JP2010139459A - Temperature test apparatus and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature test apparatus and a temperature test method capable of accurately measuring the characteristics of piezoelectric devices under preset temperatures. <P>SOLUTION: Temperature regions 4-6 are provided along the direction of transfer (the direction of the arrow B) along which a plurality of piezoelectric devices 2 are mounted to a carrier 3 and transferred. The temperature regions 4-6 are each provided with corresponding measuring parts 41, 51 and 61 and temperature adjusting parts 42, 52 and 62. The temperatures of the piezoelectric devices 2 being transferred to the temperature regions 4-6 are adjusted to each preset temperature of the temperature regions 4-6 by heat conduction from the temperature adjusting parts 42, 52 and 62 via the carrier 3 in a temperature test apparatus 1. A slit 3b passing through in a thickness direction is formed in the carrier 3 to divide a plurality of piezoelectric devices 2 into a first group 21 and a second group 22 with the slit 3b as a boundary and to measure the characteristics of the piezoelectric devices 2 under the preset temperatures by the measuring parts 41, 51 and 61 for each of the first group 21 and the second group 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a temperature test apparatus for a piezoelectric device typified by a crystal resonator and a temperature test method using the same.

Conventionally, a measurement unit has been provided to measure the characteristics of each piezoelectric device, such as a crystal resonator, at each temperature as the temperature changes. Based on the characteristics measured by this measurement unit, the characteristics of multiple piezoelectric devices As a temperature test apparatus for a piezoelectric device for testing the above, one having the following configuration is known.
It is an in-line type temperature test apparatus that measures the characteristics of a piezoelectric device while conveying the piezoelectric device in one direction in one temperature chamber, and a plurality of the temperature devices in the temperature chamber along the conveying direction of the piezoelectric device. The temperature test apparatus is configured to measure the characteristics of the piezoelectric device under different preset temperatures, each of which has a temperature region, and a plurality of temperature regions are provided with corresponding measurement units. (For example, refer to Patent Document 1).

JP 2007-120986 A

In the above temperature test apparatus, a carrier on which a plurality of piezoelectric devices are mounted is conveyed on a temperature part (hereinafter referred to as a temperature adjustment part) composed of a temperature adjustment element and a temperature sensor, and the temperature of the piezoelectric device passes through the carrier. It is the structure which reaches the preset temperature in each measurement part by the heat conduction from a temperature adjustment part.
The temperature test apparatus includes a standby unit that preheats or cools the plurality of piezoelectric devices in each measurement unit so as to quickly reach the set temperature of each measurement unit without causing variations in the temperature of the plurality of piezoelectric devices. Adjacent to each other.
Since the standby unit is provided, the temperature test apparatus has a problem that the whole apparatus becomes large and a preheating process or a precooling process is required, and the temperature test process increases.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] In the temperature test apparatus according to this application example, a plurality of temperature regions are provided along a transport direction in which a plurality of piezoelectric devices are mounted on a carrier and transported.
Each of the temperature regions has a measurement unit and a temperature adjustment unit corresponding to each temperature, and the temperature of the piezoelectric device conveyed to each temperature region is set by the heat conduction from the temperature adjustment unit via the carrier. A temperature test apparatus that adjusts to a temperature, wherein the carrier has at least one notch or notch penetrating in a thickness direction, and a plurality of the piezoelectric devices are formed with the notch or notch as a boundary. It is divided into a plurality of groups, and the characteristics of the piezoelectric device under the set temperature are measured by the measurement unit for each of the groups.

According to this, the temperature test apparatus is provided with a plurality of temperature regions along the transport direction in which the plurality of piezoelectric devices are mounted on the carrier and transported, and the plurality of temperature regions include a measurement unit and a temperature corresponding to each. It has an adjustment part.
In the temperature test apparatus, the temperature of the piezoelectric device conveyed to each temperature region is adjusted to the set temperature of each temperature region by heat conduction from the temperature adjustment unit via the carrier.
In the temperature test apparatus, at least one notch or notch penetrating in the thickness direction is formed in the carrier, and a plurality of piezoelectric devices are divided into a plurality of groups with the notch or notch as a boundary. Are measured.

Thus, in the temperature test apparatus, the carrier is thermally separated into a plurality of regions with the notch or notch as a boundary, so that the heat capacity is also divided for each region. For this reason, in the temperature test apparatus, the heat capacity of each region of the carrier is smaller than that in the case of a carrier having no cut or notch.
From this, when the temperature test apparatus adjusts the temperature of the piezoelectric device in each temperature region to the set temperature of each temperature region by heat conduction from the temperature adjustment unit via the carrier, Compared to the case of using a carrier without a notch, the carrier can reach the set temperature faster.
As a result, the temperature test apparatus does not require a standby unit as in the prior art, so that the entire apparatus can be miniaturized and the preheating or precooling process can be reduced.

In addition, the temperature test apparatus has a carrier that is thermally separated into a plurality of regions by cutting or notching, and the heat capacity of each region is reduced. The temperature variation within the group of the piezoelectric devices divided into groups can be reduced.
Thereby, the temperature test apparatus can measure the characteristics of the piezoelectric device under the set temperature more accurately.

[Application Example 2] The temperature test method according to this application example uses the temperature test apparatus according to Application Example 1, and the plurality of piezoelectric devices are connected to the plurality of the piezoelectric devices with the notch or the notch as a boundary. It divides | segments into a group, The characteristic of the said piezoelectric device under the said setting temperature is measured by the said measurement part for every said group, It is characterized by the above-mentioned.

According to this, the temperature test method divides a plurality of piezoelectric devices into a plurality of groups with a carrier notch or notch as a boundary, and measures the characteristics of the piezoelectric devices at a set temperature for each group.
From this, in the temperature test method, the carrier is thermally separated into a plurality of regions by cutting or notching, and the heat capacity of each region is reduced, so that heat conduction to each region is performed efficiently and sufficiently, The temperature variation within the group of the piezoelectric devices divided into a plurality of groups is reduced.
Thereby, the temperature test method can measure the characteristics of the piezoelectric device under the set temperature more accurately.

Hereinafter, embodiments of a temperature test apparatus and a temperature test method will be described with reference to the drawings.
(Embodiment)
FIG. 1 is a schematic diagram showing a schematic configuration of a main part of the temperature test apparatus of the present embodiment. FIG.
FIG. 1B is a front view, and FIG. 1B is a view as viewed from A in FIG.

As shown in FIG. 1, the temperature test apparatus 1 includes a plurality of piezoelectric devices 2 mounted on a carrier 3 as a plurality of temperature regions along a transport direction (arrow B direction) transported by a transport unit (not shown). The first temperature region 4, the second temperature region 5, and the third temperature region 6 are provided adjacent to each other.
The temperature test apparatus 1 includes a first measurement unit 41, a second measurement unit 51, and a third measurement unit as measurement units corresponding to the first temperature region 4, the second temperature region 5, and the third temperature region 6, respectively. 61, a first temperature adjustment unit 42 as a temperature adjustment unit, a second temperature adjustment unit 52, and a third temperature adjustment unit 62.
The temperature test apparatus 1 is configured such that the temperature of the piezoelectric device 2 conveyed in order to the first temperature region 4, the second temperature region 5, and the third temperature region 6 (hereinafter also referred to as temperature regions 4, 5, 6). , Each temperature region by heat conduction from the first temperature adjustment unit 42, the second temperature adjustment unit 52, and the third temperature adjustment unit 62 (hereinafter also referred to as each temperature adjustment unit 42, 52, 62) via the carrier 3. The set temperature is adjusted to 4, 5, and 6.

In the present embodiment, the set temperature of the first temperature region 4 is −20 ° C., the set temperature of the second temperature region 5 is + 25 ° C., and the set temperature of the third temperature region 6 is + 75 ° C.

The first measuring unit 41, the second measuring unit 51, and the third measuring unit 61 (hereinafter also referred to as each measuring unit 41, 51, 61) in each temperature region 4, 5, 6 position the carrier 3 that has been transported. Positioning pins 43, 53, and 63, and electrodes 2a and 2b of the piezoelectric device 2 mounted on the carrier 3
Probe pins 44, 54, and 64 are provided.
Two positioning pins 43, 53, and 63 are provided in each of the measurement units 41, 51, 61 (the first measurement unit 41 has the positioning pin 43, the second measurement unit 51 has the positioning pin 53, and the third measurement unit has 61 is provided with positioning pins 63.)
Then, the positioning pins 43, 53, 63 are inserted into the positioning holes 3a of the carrier 3 to be described later when the measuring portions 41, 51, 61 descend along the arrow C direction when measuring the characteristics of the piezoelectric device 2. Is done. In addition, it is preferable that the front-end | tip part of the positioning pins 43, 53, and 63 is formed in cone shape.

The probe pins 44, 54, and 64 are provided at positions facing the electrodes 2a and 2b of the piezoelectric devices 2 in the right column of FIG. 1B. In this embodiment, the probe pins 44 and 5
4 and 64 are provided in each measuring unit 41, 51, 61 as one set, four sets (first measuring unit 4
1 includes a probe pin 44, a second measurement unit 51 includes a probe pin 54, and a third measurement unit 61 includes a probe pin 64. )
The probe pins 44, 54, 64 are connected to the measuring units 41, 5 when measuring the characteristics of the piezoelectric device 2.
1, 61 descends in the direction of arrow C, so that the electrodes 2a, 2b of each piezoelectric device 2
Abut.

The temperature adjustment units 42, 52, 62 in the temperature regions 4, 5, 6 are respectively connected to the measurement units 41, 51, 61.
Are arranged to face the corresponding measurement units 41, 51, 61 respectively. Each of the temperature adjustment units 42, 52, 62 includes a Peltier element and a temperature sensor. And each temperature adjustment part 42,52,62 is controlled so that it may become the said setting temperature by heating or cooling.
Thereby, the temperature of each piezoelectric device 2 that has been transported onto each temperature adjustment unit 42, 52, 62 reaches the temperature of each temperature adjustment unit 42, 52, 62 by heat conduction through the carrier 3. Adjusted.

The carrier 3 is formed in a substantially rectangular flat plate shape using a metal such as aluminum or an aluminum alloy. The carrier 3 has a positioning hole 3a as described above and 1 that penetrates in the thickness direction.
Two notches 3b and a plurality of recesses 3c for accommodating each piezoelectric device 2 are formed.
As shown in FIG. 1B, in the carrier 3, the piezoelectric devices 2 housed in the recesses 3c are arranged in the extending direction of the cuts 3b with the cuts 3b formed along the outer peripheral side 3d as a boundary. The two groups 22 are divided into four groups 1 each having four vertical columns on the right side and two groups 22 each having four vertical columns on the left side of the sheet.

The carrier 3 has a positioning hole 3a in a first region 31 where the piezoelectric devices 2 of the first group 21 are arranged and a second region 32 where the piezoelectric devices 2 of the second group 22 are arranged.
Two each are formed.
Thereby, the temperature test apparatus 1 can measure the frequency as the characteristic of each piezoelectric device 2 under each set temperature by each measurement unit 41, 51, 61 for each of the first group 21 and the second group 22.
The surface of the carrier 3 may be coated with an insulating resin such as fluorine. According to this, the temperature test apparatus 1 can avoid a short circuit through the carrier 3 of each piezoelectric device 2 accommodated, and the carrier 3 can be transported smoothly.

Here, a temperature test method (hereinafter also simply referred to as a temperature test method) for measuring the frequency of each piezoelectric device 2 at each set temperature using the temperature test apparatus 1 will be described.
First, the carrier 3 in which four piezoelectric devices 2 are mounted as the first group 21 in the first region 31 and four groups 2 as the second group 22 in the second region 32 is first adjusted in the first temperature region 4 by the transport unit. Part 4
2 is conveyed.
Next, the positioning hole 3 a in the first region 31 of the carrier 3 is connected to the first measuring unit 4.
1 is placed at a position facing the positioning pin 43.

Next, the first measurement unit 41 is lowered along the direction of arrow C by a support unit (not shown), and the positioning pin 43 is inserted into the positioning hole 3 a of the first region 31 of the carrier 3 to position the carrier 3. At this time, since the tip of the positioning pin 43 is formed in a conical shape,
The carrier 3 is positioned without being displaced in the plane direction by the contact between the inclined surface of the distal end portion of the positioning pin 43 and the positioning hole 3a.

Next, the first measuring unit 41 is further lowered along the direction of arrow C, and the electrodes 2 a and 2 b of the four piezoelectric devices 2 in the group 21 in which the probe pins 44 are mounted in the first region 31 of the carrier 3.
Abut. Note that the positioning pin 43 and the probe pin 44 are preferably provided with an elastic member such as a spring that absorbs the overstroke during the lowering (the amount further lowering from the contact position).

Next, the first measurement unit 41 causes the four piezoelectric devices 2 in the first group 21 at −20 ° C.
Measure the frequencies at once.
At this time, the 1st temperature adjustment part 42 is controlled by -20 degreeC which is preset temperature. The carrier 3 on the first temperature adjustment unit 42 is separated from the first region 31 and the second region with the notch 3b as a boundary.
The region 32 is thermally separated. Thereby, the carrier 3 also has a heat capacity in the first region 31.
And the second area 32.

From this, the carrier 3 has a conventional carrier in which the heat capacity of the first region 31 and the second region 32 is integrated with the first region 31 and the second region 32 without the notch 3b (hereinafter simply referred to as the conventional carrier). Compared to the case of the carrier)).
As a result, the four piezoelectric devices 2 in the first group 21 mounted on the first region 31 of the carrier 3.
Since the heat conduction from the first temperature adjusting unit 42 through the carrier 3 is efficiently and sufficiently performed, the temperature of the temperature reaches the set temperature of −20 ° C. much faster than when mounted on a conventional carrier. . Therefore, the temperature test method can shorten the waiting time until the measurement of the frequency of the four piezoelectric devices 2 in the first group 21 at −20 ° C. is started.

In addition, the variation in the temperature reached among the four piezoelectric devices 2 in the first group 21 is reduced more than when it is mounted on a conventional carrier because heat conduction is performed efficiently and sufficiently.
Thereby, the temperature test method can measure the frequency of the four piezoelectric devices 2 in the first group 21 under −20 ° C. more accurately than when a conventional carrier is used.

Next, after measuring the frequencies of the four piezoelectric devices 2 in the first group 21, the first measuring unit 41 is raised along the arrow C direction by the support unit, and the positioning pin 43 and the probe pin 44 are moved above the carrier 3. Let
Next, the carrier 3 is conveyed in the direction of arrow B, and the positioning hole 3 in the second region 32 of the carrier 3 is transferred.
a is placed at a position facing the positioning pin 43 of the first measurement unit 41.

Next, the first measuring unit 41 is lowered along the direction of arrow C, and the positioning pin 43 is inserted into the positioning hole 3 a of the second region 32 of the carrier 3 to position the carrier 3.
Next, the first measuring unit 41 is further lowered along the direction of arrow C, and the electrodes 2 a and 2 b of the four piezoelectric devices 2 in the second group 22 in which the probe pins 44 are mounted in the second region 32 of the carrier 3.
Abut.

Next, the four piezoelectric devices 2 in the second group 22 at −20 ° C. by the first measuring unit 41.
Measure the frequencies at once.
At this time, the temperature of the four piezoelectric devices 2 in the second group 22 mounted in the second region 32 of the carrier 3 is the same as that of the four piezoelectric devices 2 in the first group 21 mounted in the first region 31. Since heat conduction from the first temperature adjustment unit 42 via the carrier 3 is efficiently and sufficiently performed, the temperature reaches the set temperature of −20 ° C. much faster than when mounted on a conventional carrier. Therefore, the temperature test method can shorten the waiting time until the measurement of the frequency of the four piezoelectric devices 2 in the second group 22 at −20 ° C. is started.

In addition, the variation in the reached temperature between the four piezoelectric devices 2 in the second group 22 is the first region 3.
As in the case of the four piezoelectric devices 2 in the first group 21 mounted on 1, the heat conduction is performed efficiently and sufficiently, so that it is reduced as compared with the case where it is mounted on a conventional carrier.
Thereby, this temperature test method can measure the frequency of the four piezoelectric devices 2 of the 2nd group 22 under -20 degreeC more correctly than the case where the conventional carrier is used.

Next, after measuring the frequencies of the four piezoelectric devices 2 in the second group 22, the first measurement unit 41 is moved to the arrow C.
The positioning pin 43 and the probe pin 44 are moved above the carrier 3 by being raised along the direction.
Since the frequency measurement of the piezoelectric device 2 in the subsequent second temperature region 5 and the third temperature region 6 has many common parts with the measurement in the first temperature region 4, the common parts will be described in a simplified manner. .

Next, the carrier 3 is transported onto the second temperature adjustment unit 52 in the second temperature region 5.
Next, the positioning hole 3 a in the first region 31 of the carrier 3 is connected to the second measuring unit 5.
1 is placed at a position facing the positioning pin 53.

Next, the second measuring unit 51 is lowered, and the positioning pin 53 is inserted into the positioning hole 3 a of the first region 31 of the carrier 3 to position the carrier 3.
Next, the second measurement unit 51 is further lowered, and the probe pins 54 are brought into contact with the electrodes 2 a and 2 b of the piezoelectric devices 2 in the first group 21 mounted on the first region 31 of the carrier 3.

Next, the frequency of each piezoelectric device 2 of the first group 21 at + 25 ° C. is collectively measured by the second measuring unit 51.
At this time, the 2nd temperature adjustment part 52 is controlled to +25 degreeC which is preset temperature. Similarly to the case of the first temperature region 4 described above, the temperature of each piezoelectric device 2 of the first group 21 mounted on the first region 31 of the carrier 3 is changed from the second temperature adjustment unit 52 via the carrier 3. Therefore, the temperature reaches the set temperature of + 25 ° C. very quickly. Therefore, the temperature test method can shorten the waiting time until the measurement of the frequency of each piezoelectric device 2 in the first group 21 at + 25 ° C. is started.

Moreover, the temperature test method also reduces the variation in the temperature reached between the piezoelectric devices 2 in the first group 21.
Thereby, the temperature test method can measure the frequency of each piezoelectric device 2 of the first group 21 under + 25 ° C. more accurately.

Next, after measuring the frequency of each piezoelectric device 2 in the first group 21, the second measurement unit 51 is raised,
The positioning pin 53 and the probe pin 54 are moved above the carrier 3.
Next, the carrier 3 is conveyed in the direction of arrow B, and the positioning hole 3 in the second region 32 of the carrier 3 is transferred.
a is placed at a position facing the positioning pin 53 of the second measurement unit 51.

Next, the second measuring unit 51 is lowered, and the positioning pin 53 is inserted into the positioning hole 3 a of the second region 32 of the carrier 3 to position the carrier 3.
Next, the second measurement unit 51 is further lowered, and the probe pins 54 are brought into contact with the electrodes 2 a and 2 b of the piezoelectric devices 2 in the second group 22 mounted on the second region 32 of the carrier 3.

Next, the frequency of each piezoelectric device 2 of the second group 22 at + 25 ° C. is collectively measured by the second measuring unit 51.
At this time, the temperature of each of the piezoelectric devices 2 of the second group 22 mounted on the second region 32 of the carrier 3 is efficiently and sufficiently conducted from the second temperature adjusting unit 52 via the carrier 3. The temperature reaches + 25 ° C. very quickly. Therefore, the temperature test method is +25
The waiting time until the measurement of the frequency of each piezoelectric device 2 in the second group 22 at 0 ° C. can be shortened.

In addition, the temperature test method also reduces the variation in the ultimate temperature between the piezoelectric devices 2 in the second group 22.
Thereby, the temperature test method can measure the frequency of each piezoelectric device 2 in the second group 22 at + 25 ° C. more accurately.

Next, after measuring the frequency of each piezoelectric device 2 in the second group 22, the second measuring unit 51 is raised,
The positioning pin 53 and the probe pin 54 are moved above the carrier 3.
Next, the carrier 3 is transported onto the third temperature adjustment unit 62 in the third temperature region 6.
Next, the positioning hole 3 a in the first region 31 of the carrier 3 is connected to the third measuring unit 6.
1 is placed at a position facing the positioning pin 63.

Next, the third measuring unit 61 is lowered, and the positioning pin 63 is inserted into the positioning hole 3 a of the first region 31 of the carrier 3 to position the carrier 3.
Next, the third measurement unit 61 is further lowered, and the probe pin 64 is brought into contact with the electrodes 2 a and 2 b of the piezoelectric devices 2 in the first group 21 mounted in the first region 31 of the carrier 3.

Next, the frequency of each piezoelectric device 2 of the first group 21 at + 75 ° C. is collectively measured by the third measuring unit 61.
At this time, the 3rd temperature adjustment part 62 is controlled by +75 degreeC which is preset temperature. Similarly to the case of the first temperature region 4 described above, the temperature of each piezoelectric device 2 in the first group 21 mounted on the first region 31 of the carrier 3 is changed from the third temperature adjustment unit 62 via the carrier 3. Therefore, the temperature reaches the set temperature of + 75 ° C. very quickly. Therefore, the temperature test method can shorten the waiting time until the measurement of the frequency of each piezoelectric device 2 in the first group 21 at + 75 ° C. is started.

Moreover, the temperature test method also reduces the variation in the temperature reached between the piezoelectric devices 2 in the first group 21.
Thereby, the temperature test method can measure the frequency of each piezoelectric device 2 of the first group 21 under + 75 ° C. more accurately.

Next, after measuring the frequency of each piezoelectric device 2 in the first group 21, the third measuring unit 61 is raised,
The positioning pin 63 and the probe pin 64 are moved above the carrier 3.
Next, the carrier 3 is conveyed in the direction of arrow B, and the positioning hole 3 in the second region 32 of the carrier 3 is transferred.
a is placed at a position facing the positioning pin 63 of the third measurement unit 61.

Next, the third measuring unit 61 is lowered, and the positioning pin 63 is inserted into the positioning hole 3 a of the second region 32 of the carrier 3 to position the carrier 3.
Next, the third measuring unit 61 is further lowered, and the probe pin 64 is brought into contact with the electrodes 2 a and 2 b of the piezoelectric devices 2 of the second group 22 mounted on the second region 32 of the carrier 3.

Next, the third measuring unit 61 measures the frequencies of the piezoelectric devices 2 in the second group 22 at + 75 ° C. collectively.
At this time, the temperature of each piezoelectric device 2 of the second group 22 mounted on the second region 32 of the carrier 3 is efficiently and sufficiently conducted from the third temperature adjustment unit 62 via the carrier 3. The set temperature reaches + 75 ° C. very quickly. Therefore, the temperature test method is +75.
The waiting time until the measurement of the frequency of each piezoelectric device 2 in the second group 22 at 0 ° C. can be shortened.

In addition, the temperature test method also reduces the variation in the ultimate temperature between the piezoelectric devices 2 in the second group 22.
Thereby, the temperature test method can measure the frequency of each of the piezoelectric devices 2 in the second group 22 at + 75 ° C. more accurately.

Next, after measuring the frequency of each piezoelectric device 2 in the second group 22, the third measuring unit 61 is raised,
The positioning pin 63 and the probe pin 64 are moved above the carrier 3.
Next, the carrier 3 is transported in the direction of the arrow B, and the four piezoelectric devices 2 in the first group 21 and the second group 22 that have been measured are moved to the next process. Thereafter, the temperature test method repeats this series of operations.

Here, at each set temperature (−20 ° C., + 25 ° C., + 75 ° C.), the frequency measurement result of the piezoelectric device 2 measured by the temperature test apparatus 1 including the carrier 3 of the present embodiment and the conventional carrier were provided. The frequency measurement result of the piezoelectric device 2 measured by the temperature test apparatus will be compared. Both temperature test apparatuses have a common specification except for the carrier.

FIG. 2 is a graph comparing the frequency measurement result of the piezoelectric device measured by the temperature test apparatus of the present embodiment and the frequency measurement result of the piezoelectric device measured by the conventional temperature test apparatus.
2 (a) and 2 (c) are graphs of the frequency measurement result of the piezoelectric device measured by the conventional temperature test apparatus, and FIG. 2 (b) is the piezoelectric measured by the temperature test apparatus of the present embodiment. It is a graph of the frequency measurement result of a device.

In each graph, the vertical axis represents the shift amount with respect to the reference frequency, and the horizontal axis represents each piezoelectric device 2. In addition, the piezoelectric device 2 includes four groups in one group 21 as one group, and 10 groups (40
Were measured with both temperature test devices. In addition, the waiting time until the start of measurement at each set temperature was 5.5 seconds in FIGS. 2 (a) and 2 (b), and 20 seconds as reference data in FIG. 2 (c).

As shown in FIG. 2B, the variation in the frequency measurement data of each piezoelectric device 2 measured by the temperature test apparatus 1 of the present embodiment is within a range of ± 2.5. On the other hand, as shown in FIG. 2A, the variation of the frequency measurement data of each piezoelectric device 2 measured by the conventional temperature test apparatus is in a range of about ± 5.0.
From this result, it can be seen that the variation in the frequency measurement data of each piezoelectric device 2 is smaller in the temperature test apparatus 1 of the present embodiment.

Further, as shown in FIG. 2 (c), in the conventional temperature test apparatus, by extending the waiting time until the measurement is started from 5.5 seconds to 20 seconds, the variation of the frequency measurement data of each piezoelectric device 2 is increased. It decreases, and is in the range of about ± 2.5.
That is, in the conventional temperature test apparatus, the waiting time until the measurement starts at each set temperature is considerably longer (in this case, about 15 seconds) than the waiting time until the measurement starts in the temperature test apparatus 1 of the present embodiment. I know I have to do it.

From this comparison result, it can be said that the operation and effect of the temperature test apparatus 1 of the present embodiment and the temperature test method of each piezoelectric device 2 using the temperature test apparatus 1 are supported.

As described above, in the temperature test apparatus 1 of the present embodiment, the carrier 3 is thermally separated into the first region 31 and the second region 32 with the notch 3b as a boundary. Thus, in the temperature test apparatus 1, the carrier 3 is also divided into the first region 31 and the second region 32 in terms of heat capacity.

Therefore, in the temperature test apparatus 1, the heat capacity of the first region 31 and the second region 32 of the carrier 3 is such that the first region 31 and the second region 32 without the notch 3 b of the conventional temperature test device are integrated. Compared to the carriers that have become smaller.
As a result, the temperature test apparatus 1 efficiently and sufficiently conducts heat from each of the temperature adjustment units 42, 52, and 62 through the carrier 3, so that the first region 31 and the second region 32 of the carrier 3 The temperature of each of the four piezoelectric devices 2 in the mounted first group 21 and second group 22 reaches each set temperature much faster than when mounted on a conventional carrier.

Therefore, the temperature test apparatus 1 can significantly shorten the waiting time until the measurement of the frequency of each piezoelectric device 2 under each set temperature.
As a result, the temperature test apparatus 1 eliminates the need for the standby unit provided in the conventional temperature test apparatus, thereby reducing the size of the entire apparatus and reducing the steps of preheating or precooling in the temperature test method. .

In addition, the temperature test apparatus 1 is mounted in the first region 31 and the second region 32 of the carrier 3 because the heat conduction from each of the temperature adjustment units 42, 52, 62 through the carrier 3 is efficiently and sufficiently performed. The variation in the reached temperature between each of the four piezoelectric devices 2 in the first group 21 and the second group 22 can be reduced as compared with the case where it is mounted on the carrier of the conventional temperature test apparatus.
Thereby, the temperature test apparatus 1 calculates the frequency of each piezoelectric device 2 under each set temperature.
Compared with the conventional temperature test apparatus, it can measure more accurately.

The carrier 3 is formed with one notch 3b, but the present invention is not limited to this, and a plurality of notches or notches are formed as shown in a schematic diagram showing a variation of the carrier in FIG. It may be. In FIG. 3, for the sake of convenience, the recess for housing the piezoelectric device and the electrodes of the piezoelectric device are omitted.

As shown in FIG. 3 (a), the carrier 3 has 1 along the side 3d instead of the notch 3b.
Two notches 3e may be formed. According to this, in the temperature test apparatus 1, since the carrier 3 is separated by the notch 3e, the first region 31 and the second region 32 are more thermally separated. Heat conduction from the temperature adjustment units 42, 52, 62 to each of the four piezoelectric devices 2 in the first group 21, the second group 22 is performed more efficiently and sufficiently.
From this, the temperature test apparatus 1 is configured so that the temperature of each of the four piezoelectric devices 2 in the first group 21 and the second group 22 mounted in the first region 31 and the second region 32 of the carrier 3 is faster than each set temperature. To reach.

As shown in FIG. 3 (b), the carrier 3 is connected to both ends in the extending direction of the notch 3b,
Cuts 3f and 3g may be formed that connect the positioning hole 3a of the first region 31 and the positioning hole 3a of the second region 32 and extend in a direction intersecting the extending direction of the cut 3b.
According to this, since the first region 31 and the second region 32 of the carrier 3 are more thermally separated by the cuts 3b, 3f, 3g, Heat conduction from the temperature adjustment units 42, 52, 62 to each of the four piezoelectric devices 2 in the first group 21, the second group 22 is performed more efficiently and sufficiently.
Further, in the temperature test apparatus 1, the positioning hole 3a also serves as a part of the cuts 3f and 3g, so that the space efficiency of the carrier 3 is improved.

As shown in FIG. 3C, the carrier 3 may be formed with two cuts 3b substantially parallel to each other after the carrier 3 extends in the left-right direction on the paper surface. According to this, since the carrier 3 is thermally separated into three of the third region 33 in addition to the first region 31 and the second region 32, the temperature test apparatus 1 can Heat conduction from the temperature adjustment units 42, 52, 62 to each of the four piezoelectric devices 2 of the first group 21, the second group 22, the third group 23 is performed efficiently and sufficiently.
In addition, the temperature test apparatus 1 is configured such that the heat conduction time to each of the four piezoelectric devices 2 in the third group 23 through the carrier 3 until the frequency is measured is four piezoelectric devices in each of the first group 21 and the second group 22. 2 is longer than the heat conduction time to 2, the variation in ultimate temperature between each of the four piezoelectric devices 2 in the third group 23 is more than the variation between the four piezoelectric devices 2 in the first group 21 and the second group 22. Can be reduced.

In the above-described embodiment, each piezoelectric device 2 is mounted on the carrier 3 along the extending direction of the cut 3b. However, the present invention is not limited to this, and the direction intersects with the extending direction of the cut 3b. Each piezoelectric device 2 may be mounted. In this case, the arrangement direction of the probe pins 44, 54, 64 of the measuring units 41, 51, 61 is also the piezoelectric device 2
It is changed according to the array direction.

The number of piezoelectric devices 2 mounted on the carrier 3 is not limited to four per group, and may be two, three, five to eight, for example.
The piezoelectric device can be applied to a crystal oscillator, a crystal resonator, a crystal filter, a SAW resonator, a SAW filter, and the like.

In addition, the conveyance direction (arrow B direction) in FIG.1 (b) may be circular arc shape, and each temperature area | region 4,5,6 may be provided along this circular arc.
Further, the plurality of temperature regions are not limited to three in the present embodiment, for example, four,
Two or more such as five may be used. Further, the set temperatures of the temperature regions 4, 5, 6 may be set as appropriate according to the type of the piezoelectric device 2 and the like.
In the temperature test apparatus 1, a part of the transport unit may be arranged between each temperature adjustment unit 42, 52, 62 and the carrier 3.

The schematic diagram which shows schematic structure of the principal part of the temperature test apparatus of this embodiment. The graph which compared the frequency measurement result of the piezoelectric device measured with the temperature test apparatus of this embodiment, and the frequency measurement result of the piezoelectric device measured with the conventional temperature test apparatus. The schematic diagram which shows the variation of a carrier.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Temperature test apparatus, 2 ... Piezoelectric device, 2a, 2b ... Electrode, 21 ... 1 group, 22 ... 2 group,
3 ... carrier, 3a ... positioning hole, 3b ... notch, 3c ... recess, 3d ... side, 31 ... first
Region 32... Second region 4... First temperature region 5. Second temperature region 6. Third temperature region 41
... 1st measurement part, 51 ... 2nd measurement part, 61 ... 3rd measurement part, 42 ... 1st temperature adjustment part, 52 ... 2nd temperature adjustment part, 62 ... 3rd temperature adjustment part, 43, 53, 63 ... Locating pins, 44, 54,
64: Probe pin.

Claims (2)

A plurality of temperature regions are provided along a transport direction in which a plurality of piezoelectric devices are mounted on a carrier and transported, and each of the plurality of temperature regions has a corresponding measurement unit and temperature adjustment unit, and each of the temperature A temperature test apparatus in which the temperature of the piezoelectric device conveyed to a region is adjusted to a set temperature of each temperature region by heat conduction from the temperature adjustment unit via the carrier,
The carrier is formed with at least one notch or notch penetrating in the thickness direction, and a plurality of the piezoelectric devices are divided into a plurality of groups with the notch or the notch serving as a boundary. A temperature test apparatus, wherein a characteristic of the piezoelectric device under the set temperature is measured by a measurement unit. The temperature test apparatus according to claim 1, wherein a plurality of the piezoelectric devices are divided into a plurality of the groups with the notch or the notch of the carrier as a boundary, and the setting is performed by the measurement unit for each of the groups. A temperature test method characterized by measuring characteristics of the piezoelectric device under temperature.

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