JP2010078949A5 - - Google Patents

Download PDF

Info

Publication number
JP2010078949A5
JP2010078949A5 JP2008247539A JP2008247539A JP2010078949A5 JP 2010078949 A5 JP2010078949 A5 JP 2010078949A5 JP 2008247539 A JP2008247539 A JP 2008247539A JP 2008247539 A JP2008247539 A JP 2008247539A JP 2010078949 A5 JP2010078949 A5 JP 2010078949A5
Authority
JP
Japan
Prior art keywords
acid
curable composition
group
monocarboxylic acid
monocarboxylic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008247539A
Other languages
Japanese (ja)
Other versions
JP5254723B2 (en
JP2010078949A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008247539A priority Critical patent/JP5254723B2/en
Priority claimed from JP2008247539A external-priority patent/JP5254723B2/en
Publication of JP2010078949A publication Critical patent/JP2010078949A/en
Publication of JP2010078949A5 publication Critical patent/JP2010078949A5/ja
Application granted granted Critical
Publication of JP5254723B2 publication Critical patent/JP5254723B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (9)

(A)1分子中に2個以上のエポキシ基を有する樹脂(a)のエポキシ基に、エポキシ基1当量に対してモノカルボン酸(b)を0.3〜0.9モルの割合で反応させ、得られた反応生成物(c)のエポキシ基に、エポキシ基1当量に対して多塩基酸(d)を0.2〜5モルの割合で反応させ、得られた反応生成物(e)のエポキシ基に、エポキシ基1当量に対してモノカルボン酸(f)を0.0〜5.0モルの割合で反応させて得られる酸価18〜180mgKOH/gの反応生成物(g)の2級のアルコール性水酸基に、さらに多塩基酸無水物(h)を反応させて得られる酸価40〜200mgKOH/gのカルボキシル基含有化合物、
(B)前記カルボキシル基含有化合物(A)以外のカルボキシル基含有化合物、
(C)感光性(メタ)アクリレート化合物、及び
(D)光重合開始剤
を含有することを特徴とするアルカリ現像可能な硬化性組成物。
(A) The monocarboxylic acid (b) is reacted with the epoxy group of the resin (a) having two or more epoxy groups in one molecule at a ratio of 0.3 to 0.9 mol with respect to 1 equivalent of the epoxy group. The polybasic acid (d) is reacted with the epoxy group of the obtained reaction product (c) at a ratio of 0.2 to 5 mol with respect to 1 equivalent of the epoxy group, and the reaction product (e The reaction product (g) having an acid value of 18 to 180 mgKOH / g obtained by reacting the epoxy group of 1) with a monocarboxylic acid (f) at a ratio of 0.0 to 5.0 mol with respect to 1 equivalent of the epoxy group. A carboxyl group-containing compound having an acid value of 40 to 200 mgKOH / g, obtained by further reacting the secondary alcoholic hydroxyl group with a polybasic acid anhydride (h),
(B) a carboxyl group-containing compound other than the carboxyl group-containing compound (A),
A curable composition capable of alkali development, comprising (C) a photosensitive (meth) acrylate compound, and (D) a photopolymerization initiator.
前記モノカルボン酸(b)及び(f)が不飽和基含有モノカルボン酸である請求項1に記載の硬化性組成物。   The curable composition according to claim 1, wherein the monocarboxylic acids (b) and (f) are unsaturated group-containing monocarboxylic acids. 前記モノカルボン酸(b)が不飽和基含有モノカルボン酸であり、前記モノカルボン酸(f)が不飽和基を含有しないモノカルボン酸である請求項1に記載の硬化性組成物。   The curable composition according to claim 1, wherein the monocarboxylic acid (b) is an unsaturated group-containing monocarboxylic acid, and the monocarboxylic acid (f) is a monocarboxylic acid not containing an unsaturated group. 前記モノカルボン酸(b)が不飽和基を含有しないモノカルボン酸であり、前記モノカルボン酸(f)が不飽和基含有モノカルボン酸である請求項1に記載の硬化性組成物。   The curable composition according to claim 1, wherein the monocarboxylic acid (b) is a monocarboxylic acid not containing an unsaturated group, and the monocarboxylic acid (f) is an unsaturated group-containing monocarboxylic acid. 前記モノカルボン酸(b)及び(f)が不飽和基を含有しないモノカルボン酸である請求項1に記載の硬化性組成物。   The curable composition according to claim 1, wherein the monocarboxylic acids (b) and (f) are monocarboxylic acids not containing an unsaturated group. 前記モノカルボン酸(b)及び/又は(f)が不飽和基含有モノカルボン酸と不飽和基を含有しないモノカルボン酸の混合物である請求項1に記載の硬化性組成物。   The curable composition according to claim 1, wherein the monocarboxylic acid (b) and / or (f) is a mixture of an unsaturated group-containing monocarboxylic acid and a monocarboxylic acid not containing an unsaturated group. 前記多塩基酸(d)がマロン酸又はマロン酸と他の二塩基酸との混合物である請求項1〜6のいずれかに記載の硬化性組成物The curable composition according to any one of claims 1 to 6, wherein the polybasic acid (d) is malonic acid or a mixture of malonic acid and another dibasic acid. 1分子中に2個以上のエポキシ基を有する樹脂(a)がノボラック型エポキシ樹脂である請求項1〜7のいずれかに記載の硬化性組成物。   The curable composition according to any one of claims 1 to 7, wherein the resin (a) having two or more epoxy groups in one molecule is a novolac type epoxy resin. 請求項1〜8のいずれかに記載の硬化性組成物の硬化物。   Hardened | cured material of the curable composition in any one of Claims 1-8.
JP2008247539A 2008-09-26 2008-09-26 Curable composition capable of alkali development and cured product thereof Active JP5254723B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008247539A JP5254723B2 (en) 2008-09-26 2008-09-26 Curable composition capable of alkali development and cured product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008247539A JP5254723B2 (en) 2008-09-26 2008-09-26 Curable composition capable of alkali development and cured product thereof

Publications (3)

Publication Number Publication Date
JP2010078949A JP2010078949A (en) 2010-04-08
JP2010078949A5 true JP2010078949A5 (en) 2011-11-04
JP5254723B2 JP5254723B2 (en) 2013-08-07

Family

ID=42209469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008247539A Active JP5254723B2 (en) 2008-09-26 2008-09-26 Curable composition capable of alkali development and cured product thereof

Country Status (1)

Country Link
JP (1) JP5254723B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5814691B2 (en) 2011-08-11 2015-11-17 互応化学工業株式会社 Resin resin composition
JP6524572B2 (en) * 2013-07-01 2019-06-05 互応化学工業株式会社 Composition for solder resist and printed wiring board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3434584B2 (en) * 1994-08-23 2003-08-11 住友ベークライト株式会社 Resin composition, permanent resist resin composition and cured product thereof
JP2002014467A (en) * 2000-06-28 2002-01-18 Tamura Kaken Co Ltd Photosensitive resin, photosensitive resin composition and printed wiring board
JP3659639B2 (en) * 2002-08-05 2005-06-15 昭和高分子株式会社 Vinyl ester resin, vinyl ester resin composition, and cured product thereof
JP2007206370A (en) * 2006-02-01 2007-08-16 Toppan Printing Co Ltd Colored alkali developable photosensitive resin composition and color filter obtained by using the same
JP5051217B2 (en) * 2007-03-05 2012-10-17 東亞合成株式会社 Photosensitive composition, solder resist and photosensitive dry film
JP5430884B2 (en) * 2008-06-20 2014-03-05 互応化学工業株式会社 Curable composition capable of alkali development and cured product thereof
JP5199803B2 (en) * 2008-09-19 2013-05-15 互応化学工業株式会社 Carboxyl group-containing compound and cured product thereof

Similar Documents

Publication Publication Date Title
RU2014127905A (en) STRUCTURAL ADHESIVE COMPOSITIONS
CN103980813B (en) Alicyclic epoxy urethane acrylate ultraviolet-curing paint and preparation method thereof
EP1906242A4 (en) Photosensitive resin composition
TW200719085A (en) Photosensitive resin composition, composition for solder resist, and photosensitive dry film
TW200708896A (en) Alkaline-developable photosensitive colored composition
JP2013504652A5 (en)
TW200914486A (en) Photo-and heat-curable composition, cured product and curing method thereof
JP2010138379A5 (en)
TW200625003A (en) Colored alkali developable photosensitive resin composition, and color filter using said colored alkali developable photosensitive resin composition
TW200641534A (en) Photosensitive resin composition
NZ598184A (en) Composition for aqueous coating material and process for its production, and two-component curable aqueous coating material kit
EP2292678A4 (en) Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition
JP2011013486A5 (en)
JP2008088394A5 (en)
JP2010102270A5 (en) Photosensitive resin composition, method for producing photosensitive resin used therefor, and method for producing cured coating film
JP2010078949A5 (en)
TWI782991B (en) (Meth)acrylate resins containing acid groups and resin materials for solder resist
CN102838486A (en) Ultraviolet light curing polyester acrylate and preparation method thereof
JP6669311B2 (en) Acid group-containing (meth) acrylate resin and resin material for solder resist
JP2019151861A5 (en)
JPWO2022137591A5 (en)
JP2010078753A5 (en)
JP2009080486A5 (en)
JP2012520277A5 (en)
RU2015124101A (en) METHOD FOR PRODUCING MODIFIED EPOXY (MET) OF ACRYLATE RESINS AND THEIR APPLICATION