JP5290820B2 - Electronic component measuring apparatus and measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique capable of measuring characteristics of an electronic component, by adjusting the temperature of the electronic component at a target temperature. <P>SOLUTION: The temperature of a support part supporting the electronic component is adjusted so as to be a prescribed first temperature, and the temperature of a holding section holding a probe is adjusted so as to be a prescribed second temperature. The probe is brought into contact with a terminal of the electronic component supported by the support part. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component measuring apparatus and measuring method.

  Conventionally, the characteristics of an electronic component are measured by bringing a probe into contact with the terminal of the electronic component. Here, in order to measure the temperature characteristic of an electronic component, a technique of providing a heating and / or cooling means on a holding plate that holds the electronic component is known. In addition, a technique for stabilizing the temperature of the holding plate by providing heat insulating means on the upper surface of the holding plate is known.

JP 2004-309552 A

  However, in reality, sufficient measures have not been taken to measure the characteristics of the electronic component by adjusting the temperature of the electronic component to the target temperature.

  The present invention has been made to solve at least a part of the above problems, and provides a technique capable of measuring the characteristics of an electronic component by adjusting the temperature of the electronic component to a target temperature. Objective.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Form 1]
An apparatus for measuring characteristics of an electronic component having a main body and a terminal,
A support portion for supporting the electronic component;
A first temperature adjusting unit for adjusting the temperature of the support unit to a predetermined first temperature;
A probe that contacts the terminal of the electronic component;
A holding unit for holding the probe;
A second temperature adjusting unit that adjusts the temperature of the holding unit to a predetermined second temperature;
A pressing unit that is connected to the holding unit and presses the main unit against the support unit by contacting the main unit of the electronic component;
With
The second temperature is set to a temperature higher than the first temperature as a temperature for measuring the characteristic under a temperature environment lower than the first temperature.
measuring device.
According to this configuration, the temperature of both members (the support part of the electronic component and the holding part of the probe) that affect the temperature of the electronic component are adjusted to the first temperature and the second temperature, respectively. Can be adjusted to a target temperature to measure the characteristics of the electronic component. Further, since the main body of the electronic component is pressed against the support portion having the adjusted temperature, the temperature of the electronic component can be adjusted to the target temperature and the characteristics of the electronic component can be measured. Moreover, since the temperature of the pressing part can be brought close to the temperature of the holding part, the temperature of the electronic component can be adjusted to the target temperature, and the characteristics of the electronic component can be measured. Furthermore, in an environment where the temperature of the probe tends to be lower than the temperature of the holding part, the temperature of the electronic component can be adjusted to the target temperature to measure the characteristic of the electronic component.

Application Example 1 An apparatus for measuring characteristics of an electronic component having a main body and a terminal, and adjusting the temperature of the support portion that supports the electronic component and the support portion to a predetermined first temperature A first temperature adjusting unit; a probe that contacts the terminal of the electronic component; a holding unit that holds the probe; and a second temperature adjusting unit that adjusts the temperature of the holding unit to a predetermined second temperature. And a measuring device.

  According to this configuration, the temperature of both members (the support part of the electronic component and the holding part of the probe) that affect the temperature of the electronic component are adjusted to the first temperature and the second temperature, respectively. Can be adjusted to a target temperature to measure the characteristics of the electronic component.

Application Example 2 The measurement apparatus according to Application Example 1, further including a pressing unit that presses the main body against the support unit by contacting the main body of the electronic component.

  According to this configuration, the main body of the electronic component is pressed against the support portion whose temperature has been adjusted, so that the temperature of the electronic component can be adjusted to the target temperature and the characteristics of the electronic component can be measured.

[Application Example 3] The measurement apparatus according to Application Example 2, wherein the pressing unit is connected to the holding unit.

  According to this configuration, the temperature of the pressing part can be brought close to the temperature of the holding part, so that the characteristic of the electronic part can be measured by adjusting the temperature of the electronic part to the target temperature.

Application Example 4 The measurement apparatus according to any one of Application Examples 1 to 3, wherein the second temperature is set higher than the first temperature.

  According to this configuration, the characteristics of the electronic component can be measured by adjusting the temperature of the electronic component to the target temperature in an environment where the temperature of the probe tends to be lower than the temperature of the holding unit.

Application Example 5 In the measurement apparatus according to any one of Application Examples 1 to 4, the first temperature adjusting unit includes a first Peltier element for adjusting the temperature of the support unit, The second temperature adjustment unit is a measurement device including a second Peltier element for adjusting the temperature of the holding unit.

  According to this configuration, each of the first temperature adjustment unit and the second temperature adjustment unit can appropriately adjust the temperature.

[Application Example 6] In the measurement apparatus according to any one of Application Examples 1 to 5, the electronic component is a temperature sensor having a portion whose electrical characteristics change according to a temperature change as the main body. ,measuring device.

  According to this configuration, the temperature sensor characteristic can be measured by adjusting the temperature of the temperature sensor to the target temperature.

Application Example 7 A method for measuring the characteristics of an electronic component having a main body and a terminal, wherein the temperature of a support portion that supports the electronic component is adjusted to a predetermined first temperature, A measurement method comprising: adjusting a temperature of a holding part to be held to a predetermined second temperature; and bringing the probe into contact with the terminal of the electronic component supported by the support part.

[Application Example 8] The measurement method according to Application Example 7, further including a step of pressing the main body against the support portion by bringing the pressing portion into contact with the main body of the electronic component.

Application Example 9 The measurement method according to Application Example 8, wherein the pressing unit is connected to the holding unit.

[Application Example 10] The measurement method according to any one of Application Examples 7 to 9, wherein the second temperature is set to a temperature higher than the first temperature.

Application Example 11 In the measurement method according to any one of Application Example 7 to Application Example 10, in the step of adjusting the temperature of the support portion, the temperature of the support portion is adjusted using a first Peltier element. And the step of adjusting the temperature of the holding unit includes a step of adjusting the temperature of the holding unit using a second Peltier element.

[Application Example 12] The measuring method according to any one of Application Example 7 to Application Example 11, wherein the electronic component is a temperature sensor having a portion whose electrical characteristics change according to a temperature change as the main body. ,Measuring method.

  The present invention can be realized in various modes, for example, an electronic component inspection method or apparatus, a computer program for realizing the function of the method or apparatus, and the computer program recorded therein. It can be realized in the form of a recording medium.

2 is a front view of a measuring apparatus 900. FIG. It is explanatory drawing which shows a measuring apparatus. FIG. 6 is a top view of a support part 220. It is a perspective view of the recessed part 220R. 2 is a top view of the probe device 100. FIG. It is a flowchart which shows the procedure of a measurement process. Explanatory drawing which shows the measuring apparatus 900 before and behind the movement of the probe apparatus 100. FIG. It is explanatory drawing which shows the structure of the support apparatus in 2nd Example. It is explanatory drawing which shows the structure of the probe apparatus in 3rd Example. It is a flowchart which shows the procedure of the measurement process in 4th Example. It is a flowchart which shows the procedure of the measurement process in 5th Example.

Next, embodiments of the present invention will be described in the following order based on examples.
A. First embodiment:
B. Second embodiment:
C. Third embodiment:
D. Fourth embodiment:
E. Example 5:
F. Variations:

A. First embodiment:
1 and 2 are explanatory views showing a measuring apparatus as an embodiment of the present invention. FIG. 1 is a front view of the measuring apparatus 900, and FIG. 2 is a cross-sectional view of the measuring apparatus 900. In the present embodiment, the measuring apparatus 900 inspects the temperature characteristics of the thermistor 300. Specifically, the measuring device 900 measures the electrical resistance of the thermistor 300 at a predetermined temperature. The measuring device 900 includes a probe device 100, a support device 200, and a measuring unit 600. The probe device 100 is disposed vertically above the support device 200. In the figure, an X direction, a Y direction, and a Z direction orthogonal to each other are shown. The Z direction indicates the vertically upward direction.

  The support device 200 includes a base portion 250, Peltier elements 230a and 230b, a plate 240, a support portion 220, a temperature sensor 220T, and a first control portion 510. The base 250 is a stand for installing the support device 200. Two Peltier elements 230a and 230b for controlling temperature are arranged and fixed on the upper surface (the surface on the + Z side) of the base 250. A plate 240 is fixed on the upper surfaces of the Peltier elements 230a and 230b. A support portion 220 is fixed to the upper surface of the plate 240. The support part 220 is a flat plate perpendicular to the Z direction. Ten concave portions 220 </ b> R are formed on the upper surface of the support portion 220.

  FIG. 2 shows an AA cross section (FIG. 1) of the probe device 100 and a BB cross section (FIG. 1) of the support device 200. The cross section of the probe device 100 shows a cross section passing between inspection groups IG described later. The cross section of the support device 200 shows a cross section passing through the recess 220R.

  FIG. 3 is a top view of the support part 220. As shown in the drawing, the ten recesses 220R are arranged side by side along the X direction.

  FIG. 4 is a perspective view of the recess 220R. The recess 220R has a first portion 220A and a second portion 220B. The shape of the first portion 220A is a substantially rectangular shape extending along the Y direction. The shape of the second portion 220B is a cylindrical shape extending along the Z direction. The depth of the second portion 220B (depth in the −Z direction) is deeper than the depth of the first portion 220A. The second portion 220B is disposed on the + Y side of the first portion 220A. The + Y side end of the first portion 220A communicates with the second portion 220B. A first concave wall 220A1 that is recessed toward the −X side is formed on the −X side side surface of the first portion 220A. A second concave wall 220A2 that is recessed toward the + X side is formed on the side surface on the + X side of the first portion 220A.

  As illustrated, the thermistor 300 is placed in each recess 220R. The thermistor 300 has a flat plate-shaped main body 320 and two terminals 311 and 312 connected to the side surface of the main body 320. The main body 320 is accommodated in the second portion 220B, and the terminals 311 and 312 are accommodated in the first portion 220A. The two terminals 311 and 312 extend in parallel.

  Further, as shown in FIG. 1, a temperature sensor 220 </ b> T is fixed to the support portion 220. The first controller 510 feedback-controls the Peltier elements 230a and 230b so that the measured temperature TR1 of the temperature sensor 220T becomes a predetermined first target temperature TT1. As a result, the temperature of the support part 220 can be maintained at the first target temperature TT1. Thus, by adjusting the temperature of the support part 220 to be the first target temperature TT1, the temperature of the thermistor 300 placed on the support part 220 can be adjusted to be the first target temperature TT1. . In the present embodiment, the first target temperature TT1 is set to 100 degrees Celsius. Further, the entirety of the first control unit 510, the Peltier elements 230a and 230b, and the temperature sensor 220T corresponds to a “first temperature adjustment unit” in the claims. The first control unit 510 is configured by hardware using a dedicated device and circuit.

  In addition, in order to control the temperature of the support part 220 (that is, the temperature of the thermistor 300) with high accuracy, it is preferable to employ a material having good thermal conductivity as the material of the plate 240 and the support part 220. . For example, aluminum or copper may be used. Moreover, you may employ | adopt other types of materials, such as a ceramic, not only such a metal.

  Various sensors can be adopted as the temperature sensor 220T. For example, a platinum resistor may be adopted. If a platinum resistor is employed, the temperature can be accurately measured. In the embodiment of FIG. 4, the main body 320 has a platinum resistor inside (not shown). One end of the platinum resistor is connected to the first terminal 311, and the other end of the platinum resistor is connected to the second terminal 312. However, other types of temperature sensors (for example, thermocouples) may be employed.

  In order to prevent an unintended circuit from being connected to the terminals 311 and 312 of the thermistor 300, it is preferable to form portions of the support portion 220 that can contact the terminals 311 and 312 with an electrical insulator. . For example, the surface of the recess 220R may be covered with ceramic. Alternatively, the support 220 may be formed of aluminum, the surface of the recess 220R may be oxidized, and the surface of the recess 220R may be covered with an oxide film.

  FIG. 5 is a top view of the probe device 100. As shown in FIGS. 1, 2, and 5, the probe device 100 includes a base 150, a Peltier element 130, a plate 140, a temperature sensor 140T, a holding unit 120, a first probe 111, and a second probe. 112, a pressing unit 113, and a second control unit 520. The base 150 is a base for the configuration of the probe device 100. The base 150 is fixed to a moving device (not shown) (for example, an air cylinder) and moves along the Z direction. A Peltier element 130 for controlling temperature is fixed to the front surface (the surface on the −Y side) of the base 150. A plate 140 is fixed to the front surface of the Peltier element 130. A holding unit 120 is fixed to the front surface of the plate 140.

  The holding unit 120 includes a second block 122, a first block 121 fixed to the front surface of the second block 122, and a third block 123 fixed to the rear surface (+ Y side surface) of the second block 122. Have. The rear surface of the third block 123 is fixed to the plate 140. The third block 123 covers the rear surface and side surfaces (the + X side surface and the −X side surface) of the second block 122.

  The second block 122 holds ten first probes 111, ten second probes 112, and ten pressing portions 113. All of these members 111, 112, and 113 are rod-shaped members that extend along the Z direction. Each member 111,112,113 is hold | maintained in the state which penetrated the 2nd block 122 along the Z direction.

  Moreover, as shown in FIG. 5, each member 111,112,113 is arrange | positioned along with the X direction, respectively. These members 111, 112, and 113 are divided into 10 inspection groups IG. One inspection group IG includes one first probe 111, one second probe 112, and one pressing portion 113. The members 111, 112, and 113 of one inspection group IG face one common recess 220R.

  In the lower part of FIG. 5, the arrangement of the members 111, 112, and 113 in one inspection group IG is shown in an enlarged manner. In the figure, the members 111, 112, and 113 are hatched. This arrangement is viewed from + Z to −Z.

  The first probe 111 and the second probe 112 are opposed to the first portion 220A, respectively. The first probe 111 is disposed at a position biased toward the −X + Y side in the first portion 220A, and the second probe 112 is disposed at a position biased toward the + X−Y side within the first portion 220A. As the probe device 100 moves toward the support device 200, the first probe 111 contacts the first terminal 311, and the second probe 112 contacts the second terminal 312. In addition, since the 1st probe 111 is arrange | positioned in the space protruded by 1st concave wall part 220A1, it is suppressed that the 1st probe 111 contacts the 2nd terminal 312 accidentally. Similarly, since the second probe 112 is disposed in the space protruding by the second concave wall portion 220A2, it is possible to suppress the second probe 112 from erroneously contacting the first terminal 311.

  Each of the probes 111 and 112 is formed using a conductor for electrical connection with the terminals 311 and 312 (for example, the surface of a bar-like copper is plated with gold). Each probe 111, 112 is connected to the measurement unit 600 (FIG. 1) by a cable (not shown).

  The pressing portion 113 is opposed to the second portion 220B. As the probe device 100 moves toward the support device 200, the pressing portion 113 comes into contact with the main body 320 of the thermistor 300. By this contact, the main body 320 is pressed against the support portion 220. Any material can be adopted as the material of the pressing portion 113. For example, an electrical insulator such as ceramic or rubber may be used. Moreover, in order to suppress the thermistor 300 from being damaged, an elastic body such as rubber may be used. Further, in order to suppress heat conduction between the thermistor 300 and the pressing portion 113, a heat insulating material such as foamed resin may be used. Further, the pressing portion 113 may be configured by combining a plurality of materials. For example, a rubber member may be assembled to the tip of a metal rod, and the rubber member may contact the thermistor 300. The reason for pressing the main body 320 against the support portion 220 will be described later.

  As shown in FIG. 2, a temperature sensor 140 </ b> T is fixed to the plate 140. The second control unit 520 performs feedback control of the Peltier element 130 so that the measured temperature TR2 of the temperature sensor 140T becomes a predetermined second target temperature TT2. As described above, the second controller 520 adjusts the temperature of the plate 140. Here, since the holding unit 120 is fixed to the plate 140, heat is conducted between the plate 140 and the holding unit 120. As a result, the temperature of the holding unit 120 is substantially the same as the temperature of the plate 140. As a result, it can be said that the second control unit 520 adjusts the temperature of the holding unit 120. Note that the temperature of the holding unit 120 (plate 140) is maintained at the second target temperature TT2. The entirety of the second control unit 520, the temperature sensor 140T, and the Peltier element 130 corresponds to a “second temperature adjustment unit” in the claims. The second control unit 520 is configured by hardware using a dedicated device and circuit.

  In the present embodiment, the second target temperature TT2 is set to 102 degrees Celsius that is slightly higher than the first target temperature TT1 (100 degrees Celsius) described above. The reason for this is to prevent the temperature of the thermistor 300 from greatly deviating from the target temperature (first target temperature TT1) when the probes 111 and 112 contact the thermistor 300 (terminals 311 and 312). In the present embodiment, the measuring apparatus 900 is operated under a temperature environment lower than the first target temperature TT1 (for example, under normal temperature (20 degrees Celsius)). The temperatures of the portions (tip portions) of the probes 111 and 112 that are in contact with the thermistor 300 become lower than the temperature of the holding unit 120 due to cooling by a low temperature environment. Here, assuming that the second target temperature TT2 is set to the same value as the first target temperature TT1, the temperature at the tip of each probe 111, 112 is the second target temperature TT2 (that is, the first target temperature TT1). ). As a result, the thermistor 300 is cooled by the probes 111 and 112 that are in contact with the thermistor 300, and the temperature of the thermistor 300 may be greatly deviated from the target temperature (first target temperature TT1). Therefore, in this embodiment, the second target temperature TT2 is set to a temperature slightly higher than the first target temperature TT1. As a result, it is possible to suppress the temperatures of the probes 111 and 112 from becoming excessively lower than the target temperature (first target temperature TT1) of the thermistor 300. And it can suppress that the thermistor 300 is cooled. Although the probes 111 and 112 have been described above, the same applies to the pressing portion 113. In the present embodiment, the second target temperature TT2 is preferably in the range from “first target temperature TT1” to “first target temperature TT1 + 5 degrees Celsius”. However, the appropriate second target temperature TT2 may be experimentally determined in advance.

  In addition, in order to control the temperature of the holding part 120 with high accuracy, it is preferable to employ a material having good thermal conductivity as the material of the plate 140 and the holding part 120 (for example, aluminum or copper). Moreover, you may employ | adopt other types of materials, such as a ceramic, not only such a metal. Further, as the temperature sensor 140T, various temperature sensors such as a platinum resistor can be employed.

  FIG. 6 is a flowchart showing the procedure of the measurement process. In the first step S100, the second control unit 520 (FIG. 2) starts temperature adjustment of the holding unit 120. The second control unit 520 controls the Peltier element 130 so that the second measured temperature TR2 of the temperature sensor 140T becomes the second target temperature TT2.

  In the next step S110, the first control unit 510 (FIG. 1) starts temperature adjustment of the support unit 220. The first controller 510 controls the Peltier elements 230a and 230b so that the first measured temperature TR1 of the temperature sensor 220T becomes the first target temperature TT1.

  In the next step S120, the thermistor 300 is disposed in the recess 220R (FIGS. 1 to 4). This operation may be performed by a machine (industrial robot) (not shown) or may be performed manually by an operator.

  In the next steps S130 and S140, the probe device 100 (base 150: FIGS. 1 and 2) moves toward the support device 200. FIG. 7A shows the measurement apparatus 900 before movement, and FIG. 7B shows the measurement apparatus 900 after movement. In the figure, a cross-sectional view similar to FIG. 2 is shown. When the probe device 100 (base 150) moves toward the support device 200, the holding portion 120, the probes 111 and 112, and the pressing portion 113 move together toward the thermistor 300. In this way, the holding unit 120 can be moved by moving the base 150. Then, by moving the holding unit 120, the probes 111 and 112 and the pressing unit 113 can be moved. The pressing portion 113 contacts the main body 320 (S130), and the probes 111 and 112 contact the terminals 311 and 312 respectively (S140). The contact position of each member 111, 112, 113 seen along the Z direction is shown in FIG.

  The main body 320 of the thermistor 300 is pressed against the support portion 220 by the pressing portion 113 (a state where the main body 320 is in contact with the support portion 220 is maintained). The reason for this is to prevent the temperature of the main body 320 from greatly deviating from the first target temperature TT1. As described above, the probes 111 and 112 are in contact with the terminals 311 and 312. By this contact, a force is applied to the thermistor 300. This force may cause the main body 320 to move away from the support portion 220. When the main body 320 is separated from the support portion 220, the heat conduction between the main body 320 and the support portion 220 becomes insufficient. As a result, the temperature of the main body 320 may be greatly deviated from the first target temperature TT1. On the other hand, the main body 320 can be prevented from being separated from the support portion 220 by pressing the main body 320 against the support portion 220 as in the present embodiment. Thereby, the heat conduction between the main body 320 and the support part 220 can be maintained, and the temperature of the main body 320 can be suppressed from greatly deviating from the first target temperature TT1.

  Further, as described above, in this embodiment, in addition to the temperature of the support part 220, the temperature of the holding part 120 is also adjusted. Therefore, it is possible to suppress the temperature of the thermistor 300 from greatly deviating from the first target temperature TT1 due to heat conduction between the probes 111 and 112 and the thermistor 300 (terminals 311 and 312).

  Each member 111, 112, 113 can move in the second block 122 in parallel with the Z direction so that an excessive force is not applied to the thermistor 300. Each member 111, 112, 113 is urged in the −Z direction by an urging means (not shown) (for example, a spring or rubber) incorporated in the second block 122. Therefore, when the probe device 100 further moves in the −Z direction after contact with the thermistor 300, the members 111, 112, and 113 move in the second block 122 in the + Z direction by a further movement amount. . Each member 111, 112, 113 is pressed against the thermistor 300 by the urging force. As a result, application of excessive force to the thermistor 300 can be suppressed.

  Note that the holding unit 120 is preferably configured so that each member does not fall out of the second block 122. For example, the members 111, 112, 113 may be prevented from dropping by connecting the members 111, 112, 113 to the urging means described above. Further, the movable range of each member 111, 112, 113 may be mechanically limited in advance. For example, the movement of convex portions (not shown) provided on the members 111, 112, 113 may be limited by a groove (not shown) having a predetermined length provided on the second block 122.

  In the next step S150, the measurement unit 600 (FIG. 1) measures the characteristics of each thermistor 300 via the probes 111 and 112. In the present embodiment, the measurement unit 600 measures the electrical resistance of each thermistor 300. Then, the measurement unit 600 determines that the thermistor 300 is a non-defective product when the measured electrical resistance is within a predetermined allowable range. When the electrical resistance is outside the allowable range, the measurement unit 600 determines that the thermistor 300 is a defective product.

  The measurement unit 600 (FIG. 1) includes a first measurement temperature TR1 and a second measurement temperature TR2 in a state where the thermistor 300 is placed (supported) in the recess 220R and the probes 111 and 112 are in contact with the terminals 311 and 312. , Wait for each to be adjusted to the target temperature, and execute step S150. Various conditions can be adopted as conditions for determining whether or not the measured temperatures TR1 and TR2 have been adjusted to the target temperatures TT1 and TT2, respectively. For example, for determining that the difference between the first measured temperature TR1 and the first target temperature TT1 is equal to or less than a predetermined first allowable error, the first measured temperature TR1 is adjusted to the first target temperature TT1. You may employ | adopt as conditions. Similarly, in order to determine that the second measured temperature TR2 has been adjusted to the second target temperature TT2 that the difference between the second measured temperature TR2 and the second target temperature TT2 is equal to or less than a predetermined second allowable error. You may employ | adopt as conditions of this. Each of the first and second tolerances may be experimentally determined in advance in accordance with the temperature accuracy required for the inspection.

  In the next steps S160 and S170, the probe device 100 (FIGS. 1 and 2) is separated from the support device 200. As a result, as shown in FIG. 7A, the probes 111 and 112 are separated from the terminals 311 and 312 (S160), respectively, and the pressing portion 113 is separated from the main body 320 (S170).

  In the next step S_F1, the first control unit 510 (FIG. 1) ends the temperature adjustment of the support unit 220. In the next step S_F2, the second control unit 520 (FIG. 2) ends the temperature adjustment of the holding unit 120.

  In the next step S_R, the thermistor 300 is removed from the recess 220R (FIGS. 1 to 4). This operation may be performed by a machine (industrial robot) (not shown) or may be performed manually by an operator.

  As described above, in the present embodiment, the temperatures of the support part 220 and the holding part 120 that affect the temperature of the thermistor 300 are adjusted, so the temperature of the thermistor 300 is adjusted to the first target temperature TT1, Inspection can be performed (FIGS. 1 and 2).

  Moreover, since the pressing part 113 presses the main body 320 against the support part 220 (FIG. 7), it is possible to suppress the temperature of the thermistor 300 (particularly the main body 320) from greatly deviating from the first target temperature TT1.

  Further, since the pressing unit 113 is connected to the holding unit 120 (second block 122), the temperature of the pressing unit 113 is brought close to the temperature of the holding unit 120 by heat conduction between the pressing unit 113 and the holding unit 120. be able to. As a result, when the pressing part 113 contacts the main body 320 of the thermistor 300, it is possible to suppress the temperature of the thermistor 300 from deviating excessively from the target temperature (first target temperature TT1).

  In the present embodiment, the second target temperature TT2 (FIG. 2) of the holding unit 120 (plate 140) is set to a temperature higher than the first target temperature TT1 (FIG. 1) of the support unit 220. Therefore, the temperature of the probes 111 and 112 is excessively lower than the target temperature (first target temperature TT1) of the thermistor 300 in an environment where the temperature of the probes 111 and 112 is likely to be lower than the temperature of the holding unit 120. Can be suppressed. Furthermore, in the present embodiment, it is possible to suppress the temperature of the pressing portion 113 from being excessively lower than the target temperature. As a result, it is possible to suppress the temperature of the thermistor 300 from greatly deviating from the first target temperature TT1.

  In this embodiment, the temperature characteristic of the thermistor 300 at 100 degrees Celsius is measured. Here, temperature characteristics at a higher temperature (for example, 600 degrees Celsius) may be estimated from the measurement result. Such estimation can be performed according to the resistance / temperature characteristics of the thermistor. Further, temperature characteristics at a plurality of temperatures (for example, 25 degrees Celsius and 100 degrees Celsius) may be measured, and temperature measurement at a higher temperature may be estimated according to the plurality of measurement results. In this way, the estimation accuracy can be increased. Further, the temperature is not limited to 100 degrees Celsius and 25 degrees Celsius, and other temperatures may be adopted.

B. Second Embodiment FIG. 8 is an explanatory diagram showing a configuration of a support device in a second embodiment. The only difference from the support device 200 shown in FIG. 1 is that the plate 240 is omitted. In the support device 200B of the present embodiment, the support portion 220 is directly fixed to the upper surfaces of the Peltier elements 230a and 230b. As a result, the temperature of the support part 220 can be adjusted with higher accuracy. The other configuration of the measuring apparatus is the same as that of the measuring apparatus 900 shown in FIGS.

C. Third embodiment:
FIG. 9 is an explanatory diagram showing the configuration of the probe apparatus according to the third embodiment. There are two differences from the probe apparatus 100 shown in FIG. The first difference is that the plate 140 is omitted. In the probe apparatus 100B of the present embodiment, the holding unit 120 (third block 123) is directly fixed to the front surface of the Peltier element 130. The second difference is that the temperature sensor 140T is fixed to the holding unit 120 (third block 123). As a result, the temperature of the holding unit 120 can be adjusted with higher accuracy. The other configuration of the measuring apparatus is the same as that of the measuring apparatus 900 of the first embodiment shown in FIGS. Instead of the support device 200 shown in FIG. 1, a support device 200B shown in FIG. 8 may be combined with the probe device 100B of the present embodiment.

D. Fourth embodiment:
FIG. 10 is a flowchart showing the procedure of the measurement process in the fourth embodiment. The only difference from the procedure shown in FIG. 6 is that step S_R is executed between steps S_F1 and S_F2. In this case, the same advantages as those of the first embodiment shown in FIG. 6 can be obtained. In some cases, the characteristics of many thermistors 300 are measured. In this case, a series of processes from step S110 to step S_R may be repeated. In addition, as a structure of a measuring apparatus, the structure of each above-mentioned Example is employable.

E. Example 5:
FIG. 11 is a flowchart showing the procedure of the measurement process in the fifth embodiment. The only difference from the procedure shown in FIG. 6 is that step S_R is executed between step S170 and step S_F1. In this case, the same advantages as those of the first embodiment shown in FIG. 6 can be obtained. In some cases, the characteristics of many thermistors 300 are measured. In this case, a series of processing from step S120 to step S_R may be repeated. In addition, as a structure of a measuring apparatus, the structure of each above-mentioned Example is employable.

F. Variations:
In addition, elements other than the elements claimed in the independent claims among the constituent elements in each of the above embodiments are additional elements and can be omitted as appropriate. The present invention is not limited to the above-described examples and embodiments, and can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

Modification 1:
In each of the above-described embodiments, the electronic component to be subjected to characteristic measurement is not limited to the thermistor 300, and any electronic component can be employed. For example, a pressure sensor, a concentration sensor, an acceleration sensor, or a GPS (Global Positioning System) receiver (GPS sensor) may be employed. In addition to such sensors, various electronic components such as diodes, transistors, integrated circuits, and chip antennas can be used. In either case, the portion including the element responsible for the electrical characteristics of the electronic component corresponds to the “main body of the electronic component”. Examples of such elements include a resistor whose resistance value changes with temperature, a cell that outputs a signal that changes according to the concentration of a specific gas, a semiconductor chip, an integrated circuit, and the like. A conductive member that is connected to such an element and inputs / outputs an electric signal between the element and the outside corresponds to the “terminal of the electronic component”. Further, the total number of probes is not limited to 2, and any number according to the electronic component and the characteristic to be measured can be adopted. Moreover, as a characteristic measured via a probe, not only an electrical resistance but arbitrary electrical characteristics are employable. For example, frequency characteristics may be measured. In this case, an AC signal may be supplied to the electronic component via a probe, and an output signal from the electronic component may be acquired via another probe. In any case, by applying the measuring apparatus and the measuring method of each embodiment described above, the temperature of the electronic component can be adjusted to the target temperature and the characteristic of the electronic component can be measured. In particular, when measuring characteristics that change depending on temperature, it is important to adjust the temperature of the electronic component to a target temperature, and thus the effect is remarkable. For example, the effect is particularly remarkable when measuring the temperature characteristics of various temperature sensors such as thermistors and thermocouples (corresponding relationship between temperature and signals obtained from the temperature sensor). The effect is also remarkable when the characteristics at a relatively high temperature are estimated from the measurement results of the characteristics at a relatively low temperature. In addition, arbitrary arrangement | positioning is employable as arrangement | positioning of the terminal in a main body. For example, a plurality of terminals (terminals 311 and 312) may be arranged on one surface of the main body 320 as in the thermistor 300 shown in FIG. Further, the terminals may be distributed and arranged on one surface of the main body and the surface opposite to the surface. In general, the terminals may be arranged at arbitrary positions on the main body. Further, any shape can be adopted as the shape of the terminal. For example, a rod-like terminal having one end connected to the main body (main body 320), such as the terminals (terminals 311 and 312) shown in FIG. Moreover, you may employ | adopt as a terminal the wire by which the end was connected to the main body. Moreover, you may employ | adopt the plate-shaped (layered) terminal laminated | stacked on the surface of the main body. Here, a part of the plate-like terminal may protrude outside the main body.

Modification 2:
In each of the above-described embodiments, any configuration that holds the probe can be adopted as the configuration of the holding portion. For example, in each of the above-described embodiments, each of the probes 111 and 112 (FIG. 2) may be fixed to the holding unit 120 (second block 122). In this case, in order to avoid an excessive force being applied to the thermistor 300, the movement of the probe device 100 is stopped in response to the probes 111 and 112 contacting the thermistor 300 (terminals 311 and 312). Is preferred. Similarly, the pressing part 113 may be fixed to the holding part 120 (second block 122). Here, the probes 111 and 112 and the pressing portion 113 may be fixed to the holding portion 120. In this case, it is preferable to determine the relative positions of the probes 111 and 112 and the pressing unit 113 so that the probes 111 and 112 and the pressing unit 113 are simultaneously in contact with the thermistor 300 by the movement of the holding unit 120. .

  Further, a rubber block may be adopted as the holding portion, and the probe may be inserted into the rubber. In this case, the holding portion (rubber) can hold the probe by friction. In this case, a protrusion may be provided on the rubber block, and the protrusion may be used as a pressing portion.

  Moreover, as a structure of a probe apparatus, not only the structure shown in FIG.1, FIG.2, FIG.5 and FIG. 9 but various structures are employable. For example, the holding unit 120 may be directly fixed to a moving device (for example, an air cylinder).

Modification 3:
In each of the above-described embodiments, as the configuration of the pressing portion, any configuration that can press the main body of the electronic component against the support portion can be employed. For example, the pressing unit may be separated from the holding unit 120. Further, the pressing portion may be fixed to the support portion 220. However, it is preferable that the pressing portion (pressing portion 113) is connected to the holding portion (holding portion 120) as in the above-described embodiment. Further, as in each of the above-described embodiments, the pressing unit 113 and the probes 111 and 112 are moved from the holding unit 120 by moving the holding unit 120 toward the electronic component (thermistor 300) supported by the support unit 220. It is preferable that the measuring apparatus is configured to move together toward the electronic component. In this way, the configuration of the measuring device can be simplified. In each of the above-described embodiments, the pressing unit 113 (FIG. 2) and steps S130 and S170 (FIGS. 6, 10, and 11) may be omitted.

Modification 4:
In each of the above-described embodiments, any configuration that supports an electronic component can be adopted as the configuration of the support portion. For example, as a recess for receiving an electronic component, a recess having a flat bottom without a step may be employed. Here, the main body of the electronic component may be in contact with the support portion (the bottom surface of the recess), and the terminal of the electronic component may be separated from the support portion (the bottom surface of the recess). Moreover, you may employ | adopt the support part without a recessed part which receives an electronic component. For example, a flat plate-shaped support portion may be employed and an electronic component may be placed on the surface of the flat plate. However, as in the embodiment shown in FIG. 4, it is preferable to employ a support portion having a recess for receiving an electronic component. By so doing, it is possible to suppress positional deviation of the electronic component. Further, the total number of electronic components supported by one support portion is not limited to 10, and an arbitrary number can be adopted.

  In any case, as in the embodiments shown in FIGS. 2 and 7, the support portion is in contact with the first part (first part 220 </ b> A) to be in contact with the terminal of the electronic component and the main body of the electronic component. The second portion (second portion 220B) is preferably supported. In this way, it is possible to suppress the unstable support of the electronic component. Each shape of the first part and the second part may be determined in accordance with the shape of the electronic component.

  Moreover, as a structure of a support apparatus, not only the structure shown in FIG.1, FIG.3, FIG.4 and FIG. 8 but various structures are employable. For example, the base 250 may be fixed to the moving device and move toward the probe device. Thus, in order for the probe to contact the terminal, at least one of the support part and the holding part may be moved.

Modification 5:
In each of the above-described embodiments, the measurement is performed under a temperature environment lower than the target temperature of the electronic component (first target temperature TT1 (FIG. 1)). However, the measurement is performed under a temperature environment higher than the target temperature. May be performed. In this case, the temperature of the portion (tip portion) in contact with the electronic component in each of the probes 111 and 112 (FIG. 2) becomes higher than the temperature of the holding unit 120 due to the temperature rise due to the high temperature environment. Therefore, by making the second target temperature TT2 of the holding unit 120 slightly lower than the first target temperature TT1, the temperature of the probes 111 and 112 is excessively higher than the target temperature of the electronic component (first target temperature TT1). Can be suppressed.

  In any case, the difference between the first target temperature TT1 of the support unit 220 and the second target temperature TT2 of the holding unit 120 is experimentally determined in advance so that the temperature of the electronic component does not greatly deviate from the target temperature. do it. Here, if the difference between the two target temperatures TT1 and TT2 is excessively large, the temperature adjustment accuracy of the electronic component may be lowered. Therefore, the difference between the two target temperatures TT1 and TT2 is preferably within 5 degrees, and particularly preferably within 2 degrees. Here, various methods can be adopted as a method of reducing the difference between the two target temperatures TT1 and TT2 without reducing the accuracy of temperature adjustment of the electronic component. For example, a method of bringing the temperature of the environment close to the target temperature of the electronic component may be employed. Further, when the temperature difference between the probe and the holding unit is sufficiently small, the second target temperature TT2 may be the same as the first target temperature TT1.

Modification 6:
In each of the above-described embodiments, the device for adjusting the temperature is not limited to the Peltier element, and any device can be employed. For example, when measurement is performed in a temperature environment lower than the target temperature, an electric heater may be used. The temperature can be adjusted by controlling ON / OFF of the electric heater. When performing measurement under a temperature environment higher than the target temperature, a cooler that circulates the coolant may be used. The temperature can be adjusted by controlling the ON / OFF of the coolant circulation. However, if the Peltier element is employed as in each of the above-described embodiments, the temperature can be adjusted by electrical control, so that the configuration of the temperature adjustment unit can be simplified. In addition, since heat generation and heat absorption can be switched by switching the direction of the current flowing through the Peltier element, highly accurate temperature adjustment is possible. However, when using a Peltier element, the temperature may be adjusted by controlling ON / OFF of either one of heat generation and heat absorption. Further, the total number of Peltier elements is not limited to 1 or 2, and any number can be adopted.

Modification 7:
In each of the above-described embodiments, the procedure of the measurement process is not limited to the procedure shown in FIGS. 6, 10, and 11, and various procedures can be employed. For example, in each of the above-described embodiments, any order can be adopted as the order of the five steps S100 to S140. For example, steps S100 and S110 may be executed between step S120 and step S130. Further, steps S100 and S110 may be executed after step S140. In any case, it is preferable to measure the characteristics of the electronic component in a state where the temperature of the holding unit and the temperature of the support unit are adjusted to the target temperatures, respectively. That is, the temperature of the support portion is maintained at the first target temperature within a predetermined first allowable error range, and the temperature of the holding portion is maintained at the second target temperature within a predetermined second allowable error range. It is preferable to measure the characteristics in the state of being applied. Moreover, it is preferable to measure the characteristics of the electronic component in a state where the main body of the electronic component is pressed against the support portion. Similarly, any order can be adopted as the order of the six steps S150 to S170, S_F1, S_F2, and S_R. For example, steps S_F1 and S_F2 may be executed before steps S160 and S170. In either case, step S_R is executed after steps S160 and S170.

Modification 8:
In each of the above embodiments, a part of the configuration realized by hardware may be replaced with software, and conversely, part or all of the configuration realized by software may be replaced with hardware. Also good. For example, the function of the first control unit 510 in FIG. 1 may be realized by a computer having a CPU and a memory and executing a program.

  In addition, when part or all of the functions of the present invention are realized by software, the software (computer program) can be provided in a form stored in a computer-readable recording medium. In the present invention, the “computer-readable recording medium” is not limited to a portable recording medium such as a flexible disk or a CD-ROM, but an internal storage device in a computer such as various RAMs and ROMs, a hard disk, and the like. An external storage device fixed to the computer is also included.

DESCRIPTION OF SYMBOLS 100, 100B ... Probe apparatus 111 ... 1st probe 112 ... 2nd probe 113 ... Pressing part 120 ... Holding part 121 ... 1st block 122 ... 2nd block 123 ... 3rd block 130 ... Peltier element 140 ... Plate 140T ... Temperature sensor DESCRIPTION OF SYMBOLS 150 ... Base part 200, 200B ... Support apparatus 220 ... Support part 220A ... 1st part 220B ... 2nd part 220R ... Recessed part 220T ... Temperature sensor 220A1 ... 1st recessed wall part 220A2 ... 2nd recessed wall part 230a ... Peltier element 240 ... Plate 250 ... Base 300 ... Thermistor 311 ... First terminal 312 ... Second terminal 320 ... Main body 510 ... First control unit 520 ... Second control unit 600 ... Measurement unit 900 ... Measuring device IG ... Inspection group

Claims (8)

An apparatus for measuring characteristics of an electronic component having a main body and a terminal,
A support portion for supporting the electronic component;
A first temperature adjusting unit for adjusting the temperature of the support unit to a predetermined first temperature;
A probe that contacts the terminal of the electronic component;
A holding unit for holding the probe;
A second temperature adjusting unit that adjusts the temperature of the holding unit to a predetermined second temperature;
A pressing unit that is connected to the holding unit and presses the main unit against the support unit by contacting the main unit of the electronic component;
Equipped with a,
The measurement apparatus in which the second temperature is set to a temperature higher than the first temperature as a temperature for measuring the characteristic under a temperature environment lower than the first temperature . The measuring device according to claim 1,
  The second temperature is higher than the first temperature and in a range of up to 5 degrees Celsius from the first temperature.
  measuring device. The measuring apparatus according to claim 1 or 2 ,
The first temperature adjustment unit includes a first Peltier element for adjusting the temperature of the support unit,
The second temperature adjustment unit includes a second Peltier element for adjusting the temperature of the holding unit,
measuring device. A measuring device according to any one of claims 1 to 3 ,
The electronic component is a temperature sensor having a portion whose electrical characteristics change according to a temperature change as the main body.
measuring device. A method for measuring characteristics of an electronic component having a main body and a terminal,
Adjusting the temperature of the support portion for supporting the electronic component to be a predetermined first temperature;
Adjusting the temperature of the holding unit for holding the probe to a predetermined second temperature;
Contacting the probe with the terminal of the electronic component supported by the support;
A step of pressing the main body against the support portion by bringing a pressing portion connected to the holding portion into contact with the main body of the electronic component;
Equipped with a,
The measurement method in which the second temperature is set to a temperature higher than the first temperature as a temperature for measuring the characteristic under a temperature environment lower than the first temperature . The measurement method according to claim 5, wherein
  The second temperature is higher than the first temperature and in a range of up to 5 degrees Celsius from the first temperature.
  Measuring method. The measurement method according to claim 5 or 6 , wherein
The step of adjusting the temperature of the support portion includes the step of adjusting the temperature of the support portion using a first Peltier element,
The step of adjusting the temperature of the holding unit includes the step of adjusting the temperature of the holding unit using a second Peltier element.
Measuring method. A measurement method according to any one of claims 5 to 7 ,
The electronic component is a temperature sensor having a portion whose electrical characteristics change according to a temperature change as the main body.
Measuring method.

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