JP2010135519A - Reinforcing plate mounting method in printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce man-hours by simultaneously pasting reinforcing plates onto both sides of a printed circuit board without using a pasting jig dedicated for each item. <P>SOLUTION: In this reinforcing plate mounting method in the printed circuit board for pasting and mounting the reinforcing plates 2a, 2b, 2c to both sides of the printed circuit board 1, a sacrificing part 7 having punched holes 6a, 6b, 6c formed by punching out the reinforcing plates 2a, 2b, 2c correspondingly to positions for mounting the reinforcing plates 2a, 2b, 2c on the printed circuit board 1 is integrated with the reinforcing plates 2a, 2b, 2c pushed back and mounted into the punched holes 6a, 6b, 6c, and a pair of front and rear reinforcing plate sheets 5a, 5b formed so that they can be disposed with the whole of one side of the printed circuit board 1 covered are crimped and pasted to the printed circuit board 1 by disposing adhesives 3 between the printed circuit board 1 and the reinforcing plates 2a, 2b, 2c respectively. Thereafter, the sacrificing parts 7 of the respective reinforcing plate sheets 5a, 5b are each peeled off from the printed circuit board 1 with the reinforcing plates 2a, 2b, 2c left there. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a reinforcing plate mounting method in a printed circuit board, and more particularly to a reinforcing plate mounting method in a printed circuit board that is attached by attaching a reinforcing plate to both sides of a printed circuit board.

  Conventionally, a reinforcing plate is often affixed to this type of printed circuit board, particularly a flexible printed circuit board, in order to ensure mechanical strength during component mounting or to prevent bending. The reinforcing plate is usually bonded only to one surface of the printed circuit board, but may be bonded to both the front and back surfaces. In addition, as a method of attaching the reinforcing plate to both the front and back surfaces of the printed circuit board, there are a method in which the reinforcing plate is attached to both the front and back surfaces at once and a method in which the reinforcing plate is attached to each side (for example, Patent Document 1 and Patent Document 2). reference).

In the reinforcing plate mounting structure in the printed circuit board described in Patent Document 1 and Patent Document 2, when the reinforcing plate is bonded to both the front and back surfaces of the printed circuit board, the front and back surfaces are bonded to the same place, and the reinforcing plate has the same shape. Are pasted together. In this bonding method, when the reinforcing plate is bonded to both the front and back surfaces at the same time, or when bonding one surface at a time, the reinforcing plate on the surface side that has been bonded first becomes the backing, so that When the reinforcing plate is bonded to the opposite surface to be bonded, the printed circuit board is not adversely affected even if the reinforcing plate is pressure-bonded.
Japanese Utility Model Publication No. 3-120063. JP2003-324256A.

  However, when the reinforcing plate is bonded to both the front and back surfaces of the printed circuit board at once, or when the reinforcing plates are bonded one by one, if the position where the reinforcing plate is bonded to the front and back surfaces and the shape of the reinforcing plate are greatly different, for example, FIG. When the reinforcing plates 101a, 101b, and 101c are pressure-bonded to the printed circuit board 102, an abnormal load is applied to part A of the printed circuit board 102, and the printed circuit board 102 is cracked, or There were problems such as generation of wrinkles and dents.

  In order to avoid this problem, conventionally, when a reinforcing plate is first bonded to one surface of the printed circuit board and then the reinforcing plate is bonded to the other surface, for example, as shown in FIG. A printed circuit board 102 is placed on a bonding jig 104 provided with a recess 103 corresponding to a portion of the reinforcing plate 101c that has already been bonded to the surface, with the one surface facing the bonding jig 104. The one reinforcing plate 101c is released and the reinforcing plates 101a and 101b are bonded to the other surface from above.

  However, bonding the reinforcing plates 101a, 101b, and 101c one side at a time increases the number of steps and requires a dedicated bonding jig for each item whose shape, size, etc. of the printed circuit board 102 changes. In the case of high-mix low-volume production, preparing a dedicated bonding jig for each item leads to an increase in cost and has a problem.

  Therefore, there is a technical problem to be solved in order to reduce the man-hours by allowing the reinforcing plates to be bonded to both sides of the printed circuit board at the same time without using a dedicated bonding jig for each item. The present invention aims to solve this problem.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is the reinforcing plate mounting method for a printed circuit board in which a reinforcing plate is attached to both sides of the printed circuit board. A discarded portion having a punched hole formed by punching the reinforcing plate corresponding to a position on the printed circuit board to which the plate is attached and the reinforcing plate attached by being pushed back into the punched hole are integrated. A pair of front and back reinforcing plate sheets formed so as to be disposed so as to cover substantially the entire one side of the printed circuit board, and an adhesive is provided between the printed circuit board and the reinforcing plate, respectively. Then, the reinforcing plate is left and the discarded portion of each reinforcing plate sheet is peeled off from the printed circuit board. Providing reinforcing plate mounting method in the cement circuit board.

  According to this method, the reinforcing plate sheet can be handled in the state of a flat sheet before bonding. Then, the reinforcing plate sheet for the front surface and the reinforcing plate sheet for the back surface are respectively positioned and overlapped on the front and back surfaces of the printed circuit board, and the printed circuit board and each reinforcing plate sheet are pressure-bonded. Reinforcing plate sheets can be simultaneously bonded to the front and back surfaces of the substrate. And since each sheet | seat for reinforcing plates is in the state of a flat sheet at the time of bonding, a reinforcing plate can be bonded simultaneously on both surfaces, without using a special bonding jig.

  In addition, when the printed circuit board and each reinforcing plate sheet are pressure-bonded, the reinforcing plate in which an adhesive is disposed between the printed circuit board and the printed circuit board is bonded to the printed circuit board. The discarded portion where no is disposed is not bonded to the printed circuit board. Therefore, when the front and back reinforcing plate sheets are peeled off from the printed circuit board after crimping, the reinforcing plate bonded with the adhesive remains adhered to the printed circuit board, and the unbonded discarded part is removed from the printed circuit board. Torn off.

  According to a second aspect of the present invention, there is provided a reinforcing plate attaching method for a printed circuit board according to the first aspect, wherein the adhesive is printed on the printed circuit board.

  According to this method, when the adhesive is preliminarily printed on the printed circuit board and the printed circuit board and the reinforcing plate sheet are pressure-bonded when the adhesive is in a semi-cured state, the reinforcing plate is applied to the printed circuit board. Can be bonded together with an adhesive.

  According to a third aspect of the present invention, in the reinforcing plate mounting method for a printed circuit board according to the first aspect, a double-sided adhesive sheet material having a release sheet provided on the front side is attached to substantially the entire one side of the reinforcing plate sheet. The push-back processing of the reinforcing plate with respect to the reinforcing plate sheet is performed integrally with the double-sided adhesive sheet material, and the release sheet on the reinforcing plate side is peeled off before the reinforcing sheet material is pressure-bonded to the printed circuit board. Then, there is provided a reinforcing plate mounting method in a printed circuit board in which the printed circuit board and the reinforcing plate sheet are pressure-bonded.

  According to this method, when the reinforcing plate sheet is bonded to the printed circuit board, the release sheet of the double-sided adhesive sheet material attached to the reinforcing plate is peeled off, and then the printed circuit board and the reinforcing plate sheet are pressure-bonded. Then, the reinforcing plate can be bonded to the printed circuit board with a double-sided adhesive sheet material.

  According to a fourth aspect of the present invention, there is provided the reinforcing plate mounting method in the printed circuit board according to the first, second or third aspect, wherein the reinforcing plate sheet has an opening at a position corresponding to the reinforcing plate. The spacer jig is interposed between the printed circuit board and the reinforcing plate sheet so that the reinforcing plate sheet is pressure-bonded to the printed circuit board, and at the time of the pressing, the spacer plate corresponds to the reinforcing plate of the reinforcing plate sheet. There is provided a reinforcing plate mounting method on a printed circuit board in which a crimping jig having a convex portion at a certain position is pressed against the reinforcing plate from the back side of the reinforcing plate sheet material and the reinforcing plate is pushed toward the printed circuit board.

  According to this method, when the reinforcing plate sheet is crimped to the printed circuit board, the convex portion of the crimping jig forcibly pushes the reinforcing plate to the printed circuit board side to remove the reinforcing plate from the reinforcing plate sheet, and The reinforcing plate is pressed against the printed circuit board.

  The invention according to claim 5 is the reinforcing plate mounting method in the printed circuit board according to claim 4, wherein after the press bonding of the printed circuit board and the reinforcing plate sheet, the pin is protruded through the printed circuit board, Provided is a method for attaching a reinforcing plate on a printed circuit board, in which the discarded portion of the reinforcing plate sheet is pushed up and peeled off from the printed circuit board by the pins.

  According to this method, after the printed circuit board and the reinforcing plate sheet are pressure-bonded, the reinforcing plate sheet is forcibly peeled off from the printed circuit board by pushing up the pins protruding through the printed circuit board.

  The invention according to claim 6 is the reinforcing plate mounting method in the printed circuit board according to claim 4, wherein when the printed circuit board and the reinforcing plate sheet are pressure-bonded, a pin is projected through the printed circuit board, Provided is a method for attaching a reinforcing plate on a printed circuit board, wherein the pin pushes the discarded portion of the reinforcing plate sheet toward the crimping jig disposed opposite to the printed circuit board and pulls the discarded portion away from the printed circuit board. To do.

  According to this method, after the printed circuit board and the reinforcing plate sheet are pressure-bonded, the discarded portion of the reinforcing plate sheet is opposed to the printed circuit board by the protrusion of the pin protruding through the printed circuit board. The printed circuit board is forcedly peeled off from the printed circuit board by being pushed to the crimping jig side.

  The invention according to claim 7 is the reinforcing plate mounting method in the printed circuit board according to claim 4, wherein after the printed circuit board and the reinforcing plate sheet are pressure-bonded, from the outer side to the inner side of the crimping jig. Provided is a method for attaching a reinforcing plate on a printed circuit board, in which a pin is protruded and a discarding portion of the reinforcing sheet is pulled away from the crimping jig by the pin.

  According to this method, after the printed circuit board and the reinforcing plate sheet are crimped, the pins protruding from the outer side to the inner side of the crimping jig are arranged on the back side of the printed circuit board, respectively. The discarded portions of the reinforcing plate sheets are forcibly peeled off from the crimping jig.

  In the first aspect of the present invention, the reinforcing plate sheet is handled in the state of a flat sheet before bonding, and is pressed onto the printed circuit board in the flat sheet state. On the other hand, crimping force is applied almost evenly, and the bonding position of the reinforcing plate is different on the front and back surfaces. Even if both surfaces are bonded simultaneously, problems such as folds and wrinkles occur on the flexible printed circuit board. There is nothing. Further, since the reinforcing plates can be bonded simultaneously on both sides without using a dedicated bonding jig for each item, man-hours can be reduced.

  The invention according to claim 2 can be automated by providing an adhesive layer on the printed circuit board by printing, and in addition to the effect of the invention according to claim 1, further reduction of the man-hour can be expected.

  According to a third aspect of the present invention, when the release sheet of the double-sided adhesive sheet material attached to the reinforcing plate is peeled off and the printed circuit board and the reinforcing board sheet are pressure-bonded, the reinforcing plate is attached to the printed circuit board on both sides. Since it can be bonded and bonded with an adhesive sheet material, in addition to the effect of the invention of claim 1, simplification of the bonding operation can be expected.

  When the reinforcing plate sheet is pressure-bonded to the printed circuit board, the back surface of the reinforcing plate is pushed by the convex portion of the crimping jig to forcibly separate the reinforcing plate from the discarded portion, and the reinforcing plate Therefore, in addition to the effect of the first, second, or third aspect, the reliability of bonding is improved.

  According to the fifth aspect of the present invention, after the printed circuit board and the reinforcing plate sheet are pressure-bonded, the reinforcing plate sheet is forcibly pulled from the printed circuit board by pushing up the pins protruding from the back side of the reinforcing plate sheet. Since it peels off, in addition to the effect of the invention of claim 4, the reinforcing plate and the discarding portion can be surely separated.

  According to the sixth aspect of the present invention, after the printed circuit board and the reinforcing plate sheet are pressure-bonded, the discarded portion of the reinforcing plate sheet is forcibly separated from the printed circuit board by the protrusion of the pin protruding from the printed board side. Therefore, in addition to the effect of the invention of the fourth aspect, the reinforcing plate and the discarding portion can be more reliably separated.

  According to the seventh aspect of the present invention, after the printed circuit board and the reinforcing plate sheet are pressure-bonded, the protruding portions of the pins protruding from the outer side to the inner side of the crimping jig are used to fix the discarded portions of the reinforcing plate sheets. Since it is forcibly peeled off from the tool, in addition to the effect of the invention of claim 4, the separation of the crimping jig and the discarding part is further ensured.

  In order to achieve the object of reducing the number of man-hours by allowing the reinforcing plates to be simultaneously bonded to both sides of the printed circuit board without using a dedicated bonding jig for each item, the present invention In a reinforcing plate mounting method for a printed circuit board that is attached by attaching a reinforcing plate to both sides of the board, a discarding portion having a punched hole formed by punching the reinforcing plate corresponding to a position on the printed circuit board to which the reinforcing plate is attached And a pair of front and back reinforcing plate sheets formed integrally with the reinforcing plate attached by being pushed back into the punched hole and covering substantially the entire one side of the printed circuit board, Adhesive material is disposed between the printed circuit board and the reinforcing plate, respectively, and bonded to the printed circuit board by pressure bonding, and then the reinforcing plate is left. It was achieved by the each reinforcing plate sheet discarding unit to peel from the printed circuit board, respectively Te.

  Hereinafter, the reinforcing plate mounting method in the printed circuit board of the present invention will be described with reference to preferred embodiments.

  FIG. 1 is a longitudinal side view showing an example of a printed circuit board formed by using the reinforcing plate mounting method of the present invention. In the figure, a printed circuit board 1 is a sheet-like board, and two reinforcing plates 2a and 2b are attached to each other on the front surface side by an adhesive 3, and one reinforcing plate 2c is attached to the rear surface side. Are attached with an adhesive 3. Further, a plurality of guide holes 4 are provided through the front and back surfaces at positions that do not affect the wiring of the printed circuit board 1 and the bonding of the reinforcing plates 2a, 2b, and 2c.

  The printed circuit board 1 in the present embodiment is a flexible circuit board as an example, but may be a circuit board other than the flexible circuit board. In general, the number, size, shape, and the like of the reinforcing plates 2a, 2b, and 2c bonded to the printed circuit board 1 are different for each circuit board item.

  FIG. 2 is a view showing a first embodiment of a method for attaching the reinforcing plates 2a, 2b, 2c to the printed circuit board 1, and FIGS. 1 (1) to (6) show the procedure. In the order of FIGS. 1 (1) to (6), in FIG. 2 (1), reinforcing plates 2a, 2b and 2c are attached to the printed circuit board 1 in advance in accordance with the positions where the reinforcing plates 2a, 2b and 2c are attached. A layer of adhesive material 3 is formed. In the first embodiment, the layer of the adhesive 3 is printed on the printed circuit board 1.

  In FIG. 2 (2), a front reinforcing plate sheet 5a and a back reinforcing sheet 5b having a size capable of covering almost the entire one surface of the printed circuit board 1 are prepared.

  In FIG. 2 (3), the reinforcing plates 2a and 2b are punched out in correspondence with the positions of the reinforcing plates 2a and 2b attached to the surface side of the printed circuit board 1 from the reinforcing plate sheet 5a for the surface, and the reinforcing plate 2a , 2b are punched back into the punched holes 6a, 6b, respectively, and the reinforcing plates 2a, 2b are pushed back to return the reinforcing plates 2a, 2b and the discard portion 7a, which is a portion other than the reinforcing plates 2a, 2b, Are integrated again to return to the form of the reinforcing plate sheet 5a for the surface which is in a sheet state. The reinforcing plate sheet 5a is provided with a plurality of guide holes 8a corresponding to the guide holes 4 of the printed circuit board 1 simultaneously with the punching of the reinforcing plates 2a and 2b.

  In FIG. 2 (4), the reinforcing plate 2c is punched out in correspondence with the position of the reinforcing plate 2c attached to the back side of the printed circuit 1 from the reinforcing plate sheet 5b for the back surface, and the reinforcing plate 2c is punched out. The reinforcing plate 2c is pushed back into the punched hole 6c and returned, and the reinforcing plate 2c and the discarding portion 7b other than the reinforcing plate 2c are integrated again to form a sheet-like reinforcing plate sheet for the back surface. Return to the form of 5b. The reinforcing plate sheet 5b is provided with a plurality of guide holes 8b corresponding to the guide holes 4 of the printed circuit board 1 simultaneously with the punching of the reinforcing plate 2c.

  In FIG. 2 (5), the printed circuit board 1 in which the reinforcing plate 2a and 2b are pushed back and the reinforcing plate 5b from which the reinforcing plate 2c is pushed back are provided with layers of the adhesive 3 respectively. The guide pins 9, 9 and the guide holes 4, and the guide pins 9, 9 and the guide holes 8a, 8b are respectively positioned and arranged on the front and back surfaces. Further, the printed circuit board 1 and the reinforcing plate sheet 5a, and the printed circuit board 1 and the reinforcing plate sheet 5b are simultaneously pressed by the crimping jigs (not shown) arranged above and below, respectively. In addition, the adhesive material 3 is made into a semi-hardened state before pressure bonding. Accordingly, when the printed circuit board 1 and the reinforcing plate sheet 5a and between the printed circuit board 1 and the reinforcing plate sheet 5b are simultaneously pressed, the reinforcing plates 2a, 2b and 2c respectively apply the adhesive 3 to the printed circuit board 1. And bonded together.

  In FIG. 2 (6), after bonding, the crimping by the crimping jig is released, and the reinforcing plate sheet 5 a and the reinforcing plate sheet 5 b are peeled off from the printed circuit board 1. At this time, the reinforcing plates 2a, 2b, and 2c bonded with the adhesive 3 remain attached to the printed circuit board 1, and the discarded portions 7a and 7b that are not bonded with the adhesive 3 are removed from the printed circuit board 1. Torn off. Thereby, the printed circuit board 1 to which the reinforcing plates 2a, 2b and 2c shown in FIG. 1 are attached is completed.

  Therefore, in the method of attaching the reinforcing plates 2a, 2b, 2c to the printed circuit board 1 as in the first embodiment, the reinforcing plate sheets 5a, 5b are in the state of a flat sheet before the reinforcing plates 2a, 2b, 2c are bonded together. In addition, the reinforcing plate sheets 5a and 5b are surface-bonded to the printed circuit board 1 in the state of a flat sheet at the time of crimping by the crimping jig. As a result, a crimping force is applied almost evenly to each surface of the printed circuit board 1 and the reinforcing plate sheets 5a and 5b at the time of crimping, and even the printed circuit board 1 such as a flexible printed circuit board, the printed circuit board No folds, wrinkles, etc. occur on both sides of 1. Further, the reinforcing plates 2a, 2b, and 2c can be bonded simultaneously on both sides without using a dedicated bonding jig for each item, so that the number of man-hours can be reduced.

  FIG. 3 is a view showing a second embodiment of the method of attaching the reinforcing plates 2a, 2b, 2c to the printed circuit board 1, and FIGS. 1 (1) to (7) show the procedure. In the order of FIGS. 1 (1) to (7), in FIG. 3 (1), the reinforcing plate sheet 5a for the front surface and the reinforcing material for the back surface are large enough to cover one side of the printed circuit board 1. A sheet 5b is prepared. In each of the reinforcing sheets 5a and 5b here, an adhesive 3 made of a double-sided adhesive sheet material is attached to the entire bonded surface. Further, a release sheet 10 that can be peeled and removed is bonded to the bonding surface side of the adhesive 3 with the printed circuit board 1.

  3 (2) and 3 (3), the reinforcing plates 2a and 2b are attached to the adhesive 3 in correspondence with the positions of the reinforcing plates 2a and 2b attached to the surface side of the printed circuit board 1 from the front reinforcing plate sheet 5a. The punching holes 6a and 6b formed by punching the reinforcing plates 2a and 2b are pushed back into the punching holes 6a and 6b, respectively, and returned to the reinforcing plate 2a and 2b. The plates 2a, 2b and the discarding portion 7a, which is a portion other than the reinforcing plates 2a, 2b, are integrated again to return to the form of the surface reinforcing plate sheet 5a [(3) in the figure]. Further, the release sheet 10 of the adhesive 3 attached to the reinforcing plates 2a and 2b returned into the punched holes 6a and 6b is peeled off. The reinforcing plate sheet 5a is provided with a plurality of guide holes 8a corresponding to the guide holes 4 of the printed circuit board 1 simultaneously with the punching of the reinforcing plates 2a and 2b.

  3 (4) and 3 (5), the reinforcing plate 2c is punched together with the adhesive 3 in correspondence with the position of the reinforcing plate 2c attached to the back surface side of the printed circuit board 1 from the reinforcing plate sheet 5b for the back surface. FIG. (4)], and the reinforcing plate 2c and the adhesive material 3 are pushed back into the punched holes 6c formed by punching the reinforcing plate 2c, and the discarded portions other than the reinforcing plate 2c and the reinforcing plate 2c are returned. 7b is integrated again to return to the form of the reinforcing plate sheet 5b for the back surface in the sheet state [(5) in FIG. Further, the release sheet 10 of the adhesive 3 attached to the reinforcing plate 2c returned to the punched hole 6c is peeled off. The reinforcing plate sheet 5b is also provided with a plurality of guide holes 8b corresponding to the guide holes 4 of the printed circuit board 1 simultaneously with the punching of the reinforcing plate 2c.

  In FIG. 3 (6), the reinforcing plate sheet 5 a with the reinforcing plates 2 a and 2 b pushed back and the reinforcing plate sheet 5 b with the reinforcing plate 2 c pushed back are respectively provided on the front and back surfaces of the printed circuit board 1 with the guide pins 9, 9. And the guide hole 4, the guide pins 9, 9 and the guide holes 8a, 8b, respectively. Further, the printed circuit board 1 and the reinforcing plate sheet 5a, and the printed circuit board 1 and the reinforcing plate sheet 5b are simultaneously pressed by the crimping jigs (not shown) arranged above and below, respectively. Therefore, when the printed circuit board 1 and the reinforcing plate sheet 5a and between the printed circuit board 1 and the reinforcing plate sheet 5b are simultaneously pressed, the reinforcing plates 2a, 2b, and 2c in the portion where the release sheet 10 is peeled off are respectively. The adhesive 3 is bonded to the printed circuit board 1, and the reinforcing plates 2a, 2b, and 2c are bonded to the printed circuit board 1.

  In FIG. 3 (7), after bonding, the crimping by the crimping jig is released, and the reinforcing plate sheet 5 a and the reinforcing plate sheet 5 b are peeled off from the printed circuit board 1. At this time, the reinforcing sheets 2a, 2b, 2c, which are peeled off from the release sheet 10 and adhered by the adhesive 3, remain attached to the printed circuit board 1, and the release sheet 10 of the adhesive 3 remains attached. The discard portions 7a and 7b are peeled off from the printed circuit board 1. Thereby, the printed circuit board 1 to which the reinforcing plates 2a, 2b and 2c shown in FIG. 1 are attached is completed.

  Therefore, even in the mounting method according to the second embodiment, the reinforcing plate sheets 5a and 5b are handled in the state of a flat sheet before the reinforcing plates 2a, 2b and 2c are bonded together. 5a and 5b are surface-bonded to the printed circuit board 1 in the form of a flat sheet. As a result, a crimping force is applied almost evenly to each surface of the printed circuit board 1 and the reinforcing plate sheets 5a and 5b at the time of crimping, and even the printed circuit board 1 such as a flexible printed circuit board, the printed circuit board No folds, wrinkles, etc. occur on both sides of 1. Further, the reinforcing plates 2a, 2b, and 2c can be bonded simultaneously on both sides without using a dedicated bonding jig for each item, so that the number of man-hours can be reduced.

  FIG. 4 is a view showing a third embodiment in which the method of attaching the reinforcing plates 2a, 2b, 2c to the printed circuit board 1 shown in FIGS. 2 and 3 is modified. FIGS. The procedure is shown. In the third embodiment, spacer jigs 11a and 11b are arranged between the printed circuit board 1 and the reinforcing plate sheet 5a and between the printed circuit board 1 and the reinforcing plate sheet 5b, and the crimping jigs 12a and 12b are used. Protrusions 16a, 16b, and 16c for pressing the reinforcing plates 2a, 2b, and 2c to the printed circuit board 1 from the back side of the reinforcing plate sheet 5a and the reinforcing plate sheet 5b at the time of crimping are provided. And it is substantially the same as the structure shown in FIG.

  2 and 3 will be described. The spacer jigs 11a and 11b are each formed in a sheet shape having a size capable of substantially covering the entire one surface of the printed circuit board 1. The spacer jig 11a is provided with openings 13a and 13b having substantially the same size as the reinforcing plates 2a and 2b corresponding to the reinforcing plates 2a and 2b of the reinforcing plate sheet 5a. The spacer jig 11b has a reinforcing plate. Corresponding to the reinforcing plate 2c of the sheet 5b, an opening 13c having the same size as the reinforcing plate 2c is provided.

  Corresponding to the openings 13a and 13b of the spacer jig 11a, the crimping jig 12a is provided with convex portions 16a and 16b having a slightly smaller shape than the openings 13a and 13b. Corresponding to the opening 13c of the tool 11b, a convex portion 16c having a shape slightly smaller than the opening 13c is provided. The height of the convex portions 16a, 16b, 16c is preferably slightly higher than the height obtained by subtracting the thickness of the adhesive 3 from the thickness of the spacer jigs 11a, 11b.

  In the third embodiment, the reinforcing plate 2a, 2b is pushed back, and the reinforcing plate 2b is pushed back to the front and back surfaces of the printed circuit board 1, respectively. 9, 9 and the guide hole 4, and the guide pins 9, 9 and the guide holes 8a and 8b are respectively positioned and arranged [(1) in the figure]. Further, when the upper and lower crimping jigs 12a and 12b are moved inward, the projections 16a and 16b of the crimping jig 12a pass through the openings 13a and 13b of the spacer jig 11a on the reinforcing jig 12a side. The other throwing portions 7a, 7b are blocked by the spacer jig 11a. On the other hand, on the crimping jig 12b side, the convex portion 16c of the crimping jig 12b is pressed against the reinforcing plate 2c through the opening 13c of the spacer jig 11b [(2) in the figure]. As a result, the reinforcing plates 2a, 2b, 2c are attached to the front and back surfaces of the printed circuit board 1 with the adhesive 3, respectively, and the printed circuit board 1 to which the reinforcing plates 2a, 2b, 2c are attached is completed.

  When the crimping is finished, the crimping jigs 12a and 12b are separated from each other. Next, the overlapped spacer jigs 12a and 12b, the reinforcing plate sheets 5a and 5b, and the printed circuit board 1 are removed from the crimping jigs 12a and 12b. Next, as shown in FIG. 3 (3), the removed reinforcing plate sheets 5a and 5b and the printed circuit board 1 are positioned and placed on the protruding jig 21 which is separately prepared, and the whole is placed. Press down. The projecting jig 21 is provided with a projecting pin 22, and by pushing down, the upper spacer jig 11 a is lifted together with the discarding part 7 of the reinforcing plate sheet 5 a and is forcibly separated from the printed circuit board 1. Thus, the discarding part 7 can be easily removed. Next, the lower reinforcing plate sheet 5b is also removed once together with the spacer jig 12b and the printed circuit board 1 and turned upside down. Then, the lower reinforcing plate sheet 5b is positioned and placed again on the protruding jig 21, and the whole is pushed down. The jig 11b is lifted together with the discarded portion 7 of the reinforcing plate sheet 5b and is forcibly separated from the printed circuit board 1, whereby the discarded portion 7 can be easily removed.

  FIG. 5 is a schematic diagram showing a modification in which a part of the third embodiment shown in FIG. 4 is modified. In the modification shown in FIG. 5, the upper crimping jig 12a is provided with a projecting pin 22 that projects the discarded portion 7 of the lower reinforcing plate sheet 5b, and the projecting pin 22 projects when the crimping is performed by the crimping jigs 12a and 12b. However, the discarding part 7 of the reinforcing plate sheet 5b is pressed against the lower crimping jig 12b so that the reinforcing plate 2c and the discarding part 7 are forcibly separated. In addition, since the other structure is the same as FIG. 4, the same structural part attaches | subjects the same code | symbol and abbreviate | omits duplication description.

  FIG. 6 is a view showing another modified example in which a part of the third embodiment shown in FIG. 4 is further modified. In the modified example shown in FIG. 6, the reinforcing plate sheet 5 a in which the reinforcing plates 2 a and 2 b are pushed back and the reinforcing plate sheet 5 b in which the reinforcing plate 2 c is pushed back are respectively provided on the front and back surfaces of the printed circuit board 1 as guide pins. 9, 9 and the guide hole 4, and the guide pins 9, 9 and the guide holes 8a and 8b are respectively positioned and arranged [(1) in the figure]. Further, when the upper and lower crimping jigs 12a and 12b are moved inward, the projections 16a and 16b of the crimping jig 12a are connected to the reinforcing plates 2a and 2b on the side of the crimping jig 12a. It is pressed against the surface side of the printed circuit board 1 through 13b, and the other discarded portions 7a and 7b are blocked by the spacer jig 11a. On the other hand, on the crimping jig 12b side, the convex portion 16c of the crimping jig 12b presses the reinforcing plate 2c through the opening 13c of the spacer jig 11b against the back surface side of the printed circuit board 1 [(2), ( 3)]. As a result, the reinforcing plates 2a, 2b, 2c are attached to the front and back surfaces of the printed circuit board 1 with the adhesive 3 to complete the printed circuit board 1 to which the reinforcing plates 2a, 2b, 2c are attached.

  When the crimping is finished, the crimping jigs 12a and 12b are separated from each other. Next, the spacer jigs 12a, 12b and the printed circuit board 1 are removed [(4) in FIG. 4], and the protruding pins 17a, 17b, 17c are projected from the crimping jigs 12a, 12b, respectively. The discarded portions 7a and 7b of the plate sheet 5b are forcibly removed from the crimping jigs 12a and 12b [(5) in the figure].

  Therefore, in the case of this modification, the reinforcing plates 2a, 2b, 2c are in a state where the discard portions 7a, 7b of the reinforcing plate sheets 5a, 5b are blocked by the spacer jigs 11a, 11b when the crimping jig 12a12b is pressed. Is pressed against the printed circuit board 1, so that the reinforcing plates 2a, 2b, 2c can be protruded from the discarded portions 7a, 7b of the reinforcing plate sheets 5a, 5b to be forcibly separated. Further, after crimping, the discarding portions 7a and 7b can be easily removed from the crimping jigs 12a and 12b.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The longitudinal side view which shows an example of the printed circuit board formed using the reinforcement board attachment method of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows 1st Example of this invention, (1) shows a printed circuit board, (2) is the reinforcement board sheet for front and back, (3) is the pushback process of the reinforcement board sheet for surface The procedure, (4) shows the pushback processing procedure of the back reinforcing sheet, (5) shows the state before crimping, and (6) shows the state after crimping. It is a figure which shows 2nd Example of this invention, (1) is the reinforcement board sheet for front and back, (2) and (3) is the procedure of the pushback process of the reinforcement board sheet for surface, (4) and (5) shows the procedure of pushback processing of the back reinforcing sheet, (6) shows the state before pressure bonding, and (7) shows the state after pressure bonding. It is a figure which shows 3rd Example of this invention, (1) is the state before crimping, (2) is the state after crimping, (3) is the state which removes the discard part of a reinforcement board sheet with a spacer jig | tool. Each is shown. It is a figure which shows one modification of 3rd Example of this invention, (1) is the state before setting to a crimping jig, (2) is the state before setting and crimping to a crimping jig, (3 ) Shows a state where it is set on a crimping jig and crimped, and (4) a state where the reinforcing plate and the discarding part are separated after crimping. It is a figure which shows the other modification of 3rd Example of this invention, (1) is the state before setting to a crimping jig, (2) is the state before setting to a crimping jig, and crimping | 3) shows a state where the crimping jig is set and crimped, (4) a state where the reinforcing plate and the discarding part are separated after crimping, and (5) shows a condition where the discarding part is separated from the crimping jig after crimping. The longitudinal side view which shows an example of the conventional reinforcement board attachment method. The longitudinal side view which shows the other example of the conventional reinforcement board attachment method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2a, 2b, 2c Reinforcement board 3 Adhesive material 4 Guide hole
5a Front reinforcing plate sheet 5b Back reinforcing plate sheets 6a to 6c Punching holes 7a and 7b Throwing portions 8a and 8b Guide holes 9 Guide pins 10 Release sheets 11a and 11b Spacer jigs 12a and 12b Crimping jigs 13a to 13c Opening 16a-16c Convex part 17a-17c Extrusion pin 21 Extrusion jig 22 Extrusion pin

Claims (7)

In the reinforcing plate mounting method in the printed circuit board, which is attached by attaching the reinforcing plate to both sides of the printed circuit board,
The discard part having a punched hole formed by punching the reinforcing plate corresponding to the position on the printed circuit board to which the reinforcing plate is attached and the reinforcing plate pushed back and attached in the punched hole are integrated. A pair of front and back reinforcing plate sheets formed so as to be disposed so as to cover substantially the entire one surface of the printed circuit board, and an adhesive is provided between the printed circuit board and the reinforcing plate, respectively. A method for attaching a reinforcing plate on a printed circuit board, wherein the reinforcing plate is left after being peeled off from the printed circuit board while leaving the reinforcing plate.   2. The reinforcing plate mounting method for a printed circuit board according to claim 1, wherein the adhesive material is provided by printing on the printed circuit board.   A double-sided adhesive sheet material provided with a release sheet on the surface side is attached to almost the entire surface of one side of the reinforcing plate sheet, and the push-back processing of the reinforcing plate to the reinforcing plate sheet is integrated with the double-sided adhesive sheet material. And removing the release sheet on the side of the reinforcing plate before the reinforcing sheet material is pressure-bonded to the printed circuit board, and then pressure bonding between the printed circuit board and the reinforcing plate sheet. The reinforcing plate attachment method in the printed circuit board of Claim 1.   A sheet-like spacer jig having an opening at a position corresponding to the reinforcing plate of the reinforcing plate sheet is interposed between the printed circuit board and the reinforcing plate sheet, and the reinforcing plate sheet is A crimping jig having a convex portion at a position corresponding to the reinforcing plate of the reinforcing plate sheet is pressed against the reinforcing plate from the back side of the reinforcing plate sheet material while being crimped to the printed circuit board. 4. The reinforcing plate mounting method for a printed circuit board according to claim 1, wherein the reinforcing plate is pressed toward the printed circuit board.   After pressure bonding between the printed circuit board and the reinforcing plate sheet, a pin protrudes through the printed circuit board, and the discarded portion of the reinforcing plate sheet is pushed up from the printed circuit board by the pin and peeled off. A reinforcing plate mounting method for a printed circuit board according to claim 4.   When the printed circuit board and the reinforcing plate sheet are pressure-bonded, a pin is protruded through the printed circuit board, and the discarded portion of the reinforcing plate sheet is disposed to face the printed board by the pin. 5. The method for attaching a reinforcing plate on a printed circuit board according to claim 4, wherein the pressing part is pressed toward the crimping jig and the discarded portion is separated from the printed circuit board.   After crimping the printed circuit board and the reinforcing plate sheet, a pin protrudes from the outer side to the inner side of the crimping jig, and the discarded portion of the reinforcing sheet is pulled away from the crimping jig by the pin. The reinforcing plate attachment method in the printed circuit board according to claim 4.

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