WO2013175706A1 - Optical element, light-emitting device, and projection device - Google Patents

Optical element, light-emitting device, and projection device Download PDF

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Publication number
WO2013175706A1
WO2013175706A1 PCT/JP2013/002682 JP2013002682W WO2013175706A1 WO 2013175706 A1 WO2013175706 A1 WO 2013175706A1 JP 2013002682 W JP2013002682 W JP 2013002682W WO 2013175706 A1 WO2013175706 A1 WO 2013175706A1
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WO
WIPO (PCT)
Prior art keywords
wavelength conversion
conversion member
optical element
region
light
Prior art date
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PCT/JP2013/002682
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French (fr)
Japanese (ja)
Inventor
瑞穂 冨山
鈴木 尚文
Original Assignee
日本電気株式会社
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Publication of WO2013175706A1 publication Critical patent/WO2013175706A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/644Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/16Cooling; Preventing overheating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/2006Lamp housings characterised by the light source
    • G03B21/2033LED or laser light sources
    • G03B21/204LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements

Definitions

  • the present invention relates to an optical element, a light emitting device, and a projection device, and particularly to an optical element having a wavelength conversion member, a light emitting device, and a projection device.
  • LEDs Light Emitting Diodes
  • LDs semiconductor lasers
  • LEDs and LDs are made of semiconductor materials.
  • InGaN-based semiconductor material When an InGaN-based semiconductor material is used, the LED and the LD can generate blue light.
  • AlGaInP-based semiconductor material When an AlGaInP-based semiconductor material is used, the LED and the LD can generate red light.
  • LEDs and LDs using InGaN-based and AlGaInP-based materials have low green light emission efficiency. For this reason, many light-emitting devices which combined LED, LD, and the wavelength conversion member are proposed.
  • Patent Document 1 in response to a problem that the light extraction rate is reduced, an LED chip is mounted, and a wiring board for supplying power to the LED chip is formed around the LED chip mounting portion.
  • a light emitting device having a concave opening formed and a wavelength conversion member in which a wavelength conversion material is contained in a translucent material.
  • Patent Document 1 as the wavelength conversion member, a member in which the concentration of the wavelength conversion material increases toward the central portion, or a member in which the wavelength conversion material is settled on the side of the wavelength conversion member facing the LED chip is used. ing.
  • JP 2005-166733 A paragraphs “0007”, “0024”, “0035” to “0038”, FIGS. 1, 8, and 9)
  • the vibration energy of the wavelength conversion material increases, the proportion of excitation light that is not wavelength-converted by the wavelength conversion material increases, and the fluorescence intensity may decrease (temperature quenching). For this reason, it is desirable to prevent the temperature of the wavelength conversion member from rising as much as possible.
  • An object of the present invention is to provide an optical element, a light emitting device, and a projection device that solve the above-described problem that the temperature of the wavelength conversion member increases.
  • an optical element includes a wavelength conversion member having a first region and a second region having different concentrations of the wavelength conversion material, and at least one heat radiating member in contact with the wavelength conversion member.
  • concentration of the first region is higher than that of the second region, and the heat dissipation member is in contact with the first region of the wavelength conversion member.
  • the light-emitting device of the present invention includes the optical element of the present invention and a light source that emits light incident on the wavelength conversion member.
  • the projection device of the present invention includes the light emitting device of the present invention and a projection optical system that projects light emitted from the light emitting device.
  • an increase in the temperature of the wavelength conversion member can be suppressed.
  • FIG. 1A is a plan view and FIG. 2B is a cross-sectional view of 2B-2B showing an optical element according to a first embodiment of the present invention.
  • FIG. 2B is a cross-sectional view of the optical element according to the first embodiment of the present invention, taken along the line (A) 2B-2B, showing the concentration distribution in the xz direction of the wavelength conversion material of the wavelength conversion member, and (B) 3B.
  • FIG. 3C is a cross-sectional view of ⁇ 3B, showing a concentration distribution in the yz direction.
  • FIG. It is a figure and graph which show the density distribution in the xz direction of the wavelength conversion material which another example of the wavelength conversion member which the optical element of the 1st Embodiment of this invention has has. It is sectional drawing which shows another example of the optical element of the 1st Embodiment of this invention.
  • the example in which the wavelength conversion member and the heat dissipation member of the optical element of the first embodiment of the present invention are (A) fitted, (B) another example to be fitted, and (C) yet another example to be fitted.
  • FIG. It is a graph which shows the relationship between the density
  • FIG. 6A is a plan view, FIG. 10B-10B sectional view, and FIG. 11C-11B-11B sectional view showing an optical element according to a second embodiment of the present invention.
  • 11B is a cross-sectional view taken along the line -11B and shows a concentration distribution in the yz direction. It is a perspective view which shows the optical element of the 3rd Embodiment of this invention. It is (A) top view, (B) 13B-13B sectional view, and (C) 13C-13C sectional view showing an optical element of a third embodiment of the present invention. (A) 13B-13B cross-sectional view of the optical element of the third embodiment of the present invention, a diagram and graph showing the concentration distribution in the xz direction of the wavelength conversion material possessed by the wavelength conversion member, and (B) 13C FIGS. 13A and 13B are cross-sectional views and graphs showing concentration distribution in the yz direction.
  • FIG. 1 is a perspective view showing an optical element according to the first embodiment.
  • the optical element 108 includes a wavelength conversion member 104 and at least one heat radiating member 105 in contact with the wavelength conversion member 104. Details of the optical element 108 will be described with reference to FIGS.
  • FIG. 2A is a plan view of the optical element 108.
  • FIG. 2B is a cross-sectional view of the optical element 108.
  • the concentration of the wavelength conversion material in the wavelength conversion member 104 is represented by the darkness of the filled color. The darker the color, the higher the concentration, and the lighter the color, the lower the concentration. .
  • the wavelength conversion member 104 has at least a first region 114 and a second region 113 having different concentrations of the wavelength conversion material, and the concentration of the first region 114 is the second concentration.
  • the density of the region 113 is higher.
  • One end side of the wavelength conversion member 104 is in contact with the heat dissipation member 105, and the other end side of the wavelength conversion member 104 is exposed.
  • the first region 114 is disposed on the side of the wavelength conversion member 104 that contacts the heat dissipation member 105.
  • the function of the optical element 108 will be described with reference to FIG.
  • light incident on the wavelength conversion member 104 is referred to as excitation light.
  • the light whose wavelength is converted by the wavelength conversion member 104 is called fluorescence.
  • the wavelength conversion member 104 has a first region 114 and a second region 113 in which the concentration of the wavelength conversion material is different.
  • the optical element 108 has an incident surface on which light is incident, and the first region and the second region are arranged in parallel in parallel to the surface direction of the incident surface.
  • the incident surface is a flat surface extending in the xy direction, and the first region and the second region are arranged in parallel in the x direction.
  • the concentration of the first region 114 is higher than the concentration of the second region 113. For this reason, the amount of light that is wavelength-converted in the first region 114 is larger than the amount of light that is wavelength-converted in the second region 113, and when the light is wavelength-converted in the first region 114.
  • the heat that is generated increases.
  • the first region 114 is in contact with the heat dissipation member 105, the heat generated in the first region 114 is transmitted to the heat dissipation member 105 and is dissipated from the heat dissipation member 105. Therefore, in the optical element 108, it can suppress that the temperature of wavelength conversion member 104 itself raises, and can prevent that temperature quenching occurs.
  • the wavelength conversion member 104 has a concentration of the wavelength conversion material lower than that of the first region 114 and a concentration of the wavelength conversion material higher than that of the second region 113.
  • the region 115 may be provided.
  • the third region 115 is disposed between the first region 114 and the second region of the wavelength conversion member 104.
  • FIG. 3A shows the concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 104
  • FIG. 3B shows the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 104.
  • the concentration of the wavelength conversion material in the wavelength conversion member 104 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 105, and the concentration is higher as it is farther from the heat dissipation member 105. Is thin.
  • the concentration of the wavelength conversion material in the y direction in the wavelength conversion member 104 is constant.
  • the concentration of the wavelength conversion material can be increased while preventing the temperature of the wavelength conversion member from rising.
  • the concentration distribution of the wavelength conversion material in the wavelength conversion member is not limited to that shown in FIGS. 3 (A) and 3 (B).
  • the concentration of the wavelength conversion material in the wavelength conversion member 104a may change stepwise.
  • the concentration of the wavelength conversion material is expressed in wt% and is obtained by (weight of wavelength conversion material) / (weight of wavelength conversion member).
  • the concentration of the wavelength conversion material is obtained by (weight of wavelength conversion material) / (weight of binder + weight of wavelength conversion material).
  • the concentration of the wavelength conversion material is preferably 5 wt% or more, particularly 20 wt% or more.
  • the concentration of the wavelength conversion material is desirably 50 wt% or less, particularly 40 wt% or less.
  • the concentration of the first region can be 30 wt% or more and 50 wt% or less
  • the concentration of the second region can be 5 wt% or more and less than 30 wt%.
  • the concentration of the wavelength conversion material is desirably determined in consideration of the excitation light absorption rate of the wavelength conversion material, the thickness of the wavelength conversion member, and the like.
  • the wavelength conversion member 104 may have a binder that maintains a state in which the wavelength conversion material is dispersed.
  • the binder is preferably made of glass or transparent resin.
  • the wavelength conversion member 104 when the temperature of the wavelength conversion member 104 rises, not only the temperature quenching but also the structural stability of the wavelength conversion member 104 is lowered.
  • the wavelength conversion member 104 when glass is used for the binder of the wavelength conversion member 104, the wavelength conversion member 104 may be cracked due to melting of the glass or heat-induced mechanical stress.
  • a resin when a resin is used for the binder, a decrease in transmittance due to the modification of the resin, a thermal deformation of the resin, or the like occurs.
  • the optical element 108 of this embodiment since the temperature rise of the wavelength conversion member 104 can be suppressed, these problems can be prevented from occurring.
  • Fluorescent material is used for the wavelength conversion material used in this embodiment.
  • the heat radiating member used in the present embodiment has a thermal conductivity higher than that of air.
  • the heat conductivity of the heat dissipation member is large, and in particular, it is desirable that it is larger than the binder of the wavelength conversion member.
  • the heat dissipation member desirably contains a metal material such as copper or aluminum. The thermal conductivity of metal materials is large. For this reason, the heat generated in the wavelength conversion member can be efficiently released by including a metal material in the heat dissipation member.
  • the heat dissipation member may contain a resin material.
  • the heat radiating member contains the resin material, the adhesion between the heat radiating member and the wavelength conversion member is improved, and heat generated by the wavelength conversion member is easily transmitted to the heat radiating member. Therefore, for example, as shown in FIG. 5, a heat radiating member 105e containing a resin material may be provided in contact with the wavelength conversion member 104e. In this case, since the thermal conductivity of the resin material is not generally high, it is desirable to further provide another heat radiating member 106e having a high thermal conductivity in contact with the heat radiating member 105e.
  • the heat radiating member may be either a heat sink or a heat pipe. Since heat sinks and heat pipes have high thermal conductivity and a large heat dissipation effect, it is possible to dissipate heat generated by the wavelength conversion member.
  • the heat dissipating member has a reflecting surface that reflects light on the surface in contact with the wavelength converting member.
  • the method for contacting the wavelength conversion member and the heat dissipation member is not particularly limited.
  • a convex structure and a concave structure may be provided on each of the wavelength conversion member 104b and the heat dissipation member 105b, and the convex structure and the concave structure may be fitted.
  • the concave-convex structure and fitting by providing the concave-convex structure and fitting, the area where the wavelength conversion member 104b and the heat dissipation member 105b are in contact with each other is increased. As a result, heat generated in the wavelength conversion member 104b is easily transmitted to the heat dissipation member 105b.
  • the wavelength conversion member 104b has a convex structure and the heat dissipation member 105b has a concave structure.
  • the wavelength conversion member has a concave structure and the heat dissipation member has a convex structure. It may have.
  • FIG. 6B shows another example in which the wavelength conversion member and the heat dissipation member are fitted.
  • the thickness of the heat radiating member 105c is thicker than the thickness of the wavelength conversion member 104c. Furthermore, only the heat radiating member 105c has a concave structure.
  • the area where the wavelength conversion member 104c and the heat dissipation member 105c are in contact with each other increases. As a result, heat generated in the wavelength conversion member 104c is easily transmitted to the heat dissipation member 105c.
  • FIG. 6B shows an example in which only the heat radiating member 105c has a concave structure, but only the wavelength conversion member may have a concave structure.
  • FIG. 6C shows still another example in which the wavelength conversion member and the heat dissipation member are fitted.
  • the heat radiating member 105d is provided with counterbore, and the end of the heat radiating member 105d has a step structure.
  • the area where the wavelength conversion member 104d and the heat dissipation member 105d are in contact with each other increases.
  • heat generated in the wavelength conversion member 104d is easily transmitted to the heat dissipation member 105d.
  • FIG. 6C shows an example in which only the heat radiating member 105d has a stepped structure, but only the wavelength conversion member may have a stepped structure.
  • the contact surface between the wavelength conversion member and the heat dissipation member is less likely to be displaced. And a more stable structure. For this reason, the assembly of the optical element and the light emitting device is facilitated, and the reliability of the optical element as a vibration is improved.
  • the concentration of the wavelength conversion material in the wavelength conversion member is preferably determined in consideration of the amount of fluorescence extracted from the emission surface of the wavelength conversion member and the ratio (transmittance) of the fluorescence transmitted through the wavelength conversion member.
  • concentration of the wavelength conversion material and the amount of fluorescence extracted from the emission surface and the relationship between the concentration of the wavelength conversion material and the transmittance for fluorescence will be described.
  • the excitation light 110 that has entered the wavelength conversion member 104 is absorbed by the wavelength conversion material included in the wavelength conversion member 104, and is emitted from the wavelength conversion member 104 as fluorescence 111 and 112. .
  • the fluorescence includes fluorescence 112 emitted from the incident surface on the side where the excitation light 110 is incident and fluorescence 111 emitted from the emission surface opposite to the incident side. Since the fluorescence 111 is usually used in the projection apparatus, it is preferable that the amount of the fluorescence 111 is large.
  • the surface of the wavelength conversion member 104 on which the excitation light 110 is incident is referred to as an incident surface
  • the side opposite to the incident side is referred to as an emission surface.
  • FIG. 7 is a graph showing the relationship between the concentration of the wavelength conversion material and the amount of fluorescence.
  • the dotted line in the graph indicates the total amount of fluorescence when the amount of excitation light 110 is constant.
  • the solid line indicates the amount of fluorescence 111 emitted from the emission surface of the wavelength conversion member 104 out of the total amount of fluorescence.
  • the total amount of fluorescent light increases as the concentration of the wavelength conversion material increases.
  • the light quantity of the fluorescence 111 emitted from the wavelength conversion member 104 becomes maximum at a certain concentration Do. This is because, as shown in FIG. 8, when the concentration of the wavelength conversion material is increased, the ratio of the fluorescence transmitted through the wavelength conversion member 104 is reduced.
  • the concentration of the wavelength conversion material it is desirable to set the concentration of the wavelength conversion material to the concentration Do.
  • the amount of the fluorescence 111 emitted from the wavelength conversion member 104 can be maximized by setting the concentration of the first region of the wavelength conversion member 104 in contact with the heat dissipation member 105 to the concentration Do.
  • the concentration of the second region 113 of the wavelength conversion member 104 that is not in contact with the heat dissipation member 105 is set lower than the concentration Do in order to prevent the temperature from rising.
  • the wavelength conversion member when glass is used as the binder, the wavelength conversion member can be produced by mixing glass powder and wavelength conversion material powder and sintering the mixed powder.
  • the wavelength conversion member when a resin is used as the binder, the wavelength conversion member can be produced by mixing the powder of the wavelength conversion material with the resin softened by heating.
  • the concentration distribution of the wavelength conversion material in the wavelength conversion member is provided by adjusting the ratio of mixing the wavelength conversion member and the binder.
  • the wavelength conversion member can also be produced by laminating or arranging layers having a constant concentration of the wavelength conversion material.
  • FIG. 9 is a perspective view showing an optical element 208 according to the second embodiment of the present invention.
  • the optical element 208 has a wavelength conversion member 204 and two heat radiating members 205 in contact therewith.
  • the optical element 208 differs from the optical element 108 of the first embodiment in that it has two heat radiating members 205.
  • FIG. 10A is a plan view of the optical element 208.
  • FIG. 10B is a cross-sectional view of the optical element 208.
  • the heat dissipating member 205 is provided at both ends of the wavelength converting member 204.
  • the heat dissipating member 205 has first regions 214 at both ends thereof and a second region 213 at the center.
  • the heat radiating member 205 is provided at both ends of the wavelength conversion member 204. Further, the wavelength conversion member 204 has first regions 214 at both ends thereof and a second region 213 at the center. For this reason, while the amount of heat generated at the center of the wavelength conversion member 204 is reduced, the amount of heat generated at the end of the wavelength conversion member 204 is increased. However, the heat generated at the end of the wavelength conversion member 204 can be dissipated through the heat dissipation member 205 in contact with both ends of the wavelength conversion member. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the concentration of the wavelength conversion material contained in the wavelength conversion member 204 to increase the amount of fluorescence.
  • the concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 204 is shown in FIG. 11A, and the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 204 is shown in FIG.
  • the concentration of the wavelength conversion material in the wavelength conversion member 204 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 205, and the concentration is closer to the heat dissipation member 205. Is thinner.
  • the concentration of the wavelength conversion material in the y direction in the wavelength conversion member 204 is constant. This is because the heat dissipation member 205 is not in contact with the y direction of the wavelength conversion member 204.
  • FIG. 12 is a perspective view showing an optical element 308 according to the third embodiment of the present invention.
  • the optical element 308 includes a wavelength conversion member 304 and four heat radiating members 305 in contact therewith.
  • the optical element 308 is different from the optical elements of the first and second embodiments in that it has four heat dissipating members 305.
  • FIG. 13A is a plan view showing the optical element 308.
  • FIGS. 13B and 13C are cross-sectional views showing the optical element 308.
  • the heat dissipation member 305 is provided at the four ends of the wavelength conversion member. Further, as shown in FIGS. 13B and 13C, the wavelength conversion member 304 has a first region 314 at its four ends and a second region 313 at the center. For this reason, the amount of heat generated at the center of the wavelength conversion member 304 is reduced, while the amount of heat generated at the end of the wavelength conversion member 304 is increased. However, the heat generated at the ends of the wavelength conversion member 304 can be dissipated through the heat dissipating member 305 in contact with the four ends of the wavelength conversion member. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the concentration of the wavelength conversion material.
  • FIG. 14A shows the concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 304
  • FIG. 14B shows the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 304.
  • the concentration of the wavelength conversion material in the wavelength conversion member 304 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 305 and the concentration is further away from the heat dissipation member 305. Is thinner.
  • the concentration of the wavelength conversion material in the wavelength conversion member 304 continuously changes in the y direction. The closer to the heat dissipation member 305, the higher the concentration. The farther away, the lower the concentration.
  • the shape of the heat dissipation member is not limited to that shown in FIG.
  • the single heat radiating member 305a may be contacted with four ends of the wavelength conversion member 304a.
  • the heat dissipating member 305a has such a structure, the number of parts for manufacturing the optical element can be reduced, and the manufacturing becomes easy.
  • the shapes of the wavelength conversion member and the heat dissipation member are not limited to those shown in FIGS.
  • the wavelength conversion member 304b may have a disk shape.
  • the heat radiation member 305b may have a shape surrounding the wavelength conversion member 304b.
  • FIG. 17 is a sectional view showing an optical element 408 according to the fourth embodiment of the present invention.
  • the optical element 408 has a wavelength conversion member 404 and two heat radiating members 405 in contact therewith. Furthermore, it has a transparent member 422 that faces the wavelength conversion member 404 and is provided in contact with the wavelength conversion member 404.
  • the optical element 408 differs from the first to third embodiments in that it includes a transparent member 422.
  • the transparent member 422 is disposed in contact with each of the upper surface and the lower surface of the wavelength conversion member 404.
  • the transparent member 422 By arranging the transparent member 422 in this way, the mechanical strength of the wavelength conversion member 404 can be increased.
  • the wavelength conversion member can be thinned to increase the efficiency of wavelength conversion of the excitation light incident on the wavelength conversion member and output as fluorescence.
  • the thickness of the wavelength conversion member can be 1 mm or less. It becomes.
  • the thickness of the wavelength conversion member is desirably determined in consideration of the absorption rate of excitation light, the emission efficiency of fluorescence, the transmittance for fluorescence, and the like.
  • the transparent member 422 As the material of the transparent member 422, it is desirable to use a material having a high transmittance with respect to excitation light or fluorescence. As a material of the transparent member 422, for example, glass or transparent resin can be used.
  • FIG. 18 is a cross-sectional view of the optical element 408a when a material having a high thermal conductivity is used as the material of the transparent member 422.
  • the concentration of the wavelength conversion material increases from the center of the wavelength conversion member 404a toward the surface in contact with the heat dissipation member 405 and the surface in contact with the transparent member 422 of the wavelength conversion member 404a.
  • the material of the transparent member 422 include sapphire and crystal having a higher thermal conductivity than glass or resin of a binder material.
  • the transparent member 422 has a function of radiating heat generated by the wavelength converting member 404a. For this reason, it becomes possible to realize a larger heat dissipation effect.
  • the optical element 408 in which the transparent member 422 is in contact with the upper surface and the lower surface of the wavelength conversion member, but the optical element of the present embodiment is not limited to this.
  • the optical element may include a transparent member that is in contact with only one of the upper surface and the lower surface of the wavelength conversion member.
  • FIG. 19 is a sectional view showing an optical element 508 according to the fifth embodiment of the present invention.
  • the optical element 508 includes a wavelength conversion member 504 and two heat radiating members 505 in contact therewith.
  • the heat dissipation member 505 is made of a transparent member.
  • a material having a higher thermal conductivity than the binder material included in the wavelength conversion member 504 is used as the material of the heat dissipation member 505. Examples of such materials include sapphire and quartz.
  • the heat radiating member 505 made of a transparent member is in contact with the upper surface and the lower surface of the wavelength conversion member 504.
  • the upper and lower surfaces of the wavelength conversion member 504 have a larger area than the side surfaces. For this reason, in the optical element 508, the contact area between the heat dissipation member 505 and the wavelength conversion member 504 can be increased compared to the case where the heat dissipation member is in contact with the side surface, and the heat generated by the wavelength conversion member 504 can be generated faster. Can tell.
  • FIG. 19 shows the optical element 508 in which the heat dissipation member 505 is in contact with the upper surface and the lower surface of the wavelength conversion member 504, but the optical element of the present embodiment is not limited to this.
  • the optical element may have a heat radiating member that contacts only one of the upper surface and the lower surface of the wavelength conversion member.
  • FIG. 20 is a cross-sectional view showing an optical element 608 according to the sixth embodiment of the present invention.
  • the optical element 608 has a wavelength conversion member 604 and two heat radiating members 605 in contact therewith. Furthermore, it has the wavelength selection filter 623 arrange
  • FIG. The optical element 608 differs from the first to fifth embodiments in that it includes a wavelength selection filter 623.
  • the wavelength selection filter 623 has a characteristic of reflecting or absorbing the excitation light 610 and transmitting the fluorescence 611 generated by the wavelength conversion member 604.
  • the concentration of the wavelength conversion material of the wavelength conversion member 604 varies depending on the position, the light spectrum varies depending on the position of the light emitted from the wavelength conversion member 604.
  • the optical path length of the excitation light in the wavelength conversion member 604 varies depending on the incident angle to the wavelength conversion member 604
  • the light spectrum varies depending on the emission angle of the light transmitted through the wavelength conversion member 604. For this reason, color unevenness is likely to occur in the light emitted from the wavelength conversion member 604.
  • the wavelength selection filter 623 so as to face the wavelength conversion member 604, the light emitted from the optical element 608 can be only the fluorescence 611, and color unevenness can be reduced.
  • the wavelength conversion member 604 has a region where the concentration of the wavelength conversion material is thin. Since the absorption rate of the excitation light 610 is low in this region, the proportion of the excitation light incident on the wavelength conversion member that is transmitted without being wavelength-converted increases.
  • the wavelength selection filter 623 having the characteristic of reflecting light in the wavelength band of the excitation light 610 is disposed, the excitation light 610 that has passed through the wavelength conversion member 604 is reflected by the wavelength selection filter 623 and is again converted into wavelength. Incident on the member 604. And since the excitation light 610 which entered again into the wavelength conversion member 604 is converted into the fluorescence 611, as a result, the light quantity of the fluorescence 611 can be enlarged.
  • the wavelength selection filter 623 has a characteristic of transmitting a specific wavelength band using a glass substrate containing a material that absorbs light in the wavelength band of excitation light, a dielectric multilayer film, a holographic element, a photonic crystal, or the like. Things can be used.
  • the wavelength selection filter 623 may be separated from the wavelength conversion member 604 or may be in contact with the wavelength conversion member 604.
  • FIG. 21 is a sectional view showing an optical element 708 according to the seventh embodiment of the present invention.
  • the optical element 708 includes a wavelength conversion member 704 and two heat radiating members 705 in contact therewith. Furthermore, it has the wavelength selection filter 724 arrange
  • FIG. The optical element 708 is different from the first to fifth embodiments in that it includes a wavelength selection filter 724.
  • the wavelength selection filter 724 has a characteristic of transmitting light in the wavelength band of the excitation light 710 and reflecting light in the wavelength band of the fluorescence 711 generated by the wavelength conversion member 704.
  • the fluorescence 711 emits isotropically in the wavelength conversion member 704, a part of the fluorescence 711 is emitted to the side on which the excitation light 710 is incident.
  • the fluorescence 711 emitted to the incident side of the excitation light 710 is reflected by the wavelength selection filter 724 and emitted from the emission side of the wavelength conversion member 704. Thereby, the light quantity of the fluorescence 711 emitted from the emission surface of the wavelength conversion member 704 can be increased.
  • wavelength selection filter 724 a dielectric multilayer film, a holographic element, a photonic crystal, or the like that has a characteristic of transmitting a specific wavelength band and reflecting other light can be used.
  • FIG. 22 is a sectional view showing an optical element 808 according to the eighth embodiment of the present invention.
  • the optical element 808 has a wavelength conversion member 804 and two heat radiating members 805 in contact therewith. Further, a polarizer 825 disposed to face the wavelength conversion member 804 is provided.
  • the optical element 808 differs from the first to seventh embodiments in that it includes a polarizer 825.
  • the polarizer 825 transmits light having a polarization component parallel to the transmission axis of the polarizer 825 in the fluorescence 811 and reflects light having a polarization component parallel to the direction orthogonal to the transmission axis. For this reason, part of light having a polarization component parallel to the direction orthogonal to the transmission axis can be reflected by the polarizer 825, reflected by the wavelength conversion member 804, and incident again on the polarizer 825. As a result, light having a polarization component parallel to the transmission axis of the polarizer 825 can be efficiently extracted.
  • polarizer 825 a wire grid polarizer, a multilayer film using an organic material, or the like can be used.
  • the optical element 808 can be used for a projector using a liquid crystal panel as a display element.
  • the liquid crystal panel has polarization dependency. Therefore, the projector spatially modulates only the light of the polarization component in a specific direction, and the light of the polarization component in the direction orthogonal to the specific direction is not modulated and used. Since the light emitted from the optical element 808 is linearly polarized light having a polarization component in a specific direction, the amount of light not used in the optical system as described above can be reduced, and the amount of light emitted from the projector can be improved.
  • FIG. 23 is a sectional view showing an optical element 908 according to the ninth embodiment of the present invention.
  • the optical element 908 includes a wavelength conversion member 904 and two heat radiating members 905 in contact therewith. Further, the optical unit 926 is disposed to face the wavelength conversion member 904.
  • the optical element 908 is different from the first to eighth embodiments in that it includes an optical unit 926.
  • a rod integrator made of a columnar transparent material, a light pipe having a cylindrical shape and having a specular reflection inside the cylinder, a lens array in which a plurality of lenses are arranged in a plane, and the like are used. Can do.
  • the intensity distribution of the fluorescence 911 can be made uniform by the optical unit 926. For this reason, for example, when the optical element 908 is used in a projector, the intensity distribution of light emitted from the projector is made uniform. As a result, when light is projected from a projector onto a screen or the like, illuminance unevenness on the screen can be made uniform.
  • FIG. 24A is a perspective view showing a light emitting device 1001 according to the tenth embodiment of the present invention.
  • the light emitting device 1001 includes an optical element 1008 and a light source 1002.
  • the light source 1002 is disposed so that the light emitting surface thereof faces the wavelength conversion member 1004 of the optical element 1008 and light from the light source enters the wavelength conversion member 1004.
  • the optical element 1008 is the same as that described in the third embodiment.
  • FIG. 24B is a plan view illustrating the light-emitting device 1001.
  • FIG. 25 is a cross-sectional view illustrating the light emitting device 1001.
  • the light emitting device 1001 it is possible to take out the fluorescence 1011 by making the light from the light source 1002 incident on the wavelength conversion member 1004 as the excitation light 1010 while preventing the temperature of the wavelength conversion member 1004 from rising.
  • the light source for example, an LED or a semiconductor laser can be used, but it is not particularly limited thereto. Further, the shape of the light source is not limited.
  • the light source may be a surface-emitting solid-state light source or a surface-emitting device including a light source and a light guide plate.
  • the optical element 1008 is described in the third embodiment, but the optical element 1008 is not limited to this. Any of the optical elements shown in the first to ninth embodiments can be used in the light emitting device. Further, the light-emitting device includes the wavelength selection filter 623 shown in the sixth embodiment, the wavelength selection filter 724 shown in the seventh embodiment, the polarizer 825 shown in the eighth embodiment, and the ninth embodiment. In addition, any two or more of the four elements of the optical unit 926 may be included. Further, an optical element such as a lens or a folding mirror may be provided in front of or behind each element.
  • the three elements may be arranged in any order.
  • each wavelength selection filter may be arranged so as to sandwich the wavelength conversion member. desirable.
  • FIG. 26 shows a configuration diagram of a projector as the projection apparatus of this embodiment.
  • the projector 1129 includes light emitting devices 1101a, 1101b, and 1101c, liquid crystal panels 1127a, 1127b, and 1127c, a cross dichroic prism 1128, and a projection optical system 1130b.
  • the light emitting devices 1101a, 1101b, and 1101c may be any of the light emitting devices described in the tenth embodiment.
  • Each of the light emitting devices 1101a, 1101b, and 1101c emits light having different wavelengths. For example, red light is emitted from the light emitting device 1101a, green light is emitted from the light emitting device 1101b, and blue light is emitted from the light emitting device 1101c.
  • each of the light emitting devices 1101a, 1101b, and 1101c is incident on each of the liquid crystal panels 1127a, 1127b, and 1127c.
  • the liquid crystal panels 1127a, 1127b, and 1127c two-dimensionally modulate each incident color light according to a video signal so that each color light carries an image, and spatial light that emits each color light carrying the image. It is a modulation element.
  • the spatial light modulation element may be a digital micromirror device.
  • the cross dichroic prism 1128 synthesizes and outputs the modulated lights emitted from the liquid crystal panels 1127a, 1127b, and 1127c.
  • the projection optical system 1130b projects the combined light emitted from the cross dichroic prism 1128 onto the screen 1130a, and displays an image corresponding to the video signal on the screen 1130a.
  • the wavelength conversion member has the third region where the concentration of the wavelength conversion material is lower than that of the first region, and the concentration of the wavelength conversion material is higher than that of the second region.
  • the optical element according to any one of appendices 1 to 4, wherein the third region is disposed between the first region and the second region.
  • region are 5 wt% or more and 50 wt% or less in any one of Additional remarks 1-5 Optical element.
  • the concentration of the wavelength conversion material in the first region is 30 wt% or more and 50 wt% or less, and the concentration of the wavelength conversion material in the second region is 5 wt% or more and less than 30 wt%. 7.
  • Appendix 8 The optical element according to any one of appendices 1 to 7, wherein the wavelength conversion member includes a binder that maintains a state in which the wavelength conversion material is dispersed.
  • Appendix 10 The optical element according to any one of appendices 1 to 9, wherein the wavelength conversion material is a phosphor.
  • the said heat radiating member contains the area
  • Appendix 13 The optical element according to any one of appendices 1 to 12, wherein the heat dissipating member is either a heat sink or a heat pipe.
  • Appendix 14 The optical element according to any one of appendices 1 to 13, wherein the heat radiating member has a reflective surface that reflects light on a surface in contact with the wavelength conversion member.
  • Appendix 16 The optical element according to any one of appendices 1 to 15, wherein a concave structure is provided in at least one of the portions where the wavelength conversion member and the heat dissipation member are in contact with each other.
  • the wavelength conversion material has a function of emitting light in the second wavelength band when light in the first wavelength band is incident, and further reflects the light in the first wavelength band.
  • the said 2nd wavelength selection filter is the said wavelength conversion
  • the wavelength conversion material has a function of emitting light in the second wavelength band when light in the first wavelength band is incident, and further reflects light in the second wavelength band.
  • the optical device according to any one of appendices 1 to 17, further comprising: a second wavelength selection filter that transmits light in one wavelength band, wherein the second wavelength selection filter is disposed to face the wavelength conversion member. element.
  • optical element according to any one of supplementary notes 1 to 21, further comprising an optical unit that uniformizes an intensity distribution of incident light, wherein the optical unit is disposed to face the wavelength conversion member.
  • a light-emitting device comprising the optical element according to any one of supplementary notes 1 to 22 and a light source that emits light incident on the wavelength conversion member.
  • Appendix 24 The light emitting device according to appendix 23, wherein the light source is disposed to face the wavelength conversion member.
  • a projection device comprising the light emitting device according to supplementary note 23 or 24 and a projection optical system that projects light emitted from the light emitting device.
  • Light emitting device 1002 Light source 104, 104a, 104b, 104c, 104d, 104e, 204, 304, 304a, 304b, 404, 404a, 504, 604, 704, 804, 904, 1004 Wavelength conversion member 105 105a, 105b, 105c, 105d, 105e, 205, 305, 305a, 305b, 405, 505, 605, 705, 805, 905, 1005 Heat dissipation member 106e Heat dissipation member 108, 208, 308, 308a, 308b, 408, 408a , 608, 708 Optical element 110, 610, 710, 810, 910, 1010 Excitation light 111, 611, 711, 811, 911, 1011 Fluorescence 112, 1012 Fluorescence 113, 213, 313 Second Region 114, 214, 314 First region 115 Third region 422 Transparent member 623 Wavelength conversion member 105 105a, 105b

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Projection Apparatus (AREA)

Abstract

This optical element is provided with: a wavelength conversion member comprising a first region and a second region that have differing concentrations of a wavelength conversion material; and at least one heat dissipation member that is in contact with the wavelength conversion member. The concentration in the first region is higher than the concentration in the second region, and the heat dissipation member is in contact with the first region of the wavelength conversion member.

Description

光学素子、発光装置、及び投影装置Optical element, light emitting device, and projection device
 本発明は、光学素子、発光装置、及び投影装置に関し、特に、波長変換部材を有する光学素子、発光装置、及び投影装置に関する。 The present invention relates to an optical element, a light emitting device, and a projection device, and particularly to an optical element having a wavelength conversion member, a light emitting device, and a projection device.
 照明やプロジェクタにおいては、高輝度、低消費電力、長寿命の発光装置が求められている。現在、この要求を満たす発光装置として、発光ダイオード(Light Emitting Diode;LED)や半導体レーザ(Laser Diode;LD)を用いたものがある。 In lighting and projectors, light emitting devices with high brightness, low power consumption, and long life are required. Currently, there are light emitting devices that use light emitting diodes (Light Emitting Diodes; LEDs) or semiconductor lasers (Laser Diodes; LDs) as light emitting devices that satisfy this requirement.
 LEDやLDは半導体材料によって作製される。InGaN系の半導体材料を用いると、LEDやLDは青色の光を発生させることができる。AlGaInP系の半導体材料を用いると、LEDやLDは赤色の光を発生させることができる。しかしながら、InGaN系とAlGaInP系の材料を用いたLEDやLDでは、緑色の光の発光効率が低い。このため、LEDやLDと波長変換部材とを組み合わせた発光装置が多く提案されている。 LEDs and LDs are made of semiconductor materials. When an InGaN-based semiconductor material is used, the LED and the LD can generate blue light. When an AlGaInP-based semiconductor material is used, the LED and the LD can generate red light. However, LEDs and LDs using InGaN-based and AlGaInP-based materials have low green light emission efficiency. For this reason, many light-emitting devices which combined LED, LD, and the wavelength conversion member are proposed.
 例えば、特許文献1には、光取出し率が低減するという課題に対して、LEDチップを実装し、LEDチップに電力を供給するための配線を有する実装基板と、LEDチップ実装部の周囲に形成された凹状開口部と、透光性材料中に波長変換材料を含有させた波長変換部材と、を有する発光装置が開示されている。 For example, in Patent Document 1, in response to a problem that the light extraction rate is reduced, an LED chip is mounted, and a wiring board for supplying power to the LED chip is formed around the LED chip mounting portion. There is disclosed a light emitting device having a concave opening formed and a wavelength conversion member in which a wavelength conversion material is contained in a translucent material.
 特許文献1においては、波長変換部材として、中央部に向かって波長変換材料の濃度が濃くなる部材や、波長変換部材のLEDチップに対向する面側に波長変換材料を沈降させた部材が用いられている。 In Patent Document 1, as the wavelength conversion member, a member in which the concentration of the wavelength conversion material increases toward the central portion, or a member in which the wavelength conversion material is settled on the side of the wavelength conversion member facing the LED chip is used. ing.
特開2005-166733号公報 (段落「0007」、「0024」、「0035」~「0038」、図1、図8、図9)JP 2005-166733 A (paragraphs “0007”, “0024”, “0035” to “0038”, FIGS. 1, 8, and 9)
 波長変換部材においては、一般的に、波長変換材料が多いほど波長変換される光の量は多くなるため、波長変換材料の濃度は濃い方が望ましい。しかしながら、波長変換材料にて光が波長変換される際には、熱が生じて波長変換部材の温度が上昇する。特許文献1に記載の波長変換部材のように、波長変換部材の中央やLEDチップに対向する面側の領域における波長変換材料の濃度を濃くした場合、これらの領域を起点に波長変換部材の温度が上昇する。 In the wavelength conversion member, generally, the more the wavelength conversion material is, the more light is wavelength-converted. Therefore, it is desirable that the concentration of the wavelength conversion material is higher. However, when light is wavelength-converted by the wavelength conversion material, heat is generated and the temperature of the wavelength conversion member rises. As in the wavelength conversion member described in Patent Document 1, when the concentration of the wavelength conversion material in the center of the wavelength conversion member and the region on the surface facing the LED chip is increased, the temperature of the wavelength conversion member starts from these regions. Rises.
 波長変換部材の温度が上がると、波長変換材料の振動エネルギーが増大し、励起光が波長変換材料により波長変換されない割合が増え、蛍光強度が低くなる(温度消光)可能性がある。このため、波長変換部材の温度ができるだけ上昇しないようにすることが望ましい。 When the temperature of the wavelength conversion member increases, the vibration energy of the wavelength conversion material increases, the proportion of excitation light that is not wavelength-converted by the wavelength conversion material increases, and the fluorescence intensity may decrease (temperature quenching). For this reason, it is desirable to prevent the temperature of the wavelength conversion member from rising as much as possible.
 本発明の目的は、上述した、波長変換部材の温度が上昇するという課題を解決する光学素子、発光装置、及び投影装置を提供することにある。 An object of the present invention is to provide an optical element, a light emitting device, and a projection device that solve the above-described problem that the temperature of the wavelength conversion member increases.
 上記目的を達成するために本発明に係る光学素子は、波長変換材料の濃度が異なる第1の領域と第2の領域とを有する波長変換部材と、波長変換部材に接する少なくとも一つの放熱部材と、を備え、第1の領域の濃度は第2の領域よりも濃く、波長変換部材の第1の領域に放熱部材が接する。 In order to achieve the above object, an optical element according to the present invention includes a wavelength conversion member having a first region and a second region having different concentrations of the wavelength conversion material, and at least one heat radiating member in contact with the wavelength conversion member. The concentration of the first region is higher than that of the second region, and the heat dissipation member is in contact with the first region of the wavelength conversion member.
 また、本発明の発光装置は、本発明の光学素子と、波長変換部材に入射する光を発する光源とを有する。 The light-emitting device of the present invention includes the optical element of the present invention and a light source that emits light incident on the wavelength conversion member.
 また、本発明の投影装置は、本発明の発光装置と、発光装置から出射された光を投射する投射光学系とを有する。 The projection device of the present invention includes the light emitting device of the present invention and a projection optical system that projects light emitted from the light emitting device.
 本発明によれば、波長変換部材の温度が上昇するのを抑制できる。 According to the present invention, an increase in the temperature of the wavelength conversion member can be suppressed.
本発明の第1の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 1st Embodiment of this invention. 本発明の第1の実施形態の光学素子を示す(A)平面図及び(B)2B-2B断面図である。1A is a plan view and FIG. 2B is a cross-sectional view of 2B-2B showing an optical element according to a first embodiment of the present invention. 本発明の第1の実施形態の光学素子の(A)2B-2B断面図であって、波長変換部材が有する波長変換材料のx-z方向における濃度分布を示す図及びグラフ及び(B)3B-3B断面図であって、y-z方向における濃度分布を示す図及びグラフである。FIG. 2B is a cross-sectional view of the optical element according to the first embodiment of the present invention, taken along the line (A) 2B-2B, showing the concentration distribution in the xz direction of the wavelength conversion material of the wavelength conversion member, and (B) 3B. FIG. 3C is a cross-sectional view of −3B, showing a concentration distribution in the yz direction. 本発明の第1の実施形態の光学素子が有する波長変換部材の別の例が有する波長変換材料のx-z方向における濃度分布を示す図及びグラフである。It is a figure and graph which show the density distribution in the xz direction of the wavelength conversion material which another example of the wavelength conversion member which the optical element of the 1st Embodiment of this invention has has. 本発明の第1の実施形態の光学素子の別の例を示す断面図である。It is sectional drawing which shows another example of the optical element of the 1st Embodiment of this invention. 本発明の第1の実施形態の光学素子が有する波長変換部材と放熱部材とが(A)嵌合する例、(B)嵌合する別の例、(C)嵌合するさらに別の例を示す図である。The example in which the wavelength conversion member and the heat dissipation member of the optical element of the first embodiment of the present invention are (A) fitted, (B) another example to be fitted, and (C) yet another example to be fitted. FIG. 波長変換材料の濃度と波長変換部材から出射される蛍光の光量との関係を示すグラフである。It is a graph which shows the relationship between the density | concentration of a wavelength conversion material, and the light quantity of the fluorescence radiate | emitted from a wavelength conversion member. 波長変換材料の濃度と蛍光に対する透過率との関係を示すグラフである。It is a graph which shows the relationship between the density | concentration of a wavelength conversion material, and the transmittance | permeability with respect to fluorescence. 本発明の第2の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 2nd Embodiment of this invention. 本発明の第2の実施形態の光学素子を示す(A)平面図、(B)10B-10B断面図及び(C)11B-11B断面図である。FIG. 6A is a plan view, FIG. 10B-10B sectional view, and FIG. 11C-11B-11B sectional view showing an optical element according to a second embodiment of the present invention. 本発明の第2の実施形態の光学素子の(A)10B-10B断面図であって、波長変換部材が有する波長変換材料のx-z方向における濃度分布を示す図及びグラフ及び(B)11B-11B断面図であって、y-z方向における濃度分布を示す図及びグラフである。(A) 10B-10B cross-sectional view of the optical element of the second embodiment of the present invention, a diagram and graph showing the concentration distribution in the xz direction of the wavelength conversion material possessed by the wavelength conversion member, and (B) 11B FIG. 11B is a cross-sectional view taken along the line -11B and shows a concentration distribution in the yz direction. 本発明の第3の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 3rd Embodiment of this invention. 本発明の第3の実施形態の光学素子を示す(A)平面図、(B)13B-13B断面図及び(C)13C-13C断面図である。It is (A) top view, (B) 13B-13B sectional view, and (C) 13C-13C sectional view showing an optical element of a third embodiment of the present invention. 本発明の第3の実施形態の光学素子の(A)13B-13B断面図であって、波長変換部材が有する波長変換材料のx-z方向における濃度分布を示す図及びグラフ及び(B)13C-13C断面図であって、y-z方向における濃度分布を示す図及びグラフである。(A) 13B-13B cross-sectional view of the optical element of the third embodiment of the present invention, a diagram and graph showing the concentration distribution in the xz direction of the wavelength conversion material possessed by the wavelength conversion member, and (B) 13C FIGS. 13A and 13B are cross-sectional views and graphs showing concentration distribution in the yz direction. 本発明の第3の実施形態の光学素子の別の例を示す断面図である。It is sectional drawing which shows another example of the optical element of the 3rd Embodiment of this invention. 本発明の第3の実施形態の光学素子のさらに別の例を示す図である。It is a figure which shows another example of the optical element of the 3rd Embodiment of this invention. 本発明の第4の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 4th Embodiment of this invention. 本発明の第4の実施形態の光学素子の別の例を示す断面図である。It is sectional drawing which shows another example of the optical element of the 4th Embodiment of this invention. 本発明の第5の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 5th Embodiment of this invention. 本発明の第6の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 6th Embodiment of this invention. 本発明の第7の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 7th Embodiment of this invention. 本発明の第8の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 8th Embodiment of this invention. 本発明の第9の実施形態の光学素子を示す断面図である。It is sectional drawing which shows the optical element of the 9th Embodiment of this invention. 本発明の第10の実施形態の発光装置を示す(A)斜視図、(B)平面図である。It is (A) perspective view and (B) top view which show the light-emitting device of the 10th Embodiment of this invention. 本発明の第10の実施形態の発光装置の24B-24B断面図である。It is 24B-24B sectional drawing of the light-emitting device of the 10th Embodiment of this invention. 本発明の第11の実施形態の投影装置を示す図である。It is a figure which shows the projection apparatus of the 11th Embodiment of this invention.
(第1の実施形態)
 図1は、第1の実施形態の光学素子を示す斜視図である。図1に示すように、光学素子108は、波長変換部材104と、波長変換部材104に接する少なくとも一つの放熱部材105とを有する。光学素子108の詳細について、図2(A)、図2(B)を用いて説明する。図2(A)は光学素子108の平面図である。図2(B)は光学素子108の断面図である。図2(B)では、波長変換部材104内の波長変換材料の濃度を塗りつぶした色の濃さで表しており、色が濃いほど濃度が濃く、色が薄いほど濃度が薄いことを示している。
(First embodiment)
FIG. 1 is a perspective view showing an optical element according to the first embodiment. As shown in FIG. 1, the optical element 108 includes a wavelength conversion member 104 and at least one heat radiating member 105 in contact with the wavelength conversion member 104. Details of the optical element 108 will be described with reference to FIGS. FIG. 2A is a plan view of the optical element 108. FIG. 2B is a cross-sectional view of the optical element 108. In FIG. 2B, the concentration of the wavelength conversion material in the wavelength conversion member 104 is represented by the darkness of the filled color. The darker the color, the higher the concentration, and the lighter the color, the lower the concentration. .
 図2(B)に示すように、波長変換部材104は少なくとも、波長変換材料の濃度が異なる第1の領域114と第2の領域113とを有し、第1の領域114の濃度は第2の領域113の濃度よりも濃い。波長変換部材104の一端側は放熱部材105と接しており、波長変換部材104の他端側は露出している。波長変換部材104の放熱部材105と接する側に、第1の領域114が配置される。 As shown in FIG. 2B, the wavelength conversion member 104 has at least a first region 114 and a second region 113 having different concentrations of the wavelength conversion material, and the concentration of the first region 114 is the second concentration. The density of the region 113 is higher. One end side of the wavelength conversion member 104 is in contact with the heat dissipation member 105, and the other end side of the wavelength conversion member 104 is exposed. The first region 114 is disposed on the side of the wavelength conversion member 104 that contacts the heat dissipation member 105.
 次に、図2(B)を用いて、光学素子108の働きについて説明する。以下の説明では、波長変換部材104に入射する光を励起光と呼ぶ。また、波長変換部材104で波長変換された光を蛍光と呼ぶ。 Next, the function of the optical element 108 will be described with reference to FIG. In the following description, light incident on the wavelength conversion member 104 is referred to as excitation light. In addition, the light whose wavelength is converted by the wavelength conversion member 104 is called fluorescence.
 光学素子108において、波長変換部材104は、波長変換材料の濃度が異なる第1の領域114と第2の領域113とを有する。光学素子108は、光が入射する入射面を有し、この入射面の面方向と平行に、第1の領域と第2の領域とが並列配置される。図2(B)においては、入射面はxy方向に広がる平面であり、第1の領域と第2の領域とはx方向に並列配置されている。 In the optical element 108, the wavelength conversion member 104 has a first region 114 and a second region 113 in which the concentration of the wavelength conversion material is different. The optical element 108 has an incident surface on which light is incident, and the first region and the second region are arranged in parallel in parallel to the surface direction of the incident surface. In FIG. 2B, the incident surface is a flat surface extending in the xy direction, and the first region and the second region are arranged in parallel in the x direction.
 第1の領域114の濃度は第2の領域113の濃度よりも濃い。このため、第1の領域114で波長変換される光の量は第2の領域113で波長変換される光の量よりも多くなり、第1の領域114にて光が波長変換される際に生じる熱が大きくなる。しかしながら、第1の領域114は、放熱部材105と接しているため、第1の領域114で生じた熱は放熱部材105に伝わり、放熱部材105から放散される。よって、光学素子108では、波長変換部材104自体の温度が上昇するのを抑制でき、温度消光が起こるのを防ぐことができる。 The concentration of the first region 114 is higher than the concentration of the second region 113. For this reason, the amount of light that is wavelength-converted in the first region 114 is larger than the amount of light that is wavelength-converted in the second region 113, and when the light is wavelength-converted in the first region 114. The heat that is generated increases. However, since the first region 114 is in contact with the heat dissipation member 105, the heat generated in the first region 114 is transmitted to the heat dissipation member 105 and is dissipated from the heat dissipation member 105. Therefore, in the optical element 108, it can suppress that the temperature of wavelength conversion member 104 itself raises, and can prevent that temperature quenching occurs.
 なお、本実施形態では、波長変換部材に接する放熱部材を一つ有する光学素子の例を示したが、放熱部材の数はこれに限定されない。 In the present embodiment, an example of an optical element having one heat radiating member in contact with the wavelength conversion member is shown, but the number of heat radiating members is not limited to this.
 ここで、図2(B)に示すように、波長変換部材104は、第1の領域114よりも波長変換材料の濃度が薄く、第2の領域113よりも波長変換材料の濃度が濃い第3の領域115を有していても良い。第3の領域115は、波長変換部材104の第1の領域114と第2の領域との間に配置される。 Here, as illustrated in FIG. 2B, the wavelength conversion member 104 has a concentration of the wavelength conversion material lower than that of the first region 114 and a concentration of the wavelength conversion material higher than that of the second region 113. The region 115 may be provided. The third region 115 is disposed between the first region 114 and the second region of the wavelength conversion member 104.
 波長変換部材104のx方向における波長変換材料の濃度分布を図3(A)に示し、波長変換部材104のy方向における波長変換材料の濃度分布を図3(B)に示す。図3(A)に示すように、波長変換部材104内における波長変換材料の濃度はx方向に連続的に変化しており、放熱部材105に近いほど濃度が濃く、放熱部材105から離れるほど濃度が薄い。一方、図3(B)に示すように、波長変換部材104内におけるy方向における波長変換材料の濃度は一定である。 FIG. 3A shows the concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 104, and FIG. 3B shows the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 104. As shown in FIG. 3A, the concentration of the wavelength conversion material in the wavelength conversion member 104 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 105, and the concentration is higher as it is farther from the heat dissipation member 105. Is thin. On the other hand, as shown in FIG. 3B, the concentration of the wavelength conversion material in the y direction in the wavelength conversion member 104 is constant.
 このように、波長変換部材104中の濃度を変化させることにより、波長変換部材の温度が上昇するのを防ぎつつ、波長変換材料の濃度を濃くできる。 Thus, by changing the concentration in the wavelength conversion member 104, the concentration of the wavelength conversion material can be increased while preventing the temperature of the wavelength conversion member from rising.
 波長変換部材内における波長変換材料の濃度分布は、図3(A)、(B)に示すものに限定されるものではない。例えば、図4に示すように、波長変換部材104a内における波長変換材料の濃度は、段階的に変化していても良い。 The concentration distribution of the wavelength conversion material in the wavelength conversion member is not limited to that shown in FIGS. 3 (A) and 3 (B). For example, as shown in FIG. 4, the concentration of the wavelength conversion material in the wavelength conversion member 104a may change stepwise.
 ここで、波長変換材料の濃度はwt%で表され、(波長変換材料の重さ)/(波長変換部材の重さ)により求められる。また、波長変換部材が波長変換材料とバインダからなるものである場合、波長変換材料の濃度は(波長変換材料の重さ)/(バインダの重さ+波長変換材料の重さ)で求められる。 Here, the concentration of the wavelength conversion material is expressed in wt% and is obtained by (weight of wavelength conversion material) / (weight of wavelength conversion member). When the wavelength conversion member is composed of a wavelength conversion material and a binder, the concentration of the wavelength conversion material is obtained by (weight of wavelength conversion material) / (weight of binder + weight of wavelength conversion material).
 波長変換材料の濃度は、5wt%以上、特に20wt%以上とすることが望ましい。また、波長変換材料の濃度は、50wt%以下、特に40wt%以下とすることが望ましい。例えば、第1の領域の濃度を30wt%以上、50wt%以下とし、第2の領域の濃度を5wt%以上、30wt%未満とすることができる。なお、波長変換材料の濃度は、波長変換材料の励起光吸収率、波長変換部材の厚さなどを考慮して決めることが望ましい。また、波長変換部材がバインダを有する場合は、バインダの熱伝導率を考慮して決めることが望ましい。 The concentration of the wavelength conversion material is preferably 5 wt% or more, particularly 20 wt% or more. The concentration of the wavelength conversion material is desirably 50 wt% or less, particularly 40 wt% or less. For example, the concentration of the first region can be 30 wt% or more and 50 wt% or less, and the concentration of the second region can be 5 wt% or more and less than 30 wt%. The concentration of the wavelength conversion material is desirably determined in consideration of the excitation light absorption rate of the wavelength conversion material, the thickness of the wavelength conversion member, and the like. Moreover, when the wavelength conversion member has a binder, it is desirable to determine in consideration of the thermal conductivity of the binder.
 波長変換部材104は、波長変換材料が分散した状態を保持するバインダを有していても良い。バインダは、ガラス又は透明な樹脂からなるものが望ましい。 The wavelength conversion member 104 may have a binder that maintains a state in which the wavelength conversion material is dispersed. The binder is preferably made of glass or transparent resin.
 なお、波長変換部材104の温度が上昇すると、温度消光のみならず、波長変換部材104の構造的な安定性の低下を招く。例えば、波長変換部材104のバインダにガラスを用いている場合は、ガラスの溶融や熱誘起の機械的応力による波長変換部材104のヒビ割れが生じる恐れがある。また、バインダに樹脂を用いている場合は樹脂の変性による透過率の低下や樹脂の熱変形などが生じる。一方、本実施形態の光学素子108では、波長変換部材104の温度上昇を抑制できるため、これらの問題が生じるのを防ぐことができる。 In addition, when the temperature of the wavelength conversion member 104 rises, not only the temperature quenching but also the structural stability of the wavelength conversion member 104 is lowered. For example, when glass is used for the binder of the wavelength conversion member 104, the wavelength conversion member 104 may be cracked due to melting of the glass or heat-induced mechanical stress. Further, when a resin is used for the binder, a decrease in transmittance due to the modification of the resin, a thermal deformation of the resin, or the like occurs. On the other hand, in the optical element 108 of this embodiment, since the temperature rise of the wavelength conversion member 104 can be suppressed, these problems can be prevented from occurring.
 本実施形態で用いる波長変換材料には蛍光体を用いている。本実施形態で用いる放熱部材には、その熱伝導率が空気の熱伝導率より大きいものを用いている。 Fluorescent material is used for the wavelength conversion material used in this embodiment. The heat radiating member used in the present embodiment has a thermal conductivity higher than that of air.
 また、波長変換部材で生じる熱を、放熱部材を介して放つために、放熱部材の熱伝導率は大きいほうが望ましく、特に、波長変換部材が有するバインダよりも大きい方が望ましい。例えば、放熱部材は、銅やアルミニウムなどの金属材料を含有することが望ましい。金属材料の熱伝導率は大きい。このため、放熱部材に金属材料を含有させることで、波長変換部材で生じる熱を効率的に逃がすことができるようになる。 Further, in order to release the heat generated in the wavelength conversion member through the heat dissipation member, it is desirable that the heat conductivity of the heat dissipation member is large, and in particular, it is desirable that it is larger than the binder of the wavelength conversion member. For example, the heat dissipation member desirably contains a metal material such as copper or aluminum. The thermal conductivity of metal materials is large. For this reason, the heat generated in the wavelength conversion member can be efficiently released by including a metal material in the heat dissipation member.
 また、放熱部材は、樹脂材料を含有していても良い。放熱部材が樹脂材料を含有することにより、放熱部材と波長変換部材との密着性が向上し、波長変換部材で生じる熱が放熱部材に伝わりやすくなる。そこで、例えば、図5示すように、樹脂材料を含有する放熱部材105eを波長変換部材104eに接するように設けても良い。この場合、樹脂材料の熱伝導率が一般的には高くないことから、放熱部材105eに接し、熱伝導率が大きい別の放熱部材106eをさらに設けることが望ましい。 The heat dissipation member may contain a resin material. When the heat radiating member contains the resin material, the adhesion between the heat radiating member and the wavelength conversion member is improved, and heat generated by the wavelength conversion member is easily transmitted to the heat radiating member. Therefore, for example, as shown in FIG. 5, a heat radiating member 105e containing a resin material may be provided in contact with the wavelength conversion member 104e. In this case, since the thermal conductivity of the resin material is not generally high, it is desirable to further provide another heat radiating member 106e having a high thermal conductivity in contact with the heat radiating member 105e.
 また、放熱部材は、ヒートシンク及びヒートパイプのいずれかであっても良い。ヒートシンクやヒートパイプは熱伝導率が高く、放熱効果が大きいため、これらにより波長変換部材で生じた熱を放散させることが可能となる。 Further, the heat radiating member may be either a heat sink or a heat pipe. Since heat sinks and heat pipes have high thermal conductivity and a large heat dissipation effect, it is possible to dissipate heat generated by the wavelength conversion member.
 放熱部材は、波長変換部材と接する面に、光を反射する反射面を有することが望ましい。放熱部材の波長変換部材と接する面を反射面とすることで、波長変換部材の放熱部材と接する面から出射する光を波長変換部材に戻すことができ、放熱部材での光の吸収損失が起こるのを防ぐことができる。 It is desirable that the heat dissipating member has a reflecting surface that reflects light on the surface in contact with the wavelength converting member. By making the surface of the heat radiating member in contact with the wavelength conversion member a reflective surface, light emitted from the surface of the wavelength conversion member in contact with the heat radiating member can be returned to the wavelength conversion member, and light absorption loss in the heat radiating member occurs. Can be prevented.
 波長変換部材と放熱部材とが接する方法は特に限定されるものではない。例えば、図6(A)に示すように、波長変換部材104bと放熱部材105bのそれぞれに凸構造と凹構造を設けて、凸構造と凹構造とを嵌合させても良い。このように、凹凸構造を設けて嵌合させることにより、波長変換部材104bと放熱部材105bとが接する面積が大きくなる。この結果、波長変換部材104bで生じた熱が放熱部材105bに伝わりやすくなる。なお、図6(A)には、波長変換部材104bが凸構造を有し、放熱部材105bが凹構造を有する例を示したが、波長変換部材が凹構造を有し、放熱部材が凸構造を有するものであっても良い。 The method for contacting the wavelength conversion member and the heat dissipation member is not particularly limited. For example, as shown in FIG. 6A, a convex structure and a concave structure may be provided on each of the wavelength conversion member 104b and the heat dissipation member 105b, and the convex structure and the concave structure may be fitted. As described above, by providing the concave-convex structure and fitting, the area where the wavelength conversion member 104b and the heat dissipation member 105b are in contact with each other is increased. As a result, heat generated in the wavelength conversion member 104b is easily transmitted to the heat dissipation member 105b. 6A shows an example in which the wavelength conversion member 104b has a convex structure and the heat dissipation member 105b has a concave structure. However, the wavelength conversion member has a concave structure and the heat dissipation member has a convex structure. It may have.
 図6(B)に、波長変換部材と放熱部材とが嵌合する別の例を示す。放熱部材105cの厚さは波長変換部材104cの厚さよりも厚い。さらに、放熱部材105cのみが凹構造を有する。このように、放熱部材105cに凹構造を設けて、この凹構造と波長変換部材104cとを嵌合させることにより、波長変換部材104cと放熱部材105cとが接する面積が大きくなる。この結果、波長変換部材104cで生じた熱が放熱部材105cに伝わりやすくなる。なお、図6(B)には、放熱部材105cのみが凹構造を有する例を示したが、波長変換部材のみが凹構造を有するものであっても良い。 FIG. 6B shows another example in which the wavelength conversion member and the heat dissipation member are fitted. The thickness of the heat radiating member 105c is thicker than the thickness of the wavelength conversion member 104c. Furthermore, only the heat radiating member 105c has a concave structure. Thus, by providing the heat dissipation member 105c with a concave structure and fitting the concave structure with the wavelength conversion member 104c, the area where the wavelength conversion member 104c and the heat dissipation member 105c are in contact with each other increases. As a result, heat generated in the wavelength conversion member 104c is easily transmitted to the heat dissipation member 105c. FIG. 6B shows an example in which only the heat radiating member 105c has a concave structure, but only the wavelength conversion member may have a concave structure.
 図6(C)に、波長変換部材と放熱部材とが嵌合するさらに別の例を示す。ここで、放熱部材105dにはザグリが設けられていて、放熱部材105dの端部が段構造となっている。このように、放熱部材105dに段構造を設けて、段構造と波長変換部材104dとを嵌合させることにより、波長変換部材104dと放熱部材105dとが接する面積が大きくなる。この結果、波長変換部材104dで生じた熱が放熱部材105dに伝わりやすくなる。なお、図6(C)には、放熱部材105dのみが段構造を有する例を示したが、波長変換部材のみが段構造を有するものであっても良い。 FIG. 6C shows still another example in which the wavelength conversion member and the heat dissipation member are fitted. Here, the heat radiating member 105d is provided with counterbore, and the end of the heat radiating member 105d has a step structure. As described above, by providing the heat dissipation member 105d with a step structure and fitting the step structure with the wavelength conversion member 104d, the area where the wavelength conversion member 104d and the heat dissipation member 105d are in contact with each other increases. As a result, heat generated in the wavelength conversion member 104d is easily transmitted to the heat dissipation member 105d. FIG. 6C shows an example in which only the heat radiating member 105d has a stepped structure, but only the wavelength conversion member may have a stepped structure.
 図6(A)~図6(C)に示すように波長変換部材と放熱部材とを嵌合させることにより、波長変換部材と放熱部材との接触面がズレにくくなり、波長変換部材と放熱部材とが接続した状態をより安定な構造とすることができる。このため、光学素子や発光装置の組み立てが容易になり、また、光学素子として、振動などに対する信頼性が向上する。 As shown in FIGS. 6A to 6C, by fitting the wavelength conversion member and the heat dissipation member, the contact surface between the wavelength conversion member and the heat dissipation member is less likely to be displaced. And a more stable structure. For this reason, the assembly of the optical element and the light emitting device is facilitated, and the reliability of the optical element as a vibration is improved.
 波長変換部材における波長変換材料の濃度は、波長変換部材の出射面からから取り出される蛍光の光量と、蛍光が波長変換部材を透過する割合(透過率)とを考慮して決定することが望ましい。以下、波長変換材料の濃度と出射面から取り出される蛍光の光量との関係、及び、波長変換材料の濃度と蛍光に対する透過率との関係について説明する。 The concentration of the wavelength conversion material in the wavelength conversion member is preferably determined in consideration of the amount of fluorescence extracted from the emission surface of the wavelength conversion member and the ratio (transmittance) of the fluorescence transmitted through the wavelength conversion member. Hereinafter, the relationship between the concentration of the wavelength conversion material and the amount of fluorescence extracted from the emission surface, and the relationship between the concentration of the wavelength conversion material and the transmittance for fluorescence will be described.
 図2(B)に示すとおり、波長変換部材104に入射した励起光110は、波長変換部材104に含まれる波長変換材料に吸収され、蛍光111、112となって波長変換部材104から出射される。蛍光には、励起光110が入射した側である入射面から出射される蛍光112と、入射した側とは逆側の出射面から出射される蛍光111とがある。投影装置で利用されるのは、通常、蛍光111であるため、この蛍光111の量は多い方が好ましい。なお、ここでは、波長変換部材104の表面であって、励起光110が入射した側を入射面と呼び、入射した側とは逆側を出射面と呼ぶこととする。 As shown in FIG. 2B, the excitation light 110 that has entered the wavelength conversion member 104 is absorbed by the wavelength conversion material included in the wavelength conversion member 104, and is emitted from the wavelength conversion member 104 as fluorescence 111 and 112. . The fluorescence includes fluorescence 112 emitted from the incident surface on the side where the excitation light 110 is incident and fluorescence 111 emitted from the emission surface opposite to the incident side. Since the fluorescence 111 is usually used in the projection apparatus, it is preferable that the amount of the fluorescence 111 is large. Here, the surface of the wavelength conversion member 104 on which the excitation light 110 is incident is referred to as an incident surface, and the side opposite to the incident side is referred to as an emission surface.
 図7に、波長変換材料の濃度と蛍光の光量との関係を示すグラフを示す。グラフ中の点線は、励起光110の光量を一定とした場合の蛍光の全光量を示す。一方、実線は、蛍光の全光量のうち、波長変換部材104の出射面から出射される蛍光111の光量を示す。 FIG. 7 is a graph showing the relationship between the concentration of the wavelength conversion material and the amount of fluorescence. The dotted line in the graph indicates the total amount of fluorescence when the amount of excitation light 110 is constant. On the other hand, the solid line indicates the amount of fluorescence 111 emitted from the emission surface of the wavelength conversion member 104 out of the total amount of fluorescence.
 図7に示すとおり、波長変換材料の濃度が濃くなるほど蛍光の全光量は大きくなる。一方、波長変換部材104の出射される蛍光111の光量は、ある濃度Doで最大となる。これは、図8に示すとおり、波長変換材料の濃度を濃くすると、蛍光が波長変換部材104を透過する割合が小さくなるためである。 As shown in FIG. 7, the total amount of fluorescent light increases as the concentration of the wavelength conversion material increases. On the other hand, the light quantity of the fluorescence 111 emitted from the wavelength conversion member 104 becomes maximum at a certain concentration Do. This is because, as shown in FIG. 8, when the concentration of the wavelength conversion material is increased, the ratio of the fluorescence transmitted through the wavelength conversion member 104 is reduced.
 そのため、波長変換部材104の出射面から出射される蛍光111の光量を最大化するためには、波長変換材料の濃度を濃度Doに設定することが望ましい。 Therefore, in order to maximize the amount of fluorescence 111 emitted from the emission surface of the wavelength conversion member 104, it is desirable to set the concentration of the wavelength conversion material to the concentration Do.
 本実施形態の光学素子の場合、放熱部材105と接する波長変換部材104の第1の領域の濃度を濃度Doに設定することで、波長変換部材104の出射する蛍光111の量を最大化できる。 In the case of the optical element of the present embodiment, the amount of the fluorescence 111 emitted from the wavelength conversion member 104 can be maximized by setting the concentration of the first region of the wavelength conversion member 104 in contact with the heat dissipation member 105 to the concentration Do.
 一方、放熱部材105と接していない波長変換部材104の第2の領域113の濃度は、温度上昇を防ぐために濃度Doよりも低く設定されている。 On the other hand, the concentration of the second region 113 of the wavelength conversion member 104 that is not in contact with the heat dissipation member 105 is set lower than the concentration Do in order to prevent the temperature from rising.
 次に、波長変換部材の製造方法について説明する。例えばバインダとしてガラスが用いられる場合、ガラスの粉末と波長変換材料の粉末を混合し、この混合粉末を焼結させることで波長変換部材を作製できる。また、バインダとして樹脂が用いられる場合、加熱して軟化させた樹脂に波長変換材料の粉末を混合することで波長変換部材を作製できる。 Next, a method for manufacturing the wavelength conversion member will be described. For example, when glass is used as the binder, the wavelength conversion member can be produced by mixing glass powder and wavelength conversion material powder and sintering the mixed powder. When a resin is used as the binder, the wavelength conversion member can be produced by mixing the powder of the wavelength conversion material with the resin softened by heating.
 波長変換部材における波長変換材料の濃度分布は、波長変換部材とバインダとを混合する割合を調整することで設けられる。また、波長変換部材は、波長変換材料の濃度が一定の層を積層又は配置させることで作製することもできる。 The concentration distribution of the wavelength conversion material in the wavelength conversion member is provided by adjusting the ratio of mixing the wavelength conversion member and the binder. The wavelength conversion member can also be produced by laminating or arranging layers having a constant concentration of the wavelength conversion material.
 (第2の実施形態)
 本発明の第2の実施形態の光学素子について説明する。図9は、本発明の第2の実施形態の光学素子208を示す斜視図である。光学素子208は、波長変換部材204とこれに接する2つの放熱部材205を有する。光学素子208は、放熱部材205を2つ有する点で第1の実施形態の光学素子108と異なる。
(Second Embodiment)
An optical element according to the second embodiment of the present invention will be described. FIG. 9 is a perspective view showing an optical element 208 according to the second embodiment of the present invention. The optical element 208 has a wavelength conversion member 204 and two heat radiating members 205 in contact therewith. The optical element 208 differs from the optical element 108 of the first embodiment in that it has two heat radiating members 205.
 光学素子208の詳細について、図10(A)、(B)を用いて説明する。図10(A)は光学素子208の平面図である。図10(B)は光学素子208の断面図である。 Details of the optical element 208 will be described with reference to FIGS. FIG. 10A is a plan view of the optical element 208. FIG. 10B is a cross-sectional view of the optical element 208.
 図10(B)に示すように、放熱部材205は、波長変換部材204の両端に設けられている。放熱部材205は、その両端に第1の領域214を有し、中央に第2の領域213を有する。 As shown in FIG. 10B, the heat dissipating member 205 is provided at both ends of the wavelength converting member 204. The heat dissipating member 205 has first regions 214 at both ends thereof and a second region 213 at the center.
 光学素子208では、放熱部材205が波長変換部材204の両端に設けられている。さらに、波長変換部材204はその両端に第1の領域214を有し、中央に第2の領域213を有する。このため、波長変換部材204の中央で生じる熱量は小さくなる一方で、波長変換部材204の端で生じる熱量は大きくなる。ただし、波長変換部材204の端で生じる熱は、波長変換部材の両端に接する放熱部材205を介して放散することができる。この結果、波長変換部材204に含まれる波長変換材料の濃度を濃くして蛍光の量を大きくしつつも、波長変換部材の温度が上昇するのを防ぐことができる。 In the optical element 208, the heat radiating member 205 is provided at both ends of the wavelength conversion member 204. Further, the wavelength conversion member 204 has first regions 214 at both ends thereof and a second region 213 at the center. For this reason, while the amount of heat generated at the center of the wavelength conversion member 204 is reduced, the amount of heat generated at the end of the wavelength conversion member 204 is increased. However, the heat generated at the end of the wavelength conversion member 204 can be dissipated through the heat dissipation member 205 in contact with both ends of the wavelength conversion member. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the concentration of the wavelength conversion material contained in the wavelength conversion member 204 to increase the amount of fluorescence.
 波長変換部材204のx方向における波長変換材料の濃度分布を図11(A)に示し、波長変換部材204のy方向における波長変換材料の濃度分布を図11(B)に示す。図11(A)に示すように、波長変換部材204内における波長変換材料の濃度はx方向に連続的に変化しており、放熱部材205に近いほど濃度が濃く、放熱部材205から離れるほど濃度が薄くなっている。一方、図11(B)に示すように、波長変換部材204内におけるy方向における波長変換材料の濃度は一定である。これは、波長変換部材204のy方向には放熱部材205が接していないためである。 The concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 204 is shown in FIG. 11A, and the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 204 is shown in FIG. As shown in FIG. 11A, the concentration of the wavelength conversion material in the wavelength conversion member 204 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 205, and the concentration is closer to the heat dissipation member 205. Is thinner. On the other hand, as shown in FIG. 11B, the concentration of the wavelength conversion material in the y direction in the wavelength conversion member 204 is constant. This is because the heat dissipation member 205 is not in contact with the y direction of the wavelength conversion member 204.
 (第3の実施形態)
 本発明の第3の実施形態の光学素子について説明する。図12は、本発明の第3の実施形態の光学素子308を示す斜視図である。光学素子308は、波長変換部材304とこれに接する4つの放熱部材305とを有する。光学素子308は、放熱部材305を4つ有する点で第1及び第2の実施形態の光学素子とは異なる。
(Third embodiment)
An optical element according to the third embodiment of the present invention will be described. FIG. 12 is a perspective view showing an optical element 308 according to the third embodiment of the present invention. The optical element 308 includes a wavelength conversion member 304 and four heat radiating members 305 in contact therewith. The optical element 308 is different from the optical elements of the first and second embodiments in that it has four heat dissipating members 305.
 光学素子308の詳細について、図13(A)~(C)を用いて説明する。図13(A)は光学素子308を示す平面図である。図13(B)、(C)は光学素子308を示す断面図である。 Details of the optical element 308 will be described with reference to FIGS. FIG. 13A is a plan view showing the optical element 308. FIGS. 13B and 13C are cross-sectional views showing the optical element 308.
 光学素子308では、放熱部材305が波長変換部材の4つの端に設けられている。さらに、図13(B)、(C)に示すように波長変換部材304は、その4つの端に第1の領域314を有し、中央に第2の領域313を有する。このため、波長変換部材304の中央で生じる熱量は小さくなる一方で、波長変換部材304の端で生じる熱量は大きくなる。ただし、波長変換部材304の端で生じる熱は、波長変換部材の4つの端に接する放熱部材305を介して放散することができる。この結果、波長変換材料の濃度を濃くしつつも、波長変換部材の温度が上昇するのを防ぐことができる。 In the optical element 308, the heat dissipation member 305 is provided at the four ends of the wavelength conversion member. Further, as shown in FIGS. 13B and 13C, the wavelength conversion member 304 has a first region 314 at its four ends and a second region 313 at the center. For this reason, the amount of heat generated at the center of the wavelength conversion member 304 is reduced, while the amount of heat generated at the end of the wavelength conversion member 304 is increased. However, the heat generated at the ends of the wavelength conversion member 304 can be dissipated through the heat dissipating member 305 in contact with the four ends of the wavelength conversion member. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the concentration of the wavelength conversion material.
 波長変換部材304のx方向における波長変換材料の濃度分布を図14(A)に示し、波長変換部材304のy方向における波長変換材料の濃度分布を図14(B)に示す。図14(A)に示すように、波長変換部材304内における波長変換材料の濃度はx方向に連続的に変化しており、放熱部材305に近いほど濃度が濃く、放熱部材305から離れるほど濃度が薄くなっている。同様に、図14(B)に示すように、波長変換部材304内における波長変換材料の濃度はy方向に連続的に変化しており、放熱部材305に近いほど濃度が濃く、放熱部材305から離れるほど濃度が薄くなっている。 FIG. 14A shows the concentration distribution of the wavelength conversion material in the x direction of the wavelength conversion member 304, and FIG. 14B shows the concentration distribution of the wavelength conversion material in the y direction of the wavelength conversion member 304. As shown in FIG. 14A, the concentration of the wavelength conversion material in the wavelength conversion member 304 continuously changes in the x direction, and the concentration is higher as it is closer to the heat dissipation member 305 and the concentration is further away from the heat dissipation member 305. Is thinner. Similarly, as shown in FIG. 14B, the concentration of the wavelength conversion material in the wavelength conversion member 304 continuously changes in the y direction. The closer to the heat dissipation member 305, the higher the concentration. The farther away, the lower the concentration.
 なお、放熱部材の形状は図12に示すものに限られるものではない。例えば、図15に示す光学素子308aのように、波長変換部材304aの4つの端に、単一の放熱部材305aが接触されるものであっても良い。放熱部材305aをこのような構造とすることにより、光学素子を製造するための部品点数が削減でき、製造が容易となる。 The shape of the heat dissipation member is not limited to that shown in FIG. For example, like the optical element 308a shown in FIG. 15, the single heat radiating member 305a may be contacted with four ends of the wavelength conversion member 304a. When the heat dissipating member 305a has such a structure, the number of parts for manufacturing the optical element can be reduced, and the manufacturing becomes easy.
 また、波長変換部材及び放熱部材の形状は、図12や図15に示すものに限られるものではない。例えば、図16に示す光学素子308bのように、波長変換部材304bは、円板状であっても良い。また、放熱部材305bはこの波長変換部材304bを囲むような形状であっても良い。 Further, the shapes of the wavelength conversion member and the heat dissipation member are not limited to those shown in FIGS. For example, like the optical element 308b shown in FIG. 16, the wavelength conversion member 304b may have a disk shape. Further, the heat radiation member 305b may have a shape surrounding the wavelength conversion member 304b.
 (第4の実施形態)
 本発明の第4の実施形態の光学素子について説明する。図17は、本発明の第4の実施形態の光学素子408を示す断面図である。光学素子408は、波長変換部材404とこれに接する2つの放熱部材405を有する。さらに、波長変換部材404に対向し、波長変換部材404に接して設けられた透明部材422を有する。光学素子408は、透明部材422を有する点で第1から第3の実施形態とは異なる。
(Fourth embodiment)
The optical element of the 4th Embodiment of this invention is demonstrated. FIG. 17 is a sectional view showing an optical element 408 according to the fourth embodiment of the present invention. The optical element 408 has a wavelength conversion member 404 and two heat radiating members 405 in contact therewith. Furthermore, it has a transparent member 422 that faces the wavelength conversion member 404 and is provided in contact with the wavelength conversion member 404. The optical element 408 differs from the first to third embodiments in that it includes a transparent member 422.
 透明部材422は、波長変換部材404の上面と下面のそれぞれに接して配置されている。このように透明部材422を配置させることにより、波長変換部材404の機械的強度を高めることができる。このため、例えば、波長変換部材に入射した励起光を波長変換して蛍光として出射する効率を上げるために波長変換部材を薄くでき、例えば、波長変換部材の厚さを1mm以下にすることも可能となる。 The transparent member 422 is disposed in contact with each of the upper surface and the lower surface of the wavelength conversion member 404. By arranging the transparent member 422 in this way, the mechanical strength of the wavelength conversion member 404 can be increased. For this reason, for example, the wavelength conversion member can be thinned to increase the efficiency of wavelength conversion of the excitation light incident on the wavelength conversion member and output as fluorescence. For example, the thickness of the wavelength conversion member can be 1 mm or less. It becomes.
 なお、波長変換部材の厚さは、波長変換部材の励起光の吸収率、蛍光の発光効率、蛍光に対する透過率などを考慮して決定することが望ましい。 The thickness of the wavelength conversion member is desirably determined in consideration of the absorption rate of excitation light, the emission efficiency of fluorescence, the transmittance for fluorescence, and the like.
 透明部材422の材料としては、励起光又は蛍光に対して透過率が大きいものを用いることが望ましい。透明部材422の材料としては、例えば、ガラスや透明樹脂などが使用できる。 As the material of the transparent member 422, it is desirable to use a material having a high transmittance with respect to excitation light or fluorescence. As a material of the transparent member 422, for example, glass or transparent resin can be used.
 図18は、透明部材422の材料として熱伝導率の大きいものを用いた場合の光学素子408aの断面図を示す。光学素子408aでは、波長変換材料の濃度は、波長変換部材404aの中心から波長変換部材404aの放熱部材405と接する面及び透明部材422と接する面に向かって濃くなっている。透明部材422の材料の例としては、バインダ材料のガラスや樹脂に比べて熱伝導率が大きいサファイアや水晶が挙げられる。 FIG. 18 is a cross-sectional view of the optical element 408a when a material having a high thermal conductivity is used as the material of the transparent member 422. In the optical element 408a, the concentration of the wavelength conversion material increases from the center of the wavelength conversion member 404a toward the surface in contact with the heat dissipation member 405 and the surface in contact with the transparent member 422 of the wavelength conversion member 404a. Examples of the material of the transparent member 422 include sapphire and crystal having a higher thermal conductivity than glass or resin of a binder material.
 光学素子408aでは、放熱部材405のみならず、透明部材422も波長変換部材404aで生じた熱を放散する機能を奏する。このため、より大きい放熱効果を実現することが可能となる。 In the optical element 408a, not only the heat radiating member 405 but also the transparent member 422 has a function of radiating heat generated by the wavelength converting member 404a. For this reason, it becomes possible to realize a larger heat dissipation effect.
 なお、図17、図18には、波長変換部材の上面及び下面のそれぞれに透明部材422が接する光学素子408を示したが、本実施形態の光学素子はこれに限定されるものではない。例えば、光学素子は、波長変換部材の上面及び下面のいずれか一方のみに接する透明部材を有するものであっても良い。 17 and 18 show the optical element 408 in which the transparent member 422 is in contact with the upper surface and the lower surface of the wavelength conversion member, but the optical element of the present embodiment is not limited to this. For example, the optical element may include a transparent member that is in contact with only one of the upper surface and the lower surface of the wavelength conversion member.
 (第5の実施形態)
 本発明の第5の実施形態の光学素子について説明する。図19は、本発明の第5の実施形態の光学素子508を示す断面図である。光学素子508は、波長変換部材504とこれに接する2つの放熱部材505を有する。放熱部材505は透明部材からなる。また、波長変換部材504で生じる熱を放散するために、放熱部材505の材料には、波長変換部材504に含まれるバインダ材料よりも熱伝導率が大きい材料が用いられる。このような材料の例としては、サファイアや水晶が挙げられる。
(Fifth embodiment)
An optical element according to the fifth embodiment of the present invention will be described. FIG. 19 is a sectional view showing an optical element 508 according to the fifth embodiment of the present invention. The optical element 508 includes a wavelength conversion member 504 and two heat radiating members 505 in contact therewith. The heat dissipation member 505 is made of a transparent member. Further, in order to dissipate heat generated in the wavelength conversion member 504, a material having a higher thermal conductivity than the binder material included in the wavelength conversion member 504 is used as the material of the heat dissipation member 505. Examples of such materials include sapphire and quartz.
 光学素子508では、透明部材からなる放熱部材505が波長変換部材504の上面と下面に接している。波長変換部材504の上面と下面は、側面よりも面積が広い。このため、光学素子508では、放熱部材を側面に接しさせた場合よりも、放熱部材505と波長変換部材504との接触面積を大きくでき、波長変換部材504で生じた熱をより早く放熱部材505に伝えることができる。 In the optical element 508, the heat radiating member 505 made of a transparent member is in contact with the upper surface and the lower surface of the wavelength conversion member 504. The upper and lower surfaces of the wavelength conversion member 504 have a larger area than the side surfaces. For this reason, in the optical element 508, the contact area between the heat dissipation member 505 and the wavelength conversion member 504 can be increased compared to the case where the heat dissipation member is in contact with the side surface, and the heat generated by the wavelength conversion member 504 can be generated faster. Can tell.
 なお、図19には、波長変換部材504の上面及び下面のそれぞれに放熱部材505が接する光学素子508を示したが、本実施形態の光学素子はこれに限定されるものではない。例えば、光学素子は、波長変換部材の上面及び下面のいずれか一方のみに接する放熱部材を有するものであっても良い。 FIG. 19 shows the optical element 508 in which the heat dissipation member 505 is in contact with the upper surface and the lower surface of the wavelength conversion member 504, but the optical element of the present embodiment is not limited to this. For example, the optical element may have a heat radiating member that contacts only one of the upper surface and the lower surface of the wavelength conversion member.
 (第6の実施形態)
 本発明の第6の実施形態の光学素子について説明する。図20は、本発明の第6の実施形態の光学素子608を示す断面図である。光学素子608は、波長変換部材604とこれに接する2つの放熱部材605を有する。さらに、波長変換部材604に対向して配置された波長選択フィルタ623を有する。光学素子608は、波長選択フィルタ623を有する点で第1から第5の実施形態とは異なる。
(Sixth embodiment)
An optical element according to a sixth embodiment of the present invention will be described. FIG. 20 is a cross-sectional view showing an optical element 608 according to the sixth embodiment of the present invention. The optical element 608 has a wavelength conversion member 604 and two heat radiating members 605 in contact therewith. Furthermore, it has the wavelength selection filter 623 arrange | positioned facing the wavelength conversion member 604. FIG. The optical element 608 differs from the first to fifth embodiments in that it includes a wavelength selection filter 623.
 波長選択フィルタ623は、励起光610を反射又は吸収し、かつ、波長変換部材604で生じた蛍光611を透過させる特性を有している。 The wavelength selection filter 623 has a characteristic of reflecting or absorbing the excitation light 610 and transmitting the fluorescence 611 generated by the wavelength conversion member 604.
 波長変換部材604の波長変換材料の濃度は位置に応じて異なるため、波長変換部材604から出射される光の位置によって光のスペクトルが異なる。また、励起光の波長変換部材604内での光路長は波長変換部材604への入射角度によって異なるため、波長変換部材604を透過した光の出射角度によって光のスペクトルは異なる。このため、波長変換部材604から出射される光には色ムラが生じやすい。しかしながら、波長選択フィルタ623を波長変換部材604に対向して設けることにより、光学素子608から出射される光を蛍光611のみとし、色ムラを低減できる。 Since the concentration of the wavelength conversion material of the wavelength conversion member 604 varies depending on the position, the light spectrum varies depending on the position of the light emitted from the wavelength conversion member 604. In addition, since the optical path length of the excitation light in the wavelength conversion member 604 varies depending on the incident angle to the wavelength conversion member 604, the light spectrum varies depending on the emission angle of the light transmitted through the wavelength conversion member 604. For this reason, color unevenness is likely to occur in the light emitted from the wavelength conversion member 604. However, by providing the wavelength selection filter 623 so as to face the wavelength conversion member 604, the light emitted from the optical element 608 can be only the fluorescence 611, and color unevenness can be reduced.
 また、波長変換部材604は、波長変換材料の濃度が薄い領域を有する。この領域は励起光610の吸収率が低いため、波長変換部材に入射する励起光のうち、波長変換されずにそのまま透過する割合が増加する。励起光610の波長帯域の光を反射する特性を有する波長選択フィルタ623を配置している場合には、波長変換部材604を透過した励起光610は波長選択フィルタ623で反射し、再度、波長変換部材604に入射する。そして、波長変換部材604に再び入射した励起光610は蛍光611に変換されるため、結果として、蛍光611の光量を大きくできる。 Also, the wavelength conversion member 604 has a region where the concentration of the wavelength conversion material is thin. Since the absorption rate of the excitation light 610 is low in this region, the proportion of the excitation light incident on the wavelength conversion member that is transmitted without being wavelength-converted increases. When the wavelength selection filter 623 having the characteristic of reflecting light in the wavelength band of the excitation light 610 is disposed, the excitation light 610 that has passed through the wavelength conversion member 604 is reflected by the wavelength selection filter 623 and is again converted into wavelength. Incident on the member 604. And since the excitation light 610 which entered again into the wavelength conversion member 604 is converted into the fluorescence 611, as a result, the light quantity of the fluorescence 611 can be enlarged.
 波長選択フィルタ623としては、励起光の波長帯域の光を吸収する材料を含んだガラス基板や、誘電体多層膜、ホログラフィック素子、フォトニック結晶等を使用した特定の波長帯域透過させる特性を有するものなどを用いることができる。 The wavelength selection filter 623 has a characteristic of transmitting a specific wavelength band using a glass substrate containing a material that absorbs light in the wavelength band of excitation light, a dielectric multilayer film, a holographic element, a photonic crystal, or the like. Things can be used.
 波長選択フィルタ623は、波長変換部材604と離れていても良いし、波長変換部材
604と接していても良い。
The wavelength selection filter 623 may be separated from the wavelength conversion member 604 or may be in contact with the wavelength conversion member 604.
 (第7の実施形態)
 本発明の第7の実施形態の光学素子について説明する。図21は、本発明の第7の実施形態の光学素子708を示す断面図である。光学素子708は、波長変換部材704とこれに接する2つの放熱部材705を有する。さらに、波長変換部材704に対向して配置された波長選択フィルタ724を有する。光学素子708は、波長選択フィルタ724を有する点で第1から第5の実施形態とは異なる。
(Seventh embodiment)
An optical element according to a seventh embodiment of the present invention will be described. FIG. 21 is a sectional view showing an optical element 708 according to the seventh embodiment of the present invention. The optical element 708 includes a wavelength conversion member 704 and two heat radiating members 705 in contact therewith. Furthermore, it has the wavelength selection filter 724 arrange | positioned facing the wavelength conversion member 704. FIG. The optical element 708 is different from the first to fifth embodiments in that it includes a wavelength selection filter 724.
 波長選択フィルタ724は、励起光710の波長帯域の光を透過させ、かつ、波長変換部材704で生じた蛍光711の波長帯域の光を反射する特性を有している。 The wavelength selection filter 724 has a characteristic of transmitting light in the wavelength band of the excitation light 710 and reflecting light in the wavelength band of the fluorescence 711 generated by the wavelength conversion member 704.
 波長変換部材704内で蛍光711は等方的に発光するため、蛍光711の一部は励起光710が入射する側に出射されてしまう。光学素子708においては、励起光710が入射する側に出射した蛍光711は、波長選択フィルタ724で反射され、波長変換部材704の出射側から出射する。これにより、波長変換部材704の出射面から出射する蛍光711の光量を大きくすることが出来る。 Since the fluorescence 711 emits isotropically in the wavelength conversion member 704, a part of the fluorescence 711 is emitted to the side on which the excitation light 710 is incident. In the optical element 708, the fluorescence 711 emitted to the incident side of the excitation light 710 is reflected by the wavelength selection filter 724 and emitted from the emission side of the wavelength conversion member 704. Thereby, the light quantity of the fluorescence 711 emitted from the emission surface of the wavelength conversion member 704 can be increased.
 波長選択フィルタ724としては、誘電体多層膜やホログラフィック素子、フォトニック結晶等を使用した、特定の波長帯域を透過させ、それ以外の光を反射する特性を有するものなどを用いることができる。 As the wavelength selection filter 724, a dielectric multilayer film, a holographic element, a photonic crystal, or the like that has a characteristic of transmitting a specific wavelength band and reflecting other light can be used.
 (第8の実施形態)
 本発明の第8の実施形態の光学素子について説明する。図22は、本発明の第8の実施形態の光学素子808を示す断面図である。光学素子808は、波長変換部材804とこれに接する2つの放熱部材805を有する。さらに、波長変換部材804に対向して配置された偏光子825を有する。光学素子808は、偏光子825を有する点で第1から第7の実施形態とは異なる。
(Eighth embodiment)
An optical element according to an eighth embodiment of the present invention will be described. FIG. 22 is a sectional view showing an optical element 808 according to the eighth embodiment of the present invention. The optical element 808 has a wavelength conversion member 804 and two heat radiating members 805 in contact therewith. Further, a polarizer 825 disposed to face the wavelength conversion member 804 is provided. The optical element 808 differs from the first to seventh embodiments in that it includes a polarizer 825.
 偏光子825は、蛍光811のうち、偏光子825の透過軸と平行な偏光成分を有する光を透過させ、透過軸と直交する方向と平行な偏光成分を有する光を反射する。このため、透過軸と直交する方向と平行な偏光成分を有する光の一部を、偏光子825で反射した後に、波長変換部材804で反射し、再び、偏光子825に入射させることができる。この結果、偏光子825の透過軸と平行な偏光成分を有する光を効率的に取り出すことが可能となる。 The polarizer 825 transmits light having a polarization component parallel to the transmission axis of the polarizer 825 in the fluorescence 811 and reflects light having a polarization component parallel to the direction orthogonal to the transmission axis. For this reason, part of light having a polarization component parallel to the direction orthogonal to the transmission axis can be reflected by the polarizer 825, reflected by the wavelength conversion member 804, and incident again on the polarizer 825. As a result, light having a polarization component parallel to the transmission axis of the polarizer 825 can be efficiently extracted.
 偏光子825として、ワイヤグリッド偏光子や、有機材料を用いた多層膜等を用いることができる。 As the polarizer 825, a wire grid polarizer, a multilayer film using an organic material, or the like can be used.
 光学素子808は、表示素子として液晶パネルを用いたプロジェクタに用いることができる。液晶パネルは偏光依存性を有している。このため、プロジェクタでは特定の方向の偏光成分の光のみを空間的に変調し、特定の方向と直交する方向の偏光成分の光は変調されず、使用されない。光学素子808から出射する光は特定の方向の偏光成分を有する直線偏光であるため、前述のような、光学系で使用されない光の量を低減でき、プロジェクタからの出射光量を向上できる。 The optical element 808 can be used for a projector using a liquid crystal panel as a display element. The liquid crystal panel has polarization dependency. Therefore, the projector spatially modulates only the light of the polarization component in a specific direction, and the light of the polarization component in the direction orthogonal to the specific direction is not modulated and used. Since the light emitted from the optical element 808 is linearly polarized light having a polarization component in a specific direction, the amount of light not used in the optical system as described above can be reduced, and the amount of light emitted from the projector can be improved.
 (第9の実施形態)
 本発明の第9の実施形態の光学素子について説明する。図23は、本発明の第9の実施形態の光学素子908を示す断面図である。光学素子908は、波長変換部材904とこれに接する2つの放熱部材905を有する。さらに、波長変換部材904に対向して配置された光学部926を有する。光学素子908は、光学部926を有する点で第1から第8の実施形態とは異なる。
(Ninth embodiment)
An optical element according to the ninth embodiment of the present invention will be described. FIG. 23 is a sectional view showing an optical element 908 according to the ninth embodiment of the present invention. The optical element 908 includes a wavelength conversion member 904 and two heat radiating members 905 in contact therewith. Further, the optical unit 926 is disposed to face the wavelength conversion member 904. The optical element 908 is different from the first to eighth embodiments in that it includes an optical unit 926.
 光学部926としては、柱状の透明材料からなるロッドインテグレータや、筒状であって、筒の内側が鏡面反射特性を有するライトパイプ、複数のレンズが面内に配置されたレンズアレイなどを用いることができる。 As the optical unit 926, a rod integrator made of a columnar transparent material, a light pipe having a cylindrical shape and having a specular reflection inside the cylinder, a lens array in which a plurality of lenses are arranged in a plane, and the like are used. Can do.
 光学部926により、蛍光911の強度分布を均一化することができる。このため、例えば、光学素子908をプロジェクタに用いるとプロジェクタから出射する光の強度分布が均一化される。この結果、プロジェクタからスクリーンなどに光を投射した場合、スクリーン上での照度ムラを均一化できる。 The intensity distribution of the fluorescence 911 can be made uniform by the optical unit 926. For this reason, for example, when the optical element 908 is used in a projector, the intensity distribution of light emitted from the projector is made uniform. As a result, when light is projected from a projector onto a screen or the like, illuminance unevenness on the screen can be made uniform.
 (第10の実施形態)
 本発明の第10の実施形態の発光装置について説明する。図24(A)は、本発明の第10の実施形態の発光装置1001を示す斜視図である。発光装置1001は、光学素子1008と光源1002とを有する。光源1002は、その発光面が光学素子1008の波長変換部材1004に対向し、光源からの光が波長変換部材1004に入射するように配置されている。光学素子1008は、第3の実施形態にて説明したものと同じである。
(Tenth embodiment)
A light emitting device according to a tenth embodiment of the present invention will be described. FIG. 24A is a perspective view showing a light emitting device 1001 according to the tenth embodiment of the present invention. The light emitting device 1001 includes an optical element 1008 and a light source 1002. The light source 1002 is disposed so that the light emitting surface thereof faces the wavelength conversion member 1004 of the optical element 1008 and light from the light source enters the wavelength conversion member 1004. The optical element 1008 is the same as that described in the third embodiment.
 発光装置1001の詳細について、図24(B)と図25を用いて説明する。図24(B)は発光装置1001を示す平面図である。図25は、発光装置1001を示す断面図である。 Details of the light-emitting device 1001 will be described with reference to FIGS. FIG. 24B is a plan view illustrating the light-emitting device 1001. FIG. 25 is a cross-sectional view illustrating the light emitting device 1001.
 発光装置1001では、波長変換部材1004の温度が上昇するのを防止しつつ、光源1002からの光を励起光1010として波長変換部材1004に入射させて、蛍光1011を取り出すことが可能となる。 In the light emitting device 1001, it is possible to take out the fluorescence 1011 by making the light from the light source 1002 incident on the wavelength conversion member 1004 as the excitation light 1010 while preventing the temperature of the wavelength conversion member 1004 from rising.
 光源として、例えば、LEDや半導体レーザを用いることができるが、特にこれらに限定されるものではない。また、光源の形状は限定されるものではない。例えば、光源は面発光型の固体光源、又は、光源と導光板からなる面発光デバイスであっても良い。 As the light source, for example, an LED or a semiconductor laser can be used, but it is not particularly limited thereto. Further, the shape of the light source is not limited. For example, the light source may be a surface-emitting solid-state light source or a surface-emitting device including a light source and a light guide plate.
 なお、発光装置1001では、光学素子1008を第3の実施形態にて説明したものとしたが、光学素子1008はこれに限定されるものではない。第1から第9の実施形態に示したいずれの光学素子も発光装置に用いることが可能である。さらに、発光装置は、第6の実施形態で示した波長選択フィルタ623、第7の実施形態で示した波長選択フィルタ724第8の実施形態で示した偏光子825、第9の実施形態で示した光学部926の4つの素子のうち、いずれか2つ以上の素子を有していても良い。さらに、各素子の前方又は後方に、レンズや折り返しミラーなどの光学素子を有していても良い。 In the light emitting device 1001, the optical element 1008 is described in the third embodiment, but the optical element 1008 is not limited to this. Any of the optical elements shown in the first to ninth embodiments can be used in the light emitting device. Further, the light-emitting device includes the wavelength selection filter 623 shown in the sixth embodiment, the wavelength selection filter 724 shown in the seventh embodiment, the polarizer 825 shown in the eighth embodiment, and the ninth embodiment. In addition, any two or more of the four elements of the optical unit 926 may be included. Further, an optical element such as a lens or a folding mirror may be provided in front of or behind each element.
 また、波長選択フィルタ623、偏光子825、光学部926の3つの素子のうち、いずれか2つ以上を有する発光装置において、基本的にはこの3つの素子はどういう順番で配置されていても良い。第6の実施形態で示した波長選択フィルタ623と第7の実施形態で示した波長選択フィルタ724を有する場合には、それぞれの波長選択フィルタは、波長変換部材を挟むように配置されることが望ましい。 Further, in a light emitting device having any two or more of the three elements of the wavelength selection filter 623, the polarizer 825, and the optical unit 926, basically, the three elements may be arranged in any order. . When the wavelength selection filter 623 shown in the sixth embodiment and the wavelength selection filter 724 shown in the seventh embodiment are provided, each wavelength selection filter may be arranged so as to sandwich the wavelength conversion member. desirable.
 (第11の実施形態)
 本発明の発光装置を投影装置に適用する実施形態について説明する。本実施形態の投影装置として、プロジェクタの構成図を図26に示す。プロジェクタ1129は、発光装置1101a、1101b及び1101cと、液晶パネル1127a、1127b及び1127cと、クロスダイクロイックプリズム1128と、投射光学系1130bとを備える。ここで、発光装置1101a、1101b及び1101cは第10の実施形態で説明した発光装置のいずれであっても良い。
(Eleventh embodiment)
An embodiment in which the light emitting device of the present invention is applied to a projection device will be described. FIG. 26 shows a configuration diagram of a projector as the projection apparatus of this embodiment. The projector 1129 includes light emitting devices 1101a, 1101b, and 1101c, liquid crystal panels 1127a, 1127b, and 1127c, a cross dichroic prism 1128, and a projection optical system 1130b. Here, the light emitting devices 1101a, 1101b, and 1101c may be any of the light emitting devices described in the tenth embodiment.
 発光装置1101a、1101b及び1101cのそれぞれは、波長がそれぞれ異なる光を出射するものとする。例えば、発光装置1101aから赤色光が出射され、発光装置1101bから緑色光が出射され、発光装置1101cから青色光が出射される。 Each of the light emitting devices 1101a, 1101b, and 1101c emits light having different wavelengths. For example, red light is emitted from the light emitting device 1101a, green light is emitted from the light emitting device 1101b, and blue light is emitted from the light emitting device 1101c.
 発光装置1101a、1101b及び1101cのそれぞれから出射された光は、液晶パネル1127a、1127b及び1127cのそれぞれに入射される。液晶パネル1127a、1127b及び1127cは、入射された各色光を映像信号に応じて2次元的に変調することで、各色光に画像を担持させ、その画像を担持させた各色光を出射する空間光変調素子である。なお、ここでは空間光変調素子として液晶パネルを用いたが、空間光変調素子はデジタルマイクロミラーデバイスであっても良い。 Light emitted from each of the light emitting devices 1101a, 1101b, and 1101c is incident on each of the liquid crystal panels 1127a, 1127b, and 1127c. The liquid crystal panels 1127a, 1127b, and 1127c two-dimensionally modulate each incident color light according to a video signal so that each color light carries an image, and spatial light that emits each color light carrying the image. It is a modulation element. Although a liquid crystal panel is used as the spatial light modulation element here, the spatial light modulation element may be a digital micromirror device.
 クロスダイクロイックプリズ1128は、液晶パネル1127a、1127b及び1127cのそれぞれから出射された各変調光を合成して出射する。 The cross dichroic prism 1128 synthesizes and outputs the modulated lights emitted from the liquid crystal panels 1127a, 1127b, and 1127c.
 投射光学系1130bは、クロスダイクロイックプリズム1128から出射された合成光をスクリーン1130aに投射して、映像信号に応じた画像をスクリーン1130a上に表示する。 The projection optical system 1130b projects the combined light emitted from the cross dichroic prism 1128 onto the screen 1130a, and displays an image corresponding to the video signal on the screen 1130a.
 本発明は上記実施形態に限定されることなく、特許請求の範囲に記載した発明の範囲内で、種々の変形が可能であり、それらも本発明の範囲内に含まれるものであることはいうまでもない。 The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the invention described in the claims, and it is also included within the scope of the present invention. Not too long.
 上記の実施形態の一部又は全部は、以下の付記のようにも記載されうるが、以下には限られない。 Some or all of the above embodiments can be described as in the following supplementary notes, but are not limited thereto.
 (付記1)波長変換部材と、前記波長変換部材に接する少なくとも一つの放熱部材とを有し、前記波長変換部材は、前記波長変換部材に含まれる波長変換材料の濃度が異なる第1の領域と第2の領域とを有し、前記第1の領域の濃度が前記第2の領域よりも濃く、前記波長変換部材の、前記放熱部材と接する面が、前記第1の領域からなる光学素子。 (Additional remark 1) It has a wavelength conversion member and at least 1 heat dissipation member which touches the said wavelength conversion member, and the said wavelength conversion member is a 1st area | region from which the density | concentration of the wavelength conversion material contained in the said wavelength conversion member differs. An optical element having a second region, wherein the concentration of the first region is higher than that of the second region, and a surface of the wavelength conversion member in contact with the heat dissipation member is formed of the first region.
 (付記2)前記放熱部材は、前記波長変換部材の一端に接して配置され、前記波長変換部材の他端は露出している付記1に記載の光学素子。 (Supplementary note 2) The optical element according to supplementary note 1, wherein the heat dissipation member is disposed in contact with one end of the wavelength conversion member, and the other end of the wavelength conversion member is exposed.
 (付記3)前記放熱部材を2つ有し、前記放熱部材は前記波長変換部材の両端に設けられている付記1に記載の光学素子。 (Supplementary note 3) The optical element according to supplementary note 1, wherein the heat radiation member has two heat radiation members, and the heat radiation member is provided at both ends of the wavelength conversion member.
 (付記4)前記放熱部材を4つ有し、前記放熱部材は前記波長変換部材の4つの端に設けられている付記1に記載の光学素子。 (Supplementary note 4) The optical element according to supplementary note 1, wherein the heat dissipation member has four, and the heat dissipation member is provided at four ends of the wavelength conversion member.
 (付記5)前記波長変換部材は、前記第1の領域よりも前記波長変換材料の濃度が薄く、前記第2の領域よりも前記波長変換材料の濃度が濃い前記第3の領域を有し、 前記第3の領域は、前記第1の領域と前記第2の領域との間に配置されている付記1から4のいずれかに記載の光学素子。 (Supplementary Note 5) The wavelength conversion member has the third region where the concentration of the wavelength conversion material is lower than that of the first region, and the concentration of the wavelength conversion material is higher than that of the second region. The optical element according to any one of appendices 1 to 4, wherein the third region is disposed between the first region and the second region.
 (付記6)前記第1の領域の前記波長変換材料の濃度および前記第2の領域の前記波長変換材料の濃度は、5wt%以上、50wt%以下である付記1から5のいずれかに記載の光学素子。 (Additional remark 6) The density | concentration of the said wavelength conversion material of the said 1st area | region and the density | concentration of the said wavelength conversion material of the said 2nd area | region are 5 wt% or more and 50 wt% or less in any one of Additional remarks 1-5 Optical element.
 (付記7)前記第1の領域の前記波長変換材料の濃度は30wt%以上、50wt%以下であり、前記第2の領域の前記波長変換材料の濃度は5wt%以上、30wt%未満である付記6に記載の光学素子。 (Supplementary note 7) The concentration of the wavelength conversion material in the first region is 30 wt% or more and 50 wt% or less, and the concentration of the wavelength conversion material in the second region is 5 wt% or more and less than 30 wt%. 7. The optical element according to 6.
 (付記8)前記波長変換部材は、前記波長変換材料が分散した状態を保持するバインダを有する付記1から7のいずれかに記載の光学素子。 (Appendix 8) The optical element according to any one of appendices 1 to 7, wherein the wavelength conversion member includes a binder that maintains a state in which the wavelength conversion material is dispersed.
 (付記9)前記放熱部材の熱伝導率は、前記バインダの熱伝導率よりも大きい付記8のいずれかに記載の光学素子。 (Supplementary note 9) The optical element according to any one of supplementary note 8, wherein the thermal conductivity of the heat radiating member is larger than the thermal conductivity of the binder.
 (付記10)前記波長変換材料は、蛍光体である付記1から9のいずれかに記載の光学素子。 (Appendix 10) The optical element according to any one of appendices 1 to 9, wherein the wavelength conversion material is a phosphor.
 (付記11)前記放熱部材は、前記波長変換部材との密着性が高い領域と、熱伝導率が高い領域とを含み、前記密着性が高い領域が前記波長変換部材と接する、付記1から10のいずれかに記載の光学素子。 (Additional remark 11) The said heat radiating member contains the area | region with high adhesiveness with the said wavelength conversion member, and the area | region with high heat conductivity, and the high adhesiveness area | region contacts the said wavelength conversion member. An optical element according to any one of the above.
 (付記12)前記密着性が高い領域には樹脂材料が含有され、前記熱伝導率が高い領域には金属材料が含有されている、付記11に記載の光学素子。 (Supplementary note 12) The optical element according to supplementary note 11, wherein a resin material is contained in the region having high adhesion, and a metal material is contained in the region having high thermal conductivity.
 (付記13)前記放熱部材は、ヒートシンク及びヒートパイプのいずれかである付記1から12のいずれかに記載の光学素子。 (Appendix 13) The optical element according to any one of appendices 1 to 12, wherein the heat dissipating member is either a heat sink or a heat pipe.
 (付記14)前記放熱部材は、前記波長変換部材と接する面に、光を反射する反射面を有する付記1から13のいずれかに記載の光学素子。 (Appendix 14) The optical element according to any one of appendices 1 to 13, wherein the heat radiating member has a reflective surface that reflects light on a surface in contact with the wavelength conversion member.
 (付記15)前記放熱部材は、透明材料からなる付記1から14のいずれかに記載の光学素子。 (Supplementary note 15) The optical element according to any one of supplementary notes 1 to 14, wherein the heat dissipation member is made of a transparent material.
 (付記16)前記波長変換部材と前記放熱部材とが接する部位の少なくともいずれか一方には、凹構造が設けられている付記1から15のいずれかに記載の光学素子。 (Appendix 16) The optical element according to any one of appendices 1 to 15, wherein a concave structure is provided in at least one of the portions where the wavelength conversion member and the heat dissipation member are in contact with each other.
 (付記17)前記波長変換部材と前記放熱部材とが接する部位の少なくともいずれか一方には、段構造が設けられている付記1から15のいずれかに記載の光学素子。 (Supplementary note 17) The optical element according to any one of supplementary notes 1 to 15, wherein a step structure is provided in at least one of the portions where the wavelength conversion member and the heat dissipation member are in contact with each other.
 (付記18)波長変換材料は、第1の波長帯域の光が入射すると、第2の波長帯域の光を出射する機能を有し、さらに、第1の波長帯域の光を反射し、第2の波長帯域の光を透過させる第1の波長選択フィルタを有し、前記第1の波長選択フィルタは、前記波長変換部材に対向して配置される付記1から17のいずれかに記載の光学素子。 (Appendix 18) The wavelength conversion material has a function of emitting light in the second wavelength band when light in the first wavelength band is incident, and further reflects the light in the first wavelength band. An optical element according to any one of appendices 1 to 17, further comprising a first wavelength selection filter that transmits light in the wavelength band of the first wavelength selection filter, wherein the first wavelength selection filter is disposed to face the wavelength conversion member. .
 (付記19)さらに、前記第2の波長帯域の光を反射し、第1の波長帯域の光を透過させる第2の波長選択フィルタを有し、前記第2の波長選択フィルタは、前記波長変換部材に対向し、前記第1の波長選択フィルタと前記第2の波長選択フィルタとの間に前記波長変換部材が位置するように配置される付記18に記載の光学素子。 (Additional remark 19) Furthermore, it has the 2nd wavelength selection filter which reflects the light of the said 2nd wavelength band, and permeate | transmits the light of the 1st wavelength band, The said 2nd wavelength selection filter is the said wavelength conversion The optical element according to appendix 18, wherein the optical element is disposed so as to face the member and to position the wavelength conversion member between the first wavelength selection filter and the second wavelength selection filter.
 (付記20)波長変換材料は、第1の波長帯域の光が入射すると、第2の波長帯域の光を出射する機能を有し、さらに、第2の波長帯域の光を反射し、前記第1の波長帯域の光を透過させる第2の波長選択フィルタを有し、前記第2の波長選択フィルタは、前記波長変換部材に対向して配置される付記1から17のいずれかに記載の光学素子。 (Supplementary note 20) The wavelength conversion material has a function of emitting light in the second wavelength band when light in the first wavelength band is incident, and further reflects light in the second wavelength band. The optical device according to any one of appendices 1 to 17, further comprising: a second wavelength selection filter that transmits light in one wavelength band, wherein the second wavelength selection filter is disposed to face the wavelength conversion member. element.
 (付記21)さらに、特定方向の偏光成分の光を透過させ、前記特定方向とは異なる方向の偏光成分を反射する偏光子を有し、前記偏光子は、前記波長変換部材に対向して配置される付記1から20のいずれかに記載の光学素子。 (Additional remark 21) Furthermore, it has the polarizer which permeate | transmits the light of the polarization component of a specific direction, and reflects the polarization component of the direction different from the said specific direction, The said polarizer is arrange | positioned facing the said wavelength conversion member 21. The optical element according to any one of appendices 1 to 20.
 (付記22)入射した光の強度分布を均一化する光学部を有し、前記光学部は、前記波長変換部材に対向して配置される付記1から21のいずれかに記載の光学素子。 (Supplementary note 22) The optical element according to any one of supplementary notes 1 to 21, further comprising an optical unit that uniformizes an intensity distribution of incident light, wherein the optical unit is disposed to face the wavelength conversion member.
 (付記23)付記1から22のいずれかに記載の光学素子と、前記波長変換部材に入射する光を発する光源とを有する発光装置。 (Supplementary note 23) A light-emitting device comprising the optical element according to any one of supplementary notes 1 to 22 and a light source that emits light incident on the wavelength conversion member.
 (付記24)前記光源は、前記波長変換部材に対向して配置される付記23に記載の発光装置。 (Appendix 24) The light emitting device according to appendix 23, wherein the light source is disposed to face the wavelength conversion member.
 (付記25)付記23又は24に記載の発光装置と、前記発光装置から出射された光を投射する投射光学系とを有する投影装置。 (Supplementary note 25) A projection device comprising the light emitting device according to supplementary note 23 or 24 and a projection optical system that projects light emitted from the light emitting device.
 本願発明は上記実施形態に限定されるものではなく、この発明の要旨を逸脱しない範囲の設計の変更等があってもこの発明に含まれる。また、この出願は、2012年5月25日に出願された日本出願特願2012-119979を基礎とする優先権を主張し、その開示の全てをここに取り込む。 The invention of the present application is not limited to the above-described embodiment, and any design change or the like within a range not departing from the gist of the invention is included in the invention. In addition, this application claims priority based on Japanese Patent Application No. 2012-199979 filed on May 25, 2012, the entire disclosure of which is incorporated herein.
 発光装置を用いた投射装置に広く適用することができる。 It can be widely applied to a projection device using a light emitting device.
 1001、1101a、1101b、1101c  発光装置
 1002  光源
 104、104a、104b、104c、104d、104e、204、304、304a、304b、404、404a、504、604、704、804、904、1004  波長変換部材
 105、105a、105b、105c、105d、105e、205、305、305a、305b、405、505、605、705、805、905、1005  放熱部材
 106e  放熱部材
 108、208、308、308a、308b、408、408a、608、708  光学素子
 110、610、710、810、910、1010  励起光
 111、611、711、811、911、1011  蛍光
 112、1012  蛍光
 113、213、313  第2の領域
 114、214、314  第1の領域
 115  第3の領域
 422  透明部材
 623  波長選択フィルタ
 724  波長選択フィルタ
 825  偏光子
 926  光学部
 1127a、1127b、1127c  液晶パネル
 1128  クロスダイクロイックプリズム
 1129  プロジェクタ
 1130a  スクリーン
 1130b  投射光学系
1001, 1101a, 1101b, 1101c Light emitting device 1002 Light source 104, 104a, 104b, 104c, 104d, 104e, 204, 304, 304a, 304b, 404, 404a, 504, 604, 704, 804, 904, 1004 Wavelength conversion member 105 105a, 105b, 105c, 105d, 105e, 205, 305, 305a, 305b, 405, 505, 605, 705, 805, 905, 1005 Heat dissipation member 106e Heat dissipation member 108, 208, 308, 308a, 308b, 408, 408a , 608, 708 Optical element 110, 610, 710, 810, 910, 1010 Excitation light 111, 611, 711, 811, 911, 1011 Fluorescence 112, 1012 Fluorescence 113, 213, 313 Second Region 114, 214, 314 First region 115 Third region 422 Transparent member 623 Wavelength selection filter 724 Wavelength selection filter 825 Polarizer 926 Optical unit 1127a, 1127b, 1127c Liquid crystal panel 1128 Cross dichroic prism 1129 Projector 1130a Screen 1130b Projection optical system

Claims (10)

  1. 波長変換材料の濃度が異なる第1の領域と第2の領域とを有する波長変換部材と、
    前記波長変換部材に接する少なくとも一つの放熱部材と、
    を備え、
    前記第1の領域の濃度は前記第2の領域よりも濃く、
    前記波長変換部材の前記第1の領域に前記放熱部材が接することを特徴とする光学素子。
    A wavelength conversion member having a first region and a second region having different concentrations of the wavelength conversion material;
    At least one heat dissipating member in contact with the wavelength converting member;
    With
    The concentration of the first region is higher than that of the second region,
    The optical element, wherein the heat dissipation member is in contact with the first region of the wavelength conversion member.
  2. 前記波長変換部材の前記第2の領域が配置されている側は露出している、請求項1に記載の光学素子。 The optical element according to claim 1, wherein a side of the wavelength conversion member on which the second region is disposed is exposed.
  3. 前記波長変換部材の端部領域に前記第1の領域が配置され、中央領域に前記第2の領域が配置され、
    前記波長変換部材の端部領域に前記放熱部材が接する、請求項1に記載の光学素子。
    The first region is disposed in an end region of the wavelength conversion member, and the second region is disposed in a central region;
    The optical element according to claim 1, wherein the heat dissipation member is in contact with an end region of the wavelength conversion member.
  4. 前記放熱部材を2つ有し、
    前記波長変換部材は、両端に2つの前記第1の領域が配置され、前記2つの第1の領域の間に前記第2の領域が配置された長尺体であり、
    前記2つの放熱部材は前記波長変換部材の2つの第1の領域にそれぞれ接する、請求項3に記載の光学素子。
    Having two heat dissipating members,
    The wavelength conversion member is a long body in which two first regions are disposed at both ends, and the second region is disposed between the two first regions,
    The optical element according to claim 3, wherein the two heat radiating members are in contact with two first regions of the wavelength conversion member, respectively.
  5. 前記波長変換部材は光が入射する入射面を有し、
    前記入射面の面方向に、前記第1の領域と第2の領域とが並列配置される、
    請求項1から4のいずれかに記載の光学素子。
    The wavelength conversion member has an incident surface on which light is incident,
    The first region and the second region are arranged in parallel in the plane direction of the incident surface,
    The optical element according to claim 1.
  6. 前記第1の領域における前記波長変換材料の濃度は、前記放熱部材と接する側から前記第2の領域側に向かって連続的に薄くなる、請求項1から5のいずれかに記載の光学素子。 6. The optical element according to claim 1, wherein the concentration of the wavelength conversion material in the first region continuously decreases from the side in contact with the heat radiating member toward the second region.
  7. 前記第1の領域の前記波長変換材料の濃度および前記第2の領域の前記波長変換材料の濃度は、5wt%以上、50wt%以下である請求項1から6のいずれかに記載の光学素子。 7. The optical element according to claim 1, wherein a concentration of the wavelength conversion material in the first region and a concentration of the wavelength conversion material in the second region are 5 wt% or more and 50 wt% or less.
  8. 前記波長変換部材および前記放熱部材の一方は凹部を有し、前記波長変換部材と前記放熱部材とは前記凹部により嵌合される、請求項1から7のいずれかに記載の光学素子。 8. The optical element according to claim 1, wherein one of the wavelength conversion member and the heat dissipation member has a recess, and the wavelength conversion member and the heat dissipation member are fitted by the recess.
  9. 請求項1から8のいずれかに記載の光学素子と、
    前記波長変換部材に入射する光を発する光源と、
    を有する発光装置。
    An optical element according to any one of claims 1 to 8,
    A light source that emits light incident on the wavelength conversion member;
    A light emitting device.
  10. 請求項9に記載の発光装置と、
    前記発光装置から出射された光を投射する投射光学系と、
    を有する投影装置。
    A light emitting device according to claim 9;
    A projection optical system for projecting light emitted from the light emitting device;
    A projection apparatus.
PCT/JP2013/002682 2012-05-25 2013-04-22 Optical element, light-emitting device, and projection device WO2013175706A1 (en)

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