JP2010129994A - Method of manufacturing electronic component built-in printed circuit board - Google Patents

Method of manufacturing electronic component built-in printed circuit board Download PDF

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JP2010129994A
JP2010129994A JP2009030734A JP2009030734A JP2010129994A JP 2010129994 A JP2010129994 A JP 2010129994A JP 2009030734 A JP2009030734 A JP 2009030734A JP 2009030734 A JP2009030734 A JP 2009030734A JP 2010129994 A JP2010129994 A JP 2010129994A
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electronic component
printed circuit
circuit board
built
manufacturing
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JP4783835B2 (en
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Jin Seon Park
ション パク・ジン
Sung Yi
イ・ション
Jung Won Lee
ウォン リ・ジョン
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component built-in printed circuit board which includes hardening an attaching film and an insulating material through the use of ultrasonic waves to prohibit a chip shift and also to decrease the time of a production process. <P>SOLUTION: The method includes: arranging an electron component 300 on a top of an electron component supporting member 100, the electron component having an attaching film 500 applied onto the lower surface; applying an insulating material 900 to the top of the electronic component 300 and electronic component supporting member 100 and then performing an ultrasonic hardening process on the attaching film 500 and insulating material 900 concurrently to fix the electronic component 300 onto the electron component supporting member 100. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は電子部品内蔵型プリント基板の製造方法に係り、より詳しくは電子部品ピックアップツールと超音波硬化器が結合した電子部品実装装置を使用して電子部品内蔵型プリント基板を製造する方法に関するものである。   The present invention relates to a method of manufacturing a printed circuit board with a built-in electronic component, and more particularly to a method of manufacturing a printed circuit board with a built-in electronic component using an electronic component mounting apparatus in which an electronic component pickup tool and an ultrasonic curing device are combined. It is.

最近、次世代多機能性、小型パッケージ技術の一つとし、半導体チップ内蔵プリント基板の開発が注目されている。   Recently, development of a printed circuit board with a built-in semiconductor chip has attracted attention as one of the next generation multifunctional and small package technologies.

半導体内蔵基板は、このような多機能性、小型化の利点とともに高機能化の利点も持っている。これは、フリップチップまたはＢＧＡ（ｂａｌｌ ｇｒｉｄ ａｒｒａｙ）に使用されるワイヤボンディングまたはソルダーボールを利用した半導体チップの電気的連結過程で発生し得る信頼性問題を改善することができる方便を提供するからである。   A semiconductor-embedded substrate has the advantages of higher functionality as well as the advantages of multi-functionality and miniaturization. This is because it provides a convenience that can improve reliability problems that may occur in the electrical connection process of semiconductor chips using wire bonding or solder balls used in flip chip or BGA (ball grid array). is there.

従来のパッケージ基板の製造工程は、（ａ）基板を準備する段階、（ｂ）基板にダイ（ｄｉｅ ｏｒ ｃｈｉｐ）ボンディング（ｂｏｎｄｉｎｇ ｏｒ ａｔｔａｃｈｍｅｎｔ）を行う段階、（ｃ）高温熱圧着（ｈｅａｔ ｖａｃｕｕｍ ｐｒｅｓｓ）で積層（ｌａｍｉｎａｔｉｏｎ）する段階、及び（ｄ）回路及びビアを形成する段階から構成される。ここで、ダイボンディング工程は、基板あるいはピックアップツールを加熱するとともにウェハー（ｗａｆｅｒ）などに形成されているダイをピックアップして基板上に置き、ダイボンダーを基板に仮接着するために、一定時間圧力を加えてダイをボンディングする方法である。この際、液状の有機または無機接着剤またはフィルム型のダイアタッチフィルム（ｄｉｅ ａｔｔａｃｈ ｆｉｌｍ）を使用してダイを基板に接着するので、ダイボンディングの際、一定時間熱を加える工程が必要である。しかし、ダイを付着するために、一定時間基板全体にわたって熱を加える場合、最初に置いたダイと最後に置いたダイが熱を受ける時間が違うので、ダイシフト（ｓｈｉｆｔ）などを引き起こす問題点があった。   A conventional package substrate manufacturing process includes (a) preparing a substrate, (b) performing die or chip bonding or attachment to the substrate, and (c) high-temperature thermocompression (heat vacuum press). And laminating, and (d) forming circuits and vias. Here, in the die bonding process, the substrate or the pick-up tool is heated and the die formed on the wafer is picked up and placed on the substrate, and a pressure is applied for a certain time in order to temporarily bond the die bonder to the substrate. In addition, the die is bonded. At this time, since the die is bonded to the substrate using a liquid organic or inorganic adhesive or a film-type die attach film, a process of applying heat for a certain time is required during die bonding. However, when heat is applied to the entire substrate for a certain period of time in order to attach the die, there is a problem that the die placed first and the last die are subjected to heat different times, causing die shift and the like. It was.

また、ダイの上部に絶縁材を高温熱圧着して積層する方法は、ガラス転移温度（Ｔｇ）より１５〜２０℃高い熱を加えることで、半硬化した樹脂を完全に硬化させる工程であって、これは数時間の熱硬化過程が必要なので、工業的見地で非経済的であるという問題点があった。   The method of laminating the insulating material on the upper part of the die by high-temperature thermocompression bonding is a process of completely curing the semi-cured resin by applying heat 15 to 20 ° C. higher than the glass transition temperature (Tg) Since this requires a thermosetting process of several hours, there is a problem that it is uneconomical from an industrial point of view.

本発明は前記のような従来技術の問題点を解決するためになされたもので、超音波を利用して付着フィルム及び絶縁材を硬化することで、チップのシフトの発生をなくし、製造工程時間を短縮させることができる電子部品内蔵型プリント基板の製造方法を提供するすることにその目的がある。   The present invention has been made to solve the above-described problems of the prior art, and by curing the attached film and the insulating material using ultrasonic waves, the occurrence of chip shift is eliminated, and the manufacturing process time is reduced. It is an object of the present invention to provide a method for manufacturing a printed circuit board with a built-in electronic component that can shorten the length.

本発明による電子部品内蔵型プリント基板の製造方法は、（Ａ）電子部品支持部の上部に、下面に付着フィルムが塗布された電子部品を配置する段階；及び（Ｂ）前記付着フィルムを超音波硬化し、前記電子部品を前記電子部品支持部に固定する段階；を含む。   The method of manufacturing a printed circuit board with a built-in electronic component according to the present invention includes: (A) placing an electronic component having an adhesive film coated on the lower surface thereof on the upper part of the electronic component support; and (B) ultrasonicating the adhesive film. Curing and fixing the electronic component to the electronic component support.

前記（Ａ）段階及び前記（Ｂ）段階は、電子部品ピックアップツールと超音波硬化器が結合された電子部品実装装置によって行われることができる。   The steps (A) and (B) may be performed by an electronic component mounting apparatus in which an electronic component pickup tool and an ultrasonic curing device are combined.

前記（Ａ）段階の後、前記電子部品を取り囲むように、前記電子部品及び前記電子部品支持部の上部に絶縁材を塗布する段階をさらに含み、前記（Ｂ）段階の前記電子部品を前記電子部品支持部に固定する段階は、前記絶縁材と前記付着フィルムを同時に超音波硬化することでなされることができる。   After the step (A), the method further includes a step of applying an insulating material on the electronic component and the upper part of the electronic component support portion so as to surround the electronic component, and the electronic component in the step (B) is The fixing to the component support part can be performed by simultaneously ultrasonically curing the insulating material and the attached film.

前記付着フィルムはエポキシ系樹脂を含んでなることができる。   The adhesion film may comprise an epoxy resin.

前記電子部品支持部はプリント基板のキャビティの底面に形成されることができる。   The electronic component support part may be formed on the bottom surface of the cavity of the printed circuit board.

前記電子部品支持部はメタルシートであることができる。   The electronic component support part may be a metal sheet.

前記（Ｂ）段階の後、（Ｉ）前記電子部品を取り囲むように、前記電子部品及び前記電子部品支持部の上部に絶縁材を塗布する段階；及び（ＩＩ）前記絶縁材の上部に前記電子部品に形成された外部接続端子と接続するビア及び回路パターンを形成する段階；をさらに含むことができる。   After the step (B), (I) a step of applying an insulating material over the electronic component and the electronic component support so as to surround the electronic component; and (II) the electron over the insulating material. Forming a via and a circuit pattern connected to an external connection terminal formed on the component.

前記電子部品実装装置は、真空吸着器を含む前記ピックアップツールの一側に結合されたコンバータ、ブースター及び超音波ホーンを含む超音波硬化器を含んでなることができる。   The electronic component mounting apparatus may include an ultrasonic curing device including a converter, a booster, and an ultrasonic horn coupled to one side of the pickup tool including a vacuum suction device.

前記絶縁材はエポキシ系樹脂を含んでなることができる。   The insulating material may include an epoxy resin.

前記（Ｂ）段階の後、前記絶縁材の上部に前記電子部品に形成された外部接続端子と接続するビア及び回路パターンを形成する段階をさらに含むことができる。   After the step (B), the method may further include forming a via and a circuit pattern connected to the external connection terminal formed on the electronic component on the insulating material.

本発明の特徴及び利点は添付図面に基づく以下の詳細な説明からより明らかになるであろう。   The features and advantages of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

本明細書及び請求範囲に使用された用語または単語は通常的で辞書的な意味として解釈されてはならず、発明者が自分の発明を最良の方法で説明するために用語の概念を適切に定義することができるという原則にしたがって本発明の技術的思想に合う意味及び概念として解釈されなければならない。   The terms or words used in this specification and claims should not be construed as ordinary and lexicographical meanings, and the inventor should appropriately use the terminology concepts to explain their invention in the best possible way. In accordance with the principle that it can be defined, it should be interpreted as a meaning and a concept that fit the technical idea of the present invention.

本発明による電子部品内蔵型プリント基板の製造方法によれば、超音波を利用して絶縁層を硬化するため、分解温度（Ｔｄ）以下の温度で、厚さによって数秒ないし数十分に硬化時間を短縮させることができるので、工業的見地で経済的である。   According to the method for manufacturing a printed circuit board with a built-in electronic component according to the present invention, since the insulating layer is cured using ultrasonic waves, the curing time is several seconds to several tens of minutes depending on the thickness at a temperature lower than the decomposition temperature (Td). Is economical from an industrial point of view.

また、ピックアップツールと超音波硬化器が結合された電子部品実装装置によって行われるので、製造工程時間が短縮される利点がある。   Moreover, since it is performed by the electronic component mounting apparatus in which the pickup tool and the ultrasonic curing device are combined, there is an advantage that the manufacturing process time is shortened.

本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 1st Example of this invention to a process sequence. 本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 2nd Example of this invention to a process sequence. 本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 2nd Example of this invention to a process sequence. 本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 2nd Example of this invention to a process sequence. 本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 2nd Example of this invention to a process sequence. 本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。It is a figure which shows the manufacturing method of the electronic component built-in type printed circuit board by 2nd Example of this invention to a process sequence. 図１に示す電子部品実装装置の超音波硬化器の構成を概略的に示す図である。It is a figure which shows roughly the structure of the ultrasonic curing device of the electronic component mounting apparatus shown in FIG.

以下、本発明による電子部品内蔵型プリント基板の製造方法の好適な実施例を添付図面に基づいて詳細に説明する。添付図面の全般にわたって、同一ないし対応する構成要素は同一の図面符号を付け、その重複した説明は省略する。本明細書において、上部、下部などの用語は一つの構成要素を他の構成要素から区別するために使用するもので、構成要素が前記用語によって制限されるものではない。   Hereinafter, preferred embodiments of a method of manufacturing a printed circuit board with built-in electronic components according to the present invention will be described in detail with reference to the accompanying drawings. Throughout the attached drawings, the same or corresponding components are denoted by the same reference numerals, and redundant description thereof is omitted. In the present specification, terms such as upper and lower are used to distinguish one component from other components, and the component is not limited by the terms.

図１〜図６は本発明の好適な第１実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。   1 to 6 are views showing a method of manufacturing a printed circuit board with built-in electronic components according to a first preferred embodiment of the present invention.

まず、電子部品支持部１００の上部に、下面に付着フィルム５００が塗布された電子部品３００を配置する段階である。   First, the electronic component 300 having the lower surface coated with the adhesive film 500 is disposed on the electronic component support unit 100.

図１に示すように、電子部品ピックアップツール７００によって、電子部品３００が電子部品支持部１００の上部に移動する。   As shown in FIG. 1, the electronic component 300 is moved to the upper part of the electronic component support unit 100 by the electronic component pickup tool 700.

電子部品支持部１００は実装すべき電子部品３００を安定に支持する構成のもので、例えば両面銅張積層板（ＣＣＬ）、メタルシートなどであることができる。本発明における電子部品支持部１００は、後に形成されるプリント基板に電子部品３００を安定的に内蔵するようにプリント基板の製造工程で電子部品３００を支持する構成であれば充分である。すなわち、電子部品支持部１００は後に形成される電子部品内蔵型プリント基板の一部を構成することもでき、あるいは工程中に除去されてプリント基板に含まれない構成であることができる。本実施例においては、電子部品支持部１００として銅からなったメタルシートを使用する。   The electronic component support unit 100 is configured to stably support the electronic component 300 to be mounted, and may be, for example, a double-sided copper-clad laminate (CCL) or a metal sheet. The electronic component support unit 100 according to the present invention is sufficient if it is configured to support the electronic component 300 in the printed circuit board manufacturing process so that the electronic component 300 is stably incorporated in a printed circuit board to be formed later. That is, the electronic component support part 100 can constitute a part of a printed circuit board with a built-in electronic component formed later, or can be removed during the process and not included in the printed circuit board. In this embodiment, a metal sheet made of copper is used as the electronic component support portion 100.

ついで、図２に示すように、下面付着フィルム５００が塗布された電子部品３００を電子部品支持部１００の上面に位置させる。ここで、付着フィルム５００はエポキシ系樹脂を含むダイアタッチフィルム（ｄｉｅ ａｔｔａｃｈ ｆｉｌｍ）であることが好ましい。   Next, as shown in FIG. 2, the electronic component 300 to which the lower surface adhesion film 500 is applied is positioned on the upper surface of the electronic component support unit 100. Here, the adhesion film 500 is preferably a die attach film including an epoxy resin.

電子部品３００はプリント基板と電気的に連結されて特定の機能をする部品であって、例えばキャパシタ素子または半導体素子であることができ、電子部品３００の一面には、後に形成されるプリント基板と電気的に連結されることができる外部接続端子３１０が備えられる。本実施例においては、電子部品３００として内部に電子回路が集積した半導体チップを使用し、半導体の一面には電子部品３００に電気信号を伝達する外部接続端子３１０が形成されている。   The electronic component 300 is a component that is electrically connected to the printed board and has a specific function, and may be, for example, a capacitor element or a semiconductor element. An external connection terminal 310 that can be electrically connected is provided. In this embodiment, a semiconductor chip having an electronic circuit integrated therein is used as the electronic component 300, and an external connection terminal 310 for transmitting an electrical signal to the electronic component 300 is formed on one surface of the semiconductor.

ついで、図３に示すように、電子部品３００を取り囲むように、電子部品３００及び電子部品支持部１００の上部に絶縁材９００を塗布する。すなわち、電子部品支持部１００の上部に電子部品３００が配置されれば、好ましくはエポキシ系樹脂を含むプリプレグでなる絶縁材９００を塗布する。   Next, as shown in FIG. 3, an insulating material 900 is applied to the top of the electronic component 300 and the electronic component support unit 100 so as to surround the electronic component 300. That is, if the electronic component 300 is disposed on the electronic component support part 100, an insulating material 900 made of a prepreg preferably containing an epoxy resin is applied.

ついで、図４に示すように、付着フィルム５００及び絶縁材９００を同時に硬化させる。付着フィルム５００及び絶縁材９００を同時に超音波硬化させることで、電子部品３００を電子部品支持部１００に固定する。   Next, as shown in FIG. 4, the adhesion film 500 and the insulating material 900 are simultaneously cured. The electronic component 300 is fixed to the electronic component support part 100 by simultaneously ultrasonically curing the adhesion film 500 and the insulating material 900.

この際、電子部品３００の配置及び付着フィルム５００と絶縁材９００の硬化は、電子部品３００ピックアップツール７１０と超音波硬化器７３０が結合された電子部品３００用実装装置７００によって行われる。ここで、ピックアップツール７１０は電子部品３００を移すことができる真空吸着器７１１を含んで構成され、真空吸着器７１１の吸着力によって電子部品３００を持ち上げて所望の位置に配置させることができる。   At this time, the placement of the electronic component 300 and the curing of the adhesion film 500 and the insulating material 900 are performed by the mounting device 700 for the electronic component 300 in which the electronic component 300 pickup tool 710 and the ultrasonic curing device 730 are combined. Here, the pickup tool 710 includes a vacuum suction device 711 that can move the electronic component 300, and the electronic component 300 can be lifted and placed at a desired position by the suction force of the vacuum suction device 711.

超音波硬化器７３０は、超音波を縦方向または横方向に発生させる超音波ホーン７３５（図１２参照）を含む構成である。図１２は本実施例に使用される電子部品３００の実装装置７００に含まれた超音波硬化器７３０の概略的な構成図を開示し、これに基づいて超音波硬化器７３０を簡単に説明する。   The ultrasonic curing device 730 includes an ultrasonic horn 735 (see FIG. 12) that generates ultrasonic waves in the vertical direction or the horizontal direction. FIG. 12 discloses a schematic configuration diagram of the ultrasonic curing device 730 included in the mounting apparatus 700 for the electronic component 300 used in the present embodiment, and the ultrasonic curing device 730 will be briefly described based on this. .

図１２に示すように、超音波硬化器７３０は、大別して、電源及びアクチュエータ（図示せず）、コンバータ７３１、ブースター７３３、及び超音波ホーン７３５で構成される。コンバータ７３１は超音波装置の一部であって、アクチュエータに装着されている。コンバータ７３１（トランスデューサ）は電源から超音波電気エネルギーを受ける。高周波電気振動を電気振動と同一周波数の機械振動に変換させ、コンバータ７３１の核心部分は圧電セラミック素子でなっている。この要素に交流電圧を供給すれば、膨脹と収縮を繰り返し、結果的に電気的な周波数と９０％以上同一である機械的な周波数発振を行う機械的なエネルギーへの変換が可能になる。   As shown in FIG. 12, the ultrasonic curing device 730 is roughly composed of a power source and an actuator (not shown), a converter 731, a booster 733, and an ultrasonic horn 735. The converter 731 is a part of the ultrasonic device and is attached to the actuator. Converter 731 (transducer) receives ultrasonic electrical energy from a power source. High-frequency electrical vibration is converted into mechanical vibration having the same frequency as the electrical vibration, and the core of the converter 731 is made of a piezoelectric ceramic element. If an AC voltage is supplied to this element, it is possible to convert it into mechanical energy that repeats expansion and contraction, resulting in mechanical frequency oscillation that is 90% or more identical to the electrical frequency.

ブースター７３３はホーン７３５を通じて材料に伝達される振幅を増減させる機械的変換器として利用できる。超音波組立体の性能は正確なホーン７３５の表面の振幅により、振幅はホーン７３５形態の関数であって、溶着材料のサイズ及び形態によって大きな影響を受ける。ブースター７３３はアルミニウムまたはチタン材の共鳴性半波長セクションでなり、超音波スタックの一部としてコンバータ７３１とホーン７３５の間に装着される。ブースター７３３は、一緒に使用されるコンバータ７３１と同一の周波数で共鳴するように設計される。   The booster 733 can be used as a mechanical transducer that increases or decreases the amplitude transmitted to the material through the horn 735. The performance of the ultrasonic assembly is due to the exact horn 735 surface amplitude, and the amplitude is a function of the horn 735 morphology and is greatly affected by the size and morphology of the weld material. The booster 733 is a resonant half-wave section of aluminum or titanium material and is mounted between the converter 731 and the horn 735 as part of the ultrasonic stack. Booster 733 is designed to resonate at the same frequency as converter 731 used together.

超音波ホーン７３５は典型的に半波長セクションに調律され、必要な力と振動を溶着材料に均一に作用させる構成である。超音波ホーン７３５は、コンバータ７３１から接合材料に振動を伝達する。超音波ホーン７３５は、用途によって、チタン合金、アルミニウム、または鋼鉄で製作できる。   The ultrasonic horn 735 is typically tuned to a half-wave section and is configured to apply the required force and vibration uniformly to the weld material. The ultrasonic horn 735 transmits vibration from the converter 731 to the bonding material. The ultrasonic horn 735 can be made of titanium alloy, aluminum, or steel depending on the application.

さらに、図示されていないが、超音波硬化器７３０は、材料に作用する力を測定して超音波を稼働させ、接合条件を記録するロードセルをさらに含むことができる。   Further, although not shown, the ultrasonic curing device 730 may further include a load cell that measures the force acting on the material, operates the ultrasonic wave, and records the bonding conditions.

超音波硬化器７３０の作動に先立ち、示差走査熱量計（ＤＳＣ）で硬化対象物のエンタルピーを測定し、超音波硬化器７３０を作動し、測定されたエンタルピーの熱量を加える方法で超音波の振幅を調節することにより、材料のガラス転移温度（Ｔｇ）以上でありながら分解温度以下の温度を印加する。これにより、超音波を利用してエポキシ分子の振動を引き起こし、材料自体の発熱反応によって硬化を進めることができる。   Prior to the operation of the ultrasonic curing device 730, the enthalpy of the object to be cured is measured with a differential scanning calorimeter (DSC), the ultrasonic curing device 730 is operated, and the ultrasonic amplitude is applied by adding the calorie of the measured enthalpy. By adjusting the temperature, a temperature not lower than the decomposition temperature while being higher than the glass transition temperature (Tg) of the material is applied. Thereby, the vibration of the epoxy molecule is caused by using the ultrasonic wave, and the curing can be advanced by the exothermic reaction of the material itself.

前述した構成のピックアップツール７１０と超音波硬化器７３０を結合して一体化することにより、ピックアップツール７１０によって半導体チップが実装された位置に超音波硬化器７３０が配置されるので、装備の配置と硬化に必要な時間を短縮させることができる利点がある。ここで、本実施例の容易な理解のために、ピックアップツール７１０及び超音波硬化器７３０が電子部品３００及び絶縁材９００と付着する面積が非常に小さいものとして示されているが、ピックアップツール７１０の真空吸着器７１１は吸着対象物の電子部品３００に比べて面積が広いものが好ましく、超音波硬化器７３０の超音波ホーン７３５は硬化対象物の付着フィルム５００及び絶縁材９００の広さの約９０％の面積を持つことが好ましい。   By combining and integrating the pickup tool 710 and the ultrasonic curing device 730 having the above-described configuration, the ultrasonic curing device 730 is disposed at the position where the semiconductor chip is mounted by the pickup tool 710. There is an advantage that the time required for curing can be shortened. Here, for easy understanding of the present embodiment, the pickup tool 710 and the ultrasonic curing device 730 are shown as having very small areas attached to the electronic component 300 and the insulating material 900. The vacuum adsorber 711 preferably has a larger area than the electronic component 300 of the object to be adsorbed, and the ultrasonic horn 735 of the ultrasonic curing device 730 is about the size of the adhesion film 500 and the insulating material 900 of the object to be cured. It is preferable to have an area of 90%.

一方、前述した工程では、絶縁材９００を積層した後、付着フィルム５００と絶縁材９００を同時に超音波硬化する工程についてだけ説明したが、図５Ａに示すように、絶縁材９００積層前に付着フィルム５００を超音波硬化してから、図５Ｂに示すように、絶縁材９００を積層することも可能である。この際、絶縁材９００は必ずしも超音波硬化しなければならないものではなく、熱硬化方式で硬化することができる。   On the other hand, in the process described above, only the process of ultrasonically curing the adhesive film 500 and the insulating material 900 after laminating the insulating material 900 has been described. However, as shown in FIG. It is also possible to laminate the insulating material 900 after ultrasonically curing 500, as shown in FIG. 5B. At this time, the insulating material 900 does not necessarily have to be ultrasonically cured, and can be cured by a thermosetting method.

ついで、図６に示すように、絶縁材９００の両面に電子部品３００に形成された外部接続端子３１０と電気的に接続するビア９１０及び回路パターン９３０を形成する。   Next, as shown in FIG. 6, vias 910 and circuit patterns 930 that are electrically connected to the external connection terminals 310 formed on the electronic component 300 are formed on both surfaces of the insulating material 900.

付着フィルム５００及び絶縁材９００の硬化が完了すれば、ＹＡＧレーザーまたはＣＯ２レーザーを利用したレーザードリリングで絶縁材９００の一面に電子部品３００の外部接続端子３１０を露出するブラインドビアホールを形成し、通常のセミアディティブ法（ＳＡＰ）でビア９１０及び回路パターン９３０を形成することができる。この際、電子部品３００の下部には、メタルシートでなる支持部１００をエッチングして回路パターン９３０を形成することができ、図示されていないが、絶縁材９００の上下を電気的に連結するビアをさらに形成することができることはもちろんである。 When the adhesion film 500 and the insulating material 900 are cured, a blind via hole that exposes the external connection terminal 310 of the electronic component 300 is formed on one surface of the insulating material 900 by laser drilling using a YAG laser or a CO 2 laser. Via 910 and circuit pattern 930 can be formed by the semi-additive method (SAP). At this time, the circuit pattern 930 can be formed in the lower part of the electronic component 300 by etching the support part 100 made of a metal sheet. Although not shown, the vias electrically connecting the upper and lower sides of the insulating material 900 are not shown. Of course, can be further formed.

本実施例においては、メタルシートを利用して回路パターン９３０を形成し、セミアディティブ法で電子部品３００と接続するビア及び回路パターン９３０を形成する工程についてだけ説明したが、本発明がこれに制限されるものではない。当該技術分野の当業者であれば、メタルシートでなる電子部品支持部１００の下部に更なる下部絶縁層を積層し、下部絶縁層に回路パターン９３０を形成するか、更なるビルドアップ層を形成する方式などによって電子部品内蔵型プリント基板を構成することができることが容易に理解することができる。   In the present embodiment, the circuit pattern 930 is formed using a metal sheet, and only the process of forming the via and the circuit pattern 930 connected to the electronic component 300 by the semi-additive method has been described. Is not to be done. A person skilled in the art can stack a further lower insulating layer on the lower part of the electronic component supporting unit 100 made of a metal sheet, and form a circuit pattern 930 on the lower insulating layer or form a further build-up layer. It can be easily understood that a printed circuit board with a built-in electronic component can be configured by a method to do so.

図７〜図１１は本発明の好適な第２実施例による電子部品内蔵型プリント基板の製造方法を工程手順に示す図である。以下、これら図を参照して第２実施例について説明し、第１実施例と重複する説明は省略する。   7 to 11 are views showing a method of manufacturing a printed circuit board with a built-in electronic component according to a second preferred embodiment of the present invention. Hereinafter, the second embodiment will be described with reference to these drawings, and the description overlapping with the first embodiment will be omitted.

まず、プリント基板２００の電子部品３００形成用キャビティ２７０の底面に形成された電子部品支持部２１０に電子部品３００を位置させる段階である。   First, the electronic component 300 is positioned on the electronic component support portion 210 formed on the bottom surface of the cavity 270 for forming the electronic component 300 of the printed circuit board 200.

図７に示すように、電子部品支持部２１０を持つ両面プリント基板２００が提供される。本実施例の電子部品支持部２１０は、絶縁部材の両面に形成された回路パターン２３０、絶縁部材の両面を電気的に連結するビア２５０、及び絶縁材９００を貫通する電子部品３００実装キャビティ２７０を含むプリント基板２００のキャビティ２７０の底面に形成される。このような支持部２１０は、プリント基板２００に形成された金属パターンまたはプリント基板２００の下部に付着した支持テープであることができる。本実施例においては、両面プリント基板２００について例示的に図示及び説明するが、本発明がこれに限定されるものではなく、片面または多層プリント基板にも同様に本発明の技術的特徴を適用することができることはいうまでもない。プリント基板２００に形成されるキャビティ２７０はＣＮＣドリリングまたはレーザードリリングで加工することができ、プリント基板２００の製造は公知技術によってなされるので、ここではその詳細な説明は省略する。   As shown in FIG. 7, a double-sided printed circuit board 200 having an electronic component support unit 210 is provided. The electronic component support part 210 of the present embodiment includes circuit patterns 230 formed on both surfaces of the insulating member, vias 250 that electrically connect both surfaces of the insulating member, and an electronic component 300 mounting cavity 270 that penetrates the insulating material 900. It is formed on the bottom surface of the cavity 270 of the printed circuit board 200 including it. The support unit 210 may be a metal pattern formed on the printed circuit board 200 or a support tape attached to the lower part of the printed circuit board 200. In this embodiment, the double-sided printed circuit board 200 is illustrated and described as an example, but the present invention is not limited to this, and the technical features of the present invention are similarly applied to a single-sided or multilayer printed circuit board. It goes without saying that it can be done. The cavity 270 formed in the printed circuit board 200 can be processed by CNC drilling or laser drilling. Since the printed circuit board 200 is manufactured by a known technique, a detailed description thereof is omitted here.

電子部品支持部２１０が提供されれば、図８に示すように、下面付着フィルム５００が塗布された電子部品３００を電子部品支持部２１０の上面に位置させる。ここで、付着フィルム５００はエポキシ系の樹脂を含むダイアタッチフィルムであることが好ましい。   If the electronic component support unit 210 is provided, the electronic component 300 coated with the lower surface adhesion film 500 is positioned on the upper surface of the electronic component support unit 210 as shown in FIG. Here, the adhesion film 500 is preferably a die attach film containing an epoxy resin.

ついで、図９に示すように、電子部品３００を取り囲むように、電子部品３００及び電子部品支持部２１０の上部に絶縁材９００を塗布し、付着フィルム５００及び絶縁材９００を同時に硬化させる。   Next, as shown in FIG. 9, an insulating material 900 is applied on the electronic component 300 and the electronic component supporting portion 210 so as to surround the electronic component 300, and the adhesion film 500 and the insulating material 900 are simultaneously cured.

電子部品支持部２１０の上部に電子部品３００が配置されれば、好ましくはエポキシ系樹脂を含むプリプレグでなる絶縁材９００を塗布し、付着フィルム５００及び絶縁材９００を超音波硬化して電子部品３００を電子部品支持部２１０に固定する。絶縁材９００の塗布によってプリント基板２００のキャビティ２７０は絶縁材９００で充填される。   If the electronic component 300 is disposed on the electronic component support part 210, an insulating material 900 made of a prepreg, preferably containing an epoxy resin, is applied, and the adhesive film 500 and the insulating material 900 are ultrasonically cured to form the electronic component 300. Is fixed to the electronic component support unit 210. By applying the insulating material 900, the cavity 270 of the printed circuit board 200 is filled with the insulating material 900.

前述した電子部品３００の配置及び付着フィルム５００と絶縁材９００の硬化は、電子部品３００ピックアップツール７１０と超音波硬化器７３０が結合された電子部品３００実装装置７００によってなされる。   The arrangement of the electronic component 300 and the curing of the adhesion film 500 and the insulating material 900 are performed by the electronic component 300 mounting apparatus 700 in which the electronic component 300 pickup tool 710 and the ultrasonic curing device 730 are combined.

一方、前述した工程では、絶縁材９００を積層した後、付着フィルム５００と絶縁材９００を同時に超音波硬化する工程についてだけ説明したが、図１０に示すように、絶縁材９００の積層に先立ち、付着フィルム５００を超音波硬化した後、絶縁材９００を積層することも可能である。この際、絶縁材９００は必ずしも超音波硬化しなければならないものではなく、熱硬化方式で硬化することができる。   On the other hand, in the above-described process, only the process of ultrasonically curing the adhesion film 500 and the insulating material 900 after laminating the insulating material 900 has been described, but as shown in FIG. It is also possible to laminate the insulating material 900 after the adhesive film 500 is ultrasonically cured. At this time, the insulating material 900 does not necessarily have to be ultrasonically cured, and can be cured by a thermosetting method.

ついで、図１１に示すように、絶縁材９００の両面に電子部品３００に形成された外部接続端子３１０と電気的に接続するビア９１０及び回路パターンを形成する。   Next, as shown in FIG. 11, vias 910 and circuit patterns that are electrically connected to the external connection terminals 310 formed on the electronic component 300 are formed on both surfaces of the insulating material 900.

付着フィルム５００及び絶縁材９００の硬化が完了すれば、ＹＡＧレーザーまたはＣＯ２レーザーを利用したレーザードリリングで絶縁材９００の一面に電子部品３００の外部接続端子３１０及び両面プリント基板２００の回路層を露出するブラインドビアホールを形成し、無電解シード層を形成した後、メッキレジスト層を積層し、電解メッキを行う通常のセミアディティブ法でビア９１０及び回路層を形成することができる。 When the adhesion film 500 and the insulating material 900 are cured, the external connection terminals 310 of the electronic component 300 and the circuit layer of the double-sided printed circuit board 200 are exposed on one surface of the insulating material 900 by laser drilling using a YAG laser or a CO 2 laser. The via 910 and the circuit layer can be formed by an ordinary semi-additive method in which a blind via hole is formed, an electroless seed layer is formed, a plating resist layer is stacked, and electrolytic plating is performed.

前述した実施例による電子部品内蔵型プリント基板の製造方法によれば、超音波を利用して絶縁層を硬化するので、分解温度（Ｔｄ）以下の温度に数分ないし数十分に硬化時間を短縮させることができるので、工業的見地で経済的である。   According to the method for manufacturing a printed circuit board with a built-in electronic component according to the embodiment described above, since the insulating layer is cured using ultrasonic waves, the curing time is set to a temperature equal to or lower than the decomposition temperature (Td) for several minutes to several tens of minutes. Since it can be shortened, it is economical from an industrial point of view.

また、付着フィルム５００を先に超音波で硬化させる方式によれば、付着フィルム５００の硬化時間を１秒未満に減らすことができ、工程時間が短縮するだけでなく電子部品３００のシフトなどの誘発を防止することができる。   In addition, according to the method in which the adhesive film 500 is first cured with ultrasonic waves, the curing time of the adhesive film 500 can be reduced to less than 1 second, which not only shortens the process time but also induces a shift of the electronic component 300 or the like. Can be prevented.

また、本実施例による電子部品内蔵型プリント基板の製造はピックアップツール７１０と超音波硬化器７３０が結合された電子部品３００実装装置７００によってなされるので、製造工程時間が短縮する利点がある。   In addition, since the electronic component built-in type printed circuit board according to the present embodiment is manufactured by the electronic component 300 mounting apparatus 700 in which the pickup tool 710 and the ultrasonic curing device 730 are combined, there is an advantage that the manufacturing process time is shortened.

一方、本発明は前記開示した実施例に限定されるものではなく、本発明の思想及び範囲を逸脱しない範囲内で多様に修正及び変形できることが当該技術分野で通常の知識を持った者に明らかであろう。よって、そのような変形例または修正例は本発明の特許請求範囲に属するものである。   On the other hand, the present invention is not limited to the disclosed embodiments, and it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Will. Therefore, such a modification or a modification belongs to the claim of this invention.

本発明は、電子部品ピックアップツールと超音波硬化器が結合した電子部品実装装置を使用して電子部品内蔵型プリント基板を製造することに適用可能である。   The present invention can be applied to manufacturing an electronic component built-in type printed circuit board using an electronic component mounting apparatus in which an electronic component pickup tool and an ultrasonic curing device are combined.

１００、２１０ 電子部品支持部
２００ プリント基板
２１０ 電子部品支持部
２３０ 回路パターン
２５０ ビア
２７０ キャビティ
３００ 電子部品
３１０ 外部接続端子
５００ 付着フィルム
７００ 電子部品実装装置
７１０ ピックアップツール
７１１ 真空吸着器
７３０ 超音波硬化器
７３１ コンバータ
７３３ ブースター
７３５ 超音波ホーン
９００ 絶縁材
９１０ ビア
９３０ 回路パターン DESCRIPTION OF SYMBOLS 100,210 Electronic component support part 200 Printed circuit board 210 Electronic component support part 230 Circuit pattern 250 Via 270 Cavity 300 Electronic component 310 External connection terminal 500 Adhesion film 700 Electronic component mounting apparatus 710 Pickup tool 711 Vacuum suction device 730 Ultrasonic curing device 731 Converter 733 Booster 735 Ultrasonic horn 900 Insulating material 910 Via 930 Circuit pattern

Claims (10)

（Ａ）電子部品支持部の上部に、下面に付着フィルムが塗布された電子部品を配置する段階；及び
（Ｂ）前記付着フィルムを超音波硬化し、前記電子部品を前記電子部品支持部に固定する段階；
を含むことを特徴とする、電子部品内蔵型プリント基板の製造方法。 (A) A step of placing an electronic component having an adhesive film coated on the lower surface thereof on the upper part of the electronic component support part; and (B) ultrasonically curing the adhesive film and fixing the electronic component to the electronic component support part. Stage to do;
The manufacturing method of the printed circuit board with a built-in electronic component characterized by including these. 前記（Ａ）段階及び前記（Ｂ）段階は、
電子部品ピックアップツールと超音波硬化器が結合された電子部品実装装置によって行われることを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。 The step (A) and the step (B) include
The method of manufacturing a printed circuit board with a built-in electronic component according to claim 1, wherein the method is performed by an electronic component mounting apparatus in which an electronic component pickup tool and an ultrasonic curing device are combined. 前記（Ａ）段階の後、
前記電子部品を取り囲むように、前記電子部品及び前記電子部品支持部の上部に絶縁材を塗布する段階をさらに含み、
前記（Ｂ）段階の前記電子部品を前記電子部品支持部に固定する段階は、前記絶縁材と前記付着フィルムを同時に超音波硬化することでなされることを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。 After the step (A),
A step of applying an insulating material to the top of the electronic component and the electronic component support so as to surround the electronic component;
The step (B) of fixing the electronic component to the electronic component support unit is performed by simultaneously ultrasonically curing the insulating material and the adhesion film. Manufacturing method of printed circuit board with built-in electronic components. 前記付着フィルムはエポキシ系樹脂を含んでなることを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。   The method for manufacturing a printed circuit board with built-in electronic components according to claim 1, wherein the adhesion film comprises an epoxy resin. 前記電子部品支持部はプリント基板のキャビティの底面に形成されることを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。   The method of manufacturing a printed circuit board with a built-in electronic component according to claim 1, wherein the electronic component support part is formed on a bottom surface of a cavity of the printed circuit board. 前記電子部品支持部はメタルシートであることを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。   The method of manufacturing a printed circuit board with built-in electronic components according to claim 1, wherein the electronic component supporting portion is a metal sheet. 前記（Ｂ）段階の後、
（Ｉ）前記電子部品を取り囲むように、前記電子部品及び前記電子部品支持部の上部に絶縁材を塗布する段階；及び
（ＩＩ）前記絶縁材の上部に前記電子部品に形成された外部接続端子と接続するビア及び回路パターンを形成する段階；
をさらに含むことを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。 After the step (B),
(I) a step of applying an insulating material on the electronic component and the upper part of the electronic component supporting portion so as to surround the electronic component; and (II) an external connection terminal formed on the electronic component on the insulating material. Forming vias and circuit patterns to connect with;
The method for manufacturing a printed circuit board with a built-in electronic component according to claim 1, further comprising: 前記電子部品実装装置は、真空吸着器を含む前記ピックアップツールの一側に結合されたコンバータ、ブースター及び超音波ホーンを含む超音波硬化器を含んでなることを特徴とする、請求項２に記載の電子部品内蔵型プリント基板の製造方法。   3. The electronic component mounting apparatus according to claim 2, further comprising an ultrasonic curing device including a converter, a booster, and an ultrasonic horn coupled to one side of the pickup tool including a vacuum suction device. Manufacturing method for printed circuit boards with built-in electronic components. 前記絶縁材はエポキシ系樹脂を含んでなることを特徴とする、請求項２に記載の電子部品内蔵型プリント基板の製造方法。   The method for manufacturing a printed circuit board with built-in electronic components according to claim 2, wherein the insulating material comprises an epoxy resin. 前記（Ｂ）段階の後、
前記絶縁材の上部に前記電子部品に形成された外部接続端子と接続するビア及び回路パターンを形成する段階をさらに含むことを特徴とする、請求項１に記載の電子部品内蔵型プリント基板の製造方法。 After the step (B),
The printed circuit board with built-in electronic components according to claim 1, further comprising a step of forming a via and a circuit pattern connected to an external connection terminal formed on the electronic component on the insulating material. Method.
JP2009030734A 2008-11-25 2009-02-13 Manufacturing method of printed circuit board with built-in electronic element Expired - Fee Related JP4783835B2 (en)

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