JP5195349B2 - Temperature characteristic measuring device - Google Patents

Description

  The present invention relates to a temperature characteristic measuring apparatus used for measuring a temperature characteristic of a piezoelectric device typified by a crystal resonator or the like.

  Conventionally, in order to avoid temperature changes of piezoelectric parts such as crystal resonators (hereinafter referred to as piezoelectric devices) during temperature characteristic measurement, the frequency deviation from the desired frequency depends on the temperature in the furnace chamber atmosphere in which the temperature is variable. In the frequency measuring apparatus for measuring the frequency, the frequency measuring apparatus (hereinafter referred to as the temperature characteristic measuring apparatus) is characterized in that the measuring circuit and the measuring probe are controlled to a temperature close to the measuring temperature as a measuring system for measuring the frequency of the piezoelectric device Is known (see, for example, Patent Document 1).

JP 2006-126052 A

As a specific measure for controlling the temperature of the above-mentioned measurement probe to a temperature close to the measurement temperature, a measurement probe head as shown in a schematic perspective view showing a schematic configuration of a main part of the conventional temperature characteristic measuring device in FIG. The configuration of the part is used.
As shown in FIG. 4, the measurement probe head unit 102 of the conventional temperature characteristic measurement apparatus 101 can measure a plurality of piezoelectric devices 103 in a lump, and the measurement probe unit 106 provided with a plurality of measurement probe pins 105. It has.
The measurement probe head unit 102 has a heat source that supports the measurement probe unit 106 and supports a plurality of positioning pins 109 that position the carrier 104 on which the plurality of piezoelectric devices 103 are mounted. And a temperature adjusting unit that adjusts the temperature of the plurality of measurement probe pins 105 to a predetermined temperature by contacting the support unit 107 by heat conduction.

However, in the conventional measurement probe head unit 102, since the support unit 107 supports the measurement probe unit 106 and the plurality of positioning pins 109, the size of the support unit 107 is relatively large with respect to the measurement probe unit 106. Become.
As a result, in the conventional measurement probe head unit 102, since the heat capacity of the support unit 107 is increased, the temperature of each measurement probe pin 105 due to heat conduction from the temperature adjustment unit 108 via the support unit 107 is a predetermined temperature. It takes a considerable amount of time to become.
For this reason, the temperature characteristic measuring apparatus 101 has a problem that the tact time of the frequency measurement of the piezoelectric device 103 becomes long.

Moreover, since the heat capacity of the support part 107 becomes large in the temperature characteristic measuring apparatus 101, the heat conduction from the support part 107 to the measurement probe part 106 becomes insufficient, and the temperature difference between each measurement probe pin 105 becomes large.
As a result, the temperature characteristic measuring apparatus 101 has a non-uniform temperature reached by each piezoelectric device 103 due to heat conduction from each measurement probe pin 105, so that the frequency measurement results vary, and each piezoelectric device 103 at a predetermined temperature has a different temperature. There is a problem that it is difficult to accurately measure the frequency.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A temperature characteristic measuring apparatus according to this application example surrounds a measurement probe unit provided with a plurality of measurement probe pins, and surrounds the measurement probe unit in plan view, and supports the measurement probe unit. A temperature adjustment unit that has a measurement probe unit support unit and a heat source and adjusts the temperature of the plurality of measurement probe pins to a predetermined temperature by thermal conduction through the measurement probe unit support unit in contact with the measurement probe unit support unit And a measurement probe head unit including a positioning pin that positions a carrier on which the piezoelectric device to be measured is mounted with respect to the measurement probe unit, and a positioning pin support unit that supports the positioning pin, and the measurement The measurement probe part support part of the probe head part and the positioning pin support part are formed separately.

According to this, in the temperature characteristic measuring apparatus, since the measurement probe unit support part and the positioning pin support part are formed separately, the size of the measurement probe part support part is smaller than the size of the conventional support part. it can.
As a result, the temperature characteristic measuring apparatus reduces the heat capacity of the measurement probe unit support part until the temperature of each measurement probe pin of the measurement probe part due to heat conduction from the measurement probe part support part reaches a predetermined temperature. Time is shortened compared with the case where the conventional measurement probe part support part and the positioning pin support part are integrated.
From this, the temperature characteristic measuring apparatus can shorten the tact time of the frequency measurement of the piezoelectric device at a predetermined temperature.

Moreover, since the heat capacity of the measurement probe part support part becomes small in the temperature characteristic measurement device, heat conduction from the measurement probe part support part to the measurement probe part is sufficiently performed, and the temperature difference between each measurement probe pin can be reduced. .
As a result, the temperature characteristic measuring apparatus can measure the frequency of each piezoelectric device at a predetermined temperature more accurately because the temperature reached by each piezoelectric device due to heat conduction from each measurement probe pin becomes substantially uniform. it can.

  Application Example 2 In the temperature characteristic measurement apparatus according to the application example, the positioning pin support portion is in contact with the measurement probe support portion, and the thermal conductivity of the positioning pin support portion is equal to the measurement probe support portion. It is preferable that the thermal conductivity is lower.

According to this, in the temperature characteristic measuring apparatus, the positioning pin support part is in contact with the measurement probe part support part, and the thermal conductivity of the positioning pin support part is lower than the thermal conductivity of the measurement probe part support part.
From this, the temperature characteristic measuring apparatus is a case where the positioning pin support part and the measurement probe part support part are separated while suppressing heat conduction due to contact between the measurement probe part support part and the positioning pin support part. In comparison, the size of the measurement probe head can be reduced.

  Application Example 3 In the temperature characteristic measuring apparatus according to the application example, it is preferable that the temperature adjustment unit is in contact with a side surface of the measurement probe unit support unit along the extending direction of the measurement probe pin.

According to this, in the temperature characteristic measuring apparatus, the temperature adjustment unit is in contact with the side surface of the measurement probe unit support unit along the extending direction of the measurement probe pin. Therefore, in the temperature characteristic measuring apparatus, compared with the case where the temperature adjustment unit is in contact with the upper surface of the measurement probe unit support unit that intersects the extending direction of the measurement probe pin, for example, the temperature adjustment unit It is not necessary to provide a space necessary for the arrangement on the upper surface.
Thereby, the temperature characteristic measuring apparatus can make the said upper surface size of a measurement probe part support part smaller.

Hereinafter, embodiments of a temperature characteristic measuring apparatus will be described with reference to the drawings.
(Embodiment)
FIG. 1 is a schematic perspective view showing a schematic configuration of a main part of the temperature characteristic measuring apparatus of the present embodiment. FIG. 2 is a schematic cross-sectional view of FIG. 2A is a schematic cross-sectional view taken along line AA in FIG. 1, and FIG. 2B is a schematic cross-sectional view taken along line BB in FIG.

As shown in FIGS. 1 and 2, the temperature characteristic measurement apparatus 1 includes a measurement probe head unit 2 and a carrier 4 on which a plurality of piezoelectric devices 3 to be measured are mounted.
The measurement probe head unit 2 includes a measurement probe unit 6 provided with a plurality of measurement probe pins 5, a measurement probe unit support unit 7 that surrounds the measurement probe unit 6 in plan view and supports the measurement probe unit 6. It has.
Furthermore, the measurement probe head unit 2 has a heat source, contacts the measurement probe unit support unit 7, and adjusts the temperature of the plurality of measurement probe pins 5 to a predetermined temperature by heat conduction through the measurement probe unit support unit 7. A positioning portion 9, two positioning pins 9 for positioning the carrier 4 with respect to the measurement probe portion 6, and a positioning pin support portion 10 for supporting the two positioning pins 9.

The measurement probe unit 6 includes a rod-shaped measurement probe pin 5 in which a gold alloy or the like is applied to a copper alloy such as beryllium copper on a base part formed of a resin material such as PEEK (registered trademark) (polyether ether ketone). It is formed fixed in a state of penetrating in the thickness direction.
The measurement probe pins 5 are arranged in accordance with the distance between the electrodes 3 a and 3 b of the piezoelectric device 3 mounted on the carrier 4 and the distance between the plurality of arranged piezoelectric devices 3. In the present embodiment, four sets of measurement probe pins 5 are provided by one set of two (for example, measurement probe pins 5a and 5b). Thereby, the temperature characteristic measuring apparatus 1 can measure the frequencies of the four piezoelectric devices 3 at a time.
The measurement probe pin 5 is connected to the frequency counter via a measurement circuit (not shown).

The measurement probe part support part 7 is formed with metals, such as copper and a copper alloy. The measurement probe part support part 7 is formed in a substantially frame shape in plan view, and supports the measurement probe part 6 by housing and fixing the measurement probe part 6 inside the frame.
The measurement probe portion support portion 7 is fixed to the temperature adjustment portion 8 by a fixing member such as a screw (not shown).

  The temperature adjusting unit 8 has a Peltier element as a heat source, and is maintained at a predetermined temperature by heating or cooling. The temperature of the temperature adjusting unit 8 is controlled in a range of about ± 0.5 ° C. to 1 ° C. with respect to the set temperature using a temperature sensor or the like. Further, the temperature adjustment unit 8 is in contact with the side surface of the measurement probe unit support unit 7 along the extending direction of the measurement probe pin 5.

The positioning pin support 10 is made of a resin such as PEEK (registered trademark). The positioning pin support 10 is formed so as to sandwich the measurement probe support 7 from both sides.
The positioning pin support portion 10 has a step portion 10a formed on the side surface on the measurement probe portion support portion 7 side. The positioning pin support portion 10 is fixed to the measurement probe portion support portion 7 by a fixing member such as a screw (not shown) with the step portion 7a formed on the side surface of the measurement probe portion support portion 7 superimposed on the step portion 10a. Yes.
With the step portions 10a and 7a, the temperature characteristic measuring apparatus 1 can easily position and fix the positioning pin support portion 10 and the measurement probe portion support portion 7.

The positioning pin support 10 has two cylindrical positioning pins 9 in which a copper alloy such as beryllium copper is plated with gold in the extending direction of the measurement probe pin 5 so as to sandwich the measurement probe support 7. It is supported in a state penetrating in the thickness direction along.
The thermal conductivity of the positioning pin support 10 is extremely lower than the thermal conductivity of the metal measurement probe support 7 (about 400 W / (m · K) in the case of copper) because the material is resin. (About 0.25 W / (m · K) in the case of PEEK (registered trademark)).
The positioning pin 9 has a conical end 9a on the carrier 4 side. Moreover, since the positioning pin 9 should just protrude from the positioning pin support part 10 to the carrier 4 side, it does not need to penetrate the positioning pin support part 10. FIG.

The carrier 4 is formed in a substantially rectangular flat plate shape using a metal such as aluminum or an aluminum alloy.
The carrier 4 is formed with a plurality of recesses 4 a for housing the piezoelectric device 3 on the surface facing the measurement probe unit 6. The recess 4 a is formed so that the position of the electrode of each piezoelectric device 3 to be accommodated is a position facing each measurement probe pin 5 of the measurement probe unit 6.
Specifically, for example, the electrode 3a of the piezoelectric device 3 and the measurement probe pin 5a are opposed to each other, and the electrode 3b and the measurement probe pin 5b are opposed to each other.

In the carrier 4, two positioning holes 4 b are formed at positions facing the two positioning pins 9. The surface of the carrier 4 may be coated with an insulating resin such as fluorine. According to this, the carrier 4 can avoid the short circuit of the piezoelectric device 3 accommodated, and the carrier 4 itself can be transported smoothly.
The temperature characteristic measuring apparatus 1 is provided with another temperature adjusting unit (not shown) below the carrier 4, and is adjusted so that the temperature of the piezoelectric device 3 approaches a predetermined temperature via the carrier 4.

Here, an outline of the operation of the temperature characteristic measuring apparatus 1 will be described.
In the temperature characteristic measuring apparatus 1, the carrier 4 on which the piezoelectric device 3 is mounted is transported along the direction of arrow C by a transport unit (not shown) immediately below the measurement probe head unit 2 held by a holding unit (not shown). . The carrier 4 is placed at a position where the electrodes 3a and 3b of the piezoelectric device 3 face the measurement probe pins 5a and 5b.

In the temperature characteristic measuring apparatus 1, the tip end portion 9 a of the positioning pin 9 is inserted into the positioning hole 4 b of the carrier 4 when the measuring probe head portion 2 is lowered along the arrow D direction. 1 and 2 show a state in which the measurement probe head unit 2 is lowered.
At this time, since the tip end portion 9a of the positioning pin 9 is formed in a conical shape, the carrier 4 is displaced in the plane direction when the inclined surface of the tip end portion 9a of the positioning pin 9 contacts the positioning hole 4b. Is accurately positioned.

In the temperature characteristic measuring apparatus 1, when the measurement probe head unit 2 is lowered along the arrow D direction, the measurement probe pins 5a and 5b are brought into contact with the electrodes 3a and 3b of the piezoelectric device 3 (others). The same applies to each measurement probe pin 5 and each piezoelectric device 3).
The temperature characteristic measuring apparatus 1 measures the frequency of the piezoelectric device 3 under a predetermined temperature by a frequency counter via the measurement probe pins 5a and 5b and the measurement circuit (the same applies to the other piezoelectric devices 3). Yes, 4 are measured at once).

At this time, each measurement probe pin 5 of the measurement probe unit 6 is adjusted to a predetermined temperature by heat conduction from the temperature adjustment unit 8 via the measurement probe unit support unit 7.
The measurement probe unit support 7 and the positioning pin support 10 are in contact with each other, but are separate, and the thermal conductivity of the positioning pin support 10 is lower than the thermal conductivity of the measurement probe support 7. From this, in the temperature characteristic measuring apparatus 1, heat conduction (heat radiation) from the measurement probe unit support 7 to the positioning pin support 10 is suppressed.
Thereby, in the temperature characteristic measuring apparatus 1, heat conduction from the temperature adjustment unit 8 to each measurement probe pin 5 through the measurement probe unit support unit 7 is efficiently performed.

  In the temperature characteristic measuring apparatus 1, the measurement probe head unit 2 is raised along the arrow D direction after the measurement is completed. Then, in the temperature characteristic measuring apparatus 1, the carrier 4 is transported to the next place, and then a new carrier 4 is transported, and the frequency of the new piezoelectric device 3 is measured. Thereafter, the temperature characteristic measuring apparatus 1 repeats this series of operations.

Here, the frequency measurement result of the piezoelectric device 3 measured by the temperature characteristic measurement apparatus 1 of the present embodiment under a predetermined temperature is compared with the frequency measurement result of the piezoelectric device 3 measured by the conventional temperature characteristic measurement apparatus. View.
FIG. 3 is a comparison graph of frequency measurement results between the temperature characteristic measuring apparatus of the present embodiment and the conventional temperature characteristic measuring apparatus. FIG. 3A is a graph showing the frequency measurement result of the conventional temperature characteristic measuring apparatus, and FIG. 3B is a graph showing the frequency measurement result of the temperature characteristic measuring apparatus of the present embodiment.

In each graph, the horizontal axis represents the elapsed time from the start of measurement, and the vertical axis represents the amount of deviation from the reference value of the frequency.
Further, CH1 is data of a set of measurement probe pins 5a and 5b (105a and 105b). Hereinafter, a set in which the position of the measurement probe pin 5 (105) is close to a set far from the temperature adjustment unit 8 (108). In this order, they are CH2 to CH4. Therefore, CH4 is data of a set of measurement probe pins 5 (105) closest to the temperature adjustment unit 8 (108).
This data is data when the set temperature as the predetermined temperature is both 85 ° C. Both temperature characteristic measuring apparatuses have a common specification except for the measurement probe head.

  As shown in FIG. 3, for example, when comparing the width of data variation between CH1 and CH4 at an elapsed time of about 1.5 seconds, it is about 10 in the conventional data. Thus, in the data of this embodiment, it is about 3, and it can be seen that the width of variation is greatly reduced. Note that it can be seen that, even at an elapsed time other than about 1.5 seconds, the variation of the data of this embodiment is significantly reduced.

Further, it can be seen that the variation of each CH from the elapsed time of about 0.5 seconds to about 3 seconds is also smaller in the data of this embodiment.
These main factors are that the size of the measurement probe portion support portion 7 (see FIG. 1) of the temperature characteristic measuring apparatus 1 of the present embodiment is smaller than the size of the conventional support portion 107 (see FIG. 4), and the measurement probe portion support portion. Therefore, the heat conduction from the temperature adjustment unit 8 to each measurement probe pin 5 through the measurement probe unit support unit 7 is performed efficiently and sufficiently, and the temperature difference between the measurement probe pins 5 is reduced. It is presumed that it was made small.

As described above, in the temperature characteristic measuring apparatus 1 of the present embodiment, the measurement probe unit support unit 7 and the positioning pin support unit 10 are formed separately, so that the size of the measurement probe unit support unit 7 is reduced. It can be made smaller than the size of the conventional support portion 107.
Thereby, since the heat capacity of the measurement probe part support part 7 becomes small, the temperature characteristic measuring apparatus 1 has each measurement probe of the measurement probe part 6 by the heat conduction from the temperature adjustment part 8 via the measurement probe part support part 7. The time until the temperature of the pin 5 reaches a predetermined temperature is shorter than in the conventional case.
From this, the temperature characteristic measuring apparatus 1 can shorten the tact time of the frequency measurement of the piezoelectric device 3 at a predetermined temperature.

Moreover, since the heat capacity of the measurement probe part support part 7 becomes small, the temperature characteristic measuring apparatus 1 efficiently and sufficiently conducts heat from the temperature adjustment part 8 to each measurement probe pin 5 via the measurement probe part support part 7. The temperature difference between the measurement probe pins 5 can be reduced.
As a result, the temperature characteristic measuring apparatus 1 more accurately measures the frequency of the piezoelectric device 3 at a predetermined temperature because the temperature reached by each piezoelectric device 3 due to heat conduction from each measurement probe pin 5 becomes substantially uniform. can do.

Further, in the temperature characteristic measuring apparatus 1, the positioning pin support portion 10 is in contact with the measurement probe portion support portion 7, and the thermal conductivity of the positioning pin support portion 10 is extremely lower than the thermal conductivity of the measurement probe portion support portion 7.
From this, the temperature characteristic measuring apparatus 1 is configured such that the positioning pin support portion 10 and the measurement probe portion support portion 7 are separated while suppressing heat conduction between the measurement probe portion support portion 7 and the positioning pin support portion 10. Compared with the case where it is, the size of the measurement probe head part 2 can be reduced.

Further, in the temperature characteristic measuring apparatus 1, the temperature adjustment unit 8 is in contact with the side surface of the measurement probe unit support unit 7 along the extending direction of the measurement probe pin 5. From this, the temperature characteristic measuring apparatus 1 is compared with the case where the temperature adjustment unit 8 is in contact with the upper surface 7b of the measurement probe unit support unit 7 that intersects the extending direction of the measurement probe pin 5, for example. It is not necessary to provide a space necessary for the arrangement of the temperature adjusting unit 8 on the upper surface 7b.
Thereby, the temperature characteristic measuring apparatus 1 can make the size of the upper surface 7b of the measurement probe part support part 7 smaller.

In the above embodiment, the number of measurement probe pins 5 is set to 4. However, the number of measurement probe pins 5 is not limited to this, and may be more or less than 4. For example, 1-3 sets, 5-10 sets, etc. may be sufficient. Similarly, the number of mounted piezoelectric devices 3 is not limited to four, and is increased or decreased according to the number of sets of the measurement probe pins 5.
Note that the piezoelectric device can be applied to a crystal oscillator, a crystal resonator, a crystal filter, a SAW resonator, a SAW filter, and the like. The temperature characteristic measuring apparatus 1 increases the number of one set of measurement probe pins 5 according to the number of electrodes when the piezoelectric device has a large number of electrodes such as a crystal oscillator.

Moreover, in the said embodiment, although the positioning pin support part 10 and the measurement probe part support part 7 were contacting, it is not limited to this, You may leave | separate. According to this, in the temperature characteristic measuring apparatus 1, the heat conduction between the positioning pin support portion 10 and the measurement probe portion support portion 7 is further suppressed.
Further, the positioning pin support portion 10 may be separated into two with the measurement probe portion support portion 7 as a boundary. Further, the positioning pin support portion 10 may be in contact with the temperature adjustment portion 8 or may be fixed to the temperature adjustment portion 8.
Further, the measurement probe portion 6 is not limited to a substantially rectangular parallelepiped shape, and is formed in a columnar shape with the measurement probe pins 5 penetrating in the axial direction for each measurement probe pin 5 and connected to each other by ribs. Shape may be sufficient. A plurality of measurement probe units 6 may be formed independently for each set of measurement probe pins 5.

  Further, the temperature characteristic measuring apparatus 1 includes a plurality of measurement probe head units 2 along the transport direction (arrow C direction) of the carrier 4, and sets different temperatures for the temperature adjustment units 8 of the measurement probe head units 2. By doing so, the frequency of the piezoelectric device 3 under a plurality of different temperatures may be continuously measured. In addition, the conveyance direction of the carrier 4 may be circular.

The schematic perspective view which shows schematic structure of the principal part of the temperature characteristic measuring apparatus of this embodiment. The schematic cross section of FIG. The comparison graph of the frequency measurement result of the temperature characteristic measuring apparatus of this embodiment and the conventional temperature characteristic measuring apparatus. The model perspective view which shows schematic structure of the principal part of the conventional temperature characteristic measuring apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Temperature characteristic measuring apparatus, 2 ... Measurement probe head part, 3 ... Piezoelectric device, 3a, 3b ... Electrode, 4 ... Carrier, 4a ... Recessed part, 4b ... Positioning hole, 5, 5a, 5b ... Measurement probe pin, 6 ... Measurement probe section 7... Measurement probe section support section 7 a. Stepped section 7 b. Upper surface 8. Temperature adjustment section 9. Positioning pin 9 a.

Claims (3)

A measurement probe portion provided with a plurality of measurement probe pins; and
Surrounding the circumference of the measurement probe part in plan view, and a measurement probe part support part for supporting the measurement probe part,
A temperature adjustment unit that has a heat source, contacts the measurement probe unit support unit, and adjusts the temperature of the plurality of measurement probe pins to a predetermined temperature by heat conduction through the measurement probe unit support unit;
A positioning pin for positioning a carrier on which a piezoelectric device to be measured is mounted with respect to the measurement probe unit;
A positioning probe supporting portion for supporting the positioning pin, and a measurement probe head portion comprising:
The temperature characteristic measuring apparatus according to claim 1, wherein the measurement probe part support part of the measurement probe head part and the positioning pin support part are formed separately.   The temperature characteristic measuring apparatus according to claim 1, wherein the positioning pin support portion is in contact with the measurement probe portion support portion, and a thermal conductivity of the positioning pin support portion is a thermal conductivity of the measurement probe portion support portion. A temperature characteristic measuring apparatus characterized by being lower.   The temperature characteristic measurement apparatus according to claim 1 or 2, wherein the temperature adjustment unit is in contact with a side surface of the measurement probe unit support unit along an extending direction of the measurement probe pin. apparatus.

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