JP2010129731A - Wiring board and probe card using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the following problem: when a connection member is sealed with a resin member, the connection member possibly peels from a first insulating base or second insulating base during use of the wiring board. <P>SOLUTION: The wiring board includes the first insulating base, a first conductive member arranged on a principal surface of the first insulating base, the second insulating base having an opposite surface opposed to the principal surface of the first insulating base, a second conductive member arranged on the opposite surface of the second insulating base, the resin member positioned between the first insulating member and second insulating member, and the connection member positioned between the first insulating base and second insulating base and electrically connecting the first conductive member and second conductive member to each other. The resin member has an opening for exposing at least a portion of a surface of the connection member to the outside. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wiring board used for a wiring board or a probe card on which electronic components are mounted.

  Conventionally, as a wiring board on which electronic components are mounted, an insulating substrate (first insulating substrate) having a main surface and a semiconductor integrated circuit chip (first device) disposed on the main surface of the insulating substrate. 2), a connecting member that electrically connects the insulating substrate and the semiconductor integrated circuit chip, and a resin board filled between the insulating substrate and the semiconductor integrated circuit chip. Is used (for example, Patent Document 1).

As described above, the wiring substrate disclosed in Patent Document 1 includes a resin member filled between the first insulating base and the semiconductor integrated circuit chip. Therefore, the thermal stress generated between the first insulating base and the second insulating base due to the thermal expansion and contraction of the first insulating base and the second insulating base is suppressed from concentrating on the connection member. Has been.
JP 2004-335507 A

  However, in the wiring board described in Patent Document 1, the connection member is sealed with a resin member. Therefore, when the wiring board is used, the connecting member may be peeled off from the first insulating base or the second insulating base. This is because, when the wiring board is used, the connecting member is heated, so that gas may be generated from the connecting member such as solder. At this time, if the connecting member is sealed, the generated gas expands, and the connecting member may be peeled off from the first insulating base or the second insulating base.

  This invention is made | formed in view of said subject, and it aims at providing the wiring board with the favorable connectivity by a connection member.

  The wiring board of the present invention includes a first insulating base, a first conductive member disposed on the main surface of the first insulating base, and the main surface of the first insulating base. A second insulating substrate having opposed surfaces; a second conductive member disposed on the facing surface of the second insulating substrate; the first insulating substrate; and the second insulating substrate. A resin member positioned between the insulating base, and the first conductive member and the second conductive member positioned between the first insulating base and the second insulating base; A connecting member for electrical connection. And the said resin member has an opening part which exposes at least one part of the surface of the said connection member outside.

  According to the wiring board of the present invention, the resin member has an opening that exposes at least a part of the surface of the connection member to the outside. Therefore, even when gas is generated from the connection member when the wiring board is used, the possibility that the connection member peels from the first insulating base and the second insulating base can be reduced.

  Hereinafter, the wiring board of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 to 3, the wiring board 1 according to the first embodiment of the present invention is disposed on the first insulating base 3 and the main surface 3 a of the first insulating base 3. The first conductive member 5, the second insulating base 7 having a facing surface 7 a facing the main surface 3 a of the first insulating base 3, and the opposing surface 7 a of the second insulating base 7 are arranged on the opposing surface 7 a. A second conductive member 9 provided, a resin member 11 positioned between the first insulating base 3 and the second insulating base 7, and the first insulating base 3 and the second insulating property. A connecting member 13 is provided between the base 7 and electrically connecting the first conductive member 5 and the second conductive member 9.

  And the resin member 11 has the opening part 15 which exposes at least one part of the surface of the connection member 13 outside. Thus, in the wiring board 1 according to the present embodiment, the resin member 11 has the opening 15 that exposes at least a part of the surface of the connection member 13 to the outside. Even when gas is generated from the connection member 13 at this time, the gas can be released to the outside through the opening 15. Therefore, the possibility that the connecting member 13 is peeled off from the first insulating base 3 and the second insulating base 7 can be reduced.

  The first insulating substrate 3 in the present embodiment includes a main surface 3a. As the first insulating substrate 3, a member having good insulating properties may be used. Specifically, a ceramic member and a resin can be used.

  In addition, the wiring board 1 of the present embodiment includes a via conductor 17 and a metal layer 19 embedded in the first insulating base 3. The via conductor 17 and the metal layer 19 are electrically connected to the first conductive member 5. As the via conductor 17 and the metal layer 19, a member having good electrical conductivity may be used. Specifically, metal conductors such as Sn, Ag, Au, and Cu can be used. In particular, it is preferable to use a metal conductor having a high melting point such as W, Mo and Mn.

  The first conductive member 5 in the present embodiment is disposed on the main surface 3 a of the first insulating substrate 3. The first conductive member 5 is electrically connected to the via conductor 17 and the metal layer 19, and a wiring circuit can be drawn out to the back side of the first insulating substrate 3 through these. As the first conductive member 5, a member having good electrical conductivity can be used similarly to the via conductor 17 and the metal layer 19. Specifically, metal conductors such as Sn, Ag, Au, and Cu can be used. In particular, it is preferable to use a metal conductor having a high melting point such as W, Mo and Mn.

  The second insulating substrate 7 in the present embodiment is disposed so as to face the first insulating substrate 3. At this time, the surface facing the first insulating substrate 3 is the opposing surface. As the second insulating substrate 7, a member having good electrical insulation may be used as in the case of the first insulating substrate 3. Specifically, a ceramic member and a resin can be used.

  Further, the via conductor 17 and the metal layer 19 are embedded in the second insulating substrate 7 in the present embodiment, similarly to the first insulating substrate 3. The via conductor 17 and the metal layer 19 embedded in the second insulating substrate 7 are electrically connected to the second conductive member 9.

  The second conductive member 9 in the present embodiment is disposed on the facing surface 7 a of the second insulating substrate 7. As the second conductive member 9, a member having good electrical conductivity can be used similarly to the via conductor 17 and the metal layer 19. Specifically, metal conductors such as Sn, Ag, Au, and Cu can be used. In particular, it is preferable to use a metal conductor having a high melting point such as W, Mo and Mn.

  The connection member 13 in this embodiment is located between the first insulating base 3 and the second insulating base 7 and electrically connects the first conductive member 5 and the second conductive member 9. is doing. As the connection member 13, it is preferable to use a member having good conductivity and at the same time having good bonding properties with the first conductive member 5 and the second conductive member 9. Specifically, it is preferable to use solder.

  The resin member 11 in this embodiment is located between the first insulating substrate 3 and the second insulating substrate 7. By providing such a resin member 11, the first insulating base 3 and the second insulating base 7 are associated with the thermal expansion and contraction of the first insulating base 3 and the second insulating base 7. It is suppressed that the thermal stress which arises during this is concentrated on the connection member 13.

  Further, the resin member 11 in the present embodiment has an opening 15 that exposes at least a part of the surface of the connection member 13 to the outside. The shape of the opening 15 is not particularly limited as long as it is formed so that at least a part of the surface of the connection member 13 is exposed to the outside, but is preferably cylindrical. As a result, the opening 15 is less likely to be blocked by the thermal expansion of the first insulating substrate 3 and the second insulating substrate 7. As a result, the gas generated from the connecting member 13 can be stably discharged to the outside.

  The first insulative base 3 and the second insulative base 7 thermally expand larger at a portion near the center than at a portion near the side surface. Therefore, it is preferable that the opening 15 has a larger diameter in a portion near the connection member 13 than a diameter in a portion near the side surfaces of the first insulating substrate 3 and the second insulating substrate 7. In such a case, the opening 15 is less likely to be blocked by thermal expansion of the first insulating base 3 and the second insulating base 7. As a result, the gas generated from the connecting member 13 can be stably discharged to the outside.

  In addition, the wiring board 1 according to the present embodiment includes a plurality of connection members 13, and the resin member 11 has holes 21 that open from one to the other of the adjacent connection members 13. As described above, since the resin member 11 has the holes 21 that open from one side of the adjacent connecting members 13 to the other, even if gas is generated from some of the connecting members 13, Gas can be diffused through the holes 21. Further, even when thermal stress is applied to the connecting member 13 and some of the openings 15 are crushed, the gas can be released from the other openings 15 through the holes 21. As a result, it is possible to suppress the gas generated from the connection member 13 from being collected around some of the connection members 13.

  Moreover, it is preferable that the connection member 13 and the resin member 11 are separated like this embodiment. When the connection member 13 and the resin member 11 are in contact with each other, a large stress is applied to the interface between the connection member 13 and the resin member 11 due to the gas generated from the connection member 13. However, when the connection member 13 and the resin member 11 are separated from each other, the stress is not applied, so that the stress applied to the connection member 13 and the resin member 11 can be reduced.

  Next, a wiring board according to a second embodiment of the present invention will be described.

  As shown in FIG. 4, the wiring board 1 according to the present embodiment has a cross section parallel to the main surface 3 a of the first insulating base 3 compared to the wiring board 1 according to the first embodiment. When the resin member 11 is viewed in cross section, the width L1 of the hole 21 is larger than the width L2 of the opening 15.

  As already shown, the first insulating base 3 and the second insulating base 7 thermally expand larger at a portion near the center than at a portion near the side surface. Like the wiring board 1 according to the present embodiment, the first insulating substrate is larger than the width L2 of the opening 15 located in the portion near the side surfaces of the first insulating substrate 3 and the second insulating substrate 7. 3 and the opening L 15 due to thermal expansion of the first insulating base 3 and the second insulating base 7 due to the large width L1 of the hole 21 located in the portion near the center of the second insulating base 7. And it becomes difficult for the hole 21 to be blocked. As a result, the gas generated from the connecting member 13 can be stably discharged to the outside.

  In particular, when the resin member 11 is viewed in a cross section in a cross section parallel to the main surface 3 a of the first insulating base 3, the width of the hole 21 located in a portion near the center of the first insulating base 3. However, it is preferable that the width is larger than the width of the hole 21 located in a portion far from the center of the first insulating substrate 3. Since the holes 21 are located farther from the side surface of the first insulating substrate 3 and closer to the center of the first insulating substrate 3, the width of the holes 21 is larger. This is because the possibility of being blocked by the thermal expansion of the second insulating substrate 7 can be further reduced.

  Next, a wiring board according to a third embodiment of the present invention will be described.

  As shown in FIG. 5, the wiring board 1 according to the present embodiment has a cross section perpendicular to the main surface 3 a of the first insulating base 3 as compared with the wiring board 1 according to the first embodiment. When the resin member 11 is viewed in cross section, the width L1 of the hole 21 is larger than the width L2 of the opening 15.

  As already shown, the first insulating base 3 and the second insulating base 7 thermally expand larger at a portion near the center than at a portion near the side surface. Like the wiring substrate 1 according to the present embodiment, the first insulating base 3 and the second insulating base 7 are more inferior than the width L2 of the opening 15 located near the side surface. Since the width L1 of the hole 21 located near the center of the third and second insulating bases 7 is large, the first insulating base 3 and the second insulating base are the same as in the second embodiment. Due to the thermal expansion of the substrate 7, the openings 15 and the holes 21 are not easily blocked. As a result, the gas generated from the connecting member 13 can be stably discharged to the outside.

  In particular, when the resin member 11 is viewed in a cross-section in a cross section perpendicular to the main surface 3 a of the first insulating substrate 3, the width of the hole 21 located in a portion near the center of the first insulating substrate 3. However, it is preferable that the width is larger than the width of the hole 21 located in a portion far from the center of the first insulating substrate 3. Since the holes 21 are located farther from the side surface of the first insulating substrate 3 and closer to the center of the first insulating substrate 3, the width of the holes 21 is larger. This is because the possibility of being blocked by the thermal expansion of the second insulating substrate 7 can be further reduced.

  Next, a wiring board according to a fourth embodiment of the present invention will be described.

  As shown in FIG. 6, in the wiring board 1 according to the present embodiment, an electronic component 23 is used as the second insulating substrate 7. As in the present embodiment, the resin member 11 has an opening 15 that exposes at least a part of the surface of the connection member 13 to the outside at the connection portion between the electronic component 23 and the first insulating base 3. As a result, the connectivity between the first insulating substrate 3 and the electronic component 23 can be improved.

  As the electronic component 23 in the present embodiment, for example, a semiconductor element or a semiconductor integrated circuit chip can be used. In the present embodiment, one electronic component 23 is disposed on the main surface 3a of the first insulating substrate 3 as the second insulating substrate 7, but the present invention is particularly limited to this. is not. For example, a plurality of electronic components 23 may be disposed on the main surface 3 a of the first insulating substrate 3 as the second insulating substrate 7.

  When the wiring board 1 according to the present embodiment is used as a part of an electronic circuit component, the wiring board 1 according to the present embodiment is sealed in the insulating package using an insulating package made of ceramics or the like. It is preferable. That is, in other words, it is preferable to provide an electronic component circuit including the wiring board 1 according to the present embodiment and an insulating package in which the wiring board 1 is sealed.

  This is because it is possible to reduce the possibility that the connection member 13 is corroded by the outside air. At this time, it is more preferable that the wiring board 1 is vacuum-sealed in the insulator package or sealed in the insulator package together with nitrogen or dry air.

  Next, a probe card according to an embodiment of the present invention will be described.

  As shown in FIG. 7, the probe card 25 according to the present embodiment includes a wiring board 1 typified by the above embodiment, a measurement electrode 27 disposed on one end surface of the wiring board 1, and a measurement electrode. 27 and a connection terminal 31 provided on the other end face.

  In the probe card 25 of this embodiment, the terminal of the semiconductor element that is the object to be measured is electrically connected to the measurement terminal 29 of the probe card 25, and the semiconductor element is energized. Here, energizing is intended not only to apply a voltage but also to input a signal to a semiconductor element. And the quality of a semiconductor element can be determined by measuring the output taken out via the connection terminal 31, and comparing with the expected value.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

1 is a perspective view showing a wiring board according to a first embodiment of the present invention. It is sectional drawing of the wiring board shown in FIG. FIG. 3 is an enlarged cross-sectional view of a region A of the wiring board shown in FIG. It is an expanded sectional view of a section perpendicular to the main surface of the 1st insulating substrate in the wiring board concerning a 2nd embodiment of the present invention. It is an expanded sectional view of the section which is parallel to the main surface of the 1st insulating base in the wiring board concerning a 3rd embodiment of the present invention, and contains a resin member. It is sectional drawing of the wiring board concerning the 4th Embodiment of this invention. It is sectional drawing which shows the probe card concerning one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board 3 ... 1st insulating base | substrate 3a ... Main surface 5 ... 1st electrically-conductive member 7 ... 2nd insulating base | substrate 7a ... Opposite surface 9 ... Second conductive member 11 ... resin member 13 ... connection member 15 ... opening 17 ... via conductor 19 ... metal layer 21 ... hole 23 ... electronic component 25 ..Probe card 27 ... Measurement electrode 29 ... Measurement terminal 31 ... Connection terminal

Claims (7)

A first insulating substrate;
A first conductive member disposed on a main surface of the first insulating substrate;
A second insulating substrate having a facing surface facing the main surface of the first insulating substrate;
A second conductive member disposed on the facing surface of the second insulating substrate;
A resin member positioned between the first insulating substrate and the second insulating substrate;
A wiring provided between the first insulating substrate and the second insulating substrate, and a connection member that electrically connects the first conductive member and the second conductive member A substrate,
The wiring board, wherein the resin member has an opening that exposes at least a part of the surface of the connection member to the outside.   The wiring board according to claim 1, wherein a plurality of the connection members are provided, and the resin member has a hole that opens from one of the adjacent connection members to the other.   The width of the hole is larger than the width of the opening when the resin member is viewed in cross section in a cross section parallel to the main surface of the first insulating base. 2. The wiring board according to 2.   When the resin member is viewed in cross section in a cross section parallel to the main surface of the first insulating base, the width of the hole located in a portion near the center of the first insulating base is The wiring board according to claim 3, wherein the wiring board is larger than a width of the hole located in a portion far from the center of the first insulating substrate.   The width of the hole is larger than the width of the opening when the resin member is viewed in cross section in a cross section perpendicular to the main surface of the first insulating substrate. 2. The wiring board according to 2.   When the resin member is viewed in cross section in a cross section perpendicular to the main surface of the first insulating substrate, the width of the hole located in a portion close to the center of the first insulating substrate is The wiring board according to claim 5, wherein the wiring board is larger than a width of the hole located in a portion far from the center of the first insulating substrate.   A probe card comprising: the wiring board according to claim 1; a measurement terminal provided on one end face of the wiring board; and a connection terminal provided on the other end face of the wiring board.

Images