JP2010101776A - Electronic component thrusting apparatus and ic handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component thrusting apparatus capable of quickly contacting a test objective electronic component with a testing socket at an appropriate pressure, and an IC handler provided with the thrusting apparatus. <P>SOLUTION: A control device performs an IC arrangement step in which an IC chip is arranged in the testing socket (Step S11). When this is done, there is a fine clearance between each external terminal of the IC chip and each testing probe. Next, a low-pressure thrusting step is performed (Step S12). In the low-pressure thrusting step, a pneumatic piston is caused to contact each external terminal with each testing probe by a contacting thrust lower than an adequate thrust suitable for testing. At this contacting moment, the contacting thrust and a thrust consisting of an inertia force of the piston itself and an inertia force of the testing probe are eased from becoming excessive. Thereafter, it is detected in a statically determinate pressure detection step that the thrust has been statically determinated to be the contacting thrust (Step S14), and the contacting thrust is changed to the adequate thrust in a testing thrusting step (Step S15). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component pressing device that presses an electronic component such as a semiconductor against an inspection socket that inspects its electrical characteristics, and an IC handler including the pressing device.

  As one of electronic component inspection devices (IC handlers) for inspecting various electrical characteristics of electronic components such as semiconductor chips, an IC having an inspection head that presses while placing the electronic component on an inspection socket for inspecting the electronic component The handler is known. That is, in such an IC handler, an electronic component before inspection that is placed on a tray and supplied from the outside is pressed by the inspection head while being placed on the inspection socket. After the inspection, the electronic components arranged in the inspection socket are collected by the inspection head, distributed to the corresponding trays according to the quality of the inspection results, and discharged together with the trays. become.

  Here, when the electronic component is arranged in the inspection socket, the electronic component moved to an upper position in the vicinity of the inspection socket by the inspection head is usually attached to the piston to which a predetermined connection pressure is applied from the air cylinder. It is pressed against the inspection socket as it moves downward. Then, the electronic component pressed against the inspection socket by the connection pressure has the external terminal in contact with the inspection probe which is the terminal of the inspection socket biased upward by the receiving pressure. By pushing down the probe, electrical connection with the probe is ensured, and its electrical characteristics are inspected.

  On the other hand, in recent years, along with the downsizing and high integration of electronic components, the trend toward finer pitches of external terminals has been promoted, coupled with a decrease in the rigidity of electronic components themselves and miniaturization of internal circuits. There is also a tendency for the resistance to impact from to decrease. For this reason, an external terminal of the electronic component is brought into contact (contact) with the inspection probe as well as ensuring that an appropriate connection pressure is stably applied to the electronic component disposed in the inspection socket. In some cases, it is desirable that an excessive pressing force exceeding the connection pressure is not applied to the electronic component even if it is transient. However, as a matter of fact, at the moment when the external terminal of the electronic component is brought into contact with the inspection probe due to the downward movement of the piston, together with the downward connection pressure from the piston, the downward inertia of the piston itself Is applied to the upper surface of the electronic component. Further, the inertial force of the inspection probe biased upward is also applied to the lower surface of the electronic component via the external terminal. That is, when the external terminal of the electronic component and the inspection probe are brought into contact with each other, it is inevitable that not only the connection pressure but also the inertial force is applied to the electronic component at the same time. Application of excessive pressure is inevitable.

Therefore, conventionally, for example, an IC handler having a structure described in Patent Document 1 has been proposed as an IC handler that suppresses transiently applying excessive pressure to an electronic component arranged in the inspection socket. . That is, in this IC handler, the inspection head (compliance unit) is set with the internal pressure of the air cylinder that moves the piston down to atmospheric pressure so that the piston pressing the electronic component does not generate unnecessary pressing force on the inspection socket. ) Brings the electronic component into contact with the socket for inspection. Thus, at the moment when the electronic component is brought into contact with the inspection socket, only the inertial force of the piston moved down together with the inspection head and the inertial force of the inspection probe are applied to the electronic component. Thus, the applied pressure is relieved by the absence of the pressing force such as the connection pressure. Then, after the electronic component is brought into contact with the inspection socket, air of a set pressure is supplied to the air cylinder, and the connection pressure through the piston is applied to the electronic component, so that the electronic component and the inspection socket (inspection) The electrical connection with the probe is ensured.
JP 2002-236141 A

  As described above, according to the IC handler described in Patent Document 1, although the impact (applied pressure) when the electronic component is brought into contact with the inspection socket is reduced, the electronic component is applied to the inspection socket. Since air of a set pressure is supplied to the air cylinder after contact is made, a time delay naturally occurs until the connection pressure is obtained. Moreover, since the pressing force applied to the electronic component is estimated based on an empirical value (experimental value) of the time required from the start of air cylinder pressure increase to the set pressure, the electronic component is actually The pressure received from the air cylinder is also unknown. Therefore, even if the output pressure of the air cylinder or the receiving pressure of the inspection probe changes due to changes over time, there is a disadvantage that it cannot be flexibly dealt with.

  The present invention has been made in view of such circumstances, and an object of the present invention is to press an electronic component capable of quickly bringing an electronic component to be inspected into contact with an inspection socket with an appropriate pressure. And providing an IC handler including the pressing device.

  In the electronic device pressing device according to the present invention, an electronic component held by a holding portion provided at a lower portion of a piston capable of changing a pressing force is opposed to an inspection socket, and the piston is moved downward in that state. An electronic component pressing device that controls the pressing force of the piston to an appropriate pressing force suitable for inspection of electrical characteristics while bringing an external terminal of the electronic component into contact with an inspection probe provided in the inspection socket. A pressure detecting device provided between the piston and the electronic component for detecting pressure generated between the piston and the electronic component, and each time an external terminal of the electronic component and the inspection probe are provided. The maximum value of the detected value detected by the pressure detection device at the time of the previous contact is acquired, and at the time of contact between the external terminal of the electronic component and the inspection probe, the acquired maximum value is acquired. The value obtained by subtracting the value of the appropriate pressing force from the value is subtracted from the pressing force applied at the time of previous contact each time, and the detected value obtained through the pressure detection device is static. The gist is to change the pressing force of the piston to the appropriate pressing force at a predetermined timing.

  According to such a configuration, the external terminal of the electronic component is brought into contact with the inspection probe of the inspection socket at the time of contact by the pressing force that is lower than the appropriate pressing force, and the detection value by the pressure detection device is stabilized. The pressing force is changed to an appropriate pressing force at the timing. As a result, even if the inertia force of the piston itself is applied to the upper surface in addition to the pressing force of the piston when the electronic component is brought into contact with the inspection socket, the pressing force at the time of contact is lower than the appropriate pressing force. The applied pressing force is relieved by the amount that is set. As a result, the electronic component comes into contact with the inspection socket with an appropriate pressure.

  Further, the pressing force at the time of contact is calculated so that the maximum value of the detected value at the time of contact becomes a value in the vicinity of the appropriate pressing force. As a result, even if the pressing force at the time of contact is set in advance, the detection value is quickly reached the pressing force at the time of contact, and the application of excessive pressing force to the electronic component is also reduced. The pressing force at the time of contact with good balance is calculated.

Furthermore, since the pressing force applied to the electronic component is detected through the pressure detection device including the maximum value, the pressing force at the time of contact of the electronic component is calculated based on the maximum value at the time of previous contact. Will be able to. In other words, even if the pressure on the electronic components changes due to changes in the piston output or the receiving pressure of the inspection probe due to changes over time, etc., it is possible to respond flexibly to such changes in the pressing force. Thus, it is possible to prevent an excessive pressing force from being applied to the electronic component. In addition, the piston pressing force reaches the appropriate pressing force at the time of contact because the piston pressing force is changed to an appropriate pressing force suitable for inspection at the timing when the detection value obtained through the pressure detection device is settled. The time until it is performed is shortened, and the time required to inspect the electronic component held by such a pressing device is shortened.

  Further, the electronic device pressing device according to the present invention has an initial value corresponding to the maximum value of the detection value acquired through the pressure detection device only at the first contact between the external terminal of the electronic component and the inspection probe. The gist is that the value of the appropriate pressing force is used.

  According to such a configuration, even when there is no maximum value detected by the pressure detection device at the time of the previous contact as in the case of the first contact, by using the appropriate pressing force as the initial value, The pressing force applied to the piston at the time of contact is calculated. Thereby, the contact of the electronic component to the inspection socket by such an electronic component pressing device is performed including the case of the first contact.

  Further, the electronic device pressing device according to the present invention has an initial value corresponding to the maximum value of the detection value acquired through the pressure detection device only at the first contact between the external terminal of the electronic component and the inspection probe. The gist is that empirically obtained constant values are used.

  According to such a configuration, even when there is no maximum value detected by the pressure detection device at the time of the previous contact as in the first contact, the initial value is based on an empirical value or an experimental value. By using a constant value, the pressing force applied to the piston at the time of contact is calculated. Thereby, the contact of the electronic component to the inspection socket by such an electronic component pressing device can be more suitably performed including the case of the first contact.

The gist of the electronic device pressing device of the present invention is that the pressure detecting device is provided between the piston and the grip portion.
According to such a configuration, it is easy to install the pressure detection device on the electronic device pressing device, and the electronic device pressing device can be easily realized.

The gist of the electronic device pressing device of the present invention is that the pressure detecting device comprises a load cell.
According to such a configuration, since the structure of the pressure detection device does not include a mechanical movable part requiring maintenance, the reliability of the electronic device pressing device can be improved.

  The IC handler of the present invention is an IC handler comprising an inspection head for transporting and arranging the gripped electronic component to the inspection socket, and the inspection head is provided with the electronic component pressing device described above. The gist is that the electronic component held by the holding portion of the pressing device is disposed in the inspection socket.

  According to such a configuration, when the inspection head causes the electronic component to contact the inspection socket, the external terminal of the electronic component is applied to the inspection probe of the inspection socket by the pressing force that is lower than the appropriate pressing force. The pressing force is changed to an appropriate pressing force at the timing when the detected value by the pressure detecting device is settled. As a result, even when the electronic component is brought into contact with the socket for inspection and the inertia force of the piston itself is applied to the upper surface in addition to the pressing force of the piston, the contact pressure is made lower than the appropriate pressing force. As a result, the applied pressing force is reduced. As a result, the electronic component conveyed and gripped by such an IC handler comes into contact with the inspection socket with an appropriate pressure.

  Further, the pressing force at the time of contact is calculated so that the maximum value of the detected value at the time of contact becomes a value in the vicinity of the appropriate pressing force. As a result, even if the pressing force at the time of contact is set in advance, the detection value is quickly reached the pressing force at the time of contact, and the application of excessive pressing force to the electronic component is also reduced. The pressing force at the time of contact with good balance is calculated.

  Furthermore, since the pressing force applied to the electronic component is detected through the pressure detection device including the maximum value, the pressing force at the time of contact of the electronic component is calculated based on the maximum value at the time of previous contact. Will be able to. In other words, even if the pressure on the electronic components changes due to changes in the piston output or the receiving pressure of the inspection probe due to changes over time, etc., it is possible to respond flexibly to such changes in the pressing force. Thus, it is possible to prevent an excessive pressing force from being applied to the electronic component. In addition, the piston pressing force reaches the appropriate pressing force at the time of contact because the piston pressing force is changed to an appropriate pressing force suitable for inspection at the timing when the detection value obtained through the pressure detection device is settled. The time until it is performed is shortened, and the time required to inspect the electronic component held by such a pressing device is shortened.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an IC handler 10 as an electronic component inspection apparatus.
The IC handler 10 includes a base 11, a safety cover 12, a high temperature chamber 13, a supply robot 14, a collection robot 15, a first shuttle 16, a second shuttle 17, and a plurality of conveyors C1 to C6.

  The base 11 has the above elements mounted on the upper surface thereof. The safety cover 12 surrounds a large area of the base 11, and the supply robot 14, the recovery robot 15, the first shuttle 16, and the second shuttle 17 are accommodated therein.

  The plurality of conveyors C <b> 1 to C <b> 6 are provided on the base 11 such that one end thereof is located outside the safety cover 12 and the other end is located inside the safety cover 12. Each of the conveyors C1 to C6 conveys a tray 18 containing a plurality of IC chips T such as electronic components from the outside of the safety cover 12 to the inside of the safety cover 12, and conversely, the tray 18 is moved to the inside of the safety cover 12. To the outside of the safety cover 12.

  The supply robot 14 includes an X-axis frame FX, a first Y-axis frame FY1, and a supply-side robot hand unit 20. The collection robot 15 includes the X-axis frame FX, the second Y-axis frame FY2, and the collection-side robot hand unit 21. The X-axis frame FX is disposed in the left-right direction (X direction; left-right direction in FIG. 1). The first Y-axis frame FY1 and the second Y-axis frame FY2 are arranged so as to be parallel to each other along the front-rear direction (Y direction, downward upward direction in FIG. 1), and with respect to the X-axis frame FX And supported so as to be movable in the left-right direction. The first Y-axis frame FY1 and the second Y-axis frame FY2 are reciprocated in the left-right direction along the X-axis frame FX by respective motors (not shown) provided on the X-axis frame FX.

  A supply-side robot hand unit 20 is supported below the first Y-axis frame FY1 so as to be movable in the front-rear direction (Y direction). The supply-side robot hand unit 20 reciprocates in the front-rear direction along the first Y-axis frame FY1 by respective motors (not shown) provided on the first Y-axis frame FY1. Then, the supply-side robot hand unit 20 supplies, for example, the IC chip T before inspection accommodated in the tray 18 of the conveyor C1 to the first shuttle 16, for example.

  A collection-side robot hand unit 21 is supported below the second Y-axis frame FY2 so as to be movable in the front-rear direction (Y direction). The collection-side robot hand unit 21 reciprocates in the front-rear direction along the second Y-axis frame FY2 by respective motors (not shown) provided on the second Y-axis frame FY2. Then, the collection-side robot hand unit 21 supplies, for example, the inspected IC chip T supplied from the first shuttle 16 to the tray 18 of the conveyor C6, for example.

  On the upper surface of the base 11, between the supply robot 14 and the collection robot 15, a first rail 24A and a second rail 24B are arranged in parallel in the left-right direction. The first rail 24A is provided with a first shuttle 16 that can reciprocate in the left-right direction. The second rail 24B is provided with a second shuttle 17 that can reciprocate in the left-right direction.

  The first shuttle 16 includes a substantially plate-like base member 16A that is long in the left-right direction, and is in sliding contact with the first rail 24A by a rail receiver (not shown) on the bottom surface. Then, it is reciprocated along the first rail 24 </ b> A by a motor (not shown) provided in the first shuttle 16. Change kits 25 and 27 are fixed to both ends of the upper surface of the base member 16A in a replaceable manner with screws or the like, so that the IC chips T are held in the pockets 26 of the change kits 25 and 27, respectively.

  The second shuttle 17 includes a substantially plate-like base member 17A that is long in the left-right direction, and is in sliding contact with the second rail 24B by a rail receiver (not shown) on the bottom surface. Then, it is reciprocated along the second rail 24 </ b> B by a motor (not shown) provided in the second shuttle 17. Change kits 25 and 27 are fixed to both ends of the upper surface of the base member 17A in a replaceable manner with screws or the like, so that the IC chips T are held in the pockets 26 of the change kits 25 and 27, respectively.

An inspection unit 23 is provided between the first and second shuttles 16 and 17 on the upper surface of the base 11.
In FIG. 2, an inspection socket 23A is recessed on the upper surface of the inspection unit 23. The inspection socket 23A is a socket for performing an electrical inspection on the IC chip T mounted thereon, and a connector portion 23Ac on which the IC chip T is disposed is provided on the socket 23A. That is, the inspection portion 23 is provided with the inspection socket 23A so that the connector portion 23Ac faces upward.

In FIG. 3, the connector portion 23Ac is provided with a plurality of inspection probes 23P as connection terminals for inspection corresponding to the external terminals B of the IC chip T to be inspected.
The inspection probe 23P is arranged so that its base end portion can move up and down in the inspection socket 23A, and its distal end portion protrudes upward from the bottom portion 23b of the connector portion 23Ac. That is, when the base end portion of the inspection probe 23P is moved to the lower end of the operating range in the inspection socket 23A, the distal end portion thereof is disposed at the lower end position having the same height as the bottom portion 23b of the connector portion 23Ac. . Further, when the base end portion is moved in the inspection socket 23A to the upper end of the operating range, the tip end portion is arranged at the upper end position that protrudes most from the bottom portion 23b of the connector portion 23Ac. . Normally, as illustrated in FIG. 4A, the inspection probe 23P is arranged such that its base end portion is urged upward by a spring (not shown) and arranged at the upper end of its operating range. At this time, the tip end portion is arranged at the upper end position. On the other hand, as illustrated in FIG. 4C, when the probe 23P for inspection receives a pressing force at its tip, the probe 23P resists the upward biasing force (receiving pressure) by the spring to its base end. The tip is moved in the direction from the upper end position to the lower end position, and the protruding length from the bottom 23b is shortened. That is, the IC chip T is connected to the inspection socket 2
When pressed by 3A, each external terminal B of the IC chip T pushes them down against the receiving pressure of each inspection probe 23P, thereby ensuring a predetermined contact pressure with the inspection probe 23P. However, an electrical connection is ensured.

  In FIG. 1, above and below the first and second shuttles 16 and 17 and the inspection socket 23A, in order to transport the IC chip T between the shuttles 16 and 17 and the inspection socket 23A, front and rear An inspection head 22 that can reciprocate in the direction (Y direction) is provided. In FIG. 2, the inspection head 22 is movable in the front-rear direction with respect to a frame (not shown) installed on the base 11, and can move up and down (Z direction) with respect to the horizontal movement unit 31. Further, a vertical moving part 32 connected to the lower part and a grip part 35 connected to the lower part of the vertical moving part 32 are provided.

The horizontal moving part 31 is reciprocated in the front-rear direction along the frame by forward and reverse rotation of a Y-axis motor MY (see FIG. 5) provided in the frame.
The vertical moving unit 32 is reciprocated in the vertical direction with respect to the horizontal moving unit 31 by forward and reverse rotation of a Z-axis motor MZ (see FIG. 5) provided in the horizontal moving unit 31. That is, the height of the gripping part 35 is the supply / discharge height when the IC chip T is supplied / discharged to / from the pockets 26 of the change kits 25 and 27, and the arrangement height when the IC chip T is arranged in the inspection socket 23A. Alternatively, the vertical movement unit 32 is moved up and down in accordance with each step to the height of the movement height when moving in the front-rear direction (Y direction) together with the inspection head 22.

The vertical moving unit 32 is provided with a position adjusting device 33 and a pressing unit 34 connected to the lower portion of the position adjusting device 33.
The position adjusting device 33 finely adjusts the position of the lower part with respect to the opposing inspection unit 23 and the like, and the casing is fixed to the vertical moving unit 32 and the lower part is moved vertically. Relative movement in the horizontal direction (XY direction) and rotational movement along the horizontal plane (XY plane) with respect to the portion 32 are possible. In other words, the position adjusting device 33 includes an X movement actuator (not shown) that moves the lower part in the left and right direction (X direction), a Y movement actuator (not shown) that moves in the front and rear direction (Y direction), and a rotation (θ And a θ-moving actuator (not shown) that is moved). With the cooperation of these actuators, the lower portion of the position adjusting device 33 is moved relative to the vertical moving portion 32 in the horizontal direction and rotated along the horizontal plane, and the pressing portion 34 connected to the lower portion is also vertically moved. The relative movement in the horizontal direction with respect to the moving unit 32 and the rotational movement along the horizontal plane, that is, the position is finely adjusted.

  A pneumatic cylinder is provided inside the pressing portion 34. The pneumatic cylinder is provided with a base end portion of a piston 34P that can move up and down with a predetermined stroke with respect to the pneumatic cylinder, and a distal end portion of the piston 34P projects downward from the lower surface of the pressing portion 34. Has been. When the compressed air is supplied, the pneumatic cylinder is in an operating state, and the piston 34P is moved down to a descending end which is the lower end in the pneumatic cylinder by a pressing force based on the air pressure of the supplied compressed air. On the other hand, the pneumatic cylinder is deactivated when its internal pressure is released to atmospheric pressure, and the piston 34P is moved up to the rising end, which is the upper end of the pneumatic cylinder, by the biasing of a spring (not shown). It has become. As a result, the pressing portion 34 moves up and down at a stroke corresponding to the distance between the rising end and the falling end on the lower surface of the piston 34P. In the present embodiment, the stroke in which the piston 34P is moved up and down is a very short distance compared to the distance in which the vertical moving unit 32 is moved up and down.

On the side surface of the pressing portion 34, a rising end detection sensor 34U that detects that the base end portion of the piston 34P is positioned at the rising end, and detects that the base end portion of the piston 34P is positioned at the lower end. A descending end detection sensor 34D is provided. The ascending end detection sensor 34U and the descending end detection sensor 34D detect, for example, the magnetic force of magnets that are close to each other, and a permanent magnet provided at the base end of the piston 34P moves up and down the pneumatic cylinder. The magnetic force when it is positioned at is detected. That is, when detecting that the piston 34P is positioned at the rising end, the rising end detection sensor 34U outputs an “ON” signal indicating that it has been detected, and indicates that it has not been detected otherwise. Outputs an “OFF” signal. In addition, when detecting that the piston 34P is located at the lower end, the lower end detection sensor 34D outputs an “ON” signal indicating that it has been detected, and indicates that it has not been detected otherwise. Outputs an “OFF” signal.

  The grip portion 35 is connected to the tip of the piston 34P. That is, the grip portion 35 is moved relative to the vertical moving portion 32 in the horizontal direction and rotated along the horizontal plane by driving the lower portion of the position adjusting device 33, and the piston 34P of the pressing portion 34 is moved. By being driven, it is moved up and down over a short distance.

  The gripping part 35 is provided with a suction port on its lower surface 35b. The suction port is connected to a suction valve V1 (see FIG. 5) for switching between connection to a vacuum device (not shown) and release to atmospheric pressure, and the IC chip T is generated by the negative pressure generated when connected to the vacuum device. Is held by the holding portion 35 by suction. Thereby, the IC chip T before the inspection held by the holding part 35 is arranged at the raised position near the pressing part 34 when the pressing part 34 is in the non-operating state, and the pressing part 34 is in the operating state. When it is, it is arranged at the lowered position protruding from the pressing portion 34 by the stroke of the piston 34P.

  Thus, the IC chip T is gripped by the inspection head 22 by being attracted to the lower surface 35b of the grip portion 35. Then, as shown in FIG. 4A, the IC chip T is connected to the connector of the inspection socket 23A by moving the inspection head 22 back and forth so that the vertical moving portion 32 is lowered while facing the inspection socket 23A. Arranged in the portion 23Ac. In the present embodiment, the IC chip T is arranged in the connector part 23Ac in a state where the pressing part 34 is in a non-operating state and the IC chip T is arranged in the raised position, and each external terminal B thereof is arranged. A small gap is formed between each of the inspection probes 23P. The minute interval is set to a distance shorter than the stroke of the piston 34P of the pneumatic cylinder. Then, when the IC chip T is moved down from the raised position to the lowered position as the pressing portion 34 is moved from the non-operating state to the operating state, as shown in FIG. The external terminals B come into contact with the inspection probes 23P at the contact position that is halfway and is the upper end position of the inspection probe 23P. Thereafter, as shown in FIG. 4 (c), each external terminal B pushes each inspection probe 23P downward from the contact position until the piston 34P reaches the lowered end. When the piston 34P is arranged at the descending end, the inspection probe 23P pressed by each external terminal B is stopped at the base end above the lower end of the operating range. A pressing force other than the upward biasing force (receiving pressure) from the corresponding inspection probe 23P is not applied to the terminal B.

  In the present embodiment, the grip portion 35 is provided with a load cell 36 at the center of the upper portion 35a thereof, and the tip end portion of the piston 34P is connected to the load cell 36. The load cell 36 outputs a detection signal corresponding to the load based on the load received in the vertical direction. That is, the grip portion 35 is moved up and down by the piston 34P via the load cell 36, and the pressing force from the piston 34P including the reaction force that pushes back the piston 34P is detected by the load cell 36, and the detected pressing force is changed to the detected pressing force. A corresponding detection signal is output from the load cell 36.

Next, the electrical configuration of the IC handler 10 will be described with reference to FIG. FIG. 5 is a block diagram showing an electrical configuration mainly for disposing the IC chip T in the inspection socket 23A.

  The IC handler 10 is provided with a control device 50. The control device 50 is mainly composed of a microcomputer having a central processing unit (CPU), a nonvolatile memory (ROM) and a volatile memory (RAM), and is based on various data and programs stored in the memory. Various controls. In the present embodiment, the control device 50 executes a pressing force control for pressing the IC chip T against the inspection socket 23A. In the RAM, areas for storing a proper pressing force value, a contact pressing force value, a maximum pressing force value and its initial value, and a static determination threshold value are secured.

  The control device 50 is electrically connected to the input / output device 51. The input / output device 51 includes various switches and a status indicator, and outputs a command signal for starting execution of each process, initial value data for executing each process, and the like to the control device 50. In this embodiment, it is based on an appropriate pressing force that is a pressing force suitable for inspection, an abutting pressing force when the IC chip T is brought into contact with the inspection socket, an initial value of the maximum pressing force, and detection by a pressure detection device. A static determination threshold value for determining that the detected value has been fixed is output to the control device 50. The control device 50 stores these values received from the input / output device 51 in each area secured in correspondence with each value.

The control device 50 is electrically connected to the Y-axis motor drive circuit MYD and the Z-axis motor drive circuit MZD, respectively.
The Y-axis motor drive circuit MYD calculates a drive amount based on the drive signal in response to the drive signal received from the control device 50, and drives and controls the Y-axis motor MY based on the calculated drive amount. It has become. Further, the rotational speed of the Y-axis motor MY detected by the Y-axis motor encoder EMY is input to the control device 50 via the Y-axis motor drive circuit MYD. As a result, the control device 50 grasps the position of the inspection head 22 in the front-rear direction, as well as the grasped position, the upper position of the inspection socket 23A as the target position, and the first or second shuttle 16,17. A deviation from the upper position or the like is obtained, and the Y-axis motor MY is driven and controlled to reduce the deviation, so that the inspection head 22 is moved to the target position.

  The Z-axis motor drive circuit MZD calculates a drive amount based on the drive signal in response to the drive signal received from the control device 50, and drives and controls the Z-axis motor MZ based on the calculated drive amount. It has become. Further, the rotational speed of the Z-axis motor MZ detected by the Z-axis motor encoder EMZ is input to the control device 50 via the Z-axis motor drive circuit MZD. As a result, the control device 50 grasps the vertical position (height) of the grip portion 35, and shifts the height from the supply / discharge height as the target height, the arrangement height, or the movement height. In order to reduce the deviation, the Z-axis motor MZ is driven and controlled so that the grip portion 35 is moved to the target height.

  The control device 50 is electrically connected to the valve drive circuit V1D. The valve drive circuit V1D is configured to drive and control the adsorption valve V1 in response to a control signal received from the control device 50. The suction valve V1 is configured to switch the suction port pressure between the negative pressure and the atmospheric pressure by switching the connection destination of the suction port on the bottom surface of the gripper 35 between the vacuum device and the atmospheric pressure by driving control. It has become. The IC chip T is sucked and held by the holding portion 35 when the pressure of the suction port is made negative.

The control device 50 is electrically connected to an electropneumatic regulator circuit AR provided corresponding to the pressing portion 34. In response to the pressure command value input from the control device 50, the electropneumatic regulator circuit AR adjusts the pressure of the compressed air input thereto to a pressure indicated by the pressure command value and supplies it to the pressing unit 34. . Thus, the piston 34P is driven by the pressing force corresponding to the pressure indicated by the pressure command value. For example, when the electropneumatic regulator circuit AR receives a pressure command value whose pressure is an appropriate pressing force from the controller 50, the electropneumatic regulator circuit AR adjusts the pressure of the compressed air so that the piston 34P of the pressing portion 34 is moved downward with the appropriate pressing force. To. Further, for example, when the electropneumatic regulator circuit AR receives a pressure command value whose pressure is atmospheric pressure from the control device 50, the pressure of the compressed air is adjusted to atmospheric pressure so that the piston 34P of the pressing portion 34 is moved up. To.

  The control device 50 is electrically connected to a position adjustment device 33 provided in the vertical movement unit 32. In response to a control signal received from the control device 50, the position adjusting device 33 drives and controls each actuator of the X movement actuator, the Y movement actuator, and the θ movement actuator, thereby lowering the lower portion of the vertical movement portion 32 in the horizontal direction It is relatively moved in the X direction) and the front-back direction (Y direction) and rotated along the horizontal plane (XY plane). Thereby, for example, the control signal is output based on the position correction data of the IC chip T with respect to the vertical movement unit 32 calculated by a visual alignment device or the like provided separately with the control device 50, and the position adjustment device 33 is based on the control signal. The position of the pressing portion 34 (IC chip T) connected to the lower portion of the lever is finely adjusted with respect to the vertical moving portion 32.

  The control device 50 is electrically connected to the rising end detection sensor 34U. The control device 50 receives an “ON” signal output from the rising end detection sensor 34U when the piston 34P is disposed at the rising end, and determines that the piston 34P is disposed at the rising end.

  The control device 50 is electrically connected to the descending end detection sensor 34D. The control device 50 receives an “ON” signal output from the descending end detection sensor 34D when the piston 34P is disposed at the descending end, and determines that the piston 34P is disposed at the descending end.

  The control device 50 is electrically connected to the load cell 36. The control device 50 receives the detection signal output from the load cell 36 and sequentially calculates the pressing force between the piston 34P and the grip portion 35 based on the detection signal.

  Further, the control device 50 performs a contact pressure calculation process for calculating the contact pressure used at the time of contact. In the contact pressure calculation process, the value obtained by subtracting the appropriate pressure from the value of the maximum pressure at the previous contact is subtracted from the contact pressure applied at the previous contact each time. Ask for. For example, when the value of the maximum pressing force at the previous contact is greater than the appropriate pressing force, excess pressure exceeding the appropriate pressing force (positive pressure) is subtracted from the contact pressing force applied at the previous contact. Is obtained as a new contact pressing force. Also, for example, if the value of the maximum pressing force at the previous contact is smaller than the appropriate pressing force, the insufficient pressure (negative pressure) that is insufficient for the appropriate pressing force is added to the contact pressing force applied at the previous contact. Is obtained as a new contact pressing force.

  Further, the control device 50 performs a maximum pressing force detection process for detecting the maximum value of the pressing force applied to the IC chip T in contact with the inspection socket 23A. In the maximum pressing force detection process, first, the value of the memory area in which the maximum pressing force is recorded is set to “0”, and then, for example, after an “OFF” signal is input from the rising end detection sensor 34U, from the falling end detection sensor 34D. This is performed until an “ON” signal is input. At that time, in the maximum pressing force detection process, whether or not the pressing force (detected pressing force) calculated based on the detection signal output from the load cell 36 is larger than the maximum pressing force stored in the memory is sequentially compared. When the detected pressing force is larger than the maximum pressing force, the value is set to the maximum pressing force value.

Further, the control device 50 performs a stabilization determination process for determining that the detected pressing force has been stabilized. In the stabilization determination process, after the “ON” signal is input from the descending end detection sensor 34D, the magnitude of the difference between the detected pressing force and the pressure command value (contact pressing force) is smaller than the determination threshold. It is determined that the detected pressing force has been settled because the period has elapsed.

  Next, a process (contact process) in which the IC handler 10 having the test head 22 as described above causes the IC chip T to contact the test socket 23A will be described with reference to FIGS. FIG. 6 is a flowchart showing the contact process, and FIG. 7 is a timing chart showing the relationship between the change of the pressing force applied to the IC chip T and the time in the contact process.

In addition, such a contact process is a process repeatedly performed whenever the IC chip T before the inspection is moved to the position facing the inspection socket 23A by the inspection head 22.
FIG. 7 shows the first two steps among these steps. That is, in FIG. 7, the timing chart of the first contact process is displayed on the left side (early time side), and the timing chart of the second contact process is displayed on the right side (late time side). In the following, details of the second contact step (current contact step) will be described based on a flowchart.

  First, when the IC chip T before inspection is moved to a position facing the inspection socket 23A by the inspection head 22, a contact process for bringing the IC chip T into contact with the inspection socket 23A is started. That is, when this contact process is started, the control device 50 performs an IC placement process as a process of lowering the vertical moving portion 32 of the test head 22 and placing the IC chip T in the test socket 23A. (Step S11). When the IC chip T is arranged in the inspection socket 23A in the IC arrangement step, a minute amount is provided between each external terminal B of the IC chip T and each inspection probe 23P as shown in FIG. There is a gap.

  When the IC chip T is placed in the inspection socket 23A, the control device 50 sets the pressing command to the “ON” signal (time ta2 in FIG. 7), and executes the low pressure pressing process (step S12). The low pressure pressing step is a step of pressing the IC chip T disposed in the inspection socket 23A against the inspection socket 23A with the contact pressing force Pr2 which is a pressure lower than the appropriate pressing force Pr1.

  By the way, at the moment when each external terminal B of the IC chip T that moves downward with the downward movement of the piston 34P comes into contact with the inspection probe 23P, the downward pressing force (for example, the contact pressing force) from the piston 34P. Along with Pr2), the inertial force of the piston 34P moving downward is applied to the upper surface of the IC chip T. At this time, the inertial force of the inspection probe 23P biased upward is also applied to the lower surface of the IC chip T via each external terminal B. That is, when each external terminal B of the IC chip T and the inspection probe 23P are brought into contact with each other, not only the downward pressing force from the piston 34P but also these inertial forces are simultaneously applied to the IC chip T. Then, an excessive pressure due to these inertial forces is applied. Since these inertial forces are considered to be maximized at the moment when the IC chip T is brought into contact with the inspection probe 23P, the maximum value of the excessive pressure is brought into contact with the inspection probe 23P. It is thought to occur when it happens. The application of such an excessive pressure reduces the resistance to external impacts in conjunction with the recent downsizing and higher integration of electronic components, coupled with a decrease in rigidity of the electronic components themselves and miniaturization of internal circuits. There is a high risk of damage to the IC chip T as an electronic component. Therefore, in the present embodiment, first, in the low pressure pressing process, each external terminal B is appropriately pressed so that an excessive pressure is not applied to the IC chip T when each external terminal B comes into contact with the inspection probe 23P. The inspection probe 23P is brought into contact with a lower contact pressing force.

Therefore, the contact pressing force Pr2 as the pressing command value in the current contact process is obtained by subtracting the pressure difference f obtained by subtracting the appropriate pressing force Pr1 from the maximum pressing force Psv detected in the previous contact process. It is calculated as a value obtained by subtracting from the contact pressure, that is, the appropriate pressure Pr1. As a result, the magnitude of the maximum pressing force (time ts2) applied to the IC chip T at the moment when the IC chip T comes into contact with the inspection probe 23P in the current abutting process is equal to the previous maximum pressing force Psv (time ts1). ) Than the pressure difference f).

  Next, the calculation of the contact pressing force in the first contact process (previous contact process) will also be described. Since the maximum pressing force has not been calculated before the first contact step, the appropriate pressing force Pr1 is applied as the initial value of the maximum pressing force, and the pressure obtained by subtracting the appropriate pressing force Pr1 from the maximum pressing force. The difference f is “0”. Thereby, the contact pressing force in the first contact process is calculated as the appropriate pressing force Pr1. Therefore, in the first contact process, an excessive pressure similar to that in the conventional contact process is applied to the IC chip T. Accordingly, in FIG. 7, the aspect of the pressing force applied to the IC chip is compared in the case where the appropriate pressing force is applied at the time of contact, which has been conventionally known, and the current contact process. It is an aspect.

  That is, when the low pressure pressing process is started, the control device 50 causes the pressure command value of the contact pressing force Pr2 calculated as described above to be input to the electropneumatic regulator circuit AR, and the contact is made from the electropneumatic regulator circuit AR. Compressed air with a pressing force Pr2 is supplied to the pneumatic cylinder. In the pneumatic cylinder, the piston 34P is moved down from the rising end, and the signal of the rising end detection sensor 34U changes from “ON” to “OFF” (after time ta2 in FIG. 7).

  The low pressure pressing process is completed by supplying the compressed air with the contact pressure Pr2 to the pneumatic cylinder, but the supply of the compressed air from the electropneumatic regulator circuit AR to the pneumatic piston is maintained. . As a result, the piston 34P of the pneumatic cylinder is moved down thereafter, and as shown in FIG. 4B, the external terminal B is brought into contact with the inspection probe 23P at the contact position, and thereafter, the piston 34P in FIG. As shown in FIG. 7, the signal is moved to the lower end and the signal of the lower end detection sensor 34D is changed from “OFF” to “ON” (time td2 in FIG. 7).

  When the low-pressure pressing process is completed, for example, when the piston 34P is moved down and an “OFF” signal is output from the rising end detection sensor 34U, the control device 50 changes the pressure to store the maximum pressing force from the detected pressing force. A detection process is performed (step S13). The pressure fluctuation detection step is executed until the descending end detection sensor 34D outputs an “ON” signal (time td2 in FIG. 7), and the maximum of the detected pressures detected so far. For example, the pressing force at the time ts2 in FIG. 7 is detected. Note that the maximum pressing force obtained in this contact process is used in the next contact process, and as described above, the maximum pressing force used in this contact process is obtained in the previous contact process. The maximum pressing force Psv.

  When the pressure fluctuation detection process is completed, for example, when the piston 34P is arranged at the lower end and the “ON” signal is output from the lower end detection sensor 34D, the control device 50 executes the static pressure detection process (step S14). In the pressure stabilization detection step, a difference between the detected pressing force and the contact pressing force Pr2 is calculated, and a period in which the magnitude of this difference does not exceed the value of the threshold for determination of stabilization has passed a predetermined period. Then, it is determined that the detected pressing force has been settled. That is, it is determined that the pressing force applied to the IC chip T has been settled. For example, in FIG. 7, it is determined that the detected pressing force (pressure Psu) is fixed to the contact pressing force Pr2 at time tc2. Further, for example, in FIG. 7, in the previous contact process, it is determined that the detected pressing force (pressure Pc1) is statically set to the contact pressing force (in this case, the appropriate pressing force Pr1) at time tc1. .

If it is determined that the detected pressing force has been stabilized, the control device 50 ends the pressure stabilization detecting step (time tc2 in FIG. 7) and executes the inspection pressing step (step S15). In the pressing process for inspection, the control device 50 applies the pressure command value to the electropneumatic regulator circuit AR to the contact pressing force Pr2.
To an appropriate pressing force Pr1. When it is confirmed that the detected pressing force has changed to the pressure Pc1 (appropriate pressing force Pr1), the control device 50 starts an electrical inspection of the IC chip T.

  When the electrical inspection of the IC chip T is completed, the control device 50 performs an IC removal step (step S16). In the IC separation step, the control device 50 turns the pressure command signal “OFF” and changes the pressure command value to be input to the electropneumatic regulator circuit AR to “0” (atmospheric pressure). Then, the pressing portion 34 in which the pneumatic cylinder is brought to the atmospheric pressure rises when the piston 34P starts to move upward and the signal of the descending end detection sensor 34D is raised from "ON" to "OFF" and then rises to the ascending end. The signal of the end detection sensor 34U is changed from “OFF” to “ON”. Then, after the piston 34P is disposed at the rising end, the vertical moving portion 32 of the inspection head 22 is raised, and the IC chip T is detached from the inspection socket 23A.

Thereafter, each time the IC chip T before inspection is moved to a position facing the inspection socket 23A by the inspection head 22, the contact step is repeated.
As described above, according to the electronic device pressing device and the IC handler of this embodiment, the effects listed below can be obtained.

  (1) At the time of contact, the external terminal B of the IC chip T is contacted to the inspection probe 23P of the inspection socket 23A by the contact pressing force Pr2 that is lower than the appropriate pressing force Pr1, and the load cell as a pressure detection device The pressing force command value is changed to the appropriate pressing force Pr1 at the timing when the detected pressing value as the detection value by 36 is settled. As a result, even if the inertia force of the piston 34P itself is applied to the upper surface in addition to the pressing force of the piston 34P when the IC chip T is brought into contact with the inspection socket 23A, the pressing force at the time of contact is the appropriate pressing force. The applied pressing force is relaxed by the amount that is lower than the pressure Pr1. As a result, the IC chip T comes into contact with the inspection socket 23A with an appropriate pressure.

  (2) Since the pressing force applied to the IC chip T is detected through the load cell 36 including its maximum value, the pressing force applied when the IC chip T is in contact based on the maximum pressing force at the previous contact time. The contact pressure Pr2 can also be calculated. That is, even if the pressure on the IC chip T is changed due to a change in the output of the piston 34P or the receiving pressure of the inspection probe 23P due to a change over time or the like, It becomes possible to prevent an excessive pressing force from being applied to the IC chip T in a flexible manner.

(3) The contact pressing force Pr2 is calculated so that the maximum pressing force at the time of contact becomes a value near the appropriate pressing force Pr1. As a result, the detected pressing force quickly reaches the contact pressing force Pr2 as compared with the case where the contact pressing force Pr2 is set in advance.
Application of an excessive pressing force to the lens is calculated as a well-balanced and appropriate value that is alleviated.

  (4) The timing at which the detected pressing force obtained through the load cell 36 is settled is calculated so that the pressing force of the piston 34P is changed to the appropriate pressing force Pr1 at a suitable timing for each contact. As a result, the time required for the pressing force of the piston 34P to reach the appropriate pressing force Pr1 at the time of contact is minimized as compared with the case where the timing to be settled is set in advance. Thus, the time required for the inspection of the IC chip T held by the inspection head 22 is shortened.

(5) Even when there is no maximum pressing force detected by the load cell 36 at the previous contact as in the first contact, the piston is used at the contact by using the appropriate pressing force Pr1 as the initial value. The pressing force applied to 34P was calculated. Thereby, the contact of the IC chip T to the inspection socket 23A by the inspection head 22 is performed including the case of the first contact.

  (6) The load cell 36 is provided between the tip of the piston 34P and the grip 35. Thereby, the installation of the pressure detection device on the inspection head 22 is facilitated, and the realization of such an inspection head 22 is facilitated.

  (7) Since the load cell 36 is adopted as the pressure detection device, the structure of the pressure detection device does not include a mechanical movable part requiring maintenance, and the reliability of the inspection head 22 is improved.

In addition, the said embodiment can also be implemented in the following aspects, for example.
In the above-described embodiment, when the detected pressing force is settled, a period in which the magnitude of the difference between the detected pressing force and the pressure command value (contact pressing force) is smaller than the static determination threshold is a predetermined period. Judged by the passage of time. However, the present invention is not limited to this, and a method for determining that the detected pressing force has been settled from the value of the detected pressing force is as long as a suitable timing for changing the pressure command value to the appropriate pressing force is calculated. Other known calculation methods and data processing methods may be used. Thereby, the freedom degree of the mode of a static determination is raised.

  In addition, in the above embodiment, the time point when the detected pressing force is determined to be settled is a time point delayed by a predetermined period from the time when the detected pressing force is actually stabilized, but from the descending end detection sensor 34D. A period obtained by subtracting a predetermined period from the time point when the “ON” signal is input until it is determined to be settled may be obtained as the shortest stabilization period. In this case, by using the shortest establishment period as a time point at which the detected pressing force is stabilized in the next contact step, it is possible to shorten the time required for the stabilization determination.

  In the above embodiment, the pressure fluctuation detection step (step S13) and the pressure stabilization detection step (step S14) are performed each time in the contact step, but not limited to this, as shown in FIG. The fluctuation detection step and the pressure stabilization detection step may be omitted. That is, once a suitable abutting pressing force is calculated, calculation of the abutting pressure in the low pressure pressing step (step S22) may be omitted using the abutting pressing force thereafter. Moreover, once a suitable shortest settling period is calculated, after that, the start of the test pressing step (step S23) may be determined using the shortest settling period. As a result, the time required for the contact step can be shortened.

  -Even in such a case, if the pressure fluctuation detection step and the static pressure detection step are performed every predetermined period, it is possible to flexibly cope with various pressure fluctuations that occur in the electronic device pressing device due to changes over time. It will be able to respond.

  In the above embodiment, the ascending end or descending end of the piston 34P is detected by the ascending end detection sensor 34U or the descending end detection sensor 34D being brought close to the permanent magnet provided at the base end portion of the piston 34P. did. However, the present invention is not limited to this, and a limit switch, an optical sensor, or the like may be used as another detection device as long as it is detected that the piston is positioned at the rising end or the lowering end.

In the above-described embodiment, the piston 34P of the pneumatic cylinder is raised by the bias of the spring. However, the present invention is not limited to this. For example, the piston 34P may be raised by air pressure.
In the above embodiment, the load cell 36 is adopted as the pressure detection device. However, as the pressure detection device, any other device can be used as long as it can detect the pressing force applied to the electronic component (IC chip) at the time of contact. You may make it employ | adopt the strain gauge etc. as a pressure detection apparatus. Thereby, the freedom degree of selection of a pressure detection apparatus is raised, and the implementation | achievement of such a pressing device of an electronic component is made easy.

  In the above embodiment, the load cell 36 as a pressure detection device is provided between the tip of the piston 34P and the grip portion 35. However, the installation position of the pressure detection device is applied to the electronic component at the time of contact. As long as the pressing force is detected, it may be provided between the grip portion and the electronic component as another place. Thereby, the freedom degree of selection of the installation position of a pressure detection apparatus is raised, and the implementation | achievement of such a pressing device of an electronic component is made easy.

  In the above embodiment, the appropriate pressing force Pr1 is applied as the initial value of the maximum pressing force in the first contact step. However, the present invention is not limited to this, and an empirical value or an experimental value may be used as the initial value of the maximum pressing force. As a result, even when there is no maximum value detected by the pressure detection device at the previous contact, as in the first contact, use a constant value based on an empirical value or an experimental value as the initial value. Thus, the pressing force applied to the piston at the time of contact is calculated. As a result, excessive pressure in the first contact process is also reduced, and the contact of the electronic component to the inspection socket by the electronic component pressing device is as in the first contact. It is also possible to carry out more appropriately including cases.

The top view which shows one Embodiment about the whole structure of the IC handler which has a pressing device of the electronic component concerning this invention. The side view which shows schematic structure of the side surface of the test | inspection head which has a pressing device of the electronic component concerning this invention. The elements on larger scale which show the side structure about a part of press apparatus of the electronic component of the embodiment. It is a state figure which shows the aspect of arrangement | positioning to the test | inspection socket of the electronic component by the electronic device pressing apparatus of the embodiment, Comprising: (a) is a figure which shows the state before contact | abutting, (b) is the time of contact start The figure which shows the state of (c), The figure which shows the state by which the probe for a test | inspection was pushed down. The block diagram which shows the electrical structure of the pressing device of the electronic component of the embodiment. The flowchart which shows an example of the conveyance process of the electronic component by the electronic device pressing apparatus of the embodiment. The timing chart which shows the change of the pressing force in the contact operation | movement by the press device of the electronic component of the embodiment. The flowchart which shows an example of the conveyance process of the electronic component by the pressing device of the electronic component concerning other embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... IC handler, 11 ... Base, 12 ... Safety cover, 13 ... High temperature chamber, 14 ... Supply robot, 15 ... Recovery robot, 16 ... First shuttle, 16A ... Base member, 17 ... Second shuttle, 17A ... Base member , 18 ... tray, 20 ... supply side robot hand unit, 21 ... collection side robot hand unit, 22 ... inspection head, 23 ... inspection part, 23A ... inspection socket, 23Ac ... connector part, 23b ... bottom part, 23P ... inspection 24A ... first rail, 24B ... second rail, 25 ... change kit, 26 ... pocket, 27 ... change kit, 31 ... horizontal moving part, 32 ... vertical moving part, 33 ... position adjusting device, 34 ... Pressing part, 34D ... Lower end detection sensor, 34P ... Piston, 34U ... Upward end detection sensor, 35 ... Holding part, 35a ... Upper part 35b ... lower surface, 36 ... load cell, 50 ... control device, 51 ... I / O device, B ... external terminal, C1-C6 ... conveyor, FX ... X-axis frame, FY1 ... first Y-axis frame, FY2 ... second Y axis frame, MY ... Y axis motor, MZ ... Z axis motor, T ... IC chip.

Claims (6)

The electronic component held by the holding portion provided at the lower portion of the piston whose pressing force can be changed is opposed to the inspection socket, and the piston is moved downward in this state to connect the external terminal of the electronic component to the inspection socket. An electronic component pressing device that controls the pressing force of the piston to an appropriate pressing force suitable for inspection of electrical characteristics while being brought into contact with an inspection probe provided in
A pressure detection device provided between the piston and the electronic component to detect pressure generated between the piston and the electronic component, and the external terminal of the electronic component and the inspection probe each time The maximum value of the detected value detected by the pressure detection device at the time of contact is acquired, and at the time of contact between the external terminal of the electronic component and the inspection probe, the value of the appropriate pressing force is calculated from the acquired maximum value. Each time the piston is moved downward by the pressing force subtracted from the pressing force applied at the time of previous contact, the subtracted value, and the detected value obtained through the pressure detecting device is settled at the timing. A pressing device for an electronic component, wherein the pressing force is changed to the appropriate pressing force. The value of the appropriate pressing force is used as an initial value corresponding to the maximum value of the detection value acquired through the pressure detection device only at the first contact between the external terminal of the electronic component and the inspection probe. The electronic device pressing apparatus according to claim 1. Only at the first contact between the external terminal of the electronic component and the inspection probe, a constant value obtained empirically as an initial value corresponding to the maximum value of the detection value acquired through the pressure detection device is used. The electronic device pressing device according to claim 1. The said pressure detection apparatus is a pressing device of the electronic component as described in any one of Claims 1-3 provided between the said piston and the said holding part. The electronic device pressing device according to claim 1, wherein the pressure detection device includes a load cell. In an IC handler having an inspection head for conveying and arranging the gripped electronic component to an inspection socket,
The electronic head pressing device according to any one of claims 1 to 5 is provided in the inspection head, and the electronic component gripped by a grip portion of the electronic device pressing device is provided in the inspection socket. An IC handler characterized by being arranged.

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