JPWO2022107508A5 - - Google Patents
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- Publication number
- JPWO2022107508A5 JPWO2022107508A5 JP2022516671A JP2022516671A JPWO2022107508A5 JP WO2022107508 A5 JPWO2022107508 A5 JP WO2022107508A5 JP 2022516671 A JP2022516671 A JP 2022516671A JP 2022516671 A JP2022516671 A JP 2022516671A JP WO2022107508 A5 JPWO2022107508 A5 JP WO2022107508A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- acid
- resin
- compound
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002253 acid Substances 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 3
- 125000003700 epoxy group Chemical group 0.000 claims 3
- 239000004925 Acrylic resin Substances 0.000 claims 2
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 150000007519 polyprotic acids Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 claims 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
Claims (4)
不飽和一塩基酸（Ｂ）と、
水酸基及びカルボキシル基を有する化合物（Ｃ）と、
多塩基酸無水物（Ｄ）とを必須原料とする酸基を有する（メタ）アクリレート樹脂であって、
前記エポキシ樹脂（Ａ）の軟化点が、８０℃以上であり、
前記化合物（Ｃ）が、水酸基を少なくとも２つ有し、カルボキシル基を少なくとも１つ有するものであり、
前記化合物（Ｃ）の使用量が、前記エポキシ樹脂（Ａ）のエポキシ基１モルに対して、０．２～０．４モルの範囲であることを特徴とする酸基を有する（メタ）アクリレート樹脂と、光重合開始剤と、前記酸基を有する（メタ）アクリレート樹脂以外の酸基及び重合性不飽和基を有する樹脂を含有する硬化性樹脂組成物の硬化物からなるレジスト部材。 an epoxy resin (A);
an unsaturated monobasic acid (B);
a compound (C) having a hydroxyl group and a carboxyl group;
A (meth)acrylate resin having an acid group containing a polybasic acid anhydride (D) as an essential raw material,
The softening point of the epoxy resin (A) is 80° C. or higher,
The compound (C) has at least two hydroxyl groups and at least one carboxyl group,
A (meth)acrylate having an acid group, wherein the amount of the compound (C) used is in the range of 0.2 to 0.4 mol per 1 mol of the epoxy group of the epoxy resin (A). A resist member comprising a cured product of a curable resin composition containing a resin, a photopolymerization initiator, and a resin having an acid group and a polymerizable unsaturated group other than the (meth)acrylate resin having an acid group .
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020192338 | 2020-11-19 | ||
| PCT/JP2021/037986 WO2022107508A1 (en) | 2020-11-19 | 2021-10-14 | (meth)acrylate resin having acid group, curable resin composition, cured product, insulating amterial and resist member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022107508A1 JPWO2022107508A1 (en) | 2022-05-27 |
| JPWO2022107508A5 true JPWO2022107508A5 (en) | 2022-11-24 |
Family
ID=81708958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022516671A Pending JPWO2022107508A1 (en) | 2020-11-19 | 2021-10-14 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022107508A1 (en) |
| TW (1) | TW202229390A (en) |
| WO (1) | WO2022107508A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023218876A1 (en) * | 2022-05-13 | 2023-11-16 | 株式会社日本触媒 | Alkali-soluble resin, photosensitive resin composition, and cured product thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3397249B2 (en) * | 1993-03-10 | 2003-04-14 | 日本化薬株式会社 | Resin composition and cured product thereof |
| JP2877659B2 (en) * | 1993-05-10 | 1999-03-31 | 日本化薬株式会社 | Resist ink composition and cured product thereof |
| JP2000214584A (en) * | 1999-01-27 | 2000-08-04 | Taiyo Ink Mfg Ltd | Photocurable and thermocurable resin composition and printed circuit board having solder resist film and insulating resin layer by using same |
| JP2002040647A (en) * | 2000-07-31 | 2002-02-06 | Taiyo Ink Mfg Ltd | Resist ink composition |
| JP4471149B2 (en) * | 2003-10-10 | 2010-06-02 | 日本化薬株式会社 | Photosensitive resin composition and method for producing cured product thereof |
| JP6184087B2 (en) * | 2012-12-07 | 2017-08-23 | 日本化薬株式会社 | Active energy ray curable resin composition, and display element spacer and / or color filter protective film using the same |
| WO2020059500A1 (en) * | 2018-09-18 | 2020-03-26 | 日本化薬株式会社 | Reactive polycarboxylic acid resin mixture, active energy ray-curable resin composition using same, cured product thereof, and reactive epoxy carboxylate resin mixture |
-
2021
- 2021-10-14 JP JP2022516671A patent/JPWO2022107508A1/ja active Pending
- 2021-10-14 WO PCT/JP2021/037986 patent/WO2022107508A1/en active Application Filing
- 2021-11-12 TW TW110142163A patent/TW202229390A/en unknown
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