JP2010110737A - 塗布装置 - Google Patents
塗布装置 Download PDFInfo
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- JP2010110737A JP2010110737A JP2008287927A JP2008287927A JP2010110737A JP 2010110737 A JP2010110737 A JP 2010110737A JP 2008287927 A JP2008287927 A JP 2008287927A JP 2008287927 A JP2008287927 A JP 2008287927A JP 2010110737 A JP2010110737 A JP 2010110737A
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- 239000011248 coating agent Substances 0.000 claims description 53
- 238000000576 coating method Methods 0.000 claims description 53
- 239000007788 liquid Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 58
- 239000000463 material Substances 0.000 abstract description 47
- 230000003068 static effect Effects 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 12
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】ペースト塗布装置10は、内部に導電性のペースト材Sを保持する容器部22と、前記容器部22を支持する容器支持部26と、前記容器部22における前記ペースト材Sの吐出部23aに対向してワークとしての基板12を支持するワーク支持部27と、前記容器支持部26を支持するとともに接地されるベース部21と、前記ベース部21から前記吐出部23aまでの間に設けられ、前記ベース部21と前記吐出部23aとを絶縁する絶縁部32と、を備える。
【選択図】 図1
Description
以下、本発明の第1実施形態にかかる塗布装置としてのペースト塗布装置10ついて、図1及び図2を参照して説明する。なお、各図において説明のため、適宜、構成を拡大、縮小または省略して示している。図1は、第1実施形態にかかるペースト塗布装置10の構成を示す説明図であり、図2は、フラットパネルディスプレイ11の断面図である。
以下、本発明の第2実施形態に係るペースト塗布装置10について図6を参照して説明する。また、各図において説明のため、適宜、構成を拡大、縮小または省略して示している。なお、ノズル部223の先端形状が傾斜している点以外については上記第1実施形態と同様であるため、説明を省略する。
次に本発明の第3実施形態に係るペースト塗布装置10について図7及び図8を参照して説明する。各図において説明のため、適宜、構成を拡大、縮小または省略して示している。なお、電気回路を接続した点以外については上記第1実施形態と同様であるため、説明を省略する。
次に本発明の第4実施形態に係るペースト塗布装置10について図9を参照して説明する。各図において説明のため、適宜、構成を拡大、縮小または省略して示している。なお、電位計測器33を接続し、測定した電位に基づいて切り替えを行う点以外については上記第3実施形態と同様であるため、説明を省略する。
11…フラットパネルディスプレイ、12…基板、12a…電気回路、21…ベース部、22…容器部、23a…吐出部、23…ノズル部、23b…吐出孔、24…ディスペンサ、25…加圧装置、26…容器支持部、27…ワーク支持部、27a…ステージ部、
28…突上機構、29…連通管、29a…電磁開閉弁、30…制御部、31…支持金具、32…絶縁部、33…電位計測器、41…切替電気回路、42…抵抗器、
43…可変抵抗器、223…ノズル部、223a…吐出部。
Claims (7)
- 内部に導電性の導電液体を保持する容器部と、
前記容器部を支持する容器支持部と、
前記容器部における前記導電液体の吐出部に対向してワークを支持するワーク支持部と、
前記容器支持部を支持するとともに接地されるベース部と、
前記ベース部から前記吐出部までの間に設けられ、前記ベース部と前記吐出部とを絶縁する絶縁部と、を備えたことを特徴とする塗布装置。 - 前記容器部に、前記容器部内に連通する吐出孔を有するノズル部が設けられ、前記ノズル部の先端が前記吐出部を構成するとともに、
前記容器部が絶縁材料から構成されることを特徴とする請求項1記載の塗布装置。 - 前記容器部に接続され前記容器部内に圧縮空気を供給することにより前記導電液体を吐出させる加圧装置をさらに備え、
前記加圧装置と前記容器部とは、少なくとも一部が絶縁材料からなる連通管で接続されたことを特徴とする請求項1記載の塗布装置。 - 内部に導電性の導電液体を保持する容器部と、
前記容器部を支持する容器支持部と、
前記容器部における前記導電液体の吐出部に対向してワークを支持するワーク支持部と、
前記容器支持部を支持するとともに接地されるベース部と、
前記ベース部から前記吐出部までの間に設けられ、前記吐出部への電荷の供給状態を切り替える切替手段と、
を備えたことを特徴とする塗布装置。 - 前記吐出部と前記容器部を有するディスペンサの電位を検出する電位検出手段をさらに備え、
前記切替手段は、前記電位検出手段で検出された電位に基づいて、前記電荷の供給状態を切り替える電気回路であることを特徴とする請求項3記載の塗布装置。 - 前記吐出部と前記ワークの被塗布部位との間に所定の間隙を存した状態で、前記吐出部から前記導電液体が吐出されることを特徴とする請求項1記載の塗布装置。
- 前記吐出部と前記ワークの被塗布部位とが接触した状態で、前記吐出部から前記導電液体が吐出されることを特徴とする請求項1記載の塗布装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008287927A JP4764470B2 (ja) | 2008-11-10 | 2008-11-10 | 塗布装置 |
US12/614,629 US8307779B2 (en) | 2008-11-10 | 2009-11-09 | Coating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008287927A JP4764470B2 (ja) | 2008-11-10 | 2008-11-10 | 塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010110737A true JP2010110737A (ja) | 2010-05-20 |
JP4764470B2 JP4764470B2 (ja) | 2011-09-07 |
Family
ID=42164023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008287927A Expired - Fee Related JP4764470B2 (ja) | 2008-11-10 | 2008-11-10 | 塗布装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8307779B2 (ja) |
JP (1) | JP4764470B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102211068A (zh) * | 2010-04-06 | 2011-10-12 | 大日本网屏制造株式会社 | 涂敷装置 |
KR102071367B1 (ko) * | 2019-05-11 | 2020-01-30 | 주식회사 랩텍코리아 | 회로기판의 임베디드 전자소자를 위한 복합유전체용 액상 조성물 코팅 장치 |
KR102129364B1 (ko) * | 2020-01-09 | 2020-07-02 | 주식회사 랩텍코리아 | 절연기판의 유동방지가 가능한 복합유전체용 액상 조성물 코팅 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI457182B (zh) * | 2010-06-02 | 2014-10-21 | Hon Hai Prec Ind Co Ltd | 點膠裝置 |
US9579678B2 (en) * | 2015-01-07 | 2017-02-28 | Nordson Corporation | Dispenser and method of dispensing and controlling with a flow meter |
TWI755518B (zh) * | 2017-04-14 | 2022-02-21 | 美商伊利諾工具工程公司 | 用於錫膏印刷機的自動加錫膏裝置及系統 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6358674U (ja) * | 1986-10-03 | 1988-04-19 | ||
JPH09290194A (ja) * | 1996-04-25 | 1997-11-11 | Sony Corp | 粘性物の塗布ノズルと粘性物の塗布装置 |
JPH09308855A (ja) * | 1996-03-18 | 1997-12-02 | Sumitomo Bakelite Co Ltd | 液状樹脂組成物用吐出装置 |
JPH11104555A (ja) * | 1997-09-30 | 1999-04-20 | Kansai Paint Co Ltd | 自動車サッシュの塗装方法 |
JP2000167467A (ja) * | 1998-12-02 | 2000-06-20 | Sanken Electric Co Ltd | ディスペンサ移動制御装置 |
JP2004199975A (ja) * | 2002-12-18 | 2004-07-15 | Dainippon Screen Mfg Co Ltd | パターン形成装置およびパターン形成方法 |
JP2004209463A (ja) * | 2002-12-20 | 2004-07-29 | Tac Seiko:Kk | 吐出装置 |
JP2006007061A (ja) * | 2004-06-24 | 2006-01-12 | Seiko Epson Corp | 膜パターン形成方法および膜パターン形成装置 |
JP2006088130A (ja) * | 2004-09-27 | 2006-04-06 | Sharp Corp | 静電吸引型流体吐出方法及び静電吸引型流体吐出装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6358674A (ja) | 1986-08-29 | 1988-03-14 | Matsushita Electric Ind Co Ltd | 磁気記録符号化装置 |
JP4116132B2 (ja) | 1998-02-19 | 2008-07-09 | 株式会社東芝 | 液体塗布装置及び塗布体の製造方法 |
US7690324B1 (en) * | 2002-06-28 | 2010-04-06 | Novellus Systems, Inc. | Small-volume electroless plating cell |
JP2006153971A (ja) | 2004-11-25 | 2006-06-15 | Toshiba Corp | 表示パネルの製造装置および導通剤の検出方法 |
JP5127162B2 (ja) | 2006-05-30 | 2013-01-23 | 株式会社東芝 | 中間ベースと、xyテーブルと、シール剤塗布装置および液晶パネルの製造方法 |
EP2099055A4 (en) * | 2006-12-04 | 2016-04-13 | Toshiba Kk | X-RAY TUBE WITH ROTATING ANODE |
-
2008
- 2008-11-10 JP JP2008287927A patent/JP4764470B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-09 US US12/614,629 patent/US8307779B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6358674U (ja) * | 1986-10-03 | 1988-04-19 | ||
JPH09308855A (ja) * | 1996-03-18 | 1997-12-02 | Sumitomo Bakelite Co Ltd | 液状樹脂組成物用吐出装置 |
JPH09290194A (ja) * | 1996-04-25 | 1997-11-11 | Sony Corp | 粘性物の塗布ノズルと粘性物の塗布装置 |
JPH11104555A (ja) * | 1997-09-30 | 1999-04-20 | Kansai Paint Co Ltd | 自動車サッシュの塗装方法 |
JP2000167467A (ja) * | 1998-12-02 | 2000-06-20 | Sanken Electric Co Ltd | ディスペンサ移動制御装置 |
JP2004199975A (ja) * | 2002-12-18 | 2004-07-15 | Dainippon Screen Mfg Co Ltd | パターン形成装置およびパターン形成方法 |
JP2004209463A (ja) * | 2002-12-20 | 2004-07-29 | Tac Seiko:Kk | 吐出装置 |
JP2006007061A (ja) * | 2004-06-24 | 2006-01-12 | Seiko Epson Corp | 膜パターン形成方法および膜パターン形成装置 |
JP2006088130A (ja) * | 2004-09-27 | 2006-04-06 | Sharp Corp | 静電吸引型流体吐出方法及び静電吸引型流体吐出装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102211068A (zh) * | 2010-04-06 | 2011-10-12 | 大日本网屏制造株式会社 | 涂敷装置 |
KR102071367B1 (ko) * | 2019-05-11 | 2020-01-30 | 주식회사 랩텍코리아 | 회로기판의 임베디드 전자소자를 위한 복합유전체용 액상 조성물 코팅 장치 |
KR102129364B1 (ko) * | 2020-01-09 | 2020-07-02 | 주식회사 랩텍코리아 | 절연기판의 유동방지가 가능한 복합유전체용 액상 조성물 코팅 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4764470B2 (ja) | 2011-09-07 |
US20100116200A1 (en) | 2010-05-13 |
US8307779B2 (en) | 2012-11-13 |
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