriate dimension in consideration of the amount of heat absorption and the material cost.

  The attachment support portion 6b has, for example, a rectangular bar shape, and three protrusions are provided radially from the center of the holding portion 6b as shown in FIG. The angle formed by the adjacent mounting support portions 6b, 6b is set to an equal central angle of 120 °. Therefore, a space is provided between the attachment support portions 6b and 6b.

  In the present embodiment, a heat transfer anisotropic material such as graphite is used as the good heat conductive material that is the material of the holding member 6. The following Table 1 shows an example of graphite, which is an example of a heat transfer anisotropic material, silicone rubber, which is an example of a non-thermal conductive material, copper, aluminum, which is an example of a good heat conductive material showing legal thermal conductivity. The value of thermal conductivity is shown. As shown in Table 1, graphite exhibits extremely high thermal conductivity that is an order of magnitude higher than that of metals such as copper and aluminum, which are representative of good heat conductive materials, in the xy direction, while non-heat conductive material in the z direction. It is understood that this is a material having a low thermal conductivity comparable to that of silicone rubber, which is representative of the above, and having a high direction dependency of the thermal conductivity.

  When a heat transfer anisotropic material is used as the material of the holding member 6, if the protruding direction of the mounting support portion 6b is matched with the direction of high heat conductivity of the heat transfer anisotropic material, the heat transfer anisotropic material is transmitted to the holding portion 6a. The heat of the obtained wavelength conversion member 5 is quickly transferred from the holding portion 6a to the protruding direction of the mounting support portion 6b, and the heat is hardly transferred in the direction orthogonal to the protruding direction. Therefore, it is possible to reduce the fluctuation of the light passing through the warming of the air at the mounting support portion.

  Since the thermal conductivity of graphite is very large, the diameter of the mounting support portion can be reduced. As a result, the weight can be reduced, which contributes to the weight reduction of the light emitting device. In that case, by cutting out in the XY plane of the graphite block, it is possible to easily manufacture the holding member 6 in which the protruding direction of the mounting support portion 6b matches the direction of high heat conductivity of the heat transfer anisotropic material. Graphite is a suitable heat transfer anisotropic material because it is less affected by aging due to rust and the like and has strength as a holding member. As the heat transfer anisotropic material, in addition to graphite, a material having a hexagonal crystal structure such as quartz can be used.

  As shown in FIG. 1, the heat dissipating member 7 is a heat dissipating ring that matches the outer peripheral shape of the reflecting member 8, and is fixed to the outer periphery of the reflecting member 8. Specifically, a flange 7a having a bolt hole is formed at one end of the heat radiating member 7, and a flange 8c having a bolt hole formed on the outer periphery of the reflecting member 8 corresponding to the flange 7a is combined. And a nut 22. According to this, since the reflecting member 8 also serves as a member for fixing the heat radiating member 7, the fixing structure of the heat radiating member 7 can be simplified. Moreover, since the heat dissipation ring as the heat dissipation member 7 is aligned with the outer periphery of the reflection member 8, the design of the light emitting device 1 is not deteriorated.

  The length of the three attachment support portions 6b of the holding member 6 in the protruding direction is set to be equal. That is, the ends of the three attachment support portions 6b are located on the same circumference with the center of the holding portion 6a as the center. The diameter of this circle is set to a size that is the same as or slightly larger than the diameter (D3) of the inner periphery of the heat radiating member (heat radiating ring) 7. Therefore, the end portion of the mounting support portion 6b can be easily thermally bonded to the heat radiating member 7 simply by press-fitting the holding member 6 holding the wavelength conversion member 5 to the holding portion 6a into the heat radiating member 7.

  The wavelength converting member 5 has a function of converting at least part of light (laser light) guided by the optical fiber 4 emitted from the semiconductor laser element 2a into light having a different wavelength and emitting (emitting) light. Specifically, the wavelength conversion member 5 has a function of converting a part of the light from the semiconductor laser element 2a into yellow light, blue light, red light, green light, and the like and emitting the light. And the light radiate | emitted from the wavelength conversion member 5 is mixed, for example, white light is obtained.

  Such a wavelength conversion member 5 can be formed of, for example, a translucent member and a particulate phosphor dispersed in the translucent member. This translucent member may be formed of a resin, for example.

  The phosphor is not particularly limited as long as at least a part of the light from the semiconductor laser element 2a can be converted into light having a different wavelength. However, the phosphor is formed of an oxynitride material such as sialon. Is preferred. If the phosphor is formed of an oxynitride material such as sialon, it is possible to improve the heat resistance of the phosphor (wavelength conversion member 5), so that the phosphor (wavelength conversion member 5) is deteriorated by heat. It is possible to suppress (discoloration or deformation).

  As another suitable example of the phosphor, a semiconductor nanoparticle phosphor using nanometer-sized particles made of a III-V compound semiconductor can also be used. One feature of the semiconductor nanoparticle phosphor is that even when the same compound semiconductor (for example, indium phosphide: InP) is used, the emission color can be changed by the quantum size effect by changing the particle diameter. In addition, since the wavelength of the light to irradiate should just be shorter than the absorption peak wavelength of the said semiconductor nanoparticle fluorescent substance, it is not restricted to the said blue-violet light, An ultraviolet light may be sufficient. For semiconductor nanoparticle phosphors that emit red light, blue light or green light may be used.

  In addition, since the semiconductor nanoparticle phosphor is semiconductor-based, it has a short fluorescence lifetime and can emit the excitation light power quickly as fluorescence, and thus has a feature of high resistance to high-power excitation light. This is because the emission lifetime of the semiconductor nanoparticle phosphor is about 10 nanoseconds, which is five orders of magnitude shorter than the emission lifetime of a normal phosphor material having a rare earth-based emission center. Since the emission lifetime is short, absorption of excitation light and emission of fluorescence can be repeated quickly. As a result, high conversion efficiency can be maintained for strong excitation light, and heat generation from the phosphor is reduced. Therefore, it is possible to further suppress the wavelength conversion member 5 from being deteriorated (discolored or deformed) by heat. Thereby, when using the semiconductor laser element 2a with a high light output as a light source, it can suppress more that the lifetime of the light-emitting device 1 becomes short.

  In the light emitting device 1 as described above, the heat generated in the light irradiation region S of the wavelength conversion member 5 is transmitted from the vicinity of the light irradiation region S to the holding portion 6 a of the holding member 6. Then, the heat is transmitted to the heat radiating member 7 through the mounting support portion 6b and radiated. Thereby, the heat generated in the wavelength conversion member 5 is continuously dissipated. That is, the heat generated in the wavelength conversion member 5 can be radiated.

  As shown in FIG. 1, the reflecting surface (inner surface) of the recess 8a of the reflecting member 8 is formed as a mirror surface having a function of reflecting light. Further, the reflecting surface of the concave portion 8a of the reflecting member 8 may be, for example, a parabolic surface or a part of an elliptical surface. Further, the reflection surface of the recess 8a may be a surface that is asymmetric in the vertical direction and the horizontal direction. Note that the reflection surface (inner surface) of the recess 8a of the reflection member 8 may not be a mirror surface as long as it has a function of reflecting light.

  The reflection member 8 has a function of emitting (reflecting) light emitted from the wavelength conversion member 5 in a predetermined direction.

  In addition, an insertion hole 8 b into which the optical fiber 4 is inserted is formed at the apex of the reflecting surface (parabolic surface) of the concave portion 8 a of the reflecting member 8. The optical fiber 4 protrudes from the apex of the reflecting surface (parabolic surface) of the concave portion of the reflecting member 8 to the inside of the concave portion 8 a of the reflecting member 8. Thereby, since the laser beam is irradiated to the back surface of the wavelength conversion member 5 from the central part of the reflection member 8, the light emission efficiency from the reflection member 8 can be maximized, and the performance as the light emitting device is improved. The reflecting member 8 is formed to have a diameter of about 30 mm, for example.

  Moreover, the reflecting member 8 may be formed of a metal or the like so as to have heat dissipation properties, or may be formed of a member having a metal layer formed on the surface. In this case, the heat generated in the wavelength conversion member 5 can be dissipated from the reflecting member 8 by fixing or contacting the reflecting member 8 to the heat dissipating member 7.

  According to the present invention, since the holding portion of the holding member and the mounting support portion are integrally formed of a good heat conductive material, the heat generated by the wavelength conversion member is directly transmitted to the holding portion and is integrally formed. Since heat is transferred in the support portion, the structure is simple and the heat dissipation efficiency is improved as compared with the case where the heat conducting member is formed separately from the holding member. Therefore, it is not necessary to join a heat radiating member to most of the wavelength conversion member, and a minimum area may be used as the joining surface, which is suitable for realizing a small light emitting point.

  In addition, when the mounting support portion is attached to the heat radiating member, the wavelength conversion member is positioned at a predetermined place, and at the same time, a heat radiating structure of the wavelength conversion member is obtained, and effective heat dissipation is achieved via the mounting support portion. Can be done.

  In addition, since the space between the mounting support portions becomes a space, the weight does not increase, and even when the wavelength-converted light passes through the holding member, it does not hinder the passage of light so much and is suitable for the light emitting device. It becomes. Moreover, when the calorific value of the wavelength conversion member is large, it can be easily handled by slightly increasing the diameter of the mounting support part or increasing the number of mounting support parts.

  In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes meanings equivalent to the scope of claims for patent and all modifications within the scope.

  For example, the light emitting device of the present invention can be applied to an indicator lamp (indicator light), illumination, a projector or a laser pointer, and other various light emitting devices. The light emitting device of the present invention can be applied to a backlight for a display device, an indoor lighting device or an endoscope lighting device, and other various lighting devices in addition to the vehicle headlamp.

  Further, the semiconductor laser element of the light emitting device of the present invention may be a high output type semiconductor laser element or a low output type semiconductor laser element.

  In the above embodiment, an example in which a semiconductor laser element is used as a light emitting element has been described. However, the present invention is not limited to this, and a light emitting element other than the semiconductor laser element, such as a light emitting diode, may be used.

  Moreover, in the said embodiment, although the example which used the optical fiber as a light guide member was shown, this invention is not restricted to this, As long as it has the function to guide light, it uses members other than an optical fiber. May be.

  In the above embodiment, an example in which light is guided to a place away from the light emitting element using a light guide member (optical fiber) and irradiated to the wavelength conversion member 5 is shown, but the present invention is not limited to this, and the light guide is provided. It is not necessary to use a member. For example, as shown in FIG. 8, the wavelength conversion member 5 may be directly irradiated with laser light emitted from the light emitting element 2 a through a through hole 8 d provided in the light reflecting member 8.

  Moreover, in the said embodiment, although the example which fits the wavelength conversion member to the inner periphery of the holding | maintenance part of a holding member was shown, this invention is not restricted to this, You may adhere using a conductive contact bonding layer. . Since the conductive adhesive layer usually has higher thermal conductivity than the non-conductive adhesive layer, the heat generated by the wavelength conversion member can be more efficiently transferred to the holding portion via the conductive adhesive layer. Can do.

  Moreover, although the said embodiment demonstrated the example which formed the holding part of the holding member in the cylindrical shape, this invention is not restricted to this, You may form in shapes other than a cylindrical shape. For example, as shown in FIG. 6, the holding portion 6 a is formed in a plate shape or a column shape, and the light emitting side end portion of the optical fiber 4 is fitted into a through hole provided in the center thereof, and on one surface thereof. The wavelength conversion member 5 may be bonded using the conductive adhesive 10. According to this, since the light emitting side end portion of the optical fiber 4 is also held by the holding portion 6a, the accuracy of the irradiation position of the laser light can be increased. Or as shown in FIG. 7, it is good also as a structure which forms an inward flange in the end of the cylindrical holding part 6a, and hold | maintains the wavelength conversion member 5 by an edge part. According to this, since the wavelength conversion member 5 can be reliably positioned in the axial direction, the wavelength conversion member 5 can be accurately arranged at the focal position of the reflection member 8.

  In the above embodiment, the case where the heat transfer anisotropic material is used as the material of the holding member has been described. However, the present invention is not limited to this, and a good heat conductive material other than the heat transfer anisotropic material may be used. Good. For example, a metal material such as gold, silver, copper, aluminum, stainless steel, which is a representative example of a good heat conductive material, may be used.

  Moreover, although the case where the attachment support part of the holding member was formed in the shape of a square bar was shown in the above embodiment, the present invention is not limited to this and may be formed in a shape other than each bar shape. For example, the attachment support portion may be formed in a round bar shape, a fin shape, or the like.

  Moreover, although the case where the number of attachment support portions of the holding member is three has been described in the above embodiment, the present invention is not limited to this and may be one, two, or more than three. In terms of heat transfer efficiency and strength, it is preferable to have a large number of mounting support portions. However, if the number is too large, the light emitted from the wavelength conversion member and the light emitted from the reflecting member are greatly diminished. The number should be in a range that does not impair the function.

  Moreover, in the said embodiment, as shown in FIG. 1, although the example which provides the heat radiating member 7 separately from the reflective member 8 was demonstrated, this invention is not restricted to this, You may use a reflective member as a heat radiating member. . For example, as shown in FIG. 9, a plurality of groove holes 8d corresponding to the attachment support portions 6b are provided at equal intervals in the circumferential direction on the inner periphery facing the recess 8a of the reflecting member 8, and the holding member 6 is attached to the groove hole 8d. You may make it fit in the edge part of the support part 6b. According to this, the attachment support portion 6 b of the holding member 6 is thermally joined to the reflecting member 8. That is, since the reflecting member 8 also serves as the heat radiating member, the cost can be reduced as compared with the case where the heat radiating member 7 is prepared separately from the reflecting member 8. Further, since the reflecting member 8 has a large area, the heat radiation area is large and the efficiency is good.

  Moreover, in the said embodiment, although shown about the example which formed the wavelength conversion member in the column shape, this invention is not limited to this, You may form a wavelength conversion member in shapes other than a column shape. For example, the wavelength conversion member may be formed in a hemispherical shape.

  Moreover, in the said embodiment, although the example which formed the wavelength conversion member with the translucent member and the fluorescent substance disperse | distributed in the translucent member was shown, this invention is not limited to this, The wavelength conversion member May be formed of phosphor alone.

  Moreover, in the said embodiment, although the case where the wavelength conversion member was fixed to the heat radiating member was shown, this invention is not restricted to this, The wavelength conversion member is contact | abutted even if it is not fixed to the heat radiating member. Just do it. In this case, a member that supports the wavelength conversion member may be provided separately.

  Moreover, although the said embodiment demonstrated the case where the wavelength conversion member was supported only by the heat radiating member, this invention is not restricted to this, You may provide the member which supports a wavelength conversion member and a heat radiating member separately.

  Moreover, in the said embodiment, although shown about the example which has arrange | positioned the wavelength conversion member in the recessed part of a reflection member, this invention is not limited to this, Even if it arrange | positions a wavelength conversion member in the recessed part of a reflection member. Good.

  Moreover, although the said embodiment demonstrated the example in which the surface by the side of the optical fiber of a wavelength conversion member was formed in the flat surface, for example, this invention is not restricted to this, The surface by the side of the optical fiber of a wavelength conversion member A recess may be provided. In this case, the optical fiber may be arranged so that the light emitting end face of the optical fiber is located in the recess.

  Moreover, in the said embodiment, although the example which comprised the optical fiber and the semiconductor laser apparatus in the pigtail type was shown, this invention is not restricted to this, The connector type which can isolate | separate an optical fiber and a semiconductor laser apparatus mutually. You may comprise (receptacle type).

  Moreover, in the said embodiment, although shown about the example which comprises a semiconductor laser element and a wavelength conversion member so that white light can be obtained by mixing the light radiate | emitted from a wavelength conversion member, this invention is shown to this. However, the semiconductor laser element and the wavelength conversion member may be configured so that light other than white light is obtained.

  In the above-described embodiment, an example in which a semiconductor laser element that emits light having a wavelength of about 450 nm or less (blue light, blue-violet light, or ultraviolet laser light) is used has been described, but the present invention is not limited thereto. A semiconductor laser element that emits light (laser light) having a wavelength greater than about 450 nm may be used.

  In the above embodiment, an example in which a condensing lens is provided between the semiconductor laser element and the optical fiber has been described. However, the present invention is not limited to this, and condensing is performed between the semiconductor laser element and the optical fiber. It is not necessary to provide a lens.

  Moreover, in the said embodiment, although the example which attached the semiconductor laser apparatus to the heat radiating member using the metal plate was shown, this invention is not restricted to this, For example, a screw insertion hole is provided in a stem and a metal plate is not used. In addition, the semiconductor laser device (stem) may be attached to the heat radiating member.

1 Light-emitting device (lighting device)
2a Semiconductor laser element (light emitting element)
3 Heat dissipation member 4 Optical fiber (light guide member)
DESCRIPTION OF SYMBOLS 5 Wavelength conversion member 6 Holding member 6a Holding part 6b Mounting support part 7 Heat radiating member 8 Reflective member S Light irradiation area

Claims (10)

  A holding member for holding a wavelength conversion member that receives and radiates laser light and converts it into light having a different wavelength, the holding portion for holding the wavelength conversion member, and irradiation of the laser light from the holding portion. A holding member having a mounting support portion protruding in an outer peripheral direction of the optical axis, wherein the holding portion and the mounting support portion are integrally formed of a heat-conductive material.   The holding member according to claim 1, wherein the holding member is made of a heat transfer anisotropic material, and a protruding direction of the mounting support portion is matched with a direction of high heat conductivity of the heat transfer anisotropic material. Element.   The holding member according to claim 2, wherein the heat transfer anisotropic material is graphite.   It is a manufacturing method of the holding member of Claim 3, Comprising: It cuts out within the XY plane of a graphite block, The manufacturing method of the holding member characterized by the above-mentioned.   A heat dissipation structure for a wavelength conversion member, wherein an end of the mounting support portion of the holding member according to claim 1 is thermally bonded to the heat dissipation member.   6. A light emitting device having the heat dissipation structure according to claim 5, wherein the light emitted from the wavelength conversion member is emitted in a predetermined external direction by a reflection member, wherein the reflection member is used as the heat dissipation member. Light emitting device.   6. A light emitting device having the heat dissipation structure according to claim 5, wherein the light radiating from the wavelength converting member is emitted in a predetermined external direction by a reflecting member, and the heat radiating member is a heat radiating ring that matches an outer peripheral shape of the reflecting member. And a light emitting device fixed to the outer periphery of the reflecting member.   The light emitting device according to claim 7, wherein the holding member holding the wavelength conversion member is press-fitted into the heat dissipation ring.   The light emitting device according to any one of claims 6 to 8, wherein the wavelength conversion member is irradiated with a laser beam emitted from a central portion of the reflection member on a back surface.   The reflection surface of the reflection member is a paraboloid, and the wavelength conversion member is held by the holding member at a focal position of the paraboloid of the reflection member. The light-emitting device of description.

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