JP2010123658A5 - - Google Patents
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- Publication number
- JP2010123658A5 JP2010123658A5 JP2008294259A JP2008294259A JP2010123658A5 JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5 JP 2008294259 A JP2008294259 A JP 2008294259A JP 2008294259 A JP2008294259 A JP 2008294259A JP 2010123658 A5 JP2010123658 A5 JP 2010123658A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- liquid
- back surface
- disk
- nozzle device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 34
- 238000007599 discharging Methods 0.000 claims description 6
- 230000002093 peripheral Effects 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008294259A JP5198223B2 (ja) | 2008-11-18 | 2008-11-18 | 基板処理装置および基板処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008294259A JP5198223B2 (ja) | 2008-11-18 | 2008-11-18 | 基板処理装置および基板処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010123658A JP2010123658A (ja) | 2010-06-03 |
JP2010123658A5 true JP2010123658A5 (fr) | 2012-01-12 |
JP5198223B2 JP5198223B2 (ja) | 2013-05-15 |
Family
ID=42324766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008294259A Active JP5198223B2 (ja) | 2008-11-18 | 2008-11-18 | 基板処理装置および基板処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5198223B2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6158737B2 (ja) | 2014-03-31 | 2017-07-05 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
JP6454123B2 (ja) * | 2014-10-09 | 2019-01-16 | ライト工業株式会社 | 法面吹付装置及び法面吹付工法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05234868A (ja) * | 1992-01-30 | 1993-09-10 | Nec Corp | スピン式レジスト塗布装置 |
JP3479602B2 (ja) * | 1998-10-08 | 2003-12-15 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2005311150A (ja) * | 2004-04-23 | 2005-11-04 | Seiko Epson Corp | スピンコータ及び基板裏面の洗浄方法 |
JP2006114884A (ja) * | 2004-09-17 | 2006-04-27 | Ebara Corp | 基板洗浄処理装置及び基板処理ユニット |
JP4757126B2 (ja) * | 2005-10-11 | 2011-08-24 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
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2008
- 2008-11-18 JP JP2008294259A patent/JP5198223B2/ja active Active
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