JP2010123658A5 - - Google Patents

Download PDF

Info

Publication number
JP2010123658A5
JP2010123658A5 JP2008294259A JP2008294259A JP2010123658A5 JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5 JP 2008294259 A JP2008294259 A JP 2008294259A JP 2008294259 A JP2008294259 A JP 2008294259A JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5
Authority
JP
Japan
Prior art keywords
substrate
liquid
back surface
disk
nozzle device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008294259A
Other languages
English (en)
Japanese (ja)
Other versions
JP5198223B2 (ja
JP2010123658A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008294259A priority Critical patent/JP5198223B2/ja
Priority claimed from JP2008294259A external-priority patent/JP5198223B2/ja
Publication of JP2010123658A publication Critical patent/JP2010123658A/ja
Publication of JP2010123658A5 publication Critical patent/JP2010123658A5/ja
Application granted granted Critical
Publication of JP5198223B2 publication Critical patent/JP5198223B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008294259A 2008-11-18 2008-11-18 基板処理装置および基板処理方法 Active JP5198223B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008294259A JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008294259A JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2010123658A JP2010123658A (ja) 2010-06-03
JP2010123658A5 true JP2010123658A5 (zh) 2012-01-12
JP5198223B2 JP5198223B2 (ja) 2013-05-15

Family

ID=42324766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008294259A Active JP5198223B2 (ja) 2008-11-18 2008-11-18 基板処理装置および基板処理方法

Country Status (1)

Country Link
JP (1) JP5198223B2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6158737B2 (ja) 2014-03-31 2017-07-05 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6454123B2 (ja) * 2014-10-09 2019-01-16 ライト工業株式会社 法面吹付装置及び法面吹付工法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05234868A (ja) * 1992-01-30 1993-09-10 Nec Corp スピン式レジスト塗布装置
JP3479602B2 (ja) * 1998-10-08 2003-12-15 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2005311150A (ja) * 2004-04-23 2005-11-04 Seiko Epson Corp スピンコータ及び基板裏面の洗浄方法
JP2006114884A (ja) * 2004-09-17 2006-04-27 Ebara Corp 基板洗浄処理装置及び基板処理ユニット
JP4757126B2 (ja) * 2005-10-11 2011-08-24 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Similar Documents

Publication Publication Date Title
JP2014209605A5 (zh)
ATE466376T1 (de) Flüssigkeitsverarbeitungsvorrichtung und flüssigkeitsverarbeitungsverfahren
JP2014147990A5 (zh)
JP2006114884A5 (zh)
JP2014075438A5 (zh)
TW201508815A (zh) 基板處理裝置及基板處理方法
JP6438748B2 (ja) 塗布方法および塗布装置
TWI524400B (zh) 基板處理裝置及基板處理方法
TW200802532A (en) Substrate processing method, substrate processing apparatus and producing method of semiconductor apparatus
JP2014033178A5 (zh)
JP2014130881A5 (zh)
JP2013206993A5 (zh)
TW200724247A (en) Substrate processing apparatus and substrate processing method
JP2008091637A5 (zh)
JP2016530091A5 (zh)
JP2013062436A5 (zh)
JP2013153141A5 (zh)
JP2010123658A5 (zh)
JP2012064800A5 (zh)
JP2019167628A5 (zh)
JP6298277B2 (ja) 基板処理装置
KR20180059997A (ko) 기판 회전형 약물 분사장치
JP2011014935A5 (zh)
JP2012165000A5 (ja) 基板洗浄方法、基板洗浄装置、現像方法、現像装置及び記憶媒体
JP2006041439A (ja) 液吐出機構、基板処理装置