WO2013175752A1 - Wavelength conversion member, optical element, light-emitting device, and projection device - Google Patents

Wavelength conversion member, optical element, light-emitting device, and projection device Download PDF

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Publication number
WO2013175752A1
WO2013175752A1 PCT/JP2013/003177 JP2013003177W WO2013175752A1 WO 2013175752 A1 WO2013175752 A1 WO 2013175752A1 JP 2013003177 W JP2013003177 W JP 2013003177W WO 2013175752 A1 WO2013175752 A1 WO 2013175752A1
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WO
WIPO (PCT)
Prior art keywords
wavelength conversion
conversion member
optical element
light
wavelength
Prior art date
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PCT/JP2013/003177
Other languages
French (fr)
Japanese (ja)
Inventor
瑞穂 冨山
鈴木　尚文
Original Assignee
日本電気株式会社
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Publication date
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Publication of WO2013175752A1 publication Critical patent/WO2013175752A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • G03B21/204—LED or laser light sources using secondary light emission, e.g. luminescence or fluorescence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Definitions

  • the present invention relates to a wavelength conversion member, an optical element, a light emitting device, and a projection device.
  • LEDs Light Emitting Diodes
  • LDs Laser Diodes
  • LEDs and LDs are made of semiconductor materials.
  • the LED and the LD can generate blue light.
  • an LED or an LD can generate red light.
  • LEDs and LDs using InGaN-based and AlGaInP-based materials have low green light emission efficiency. For this reason, many light-emitting devices which combined LED and LD, and the wavelength conversion part are proposed.
  • Patent Document 2 a problem is that the effect of improving the light extraction rate is reduced, and an LED chip is mounted, a mounting substrate having wiring for supplying power to the LED chip, and a light extraction surface of the LED chip Light emission having a light extraction increasing portion integrated on the side, a concave opening formed around the LED chip mounting portion, and a wavelength conversion member containing a wavelength conversion material in a translucent material An apparatus is disclosed. Further, Patent Document 2 discloses a light emitting device in which a wavelength conversion member formed in a plano-convex lens shape is disposed in a tapered concave opening of a mounting substrate. This plano-convex lens-shaped wavelength conversion member is shaped so that the length in the member is constant regardless of the direction of light emitted from the LED chip.
  • JP 2008-047539 A (paragraphs [0004], [0026], FIG. 1) JP 2005-166733 A (paragraphs [0007], [0024], [0033], FIG. 1 and FIG. 7)
  • the thicker the wavelength conversion member is the thicker the wavelength conversion member is, because the wavelength conversion material contained in the wavelength conversion member increases and the amount of light to be wavelength-converted increases.
  • a heat radiating plate is connected to the side surface of the wavelength conversion member. Therefore, a temperature rise can be suppressed in a region near the heat sink of the wavelength conversion member.
  • heat generated in a region away from the heat radiating plate such as a central region of the wavelength conversion member is not easily radiated. For this reason, there existed a problem that the temperature rise of the whole wavelength conversion member could not be suppressed.
  • An object of the present invention is to provide an optical element, a light emitting device, and a projection device that solve the above-described problem that the temperature of the wavelength conversion member increases.
  • the wavelength conversion member of the present invention has a central region having a thickness different from that of at least two opposing ends of the wavelength conversion member, and the thickness of the central region is thinner than the thickness of the two ends.
  • the optical element of the present invention includes the wavelength conversion member of the present invention and a heat dissipation member in contact with the wavelength conversion member.
  • the light-emitting device of the present invention includes the wavelength conversion member of the present invention and a light source that emits light incident on the wavelength conversion member.
  • the light-emitting device of the present invention includes the optical element of the present invention and a light source that emits light incident on the wavelength conversion member.
  • the projection apparatus of the present invention has a projection optical system that projects light emitted from the light emitting apparatus of the present invention.
  • the present invention can suppress the temperature of the wavelength conversion member from rising.
  • FIG. 12B is a cross-sectional view taken along line 12B-12B of FIG. 12A.
  • FIG. 12B is a cross-sectional view taken along line 12C-12C of FIG. 12A.
  • FIG. 12B is a perspective view which shows another example of the optical element of the 3rd Embodiment of this invention.
  • FIG. 24B is a cross-sectional view taken along line 24B-24B of FIG. 24A. It is a figure which shows the projection apparatus of the 12th Embodiment of this invention.
  • FIG. 1 is a perspective view showing the wavelength conversion member 104 of the first embodiment.
  • FIG. 2 is a front view showing the wavelength conversion member 104 of the first embodiment.
  • excitation light light incident on the wavelength conversion member
  • fluorescence light that has been wavelength-converted by the wavelength conversion member
  • the wavelength conversion member 104 has a central region that is different in thickness from at least two opposing ends of the wavelength conversion member, and the thickness of the central region is thinner than the thickness of the two ends.
  • the excitation light 110 incident on the wavelength conversion member 104 is converted into wavelengths 111 and 112 as fluorescence.
  • the thickness of the central region of the wavelength conversion member 104 is thinner than the thickness of the two ends. For this reason, there are few wavelength conversion materials contained in a center area
  • the heat generated in the central region where heat is likely to be generated is reduced, thereby suppressing the temperature of the entire wavelength conversion member 104 from rising.
  • the amount of light that is wavelength-converted in the part is increased.
  • the wavelength converting member preferably has a recess as shown in FIG. By providing the depression, the central region of the wavelength conversion member can be made thinner than the two end portions.
  • the thickness of the wavelength conversion member may be continuously changed from the two end portions toward the central region, or may be changed stepwise.
  • the wavelength conversion member 104 may gradually become thinner from the two end portions toward the central region.
  • the wavelength conversion member 104a may be gradually reduced from the two end portions toward the central region.
  • the wavelength conversion member may have a second depression on a surface facing the surface having the first depression.
  • the wavelength conversion member 104 b has dents on both opposing surfaces.
  • the thickness of the wavelength conversion member is not particularly limited.
  • the thickness of the wavelength conversion member can be 50 ⁇ m or more and 2000 ⁇ m or less.
  • the thickness of the central region of the wavelength conversion member can be set to 50 ⁇ m or more and 100 ⁇ m or less.
  • the thickness of the end of the wavelength conversion member can be set to 150 ⁇ m or more and 200 ⁇ m or less.
  • the thickness of the wavelength conversion member is desirably determined in consideration of the amount of fluorescence extracted from the emission surface of the wavelength conversion member and the ratio (transmittance) of the fluorescence passing through the wavelength conversion member.
  • the relationship between the thickness of the wavelength conversion member and the amount of fluorescence extracted from the emission surface, and the relationship between the thickness of the wavelength conversion member and fluorescence transmittance will be described.
  • the excitation light 110 incident on the wavelength conversion member 104 is absorbed by the wavelength conversion material included in the wavelength conversion member 104 and is emitted from the wavelength conversion member 104 as fluorescence 111 and 112.
  • the fluorescence includes fluorescence 112 emitted from the incident surface on the side where the excitation light 110 is incident and fluorescence 111 emitted from the emission surface opposite to the incident side. Since the fluorescence 111 is usually used in the projection apparatus, it is preferable that the amount of the fluorescence 111 is large.
  • the surface of the wavelength conversion member 104 on which the excitation light 110 is incident is referred to as an incident surface
  • the side opposite to the incident side is referred to as an emission surface.
  • FIG. 5 is a graph showing the relationship between the thickness of the wavelength conversion member and the amount of fluorescent light.
  • the dotted line in the graph indicates the total amount of fluorescence when the amount of excitation light 110 is constant.
  • the solid line indicates the amount of fluorescence 111 emitted from the emission surface of the wavelength conversion member, out of the total amount of fluorescence.
  • the thickness of the wavelength conversion member increases as the thickness of the wavelength conversion member increases.
  • the light quantity of the fluorescence 111 emitted from the emission surface of the wavelength conversion member becomes maximum at a certain thickness To. This is because, as shown in FIG. 6, when the thickness of the wavelength conversion member is increased, the proportion of fluorescence transmitted through the wavelength conversion member is reduced.
  • the thickness of the wavelength conversion member it is desirable to set the thickness of the wavelength conversion member to the thickness To.
  • the thickness of the two end portions of the wavelength conversion member 104 it is desirable to set the thickness of the two end portions of the wavelength conversion member 104 to the thickness To.
  • the wavelength conversion member 104 may have a binder that maintains a state in which the wavelength conversion material is dispersed.
  • the binder is preferably made of glass or transparent resin.
  • the wavelength conversion member 104 when the temperature of the wavelength conversion member 104 rises, there is a problem that not only temperature quenching but also structural stability of the wavelength conversion member 104 is lowered. For example, when glass is used for the binder of the wavelength conversion member 104, the wavelength conversion member 104 may be cracked due to melting of the glass or heat-induced mechanical stress. Further, when a resin is used for the binder, a decrease in transmittance due to the modification of the resin, a thermal deformation of the resin, or the like occurs. On the other hand, in the wavelength conversion member 104 of this embodiment, since temperature rise can be suppressed, it is possible to prevent these problems from occurring.
  • the wavelength conversion member 104 has a wavelength conversion material for converting the wavelength.
  • a phosphor is used as the wavelength conversion material used in the present embodiment.
  • the central region having a thickness different from the two end portions of the wavelength conversion member may be provided by cutting or grinding the wavelength conversion member. Alternatively, it may be provided by laminating a wavelength conversion member on a substrate having a curved or stepped surface shape. Or you may provide by laminating
  • the optical element of this embodiment has the wavelength conversion member of 1st Embodiment, and the thermal radiation member which touches a wavelength conversion member.
  • FIG. 7 is a perspective view showing an optical element 208 according to the second embodiment of the present invention.
  • the optical element 208 includes two heat dissipating members 205 and a wavelength converting member 204.
  • the heat radiating member 205 is provided at two ends.
  • the wavelength conversion member 204 Since the two ends of the wavelength conversion member 204 are thicker than the central region, the wavelength conversion member 204 contains a large amount of wavelength conversion material, and the temperature tends to rise. However, in the optical element 208, since the heat radiation member 205 is in contact with the two ends of the wavelength conversion member 204, the heat generated at the two ends can be efficiently dissipated through the heat radiation member 205, and the wavelength conversion member 204 The temperature can be prevented from rising.
  • the heat radiating member used in the present embodiment has a thermal conductivity higher than that of air.
  • the heat conductivity of the heat dissipation member is larger, and in particular, it is desirable that the heat conductivity is larger than the binder included in the wavelength conversion member.
  • the heat dissipation member preferably contains a metal material such as copper or aluminum.
  • the thermal conductivity of metal materials is large. For this reason, the heat generated in the wavelength conversion member can be efficiently released by including a metal material in the heat dissipation member.
  • the heat dissipation member may contain a resin material.
  • the heat radiating member contains the resin material, the adhesion between the heat radiating member and the wavelength conversion member is improved, and heat generated by the wavelength conversion member is easily transmitted to the heat radiating member. Therefore, for example, as shown in FIG. 10, a heat radiating member 205d containing a resin material may be provided in contact with the wavelength conversion member 204d. In this case, since the thermal conductivity of the resin material is generally not high, it is desirable to further provide another heat radiating member 206d having a high thermal conductivity in contact with the heat radiating member 205d.
  • the heat radiating member may be either a heat sink or a heat pipe. Since heat sinks and heat pipes have high thermal conductivity and a large heat dissipation effect, it is possible to dissipate heat generated by the wavelength conversion member.
  • the heat radiating member desirably has a reflective surface that reflects light on a surface in contact with the wavelength conversion member.
  • a reflective surface By making the surface in contact with the wavelength conversion member of the heat radiating member a reflective surface, light emitted from the surface in contact with the heat radiating member of the wavelength conversion member can be returned to the wavelength conversion member, and light loss can be prevented from occurring. It becomes possible.
  • the method for contacting the wavelength conversion member and the heat dissipation member is not particularly limited. That is, you may comprise so that the wavelength conversion member and heat radiating member which the optical element of the 2nd Embodiment of this invention has may be fitted and contacted.
  • FIG. 9A is a side view showing an example of the fitting between the wavelength conversion member and the heat dissipation member of the optical element of the second embodiment of the present invention.
  • a concave structure and a convex structure may be provided on each of the wavelength conversion member 204a and the heat dissipation member 205a, and the concave structure and the convex structure may be fitted.
  • the concave-convex structure and fitting the area where the wavelength conversion member 204a and the heat dissipation member 205a are in contact with each other increases. As a result, heat generated in the wavelength conversion member 204a is easily transmitted to the heat dissipation member 205a.
  • the wavelength conversion member 204a has a convex structure and the heat dissipation member 205a has a concave structure.
  • the wavelength conversion member has a concave structure and the heat dissipation member has a convex structure. It may be.
  • FIG. 9B shows another example in which the wavelength conversion member and the heat dissipation member of the optical element according to the second embodiment of the present invention are fitted.
  • the heat radiating member 205b is thicker than the wavelength converting member 204b. Furthermore, only the heat radiating member 205b has a concave structure.
  • the area where the wavelength conversion member 204b and the heat radiating member 205b are in contact with each other increases. As a result, heat generated in the wavelength conversion member 204b is easily transmitted to the heat dissipation member 205b.
  • FIG. 9B shows an example in which only the heat dissipation member 205b has a concave structure, only the wavelength conversion member may have a concave structure.
  • FIG. 9C shows still another example in which the wavelength conversion member and the heat dissipation member of the optical element according to the second embodiment of the present invention are fitted.
  • the heat radiation member 205c is provided with counterbore, and the end of the heat radiation member 205c has a step structure.
  • the heat dissipation member 205c by providing the heat dissipation member 205c with a step structure and fitting the step structure with the wavelength conversion member 204c, the area where the wavelength conversion member 204c and the heat dissipation member 205c are in contact with each other is increased. As a result, heat generated in the wavelength conversion member 204c is easily transmitted to the heat dissipation member 205c.
  • FIG. 9C shows an example in which only the heat radiating member 205c has a step structure, only the wavelength conversion member may have a step structure.
  • the contact surface between the wavelength conversion member and the heat dissipation member becomes difficult to shift, and the wavelength conversion member and the heat dissipation member are connected.
  • the state can be a more stable structure. For this reason, the assembly of the optical element and the light emitting device is facilitated, and the reliability of the optical element as a vibration is improved.
  • FIG. 11 is a perspective view showing an optical element 308 according to the third embodiment of the present invention.
  • the optical element 308 includes a wavelength conversion member 304 and a heat dissipation member 305 in contact with the wavelength conversion member 304.
  • the optical element 308 is different from the optical element of the second embodiment in that it has four heat dissipating members 305.
  • FIG. 12A is a plan view showing an optical element 308 according to the third embodiment of the present invention.
  • 12B is a cross-sectional view of the optical element 308 in the xz direction along the line 12B-12B in FIG. 12A.
  • 12C is a cross-sectional view of the optical element 308 in the yz direction, taken along the line 12C-12C in FIG. 12A.
  • the heat radiating member 305 is provided at four ends of the wavelength conversion member 304. Further, as shown in FIG. 12B, the thickness of the wavelength conversion member 304 continuously changes in the x direction, and becomes thicker as it is closer to the heat dissipation member 305 and thinner as it is farther from the heat dissipation member 305 and closer to the central region. Yes. Similarly, as shown in FIG. 12C, the thickness of the wavelength conversion member 304 continuously changes in the y direction, and is thicker as it is closer to the heat dissipation member 305 and thinner as it is farther from the heat dissipation member 305 and closer to the central region. ing.
  • the amount of heat generated at the center of the wavelength conversion member 304 is reduced, while the amount of heat generated at the end of the wavelength conversion member 304 is increased.
  • the heat generated at the ends of the wavelength conversion member 304 can be released through the heat dissipation member 305 in contact with the four ends of the wavelength conversion member 304. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the thickness of the wavelength conversion material.
  • the shape of the heat dissipation member is not limited to that shown in FIG.
  • a single heat radiating member 305a may be in contact with the four ends of the wavelength conversion member 304a.
  • the heat dissipating member 305a has such a structure, the number of parts for manufacturing the optical element can be reduced, and the manufacturing becomes easy.
  • the shapes of the wavelength conversion member and the heat dissipation member are not limited to those shown in FIGS.
  • the wavelength conversion member 304b may have a disk shape.
  • the heat radiation member 305b may have a shape surrounding the wavelength conversion member 304b.
  • FIG. 15 is a perspective view showing an optical element 408 according to the fourth embodiment of the present invention.
  • the optical element 408 includes a wavelength conversion member 404 and a heat dissipation member 405.
  • the wavelength converting member 404 has one end and the other end having different thicknesses, and the heat radiating member 405 is provided in contact with the other end that is thicker than one end of the wavelength converting member 404. One end of the wavelength conversion member 404 is exposed.
  • the other end of the wavelength conversion member 404 is thicker than one end. For this reason, compared with the other end of the wavelength conversion member 404, there are few wavelength conversion materials contained in one end. As a result, the amount of light wavelength-converted at one end of the wavelength conversion member 404 is reduced, and the generated heat is reduced. On the other hand, since the other end of the wavelength conversion member 404 is thicker than the one end, there are more wavelength conversion materials contained in the other end than the one end. As a result, the heat generated at the other end of the wavelength conversion member 404 increases, but the amount of light subjected to wavelength conversion increases. However, since the heat radiating member 405 is provided in contact with the other end of the wavelength conversion member 404, the heat generated at the other end is transmitted to the heat radiating member 405 and dissipated.
  • the temperature of the entire optical element 408 is suppressed from increasing, while the heat is dissipated by being in contact with the heat dissipation member 405.
  • the amount of light that is wavelength-converted at the other end that is easy to do is increased.
  • FIG. 16 is a front view showing an optical element 508 according to the fifth embodiment of the present invention.
  • the optical element 508 includes a wavelength conversion member 504 and a heat dissipation member 505 in contact therewith. Further, the optical element 508 includes a transparent member 521 provided so as to face and contact the wavelength conversion member 504. The optical element 508 is different from the second embodiment in that it includes a transparent member 521.
  • the transparent member 521 is disposed in contact with the lower surface of the wavelength conversion member 504. By disposing the transparent member 521 in this manner, the mechanical strength of the wavelength conversion member 504 can be increased. For this reason, for example, the wavelength conversion member can be thinned to increase the efficiency of wavelength conversion of the excitation light incident on the wavelength conversion member and output as fluorescence.
  • the thickness of the wavelength conversion member can be 1 mm or less. It becomes.
  • the thickness of the wavelength conversion member is desirably determined in consideration of the absorption rate of excitation light, the emission efficiency of fluorescence, the transmittance for fluorescence, and the like.
  • the material of the transparent member 521 it is desirable to use a material having a high transmittance with respect to excitation light or fluorescence.
  • a material having a high transmittance with respect to excitation light or fluorescence For example, glass or transparent resin can be used.
  • examples of the material of the transparent member 521 include sapphire and quartz having a higher thermal conductivity than the glass or resin of the binder material.
  • a material having high thermal conductivity is used as the transparent member 521, not only the heat radiating member 505 but also the transparent member 521 has a function of radiating heat generated by the wavelength conversion member 504. For this reason, a larger heat dissipation effect can be realized.
  • the optical element 508 in which the transparent member 521 is in contact with the lower surface of the wavelength conversion member, but the optical element of the present embodiment is not limited to this.
  • the optical element 508 a may include transparent members 521 and 522 that are in contact with both the upper surface and the lower surface of the wavelength conversion member 504.
  • FIG. 18 is a front view showing an optical element 608 according to the sixth embodiment of the present invention.
  • the optical element 608 has a wavelength conversion member 604 and a single heat radiating member 605 in contact therewith.
  • the heat radiating member 605 is made of a transparent member. Examples of the material of the heat radiating member 605 include sapphire and quartz having a higher thermal conductivity than that of glass or resin as a binder material.
  • a heat radiating member 605 made of a transparent member is in contact with the lower surface of the wavelength conversion member 604.
  • the lower surface of the wavelength conversion member 604 has a larger area than the end surface. Therefore, in the optical element 608, the contact area between the heat radiating member 605 and the wavelength conversion member 604 can be increased as compared with the case where the heat radiating member is brought into contact with the end surface, and the heat generated by the wavelength conversion member 604 can be generated faster. Can tell.
  • FIG. 18 shows the optical element 608 in which the heat radiating member 605 is in contact with only the lower surface of the wavelength conversion member 604, but the optical element of the present embodiment is not limited to this.
  • the optical element may have two heat radiating members in contact with the upper surface and the lower surface of the wavelength conversion member.
  • FIG. 19 is a front view showing an optical element 708 according to the seventh embodiment of the present invention.
  • the optical element 708 includes a wavelength conversion member 704 and a wavelength selection filter 723 disposed to face the wavelength conversion member 704.
  • the optical element 708 is different from the first embodiment in that it includes a wavelength selection filter 723.
  • the wavelength selection filter 723 has a characteristic of reflecting or absorbing the excitation light 710 and transmitting the fluorescence 711 generated by the wavelength conversion member 704.
  • the thickness of the wavelength conversion member 704 varies depending on the position, the light spectrum varies depending on the position of the light emitted from the wavelength conversion member 704. Further, since the optical path length of the excitation light in the wavelength conversion member 704 varies depending on the incident angle to the wavelength conversion member 704, the spectrum of light varies depending on the emission angle of the light transmitted through the wavelength conversion member 704. For this reason, color unevenness is likely to occur in the light emitted from the wavelength conversion member 704. However, by providing the wavelength selection filter 723 so as to face the wavelength conversion member 704, the light emitted from the optical element 708 can be only the fluorescence 711, and color unevenness can be reduced.
  • the wavelength conversion member 704 has a thin region. Since the absorption rate of the excitation light 710 is low in this region, the ratio of the excitation light incident on the wavelength conversion member that is transmitted without being subjected to wavelength conversion increases.
  • the wavelength selection filter 723 has a characteristic of reflecting light in the wavelength band of the excitation light 710
  • the excitation light 710 transmitted through the wavelength conversion member 704 is reflected by the wavelength selection filter 723, and again, The light enters the wavelength conversion member 704. And since the excitation light 710 which entered the wavelength conversion member 704 again is converted into fluorescence 711, as a result, the light quantity of the fluorescence 711 can be increased.
  • the wavelength selection filter 723 has a characteristic of transmitting a specific wavelength band using a glass substrate containing a material that absorbs light in the wavelength band of excitation light, a dielectric multilayer film, a holographic element, a photonic crystal, or the like. Things can be used.
  • the optical element 708 may have a heat radiating member in contact with the wavelength conversion member 704.
  • the wavelength selection filter 723 may be separated from the wavelength conversion member 704 or may be in contact with the wavelength conversion member 704.
  • FIG. 20 is a front view showing an optical element 808 according to the eighth embodiment of the present invention.
  • the optical element 808 includes a wavelength conversion member 804 and a wavelength selection filter 824 disposed to face the wavelength conversion member 804.
  • the optical element 808 differs from the first embodiment in that it includes a wavelength selection filter 824.
  • the wavelength selection filter 824 has a characteristic of transmitting light in the wavelength band of the excitation light 810 and reflecting light in the wavelength band of the fluorescence 811 generated by the wavelength conversion member 804.
  • the fluorescence 811 emits isotropically in the wavelength conversion member 804, a part of the fluorescence 811 is emitted to the side on which the excitation light 810 is incident. Therefore, in the optical element 808, the fluorescence 811 emitted to the incident side of the excitation light 810 is reflected by the wavelength selection filter 824 and emitted from the emission side of the wavelength conversion member 804. Thereby, the light quantity of the fluorescence 811 emitted from the emission surface of the wavelength conversion member 804 can be increased.
  • the wavelength selection filter 824 a filter having a characteristic of transmitting a specific wavelength band using a dielectric multilayer film, a holographic element, a photonic crystal, or the like and reflecting other light can be used.
  • the optical element 808 may have a heat radiating member in contact with the wavelength conversion member 804.
  • FIG. 21 is a front view showing an optical element 908 according to the ninth embodiment of the present invention.
  • the optical element 908 includes a wavelength conversion member 904 and a polarizer 925 disposed to face the wavelength conversion member 904.
  • the optical element 908 is different from the first embodiment in that it includes a polarizer 925.
  • the polarizer 925 transmits light having a polarization component parallel to the transmission axis of the polarizer 925 out of the fluorescence 911 and reflects light having a polarization component parallel to the direction orthogonal to the transmission axis. For this reason, part of light having a polarization component parallel to the direction orthogonal to the transmission axis can be reflected by the polarizer 925, reflected by the wavelength conversion member 904, and incident on the polarizer 825 again. As a result, light having a polarization component parallel to the transmission axis of the polarizer 925 can be efficiently extracted.
  • polarizer 925 a wire grid polarizer, a multilayer film using an organic material, or the like can be used.
  • the optical element 908 can be used for a projector using a liquid crystal panel as a display element.
  • the liquid crystal panel has polarization dependency. Therefore, the projector spatially modulates only the light of the polarization component in a specific direction, and the light of the polarization component in the direction orthogonal to the specific direction is not modulated and used. Since the light emitted from the optical element 908 is linearly polarized light having a polarization component in a specific direction, the amount of light not used in the optical system as described above can be reduced, and the amount of light emitted from the projector can be improved.
  • FIG. 22 is a front view showing an optical element 1008 according to the tenth embodiment of the present invention.
  • the optical element 1008 includes a wavelength conversion member 1004 and an optical unit 1026 disposed to face the wavelength conversion member 1004.
  • the optical element 1008 differs from the first embodiment in that it includes an optical unit 1026.
  • a rod integrator made of a columnar transparent material, a light pipe having a cylindrical shape and having a specular reflection characteristic inside the tube, a lens array in which a plurality of lenses are arranged in a plane, or the like is used. Can do.
  • the intensity distribution of the fluorescence 1011 can be made uniform by the optical unit 1026. For this reason, for example, when the optical element 1008 is used in a projector, the intensity distribution of light emitted from the projector can be made uniform. As a result, when light is projected from a projector onto a screen or the like, illuminance unevenness on the screen can be reduced.
  • the optical element 1008 may have a heat radiating member in contact with the wavelength conversion member 1004.
  • FIG. 23 is a perspective view showing a light emitting device 1101 according to an eleventh embodiment of the present invention.
  • the light emitting device 1101 includes a wavelength conversion member 1104 and a light source 1102.
  • the light source 1102 is disposed such that the light emitting surface thereof faces the wavelength conversion member 1104 and light from the light source enters the wavelength conversion member 1104.
  • FIG. 24A is a plan view showing a light emitting device 1101 according to an eleventh embodiment of the present invention.
  • 24B is a cross-sectional view taken along line 24B-24B of FIG. 24A.
  • the light emitting device 1101 it is possible to take out the fluorescence 1111 by making the light from the light source 1102 enter the wavelength conversion member 1104 as the excitation light 1110 while preventing the temperature of the wavelength conversion member 1104 from rising.
  • the light source for example, an LED or a semiconductor laser can be used, but it is not particularly limited thereto. Further, the shape of the light source is not limited.
  • the light source may be a surface-emitting solid-state light source or a surface-emitting device including a light source and a light guide plate.
  • the form of the light emitting device 1101 is not limited to this.
  • the optical element described in any one of the second to tenth embodiments may be used.
  • the light emitting device 1101 includes the wavelength selection filter 723 shown in the seventh embodiment, the wavelength selection filter 824 shown in the eighth embodiment, the polarizer 925 shown in the ninth embodiment, and the tenth embodiment. Any one or more of the four elements of the optical unit 1026 shown in FIG. Further, an optical element such as a lens or a folding mirror may be provided in front of or behind each element.
  • the three elements may be arranged in any order.
  • each wavelength selection filter may be arranged so as to sandwich the wavelength conversion member. desirable.
  • FIG. 25 shows a projector as the projection apparatus of this embodiment.
  • the projector 1229 includes light emitting devices 1201a, 1201b, and 1201c, liquid crystal panels 1227a, 1227b, and 1227c, a cross dichroic prism 1228, and a projection optical system 1231.
  • the light emitting devices 1201a, 1201b, and 1201c may be any of the light emitting devices described in the eleventh embodiment.
  • each of the light emitting devices 1201a, 1201b, and 1201c emits light having different wavelengths. For example, it is assumed that red light is emitted from the light emitting device 1201a, green light is emitted from the light emitting device 1201b, and blue light is emitted from the light emitting device 1201c.
  • the liquid crystal panels 1227a, 1227b, and 1227c modulate each incident color light in a two-dimensional manner according to a video signal so that each color light carries an image, and spatial light that emits each color light carrying the image. It is a modulation element.
  • the spatial light modulation element may be a digital micromirror device.
  • the cross dichroic prism 1228 synthesizes and outputs the modulated lights emitted from the liquid crystal panels 1227a, 1227b, and 1227c.
  • the projection optical system 1231 projects the combined light emitted from the cross dichroic prism 1228 onto the screen 1230, and displays an image corresponding to the video signal on the screen 1230.
  • the said wavelength conversion member has a center area
  • the said wavelength conversion member is a wavelength conversion member of Additional remark 1 which has a 1st hollow.
  • the said wavelength conversion member is a wavelength conversion member of Additional remark 2 which has a 2nd hollow in the surface facing the surface which has a said 1st hollow.
  • the wavelength conversion member in any one of Additional remark 1 to 3 whose thickness of the center area
  • the wavelength conversion member in any one of Additional remark 1 to 4 which has a binder which holds the state which the wavelength conversion material and the said wavelength conversion material were disperse
  • the said heat radiation member is an optical element of Additional remark 7 provided in the said 2 edge part of the said wavelength conversion member.
  • the said heat radiating member consists of transparent materials, The said heat radiating member is an optical element of Additional remark 7 provided in contact with the surface different from the end surface of the said wavelength conversion member.
  • the wavelength conversion member has one end and another end having different thicknesses
  • the heat dissipation member is an optical element provided in contact with the other end, which is thicker than the one end.
  • the optical element according to supplementary note 11 wherein the one end of the wavelength conversion member is exposed.
  • the said heat radiating member is an optical element in any one of Additional remark 7 to 12 containing a metal material.
  • the optical element according to supplementary note 14 further including another heat dissipation member in contact with the heat dissipation member, wherein the another heat dissipation member contains a metal material.
  • the said heat radiating member is an optical element in any one of Additional remark 7 to 16 which has a reflective surface which reflects light in the surface which contact
  • the wavelength conversion member according to any one of supplementary notes 1 to 6,
  • the wavelength conversion member has a function of emitting light in the second wavelength band when light in the first wavelength band is incident; And a first wavelength selection filter that reflects light in the first wavelength band and transmits light in the second wavelength band,
  • the first wavelength selection filter is an optical element disposed to face the wavelength conversion member.
  • the second wavelength selection filter is disposed so that the wavelength conversion member faces the wavelength conversion member, and the wavelength conversion member is positioned between the first wavelength selection filter and the second wavelength selection filter.
  • the wavelength conversion member according to any one of supplementary notes 1 to 6, The wavelength conversion member has a function of emitting light in the second wavelength band when light in the first wavelength band is incident; Furthermore, it has a second wavelength selection filter that reflects light in the second wavelength band and transmits light in the first wavelength band, and the second wavelength selection filter faces the wavelength conversion member.
  • the wavelength conversion member according to supplementary notes 1 to 6, A polarizer that transmits light of a polarization component in a specific direction and reflects a polarization component in a direction different from the specific direction; The polarizer is an optical element arranged to face the wavelength conversion member.
  • the optical unit is an optical element disposed to face the wavelength conversion member.
  • the light-emitting device which has a wavelength conversion member in any one of Additional remark 1 to 6, and a light source which emits the light which injects into the said wavelength conversion member.
  • Additional remark 27 The light source of Additional remark 25 or 26 with which the said light source is arrange
  • Additional remark 28 The projection apparatus which has the light-emitting device in any one of additional marks 25-27, and the projection optical system which projects the light radiate

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Abstract

In the present invention, the temperature of a wavelength conversion member increases. The wavelength conversion member of the present invention comprises a central region having a thickness that differs from the thickness of at least two end sections of the wavelength conversion member that face each other, and the thickness of said central region is less than the thickness of the two end sections.

Description

波長変換部材、光学素子、発光装置、及び投影装置Wavelength conversion member, optical element, light emitting device, and projection device
　本発明は、波長変換部材、光学素子、発光装置、及び投影装置に関する。 The present invention relates to a wavelength conversion member, an optical element, a light emitting device, and a projection device.
　照明やプロジェクタでは、高輝度かつ低消費電力、長寿命の発光装置が求められている。現在、この要求を満たす発光装置として、発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）や半導体レーザ（ＬＤ：Ｌａｓｅｒ　Ｄｉｏｄｅ）を用いたものが提案されている。 For lighting and projectors, there is a demand for light emitting devices with high brightness, low power consumption, and long life. Currently, light emitting devices that use light emitting diodes (LEDs: Light Emitting Diodes) and semiconductor lasers (LDs: Laser Diodes) have been proposed as light emitting devices that satisfy this requirement.
　ＬＥＤやＬＤは半導体材料によって作製される。ＩｎＧａＮ系の半導体材料を用いると、ＬＥＤやＬＤは青色の光を発生させることができる。また、ＡｌＧａＩｎＰ系の半導体材料を用いると、ＬＥＤやＬＤは赤色の光を発生させることができる。しかしながら、ＩｎＧａＮ系とＡｌＧａＩｎＰ系の材料を用いたＬＥＤやＬＤでは、緑色の光の発光効率が低い。このため、ＬＥＤやＬＤと波長変換部とを組み合わせた発光装置が多く提案されている。 LEDs and LDs are made of semiconductor materials. When an InGaN-based semiconductor material is used, the LED and the LD can generate blue light. In addition, when an AlGaInP-based semiconductor material is used, an LED or an LD can generate red light. However, LEDs and LDs using InGaN-based and AlGaInP-based materials have low green light emission efficiency. For this reason, many light-emitting devices which combined LED and LD, and the wavelength conversion part are proposed.
　例えば、特許文献１において、蛍光体がＬＥＤと物理的に接触して置かれる装置では、接着材料の選択が、コストへの影響、並びに例えば熱誘起機械的応力によって引き起こされる信頼性への影響を与える可能性に鑑み、波長変換要素を保持する放熱板を有する照明装置が開示されている。この放熱板は、波長変換要素の少なくとも一つの側面で波長変換要素を保持する。 For example, in U.S. Patent No. 6,047,033, in an apparatus where the phosphor is placed in physical contact with the LED, the choice of adhesive material has an impact on cost as well as on the reliability caused by, for example, thermally induced mechanical stress. In view of the possibility of giving, an illuminating device having a heat sink that holds a wavelength conversion element is disclosed. The heat dissipation plate holds the wavelength conversion element on at least one side surface of the wavelength conversion element.
　また、特許文献２には、光取出し率向上の効果が低減することを課題として、ＬＥＤチップを実装し、ＬＥＤチップに電力を供給するための配線を有する実装基板と、ＬＥＤチップの光取り出し面側に一体化して設けられた光取出し増大部と、ＬＥＤチップ実装部の周囲に形成された凹状開口部と、透光性材料中に波長変換材料を含有させて成る波長変換部材とを有する発光装置が開示されている。さらに、特許文献２には、平凸レンズ状に形成した波長変換部材を実装基板のテーパー形状の凹状開口部内に配置した発光装置が開示されている。この平凸レンズ状の波長変換部材は、ＬＥＤチップからの出射光方向に関わらず、部材内の長さが一定となるような形状とされている。 Further, in Patent Document 2, a problem is that the effect of improving the light extraction rate is reduced, and an LED chip is mounted, a mounting substrate having wiring for supplying power to the LED chip, and a light extraction surface of the LED chip Light emission having a light extraction increasing portion integrated on the side, a concave opening formed around the LED chip mounting portion, and a wavelength conversion member containing a wavelength conversion material in a translucent material An apparatus is disclosed. Further, Patent Document 2 discloses a light emitting device in which a wavelength conversion member formed in a plano-convex lens shape is disposed in a tapered concave opening of a mounting substrate. This plano-convex lens-shaped wavelength conversion member is shaped so that the length in the member is constant regardless of the direction of light emitted from the LED chip.
特開２００８－０４７５３９号公報　（段落［０００４］、［００２６］、図１）JP 2008-047539 A (paragraphs [0004], [0026], FIG. 1) 特開２００５－１６６７３３号公報　（段落［０００７］、［００２４］、［００３３］、図１、図７）JP 2005-166733 A (paragraphs [0007], [0024], [0033], FIG. 1 and FIG. 7)
　一般的に波長変換部材は厚いほど波長変換部材に含まれる波長変換材料は多くなり、波長変換される光の量は多くなるため、波長変換部材は厚い方が望ましい。 Generally, the thicker the wavelength conversion member is, the thicker the wavelength conversion member is, because the wavelength conversion material contained in the wavelength conversion member increases and the amount of light to be wavelength-converted increases.
　しかしながら、波長変換材料にて光が波長変換される際には熱が生じて、波長変換部材の温度が上昇するという問題があった。波長変換部材の温度が上がると、波長変換材料の振動エネルギーが増大し、励起光が波長変換材料により波長変換されない割合が増える結果、蛍光強度が低くなるという現象（温度消光）が起こる可能性がある。このため、波長変換部材の温度はできるだけ上昇しないようにすることが望ましい。 However, when light is wavelength-converted by the wavelength conversion material, there is a problem that heat is generated and the temperature of the wavelength conversion member rises. When the temperature of the wavelength conversion member increases, the vibration energy of the wavelength conversion material increases, and as a result of the increase in the proportion of excitation light that is not wavelength-converted by the wavelength conversion material, there is a possibility that the phenomenon that the fluorescence intensity decreases (temperature quenching) may occur. is there. For this reason, it is desirable to prevent the temperature of the wavelength conversion member from rising as much as possible.
　特許文献１に記載の照明装置では、波長変換部材の側面に放熱板が連結されている。そのため、波長変換部材の放熱板に近い領域では温度上昇を抑制できる。しかしながら、波長変換部材の中央領域などの放熱板から離れた領域で生じた熱は放熱されにくい。このため、波長変換部材全体の温度上昇を抑制することはできないという問題があった。 In the lighting device described in Patent Document 1, a heat radiating plate is connected to the side surface of the wavelength conversion member. Therefore, a temperature rise can be suppressed in a region near the heat sink of the wavelength conversion member. However, heat generated in a region away from the heat radiating plate such as a central region of the wavelength conversion member is not easily radiated. For this reason, there existed a problem that the temperature rise of the whole wavelength conversion member could not be suppressed.
　また、特許文献２に記載の発光装置では、波長変換部材が平凸レンズ状に形成されているため、波長変換部材の中央領域の温度が特に上昇しやすいという問題があった。 Further, in the light emitting device described in Patent Document 2, since the wavelength conversion member is formed in a plano-convex lens shape, there is a problem that the temperature in the central region of the wavelength conversion member is particularly likely to rise.
　本発明の目的は、上述した、波長変換部材の温度が上昇するという課題を解決する光学素子、発光装置、及び投影装置を提供することにある。 An object of the present invention is to provide an optical element, a light emitting device, and a projection device that solve the above-described problem that the temperature of the wavelength conversion member increases.
　本発明の波長変換部材は、波長変換部材の少なくとも対向する２つの端部とは厚さが異なる中央領域を有し、中央領域の厚さが２つの端部の厚さよりも薄い。 The wavelength conversion member of the present invention has a central region having a thickness different from that of at least two opposing ends of the wavelength conversion member, and the thickness of the central region is thinner than the thickness of the two ends.
　また、本発明の光学素子は、本発明の波長変換部材と、波長変換部材と接する放熱部材とを有する。 The optical element of the present invention includes the wavelength conversion member of the present invention and a heat dissipation member in contact with the wavelength conversion member.
　また、本発明の発光装置は、本発明の波長変換部材と、波長変換部材に入射する光を発する光源とを有する。 The light-emitting device of the present invention includes the wavelength conversion member of the present invention and a light source that emits light incident on the wavelength conversion member.
　また、本発明の発光装置は、本発明の光学素子と、波長変換部材に入射する光を発する光源とを有する。 The light-emitting device of the present invention includes the optical element of the present invention and a light source that emits light incident on the wavelength conversion member.
　また、本発明の投影装置は、本発明の発光装置から出射された光を投射する投射光学系を有する。 Further, the projection apparatus of the present invention has a projection optical system that projects light emitted from the light emitting apparatus of the present invention.
　本発明により、波長変換部材の温度が上昇するのを抑制できる。 The present invention can suppress the temperature of the wavelength conversion member from rising.
本発明の第１の実施形態の波長変換部材を示す斜視図である。It is a perspective view which shows the wavelength conversion member of the 1st Embodiment of this invention. 本発明の第１の実施形態の波長変換部材を示す正面図である。It is a front view which shows the wavelength conversion member of the 1st Embodiment of this invention. 本発明の第１の実施形態の波長変換部材の別の例を示す正面図である。It is a front view which shows another example of the wavelength conversion member of the 1st Embodiment of this invention. 本発明の第１の実施形態の波長変換部材のさらに別の例を示す正面図である。It is a front view which shows another example of the wavelength conversion member of the 1st Embodiment of this invention. 波長変換部材の厚さと波長変換部材から出射される蛍光の光量との関係を示すグラフである。It is a graph which shows the relationship between the thickness of a wavelength conversion member, and the light quantity of the fluorescence radiate | emitted from a wavelength conversion member. 波長変換材料の厚さと蛍光の透過率との関係を示すグラフである。It is a graph which shows the relationship between the thickness of wavelength conversion material, and the transmittance | permeability of fluorescence. 本発明の第２の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 2nd Embodiment of this invention. 本発明の第２の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 2nd Embodiment of this invention. 本発明の第２の実施形態の光学素子が有する波長変換部材と放熱部材との嵌合の一例を示す側面図である。It is a side view which shows an example of fitting with the wavelength conversion member and heat dissipation member which the optical element of the 2nd Embodiment of this invention has. 本発明の第２の実施形態の光学素子が有する波長変換部材と放熱部材との嵌合の別の一例を示す側面図である。It is a side view which shows another example of fitting with the wavelength conversion member and heat dissipation member which the optical element of the 2nd Embodiment of this invention has. 本発明の第２の実施形態の光学素子が有する波長変換部材と放熱部材との嵌合のさらに別の一例を示す側面図である。It is a side view which shows another example of fitting with the wavelength conversion member and heat dissipation member which the optical element of the 2nd Embodiment of this invention has. 本発明の第２の実施形態の光学素子の別の例を示す正面図である。It is a front view which shows another example of the optical element of the 2nd Embodiment of this invention. 本発明の第３の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 3rd Embodiment of this invention. 本発明の第３の実施形態の光学素子を示す平面図である。It is a top view which shows the optical element of the 3rd Embodiment of this invention. 図１２Ａの１２Ｂ－１２Ｂ線に沿った断面図である。FIG. 12B is a cross-sectional view taken along line 12B-12B of FIG. 12A. 図１２Ａの１２Ｃ－１２Ｃ線に沿った断面図である。FIG. 12B is a cross-sectional view taken along line 12C-12C of FIG. 12A. 本発明の第３の実施形態の光学素子の別の例を示す斜視図である。It is a perspective view which shows another example of the optical element of the 3rd Embodiment of this invention. 本発明の第３の実施形態の光学素子のさらに別の例を示す斜視図である。It is a perspective view which shows another example of the optical element of the 3rd Embodiment of this invention. 本発明の第４の実施形態の光学素子を示す斜視図である。It is a perspective view which shows the optical element of the 4th Embodiment of this invention. 本発明の第５の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 5th Embodiment of this invention. 本発明の第５の実施形態の光学素子の別の例を示す正面図である。It is a front view which shows another example of the optical element of the 5th Embodiment of this invention. 本発明の第６の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 6th Embodiment of this invention. 本発明の第７の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 7th Embodiment of this invention. 本発明の第８の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 8th Embodiment of this invention. 本発明の第９の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 9th Embodiment of this invention. 本発明の第１０の実施形態の光学素子を示す正面図である。It is a front view which shows the optical element of the 10th Embodiment of this invention. 本発明の第１１の実施形態の発光装置を示す斜視図である。It is a perspective view which shows the light-emitting device of the 11th Embodiment of this invention. 本発明の第１１の実施形態の発光装置を示す平面図である。It is a top view which shows the light-emitting device of the 11th Embodiment of this invention. 図２４Ａの２４Ｂ－２４Ｂ線に沿った断面図である。FIG. 24B is a cross-sectional view taken along line 24B-24B of FIG. 24A. 本発明の第１２の実施形態の投影装置を示す図である。It is a figure which shows the projection apparatus of the 12th Embodiment of this invention.
　次に、本発明の実施形態について図面を参照して説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
　〔第１の実施形態〕
　図１は、第１の実施形態の波長変換部材１０４を示す斜視図である。図２は、第１の実施形態の波長変換部材１０４を示す正面図である。なお、以下の説明では、波長変換部材に入射する光を励起光と呼ぶこととする。また、波長変換部材で波長変換された光を蛍光と呼ぶこととする。 [First Embodiment]
FIG. 1 is a perspective view showing the wavelength conversion member 104 of the first embodiment. FIG. 2 is a front view showing the wavelength conversion member 104 of the first embodiment. In the following description, light incident on the wavelength conversion member is referred to as excitation light. In addition, light that has been wavelength-converted by the wavelength conversion member is referred to as fluorescence.
　波長変換部材１０４は、波長変換部材の少なくとも対向する２つの端部とは厚さが異なる中央領域を有し、中央領域の厚さは２つの端部の厚さよりも薄い。 The wavelength conversion member 104 has a central region that is different in thickness from at least two opposing ends of the wavelength conversion member, and the thickness of the central region is thinner than the thickness of the two ends.
　図２に示すように、波長変換部材１０４に入射する励起光１１０は波長変換されて蛍光１１１、１１２となる。 As shown in FIG. 2, the excitation light 110 incident on the wavelength conversion member 104 is converted into wavelengths 111 and 112 as fluorescence.
　波長変換部材１０４の中央領域の厚さは２つの端部の厚さよりも薄い。このため、２つの端部に比べると、中央領域に含まれる波長変換材料は少ない。この結果、中央領域で波長変換される光の量が少なくなり、生じる熱が小さくなる。一方、波長変換部材１０４の２つの端部は中央領域よりも厚いため、中央領域と比べると２つの端部に含まれる波長変換材料は多い。この結果、２つの端部で生じる熱は大きくなるが、波長変換される光の量が多くなる。 The thickness of the central region of the wavelength conversion member 104 is thinner than the thickness of the two ends. For this reason, there are few wavelength conversion materials contained in a center area | region compared with two edge parts. As a result, the amount of light that is wavelength-converted in the central region is reduced, and the generated heat is reduced. On the other hand, since the two end portions of the wavelength conversion member 104 are thicker than the central region, the wavelength conversion material contained in the two end portions is larger than that in the central region. As a result, the heat generated at the two ends is increased, but the amount of light subjected to wavelength conversion is increased.
　このように、波長変換部材１０４では、熱が篭りやすい中央領域で生じる熱を小さくすることで、波長変換部材１０４全体の温度が上昇するのを抑制する一方で、熱を放熱しやすい２つの端部で波長変換される光の量を多くしている。この結果、波長変換部材１０４全体にて波長変換される光の量を多くしながら、波長変換部材１０４全体の温度が上昇するのを抑制できる。 As described above, in the wavelength conversion member 104, the heat generated in the central region where heat is likely to be generated is reduced, thereby suppressing the temperature of the entire wavelength conversion member 104 from rising. The amount of light that is wavelength-converted in the part is increased. As a result, it is possible to suppress an increase in the temperature of the entire wavelength conversion member 104 while increasing the amount of light that is wavelength-converted by the entire wavelength conversion member 104.
　波長変換部材は、図１に示すように、窪みを有するのが望ましい。窪みを設けることで、波長変換部材の中央領域を２つの端部よりも薄くできる。 The wavelength converting member preferably has a recess as shown in FIG. By providing the depression, the central region of the wavelength conversion member can be made thinner than the two end portions.
　波長変換部材の厚さは、２つの端部から中央領域に向かって連続的に変化していても良いし、段階的に変化していても良い。例えば、図２に示すように、波長変換部材１０４は２つの端部から中央領域に向かって徐々に薄くなっていても良い。また、例えば、図３に示すように、波長変換部材１０４ａは２つの端部から中央領域に向かって段階的に薄くなっていても良い。 The thickness of the wavelength conversion member may be continuously changed from the two end portions toward the central region, or may be changed stepwise. For example, as illustrated in FIG. 2, the wavelength conversion member 104 may gradually become thinner from the two end portions toward the central region. Further, for example, as shown in FIG. 3, the wavelength conversion member 104a may be gradually reduced from the two end portions toward the central region.
　波長変換部材は、第１の窪みを有する面と対向する面に第２の窪みを有していても良い。例えば、図４に示すように、波長変換部材１０４ｂは、対向する両面に窪みを有する。 The wavelength conversion member may have a second depression on a surface facing the surface having the first depression. For example, as shown in FIG. 4, the wavelength conversion member 104 b has dents on both opposing surfaces.
　波長変換部材の厚さは特に限定されるものではない。例えば、波長変換部材の厚さを５０μｍ以上、２０００μｍ以下とすることができる。また、例えば、波長変換部材の中央領域の厚さを５０μｍ以上、１００μｍ以下とすることができる。また、例えば、波長変換部材の端の厚さを１５０μｍ以上、２００μｍ以下とすることができる。 The thickness of the wavelength conversion member is not particularly limited. For example, the thickness of the wavelength conversion member can be 50 μm or more and 2000 μm or less. For example, the thickness of the central region of the wavelength conversion member can be set to 50 μm or more and 100 μm or less. For example, the thickness of the end of the wavelength conversion member can be set to 150 μm or more and 200 μm or less.
　波長変換部材の厚さは、波長変換部材の出射面から取り出される蛍光の光量と、蛍光が波長変換部材を通過する割合（透過率）とを考慮して決定することが望ましい。以下、波長変換部材の厚さと出射面から取り出される蛍光の光量との関係、及び、波長変換部材の厚さと蛍光の透過率との関係について説明する。 The thickness of the wavelength conversion member is desirably determined in consideration of the amount of fluorescence extracted from the emission surface of the wavelength conversion member and the ratio (transmittance) of the fluorescence passing through the wavelength conversion member. Hereinafter, the relationship between the thickness of the wavelength conversion member and the amount of fluorescence extracted from the emission surface, and the relationship between the thickness of the wavelength conversion member and fluorescence transmittance will be described.
　図２に示すとおり、波長変換部材１０４に入射した励起光１１０は、波長変換部材１０４に含まれる波長変換材料に吸収され、蛍光１１１、１１２となって波長変換部材１０４から出射される。蛍光には、励起光１１０が入射した側である入射面から出射される蛍光１１２と、入射した側とは逆側の出射面から出射される蛍光１１１とがある。投影装置で利用されるのは、通常、蛍光１１１であるため、この蛍光１１１の量は多い方が好ましい。なお、ここでは、波長変換部材１０４の表面であって、励起光１１０が入射した側を入射面と呼び、入射した側とは逆側を出射面と呼ぶこととする。 As shown in FIG. 2, the excitation light 110 incident on the wavelength conversion member 104 is absorbed by the wavelength conversion material included in the wavelength conversion member 104 and is emitted from the wavelength conversion member 104 as fluorescence 111 and 112. The fluorescence includes fluorescence 112 emitted from the incident surface on the side where the excitation light 110 is incident and fluorescence 111 emitted from the emission surface opposite to the incident side. Since the fluorescence 111 is usually used in the projection apparatus, it is preferable that the amount of the fluorescence 111 is large. Here, the surface of the wavelength conversion member 104 on which the excitation light 110 is incident is referred to as an incident surface, and the side opposite to the incident side is referred to as an emission surface.
　図５に、波長変換部材の厚さと蛍光の光量との関係を示すグラフを示す。グラフ中の点線は、励起光１１０の光量を一定とした場合の蛍光の全光量を示す。一方、実線は、蛍光の全光量のうち、波長変換部材の出射面から出射される蛍光１１１の光量を示す。 FIG. 5 is a graph showing the relationship between the thickness of the wavelength conversion member and the amount of fluorescent light. The dotted line in the graph indicates the total amount of fluorescence when the amount of excitation light 110 is constant. On the other hand, the solid line indicates the amount of fluorescence 111 emitted from the emission surface of the wavelength conversion member, out of the total amount of fluorescence.
　図５に示すとおり、波長変換部材の厚さが厚くなるほど蛍光の全光量は大きくなる。一方、波長変換部材の出射面から出射される蛍光１１１の光量は、ある厚さＴｏで最大となる。これは、図６に示すとおり、波長変換部材の厚さを厚くすると、蛍光が波長変換部材を透過する割合が小さくなるためである。 As shown in FIG. 5, as the thickness of the wavelength conversion member increases, the total amount of fluorescence increases. On the other hand, the light quantity of the fluorescence 111 emitted from the emission surface of the wavelength conversion member becomes maximum at a certain thickness To. This is because, as shown in FIG. 6, when the thickness of the wavelength conversion member is increased, the proportion of fluorescence transmitted through the wavelength conversion member is reduced.
　そのため、波長変換部材の出射面から出射される蛍光１１１の光量を最大化するためには、波長変換部材の厚さを厚さＴｏに設定することが望ましい。 Therefore, in order to maximize the amount of the fluorescence 111 emitted from the emission surface of the wavelength conversion member, it is desirable to set the thickness of the wavelength conversion member to the thickness To.
　本実施形態の光学素子の場合、波長変換部材１０４の２つの端部の厚さを厚さＴｏに設定することが望ましい。 In the case of the optical element of the present embodiment, it is desirable to set the thickness of the two end portions of the wavelength conversion member 104 to the thickness To.
　波長変換部材１０４は、波長変換材料が分散した状態を保持するバインダを有していても良い。 The wavelength conversion member 104 may have a binder that maintains a state in which the wavelength conversion material is dispersed.
　バインダは、ガラス又は透明な樹脂からなるものが望ましい。 The binder is preferably made of glass or transparent resin.
　なお、波長変換部材１０４の温度が上昇すると、温度消光のみならず、波長変換部材１０４の構造的な安定性の低下を招くという問題がある。例えば、波長変換部材１０４のバインダにガラスを用いている場合はガラスの溶融や熱誘起の機械的応力による波長変換部材１０４のヒビ割れが生じる恐れがある。また、バインダに樹脂を用いている場合は樹脂の変性による透過率の低下や樹脂の熱変形などが生じる。一方、本実施形態の波長変換部材１０４では温度上昇を抑制できるため、これらの問題が生じるのを防ぐことができる。 Note that when the temperature of the wavelength conversion member 104 rises, there is a problem that not only temperature quenching but also structural stability of the wavelength conversion member 104 is lowered. For example, when glass is used for the binder of the wavelength conversion member 104, the wavelength conversion member 104 may be cracked due to melting of the glass or heat-induced mechanical stress. Further, when a resin is used for the binder, a decrease in transmittance due to the modification of the resin, a thermal deformation of the resin, or the like occurs. On the other hand, in the wavelength conversion member 104 of this embodiment, since temperature rise can be suppressed, it is possible to prevent these problems from occurring.
　また、波長変換部材１０４は波長を変換する波長変換材料を有するものである。本実施形態で用いる波長変換材料には蛍光体を用いている。 Further, the wavelength conversion member 104 has a wavelength conversion material for converting the wavelength. A phosphor is used as the wavelength conversion material used in the present embodiment.
　次に、波長変換部材の製造方法について説明する。 Next, a method for manufacturing the wavelength conversion member will be described.
　波長変換部材の２つの端部とは厚さが異なる中央領域は、波長変換部材を切削又は研削することにより設けられても良い。又は、曲面又は階段状の表面形状を有する基板上に波長変換部材を積層することにより設けられても良い。又は、形状の異なる複数の波長変換部材を積層することにより設けられても良い。 The central region having a thickness different from the two end portions of the wavelength conversion member may be provided by cutting or grinding the wavelength conversion member. Alternatively, it may be provided by laminating a wavelength conversion member on a substrate having a curved or stepped surface shape. Or you may provide by laminating | stacking the several wavelength conversion member from which a shape differs.
　〔第２の実施形態〕
　次に本発明の第２の実施形態の光学素子について説明する。本実施形態の光学素子は、第１の実施形態の波長変換部材と、波長変換部材と接する放熱部材とを有する。 [Second Embodiment]
Next, an optical element according to a second embodiment of the present invention will be described. The optical element of this embodiment has the wavelength conversion member of 1st Embodiment, and the thermal radiation member which touches a wavelength conversion member.
　図７は、本発明の第２の実施形態の光学素子２０８を示す斜視図である。光学素子２０８は、放熱部材２０５を２つと、波長変換部材２０４とを有する。放熱部材２０５は２つの端部に設けられている。 FIG. 7 is a perspective view showing an optical element 208 according to the second embodiment of the present invention. The optical element 208 includes two heat dissipating members 205 and a wavelength converting member 204. The heat radiating member 205 is provided at two ends.
　波長変換部材２０４の２つの端部は中央領域よりも厚いため、波長変換材料を多く含み、温度が上昇しやすい。しかしながら、光学素子２０８では、波長変換部材２０４の２つの端部に放熱部材２０５が接するため、２つの端部で生じた熱を放熱部材２０５を介して効率的に放散でき、波長変換部材２０４の温度が上昇するのを防止できる。 Since the two ends of the wavelength conversion member 204 are thicker than the central region, the wavelength conversion member 204 contains a large amount of wavelength conversion material, and the temperature tends to rise. However, in the optical element 208, since the heat radiation member 205 is in contact with the two ends of the wavelength conversion member 204, the heat generated at the two ends can be efficiently dissipated through the heat radiation member 205, and the wavelength conversion member 204 The temperature can be prevented from rising.
　本実施形態で用いる放熱部材には、その熱伝導率が空気の熱伝導率より大きいものを用いている。 The heat radiating member used in the present embodiment has a thermal conductivity higher than that of air.
　また、波長変換部材で生じる熱を放熱部材を介して放散するためには、放熱部材の熱伝導率は大きいほうが望ましく、特に、波長変換部材が有するバインダよりも大きい方が望ましい。 Further, in order to dissipate heat generated in the wavelength conversion member through the heat dissipation member, it is desirable that the heat conductivity of the heat dissipation member is larger, and in particular, it is desirable that the heat conductivity is larger than the binder included in the wavelength conversion member.
　例えば、放熱部材は、銅やアルミニウムなどの金属材料を含有することが望ましい。金属材料の熱伝導率は大きい。このため、放熱部材に金属材料を含有させることで、波長変換部材で生じる熱を効率的に逃がすことができるようになる。 For example, the heat dissipation member preferably contains a metal material such as copper or aluminum. The thermal conductivity of metal materials is large. For this reason, the heat generated in the wavelength conversion member can be efficiently released by including a metal material in the heat dissipation member.
　また、放熱部材は、樹脂材料を含有していても良い。放熱部材が樹脂材料を含有することにより、放熱部材と波長変換部材との密着性が向上し、波長変換部材で生じる熱が放熱部材に伝わりやすくなる。そこで、例えば、図１０に示すように、樹脂材料を含有する放熱部材２０５ｄを波長変換部材２０４ｄに接するように設けても良い。この場合、樹脂材料の熱伝導率が一般的には高くないことから、放熱部材２０５ｄに接し、熱伝導率が大きい別の放熱部材２０６ｄをさらに設けることが望ましい。 The heat dissipation member may contain a resin material. When the heat radiating member contains the resin material, the adhesion between the heat radiating member and the wavelength conversion member is improved, and heat generated by the wavelength conversion member is easily transmitted to the heat radiating member. Therefore, for example, as shown in FIG. 10, a heat radiating member 205d containing a resin material may be provided in contact with the wavelength conversion member 204d. In this case, since the thermal conductivity of the resin material is generally not high, it is desirable to further provide another heat radiating member 206d having a high thermal conductivity in contact with the heat radiating member 205d.
　また、放熱部材は、ヒートシンク及びヒートパイプのいずれかであっても良い。ヒートシンクやヒートパイプは熱伝導率が高く、放熱効果が大きいため、これらにより波長変換部材で生じた熱を放熱させることが可能となる。 Further, the heat radiating member may be either a heat sink or a heat pipe. Since heat sinks and heat pipes have high thermal conductivity and a large heat dissipation effect, it is possible to dissipate heat generated by the wavelength conversion member.
　放熱部材は、波長変換部材と接する面に、光を反射する反射面を有することが望ましい。
放熱部材の波長変換部材と接する面を反射面とすることで、波長変換部材の放熱部材と接する面から出射する光を波長変換部材に戻すことができ、光の損失が起こるのを防ぐことが可能となる。 The heat radiating member desirably has a reflective surface that reflects light on a surface in contact with the wavelength conversion member.
By making the surface in contact with the wavelength conversion member of the heat radiating member a reflective surface, light emitted from the surface in contact with the heat radiating member of the wavelength conversion member can be returned to the wavelength conversion member, and light loss can be prevented from occurring. It becomes possible.
　波長変換部材と放熱部材とが接する方法は特に限定されるものではない。すなわち、本発明の第２の実施形態の光学素子が有する波長変換部材と放熱部材とが嵌合して接するよう、構成しても良い。 The method for contacting the wavelength conversion member and the heat dissipation member is not particularly limited. That is, you may comprise so that the wavelength conversion member and heat radiating member which the optical element of the 2nd Embodiment of this invention has may be fitted and contacted.
　図９Ａは本発明の第２の実施形態の光学素子が有する波長変換部材と放熱部材との嵌合の一例を示す側面図である。例えば、図９Ａに示すように、波長変換部材２０４ａと放熱部材２０５ａのそれぞれに凹構造と凸構造を設けて、凹構造と凸構造とを嵌合させても良い。このように、凹凸構造を設けて嵌合させることにより、波長変換部材２０４ａと放熱部材２０５ａとが接する面積が大きくなる。この結果、波長変換部材２０４ａで生じた熱が放熱部材２０５ａに伝わりやすくなる。なお、図９Ａには、波長変換部材２０４ａが凸構造を有し、放熱部材２０５ａが凹構造を有する例を示したが、波長変換部材が凹構造を有し、放熱部材が凸構造を有するものであっても良い。 FIG. 9A is a side view showing an example of the fitting between the wavelength conversion member and the heat dissipation member of the optical element of the second embodiment of the present invention. For example, as shown in FIG. 9A, a concave structure and a convex structure may be provided on each of the wavelength conversion member 204a and the heat dissipation member 205a, and the concave structure and the convex structure may be fitted. Thus, by providing the concave-convex structure and fitting, the area where the wavelength conversion member 204a and the heat dissipation member 205a are in contact with each other increases. As a result, heat generated in the wavelength conversion member 204a is easily transmitted to the heat dissipation member 205a. 9A shows an example in which the wavelength conversion member 204a has a convex structure and the heat dissipation member 205a has a concave structure. However, the wavelength conversion member has a concave structure and the heat dissipation member has a convex structure. It may be.
　図９Ｂに、本発明の第２の実施形態の光学素子の、波長変換部材と放熱部材とが嵌合する別の例を示す。放熱部材２０５ｂの厚さは、波長変換部材２０４ｂの厚さよりも厚い。さらに、放熱部材２０５ｂのみが凹構造を有する。このように、放熱部材２０５ｂに凹構造を設けて、この凹構造と波長変換部材２０４ｂとを嵌合させることにより、波長変換部材２０４ｂと放熱部材２０５ｂとが接する面積が大きくなる。この結果、波長変換部材２０４ｂで生じた熱が放熱部材２０５ｂに伝わりやすくなる。なお、図９Ｂには、放熱部材２０５ｂのみが凹構造を有する例を示したが、波長変換部材のみが凹構造を有するものであっても良い。 FIG. 9B shows another example in which the wavelength conversion member and the heat dissipation member of the optical element according to the second embodiment of the present invention are fitted. The heat radiating member 205b is thicker than the wavelength converting member 204b. Furthermore, only the heat radiating member 205b has a concave structure. Thus, by providing a concave structure in the heat radiating member 205b and fitting the concave structure with the wavelength conversion member 204b, the area where the wavelength conversion member 204b and the heat radiating member 205b are in contact with each other increases. As a result, heat generated in the wavelength conversion member 204b is easily transmitted to the heat dissipation member 205b. Although FIG. 9B shows an example in which only the heat dissipation member 205b has a concave structure, only the wavelength conversion member may have a concave structure.
　図９Ｃに、本発明の第２の実施形態の光学素子の、波長変換部材と放熱部材とが嵌合するさらに別の例を示す。ここで、放熱部材２０５ｃにはザグリが設けられていて、放熱部材２０５ｃの端部が段構造となっている。このように、放熱部材２０５ｃに段構造を設けて、段構造と波長変換部材２０４ｃとを嵌合させることにより、波長変換部材２０４ｃと放熱部材２０５ｃとが接する面積が大きくなる。この結果、波長変換部材２０４ｃで生じた熱が放熱部材２０５ｃに伝わりやすくなる。なお、図９Ｃには、放熱部材２０５ｃのみが段構造を有する例を示したが、波長変換部材のみが段構造を有するものであっても良い。 FIG. 9C shows still another example in which the wavelength conversion member and the heat dissipation member of the optical element according to the second embodiment of the present invention are fitted. Here, the heat radiation member 205c is provided with counterbore, and the end of the heat radiation member 205c has a step structure. As described above, by providing the heat dissipation member 205c with a step structure and fitting the step structure with the wavelength conversion member 204c, the area where the wavelength conversion member 204c and the heat dissipation member 205c are in contact with each other is increased. As a result, heat generated in the wavelength conversion member 204c is easily transmitted to the heat dissipation member 205c. Although FIG. 9C shows an example in which only the heat radiating member 205c has a step structure, only the wavelength conversion member may have a step structure.
　また、図９Ａ～図９Ｃに示すように波長変換部材と放熱部材とを嵌合させることにより、波長変換部材と放熱部材との接触面がズレにくくなり、波長変換部材と放熱部材とが接続した状態をより安定な構造とすることができる。このため、光学素子や発光装置の組み立てが容易になり、また、光学素子として、振動などに対する信頼性が向上する。 Further, as shown in FIGS. 9A to 9C, by fitting the wavelength conversion member and the heat dissipation member, the contact surface between the wavelength conversion member and the heat dissipation member becomes difficult to shift, and the wavelength conversion member and the heat dissipation member are connected. The state can be a more stable structure. For this reason, the assembly of the optical element and the light emitting device is facilitated, and the reliability of the optical element as a vibration is improved.
　〔第３の実施形態〕
　次に本発明の第３の実施形態の光学素子について説明する。 [Third Embodiment]
Next, an optical element according to a third embodiment of the present invention will be described.
　図１１は、本発明の第３の実施形態の光学素子３０８を示す斜視図である。光学素子３０８は、波長変換部材３０４とこれに接する放熱部材３０５とを有する。光学素子３０８は、放熱部材３０５を４つ有する点で第２の実施形態の光学素子とは異なる。 FIG. 11 is a perspective view showing an optical element 308 according to the third embodiment of the present invention. The optical element 308 includes a wavelength conversion member 304 and a heat dissipation member 305 in contact with the wavelength conversion member 304. The optical element 308 is different from the optical element of the second embodiment in that it has four heat dissipating members 305.
　光学素子３０８の詳細について、図１２Ａ～図１２Ｃを用いて説明する。図１２Ａは、本発明の第３の実施形態の光学素子３０８を示す平面図である。図１２Ｂは、図１２Ａの１２Ｂ－１２Ｂ線に沿った、光学素子３０８のｘｚ方向における断面図である。図１２Ｃは、図１２Ａの１２Ｃ－１２Ｃ線に沿った、光学素子３０８のｙｚ方向における断面図である。 Details of the optical element 308 will be described with reference to FIGS. 12A to 12C. FIG. 12A is a plan view showing an optical element 308 according to the third embodiment of the present invention. 12B is a cross-sectional view of the optical element 308 in the xz direction along the line 12B-12B in FIG. 12A. 12C is a cross-sectional view of the optical element 308 in the yz direction, taken along the line 12C-12C in FIG. 12A.
　光学素子３０８では、放熱部材３０５が波長変換部材３０４の４つの端に設けられている。さらに、図１２Ｂに示すように、波長変換部材３０４の厚さはｘ方向に連続的に変化しており、放熱部材３０５に近いほど厚く、放熱部材３０５から離れて中央領域に近いほど薄くなっている。同様に、図１２Ｃに示すように、波長変換部材３０４の厚さはｙ方向に連続的に変化しており、放熱部材３０５に近いほど厚く、放熱部材３０５から離れて中央領域に近いほど薄くなっている。このため、波長変換部材３０４の中央で生じる熱量は小さくなる一方で、波長変換部材３０４の端で生じる熱量は大きくなる。ただし、波長変換部材３０４の端で生じる熱は、波長変換部材３０４の４つの端に接する放熱部材３０５を介して逃がすことができる。この結果、波長変換材料を厚くしつつも、波長変換部材の温度が上昇するのを防ぐことができる。 In the optical element 308, the heat radiating member 305 is provided at four ends of the wavelength conversion member 304. Further, as shown in FIG. 12B, the thickness of the wavelength conversion member 304 continuously changes in the x direction, and becomes thicker as it is closer to the heat dissipation member 305 and thinner as it is farther from the heat dissipation member 305 and closer to the central region. Yes. Similarly, as shown in FIG. 12C, the thickness of the wavelength conversion member 304 continuously changes in the y direction, and is thicker as it is closer to the heat dissipation member 305 and thinner as it is farther from the heat dissipation member 305 and closer to the central region. ing. For this reason, the amount of heat generated at the center of the wavelength conversion member 304 is reduced, while the amount of heat generated at the end of the wavelength conversion member 304 is increased. However, the heat generated at the ends of the wavelength conversion member 304 can be released through the heat dissipation member 305 in contact with the four ends of the wavelength conversion member 304. As a result, it is possible to prevent the temperature of the wavelength conversion member from rising while increasing the thickness of the wavelength conversion material.
　なお、放熱部材の形状は図１１に示すものに限られるものではない。例えば、図１３に示す光学素子３０８ａのように、波長変換部材３０４ａの４つの端に、単一の放熱部材３０５ａが接触されるものであっても良い。放熱部材３０５ａをこのような構造とすることにより、光学素子を製造するための部品点数が削減でき、製造が容易となる。 Note that the shape of the heat dissipation member is not limited to that shown in FIG. For example, as in the optical element 308a shown in FIG. 13, a single heat radiating member 305a may be in contact with the four ends of the wavelength conversion member 304a. When the heat dissipating member 305a has such a structure, the number of parts for manufacturing the optical element can be reduced, and the manufacturing becomes easy.
　また、波長変換部材及び放熱部材の形状は、図１１や図１３に示すものに限られるものではない。例えば、図１４に示す光学素子３０８ｂのように、波長変換部材３０４ｂは、円板状であっても良い。また、放熱部材３０５ｂはこの波長変換部材３０４ｂを囲むような形状であっても良い。 Further, the shapes of the wavelength conversion member and the heat dissipation member are not limited to those shown in FIGS. For example, like the optical element 308b shown in FIG. 14, the wavelength conversion member 304b may have a disk shape. Further, the heat radiation member 305b may have a shape surrounding the wavelength conversion member 304b.
　〔第４の実施形態〕
　次に本発明の第４の実施形態の光学素子について説明する。 [Fourth Embodiment]
Next, an optical element according to a fourth embodiment of the present invention will be described.
　図１５は、本発明の第４の実施形態の光学素子４０８を示す斜視図である。光学素子４０８は、波長変換部材４０４と、放熱部材４０５とを有する。波長変換部材４０４は厚さが異なる一端と他端を有し、放熱部材４０５は、波長変換部材４０４の一端よりも厚さが厚い他端に接して設けられている。また、波長変換部材４０４の一端は露出している。 FIG. 15 is a perspective view showing an optical element 408 according to the fourth embodiment of the present invention. The optical element 408 includes a wavelength conversion member 404 and a heat dissipation member 405. The wavelength converting member 404 has one end and the other end having different thicknesses, and the heat radiating member 405 is provided in contact with the other end that is thicker than one end of the wavelength converting member 404. One end of the wavelength conversion member 404 is exposed.
　波長変換部材４０４の他端は一端よりも厚さが厚い。このため、波長変換部材４０４の他端に比べると、一端に含まれる波長変換材料は少ない。この結果、波長変換部材４０４の一端で波長変換される光の量が少なくなり、生じる熱が小さくなる。一方、波長変換部材４０４の他端は一端よりも厚いため、一端と比べると他端に含まれる波長変換材料は多い。この結果、波長変換部材４０４の他端で生じる熱は大きくなるが、波長変換される光の量が多くなる。しかしながら、波長変換部材４０４の他端には放熱部材４０５が接して設けられているため、他端で生じる熱は放熱部材４０５に伝わり放散されることとなる。 The other end of the wavelength conversion member 404 is thicker than one end. For this reason, compared with the other end of the wavelength conversion member 404, there are few wavelength conversion materials contained in one end. As a result, the amount of light wavelength-converted at one end of the wavelength conversion member 404 is reduced, and the generated heat is reduced. On the other hand, since the other end of the wavelength conversion member 404 is thicker than the one end, there are more wavelength conversion materials contained in the other end than the one end. As a result, the heat generated at the other end of the wavelength conversion member 404 increases, but the amount of light subjected to wavelength conversion increases. However, since the heat radiating member 405 is provided in contact with the other end of the wavelength conversion member 404, the heat generated at the other end is transmitted to the heat radiating member 405 and dissipated.
　このように、光学素子４０８では、波長変換部材４０４の一端で生じる熱を小さくすることで、光学素子４０８全体の温度が上昇するのを抑制する一方で、放熱部材４０５と接することにより熱を放熱しやすくなっている他端で波長変換される光の量を多くしている。この結果、波長変換部材４０４全体にて波長変換される光の量を多くしながら、波長変換部材４０４全体の温度が上昇するのを抑制できる。 As described above, in the optical element 408, by reducing the heat generated at one end of the wavelength conversion member 404, the temperature of the entire optical element 408 is suppressed from increasing, while the heat is dissipated by being in contact with the heat dissipation member 405. The amount of light that is wavelength-converted at the other end that is easy to do is increased. As a result, it is possible to suppress an increase in the temperature of the entire wavelength conversion member 404 while increasing the amount of light subjected to wavelength conversion in the entire wavelength conversion member 404.
　〔第５の実施形態〕
　次に本発明の第５の実施形態の光学素子について説明する。 [Fifth Embodiment]
Next, an optical element according to a fifth embodiment of the present invention will be described.
　図１６は、本発明の第５の実施形態の光学素子５０８を示す正面図である。光学素子５０８は、波長変換部材５０４と、これに接する放熱部材５０５とを有する。さらに、光学素子５０８は、波長変換部材５０４に対向し、接して設けられた透明部材５２１を有する。光学素子５０８は、透明部材５２１を有する点で第２の実施形態とは異なる。 FIG. 16 is a front view showing an optical element 508 according to the fifth embodiment of the present invention. The optical element 508 includes a wavelength conversion member 504 and a heat dissipation member 505 in contact therewith. Further, the optical element 508 includes a transparent member 521 provided so as to face and contact the wavelength conversion member 504. The optical element 508 is different from the second embodiment in that it includes a transparent member 521.
　透明部材５２１は、波長変換部材５０４の下面に接して配置されている。このように透明部材５２１を配置させることにより、波長変換部材５０４の機械的強度を高めることができる。このため、例えば、波長変換部材に入射した励起光を波長変換して蛍光として出射する効率を上げるために波長変換部材を薄くでき、例えば、波長変換部材の厚さを１ｍｍ以下にすることも可能となる。 The transparent member 521 is disposed in contact with the lower surface of the wavelength conversion member 504. By disposing the transparent member 521 in this manner, the mechanical strength of the wavelength conversion member 504 can be increased. For this reason, for example, the wavelength conversion member can be thinned to increase the efficiency of wavelength conversion of the excitation light incident on the wavelength conversion member and output as fluorescence. For example, the thickness of the wavelength conversion member can be 1 mm or less. It becomes.
　なお、波長変換部材の厚さは、波長変換部材の励起光の吸収率、蛍光の発光効率、蛍光に対する透過率などを考慮して決定することが望ましい。 The thickness of the wavelength conversion member is desirably determined in consideration of the absorption rate of excitation light, the emission efficiency of fluorescence, the transmittance for fluorescence, and the like.
　透明部材５２１の材料としては、励起光又は蛍光に対して透過率が大きいものを用いることが望ましく、例えば、ガラスや透明樹脂などが使用できる。 As the material of the transparent member 521, it is desirable to use a material having a high transmittance with respect to excitation light or fluorescence. For example, glass or transparent resin can be used.
　また、透明部材５２１の材料の例としては、バインダ材料のガラスや樹脂に比べて熱伝導率が大きいサファイアや水晶が挙げられる。透明部材５２１として熱伝導率が大きい材料が用いられた場合、放熱部材５０５のみならず、透明部材５２１も波長変換部材５０４で生じた熱を放熱する機能を奏する。このため、より大きな放熱効果を実現可能となる。 Also, examples of the material of the transparent member 521 include sapphire and quartz having a higher thermal conductivity than the glass or resin of the binder material. When a material having high thermal conductivity is used as the transparent member 521, not only the heat radiating member 505 but also the transparent member 521 has a function of radiating heat generated by the wavelength conversion member 504. For this reason, a larger heat dissipation effect can be realized.
　図１６には、波長変換部材の下面に透明部材５２１が接する光学素子５０８を示したが、本実施形態の光学素子はこれに限定されるものではない。例えば、図１７に示すように、光学素子５０８ａは、波長変換部材５０４の上面及び下面のいずれにも接する透明部材５２１、５２２を有するものであっても良い。 16 shows the optical element 508 in which the transparent member 521 is in contact with the lower surface of the wavelength conversion member, but the optical element of the present embodiment is not limited to this. For example, as shown in FIG. 17, the optical element 508 a may include transparent members 521 and 522 that are in contact with both the upper surface and the lower surface of the wavelength conversion member 504.
　〔第６の実施形態〕
　図１８は、本発明の第６の実施形態の光学素子６０８を示す正面図である。光学素子６０８は、波長変換部材６０４とこれに接する単一の放熱部材６０５を有する。放熱部材６０５は透明部材からなる。放熱部材６０５の材料の例としては、バインダ材料のガラスや樹脂に比べて熱伝導率が大きいサファイアや水晶が挙げられる。 [Sixth Embodiment]
FIG. 18 is a front view showing an optical element 608 according to the sixth embodiment of the present invention. The optical element 608 has a wavelength conversion member 604 and a single heat radiating member 605 in contact therewith. The heat radiating member 605 is made of a transparent member. Examples of the material of the heat radiating member 605 include sapphire and quartz having a higher thermal conductivity than that of glass or resin as a binder material.
　光学素子６０８では、透明部材からなる放熱部材６０５が波長変換部材６０４の下面に接している。波長変換部材６０４の下面は端面よりも面積が広い。このため、光学素子６０８では、放熱部材を端面に接しさせた場合よりも、放熱部材６０５と波長変換部材６０４との接触面積を大きくでき、波長変換部材６０４で生じた熱をより早く放熱部材６０５に伝えることができる。 In the optical element 608, a heat radiating member 605 made of a transparent member is in contact with the lower surface of the wavelength conversion member 604. The lower surface of the wavelength conversion member 604 has a larger area than the end surface. Therefore, in the optical element 608, the contact area between the heat radiating member 605 and the wavelength conversion member 604 can be increased as compared with the case where the heat radiating member is brought into contact with the end surface, and the heat generated by the wavelength conversion member 604 can be generated faster. Can tell.
　なお、図１８には、波長変換部材６０４の下面のみに放熱部材６０５が接する光学素子６０８を示したが、本実施形態の光学素子はこれに限定されるものではない。例えば、光学素子は、波長変換部材の上面及び下面に接する２つの放熱部材を有するものであっても良い。 FIG. 18 shows the optical element 608 in which the heat radiating member 605 is in contact with only the lower surface of the wavelength conversion member 604, but the optical element of the present embodiment is not limited to this. For example, the optical element may have two heat radiating members in contact with the upper surface and the lower surface of the wavelength conversion member.
　〔第７の実施形態〕
　図１９は、本発明の第７の実施形態の光学素子７０８を示す正面図である。光学素子７０８は、波長変換部材７０４と、波長変換部材７０４に対向して配置された波長選択フィルタ７２３とを有する。光学素子７０８は、波長選択フィルタ７２３を有する点で第１の実施形態とは異なる。 [Seventh Embodiment]
FIG. 19 is a front view showing an optical element 708 according to the seventh embodiment of the present invention. The optical element 708 includes a wavelength conversion member 704 and a wavelength selection filter 723 disposed to face the wavelength conversion member 704. The optical element 708 is different from the first embodiment in that it includes a wavelength selection filter 723.
　波長選択フィルタ７２３は、励起光７１０を反射又は吸収し、かつ、波長変換部材７０４で生じた蛍光７１１を透過させる特性を有している。 The wavelength selection filter 723 has a characteristic of reflecting or absorbing the excitation light 710 and transmitting the fluorescence 711 generated by the wavelength conversion member 704.
　波長変換部材７０４の厚さは位置に応じて異なるため、波長変換部材７０４から出射される光の位置によって光のスペクトルは異なる。また、励起光の波長変換部材７０４内での光路長は波長変換部材７０４への入射角度によって異なるため、波長変換部材７０４を透過した光の出射角度によって光のスペクトルは異なる。このため、波長変換部材７０４から出射される光には色ムラが生じやすい。しかしながら、波長選択フィルタ７２３を波長変換部材７０４に対向して設けることにより、光学素子７０８から出射される光を蛍光７１１のみとし、色ムラを低減できる。 Since the thickness of the wavelength conversion member 704 varies depending on the position, the light spectrum varies depending on the position of the light emitted from the wavelength conversion member 704. Further, since the optical path length of the excitation light in the wavelength conversion member 704 varies depending on the incident angle to the wavelength conversion member 704, the spectrum of light varies depending on the emission angle of the light transmitted through the wavelength conversion member 704. For this reason, color unevenness is likely to occur in the light emitted from the wavelength conversion member 704. However, by providing the wavelength selection filter 723 so as to face the wavelength conversion member 704, the light emitted from the optical element 708 can be only the fluorescence 711, and color unevenness can be reduced.
　また、波長変換部材７０４は厚さが薄い領域を有する。この領域は励起光７１０の吸収率が低いため、波長変換部材に入射する励起光のうち、波長変換されずにそのまま透過する割合が増加する。ここで、波長選択フィルタ７２３は励起光７１０の波長帯域の光を反射する特性を有している場合には、波長変換部材７０４を透過した励起光７１０は波長選択フィルタ７２３で反射し、再度、波長変換部材７０４に入射する。そして、波長変換部材７０４に再び入射した励起光７１０は蛍光７１１に変換されるため、結果として、蛍光７１１の光量を大きくできる。 Further, the wavelength conversion member 704 has a thin region. Since the absorption rate of the excitation light 710 is low in this region, the ratio of the excitation light incident on the wavelength conversion member that is transmitted without being subjected to wavelength conversion increases. Here, when the wavelength selection filter 723 has a characteristic of reflecting light in the wavelength band of the excitation light 710, the excitation light 710 transmitted through the wavelength conversion member 704 is reflected by the wavelength selection filter 723, and again, The light enters the wavelength conversion member 704. And since the excitation light 710 which entered the wavelength conversion member 704 again is converted into fluorescence 711, as a result, the light quantity of the fluorescence 711 can be increased.
　波長選択フィルタ７２３としては、励起光の波長帯域の光を吸収する材料を含んだガラス基板や、誘電体多層膜、ホログラフィック素子、フォトニック結晶等を使用した特定の波長帯域透過させる特性を有するものなどを用いることができる。 The wavelength selection filter 723 has a characteristic of transmitting a specific wavelength band using a glass substrate containing a material that absorbs light in the wavelength band of excitation light, a dielectric multilayer film, a holographic element, a photonic crystal, or the like. Things can be used.
　光学素子７０８は、波長変換部材７０４に接する放熱部材を有していても良い。 The optical element 708 may have a heat radiating member in contact with the wavelength conversion member 704.
　波長選択フィルタ７２３は、波長変換部材７０４と離れていても良いし、波長変換部材７０４と接していても良い。 The wavelength selection filter 723 may be separated from the wavelength conversion member 704 or may be in contact with the wavelength conversion member 704.
　〔第８の実施形態〕
　図２０は、本発明の第８の実施形態の光学素子８０８を示す正面図である。光学素子８０８は、波長変換部材８０４と、波長変換部材８０４に対向して配置された波長選択フィルタ８２４とを有する。光学素子８０８は、波長選択フィルタ８２４を有する点で第１の実施形態とは異なる。 [Eighth Embodiment]
FIG. 20 is a front view showing an optical element 808 according to the eighth embodiment of the present invention. The optical element 808 includes a wavelength conversion member 804 and a wavelength selection filter 824 disposed to face the wavelength conversion member 804. The optical element 808 differs from the first embodiment in that it includes a wavelength selection filter 824.
　波長選択フィルタ８２４は、励起光８１０の波長帯域の光を透過させ、かつ、波長変換部材８０４で生じた蛍光８１１の波長帯域の光を反射する特性を有している。 The wavelength selection filter 824 has a characteristic of transmitting light in the wavelength band of the excitation light 810 and reflecting light in the wavelength band of the fluorescence 811 generated by the wavelength conversion member 804.
　波長変換部材８０４内で蛍光８１１は等方的に発光するため、蛍光８１１の一部は励起光８１０が入射する側に出射されてしまう。そこで、光学素子８０８では、励起光８１０が入射する側に出射した蛍光８１１を、波長選択フィルタ８２４で反射させ、波長変換部材８０４の出射側から出射させることとした。これにより、波長変換部材８０４の出射面から出射する蛍光８１１の光量を大きくできる。 Since the fluorescence 811 emits isotropically in the wavelength conversion member 804, a part of the fluorescence 811 is emitted to the side on which the excitation light 810 is incident. Therefore, in the optical element 808, the fluorescence 811 emitted to the incident side of the excitation light 810 is reflected by the wavelength selection filter 824 and emitted from the emission side of the wavelength conversion member 804. Thereby, the light quantity of the fluorescence 811 emitted from the emission surface of the wavelength conversion member 804 can be increased.
　波長選択フィルタ８２４としては、誘電体多層膜やホログラフィック素子、フォトニック結晶等を使用した特定の波長帯域を透過させ、それ以外の光を反射する特性を有するものを用いることができる。 As the wavelength selection filter 824, a filter having a characteristic of transmitting a specific wavelength band using a dielectric multilayer film, a holographic element, a photonic crystal, or the like and reflecting other light can be used.
　光学素子８０８は、波長変換部材８０４に接する放熱部材を有していても良い。 The optical element 808 may have a heat radiating member in contact with the wavelength conversion member 804.
　〔第９の実施形態〕
　図２１は、本発明の第９の実施形態の光学素子９０８を示す正面図である。光学素子９０８は、波長変換部材９０４と、波長変換部材９０４に対向して配置された偏光子９２５とを有する。光学素子９０８は、偏光子９２５を有する点で第１の実施形態とは異なる。 [Ninth Embodiment]
FIG. 21 is a front view showing an optical element 908 according to the ninth embodiment of the present invention. The optical element 908 includes a wavelength conversion member 904 and a polarizer 925 disposed to face the wavelength conversion member 904. The optical element 908 is different from the first embodiment in that it includes a polarizer 925.
　偏光子９２５は、蛍光９１１のうち、偏光子９２５の透過軸と平行な偏光成分を有する光を透過させ、透過軸と直交する方向と平行な偏光成分を有する光を反射する。このため、透過軸と直交する方向と平行な偏光成分を有する光の一部を、偏光子９２５で反射した後に、波長変換部材９０４で反射し、再び、偏光子８２５に入射させることができる。この結果、偏光子９２５の透過軸と平行な偏光成分を有する光を効率的に取り出すことが可能となる。 The polarizer 925 transmits light having a polarization component parallel to the transmission axis of the polarizer 925 out of the fluorescence 911 and reflects light having a polarization component parallel to the direction orthogonal to the transmission axis. For this reason, part of light having a polarization component parallel to the direction orthogonal to the transmission axis can be reflected by the polarizer 925, reflected by the wavelength conversion member 904, and incident on the polarizer 825 again. As a result, light having a polarization component parallel to the transmission axis of the polarizer 925 can be efficiently extracted.
　偏光子９２５として、ワイヤグリッド偏光子や、有機材料を用いた多層膜等を用いることができる。 As the polarizer 925, a wire grid polarizer, a multilayer film using an organic material, or the like can be used.
　光学素子９０８は、表示素子として液晶パネルを用いたプロジェクタに用いることができる。液晶パネルは偏光依存性を有している。このため、プロジェクタでは特定の方向の偏光成分の光のみを空間的に変調し、特定の方向と直交する方向の偏光成分の光は変調されず、使用されない。光学素子９０８から出射する光は特定の方向の偏光成分を有する直線偏光であるため、前述のような、光学系で使用されない光の量を低減でき、プロジェクタからの出射光量を向上できる。 The optical element 908 can be used for a projector using a liquid crystal panel as a display element. The liquid crystal panel has polarization dependency. Therefore, the projector spatially modulates only the light of the polarization component in a specific direction, and the light of the polarization component in the direction orthogonal to the specific direction is not modulated and used. Since the light emitted from the optical element 908 is linearly polarized light having a polarization component in a specific direction, the amount of light not used in the optical system as described above can be reduced, and the amount of light emitted from the projector can be improved.
　〔第１０の実施形態〕
　図２２は、本発明の第１０の実施形態の光学素子１００８を示す正面図である。光学素子１００８は、波長変換部材１００４と、波長変換部材１００４に対向して配置された光学部１０２６とを有する。光学素子１００８は、光学部１０２６を有する点で第１の実施形態とは異なる。 [Tenth embodiment]
FIG. 22 is a front view showing an optical element 1008 according to the tenth embodiment of the present invention. The optical element 1008 includes a wavelength conversion member 1004 and an optical unit 1026 disposed to face the wavelength conversion member 1004. The optical element 1008 differs from the first embodiment in that it includes an optical unit 1026.
　光学部１０２６としては、柱状の透明材料からなるロッドインテグレータや、筒状であって、筒の内側が鏡面反射特性を有するライトパイプ、複数のレンズが面内に配置されたレンズアレイなどを用いることができる。 As the optical unit 1026, a rod integrator made of a columnar transparent material, a light pipe having a cylindrical shape and having a specular reflection characteristic inside the tube, a lens array in which a plurality of lenses are arranged in a plane, or the like is used. Can do.
　光学部１０２６により、蛍光１０１１の強度分布を均一化できる。このため、例えば、光学素子１００８をプロジェクタに用いるとプロジェクタから出射する光の強度分布が均一化できる。この結果、プロジェクタからスクリーンなどに光を投射した場合、スクリーン上での照度ムラを小さくすることができる。 The intensity distribution of the fluorescence 1011 can be made uniform by the optical unit 1026. For this reason, for example, when the optical element 1008 is used in a projector, the intensity distribution of light emitted from the projector can be made uniform. As a result, when light is projected from a projector onto a screen or the like, illuminance unevenness on the screen can be reduced.
　光学素１００８は、波長変換部材１００４に接する放熱部材を有していても良い。 The optical element 1008 may have a heat radiating member in contact with the wavelength conversion member 1004.
　〔第１１の実施形態〕
　次に本発明の第１１の実施形態の発光装置について説明する。 [Eleventh embodiment]
Next, a light emitting device according to an eleventh embodiment of the present invention will be described.
　図２３は、本発明の第１１の実施形態の発光装置１１０１を示す斜視図である。発光装置１１０１は、波長変換部材１１０４と光源１１０２とを有する。光源１１０２は、その発光面が波長変換部材１１０４に対向し、光源からの光が波長変換部材１１０４に入射するように配置されている。 FIG. 23 is a perspective view showing a light emitting device 1101 according to an eleventh embodiment of the present invention. The light emitting device 1101 includes a wavelength conversion member 1104 and a light source 1102. The light source 1102 is disposed such that the light emitting surface thereof faces the wavelength conversion member 1104 and light from the light source enters the wavelength conversion member 1104.
　発光装置１１０１の詳細について、図面を用いて説明する。図２４Ａは、本発明の第１１の実施形態の発光装置１１０１を示す平面図である。図２４Ｂは、図２４Ａの２４Ｂ－２４Ｂ線に沿った断面図である。 Details of the light emitting device 1101 will be described with reference to the drawings. FIG. 24A is a plan view showing a light emitting device 1101 according to an eleventh embodiment of the present invention. 24B is a cross-sectional view taken along line 24B-24B of FIG. 24A.
　発光装置１１０１では、波長変換部材１１０４の温度が上昇するのを防止しつつ、光源１１０２からの光を励起光１１１０として波長変換部材１１０４に入射させて、蛍光１１１１を取り出すことが可能となる。 In the light emitting device 1101, it is possible to take out the fluorescence 1111 by making the light from the light source 1102 enter the wavelength conversion member 1104 as the excitation light 1110 while preventing the temperature of the wavelength conversion member 1104 from rising.
　光源として、例えば、ＬＥＤや半導体レーザを用いることができるが、特にこれらに限定されるものではない。また、光源の形状は限定されるものではない。例えば、光源は面発光型の固体光源、又は、光源と導光板からなる面発光デバイスであっても良い。 As the light source, for example, an LED or a semiconductor laser can be used, but it is not particularly limited thereto. Further, the shape of the light source is not limited. For example, the light source may be a surface-emitting solid-state light source or a surface-emitting device including a light source and a light guide plate.
　なお、発光装置１１０１の形態はこれに限定されるものではない。例えば、波長変換部材１１０４の代わりに、第２から第１０のいずれかの実施形態に記載の光学素子を用いても良い。さらに、発光装置１１０１は、第７の実施形態で示した波長選択フィルタ７２３、第８の実施形態で示した波長選択フィルタ８２４、第９の実施形態で示した偏光子９２５、第１０の実施形態で示した光学部１０２６の４つの素子のうち、いずれか２つ以上の素子を有していても良い。さらに、各素子の前方又は後方に、レンズや折り返しミラーなどの光学素子を有していても良い。また、波長選択フィルタ７２３、偏光子９２５、光学部１０２６の３つの素子のうち、いずれか２つ以上を有する発光装置において、基本的にはこの３つの素子はどういう順番で配置されていても良い。第７の実施形態で示した波長選択フィルタ７２３と第８の実施形態で示した波長選択フィルタ８２４を有する場合には、それぞれの波長選択フィルタは、波長変換部材を挟むように配置されることが望ましい。 Note that the form of the light emitting device 1101 is not limited to this. For example, instead of the wavelength conversion member 1104, the optical element described in any one of the second to tenth embodiments may be used. Further, the light emitting device 1101 includes the wavelength selection filter 723 shown in the seventh embodiment, the wavelength selection filter 824 shown in the eighth embodiment, the polarizer 925 shown in the ninth embodiment, and the tenth embodiment. Any one or more of the four elements of the optical unit 1026 shown in FIG. Further, an optical element such as a lens or a folding mirror may be provided in front of or behind each element. Further, in the light emitting device having any two or more of the three elements of the wavelength selection filter 723, the polarizer 925, and the optical unit 1026, basically, the three elements may be arranged in any order. . When the wavelength selection filter 723 shown in the seventh embodiment and the wavelength selection filter 824 shown in the eighth embodiment are provided, each wavelength selection filter may be arranged so as to sandwich the wavelength conversion member. desirable.
　〔第１２の実施形態〕
　次に本発明の発光装置を投影装置に適用する実施形態について説明する。 [Twelfth embodiment]
Next, an embodiment in which the light emitting device of the present invention is applied to a projection device will be described.
　本実施形態の投影装置として、プロジェクタを図２５に示す。プロジェクタ１２２９は、発光装置１２０１ａ、１２０１ｂ及び１２０１ｃと、液晶パネル１２２７ａ、１２２７ｂ及び１２２７ｃと、クロスダイクロイックプリズム１２２８と、投射光学系１２３１とを備える。ここで、発光装置１２０１ａ、１２０１ｂ及び１２０１ｃは第１１の実施形態で説明した発光装置のいずれであっても良い。 FIG. 25 shows a projector as the projection apparatus of this embodiment. The projector 1229 includes light emitting devices 1201a, 1201b, and 1201c, liquid crystal panels 1227a, 1227b, and 1227c, a cross dichroic prism 1228, and a projection optical system 1231. Here, the light emitting devices 1201a, 1201b, and 1201c may be any of the light emitting devices described in the eleventh embodiment.
　発光装置１２０１ａ、１２０１ｂ及び１２０１ｃのそれぞれは、波長がそれぞれ異なる光を出射するものとする。例えば、発光装置１２０１ａから赤色光が出射され、発光装置１２０１ｂから緑色光が出射され、発光装置１２０１ｃから青色光が出射されるものとする。 Suppose that each of the light emitting devices 1201a, 1201b, and 1201c emits light having different wavelengths. For example, it is assumed that red light is emitted from the light emitting device 1201a, green light is emitted from the light emitting device 1201b, and blue light is emitted from the light emitting device 1201c.
　発光装置１２０１ａ、１２０１ｂ及び１２０１ｃのそれぞれから出射された光は、液晶パネル１２２７ａ、１２２７ｂ及び１２２７ｃのそれぞれに入射される。 Light emitted from each of the light emitting devices 1201a, 1201b, and 1201c is incident on each of the liquid crystal panels 1227a, 1227b, and 1227c.
　液晶パネル１２２７ａ、１２２７ｂ及び１２２７ｃは、入射された各色光を映像信号に応じて２次元的に変調することで、各色光に画像を担持させ、その画像を担持させた各色光を出射する空間光変調素子である。なお、ここでは空間光変調素子として液晶パネルを用いたが、空間光変調素子はデジタルマイクロミラーデバイスであっても良い。 The liquid crystal panels 1227a, 1227b, and 1227c modulate each incident color light in a two-dimensional manner according to a video signal so that each color light carries an image, and spatial light that emits each color light carrying the image. It is a modulation element. Although a liquid crystal panel is used as the spatial light modulation element here, the spatial light modulation element may be a digital micromirror device.
　クロスダイクロイックプリズム１２２８は、液晶パネル１２２７ａ、１２２７ｂ及び１２２７ｃのそれぞれから出射された各変調光を合成して出射する。 The cross dichroic prism 1228 synthesizes and outputs the modulated lights emitted from the liquid crystal panels 1227a, 1227b, and 1227c.
　投射光学系１２３１は、クロスダイクロイックプリズム１２２８から出射された合成光をスクリーン１２３０に投射して、映像信号に応じた画像をスクリーン１２３０上に表示する。 The projection optical system 1231 projects the combined light emitted from the cross dichroic prism 1228 onto the screen 1230, and displays an image corresponding to the video signal on the screen 1230.
　本発明は上記実施形態に限定されることなく、特許請求の範囲に記載した発明の範囲内で、種々の変形が可能であり、それらも本発明の範囲内に含まれるものであることはいうまでもない。 The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the invention described in the claims, and it is also included within the scope of the present invention. Not too long.
　この出願は、２０１２年５月２５日に出願された日本出願特願２０１２－１１９９８０号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2012-119980 filed on May 25, 2012, the entire disclosure of which is incorporated herein.
　上記の実施形態の一部又は全部は、以下の付記のようにも記載されうるが、以下には限られない。
（付記１）波長変換部材であって、前記波長変換部材は、前記波長変換部材の少なくとも対向する２つの端部とは厚さが異なる中央領域を有し、前記中央領域の厚さが前記２つの端部の厚さよりも薄い波長変換部材。
（付記２）前記波長変換部材は第１の窪みを有する、付記１に記載の波長変換部材。
（付記３）前記波長変換部材は、前記第１の窪みを有する面と対向する面に第２の窪みを有する、付記２に記載の波長変換部材。
（付記４）前記波長変換部材の中央領域の厚さは５０μｍ以上１００μｍ以下、前記２つの端部の厚さは１５０μｍ以上２００μｍ以下である、付記１から３のいずれかに記載の波長変換部材。
（付記５）波長変換材料と前記波長変換材料が分散した状態を保持するバインダとを有する、付記１から４のいずれかに記載の波長変換部材。
（付記６）前記波長変換材料は蛍光体である、付記５に記載の波長変換部材。
（付記７）付記１から６のいずれかに記載の波長変換部材と、前記波長変換部材と接する放熱部材とを有する光学素子。
（付記８）前記放熱部材は前記波長変換部材の前記２つの端部に設けられている、付記７に記載の光学素子。
（付記９）前記放熱部材は前記波長変換部材の４つの端に設けられている、付記７に記載の光学素子。
（付記１０）前記放熱部材は透明材料からなり、前記放熱部材は前記波長変換部材の端面とは異なる面に接して設けられている、付記７に記載の光学素子。
（付記１１）波長変換部材と、放熱部材とを有し、
前記波長変換部材は厚さが異なる一端と他端を有し、
前記放熱部材は、前記一端よりも厚さが厚い前記他端に接して設けられている光学素子。
（付記１２）前記波長変換部材の前記一端は露出している、付記１１に記載の光学素子。
（付記１３）前記放熱部材は金属材料を含有する、付記７から１２のいずれかに記載の光学素子。
（付記１４）前記放熱部材は樹脂材料を含有する、付記７から１３のいずれかに記載の光学素子。
（付記１５）前記放熱部材に接するさらに別の放熱部材を有し、前記別の放熱部材は金属材料を含有する、付記１４に記載の光学素子。
（付記１６）前記放熱部材はヒートシンク及びヒートパイプのいずれかである、付記７から１５のいずれかに記載の光学素子。
（付記１７）前記放熱部材は、前記波長変換部材と接する面に、光を反射する反射面を有する、付記７から１６のいずれかに記載の光学素子。
（付記１８）前記波長変換部材と前記放熱部材とが接する部位の少なくともいずれか一方には、凹構造が設けられている、付記７から１７のいずれかに記載の光学素子。
（付記１９）前記波長変換部材と前記放熱部材とが接する部位の少なくともいずれか一方には、段構造が設けられている、付記７から１７のいずれかに記載の光学素子。
（付記２０）付記１から６のいずれかに記載の波長変換部材を有し、
前記波長変換部材は、第１の波長帯域の光が入射すると第２の波長帯域の光を出射する機能を有し、
さらに、第１の波長帯域の光を反射し第２の波長帯域の光を透過させる第１の波長選択フィルタを有し、
前記第１の波長選択フィルタは前記波長変換部材に対向して配置される光学素子。
（付記２１）前記第２の波長帯域の光を反射し前記第１の波長帯域の光を透過させる第２の波長選択フィルタをさらに有し、
前記第２の波長選択フィルタは、前記波長変換部材に対向し、前記第１の波長選択フィルタと前記第２の波長選択フィルタとの間に前記波長変換部材が位置するように配置される、付記２０に記載の光学素子。
（付記２２）付記１から６のいずれかに記載の波長変換部材を有し、
前記波長変換部材は、第１の波長帯域の光が入射すると第２の波長帯域の光を出射する機能を有し、
さらに、第２の波長帯域の光を反射し、第１の波長帯域の光を透過させる第２の波長選択フィルタを有し、前記第２の波長選択フィルタは、前記波長変換部材に対向して配置される光学素子。
（付記２３）付記１から６に記載の波長変換部材と、
特定方向の偏光成分の光を透過させ、前記特定方向とは異なる方向の偏光成分を反射する偏光子とを有し、
前記偏光子は前記波長変換部材に対向して配置される光学素子。
（付記２４）付記１から６のいずれかに記載の波長変換部材と、入射した光の強度分布を均一化する光学部とを有し、
前記光学部は、前記波長変換部材に対向して配置される光学素子。
（付記２５）付記１から６のいずれかに記載の波長変換部材と、前記波長変換部材に入射する光を発する光源とを有する発光装置。
（付記２６）付記７から２４のいずれかに記載の光学素子と、前記波長変換部材に入射する光を発する光源とを有する発光装置。
（付記２７）前記光源は前記波長変換部材に対向して配置される、付記２５又は２６に記載の発光装置。
（付記２８）付記２５から２７のいずれかに記載の発光装置と、前記発光装置から出射された光を投射する投射光学系とを有する投影装置。 A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.
(Additional remark 1) It is a wavelength conversion member, Comprising: The said wavelength conversion member has a center area | region where thickness differs from the at least two opposing edge part of the said wavelength conversion member, and the thickness of the said center area | region is said 2 Wavelength conversion member thinner than the thickness of one end.
(Additional remark 2) The said wavelength conversion member is a wavelength conversion member of Additional remark 1 which has a 1st hollow.
(Additional remark 3) The said wavelength conversion member is a wavelength conversion member of Additional remark 2 which has a 2nd hollow in the surface facing the surface which has a said 1st hollow.
(Additional remark 4) The wavelength conversion member in any one of Additional remark 1 to 3 whose thickness of the center area | region of the said wavelength conversion member is 50 micrometers or more and 100 micrometers or less, and whose two edge parts are 150 micrometers or more and 200 micrometers or less.
(Additional remark 5) The wavelength conversion member in any one of Additional remark 1 to 4 which has a binder which holds the state which the wavelength conversion material and the said wavelength conversion material were disperse | distributed.
(Additional remark 6) The wavelength conversion member of Additional remark 5 whose said wavelength conversion material is a fluorescent substance.
(Additional remark 7) The optical element which has the wavelength conversion member in any one of Additional remark 1 to 6, and the heat radiating member which touches the said wavelength conversion member.
(Additional remark 8) The said heat radiation member is an optical element of Additional remark 7 provided in the said 2 edge part of the said wavelength conversion member.
(Supplementary note 9) The optical element according to supplementary note 7, wherein the heat dissipation member is provided at four ends of the wavelength conversion member.
(Additional remark 10) The said heat radiating member consists of transparent materials, The said heat radiating member is an optical element of Additional remark 7 provided in contact with the surface different from the end surface of the said wavelength conversion member.
(Additional remark 11) It has a wavelength conversion member and a heat radiating member,
The wavelength conversion member has one end and another end having different thicknesses,
The heat dissipation member is an optical element provided in contact with the other end, which is thicker than the one end.
(Supplementary note 12) The optical element according to supplementary note 11, wherein the one end of the wavelength conversion member is exposed.
(Additional remark 13) The said heat radiating member is an optical element in any one of Additional remark 7 to 12 containing a metal material.
(Supplementary note 14) The optical element according to any one of supplementary notes 7 to 13, wherein the heat dissipation member contains a resin material.
(Supplementary note 15) The optical element according to supplementary note 14, further including another heat dissipation member in contact with the heat dissipation member, wherein the another heat dissipation member contains a metal material.
(Supplementary note 16) The optical element according to any one of supplementary notes 7 to 15, wherein the heat dissipation member is one of a heat sink and a heat pipe.
(Additional remark 17) The said heat radiating member is an optical element in any one of Additional remark 7 to 16 which has a reflective surface which reflects light in the surface which contact | connects the said wavelength conversion member.
(Supplementary note 18) The optical element according to any one of supplementary notes 7 to 17, wherein a concave structure is provided in at least one of the portions where the wavelength conversion member and the heat dissipation member are in contact with each other.
(Additional remark 19) The optical element in any one of additional remark 7 to 17 with which the step structure is provided in at least any one of the site | part which the said wavelength conversion member and the said heat radiating member contact.
(Supplementary note 20) The wavelength conversion member according to any one of supplementary notes 1 to 6,
The wavelength conversion member has a function of emitting light in the second wavelength band when light in the first wavelength band is incident;
And a first wavelength selection filter that reflects light in the first wavelength band and transmits light in the second wavelength band,
The first wavelength selection filter is an optical element disposed to face the wavelength conversion member.
(Additional remark 21) It further has the 2nd wavelength selection filter which reflects the light of the 2nd wavelength band, and permeate | transmits the light of the 1st wavelength band,
The second wavelength selection filter is disposed so that the wavelength conversion member faces the wavelength conversion member, and the wavelength conversion member is positioned between the first wavelength selection filter and the second wavelength selection filter. 20. The optical element according to 20.
(Supplementary note 22) The wavelength conversion member according to any one of supplementary notes 1 to 6,
The wavelength conversion member has a function of emitting light in the second wavelength band when light in the first wavelength band is incident;
Furthermore, it has a second wavelength selection filter that reflects light in the second wavelength band and transmits light in the first wavelength band, and the second wavelength selection filter faces the wavelength conversion member. Optical element to be arranged.
(Supplementary note 23) The wavelength conversion member according to supplementary notes 1 to 6,
A polarizer that transmits light of a polarization component in a specific direction and reflects a polarization component in a direction different from the specific direction;
The polarizer is an optical element arranged to face the wavelength conversion member.
(Supplementary Note 24) The wavelength conversion member according to any one of Supplementary Notes 1 to 6, and an optical unit that uniformizes the intensity distribution of incident light,
The optical unit is an optical element disposed to face the wavelength conversion member.
(Additional remark 25) The light-emitting device which has a wavelength conversion member in any one of Additional remark 1 to 6, and a light source which emits the light which injects into the said wavelength conversion member.
(Supplementary note 26) A light-emitting device including the optical element according to any one of supplementary notes 7 to 24, and a light source that emits light incident on the wavelength conversion member.
(Additional remark 27) The light source of Additional remark 25 or 26 with which the said light source is arrange | positioned facing the said wavelength conversion member.
(Additional remark 28) The projection apparatus which has the light-emitting device in any one of additional marks 25-27, and the projection optical system which projects the light radiate | emitted from the said light-emitting device.
　１１０１、１２０１ａ、１２０１ｂ、１２０１ｃ　　発光装置
　１１０２　　光源
　１０４、１０４ａ、１０４ｂ、２０４、２０４ａ、２０４ｂ、２０４ｃ、２０４ｄ、３０４、３０４ａ、３０４ｂ、４０４、５０４、６０４、７０４、８０４、９０４、１００４、１１０４　　波長変換部材
　１１０、７１０、８１０、９１０、１０１０、１１１０　　励起光
　１１１、７１１、８１１、９１１、１０１１、１１１１　　蛍光
　１１２　　蛍光
　２０５、２０５ａ、２０５ｂ、２０５ｃ、２０５ｄ、３０５、３０５ａ、３０５ｂ、４０５、５０５、５０５ａ、６０５　　放熱部材
　２０６ｄ　放熱部材
　２０８、３０８、３０８ａ、３０８ｂ、４０８、５０８、５０８ａ、６０８、７０８、８０８、９０８、１００８、１１０８　　光学素子
　５２１、５２２　　透明部材
　７２３　　波長選択フィルタ
　８２４　　波長選択フィルタ
　９２５　　偏光子
　１０２６　　光学部
　１２２７ａ、１２２７ｂ、１２２７ｃ　　液晶パネル
　１２２８　　クロスダイクロイックプリズム
　１２２９　　プロジェクタ
　１２３０　　スクリーン
　１２３１　　投射光学系 1101, 1201a, 1201b, 1201c Light emitting device 1102 Light source 104, 104a, 104b, 204, 204a, 204b, 204c, 204d, 304, 304a, 304b, 404, 504, 604, 704, 804, 904, 1004, 1104 Wavelength conversion Member 110, 710, 810, 910, 1010, 1110 Excitation light 111, 711, 811, 911, 1011, 1111 Fluorescence 112 Fluorescence 205, 205a, 205b, 205c, 205d, 305, 305a, 305b, 405, 505, 505a, 605 Heat dissipation member 206d Heat dissipation member 208, 308, 308a, 308b, 408, 508, 508a, 608, 708, 808, 908, 1008, 1108 Optical element 521, 522 Transparent member 723 Wavelength selection filter 824 Wavelength selection filter 925 Polarizer 1026 Optical unit 1227a, 1227b, 1227c Liquid crystal panel 1228 Cross dichroic prism 1229 Projector 1230 Screen 1231 Projection optical system

Claims (10)

  1. 　波長変換部材であって、
    　前記波長変換部材は、前記波長変換部材の少なくとも対向する２つの端部とは厚さが異なる中央領域を有し、
    　前記中央領域の厚さが、前記２つの端部の厚さよりも薄い波長変換部材。     A wavelength converting member,
    The wavelength conversion member has a central region having a thickness different from at least two opposing ends of the wavelength conversion member,
    The wavelength conversion member in which the thickness of the central region is thinner than the thickness of the two end portions.
  2. 　前記波長変換部材は第１の窪みを有する、請求項１に記載の波長変換部材。 The wavelength conversion member according to claim 1, wherein the wavelength conversion member has a first depression.
  3. 　前記波長変換部材は、前記第１の窪みを有する面と対向する面に第２の窪みを有する、請求項２に記載の波長変換部材。 The wavelength conversion member according to claim 2, wherein the wavelength conversion member has a second depression on a surface facing the surface having the first depression.
  4. 　請求項１から３のいずれかに記載の波長変換部材と、
    　前記波長変換部材と接する放熱部材とを有する光学素子。     The wavelength conversion member according to any one of claims 1 to 3,
    An optical element having a heat dissipation member in contact with the wavelength conversion member.
  5. 　前記放熱部材は前記波長変換部材の前記２つの端部に設けられている、請求項４に記載の光学素子。 The optical element according to claim 4, wherein the heat dissipation member is provided at the two end portions of the wavelength conversion member.
  6. 　波長変換部材と、
    　放熱部材とを有し、
    　前記波長変換部材は厚さが異なる一端と他端を有し、
    　前記放熱部材は、前記一端よりも厚さが厚い前記他端に接して設けられている光学素子。     A wavelength conversion member;
    A heat dissipating member,
    The wavelength conversion member has one end and another end having different thicknesses,
    The heat dissipation member is an optical element provided in contact with the other end, which is thicker than the one end.
  7. 　前記波長変換部材の前記一端は露出している、請求項６に記載の光学素子。 The optical element according to claim 6, wherein the one end of the wavelength conversion member is exposed.
  8. 　請求項１から３のいずれかに記載の波長変換部材と、
    　前記波長変換部材に入射する光を発する光源とを有する発光装置。     The wavelength conversion member according to any one of claims 1 to 3,
    And a light source that emits light incident on the wavelength conversion member.
  9. 　請求項４から７のいずれかに記載の光学素子と、
    　前記波長変換部材に入射する光を発する光源とを有する発光装置。     An optical element according to any one of claims 4 to 7,
    And a light source that emits light incident on the wavelength conversion member.
  10. 　請求項８又は９のいずれかに記載の発光装置と、
    　前記発光装置から出射された光を投射する投射光学系とを有する投影装置。     A light emitting device according to claim 8 or 9,
    A projection optical system that projects light emitted from the light emitting device;
PCT/JP2013/003177 2012-05-25 2013-05-20 Wavelength conversion member, optical element, light-emitting device, and projection device WO2013175752A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016092271A (en) * 2014-11-06 2016-05-23 シャープ株式会社 Phosphor sheet and lighting system
EP3731286A1 (en) * 2019-04-22 2020-10-28 Nichia Corporation Wavelength conversion part, method of manufacturing wavelength conversion part, and light emitting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303373A (en) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd Manufacturing method of light emitting device and lighting apparatus using the same
JP2007116138A (en) * 2005-09-22 2007-05-10 Lexedis Lighting Gmbh Light emitting device
WO2011024934A1 (en) * 2009-08-27 2011-03-03 京セラ株式会社 Light-emitting device
JP2012094419A (en) * 2010-10-28 2012-05-17 Nippon Electric Glass Co Ltd Wavelength conversion element, light source with it, and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303373A (en) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd Manufacturing method of light emitting device and lighting apparatus using the same
JP2007116138A (en) * 2005-09-22 2007-05-10 Lexedis Lighting Gmbh Light emitting device
WO2011024934A1 (en) * 2009-08-27 2011-03-03 京セラ株式会社 Light-emitting device
JP2012094419A (en) * 2010-10-28 2012-05-17 Nippon Electric Glass Co Ltd Wavelength conversion element, light source with it, and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016092271A (en) * 2014-11-06 2016-05-23 シャープ株式会社 Phosphor sheet and lighting system
EP3731286A1 (en) * 2019-04-22 2020-10-28 Nichia Corporation Wavelength conversion part, method of manufacturing wavelength conversion part, and light emitting device

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