JP2010119952A - 樹脂塗布方法及び樹脂塗布装置 - Google Patents
樹脂塗布方法及び樹脂塗布装置 Download PDFInfo
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Abstract
【解決手段】低圧環境下の塗布チャンバ31Bで一番目の基板2に対してアンダーフィル材6を塗布する塗布工程と、搬送チャンバ31A内に次に処理される2番目の基板2を移動させた後に搬送チャンバ31A内を大気圧環境下から低圧環境に減圧する気圧調整工程と、前記塗布工程完了後に2枚目の基板2を塗布チャンバ31Bへ移動させ、1枚目の基板2を搬送チャンバ31Aへ移動させる移動工程とを有する。
【選択図】 図5
Description
これにより、再び搬送チャンバ31Aと塗布チャンバ31Bは気密に画成された状態となる。この状態で、塗布ノズル32及び直交ロボット33が駆動し、3枚目の基板2と、これに実装されているチップ3(図示せず)との間にアンダーフィル材6を塗布する(D3工程)。
(付記1)
第1気圧下の塗布室内で、第1の電子部品に対して樹脂を塗布する塗布工程と、
気圧調節室内に第2の電子部品を移動させ、前記気圧調節室内を第2気圧下から前記第1気圧下に調節する第1気圧調整工程と
前記塗布工程完了後、前記第2の電子部品を前記塗布室へ移動させ、前記第1の電子部品を前記気圧調節室へ移動させる第1移動工程とを有することを特徴とする樹脂塗布方法。
(付記2)
前記第2の電子部品に対する前記塗布工程中に、前記気圧調節室内を第2気圧下に調節する第2気圧調整工程と、
前記第2の電子部品に対する前記塗布工程中に、前記気圧調節室内に第3の電子部品を移動させ、前記第1の電子部品を前記気圧調節室外に移動させる第2移動工程とを有することを特徴とする付記1記載の樹脂塗布方法。
(付記3)
前記第1気圧調整工程において、前記第2の電子部品を加熱することを特徴とする付記1または2記載の樹脂塗布方法。
(付記4)
前記第1の電子部品、前記第2の電子部品及び前記第3の電子部品は、少なくとも一つの電子部品をプリント板に実装した基板ユニットであり、
前記樹脂は、前記電子部品に対して塗布されることを特徴とする付記1乃至3のいずれか一項に記載の樹脂塗布方法。
(付記5)
前記第1の電子部品、前記第2の電子部品及び前記第3の電子部品は、少なくとも一つの半導体素子を基板に実装した半導体部品であり、
前記樹脂は、前記半導体素子に塗布されることを特徴とする付記1乃至3のいずれか一項に記載の樹脂塗布方法。
(付記6)
第1気圧調整工程及び第2気圧調整工程において、
前記気圧調節室の気圧を制御するポンプは、切り替えバルブを経由して塗布室の気圧を制御することを特徴とする付記1乃至5のいずれか一項に記載の樹脂塗布方法。
(付記7)
前記第1の電子部品、前記第2の電子部品及び前記第3の電子部品は、少なくとも一つの半導体素子を基板に実装した半導体部品であり、
前記樹脂は、前記半導体素子と基板間に塗布されることを特徴とする付記1乃至3のいずれか一項に記載の樹脂塗布方法。
(付記8)
第1気圧下において電子部品に対して樹脂を塗布する塗布室と、
前記電子部品を格納し、前記塗布室に前記電子部品を供給し、かつ第2気圧下から前記第1気圧へ気圧を調整する気圧調節室と、
前記塗布室内で第1の電子部品に対して樹脂を塗布する際に、前記気圧調節室内に第2の電子部品を移動させ、前記気圧調節室内を第2気圧下から前記第1気圧下に調節する制御部とを有する樹脂塗布装置。
(付記9)
前記制御部は、前記第1の電子部品に対する塗布が完了後、前記第1の電子部品を前記気圧調節室内に移動させ、前記第2の電子部品を塗布室に移動後、前記第2の電子部品に対する塗布を行い、前記第2の電子部品に対する塗布が完了する前に、前記気圧調節室内を第2気圧下に調節し、前記気圧調節室内に第3の電子部品を移動させ、前記第1の電子部品を前記気圧調節室外に移動させることを特徴とする付記8記載の樹脂塗布装置。
(付記10)
前記気圧調節室内に前記電子部品を加熱する加熱装置とを有することを特徴とする付記8または9記載の樹脂塗布装置。
2.92 基板
3,93 チップ
4,94 バンプ
5 接合材
6 アンダーフィル材
7 ボイド
8 吸着アーム
9,99 電極パッド
30,80 樹脂塗布装置
31A 搬送チャンバ
31B 塗布チャンバ
32 塗布ノズル
33 直交ロボット
34 コントローラ
35 基板搬送ユニット
36 基板ステージ
37,38 基板搬送ステージ
39,39A,39B 真空ポンプ
40 搬入扉
41 排出扉
42A,42B バルブ
43 移送扉
45 基板移動装置
46 X方向モータ
47 X方向移動ステージ
48 Y方向モータ
49 Y方向移動ステージ
50 扉開閉モータ
53 ガイドロッド
54 昇降フレーム
55 ガイドレール
56 ガイド押さえ
57 ローラ
58 板カム
58a 傾斜カム部
59 リニアガイド
60 係合部
61 エアシリンダ
61a シリンダシャフト
62 サイドアーム
63 ホットプレート
64 ヒータ
65 単軸ロボット
66 第1アーム
67 第2アーム
68 第3アーム
69 第1送りピン
70 第2送りピン
71 第3送りピン
72 搬送モータ
74,75,76 エアシリンダ
77 ベース
81 切り替えバルブ
82,83 真空配管
95 第1のアンダーフィル材
96 第2のアンダーフィル材
98 ヒートシンク
Claims (5)
- 第1気圧下の塗布室内で、第1の電子部品に対して樹脂を塗布する塗布工程と、
気圧調節室内に第2の電子部品を移動させ、前記気圧調節室内を第2気圧下から前記第1気圧下に調節する第1気圧調整工程と、
前記塗布工程完了後、前記第2の電子部品を前記塗布室へ移動させ、前記第1の電子部品を前記気圧調節室へ移動させる第1移動工程とを有することを特徴とする樹脂塗布方法。 - 前記第2の電子部品に対する前記塗布工程中に、前記気圧調節室内を第2気圧下に調節する第2気圧調整工程と、
前記第2の電子部品に対する前記塗布工程中に、前記気圧調節室内に第3の電子部品を移動させ、前記第1の電子部品を前記気圧調節室外に移動させる第2移動工程とを有することを特徴とする請求項1記載の樹脂塗布方法。 - 前記第1気圧調整工程において、前記第2の電子部品を加熱することを特徴とする請求項1または2記載の樹脂塗布方法。
- 第1気圧下において電子部品に対して樹脂を塗布する塗布室と、
前記電子部品を格納し、前記塗布室に前記電子部品を供給し、かつ第2気圧下から前記第1気圧へ気圧を調整する気圧調節室と、
前記塗布室内で第1の電子部品に対して樹脂を塗布する際に、前記気圧調節室内に第2の電子部品を移動させ、前記気圧調節室内を第2気圧下から前記第1気圧下に調節する制御部とを有する樹脂塗布装置。 - 前記制御部は、前記第1の電子部品に対する塗布が完了後、前記第1の電子部品を前記気圧調節室内に移動させ、前記第2の電子部品を塗布室に移動後、前記第2の電子部品に対する塗布を行い、前記第2の電子部品に対する塗布が完了する前に、前記気圧調節室内を第2気圧下に調節し、前記気圧調節室内に第3の電子部品を移動させ、前記第1の電子部品を前記気圧調節室外に移動させることを特徴とする請求項4記載の樹脂塗布装置。
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JPH04233742A (ja) * | 1990-12-28 | 1992-08-21 | Fujitsu Ltd | 半導体装置の製造方法 |
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