JP2010129431A - Bulb for vehicle, and method for manufacturing the same - Google Patents

Bulb for vehicle, and method for manufacturing the same Download PDF

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JP2010129431A
JP2010129431A JP2008304139A JP2008304139A JP2010129431A JP 2010129431 A JP2010129431 A JP 2010129431A JP 2008304139 A JP2008304139 A JP 2008304139A JP 2008304139 A JP2008304139 A JP 2008304139A JP 2010129431 A JP2010129431 A JP 2010129431A
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substrate
wiring circuit
metal substrate
circuit pattern
groove
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JP5186341B2 (en
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Jiro Miura
次朗 三浦
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PIAA Corp
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PIAA Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To enhance the reliability of a wiring circuit by preventing cracking or disconnection in a wiring circuit pattern of a bent part. <P>SOLUTION: A substrate bending groove 6 is formed on the other surface 5b of a metal substrate 5, which is opposite to one surface 5a for forming a wiring circuit pattern thereon, and an insulating layer 32 is then formed on the one surface 5a of the metal substrate 5. The wiring circuit pattern 19 is formed on the insulating layer 32, and cream solder is applied to a light source mounting part on which a light source of LED of the wiring circuit pattern 19 is to be mounted and the wiring circuit pattern 19 formed on the one surface 5a of the metal substrate 5 opposed to the substrate bending groove 6. The metal substrate 5 is reflowed within a furnace, and the metal substrate 5 is then polygonally bent along the substrate bending groove 6 to form a substantially spherical LED bulb part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、LEDを光源とした車両用バルブに関し、配線回路パターンを形成した金属基板を多角形状に折り曲げて略球体をなすようにLEDバルブ部を形成する技術に関する。   The present invention relates to a vehicle bulb using an LED as a light source, and relates to a technique for forming an LED bulb portion so as to form a substantially spherical body by bending a metal substrate on which a wiring circuit pattern is formed into a polygonal shape.

例えば、特許文献1には、平面視五角形をなす中央部分の各辺より脚部となるウイング部を形成した金属基板に対して、その各ウイング部の一面にLEDとこれに接続される回路パターンを形成すると共に他面に溝を形成し、その溝を折曲げ部位として各ウイング部を折り曲げることにより、全体形状を五角錐形状とした自動車用のLED電球が開示されている。   For example, in Patent Document 1, for a metal substrate on which a wing portion that becomes a leg portion is formed from each side of a central portion that forms a pentagon in plan view, an LED and a circuit pattern connected to the LED on one surface of each wing portion And a groove is formed on the other surface, and each wing portion is bent using the groove as a bent portion, thereby disclosing an LED bulb for an automobile having a pentagonal pyramid shape as a whole.

また、特許文献2には、基板本体に折り曲げ可能な屈曲溝部を形成したプリント基板を、前記屈曲溝部を屈曲部として立体的に組み立てた技術が開示されている。
特開2006−210340号公報 実開昭63−152260号公報
Patent Document 2 discloses a technique in which a printed circuit board in which a bendable groove portion that can be bent is formed on a substrate body is three-dimensionally assembled using the bend groove portion as a bend portion.
JP 2006-210340 A Japanese Utility Model Publication No. 63-152260

しかしながら、特許文献1及び特許文献2に開示された技術では、何れもウイング部及びプリント基板を、溝部を折曲げ部位として折り曲げているので、配線回路パターンに折り曲げ時の応力が掛かってヒビ割れが生じたり、回路自体が断線する恐れがある。   However, in the techniques disclosed in Patent Document 1 and Patent Document 2, since the wing portion and the printed circuit board are both bent with the groove portion as a bending portion, the wiring circuit pattern is subjected to stress at the time of bending and cracks are generated. May occur or the circuit itself may be disconnected.

そこで、本発明は、折曲げ部の配線回路パターンにヒビ割れや断線が生じないようにして該配線回路パターンの信頼性を高めることのできる車両用バルブ及びその製造方法を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a vehicle valve and a method for manufacturing the same that can improve the reliability of the wiring circuit pattern without causing cracks or breakage in the wiring circuit pattern of the bent portion. To do.

請求項1に記載の発明は、金属基板の一面に配線回路パターンが形成されて複数個のLEDからなる光源が実装されると共に他面に基板折曲げ溝が形成され、その基板折曲げ溝にて該金属基板を多角形状に折り曲げることで略球体としたLEDバルブ部と、このLEDバルブ部が取り付けられる、電子回路部が設けられた内蔵基板を取り付けたバルブソケットと、を備えた車両用バルブであって、前記基板折曲げ溝と対峙する前記金属基板の一面の部位に、前記光源を前記配線回路パターンの光源実装部に実装する際に使用するクリーム半田を塗布して配線回路パターンを保護する回路保護部を形成したことを特徴としている。   According to the first aspect of the present invention, a wiring circuit pattern is formed on one surface of a metal substrate to mount a light source composed of a plurality of LEDs, and a substrate bending groove is formed on the other surface. And a valve socket having a built-in substrate provided with an electronic circuit portion to which the LED bulb portion is attached, and an LED bulb portion that is formed into a substantially spherical body by bending the metal substrate into a polygonal shape. In this case, the solder paste used for mounting the light source on the light source mounting portion of the wiring circuit pattern is applied to a portion of the metal substrate facing the substrate bending groove to protect the wiring circuit pattern. The circuit protection part is formed.

請求項2に記載の車両用バルブの製造方法は、金属基板上に配線回路パターンが形成される一面とは反対側の他面に基板折曲げ溝を複数形成する溝形成工程と、前記金属基板の一面に絶縁層を形成する絶縁層形成工程と、前記絶縁層の上に配線回路パターンを形成する回路形成工程と、前記配線回路パターンのうちLEDからなる光源を実装する光源実装部と、前記基板折曲げ溝と対峙する前記金属基板の一面に形成された前記配線回路パターン上にクリーム半田を塗布する半田塗布工程と、前記金属基板を炉内に入れてリフローするリフロー工程と、前記基板折曲げ溝にて前記金属基板を多角形状に折り曲げて略球体をなすLEDバルブ部を形成するバルブ部形成工程と、前記LEDバルブ部を、電子回路部が設けられた内蔵基板を取り付けたバルブソケットに取り付けて車両用バルブとする組立工程と、を備えたことを特徴としている。   The method for manufacturing a vehicle valve according to claim 2 includes a groove forming step of forming a plurality of substrate bending grooves on the other surface opposite to the one surface on which the wiring circuit pattern is formed on the metal substrate, and the metal substrate. An insulating layer forming step for forming an insulating layer on one surface; a circuit forming step for forming a wiring circuit pattern on the insulating layer; a light source mounting portion for mounting a light source composed of LEDs in the wiring circuit pattern; A solder application step of applying cream solder on the wiring circuit pattern formed on one surface of the metal substrate facing the substrate bending groove, a reflow step of reflowing the metal substrate in a furnace, and the substrate folding The metal bulb is bent into a polygonal shape at a bending groove to form a bulb portion that forms a substantially spherical body, and the LED bulb portion is attached to an internal substrate provided with an electronic circuit portion. Attached to the valve socket is characterized by comprising, an assembly process of the vehicle valve was.

請求項3に記載の車両用バルブの製造方法は、金属基板上に配線回路パターンが形成される一面とは反対側の他面に基板折曲げ溝を形成すると共にその基板折曲げ溝と対峙する前記一面の部位に凹溝を形成する溝形成工程と、前記凹溝を除く前記一面に接着剤を塗布した後、絶縁層を貼り付ける絶縁層形成工程と、前記絶縁層上に配線回路パターンを形成する回路形成工程と、前記配線回路パターンのうちLEDからなる光源を実装する光源実装部にクリーム半田を塗布する半田塗布工程と、前記金属基板を炉内に入れてリフローするリフロー工程と、前記基板折曲げ溝にて前記金属基板を多角形状に折り曲げて略球体をなすLEDバルブ部を形成するバルブ部形成工程と、前記LEDバルブ部を、電子回路部が設けられた内蔵基板を取り付けたバルブソケットに取り付けて車両用バルブとする組立工程と、を備えたことを特徴としている。   According to a third aspect of the present invention, there is provided a vehicle valve manufacturing method in which a substrate bending groove is formed on the other surface opposite to the one surface on which a wiring circuit pattern is formed on a metal substrate, and is opposed to the substrate bending groove. A groove forming step of forming a groove on the one surface portion, an insulating layer forming step of applying an adhesive to the one surface excluding the groove, and then attaching an insulating layer; and a wiring circuit pattern on the insulating layer. A circuit forming step for forming, a solder applying step for applying cream solder to a light source mounting portion for mounting a light source consisting of LEDs in the wiring circuit pattern, a reflow step for reflowing the metal substrate in a furnace, and A valve part forming step for forming an LED bulb part that forms a substantially spherical body by bending the metal substrate into a polygonal shape at a board bending groove, and the LED bulb part is attached to an internal substrate provided with an electronic circuit part Attached to the valve socket is characterized by comprising, an assembly process of the vehicle valve was.

請求項4に記載の車両用バルブの製造方法は、請求項2または請求項3において、前記溝形成工程で、同一ヶ所に設ける基板折曲げ溝を複数形成することを特徴としている。   According to a fourth aspect of the present invention, there is provided a vehicle valve manufacturing method according to the second or third aspect, wherein a plurality of substrate bending grooves provided at the same location are formed in the groove forming step.

請求項1に記載の車両用バルブによれば、他面に形成した基板折曲げ溝と対峙する金属基板の一面の部位にクリーム半田を塗布して配線回路パターンを保護する回路保護部を形成したことにより、金属基板を折り曲げたときに前記クリーム半田が、基板折曲げ時に折曲げ部に作用する力を分散させ、配線回路パターンがヒビ割れるのを抑制し断線を回避させる。したがって、本発明によれば、ひび割れや断線の無い配線回路パターンを持つ信頼性の高い車両用バルブを提供することができる。   According to the vehicle valve of the first aspect, the circuit protection portion for protecting the wiring circuit pattern is formed by applying the cream solder to the portion of the one surface of the metal substrate facing the substrate bending groove formed on the other surface. Thus, when the metal substrate is bent, the cream solder disperses the force acting on the bent portion when the substrate is bent, and the wiring circuit pattern is prevented from cracking and disconnection is avoided. Therefore, according to the present invention, it is possible to provide a highly reliable vehicle valve having a wiring circuit pattern free from cracks and disconnection.

請求項2に記載の車両用バルブの製造方法によれば、他面に形成した基板折曲げ溝と対峙する金属基板の一面に形成した配線回路パターン上にクリーム半田を塗布することで、このクリーム半田が、金属基板を折り曲げた時の折曲げ部に作用する力を分散させて配線回路パターンへのひび割れや断線を無くす。したがって、本発明方法によれば、ひび割れや断線の無い配線回路パターンを持つ信頼性の高い車両用バルブを製造することができる。   According to the vehicle valve manufacturing method of claim 2, the cream solder is applied to the wiring circuit pattern formed on one surface of the metal substrate facing the substrate bending groove formed on the other surface. Solder disperses the force acting on the bent portion when the metal substrate is bent, thereby eliminating cracks and disconnections in the wiring circuit pattern. Therefore, according to the method of the present invention, it is possible to manufacture a highly reliable vehicle valve having a wiring circuit pattern free from cracks and disconnection.

請求項3に記載の車両用バルブの製造方法によれば、金属基板の他面に形成した基板折曲げ溝と対峙する一面の部位に凹溝を形成し、その凹溝を除く前記一面に塗布した接着剤に絶縁層を貼り付け、その絶縁層上に銅箔を貼り付けて配線回路パターンを形成した後に、金属基板を折り曲げると、前記凹溝の上に設けられた部位に相当する配線回路パターンが浮き上がり、基板折曲げ時に作用する折曲げ力が配線回路パターンに加わるのを防止する。したがって、本発明方法によれば、ひび割れや断線の無い配線回路パターンを持つ信頼性の高い車両用バルブを製造することができる。   According to the method for manufacturing a valve for a vehicle according to claim 3, a concave groove is formed on a portion of one surface facing the substrate bending groove formed on the other surface of the metal substrate, and the coating is applied to the one surface excluding the concave groove. A wiring circuit corresponding to a portion provided on the concave groove when a metal substrate is bent after an insulating layer is pasted on the adhesive and a copper foil is pasted on the insulating layer to form a wiring circuit pattern. The pattern is lifted to prevent the bending force acting upon the substrate bending from being applied to the wiring circuit pattern. Therefore, according to the method of the present invention, it is possible to manufacture a highly reliable vehicle valve having a wiring circuit pattern free from cracks and disconnection.

請求項4に記載の車両用バルブの製造方法によれば、溝形成工程において同一ヶ所に設ける基板折曲げ溝を複数形成することで、基板折曲げ溝の数が増えた分だけ金属基板を折り曲げ易くできる。   According to the method for manufacturing a valve for a vehicle according to claim 4, by forming a plurality of substrate folding grooves provided at the same place in the groove forming step, the metal substrate is bent by an amount corresponding to an increase in the number of substrate folding grooves. Easy to do.

以下、本発明を適用した具体的な実施形態について図面を参照しながら詳細に説明する。   Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

「車両用バルブの構造説明」
図1(A)は車両用バルブの平面図、図1(B)は車両用バルブの右側面図、図1(C)は車両用バルブの底面図、図1(D)は車両用バルブの正面図、図2は車両用バルブの縦断面図、図3(A)はLEDバルブ部の平面図、図3(B)はLEDバルブ部の右側面図、図3(C)はLEDバルブ部の底面図、図3(D)はLEDバルブの正面図、図4(A)はLEDバルブ部を構成する金属基板を基板折曲げ溝が形成された面を上向きとして示す展開図、図4(B)はその金属基板の側面図、図4(C)は金属基板に形成した基板折曲げ溝の断面図、図5はLEDバルブ部を構成する金属基板を配線回路パターンが形成された面を上向きとして示す展開図、図6(A)はバルブソケットの平面図、図6(B)はバルブソケットの右側面図、図6(C)はバルブソケットの底面図、図6(D)はバルブソケットの正面図、図7(A)は図6(A)のA−A線断面図、図7(B)は図6(B)のB−B線断面図、図7(C)は図6(B)のC−C線断面図である。なお、図1及び図2では、配線回路パターン19の図示は省略してある。
"Vehicle valve structure description"
1A is a plan view of the valve for the vehicle, FIG. 1B is a right side view of the valve for the vehicle, FIG. 1C is a bottom view of the valve for the vehicle, and FIG. FIG. 3A is a plan view of the LED bulb, FIG. 3B is a right side view of the LED bulb, and FIG. 3C is the LED bulb. 3 (D) is a front view of the LED bulb, FIG. 4 (A) is a developed view showing the metal substrate constituting the LED bulb portion with the surface where the substrate bending groove is formed, and FIG. B) is a side view of the metal substrate, FIG. 4C is a cross-sectional view of a substrate bending groove formed on the metal substrate, and FIG. 5 is a diagram showing a surface on which a wiring circuit pattern is formed on the metal substrate constituting the LED bulb portion. FIG. 6 (A) is a plan view of the valve socket, FIG. 6 (B) is a right side view of the valve socket, 6 (C) is a bottom view of the valve socket, FIG. 6 (D) is a front view of the valve socket, FIG. 7 (A) is a cross-sectional view taken along line AA of FIG. 6 (A), and FIG. FIG. 7B is a cross-sectional view taken along line BB in FIG. 6B, and FIG. 7C is a cross-sectional view taken along line CC in FIG. In FIG. 1 and FIG. 2, the wiring circuit pattern 19 is not shown.

車両用バルブ1は、図1及び図2に示すように、金属基板を多角形状に折り曲げることで略球体としたLEDバルブ部2と、電子回路部が設けられた内蔵基板3を取り付けたバルブソケット4と、を備え、LEDバルブ部2をバルブソケット4に取り付けることによって構成されている。   As shown in FIG. 1 and FIG. 2, the vehicle valve 1 is a valve socket in which an LED bulb part 2 made of a substantially spherical body by bending a metal substrate into a polygonal shape and a built-in board 3 provided with an electronic circuit part are attached. 4, and the LED bulb portion 2 is attached to the bulb socket 4.

LEDバルブ部2は、図3から図5に示すように、最終形態を略球体とする展開した形状とした金属基板5を多角形状に折り曲げることにより形成される。かかる金属基板5には、LEDの点灯により発せられる熱を効率良く放熱するために、放熱性に優れたアルミニウム合金板等が使用される。   As shown in FIG. 3 to FIG. 5, the LED bulb portion 2 is formed by bending a metal substrate 5 in a developed shape whose final form is a substantially spherical body into a polygonal shape. For the metal substrate 5, an aluminum alloy plate or the like having excellent heat dissipation is used in order to efficiently dissipate heat generated by the lighting of the LEDs.

前記金属基板5は、図3の如く略球体をなす最終形態を展開した図4及び図5に示すように、平面視で三角形状をなす天板部5Aと、この天板部5Aの各辺に連結される平面視六角形状をなす上板部5B、5C、5Dと、この上板部5B、5C、5Dの側辺に連結される平面視五角形状をなす側板部5E、5F、5Gと、この側板部5E、5F、5Gに連結される平面視四角形状をなす下板部5H、5I、5Jと、前記上板部5B、5C、5Dの下辺に連結される平面視略四角形状をなす取付け板部5K、5L、5Mとから構成されている。   As shown in FIGS. 4 and 5 in which the final form of a substantially spherical body as shown in FIG. 3 is developed, the metal substrate 5 has a top plate portion 5A having a triangular shape in plan view, and each side of the top plate portion 5A. The upper plate portions 5B, 5C, and 5D having a hexagonal shape in plan view coupled to the side plates, and the side plate portions 5E, 5F, and 5G having a pentagonal shape in plan view coupled to the sides of the upper plate portions 5B, 5C, and 5D, The lower plate portions 5H, 5I, and 5J having a square shape in plan view coupled to the side plate portions 5E, 5F, and 5G, and the substantially square shape in plan view coupled to the lower sides of the upper plate portions 5B, 5C, and 5D. It is comprised from the attaching plate part 5K, 5L, and 5M.

そして、この金属基板5の他面5bには、図4に示すように板厚方向にその板厚の約半分程度まで切り込まれた基板折曲げ溝6〜17が形成されている。中央の天板部5Aと上板部5B、5C、5Dとの連結部には、それぞれ基板折曲げ溝6、7、8が形成されている。また、上板部5B、5C、5Dと側板部5E、5F、5Gとの連結部には、それぞれ基板折曲げ溝9、10、11が形成されている。また、側板部5E、5F、5Gと下板部5H、5I、5Jとの連結部には、それぞれ基板折曲げ溝12、13、14が形成されている。また、下板部5H、5I、5Jと取付け板部5K、5L、5Mとの連結部には、それぞれ基板折曲げ溝15、16、17が形成されている。   Then, on the other surface 5b of the metal substrate 5, as shown in FIG. 4, there are formed substrate bending grooves 6 to 17 which are cut to about half of the plate thickness in the plate thickness direction. Substrate bending grooves 6, 7, and 8 are formed in the connecting portions between the central top plate portion 5A and the upper plate portions 5B, 5C, and 5D, respectively. In addition, substrate bending grooves 9, 10 and 11 are formed at the connecting portions between the upper plate portions 5B, 5C and 5D and the side plate portions 5E, 5F and 5G, respectively. Further, substrate bending grooves 12, 13, and 14 are formed at the connecting portions between the side plate portions 5E, 5F, and 5G and the lower plate portions 5H, 5I, and 5J, respectively. Further, substrate bending grooves 15, 16, and 17 are formed at the connecting portions between the lower plate portions 5H, 5I, and 5J and the mounting plate portions 5K, 5L, and 5M, respectively.

前記基板折曲げ溝6の深さHは、金属基板5の材質と板厚Tにより決められ、該金属基板5を折り曲げた時に折れてしまうことがないような寸法とされる。また、この基板折曲げ溝6の形状に関しては、図4(C)に示す如く半円形状であっても良く、或いは、折り曲げたときに折曲げ部が密着するようにV字状とすることが望ましい。   The depth H of the substrate bending groove 6 is determined by the material of the metal substrate 5 and the plate thickness T, and is dimensioned so as not to be bent when the metal substrate 5 is bent. Further, the shape of the substrate bending groove 6 may be semicircular as shown in FIG. 4C, or it may be V-shaped so that the bent portion comes into close contact when bent. Is desirable.

一方、金属基板5の一面5aには、図5に示すように、LEDからなる光源18を点灯させるための配線回路パターン19と、光源18を実装させる光源実装部20とが形成されている。配線回路パターン19は、天板部5Aと上板部5B、5C、5Dと側板部5E、5F、5Gと下板部5H、5I、5Jとにそれぞれ形成されている。これら配線回路パターン19のうち、側板部5E、5F、5Gに形成される部位には、スルーホール21が形成されている。光源実装部20は、上板部5B、5C、5Dと側板部5E、5F、5Gと下板部5H、5I、5Jとにそれぞれ形成されている。   On the other hand, on one surface 5a of the metal substrate 5, as shown in FIG. 5, a wiring circuit pattern 19 for turning on a light source 18 made of LEDs and a light source mounting portion 20 for mounting the light source 18 are formed. The wiring circuit pattern 19 is formed on the top plate portion 5A, the upper plate portions 5B, 5C, and 5D, the side plate portions 5E, 5F, and 5G, and the lower plate portions 5H, 5I, and 5J, respectively. Through holes 21 are formed in portions of the wiring circuit patterns 19 formed in the side plate portions 5E, 5F, and 5G. The light source mounting portion 20 is formed on the upper plate portions 5B, 5C, and 5D, the side plate portions 5E, 5F, and 5G, and the lower plate portions 5H, 5I, and 5J, respectively.

配線回路パターン19は、金属基板5の一面5aに絶縁層を形成した後、その絶縁層上に銅箔を設け、この銅箔をマスキングしてエッチングすることにより所定パターン形状に形成される。製造方法については、後述するものとする。   The wiring circuit pattern 19 is formed in a predetermined pattern shape by forming an insulating layer on the one surface 5a of the metal substrate 5, then providing a copper foil on the insulating layer, masking and etching the copper foil. The manufacturing method will be described later.

前記取付け板部5K、5L、5Mには、LEDバルブ部2をバルブソケット4に固定させるための爪部係止溝22が形成されている。この爪部係止溝22は、両側縁にそれぞれコ字状をなす溝として形成されている。   A claw portion locking groove 22 for fixing the LED bulb portion 2 to the bulb socket 4 is formed in the mounting plate portions 5K, 5L, and 5M. The claw portion locking grooves 22 are formed as U-shaped grooves on both side edges.

LEDバルブ部2を形成するには、天板部5Aと上板部5B、5C、5Dの連結部を基板折曲げ溝6、7、8を折曲げ部位として山折りに折った後、上板部5B、5C、5Dと側板部5E、5F、5Gの連結部を基板折曲げ溝9、10、11を折曲げ部位として山折りに折る。また、側板部5E、5F、5Gと下板部5H、5I、5Jの連結部を基板折曲げ溝12、13、14を折曲げ部位として山折りに折った後、上板部5B、5C、5Dと取付け板部5K、5L、5Mの連結部を基板折曲げ溝15、16、17を折曲げ部位として山折りに折る。このように金属基板5を各基板折曲げ溝6〜17にて山折りにして多角形状に折り曲げることで略球体をなすLEDバルブ部2が形成される。   In order to form the LED bulb portion 2, the top plate portion 5A and the upper plate portions 5B, 5C, and 5D are folded in a mountain fold using the substrate folding grooves 6, 7, and 8 as folding portions, and then the upper plate The connecting portions of the portions 5B, 5C, and 5D and the side plate portions 5E, 5F, and 5G are folded in a mountain fold using the substrate folding grooves 9, 10, and 11 as folding portions. Further, after folding the connecting portions of the side plate portions 5E, 5F, and 5G and the lower plate portions 5H, 5I, and 5J into the substrate folding grooves 12, 13, and 14 as folding portions, the upper plate portions 5B, 5C, 5D and the attachment plate portions 5K, 5L, and 5M are folded in a mountain fold using the substrate folding grooves 15, 16, and 17 as folding portions. Thus, the LED bulb part 2 which forms a substantially spherical body is formed by folding the metal substrate 5 into the polygonal shape by folding the metal substrate 5 at the respective substrate bending grooves 6 to 17.

内蔵基板3は、図2に示すように、抵抗等の電子部品23が実装されることにより電子回路部を構成している。この内蔵基板3の電子回路部と金属基板5の配線回路パターン19とは、スルーホール21に一端を接続し内蔵基板3の配線パターン24に他端を接続した電線25にて電気的に接続されている。   As shown in FIG. 2, the built-in substrate 3 constitutes an electronic circuit section by mounting electronic components 23 such as resistors. The electronic circuit portion of the internal substrate 3 and the wiring circuit pattern 19 of the metal substrate 5 are electrically connected by an electric wire 25 having one end connected to the through hole 21 and the other end connected to the wiring pattern 24 of the internal substrate 3. ing.

バルブソケット4は、図6及び図7に示すように、内蔵基板3を内部中央に支持すると共にLEDバルブ部2を取り付けるバルブ固定部26と、相手端子が設けられるソケット(図示は省略する)に装着される差し込み部27と、を有した絶縁体から構成されている。   As shown in FIGS. 6 and 7, the bulb socket 4 is a socket (not shown) provided with a bulb fixing portion 26 for supporting the built-in substrate 3 at the center of the interior and attaching the LED bulb portion 2 and a counterpart terminal. It is comprised from the insulator which has the insertion part 27 with which it mounts | wears.

バルブ固定部26には、LEDバルブ部2の内部に挿入されて取付け板部5K、5L、5Mを内側から支持する取付け板部支持面26A、26B、26Cが形成されている。この取付け板部支持面26A、26B、26Cには、前記取付け板部5K、5L、5Mに形成された爪部係止溝22に係合して前記LEDバルブ部2をバルブソケット4に固定させるための係合爪28が形成されている。   The bulb fixing portion 26 is formed with attachment plate portion support surfaces 26A, 26B, and 26C that are inserted into the LED bulb portion 2 and support the attachment plate portions 5K, 5L, and 5M from the inside. The mounting plate portion support surfaces 26A, 26B, and 26C are engaged with claw portion locking grooves 22 formed in the mounting plate portions 5K, 5L, and 5M to fix the LED bulb portion 2 to the bulb socket 4. An engaging claw 28 is formed.

また、バルブ固定部26には、側板部5E、5F、5Gを内側から支持する側板部支持面26D、26E、26Fが形成されている。側板部支持面26D、26E、26Fは、前記各取付け板部支持面26A、26B、26Cの間にそれぞれ形成されている。さらに、バルブ固定部26には、下板部5H、5I、5Jを内側から支持する下板部支持面26G、26H、26Iが形成されている。   The valve fixing portion 26 is formed with side plate portion support surfaces 26D, 26E, and 26F that support the side plate portions 5E, 5F, and 5G from the inside. The side plate support surfaces 26D, 26E, and 26F are formed between the mounting plate support surfaces 26A, 26B, and 26C, respectively. Furthermore, lower plate portion support surfaces 26G, 26H, and 26I that support the lower plate portions 5H, 5I, and 5J from the inside are formed in the valve fixing portion 26.

差し込み部27には、車両用バルブ1を装着させるソケットに設けられた外部端子と接続する端子線29、30が設けられている。これら端子線29、30は、一端を内蔵基板3の電子回路部と接続させ、他端を差し込み部27の側面からその先端部に引き出している。一方の端子線29は、プラス側の端子線で、他方の端子線30は、マイナス側の端子線とされる。また、この差し込み部27には、内蔵基板3が設けられる部位から先端部にかけて端子線29、30を挿入配索させる配線孔31が貫通形成されている。配線孔31は、バルブソケットをシングル球とダブル球に共用するため4つ形成されており、それぞれの場合に選択的に使用される。   The insertion portion 27 is provided with terminal wires 29 and 30 that are connected to external terminals provided in a socket on which the vehicle valve 1 is mounted. One end of each of the terminal wires 29 and 30 is connected to the electronic circuit portion of the built-in substrate 3, and the other end is drawn from the side surface of the insertion portion 27 to the tip portion. One terminal line 29 is a plus terminal line, and the other terminal line 30 is a minus terminal line. The insertion portion 27 is formed with a wiring hole 31 through which the terminal wires 29 and 30 are inserted and routed from a portion where the built-in substrate 3 is provided to the tip portion. Four wiring holes 31 are formed to share the valve socket for a single sphere and a double sphere, and are selectively used in each case.

そして本実施形態の車両用バルブ1においては、他面5bに形成した基板折曲げ溝6〜17と対峙する金属基板5の一面5aの部位にクリーム半田を塗布して配線回路パターン19を保護する回路保護部が形成されている。この回路保護部については、後述するが、金属基板5を折り曲げたときに配線回路パターン19がヒビ割れるのを抑制し且つ断線を回避させる機能をするものである。   In the vehicle valve 1 of the present embodiment, the solder paste is applied to the portion of the one surface 5a of the metal substrate 5 facing the substrate bending grooves 6 to 17 formed on the other surface 5b to protect the wiring circuit pattern 19. A circuit protection part is formed. As will be described later, the circuit protection unit functions to suppress cracking of the wiring circuit pattern 19 and avoid disconnection when the metal substrate 5 is bent.

「車両用バルブの製造方法」
次に、車両用バルブの製造方法について説明する。図8はLEDバルブ部を形成する一連の製造工程を示し、図8(A)は溝形成工程図、図8(B)は絶縁層形成工程図、図8(C)は回路形成工程図、図8(D)は半田塗布工程図、図8(E)はバルブ部形成工程図である。
"Vehicle valve manufacturing method"
Next, a method for manufacturing a vehicle valve will be described. FIG. 8 shows a series of manufacturing steps for forming the LED bulb portion, FIG. 8A is a groove forming step, FIG. 8B is an insulating layer forming step, and FIG. 8C is a circuit forming step. FIG. 8D is a solder application process diagram, and FIG. 8E is a valve portion formation process diagram.

先ず、平板形状をなす大型のアルミニウム合金板から打ち抜き加工又はリューター加工を行って展開した金属基板5を形成する。次に、溝形成工程を行う。溝形成工程では、図8(A)に示すように、金属基板5上に配線回路パターン19が形成される一面5aとは反対側の他面5bに基板折曲げ溝6(6〜17)を形成する。図8(A)では、断面略V字状をなす溝として基板折曲げ溝6を形成している。V字状溝の形態に基板折曲げ溝6を形成すれば、金属基板5を折り曲げたときに、溝部の傾斜面6a、6b同士が密着して折曲げ部の強度が高くなる。   First, the unrolled metal substrate 5 is formed by punching or processing a large aluminum alloy plate having a flat plate shape. Next, a groove forming step is performed. In the groove forming step, as shown in FIG. 8A, the substrate bent grooves 6 (6 to 17) are formed on the other surface 5b opposite to the one surface 5a on which the wiring circuit pattern 19 is formed on the metal substrate 5. Form. In FIG. 8A, a substrate bending groove 6 is formed as a groove having a substantially V-shaped cross section. If the substrate bending groove 6 is formed in the form of a V-shaped groove, when the metal substrate 5 is bent, the inclined surfaces 6a and 6b of the groove portion are brought into close contact with each other and the strength of the bending portion is increased.

次に、絶縁層形成工程を行う。絶縁層形成工程では、図8(B)に示すように、前記基板折曲げ溝6とは反対側の金属基板5の一面5aに全体に亘って絶縁層32を形成する。絶縁層32は、導電性のある金属基板5とその上に形成される配線回路パターン19とを絶縁するために形成される。   Next, an insulating layer forming step is performed. In the insulating layer forming step, as shown in FIG. 8B, an insulating layer 32 is formed over the entire surface 5a of the metal substrate 5 on the side opposite to the substrate bending groove 6. The insulating layer 32 is formed to insulate the conductive metal substrate 5 from the wiring circuit pattern 19 formed thereon.

次に、回路形成工程を行う。回路形成工程では、図8(C)に示すように、絶縁層32の上に銅箔33を設け、その銅箔33の上にマスキングをしてエッチングすることにより、所定の配線回路パターン19を形成する。   Next, a circuit formation process is performed. In the circuit forming step, as shown in FIG. 8C, a copper foil 33 is provided on the insulating layer 32, masking is performed on the copper foil 33, and etching is performed, whereby a predetermined wiring circuit pattern 19 is formed. Form.

次に、半田塗布工程を行う。半田塗布工程では、図8(D)に示すように、配線回路パターン19のうち光源実装部20と、基板折曲げ溝6(6〜17)と対峙する金属基板5の一面5aに形成された配線回路パターン19上にクリーム半田を塗布する。クリーム半田は、光源18を配線回路パターン19に接続するのに光源実装部20に塗布するが、基板折曲げ溝6(6〜17)と対峙する部位にも塗布する。基板折曲げ溝6(6〜17)と対峙する部位に塗布されたクリーム半田は、配線回路パターン19をヒビ割れ等から保護するための回路保護部34として機能する。前記クリーム半田を塗布する範囲は、少なくとも基板折曲げ溝6が形成される部位と、その折れ曲がる部位全体とされる。   Next, a solder application process is performed. In the solder application step, as shown in FIG. 8D, the light source mounting portion 20 in the wiring circuit pattern 19 and the one surface 5a of the metal substrate 5 facing the substrate bending grooves 6 (6 to 17) are formed. Cream solder is applied on the wiring circuit pattern 19. The cream solder is applied to the light source mounting portion 20 in order to connect the light source 18 to the wiring circuit pattern 19, but is also applied to a portion facing the substrate bending groove 6 (6 to 17). The cream solder applied to the part facing the substrate bending groove 6 (6 to 17) functions as a circuit protection part 34 for protecting the wiring circuit pattern 19 from cracks and the like. The range in which the cream solder is applied includes at least a portion where the substrate bending groove 6 is formed and the entire portion where the bending is performed.

次に、リフロー工程を行う。リフロー工程では、光源実装部20に塗布したクリーム半田34の上にLEDである光源18を載せ、前記金属基板5を炉内に入れてリフローする。これにより、光源18は、配線回路パターン19に接続される。   Next, a reflow process is performed. In the reflow process, the light source 18 that is an LED is placed on the cream solder 34 applied to the light source mounting portion 20, and the metal substrate 5 is placed in a furnace and reflowed. As a result, the light source 18 is connected to the wiring circuit pattern 19.

次に、バルブ部形成工程を行う。バルブ部形成工程では、図8(E)に示すように、前記基板折曲げ溝6(6〜17)にて金属基板5を折り曲げて略球体をなすLEDバルブ部2を形成する。基板折曲げ溝6の部位から金属基板5を折り曲げると、その折曲げ部位には折曲げ力が配線回路パターン19に作用してヒビ割れ等を発生させるが、その折曲げ力を前記回路保護部34が分散させる。そのため、基板折曲げ溝6と対峙する部位に形成された配線回路パターン19をヒビ割れから回避することができ、回路自体の断線が抑制される。   Next, a valve portion forming process is performed. In the bulb portion forming step, as shown in FIG. 8E, the LED bulb portion 2 that forms a substantially spherical body is formed by bending the metal substrate 5 in the substrate folding grooves 6 (6 to 17). When the metal substrate 5 is bent from the portion of the substrate bending groove 6, the bending force acts on the wiring circuit pattern 19 at the bent portion to generate cracks and the like. 34 is dispersed. Therefore, it is possible to avoid the wiring circuit pattern 19 formed in the portion facing the substrate bending groove 6 from cracking, and the disconnection of the circuit itself is suppressed.

次に、組立工程を行う。組立工程では、略球体としたLEDバルブ部2を、電子回路部が設けられた内蔵基板3を取り付けたバルブソケット4に取り付けて車両用バルブ1を完成させる。LEDバルブ部2をバルブソケット4に取り付けるに際しては、前記取付け板部5K、5L、5Mに形成された爪部係止溝22に、該バルブソケット4に設けた係合爪28を嵌め込んで係止させる。前記係合爪28が爪部係止溝22に係止されることで、前記LEDバルブ部2とバルブソケット4とが固定される。   Next, an assembly process is performed. In the assembling process, the vehicular bulb 1 is completed by attaching the LED bulb portion 2 having a substantially spherical shape to the bulb socket 4 to which the built-in substrate 3 provided with the electronic circuit portion is attached. When the LED bulb portion 2 is attached to the bulb socket 4, the engagement claws 28 provided in the bulb socket 4 are fitted into the claw portion engaging grooves 22 formed in the attachment plate portions 5K, 5L, and 5M. Stop. When the engaging claw 28 is locked in the claw locking groove 22, the LED bulb 2 and the bulb socket 4 are fixed.

以上のように本発明方法によれば、他面5bに形成した基板折曲げ溝6(6〜17)と対峙する金属基板5の一面5aに形成した配線回路パターン19上にクリーム半田を塗布することで、このクリーム半田からなる回路保護部34が、前記金属基板5を折り曲げた時の折曲げ部に作用する力を分散させて配線回路パターン19へのひび割れや断線を無くすことができる。したがって、本発明方法によれば、ひび割れや断線の無い配線回路パターン19を持つ信頼性の高い車両用バルブ1を製造できる。   As described above, according to the method of the present invention, the cream solder is applied on the wiring circuit pattern 19 formed on the one surface 5a of the metal substrate 5 facing the substrate bending groove 6 (6 to 17) formed on the other surface 5b. As a result, the circuit protection portion 34 made of cream solder can disperse the force acting on the bent portion when the metal substrate 5 is bent, thereby eliminating the cracks and disconnection of the wiring circuit pattern 19. Therefore, according to the method of the present invention, it is possible to manufacture the highly reliable vehicle valve 1 having the wiring circuit pattern 19 free from cracks and disconnection.

また、本発明方法によれば、光源18をリフローにて配線回路パターン19に接続するために用いるクリーム半田を基板折曲げ溝6(6〜17)と対峙する部位に塗布しているので、光源実装部20にクリーム半田を載せる工程の中で塗布することができる。したがって、専用工程を設ける必要が無く、製造工程を簡略化することができる。   Further, according to the method of the present invention, the cream solder used for connecting the light source 18 to the wiring circuit pattern 19 by reflow is applied to the portion facing the substrate bending groove 6 (6-17). It can apply | coat in the process of mounting cream solder on the mounting part 20. FIG. Therefore, it is not necessary to provide a dedicated process, and the manufacturing process can be simplified.

また、本発明方法によって製造された車両用バルブ1によれば、他面5bに形成した基板折曲げ溝6と対峙する金属基板5の一面5aの部位にクリーム半田を塗布して配線回路パターン19を保護する回路保護部34を形成したことにより、金属基板5を折り曲げたときに前記クリーム半田が、基板折曲げ時に折曲げ部に作用する力を分散させ、配線回路パターン19がヒビ割れるのを抑制すると共に断線を回避させる。したがって、本発明によれば、ひび割れや断線の無い配線回路パターン19を持つ信頼性の高い車両用バルブ1となる。   Further, according to the vehicle valve 1 manufactured by the method of the present invention, the cream circuit solder 19 is applied to the portion of the one surface 5a of the metal substrate 5 facing the substrate bending groove 6 formed on the other surface 5b, and the wiring circuit pattern 19 is applied. By forming the circuit protection part 34 that protects the circuit board 19, the cream solder disperses the force acting on the bent part when the metal substrate 5 is bent, and the wiring circuit pattern 19 is cracked. Suppresses and avoids disconnection. Therefore, according to this invention, it becomes the reliable valve | bulb 1 for vehicles with the wiring circuit pattern 19 without a crack and a disconnection.

「他の実施形態1」
上述の実施形態では、金属基板5を折り曲げる時に折曲げ部の配線回路パターン19がヒビ割れや断線しないように、基板折曲げ溝6〜17と対峙する部位にクリーム半田を塗布して形成した回路保護部34を設けたが、ここでは、基板折曲げ溝6〜17と対峙する部位に凹溝を形成する。以下に、その具体的な車両用バルブの製造方法について説明する。前記した製造工程と同一工程については、ここではその説明は省略するものとする。
Other embodiment 1”
In the above-described embodiment, a circuit formed by applying cream solder to a portion facing the substrate bending grooves 6 to 17 so that the wiring circuit pattern 19 of the bent portion does not crack or break when the metal substrate 5 is bent. Although the protection part 34 was provided, a ditch | groove is formed in the site | part which opposes the board | substrate bending grooves 6-17 here. Below, the manufacturing method of the specific valve | bulb for vehicles is demonstrated. The description of the same steps as those described above will be omitted here.

図9は他の実施形態1におけるLEDバルブ部を形成する一連の製造工程を示す他の例であり、図9(A)は溝形成工程図、図9(B)は絶縁層形成工程図、図9(C)は回路形成工程図、図9(D)はバルブ部形成工程図である。   FIG. 9 is another example showing a series of manufacturing steps for forming the LED bulb portion in the other embodiment 1, FIG. 9A is a groove forming step diagram, FIG. 9B is an insulating layer forming step diagram, FIG. 9C is a circuit formation process diagram, and FIG. 9D is a valve section formation process diagram.

金属基板5の他面5bに基板折曲げ溝6(6〜17)を形成する工程までは同じであるが、図9(A)に示すように、溝形成工程において前記基板折曲げ溝6と対峙する前記一面5aの部位に凹溝35を形成する。図9(A)では、前記凹溝35を半円形状をなす溝として形成しているが、コ字状或いはV字状をなす溝形状であってもよい。   The process is the same up to the step of forming the substrate bending groove 6 (6-17) on the other surface 5b of the metal substrate 5, but as shown in FIG. A concave groove 35 is formed in the part of the one surface 5a facing each other. In FIG. 9A, the concave groove 35 is formed as a semicircular groove, but may be a U-shaped or V-shaped groove.

次に、絶縁層形成工程を行う。絶縁層形成工程では、凹溝35を除く前記一面5aに接着剤を塗布する。接着剤を塗布するに際しては、前記凹溝35の中まで塗らないようにする。次に、接着剤の上に図9(B)に示すように絶縁層32を貼り付ける。凹溝35の上に置かれた絶縁層32は、接着剤が塗布されていないため、前記一面5aに固定されていない。   Next, an insulating layer forming step is performed. In the insulating layer forming step, an adhesive is applied to the one surface 5 a excluding the concave groove 35. When applying the adhesive, it should not be applied to the inside of the groove 35. Next, an insulating layer 32 is pasted on the adhesive as shown in FIG. The insulating layer 32 placed on the concave groove 35 is not fixed to the one surface 5a because the adhesive is not applied.

次に、回路形成工程を行う。回路形成工程では、図9(C)に示すように、絶縁層32の上に銅箔33を設け、その銅箔33の上にマスキングをしてエッチングすることにより、所定の配線回路パターン19を形成する。前記凹溝35の上に設けられた配線回路パターン19は、やはり凹溝35に接着された状態とされていない。   Next, a circuit formation process is performed. In the circuit forming step, as shown in FIG. 9C, a copper foil 33 is provided on the insulating layer 32, masking is performed on the copper foil 33, and etching is performed, whereby a predetermined wiring circuit pattern 19 is formed. Form. The wiring circuit pattern 19 provided on the concave groove 35 is not bonded to the concave groove 35.

次に、半田塗布工程を行う。半田塗布工程では、配線回路パターン19の光源実装部20の上にクリーム半田を塗布する。図9では、クリーム半田は、図示を省略してある。   Next, a solder application process is performed. In the solder application process, cream solder is applied on the light source mounting portion 20 of the wiring circuit pattern 19. In FIG. 9, the cream solder is not shown.

次いで、リフロー工程を行う。リフロー工程では、光源実装部20に塗布したクリーム半田の上にLEDである光源18を載せ、前記金属基板5を炉内に入れてリフローする。これにより、光源18は、配線回路パターン19に接続される。   Next, a reflow process is performed. In the reflow process, the light source 18 that is an LED is placed on the cream solder applied to the light source mounting portion 20, and the metal substrate 5 is placed in a furnace and reflowed. As a result, the light source 18 is connected to the wiring circuit pattern 19.

次に、バルブ部形成工程を行う。バルブ部形成工程では、図9(D)に示すように、前記基板折曲げ溝6(6〜17)にて金属基板5を折り曲げて略球体をなすLEDバルブ部2を形成する。基板折曲げ溝6の部位から金属基板5を折り曲げると、凹溝35の上に接着されずに設けられた絶縁層32と配線回路パターン19が浮き上がり、その弛みによって折曲げ部位に作用する折曲げ力が吸収される。そのため、基板折曲げ溝6と対峙する部位に形成された配線回路パターン19のヒビ割れや断線が回避される。   Next, a valve portion forming process is performed. In the bulb portion forming step, as shown in FIG. 9D, the LED bulb portion 2 is formed in a substantially spherical shape by bending the metal substrate 5 in the substrate bending grooves 6 (6 to 17). When the metal substrate 5 is bent from the portion of the substrate bending groove 6, the insulating layer 32 and the wiring circuit pattern 19 provided without being bonded to the concave groove 35 are lifted, and the bending acts on the bending portion due to the slack. Power is absorbed. For this reason, cracks and disconnection of the wiring circuit pattern 19 formed at the portion facing the substrate bending groove 6 are avoided.

そして、最後に組立工程を行うが、組立工程は先の実施形態と同じであるので、ここではその説明は省略する。   Finally, the assembly process is performed. Since the assembly process is the same as that of the previous embodiment, the description thereof is omitted here.

この他の実施形態1によれば、接着剤が塗布されていない凹溝の上に設けられた部位に相当する配線回路パターン19が浮き上がることによって、基板折曲げ時に作用する折曲げ力が配線回路パターン19に加わるのを防止し、ひび割れや断線の無い配線回路パターン19を持つ信頼性の高い車両用バルブを製造することができる。   According to the other embodiment 1, when the wiring circuit pattern 19 corresponding to the portion provided on the concave groove to which the adhesive is not applied is lifted, the bending force acting at the time of substrate bending is applied to the wiring circuit. It is possible to manufacture a highly reliable vehicle valve having a wiring circuit pattern 19 that is prevented from being applied to the pattern 19 and has no cracks or breakage.

「他の実施形態2」
この実施形態2では、先の実施形態における特に図8の溝形成工程において、同一ヶ所に設ける基板折曲げ溝6(6〜17)を複数形成する。それ以外は、図8の製造工程と同一であるので、各工程の具体的な説明は省略するものとする。
Other embodiment 2”
In the second embodiment, a plurality of substrate bending grooves 6 (6 to 17) provided at the same place are formed particularly in the groove forming step of FIG. 8 in the previous embodiment. Other than that, the manufacturing process is the same as that shown in FIG. 8, and a specific description of each process will be omitted.

図10は他の実施形態2におけるLEDバルブ部を形成する一連の製造工程を示し、図10(A)は溝形成工程図、図10(B)は絶縁層形成工程図、図10(C)は回路形成工程図、図10(D)は半田塗布工程図、図10(E)はバルブ部形成工程図である。   FIG. 10 shows a series of manufacturing steps for forming the LED bulb portion according to the second embodiment, FIG. 10 (A) is a groove forming step, FIG. 10 (B) is an insulating layer forming step, and FIG. 10 (C). FIG. 10D is a solder application process diagram, and FIG. 10E is a valve portion formation process diagram.

この他の実施形態2では、金属基板5の折曲げ部位に2つの基板折曲げ溝6(6〜17)を形成する。基板折曲げ溝6の形状に関しては、先の図8と同じである。金属基板5の折曲げ部位に2つの基板折曲げ溝6(6〜17)を形成すれば、金属基板5を折り曲げたときに、基板折曲げ溝6の数が増えた分だけ金属基板5を折り曲げ易くなる。また、折り曲げ部位に対応する配線回路パターン19に作用する折り曲げ力も低減し、当該配線回路パターン19への負荷も低減し、より一層のヒビ割れ及び断線発生率を抑えることが可能となる。   In the second embodiment, two substrate bending grooves 6 (6 to 17) are formed in the bent portion of the metal substrate 5. The shape of the substrate bending groove 6 is the same as in FIG. If two substrate bending grooves 6 (6 to 17) are formed in the bent portion of the metal substrate 5, when the metal substrate 5 is bent, the metal substrate 5 is increased by the number of the substrate bending grooves 6. It becomes easy to bend. Further, the bending force acting on the wiring circuit pattern 19 corresponding to the bent portion is also reduced, the load on the wiring circuit pattern 19 is also reduced, and it is possible to further suppress the occurrence of cracks and disconnection.

「他の実施形態3」
図11は他の実施形態3における車両用バルブを示し、図11(A)はその車両用バルブの平面図、図11(B)はその車両用バルブの右側面図、図11(C)はその車両用バルブの底面図、図11(D)はその車両用バルブの正面図、図12は図11に示すソケットを取り付ける前の車両用バルブを示し、図12(A)はその車両用バルブの平面図、図12(B)はその車両用バルブの右側面図、図12(C)はその車両用バルブの底面図、図12(D)はその車両用バルブの正面図、図13は図11のソケットの斜視図である。
“Other embodiment 3”
FIG. 11 shows a valve for a vehicle in another embodiment 3, FIG. 11A is a plan view of the valve for the vehicle, FIG. 11B is a right side view of the valve for the vehicle, and FIG. The bottom view of the valve for vehicles, Drawing 11 (D) is a front view of the valve for vehicles, Drawing 12 shows the valve for vehicles before attaching the socket shown in Drawing 11, and Drawing 12 (A) shows the valve for vehicles FIG. 12B is a right side view of the vehicle valve, FIG. 12C is a bottom view of the vehicle valve, FIG. 12D is a front view of the vehicle valve, and FIG. It is a perspective view of the socket of FIG.

この他の実施形態3では、先の実施形態の図1で示したバルブソケット4とは異なる形状とした例であり、円筒状のソケット36を装着した形態としている。この実施形態3のバルブソケット4は、図1のLEDバルブ部2に装着される部位の形状と同じであるが、外に出ている部位の形状を円柱形状としている。ソケット36の底面には、プラス側の端子31が設けられている。   The other embodiment 3 is an example in which the shape is different from that of the valve socket 4 shown in FIG. 1 of the previous embodiment, and has a form in which a cylindrical socket 36 is attached. The bulb socket 4 of the third embodiment is the same as the shape of the portion that is mounted on the LED bulb portion 2 of FIG. 1, but the shape of the portion that is outside is a cylindrical shape. A positive terminal 31 is provided on the bottom surface of the socket 36.

この実施形態3のように、LEDバルブ部2に装着されるバルブソケット4の形態は、相手側ソケットの形状に応じて決められる。そのため、このバルブソケット4の形態に関しては、先の実施形態の形態に制限されることはない。   Like this Embodiment 3, the form of the valve socket 4 with which the LED valve part 2 is mounted | worn is decided according to the shape of the other party socket. Therefore, the form of the valve socket 4 is not limited to the form of the previous embodiment.

以上、本発明を適用した具体的な実施形態について説明したが、本発明は、上述した実施形態に制限されない。   Although specific embodiments to which the present invention is applied have been described above, the present invention is not limited to the above-described embodiments.

図1(A)は車両用バルブの平面図、図1(B)は車両用バルブの右側面図、図1(C)は車両用バルブの底面図、図1(D)は車両用バルブの正面図である。1A is a plan view of the valve for the vehicle, FIG. 1B is a right side view of the valve for the vehicle, FIG. 1C is a bottom view of the valve for the vehicle, and FIG. It is a front view. 図2は車両用バルブの縦断面図である。FIG. 2 is a longitudinal sectional view of the vehicle valve. 図3(A)はLEDバルブ部の平面図、図3(B)はLEDバルブ部の右側面図、図3(C)はLEDバルブ部の底面図、図3(D)はLEDバルブの正面図である。3A is a plan view of the LED bulb, FIG. 3B is a right side view of the LED bulb, FIG. 3C is a bottom view of the LED bulb, and FIG. 3D is a front view of the LED bulb. FIG. 図4(A)はLEDバルブ部を構成する金属基板を基板折曲げ溝が形成された面を上向きとして示す展開図、図4(B)はその金属基板の側面図、図4(C)は金属基板に形成した基板折曲げ溝の断面図である。FIG. 4A is a development view showing a metal substrate constituting the LED bulb portion with the surface where the substrate bending groove is formed facing upward, FIG. 4B is a side view of the metal substrate, and FIG. It is sectional drawing of the board | substrate bending groove | channel formed in the metal substrate. 図5はLEDバルブ部を構成する金属基板を配線回路パターンが形成された面を上向きとして示す展開図である。FIG. 5 is a development view showing the metal substrate constituting the LED bulb portion with the surface on which the wiring circuit pattern is formed facing upward. 図6(A)はバルブソケットの平面図、図6(B)はバルブソケットの右側面図、図6(C)はバルブソケットの底面図、図6(D)はバルブソケットの正面図である。6A is a plan view of the valve socket, FIG. 6B is a right side view of the valve socket, FIG. 6C is a bottom view of the valve socket, and FIG. 6D is a front view of the valve socket. . 図7(A)は図6(A)のA−A線断面図、図7(B)は図6(B)のB−B線断面図、図7(C)は図6(B)のC−C線断面図である。7A is a cross-sectional view taken along the line AA of FIG. 6A, FIG. 7B is a cross-sectional view taken along the line BB of FIG. 6B, and FIG. 7C is a cross-sectional view of FIG. It is CC sectional view taken on the line. 図8はLEDバルブ部を形成する一連の製造工程を示し、図8(A)は溝形成工程図、図8(B)は絶縁層形成工程図、図8(C)は回路形成工程図、図8(D)は半田塗布工程図、図8(E)はバルブ部形成工程図である。FIG. 8 shows a series of manufacturing steps for forming the LED bulb portion, FIG. 8A is a groove forming step, FIG. 8B is an insulating layer forming step, and FIG. 8C is a circuit forming step. FIG. 8D is a solder application process diagram, and FIG. 8E is a valve portion formation process diagram. 図9は他の実施形態1におけるLEDバルブ部を形成する一連の製造工程を示す他の例であり、図9(A)は溝形成工程図、図9(B)は絶縁層形成工程図、図9(C)は回路形成工程図、図9(D)はバルブ部形成工程図である。FIG. 9 is another example showing a series of manufacturing steps for forming the LED bulb portion in the other embodiment 1, FIG. 9A is a groove forming step diagram, FIG. 9B is an insulating layer forming step diagram, FIG. 9C is a circuit formation process diagram, and FIG. 9D is a valve section formation process diagram. 図10は他の実施形態2におけるLEDバルブ部を形成する一連の製造工程を示し、図10(A)は溝形成工程図、図10(B)は絶縁層形成工程図、図10(C)は回路形成工程図、図10(D)は半田塗布工程図、図10(E)はバルブ部形成工程図である。FIG. 10 shows a series of manufacturing steps for forming the LED bulb portion according to the second embodiment, FIG. 10 (A) is a groove forming step, FIG. 10 (B) is an insulating layer forming step, and FIG. 10 (C). FIG. 10D is a solder application process diagram, and FIG. 10E is a valve portion formation process diagram. 図11は他の実施形態3における車両用バルブを示し、図11(A)はその車両用バルブの平面図、図11(B)はその車両用バルブの右側面図、図11(C)はその車両用バルブの底面図、図11(D)はその車両用バルブの正面図である。FIG. 11 shows a valve for a vehicle in another embodiment 3, FIG. 11A is a plan view of the valve for the vehicle, FIG. 11B is a right side view of the valve for the vehicle, and FIG. FIG. 11D is a bottom view of the vehicle valve, and FIG. 11D is a front view of the vehicle valve. 図12は図11に示すソケットを取り付ける前の車両用バルブを示し、図12(A)はその車両用バルブの平面図、図12(B)はその車両用バルブの右側面図、図12(C)はその車両用バルブの底面図、図12(D)はその車両用バルブの正面図である。12 shows the vehicle valve before the socket shown in FIG. 11 is attached, FIG. 12A is a plan view of the vehicle valve, FIG. 12B is a right side view of the vehicle valve, and FIG. FIG. 12C is a bottom view of the vehicle valve, and FIG. 12D is a front view of the vehicle valve. 図13は図11のソケットの斜視図である。13 is a perspective view of the socket of FIG.

符号の説明Explanation of symbols

1…車両用バルブ
2…LEDバルブ部
3…内蔵基板
4…バルブソケット
5…金属基板
6〜17…基板折曲げ溝
18…光源(LED)
19…配線回路パターン
20…光源実装部
22…爪部係止溝
28…係合爪
32…絶縁層
33…銅箔
34…回路保護部
DESCRIPTION OF SYMBOLS 1 ... Vehicle valve | bulb 2 ... LED valve part 3 ... Built-in board | substrate 4 ... Valve socket 5 ... Metal substrate 6-17 ... Board | substrate bending groove | channel 18 ... Light source (LED)
DESCRIPTION OF SYMBOLS 19 ... Wiring circuit pattern 20 ... Light source mounting part 22 ... Claw part latching groove 28 ... Engagement claw 32 ... Insulating layer 33 ... Copper foil 34 ... Circuit protection part

Claims (4)

金属基板の一面に配線回路パターンが形成されて複数個のLEDからなる光源が実装されると共に他面に基板折曲げ溝が形成され、その基板折曲げ溝にて該金属基板を多角形状に折り曲げることで略球体としたLEDバルブ部と、このLEDバルブ部が取り付けられる、電子回路部が設けられた内蔵基板を取り付けたバルブソケットと、を備えた車両用バルブであって、
前記基板折曲げ溝と対峙する前記金属基板の一面の部位に、前記光源を前記配線回路パターンの光源実装部に実装する際に使用するクリーム半田を塗布して配線回路パターンを保護する回路保護部を形成した
ことを特徴とする車両用バルブ。
A wiring circuit pattern is formed on one surface of the metal substrate to mount a light source composed of a plurality of LEDs, and a substrate bending groove is formed on the other surface, and the metal substrate is bent into a polygonal shape by the substrate bending groove. A bulb for a vehicle comprising: an LED bulb portion having a substantially spherical shape; and a bulb socket to which the LED bulb portion is attached and a built-in substrate provided with an electronic circuit portion.
A circuit protection unit that protects the wiring circuit pattern by applying cream solder used when mounting the light source to the light source mounting portion of the wiring circuit pattern on a portion of the metal substrate facing the substrate bending groove A vehicular valve characterized by forming
金属基板上に配線回路パターンが形成される一面とは反対側の他面に基板折曲げ溝を形成する溝形成工程と、
前記金属基板の一面に絶縁層を形成する絶縁層形成工程と、
前記絶縁層の上に配線回路パターンを形成する回路形成工程と、
前記配線回路パターンのうちLEDからなる光源を実装する光源実装部と、前記基板折曲げ溝と対峙する前記金属基板の一面に形成された前記配線回路パターン上にクリーム半田を塗布する半田塗布工程と、
前記金属基板を炉内に入れてリフローするリフロー工程と、
前記基板折曲げ溝にて前記金属基板を多角形状に折り曲げて略球体をなすLEDバルブ部を形成するバルブ部形成工程と、
前記LEDバルブ部を、電子回路部が設けられた内蔵基板を取り付けたバルブソケットに取り付けて車両用バルブとする組立工程と、を備えた
ことを特徴とする車両用バルブの製造方法。
A groove forming step of forming a substrate bending groove on the other surface opposite to the one surface on which the wiring circuit pattern is formed on the metal substrate;
An insulating layer forming step of forming an insulating layer on one surface of the metal substrate;
Forming a wiring circuit pattern on the insulating layer; and
A light source mounting portion for mounting a light source composed of an LED among the wiring circuit patterns; and a solder application step of applying cream solder on the wiring circuit pattern formed on one surface of the metal substrate facing the substrate bending groove; ,
A reflow step of reflowing the metal substrate into a furnace;
A bulb portion forming step of forming an LED bulb portion that is substantially spherical by bending the metal substrate into a polygonal shape at the substrate folding groove;
An assembly step of attaching the LED bulb portion to a bulb socket to which a built-in substrate provided with an electronic circuit portion is attached to form a bulb for the vehicle.
金属基板上に配線回路パターンが形成される一面とは反対側の他面に基板折曲げ溝を形成すると共にその基板折曲げ溝と対峙する前記一面の部位に凹溝を形成する溝形成工程と、
前記凹溝を除く前記一面に接着剤を塗布した後、絶縁層を貼り付ける絶縁層形成工程と、
前記絶縁層上に配線回路パターンを形成する回路形成工程と、
前記配線回路パターンのうちLEDからなる光源を実装する光源実装部にクリーム半田を塗布する半田塗布工程と、
前記金属基板を炉内に入れてリフローするリフロー工程と、
前記基板折曲げ溝にて前記金属基板を多角形状に折り曲げて略球体をなすLEDバルブ部を形成するバルブ部形成工程と、
前記LEDバルブ部を、電子回路部が設けられた内蔵基板を取り付けたバルブソケットに取り付けて車両用バルブとする組立工程と、を備えた
ことを特徴とする車両用バルブの製造方法。
A groove forming step of forming a substrate bending groove on the other surface opposite to the one surface on which the wiring circuit pattern is formed on the metal substrate, and forming a groove on the one surface facing the substrate bending groove; ,
An insulating layer forming step of attaching an insulating layer after applying an adhesive to the one surface excluding the concave groove;
Forming a wiring circuit pattern on the insulating layer; and
A solder application step of applying cream solder to a light source mounting portion for mounting a light source composed of LEDs in the wiring circuit pattern;
A reflow step of reflowing the metal substrate into a furnace;
A bulb portion forming step of forming an LED bulb portion that is substantially spherical by bending the metal substrate into a polygonal shape at the substrate folding groove;
An assembly step of attaching the LED bulb portion to a bulb socket to which a built-in substrate provided with an electronic circuit portion is attached to form a bulb for the vehicle.
請求項2または請求項3に記載の車両用バルブの製造方法であって、
前記溝形成工程で、同一ヶ所に設ける基板折曲げ溝を複数形成する
ことを特徴とする車両用バルブの製造方法。
It is a manufacturing method of the valve for vehicles according to claim 2 or 3,
In the groove forming step, a plurality of substrate bending grooves provided at the same place are formed.
JP2008304139A 2008-11-28 2008-11-28 Vehicle valve and method of manufacturing the same Expired - Fee Related JP5186341B2 (en)

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Publications (2)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101542528B1 (en) * 2014-02-07 2015-08-11 주식회사 렌즈엘이디 LED streetlight
JP2016001543A (en) * 2014-06-11 2016-01-07 三菱電機株式会社 Light-emitting device
WO2017032576A1 (en) * 2015-08-27 2017-03-02 Continental Automotive Gmbh Printed circuit board and method for producing such a printed circuit board
KR101805556B1 (en) * 2014-10-28 2017-12-07 성재덕 Light module assembly for vehilce
JP2020205207A (en) * 2019-06-19 2020-12-24 株式会社小糸製作所 Lamp unit
DE102021100307A1 (en) 2021-01-11 2022-07-14 Marelli Automotive Lighting Reutlingen (Germany) GmbH Process for processing a circuit board and circuit board

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* Cited by examiner, † Cited by third party
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Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53104949U (en) * 1977-01-31 1978-08-23
JPS5482962U (en) * 1977-11-24 1979-06-12
JPS59111064U (en) * 1983-01-17 1984-07-26 松下電器産業株式会社 printed wiring board
JPS60158759U (en) * 1984-03-30 1985-10-22 ジエコ−株式会社 substrate
JPS63128792A (en) * 1986-11-19 1988-06-01 日本電気株式会社 Mounting system of electronic circuit unit
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH06169139A (en) * 1986-09-29 1994-06-14 Ibiden Co Ltd Bending method for metal core printed wiring board
JPH07221412A (en) * 1994-01-31 1995-08-18 Nec Toyama Ltd Printed circuit board and manufacture thereof
JPH09283889A (en) * 1996-04-09 1997-10-31 Rohm Co Ltd Reinforcing method of flexible substrate and flexible substrate
JPH1056240A (en) * 1996-08-12 1998-02-24 Kitagawa Ind Co Ltd Substrate for three-dimensional circuit and production of three-dimensional circuit
JP2002289984A (en) * 2001-03-26 2002-10-04 Olympus Optical Co Ltd Double-sided flexible board and camera having the same
JP2006128525A (en) * 2004-10-29 2006-05-18 Alps Electric Co Ltd Flexible board
JP2006210340A (en) * 2005-01-25 2006-08-10 Osram Sylvania Inc Automotive led bulb
JP2007129111A (en) * 2005-11-04 2007-05-24 Jisedai Gijutsu:Kk Solid substrate
JP2007214475A (en) * 2006-02-13 2007-08-23 Matsushita Electric Ind Co Ltd Heat disspating light-emitting component and method of manufacturing same

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53104949U (en) * 1977-01-31 1978-08-23
JPS5482962U (en) * 1977-11-24 1979-06-12
JPS59111064U (en) * 1983-01-17 1984-07-26 松下電器産業株式会社 printed wiring board
JPS60158759U (en) * 1984-03-30 1985-10-22 ジエコ−株式会社 substrate
JPH06169139A (en) * 1986-09-29 1994-06-14 Ibiden Co Ltd Bending method for metal core printed wiring board
JPS63128792A (en) * 1986-11-19 1988-06-01 日本電気株式会社 Mounting system of electronic circuit unit
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH07221412A (en) * 1994-01-31 1995-08-18 Nec Toyama Ltd Printed circuit board and manufacture thereof
JPH09283889A (en) * 1996-04-09 1997-10-31 Rohm Co Ltd Reinforcing method of flexible substrate and flexible substrate
JPH1056240A (en) * 1996-08-12 1998-02-24 Kitagawa Ind Co Ltd Substrate for three-dimensional circuit and production of three-dimensional circuit
JP2002289984A (en) * 2001-03-26 2002-10-04 Olympus Optical Co Ltd Double-sided flexible board and camera having the same
JP2006128525A (en) * 2004-10-29 2006-05-18 Alps Electric Co Ltd Flexible board
JP2006210340A (en) * 2005-01-25 2006-08-10 Osram Sylvania Inc Automotive led bulb
JP2007129111A (en) * 2005-11-04 2007-05-24 Jisedai Gijutsu:Kk Solid substrate
JP2007214475A (en) * 2006-02-13 2007-08-23 Matsushita Electric Ind Co Ltd Heat disspating light-emitting component and method of manufacturing same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101542528B1 (en) * 2014-02-07 2015-08-11 주식회사 렌즈엘이디 LED streetlight
JP2016001543A (en) * 2014-06-11 2016-01-07 三菱電機株式会社 Light-emitting device
KR101805556B1 (en) * 2014-10-28 2017-12-07 성재덕 Light module assembly for vehilce
WO2017032576A1 (en) * 2015-08-27 2017-03-02 Continental Automotive Gmbh Printed circuit board and method for producing such a printed circuit board
JP2020205207A (en) * 2019-06-19 2020-12-24 株式会社小糸製作所 Lamp unit
DE102021100307A1 (en) 2021-01-11 2022-07-14 Marelli Automotive Lighting Reutlingen (Germany) GmbH Process for processing a circuit board and circuit board

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