JP2006332088A - Fixing structure of heat dissipater - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate fixing of a heat dissipator employing a lead wire. <P>SOLUTION: Fixing structure of a heat dissipator comprises a printed board 8 for holding and electrically connecting an electric component, a hole 4 provided in the printed board 8, and a heat dissipator 1 produced by covering a single wire 2 of copper alloy having a circular cross-section with an electric insulator 3. The hole 4 consists of a holding portion 7 larger than the cross-section shape of the single wire 2 but smaller than the cross-section shape of the insulator 3, and an inserting portion 6 larger than the holding portion 7. Since the hole 4 for inserting the single wire 2 can be enlarged by inserting the heat dissipator 1 into the inserting portion 6 while folding and holding the heat dissipator 1 at the holding portion 7 by utilizing springiness of the heat dissipator 1, insertion work is facilitated relatively. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting structure for a heat dissipating member that is attached to increase the heat dissipating property of an electric component that is attached to a printed circuit board that holds and electrically connects the electric component.

  Conventionally, a lead wire has been used as this type of radiator (see, for example, Patent Document 1).

FIG. 6 shows a conventional heat dissipating wire described in Patent Document 1. In FIG. As shown in FIG. 6, a heat dissipating body 100 covered with an outer cover 103 made of an insulating material such as a synthetic resin having electrical insulating performance on the outside of a wire 102 having a circular cross section made of a copper alloy, Both ends of the heat radiating body have bare portions 105 so that they can be inserted into the round holes 104 provided in the printed circuit board 106. Then, the heat dissipating body 100 is attached in the vicinity of an electric component to be improved in heat dissipation of the printed circuit board 106, and is soldered and electrically connected to the printed wiring on the back surface of the printed circuit board 106.
JP-A-6-29084

  However, in the conventional configuration, since it is difficult to bend when a single wire is used, it is difficult to insert into a hole during insertion, and workability is poor. Moreover, although it should just be bent in advance, it will take time and effort. If it is a stranded wire, the wire will be scattered, and it will take time to insert, and workability will be poor. In addition, if the hole diameter is increased, the stability of the lead wire after insertion is deteriorated and it is easily detached. As a countermeasure, it is necessary to prevent the lines from being separated by soldering in advance, but there is a problem that it is necessary to manage the dimensions after soldering, which is troublesome.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a mounting structure with improved lead wire insertability.

  In order to solve the above-mentioned conventional problems, the mounting structure of the radiator of the present invention includes a printed circuit board that holds and electrically connects electrical components, a hole provided in the printed circuit board, and a circular shape made of a copper alloy. And a heat sink covered with an insulator having electrical insulation on the outside of the single wire having a cross section of, and the hole is larger than the cross-sectional shape of the single wire and smaller than the cross-sectional shape of the insulator, The heat sink is bent and inserted into the insertion portion, and is held by the holding portion using the spring property of the heat dissipation body, and then fixed by soldering. This makes it easy to insert even a single wire because the insertion hole is large.

  The mounting structure of the radiator of the present invention includes a printed circuit board that holds and electrically connects electrical components, a hole provided in the printed circuit board, and a wire composed of a plurality of strands composed of a copper alloy. A heat-dissipating body covered with an insulator having electrical insulation on the outside, and the hole is larger than the cross-sectional shape of the wire, smaller than the cross-sectional shape of the insulator, and an insertion portion larger than the holding portion Thus, the heat radiating body is bent and inserted into the insertion portion, held by the holding portion using the spring property of the heat radiating body, and then fixed by soldering. This facilitates insertion because the insertion hole is large without soldering.

  The mounting structure of the heat dissipating body of the present invention can facilitate the insertion of the lead wire without impairing the retainability after insertion into the printed circuit board before the lead wire is soldered and fixed.

  1st invention has electrical insulation in the outer side of the printed circuit board which hold | maintains an electrical component, and makes an electrical connection, the hole provided in the said printed circuit board, and the single wire which has the circular cross section comprised with the copper alloy A heat dissipating body covered with an insulator, wherein the hole comprises a holding portion that is larger than the cross-sectional shape of the single wire and smaller than the cross-sectional shape of the insulator, and an insertion portion that is larger than the holding portion. Is bent and inserted into the insertion portion, and is held by the holding portion using the spring property of the heat radiating body, so that a hole for inserting a single wire can be enlarged, and the insertion operation is relatively performed. It can be made easier.

  In the second invention, in particular, by making the single wire of the first invention a wire composed of a plurality of strands made of a copper alloy, it is easy to bend the heat radiating body and facilitate the insertion work. Further, by increasing the diameter of the hole into which the wire is inserted, it is not necessary to solder the wire in advance, so that the cost of the heat radiator can be suppressed.

  In the third invention, in particular, by providing the holding portion of the first or second invention outside the insertion portion, the spring property acts in the direction opposite to the bending direction, so that the spring property is effective. Can be used to hold.

  In the fourth invention, in particular, the holding portion and the insertion portion of the first or second invention are provided concentrically, so that the hole is not unnecessarily enlarged, and the soldering operation is facilitated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a view showing a state in which the heat radiator in the first embodiment of the present invention is attached to a printed circuit board. FIG. 2 shows an external view of the radiator. FIG. 3 shows an enlarged view of the holes provided in the printed circuit board.

  In FIG. 2, the radiator 1 is obtained by removing the coating on both ends of the lead wire covered with the insulator 3 from the single wire 2 made of copper alloy, and when the radiator 1 is connected to the charging part of the printed circuit board 8. By covering the outer shell of the radiator with an insulator, an insulation configuration with other charged parts is made advantageous. Moreover, since a heat radiator can be made using a general lead wire, it can be easily obtained at a low cost. In addition, the heat dissipation can be easily adjusted by adjusting the length.

  FIG. 3A shows a pair of holes provided in the printed circuit board. The lead wire as a heat radiating member is fixed to the printed circuit board 8 by inserting the bare part 5 from which the insulating coating is removed into the hole 4 and soldering. Is done. FIG. 3B is an enlarged view of one of the pair of holes. As shown in the figure, in order to improve the insertability of the bare part 5 in this hole 4, in order to temporarily hold the lead wire after insertion. The holding part 6 and the insertion part 7 having a larger cross-sectional shape than the holding part are provided. The shape of the holding portion 6 is larger than the cross-sectional shape of the bare portion 5 and smaller than the cross-sectional shape of the insulator 3 so that it can be reliably held. Moreover, the shape of the insertion part 7 is made larger than the shape of the holding | maintenance part 6, and has improved insertability. In the present embodiment, the case where circular holes are combined has been described, but it is needless to say that the holes may be combined with holes having other shapes.

  The operation and action of the heat sink mounting structure configured as described above will be described below.

  FIG. 4 is a view showing a method for attaching a heat radiator. (A) is a figure which shows the bending process which inserts a thermal radiation body in a bending insertion part, (b) is a figure which shows a mode that it hold | maintains at a holding part after inserting a thermal radiation body in an insertion part.

  First, as shown in FIG. 4A, the lead wire is bent to a size that allows easy insertion into the insertion portion 6, and the bare portion 5 is inserted. After the insertion, the force in the bending direction of the lead wire is removed and the lead wire is held by the holding portion 7 as shown in FIG. Then, it solders to the printed wiring of the back surface of a printed circuit board (not shown), and is electrically connected. In the present embodiment, the case of a single lead wire has been described, but the same applies to a lead wire composed of a plurality of strands. In the case of a lead wire composed of a plurality of strands, the bending force of the lead wire can be reduced, so that the bending work becomes easier.

  As described above, in the present embodiment, the mounting hole for the lead wire of the printed circuit board is composed of an insertion portion sufficiently larger than the cross-sectional shape of the bare lead wire portion and a holding portion necessary and sufficient to hold the lead wire. This makes it easy to insert the bare part, and by providing the holding part outside the insertion part, the spring property acts in the direction opposite to the bending direction. Can be held. This holding method using the spring property makes it possible to hold the lead wire even if the printed board is turned upside down after insertion, and is therefore suitable for the work of turning the printed board upside down and soldering.

(Embodiment 2)
FIG. 5 is an enlarged view of a hole provided in the printed circuit board according to the second embodiment of the present invention.

  The difference from the first embodiment is that an insertion portion 7 and a holding portion 6 are provided concentrically in a hole 4 provided in a printed circuit board (not shown). Further, the shape of the insertion portion 7 is processed into a mortar shape so that the bare portion 5 of the lead wire 1 can be smoothly moved to the holding portion 6.

The operation and action of the heat sink mounting structure configured as described above will be described below.
Similar to the first embodiment, the lead wire 1 is bent to a size that allows easy insertion into the insertion portion 6, and the bare portion 5 is inserted and held up to the holding portion 6 along the side surface of the mortar-shaped hole of the insertion portion 7. Then, it solders to the printed wiring of the back surface of a printed circuit board, and is electrically connected.

  As described above, in the present embodiment, it is not necessary to unnecessarily increase the shape of the holes and the land to be soldered, and fixing by soldering is ensured.

  As described above, the mounting structure of the radiator according to the present invention has an insertion hole used when inserting the lead wire separately from the holding portion without impairing the function of the holding portion that holds the lead wire after insertion. Since it can be held together, it can be applied to applications such as mounting a jumper wire using a lead wire in addition to a lead wire for heat dissipation.

Mounting structure diagram of radiator in embodiment 1 of the present invention External view of radiator in Embodiment 1 of the present invention (A) The perspective view of a pair of hole provided in the printed circuit board in Embodiment 1 of this invention (b) The enlarged view of the hole (A) The figure which shows the bending process which inserts the heat sink in Embodiment 1 of this invention in a bending insertion part (b) After the heat radiator in Embodiment 1 of this invention is inserted in an insertion part, it is hold | maintained at a holding | maintenance part. Diagram showing how The enlarged view of the hole provided in the printed circuit board in Embodiment 2 of this invention Conventional heat sink mounting structure

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat radiator 2 Single wire 3 Insulator 4, 4 'hole 6 Insertion part 7 Holding part 8 Printed circuit board

Claims (4)

A printed circuit board that holds and electrically connects electrical components, a hole provided in the printed circuit board, and a heat radiation covered with an electrically insulating insulator on the outside of a single wire having a circular cross section made of a copper alloy And the hole is composed of a holding portion that is larger than the cross-sectional shape of the single wire and smaller than the cross-sectional shape of the insulator, and an insertion portion that is larger than the holding portion. A mounting structure for a heat dissipating body, wherein the heat dissipating member is fixed by soldering after being inserted into the holding member and held by the holding portion using the spring property of the heat dissipating member. A printed circuit board that holds and electrically connects the electrical components, a hole provided in the printed circuit board, and an outer side of the wire composed of a plurality of strands composed of a copper alloy is covered with an insulator having electrical insulation. And the hole is formed of a holding portion that is larger than the cross-sectional shape of the line and smaller than the cross-sectional shape of the insulator, and an insertion portion that is larger than the holding portion. A mounting structure for a heat dissipating member, wherein the heat dissipating member is fixed by soldering after being inserted into the insertion portion, held by the holding portion using the spring property of the heat dissipating member. The mounting structure for a radiator according to claim 1 or 2, wherein the holding portion is provided outside the insertion portion. 3. A radiator mounting structure according to claim 1, wherein the holding portion and the insertion portion are provided concentrically.