JP2010102270A5 - Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film - Google Patents
Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film Download PDFInfo
- Publication number
- JP2010102270A5 JP2010102270A5 JP2008276084A JP2008276084A JP2010102270A5 JP 2010102270 A5 JP2010102270 A5 JP 2010102270A5 JP 2008276084 A JP2008276084 A JP 2008276084A JP 2008276084 A JP2008276084 A JP 2008276084A JP 2010102270 A5 JP2010102270 A5 JP 2010102270A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- compound
- producing
- resin composition
- reacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims 5
- 239000011347 resin Substances 0.000 title claims 5
- 239000011342 resin composition Substances 0.000 title claims 5
- 239000011248 coating agent Substances 0.000 title claims 4
- 238000000576 coating method Methods 0.000 title claims 4
- 238000004519 manufacturing process Methods 0.000 title claims 4
- 150000001875 compounds Chemical class 0.000 claims 7
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims 3
- IPWHFHKSGYXXLG-UHFFFAOYSA-N naphthalene-1-carboxylic acid;zirconium Chemical compound [Zr].C1=CC=C2C(C(=O)O)=CC=CC2=C1.C1=CC=C2C(C(=O)O)=CC=CC2=C1.C1=CC=C2C(C(=O)O)=CC=CC2=C1.C1=CC=C2C(C(=O)O)=CC=CC2=C1 IPWHFHKSGYXXLG-UHFFFAOYSA-N 0.000 claims 3
- 150000002903 organophosphorus compounds Chemical class 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 3
- 229910052726 zirconium Inorganic materials 0.000 claims 3
- 239000002253 acid Substances 0.000 claims 2
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- 150000007519 polyprotic acids Polymers 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Claims (6)
第一工程で得られた生成物に多塩基酸無水物を反応させる第二工程と、
第二工程で得られた生成物に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させる第三工程と
を含むことを特徴とする感光性樹脂の製造方法。 A first step of reacting a polyfunctional epoxy compound with an unsaturated monobasic acid in the presence of a trivalent organic phosphorus compound and at least one of zirconium naphthenate and zirconium octylate;
A second step of reacting a polybasic acid anhydride with the product obtained in the first step;
A process for producing a photosensitive resin comprising the step of reacting a monoepoxy compound having an unsaturated double bond and a water-soluble monoepoxy compound with the product obtained in the second step.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008276084A JP5161032B2 (en) | 2008-10-27 | 2008-10-27 | Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film |
| PCT/JP2009/062446 WO2010050272A1 (en) | 2008-10-27 | 2009-07-08 | Photosensitive resin composition and method for producing photosensitive resin used therein |
| KR1020117006587A KR101267111B1 (en) | 2008-10-27 | 2009-07-08 | Photosensitive resin composition and method for producing photosensitive resin used therein |
| CN200980137692.1A CN102164977B (en) | 2008-10-27 | 2009-07-08 | Photosensitive resin composition and method for producing photosensitive resin used therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008276084A JP5161032B2 (en) | 2008-10-27 | 2008-10-27 | Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010102270A JP2010102270A (en) | 2010-05-06 |
| JP2010102270A5 true JP2010102270A5 (en) | 2011-08-18 |
| JP5161032B2 JP5161032B2 (en) | 2013-03-13 |
Family
ID=42128642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008276084A Active JP5161032B2 (en) | 2008-10-27 | 2008-10-27 | Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5161032B2 (en) |
| KR (1) | KR101267111B1 (en) |
| CN (1) | CN102164977B (en) |
| WO (1) | WO2010050272A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4723658B2 (en) * | 2009-02-16 | 2011-07-13 | 昭和電工株式会社 | Photosensitive resin composition and method for producing photosensitive resin used therefor |
| KR101349622B1 (en) * | 2011-08-26 | 2014-01-10 | 롬엔드하스전자재료코리아유한회사 | Photopolymerizable unsaturated resin, photosensitive resin composition comprising the same, and light shielding spacer and liquid crystal display device formed therefrom |
| CN105086602B (en) * | 2015-07-02 | 2017-06-16 | 深圳市容大感光科技股份有限公司 | Photocuring thermally curable resin composition ink, purposes and use its wiring board |
| CN105086604A (en) * | 2015-07-13 | 2015-11-25 | 深圳市容大感光科技股份有限公司 | Printing ink composition, application thereof and printed circuit board |
| CN105086605B (en) * | 2015-07-13 | 2018-07-27 | 深圳市容大感光科技股份有限公司 | A kind of photocuring heat-curing composition ink, purposes and the wiring board containing it |
| JP2017088538A (en) * | 2015-11-10 | 2017-05-25 | 日本メナード化粧品株式会社 | Filaggrin production promoter |
| CN108164686B (en) * | 2018-02-01 | 2020-01-21 | 江南大学 | Modified epoxy acrylate and solder resist containing same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001026624A (en) * | 1999-07-15 | 2001-01-30 | Tamura Kaken Co Ltd | Photosensitive resin, photosensitive resin composition and printed-wiring board |
| JP4655362B2 (en) * | 1999-12-28 | 2011-03-23 | Ｄｉｃ株式会社 | Method for producing photosensitive resin |
| JP2002308957A (en) * | 2001-04-17 | 2002-10-23 | Showa Highpolymer Co Ltd | Modified novolak resin and photosensitive resin composition |
| JP2003057821A (en) * | 2001-08-13 | 2003-02-28 | Showa Highpolymer Co Ltd | Photosensitive resin and photosensitive resin composition |
| JP2004131526A (en) * | 2002-10-08 | 2004-04-30 | Great Eastern Resins Industrial Co Ltd | Photosensitive thermosetting resin and method for producing the same and solder-resistant ink composition comprising the resin |
| JP4682340B2 (en) | 2003-07-25 | 2011-05-11 | 昭和電工株式会社 | Method for producing photosensitive resin |
| JP4655928B2 (en) * | 2005-06-30 | 2011-03-23 | Ｄｉｃ株式会社 | Photosensitive resin composition |
-
2008
- 2008-10-27 JP JP2008276084A patent/JP5161032B2/en active Active
-
2009
- 2009-07-08 CN CN200980137692.1A patent/CN102164977B/en active Active
- 2009-07-08 WO PCT/JP2009/062446 patent/WO2010050272A1/en active Application Filing
- 2009-07-08 KR KR1020117006587A patent/KR101267111B1/en not_active IP Right Cessation
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