JP2002289984A - Double-sided flexible board and camera having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a double-sided flexible board, constituted such that a circuit pattern at a bent portion where a reinforcing cover lay film cannot be put is not separated, capable of mounting a smaller-sized component. SOLUTION: This double-sided flexible board used for the camera is the one having a predetermined wiring circuit pattern 103 at a curved portion 100L where at least a part is bent and deformed, and has a reinforcing cover lay 104 and a first through hole 105 for bringing into conduction circuit patterns 103a, 103b on both sides of the double-sided flexible board. The reinforcing cover lay 104a, 104b are provided on predetermined regions at least on the obverse surface or the reverse surface of the curved portion 100L, and a second through hole 107 that is not brought into conduction with respect to a wiring is further made in the curved portion 100L.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for reinforcing a double-sided flexible board so that a signal copper foil pattern at a bent portion of the double-sided flexible board is not peeled off.

[0002]

2. Description of the Related Art Among recent mounting technologies for flexible substrates, a double-sided flexible printed circuit board (FPC: hereinafter abbreviated as "double-sided flexible substrate") which can be used on both sides is widely used for miniaturization of various electronic devices. . This double-sided flexible board can be folded or folded in a state where electronic components are mounted on both sides thereof, and further has features such that the flexible board itself can be made thinner.
It is a substrate that can be freely incorporated into a narrow space inside an electronic device.

[0003] Looking at the cross-sectional structure of a normal double-sided flexible substrate, a copper foil forming a predetermined circuit pattern is patterned on a base material such as polyester or polyimide. Further, it is covered with a protective substrate called "coverlay" made of polyimide or the like for reinforcement. The base material, the circuit pattern, and the cover lay are attached to each other with an adhesive. Incidentally, such a double-sided flexible substrate is also exemplified in JP-A-7-302555.

[0004]

In recent years, electronic devices such as cameras have been increasingly required to be miniaturized, and accordingly, there has been an increasing tendency to mount a large number of electronic components together with various flexible substrates in a narrow space. The body itself is formed thinner and thinner. In order to mount many components in a limited space, the double-sided flexible board is also folded and folded. Since the copper foil film forming the circuit pattern is thin and easily peels off even when a slight force is applied, it is absolutely necessary to reinforce the strength of the bent curved portion.

However, there is a region (opening) where a coverlay is not partially provided in a portion where a desired component such as an IC chip is mounted and soldered on a double-sided flexible substrate. No reinforcement effect can be expected.

In order to reinforce the curved part with a coverlay,
It is necessary to secure a certain distance between the curved portion and the opening. In addition, the space for mounting components is limited due to the demand for miniaturization, and when the opening approaches the curved portion of the double-sided flexible substrate, a portion adjacent to the curved portion cannot be sufficiently secured. As a result, since a coverlay for reinforcement cannot be applied, a force acting in a direction in which the circuit pattern of the curved portion is peeled acts, and the pattern itself may eventually be peeled off, leading to a disconnection state. .

There is a need for a double-sided flexible substrate that takes measures to prevent circuit patterns from peeling off so that a predetermined strength can be secured even during maintenance work or long-term use, while avoiding failures due to this. Therefore, an object of the present invention is to provide a flexible substrate including a double-sided flexible substrate, in which a circuit pattern of a bent portion where a reinforcing coverlay film cannot be applied is not peeled off, and a double-sided flexible substrate capable of mounting smaller components. It is to provide a substrate and a camera having the same.

[0008]

Means for Solving the Problems In order to solve the above problems and achieve the object, the present invention takes the following means.
According to the first invention, in the double-sided flexible substrate,
A double-sided flexible substrate having at least a part of the wiring pattern, a reinforcing coverlay having a wiring pattern, and a first through-hole for conducting the patterns between both surfaces are provided. An opening portion of the reinforcing coverlay (that is, a region that does not cover the pattern of the substrate) is provided in the portion, and a second through hole that is invalid (that is, non-conductive) in connection is formed in the curved portion. Thus, a double-sided flexible substrate that prevents the wiring pattern in the vicinity from peeling off is proposed.

According to a second aspect of the present invention, there is provided a camera incorporating a double-sided flexible substrate having at least a portion curved in a curved portion and having a wiring pattern, wherein the double-sided flexible substrate includes a reinforcing coverlay, A first through hole for conducting patterns between both surfaces of the substrate; a reinforcing cover lay provided on the curved portion; and a second through hole that is not conductively connected to the curved portion. We propose a camera that is a double-sided flexible substrate as described.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the details of a double-sided flexible substrate of the present invention and a camera having such a double-sided flexible substrate will be described with reference to embodiments. (First Embodiment) First, a camera according to the present invention will be described as a first embodiment. 1 to 5 show an embodiment of the camera of the present invention. The main feature of this camera is that the camera has a built-in double-sided flexible board having a predetermined wiring pattern, and at least a part of the board can be curved when mounted. The double-sided flexible substrate includes a reinforcing coverlay and a first through hole formed so as to conduct circuit patterns between both surfaces of the substrate. The camera has a double-sided flexible board provided with a ray and further provided with a second through hole formed in the curved portion so as not to conduct on the connection. Note that this camera is a camera that can use the double-sided flexible substrate exemplified in any of the embodiments described later in detail as a part of its constituent elements.

First, an outline of a camera according to the present invention will be described with reference to FIGS. 1 and 2. This camera has a front appearance as shown in FIG. On the front surface of the camera body, a photographic optical system 1 including an objective lens for forming a subject image on a silver halide film and a lens barrel 2 holding the photographic optical system 1 can protrude and retract in the vicinity of the center (that is, in the vicinity of the center). (Retractable).

An image forming lens 3 for forming an image of a subject on a predetermined image pickup device, an objective lens 4 of a finder optical system, and an object lens for adjusting the focus of the photographing optical system 1 A distance measuring window 5 for an autofocus module for measuring a distance is provided side by side, and a strobe panel 6 attached in front of a strobe light emitting window is provided beside the distance measuring window 5.

On the upper surface of the camera, a two-stage release button 7 and a manual zoom button 8 for changing the focal length of the photographing optical system 1 are provided side by side at a position where it can be operated with the right finger. The manual zoom button 8 can also be used as an image scroll button for browsing electronic images captured in the past.

Near the center of the upper surface of the camera, there is provided a small LCD panel 9 for displaying and outputting shooting information such as the number of shot frames of the film, various modes and data information. A mode button 10 for setting a self mode / remote control mode and a mode button 11 for setting a strobe mode are arranged side by side. Each time the mode button 10 is pressed, for example, mode release → self mode The mode is switched in order from mode to remote control mode to mode release. Similarly, when the mode button 11 is pressed, the mode is set so as to sequentially switch from a low-luminance automatic light-emitting mode, a red-eye light-emitting mode, a light-emitting off mode, a forced light-emitting mode, a night scene mode, and a low-luminance automatic light-emitting mode. .

Further, on the other side of the LCD panel 9, a DSP mode button 12 for setting a display mode (abbreviated as DSP mode) and a photographing mode button 13 are provided side by side. By pressing, an electronic image captured in the past is displayed on a monitor device 16 described later and can be viewed. Pressing this button again cancels the DSP mode.

Each time the photographing mode button 13 is pressed, the photographing mode button 13 is set in the order of, for example, a hybrid photographing mode → a film mode → a hybrid photographing mode. The “hybrid photographing mode” referred to here is a mode in which electronic photographing and silver halide photographing are performed at substantially the same timing, and an electronic image photographed on the monitor device 16 is displayed. The “film mode” is a mode in which circuits related to electronic imaging are turned off and only silver halide photography is performed.

In order to protect the lens of the photographic optical system 1 described above, a barrier 14 is mounted on the front surface of the camera body so as to be slidable and openable in the lateral direction. (Not shown) is on /
Turn off. That is, when the barrier 14 is operated from the closed state to the open state, the lens barrel 2 in the collapsed state
The camera is set up at the (wide-angle) shooting position.

FIG. 2 shows the appearance of the body of the camera as viewed from the upper rear side. An eyepiece window 15 of an optical viewfinder system for observing a subject is provided near the center of the back of the camera.
A monitor device 16 for displaying an electronic image and a composition line is provided, and a film confirmation window 17 for confirming the state and presence / absence of the silver halide film used is provided.

The monitor device 16 and the film confirmation window 17 are integrally incorporated in a back cover 18 rotatably supported by the camera body. In addition, on the back,
A panorama shooting mode switching lever 19 and two buttons 20 and 21 for setting date information are provided side by side.

The exterior member forming the camera body having such an external appearance is, for example, a front exterior 22 made of a plastic such as polycarbonate or ABS, and a first screw (not shown) formed of metal and attached to the camera body. And a lower cover 24 also formed of metal and fixed to the camera body with a second screw (not shown).
And a back cover 18 that can be opened and closed as described above, and a battery (not shown)
And a cover 25 that can be opened and closed when replacing the camera body. In this camera, when the second screw is removed, the lower cover 24 can be easily removed from the camera body, and the substrate relating to the digital section (electronic imaging function section) is exposed. Can be adjusted.

The digital section operates at a high speed to handle a large amount of data, and is liable to generate electrical noise. Therefore, at least the upper and lower covers 23, 24 are required to cover the digital section with a shieldable exterior member. Is made of metal.

Next, with reference to FIG. 3, a description will be given of a configuration focusing on a control system of the camera according to the embodiment. First, a portion relating to the silver halide photographing apparatus will be described in detail. A photographic lens for forming a subject image includes a positive lens 30 and a negative lens 32, and a sector 3 is provided between the photographic lenses.
1 is arranged.

The driving of the sector 31 is controlled by a plunger 37 via a shutter driving mechanism 36 (not shown). When the sector 31 is opened, a subject image is formed on the silver halide film 33 and is exposed. The main CPU 58 calculates the shutter speed based on the subject luminance value output from the photometric sensor 65, the film sensitivity detected by a film sensitivity detection circuit (not shown), and a program diagram (not shown). The driving of the sector 31 is controlled so that the shutter speed becomes equal to the shutter speed.

The zoom / feed driving mechanism 38 has a mechanical switching mechanism (not shown), and can switch the transmission destination of the driving force of the motor 39 between the zoom side and the film feeding side. Further, the zoom / feed drive mechanism 38 includes an encoder for detecting the feed amount of the film, an encoder for detecting the drive amount of the motor 39, and an encoder for detecting the focal length of the photographing lenses 30 and 32. . The signals output from these encoders are transmitted to the main C via the IFIC 64.
It is input to PU58.

The exposed film is wound up by one frame in accordance with the output of an encoder for detecting the film feed amount. In addition, during film feeding, the basis weight information is imprinted on the film by the date imprinting device 40 in accordance with the output of the encoder that detects the driving amount of the motor 39.

The autofocus module 41 is composed of a separator optical system 41a for separating two images and a line sensor 41b arranged at a position where an object image is formed. Focus detection is performed by a known phase difference method. The main CPU 58 calculates the distance between the two images based on the signal output from the autofocus module 41, and calculates the driving amount data of the photographing lenses 30, 32 for driving to the in-focus position. Then, the motor 35 is controlled so that a suitable driving amount is obtained, and the focal positions of the photographing lenses 30 and 32 are changed via the focus driving mechanism 34.

The focus drive mechanism 34 includes an encoder for detecting the position of the lens. A signal output from this encoder is input to the main CPU 58 via the IFIC 64. The driver circuit 67 drives the motors 39 and 35 and the plunger 37, and drives the main CPU.
58 is controlled via the IFIC 64.

The IFIC 64 mainly includes the photometric sensor 6
5. Remote controller light receiving sensor 66, driver circuit 67, and an interface function between the main CPU 58 and an encoder (not shown). The switch input unit 68 has a first release switch that is turned on in conjunction with a half-press operation of the release button 7 and a second release switch that is turned on in conjunction with a full-depression operation of the release button. Further, the switch input unit 68 includes a power switch linked to the barrier 14, date information setting buttons 20, 21, shooting mode switching buttons 10, 11, 13, and DSP mode switching button 1.
2. It has an operation switch such as a panorama shooting mode switching lever 19, a switch for detecting the operation of a mechanical mechanism (not shown), and the like. The EEPROM 59 is a non-volatile memory for storing an adjustment value for each camera in advance in order to ship each camera at a factory while suppressing variations.

Next, parts related to the electronic image pickup apparatus will be described. CMO with subject image formed on IC chip
An imaging lens for forming an image on the S imager 48 includes:
Consisting of positive lenses 43 and 45 and negative lenses 42 and 46,
In this imaging lens, a fixed aperture 44, an ND filter 4
7 are arranged.

The subject image formed on the CMOS imager 48 is converted into an analog video signal, and further converted into digital image data by a control circuit (not shown) formed on an IC chip. Is output. This image processing LSI 57 has an internal RIS
The RISC processor has a built-in C processor and various hardware macros.
And controls the hardware macro in accordance with the program written in.

The hardware macro includes an external memory controller (the flash memory 62 as an external memory,
DRAM 63), internal cache memory, JPE
G compression / expansion controller, various image processing functions (including gain adjustment, γ correction, pixel interpolation, RGB / YC conversion, edge enhancement, saturation correction, color tone adjustment, etc.), OSD (on-screen display) function, external Interface circuit (USB60, JTAG61), LCD driver 6
9 is included.

The SDRAM 63 is a memory for temporarily storing an image before image processing and an image being processed. The flash memory 62 is a non-volatile memory for storing a program to be executed by the RISC processor and for storing an electronic image finally determined. The stored content is stored even when the power of the camera is turned off. .

The ND filter 47 is driven by a stepping motor 50 via an ND drive mechanism 49.
The ND filter 47 having a different transmittance can be switched according to the amount of light of the subject. Step Pink Moru 50 is an image processing LSI 57
Is controlled by a driver circuit 51 that operates in accordance with the output code from. The display signal output from the image processing LSI 57 is transmitted to the reflection type LC through the LCD driver 69.
The data is input to the D monitor 70, and a display segment (not shown) formed on the LCD motor 70 is driven and visualized.

Further, the front light lighting signal output from the image processing LSI 57 is input to the LED driver 72 to light the white LED 78. The light emitted from the white LED 73 functions as auxiliary lighting through the light guide plate 71. The brightness of the white LED is determined by the LED driver 72.
Is controlled to be constant by the constant current circuit. The imaging angle of view of the imaging lens is substantially the same as the imaging angle of view of the shortest focus (the so-called wide end) of the imaging lenses 30 and 32.

When the focal lengths of the photographing lenses 30 and 32 are changed by the zoom / feed drive mechanism 38, the electronic image is displayed on the LCD monitor 70 by enlarging / reducing (electronic zooming) by the image processing LSI 57. And the angle of view of the latent image recorded on the silver halide film 33 is substantially matched.

The xenon gas sealed in the arc tube 54 is excited by the trigger signal output from the trigger circuit 55 to emit light, and the light is reflected by the reflector 53, passes through the panel 52, and passes through the panel 52. Is irradiated. The strobe control circuit 56 performs a charging process of a strobe main capacitor (not shown) and a light emission instruction to the trigger circuit 55 according to a control signal of the main CPU 58.

The LCD panel 74 is a small display device for displaying camera information. The image processing LSI 57 and the main CPU 58 are connected by a data bus 75, and exchange required data with each other, and adjust the timing of imaging by the CMOS imager 48 and the timing of exposure to the film 33.

Detailed components of the camera body according to this embodiment will be described. FIG. 4 is an exploded view of the structure of the camera body and the camera body. The camera body includes a spool chamber unit 200 that forms a spool chamber in which a spool shaft for winding a rolled film that has been photographed is rotatably disposed, and a roll-shaped photosensitive silver halide film that has not been photographed. Chamber unit 201 forming a cartridge chamber in which a film cartridge accommodated therein is loaded, and a lens barrel unit 204
An aperture opening provided to allow the light beam from the lens barrel unit 204 to pass therethrough; and a guide rail 2 for defining the position of the film with respect to the aperture opening.
02.

Further, there is provided a guide rail 202 which connects the spool chamber unit 200, the patrone chamber unit 201, and the lens barrel unit 204,
Further, a front plate 203 for reinforcing the connection between the lens barrel unit 204 and each unit from the front side of the camera body, and a lower plate 205 for reinforcing the connection between the units from the bottom side of the camera body are also provided as exterior members. Has as part.

Further, a finder unit 207 is mounted on the lens barrel unit 204. At the time of assembly, each unit is fastened to an adjacent unit by a plurality of screws 206. For further details,
Since it is also disclosed in Japanese Patent Application Laid-Open No. H11-24146 filed by the present applicant, other explanations are omitted.

On the other hand, when it is necessary to disassemble or repair or adjust the camera, when the lower cover locked with screws on the bottom of the camera is removed, the digital board (for example, a DM flexible board or M board) is exposed from inside the main body. The related chips and various connectors for electronic imaging and the check terminals 103 for adjustment provided on the digital board are visible on the board surface.

The adjustment of the DM flexible substrate can be performed while connecting to a predetermined device through the check terminal 103. When adjusting the M-flexible board, the signal can be transmitted and received to and from the M-flexible board via the RELAY flexible board, and the adjustment can be appropriately performed.

In order to explain the above-mentioned features, FIG. 5 shows in detail the configuration of various substrates mounted inside the camera exterior constructed as described above and related components.
As already illustrated in FIG. 4, the spool chamber unit 200,
Patrone room unit 201, lens barrel unit 20
Each unit such as a camera unit 4 and a finder unit 207 constitutes a main part of the camera body.

The viewfinder unit 207 of the camera, which has two functions of electronic imaging and silver halide photography, includes an imaging lens 3 as an optical system for electronic imaging as a part shared by these functions. An objective lens 4 of an optical system used for observing a subject for silver halide photography is integrally incorporated. The subject image is bent upward by 90 ° by a mirror (not shown) in the finder optical system through the imaging lens 3 and assembled so as to be formed on the CMOS imager 48.

The autofocus module 41
Is based on the result of distance measurement.
The ND drive mechanism 49 and the motor 50 are incorporated so that the subject 04 can be automatically focused on the subject. Others
This camera is assembled from various parts, and is configured to maintain a predetermined electrical connection as well as a mechanical connection.

In particular, the electrical connection relationship in this embodiment is as follows:
ICs on various double-sided flexible substrates other than rigid substrates
With the chip and the like mounted, the configuration is as follows. That is, a main CPU 58, an IFIC 64,
EEPROM 59, driver circuit 67, photometric sensor 65
And a remote control sensor 66. Press-connecting connectors 80a and 80b that can be electrically connected by applying pressure by overlapping or screwing are provided at the branched ends for connection with another substrate.

The DM flexible substrate 81 is used for image processing L
SI 57, flash memory 62 and SDRAM 63
Etc. are mounted on the substrate. The ML flexible board 82 is a board for connecting the LCD panel 74 and is connected to the branch portion 84d of the M flexible board 80 by, for example, thermocompression bonding.

The K-flexible substrate 83 is provided with the photographing optical system 1
A substrate for supplying an electric signal and electric power to, for example, the focus driving mechanism 34, the motor 35 (M2), the shutter driving mechanism 36, the shutter plunger 37, and the like incorporated in the lens barrel unit 204 including The K-flexible substrate 83 is provided with a press-connecting connector 83a which can be connected so as to be able to transmit an electric signal by applying a pressure such as overlapping or screw fastening.

The lens barrel unit 204 is provided with a Z-flexible board 84 provided with a reflective sensor 84a for detecting the lens position of the lens frame. A pattern 84b for solder connection is formed on one side of the Z flexible board, and is connected to a predetermined end of the M flexible board 80.

The W flexible board 84w is a spool chamber unit 200 in which the zoom / feed drive mechanism 38 is built.
The switching plunger 85b and the motor 39 (M3) are connected to the lead wires 85c and 8c.
Connected at 5d.

Further, a reflection type sensor 84e for detecting the movement of the silver halide film loaded in the camera and a reflection type for controlling the zoom driving or feeding driving mechanism 38 are provided at the end of the W flexible substrate 84w. Type sensor 84f
And a press-connecting connector 84h.

The press-connecting connectors 80a, 83a, 84h formed on the above-mentioned various substrates (M flexible substrate, K flexible substrate, W flexible substrate) are overlapped and interconnected, and the main CPU 58 mounted on the M flexible substrate 80, etc. Is transmitted and received.

Other substrates include the following, which are connected as follows. That is, the ST1 substrate 85
Is equipped with a charging section of the flash circuit 56, and is charged by the main capacitor 85a. The terminal 85b to be soldered is connected to the DX flexible board 86. The DX flexible substrate 86 has a DX contact 86b, which is used for reading a DX code on the surface of the film cartridge. The obtained DX code information is connected so as to be transmitted through the press-connecting connector 80b of the M flexible board 80 via the press-connecting connector 86c.

The battery 87 is connected to the ST1 substrate 85 by a minus contact piece 87a and a plus contact piece 87b as a power source, and is connected to supply power to each part of the camera. A
The FND flexible substrate 88 has an auto focus
Module 41 and reflective sensor 8 for controlling ND filter
8a, and is connected to the M-flexible board 80 together with the press-connecting connectors 86c and 80b through the press-connecting connector 88b. On the ST2 board 89, a trigger circuit 55 for strobe light emission is mounted.

A sensor 90a is provided on the BXSW flexible board 90. The sensor 90a is directly attached to a shaft of a motor 39 (M3) provided inside the spool chamber unit 26, and controls the rotation of the motor 39. The movement of the slit 84g that rotates together is detected. Further, a switch (not shown) for detecting opening / closing of the back cover 18 is provided.
DCDC board 92 via solder connector 90b at the end
Connected to.

The date imprinting device 40 is mounted on the D-flexible board 91, and is connected to the M-flexible board 80 via the press-connecting connector 91a. DCDC board 92
Is a board for boosting and supplying a voltage to an image processing IC or the like, and is connected so that a control signal can be transmitted from the connector 80c of the M flexible board 80 via the connector 92a.

The CMOS flexible substrate 93 is a CMO
CMOS imager 48 as an image sensor made of S
Is installed. The RELAY flexible board 94 is connected to the M-flexible board 80 via the connector 93a.

The RELAY flexible board 94 mainly serves to relay a plurality of boards, and has connection terminals 94a and 94b and a press-connecting connector 9 at each end.
4c. USB terminal and JTAG terminal 94d
Also have. The flexible board extension 94 e is for sending a signal to the image display monitor 70 provided on the back cover 18.

Further, the connecting line group 95 of the strobo-xenon tube
Xe + lead 95a, Xe lead 95c
And the trigger lead 95b is D
It is connected via the CDC board 92.

The switch 68 is provided on the S flexible substrate 96.
Are formed or connected, and are connected to the M-flexible substrate 80 via the press-connecting connector 96a. Other parts requiring a large current are connected by lead wires as shown (details will be described later).

In the case of this embodiment, the various mounted substrates are arranged inside the camera as follows. For example,
The M flexible board 80 is a cartridge room unit 201
, And the RELAY flexible substrate 94 is disposed on the front surface of the M flexible substrate 80. The ST2 substrate 89 is disposed above the spool chamber unit 200, the DCDC substrate 92 is disposed above the ST2 substrate 89, and the DM flexible substrate 81 is disposed below the camera.

The lead wires connected to each substrate and each line will be described in more detail. Power leads LW1 and LW2 from battery 87 are connected to ST1 substrate 85. Power line is ST1 board 85, DX flexible board 86
Via LW3 to M flexible substrate 80
D is supplied with Vcc by LW4. Further, the GND line LW5 is connected to the DCDC board 92 from the connection point of LW3 of the M flexible board 80. Also, M
Vcc from the LW4 connection point of the flexible substrate 80
Line LW6 is connected to DCDC board 92.

The Vcc line is further connected to the DM flexible board 81 by LW7. DCDC board 92
Is supplied to the DM flexible substrate 81 by the LW13. In addition, the same digital GND line is connected by LW12. The LW 10 is wired from the digital GND of the DCDC board 92, and the lower cover 24 of the camera is dropped to GND. Similarly, when the LW11 is wired from the DCDC board 92, the upper cover 23 is dropped to digital GND. Digital GND is concentrated on the DCDC substrate 92 and grounded at one point.

From the main capacitor charged in the ST1 substrate 85, LW8 and LW9 are wired and connected to a substrate (ST2 substrate 89) that performs strobe light emission. DCD
The power boosted by the C substrate 92 is supplied to the CMOS imager 48 by LW14 and LW15. This LW15
Is connected to digital GND.

As described above, the digital GND is DC
The DC board 92 is grounded at one point. The DM flexible board 81 on which digital components are mounted is shielded by a metal lower cover 24.
Connected to digital GND of CDC board 92. on the other hand,
The upper cover 23 shields the CMOS imager 48,
Similarly, it is grounded to the digital GND of the DCDC board 92.

As described above, various types of flexible substrates frequently used in the respective portions are specifically provided with the following features which are features of the present invention. Before a detailed description of its features,
The difference between the technology of the double-sided flexible substrate as the basis and the present invention will be described with reference to FIGS.

FIG. 6 is a cross-sectional view showing a cross-sectional structure of a double-sided flexible substrate 100 on which the present invention is based. That is, the base material 101 is used as a base material and its front and back 100A,
Predetermined circuit patterns 103a and 103b are formed on 100B via an adhesive 102 (102c and 102d), and a semi-transparent outside of the circuit patterns 103a and 103b via an adhesive 102 (102a and 102b). Laminated with a protective substrate. This protective substrate is called a “cover lay” that protects and strengthens the double-sided flexible substrate 100 having a laminated structure as shown in the figure.

Further, the front side 100 A and the back side 100 A of the double-sided flexible substrate 100 with respect to the base material 101.
Through holes (that is, “conductive through holes”) 105 for electrically connecting the circuit patterns 103a and 103b near B are formed. Incidentally, an example of such a double-sided flexible substrate is also disclosed in JP-A-7-302555.

The formation of the laminated structure is performed in substantially the following procedure. For example, a well-known substrate adhesive 102 (102c, 102d) is applied to both sides of a base material 101 formed of a polyimide material, polyester, or the like, and a desired copper foil pattern is further formed on the circuit pattern 103 (103a, 10a).
3b), and a desired electric circuit is patterned.

Further, the front side 100A and the back side 100A of the double-sided flexible substrate 100 with respect to the base material 101.
A conductive through hole 105 connected to each of the circuit patterns 103a and 103b near B is formed. Incidentally, a similar one is also taught in Japanese Patent Application Laid-Open No. 2000-315840. The above-described conduction through hole is formed by drilling a through hole in the vertical direction on the substrate surface with a drill or the like, and then performing copper etching up to the inner peripheral surface of the hole, so that conduction between the front and back patterns of the substrate can be obtained. Become like

Finally, the predetermined adhesives 102a, 102b
Are respectively applied to the front and back surfaces, and coverlays 104a and 104b are attached as protective base materials. Incidentally, a polyimide material or the like is similarly employed as a material of the cover lay. By affixing the coverlay 104 (104a, 104b) to both sides of the substrate, reinforcement is provided so that pattern peeling does not occur in the vicinity of a portion that is folded and bent when using this double-sided flexible substrate 100.

In FIG. 7, the double-sided flexible substrate 1 shown in FIG.
The case where 00 is bent at a substantially right angle is shown in a cross-sectional view along the longitudinal direction of the double-sided flexible substrate 100.
A desired electronic component such as an IC chip 106 is mounted on the front surface 100A of the double-sided flexible substrate 100, and a solder 108 is provided at an end of the exposed circuit pattern 103a.
a. As described above, the portion (solder land) 108 where soldering can be performed does not have the coverlay 104a, and the opening C of the coverlay on the front side extends around the periphery. The conduction through hole 105 connects the circuit patterns 103a and 103b.

However, in order to reinforce the curved portion 100L by covering with the cover lay 104, it is preferable to secure a certain distance D between the curved portion 100L and the opening C thereof. The reason for this is to reduce the influence of the bending deformation of the substrate of the curved portion 100L on the adjacent region, and a predetermined distance D is required here as a buffer region for the deformation.

Therefore, the present invention is devised so that the distance D from the opening C is as short as possible. That is, in order to shorten the distance D, it is considered that a structure that reduces the influence of the bending deformation of the substrate in the vicinity of the bent portion 100L is considered, and the embodiments are described in detail below.

First, an example of a double-sided flexible board included in the above-described camera will be specifically described as the first embodiment with reference to FIGS. FIG. 8 is a cross-sectional view along the longitudinal direction of the double-sided flexible substrate 100 showing the features of the first embodiment. The double-sided flexible substrate 100 of the first embodiment has at least a predetermined wiring pattern and circuit patterns 103a and 103b, and as described above, a curved portion (folding) that bends and deforms when a part of the substrate is bent. Inside the bent portion 100L, a plurality of circuit patterns 103a and 103b existing between the front and back surfaces 100A and 100B of the double-sided flexible substrate 100 are formed together with a reinforcing coverlay 104b so as to electrically conduct each other. First through hole 10 as shown in FIG.
5, a double-sided flexible substrate provided with the same.

This double-sided flexible substrate 100
The reinforcing coverlay 104 (104a, 104b) is provided on the back surface 100B of the curved portion 100L, and the curved portion 100L is not electrically connected to the circuit pattern 103b, for example (ie, electrically non-conductive). Two through holes 107 are formed for reinforcing the substrate.

That is, the curved portion 100L of the front surface 100A of the double-sided flexible substrate 100 has an area that is not partially covered by the coverlay 104a.
It is characterized in that a second through hole 107 capable of reinforcing that portion is formed so that the portion may be bent at 00L.

The presence of the second through-hole 107 is also due to the secondary effect that the bending deformation of the substrate is absorbed at the same time as the reinforcement and does not adversely affect the surroundings. By this measure, the above-mentioned distance D is shortened, and the IC chip 106 and the like can be arranged very close to the curved portion 100L. The base material 101, the circuit pattern 103b, the coverlay 10
Details such as 4b and the solder land 108 may be substantially the same as those described with reference to FIG.

On the front side of the double-sided flexible substrate 100 according to the first embodiment shown in a perspective view in FIG. 9, an IC chip 106 and the like are mounted in a downward direction indicated by an arrow so as to be solderable. Or circular solder land 10
8 are provided. The above-described circuit pattern 103 made of copper foil extends from each solder land 108, and a second through hole 107 having a round hole is provided in the middle thereof in the lateral direction (that is, the width direction of the substrate: bending center). L). Further, as shown in the drawing, a coverlay 10 is removed from a linear portion where the curvature change due to bending is eliminated.
4a is applied.

On the other hand, on the back side 100B of the double-sided flexible substrate 100 shown in a perspective view in FIG. 10, a second through-hole 107 is similarly formed as a continuous hole from the front side 100A. Similarly, they are juxtaposed. Further, the circuit pattern 103b on the back side 100B can be covered and reinforced with a cover lay 104b.

Therefore, the main structural difference from the conventional one is that the second through hole 107 is provided at the bending center L. With such a structure, the second through hole 107 is protected by the coverlay of the surface 100A. A second through hole 107 is formed in a portion of the circuit pattern 103a existing on the side not strengthened.
Provide strength for preventing peeling.

The back side 1 of the double-sided flexible substrate 100
The second through hole 107 reaching 00B is not electrically connected directly to the circuit pattern 103b, so that even if the second through hole 107 is damaged, there is no problem in the circuit itself. A first through hole (not shown)
It suffices if the upper and lower circuits are electrically connected in a state where the signal lines are hardly damaged.

As described above, according to the double-sided flexible substrate 100 of the first embodiment, even if a part of the surface 100A on which the coverlay 104a cannot be applied is bent along the bending center L as the curved portion 100L. The exposed circuit pattern 103a corresponding to that portion is
The through holes 107 correspond to the bending stress, thereby reducing the force applied to the circuit pattern 103a itself.

Further, even if the opening of the reinforcing coverlay exists near the curved portion 100L of the double-sided flexible substrate 100, the second through-holes 107 are juxtaposed, so that the second through-holes 107 are arranged side by side as in the conventional case. There is no need to secure enough parts. Accordingly, since the force in the peeling direction acting on the circuit pattern 103 of the curved portion 100L instead of the coverlay 104 is not substantially directly applied to the circuit pattern 103 itself, there is no possibility that the peeling does not occur and the disconnection occurs. Electrical failure can be avoided, and a normal circuit pattern state can be maintained even during maintenance work or long-term use.

In the camera of the first embodiment on which various types of flexible substrates are mounted as shown in the examples, the reinforced double-sided flexible substrate 100 is used for improving the mounting efficiency in terms of space, and is overlapped and superimposed. Even when mounted at high density, operational defects such as operation failures due to the peeling of the circuit pattern of the double-sided flexible substrate are less likely to occur, and are also used for improving reliability.

(Second Embodiment) Next, a double-sided flexible substrate according to a second embodiment of the present invention will be described.
FIG. 11 shows a cross-sectional structure when a double-sided flexible substrate according to a second embodiment of the present invention is bent, and two through holes are provided at positions where the bending center L is removed to increase strength. This is an example of improvement. The camera of the second embodiment is assumed to be the same camera as that of the first embodiment. Therefore, description of the same parts as in the first embodiment will be omitted, and characteristic points will be described.

As shown in this cross-sectional view, the flexible board 100 of the second embodiment has a plurality of through holes 107a and 107b at positions slightly deviating from the bending center L. The main feature is that through-holes are formed in two lines along the width direction that are substantially line-symmetric.

According to such a configuration and arrangement, the middle between the through holes 107a and 107b is easily bent as the bending center L, and these through holes are respectively deformed, and unnecessary force is applied to the circuit pattern 104b itself. Is not added, and peeling of the circuit pattern 104b in the vicinity does not occur. That is, the strength of the curved portion 100L can be further improved. Therefore, even in the double-sided flexible substrate 100 of the second embodiment and the camera having the same,
The same or better effects as those of the first embodiment can be obtained.

(Third Embodiment) Next, a double-sided flexible substrate according to a third embodiment of the present invention will be described with reference to FIGS.
3 will be described. Similarly, description of the camera is omitted. FIG. 12 is a plan view showing a double-sided flexible substrate 100 as an example, and each line pattern 1 forming a predetermined circuit is formed on the front side of the double-sided flexible substrate.
09, two sets of through holes 107 (107a, 107b) for improving the strength are provided, and each set of adjacent through holes 107 is staggered with respect to the bending center L. This is an example in which the arrangement is configured as described above.

FIG. 13 shows a circuit pattern 103 seen from the back side 100B of the double-sided flexible substrate 100 described above.
b is a plan view. Since each through-hole is formed perpendicular to the substrate, each through-hole 107 (107a, 107a) on the front side 100A is also provided on the back side.
At each position corresponding to b), each set is arranged so as to be staggered.

As described above, according to the flexible board 100 of the third embodiment, by arranging the plurality of through holes 107 alternately, the line segments connecting the adjacent pairs of through holes 107a and 107b are separated. Is a bending center L. Therefore, since each of the through holes is easily deformed and each through hole is deformed, no extra force is directly applied to each of the line patterns 109, the copper foil pattern does not peel off, and the strength of the curved portion 100L is further improved. Is realized.

That is, with the double-sided flexible substrate 100 of the third embodiment, effects equivalent to or higher than those of the first and second embodiments can be obtained. Of course, the same applies to a camera having this.

(Fourth Embodiment) FIG. 14 shows a fourth embodiment of the present invention.
FIG. 9 is a plan view showing a double-sided flexible substrate as an embodiment, which is a modification of the above-described third embodiment. That is, in this example, only one through hole 107 is formed in the surface of each line pattern 109, and the through holes 107 are alternately arranged at the bending center L. .

As described above, also in the flexible board 100 of the fourth embodiment, it is shown that the number of through-holes and their arrangement can be appropriately modified and implemented. Is also equivalent to the above, or more can be obtained depending on where it is implemented and adopted.

Finally, the double-sided flexible substrate 100 described above is connected to the finder unit 207 of the camera of the present invention.
FIG. 15 is a perspective view showing a specific example of the case where the present invention is used. In the finder unit 207, an imaging lens 3 for forming a subject image on an image pickup device for electronic imaging, an objective lens 4 of a finder optical system, and a distance measurement window 5 for distance measurement are arranged in front of the finder unit 207. .

Further, at a predetermined position on the back side of the finder unit 207, the double-sided flexible substrate (10
The CMOS flexible substrate 93 as (0) is connected. A predetermined electronic circuit pattern (not shown) related to an image pickup function is formed on both sides of the CMOS flexible substrate 93, and the end portion thereof is bent at a substantially right angle in the vicinity of the formation of the second through hole. Is provided with a connector 93a for connection. Then, a separate flexible board for connection (not shown) is connected to the connector 93a.
And can be connected. The CMOS flexible substrate 93 is mounted in a narrow space close to the back side or the bottom of the finder unit 207 in a folded state. As in this specific example, the double-sided flexible substrate of the present invention can be used in various forms for each part of the camera.

(Modification) Not only the double-sided flexible substrate illustrated here, but also a substrate having a coverlay on only one side, a flexible substrate used only for connection, and the like are bent. The present invention is similarly applicable as long as it has a portion.

Of course, the flexible substrate to which the present invention is applied is applied to the above-described various flexible substrates which may be partially bent when mounted in a camera. That is, M flexible substrate 80, DM flexible substrate 81, ML flexible substrate 82, K flexible substrate 83, Z flexible substrate 84, W flexible substrate 84w, ST1 substrate 85, DX flexible substrate 86, AFND flexible substrate 88, ST2 substrate 8
9, BXSW flexible board 90, D flexible board 91, DCDC board 92, RELAY flexible board 9
4 and the S-flexible substrate 96 and the like, as a matter of course.

Each of the above-described embodiments may be appropriately modified as needed. For example, design requirements such as the shape and bending angle of the flexible substrate, or the position and shape of the opening of the coverlay are not limited. Further, the arrangement, the number, the size, the arrangement direction, and the like of the first and second through holes are not similarly limited. In addition, various modifications can be made without departing from the spirit of the present invention.

Although the embodiments have been described above, the present invention includes the following inventions. (1) At least a part of the double-sided flexible substrate, which is curved and has a wiring pattern, a reinforcing coverlay, and a conduction through-hole for conducting the patterns between both surfaces of the double-sided flexible substrate. The double-sided flexible substrate is characterized in that the curved portion of the double-sided flexible substrate is provided with an opening for the reinforcing coverlay, and the curved portion is formed with a reinforcing through-hole that is invalid in connection. Can be provided.

(2) The constituent units of the camera are connected by the double-sided flexible board, and the double-sided flexible board is densely built by folding or folding at the portion where the second through-hole is formed. Can provide camera.

[0102]

As described above, according to the present invention, the mounting space is strict, especially when the double-sided flexible board is used in a place where it can be bent almost vertically, and when a cover example for reinforcement cannot be applied. Further, in the double-sided flexible substrate, it is possible to provide a double-sided flexible substrate that can be implemented so that the pattern of the bent portion where the reinforcing coverlay film cannot be applied does not peel off, and that allows mounting of smaller components.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a camera front portion as an embodiment of the present invention.

FIG. 2 is a perspective view showing the appearance of the rear part of the body of the camera.

FIG. 3 is a block diagram showing a configuration centered on a control system of the camera.

FIG. 4 is an exploded view showing the configuration of main parts of the camera body.

FIG. 5 is an exploded view showing the configuration of various boards attached to the camera body and related parts in detail.

FIG. 6 is a cross-sectional view showing a cross-sectional structure of a double-sided flexible substrate on which the present invention is based.

7 is a cross-sectional view illustrating a case where the double-sided flexible substrate of FIG. 6 is bent at a substantially right angle.

FIG. 8 is a cross-sectional view illustrating a curved portion when the double-sided flexible substrate as the first embodiment of the present invention is bent.

FIG. 9 is a perspective view showing the front side of the double-sided flexible substrate of the first embodiment.

FIG. 10 is a perspective view showing the state of the back side of the double-sided flexible substrate.

FIG. 11 is an enlarged cross-sectional view showing an example of a curved portion when a double-sided flexible substrate as a second embodiment of the present invention is bent.

FIG. 12 is a plan view showing an example of a double-sided flexible substrate as a third embodiment of the present invention.

FIG. 13 is a plan view showing another example of a double-sided flexible substrate.

FIG. 14 is a plan view showing a double-sided flexible board as a fourth embodiment of the present invention.

FIG. 15 is a perspective view showing a specific example in which the double-sided flexible substrate of the present invention is used for a finder unit.

[Explanation of symbols]

80: M flexible board, 81: DM flexible board, 82: ML flexible board, 83: K flexible board, 84: Z flexible board, 84
w: W flexible board, 85: ST1 board, 8
6: DX flexible board, 88: AFND flexible board, 89: ST2 board, 90: BXSW flexible board, 91: D flexible board, 92:
DCDC substrate, 93: CMOS flexible substrate,
94: RELAY flexible board, 96: S flexible board, 100: Double-sided flexible board, 100
A: front surface, 100B: back surface, 100L: curved portion
(Bent portion), 101: base material (base material), 102:
Adhesive (each adhesive layer), 102a, 102b, 102c, 1
02d: adhesive, 103: circuit pattern (copper foil pattern layer on front and back), 103a: circuit pattern (front side),
103b: circuit pattern (back side), 104: cover lay (front and back), 104a: cover lay (front side), 10
4b: coverlay (back side), 105: first through hole (conduction through hole), 106: IC chip (mounting integrated circuit module), 107: second through hole (for reinforcement), 107a, 107b: second Through hole (one set), 108: solder land, 10
8a: solder, 109: line pattern, 200:
Spool room unit, 201: patrone room unit, 202: guide rail, 203: front plate, 20
4: lens barrel unit, 205: lower plate, 206:
Screw, 207: finder unit.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H100 BB11 5C022 AC70 5E314 AA35 AA36 BB02 BB06 BB12 CC15 FF06 GG12 5E317 AA24 BB03 BB11 CD23 CD32 GG09 5E338 AA02 AA12 AA16 BB02 BB13 BB25 CD72 BB56

Claims (2)

[Claims] 1. A double-sided flexible substrate having at least a portion curved at a curved portion and having a predetermined wiring pattern, comprising: a reinforcing coverlay; and a first through hole for conducting patterns between both surfaces of the substrate. A double-sided flexible substrate, wherein the reinforcing coverlay is provided in the curved portion, and a second through-hole that is not conductive in connection is formed in the curved portion. 2. A camera having a double-sided flexible substrate having at least a portion curved at a curved portion and having a wiring pattern, wherein the double-sided flexible substrate electrically connects a reinforcing coverlay and a pattern between both surfaces of the substrate. A first through-hole to be provided, wherein the reinforcing coverlay is provided on the curved portion, and a second through-hole which is not conductive in connection is formed in the curved portion. A camera having a flexible substrate.