JP2010093675A5 - - Google Patents

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Publication number
JP2010093675A5
JP2010093675A5 JP2008263570A JP2008263570A JP2010093675A5 JP 2010093675 A5 JP2010093675 A5 JP 2010093675A5 JP 2008263570 A JP2008263570 A JP 2008263570A JP 2008263570 A JP2008263570 A JP 2008263570A JP 2010093675 A5 JP2010093675 A5 JP 2010093675A5
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JP
Japan
Prior art keywords
base
opening
bonding layer
substrate
vibration
Prior art date
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Granted
Application number
JP2008263570A
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English (en)
Japanese (ja)
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JP5262548B2 (ja
JP2010093675A (ja
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Publication date
Application filed filed Critical
Priority to JP2008263570A priority Critical patent/JP5262548B2/ja
Priority claimed from JP2008263570A external-priority patent/JP5262548B2/ja
Publication of JP2010093675A publication Critical patent/JP2010093675A/ja
Publication of JP2010093675A5 publication Critical patent/JP2010093675A5/ja
Application granted granted Critical
Publication of JP5262548B2 publication Critical patent/JP5262548B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008263570A 2008-10-10 2008-10-10 振動子 Expired - Fee Related JP5262548B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008263570A JP5262548B2 (ja) 2008-10-10 2008-10-10 振動子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008263570A JP5262548B2 (ja) 2008-10-10 2008-10-10 振動子

Publications (3)

Publication Number Publication Date
JP2010093675A JP2010093675A (ja) 2010-04-22
JP2010093675A5 true JP2010093675A5 (ru) 2011-11-10
JP5262548B2 JP5262548B2 (ja) 2013-08-14

Family

ID=42255943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008263570A Expired - Fee Related JP5262548B2 (ja) 2008-10-10 2008-10-10 振動子

Country Status (1)

Country Link
JP (1) JP5262548B2 (ru)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134045B2 (ja) * 2010-06-23 2013-01-30 日本電波工業株式会社 圧電デバイス及びその製造方法
WO2013128496A1 (ja) * 2012-03-02 2013-09-06 富士通株式会社 水晶振動子及びその製造方法
CN109155620B (zh) 2016-06-29 2022-05-03 株式会社大真空 压电振动器件及压电振动器件的制造方法
JP2018019417A (ja) * 2017-09-25 2018-02-01 株式会社大真空 圧電振動デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0865093A (ja) * 1994-08-26 1996-03-08 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2001267875A (ja) * 2000-03-22 2001-09-28 Seiko Epson Corp 水晶振動子及びその製造方法
JP4576693B2 (ja) * 2000-10-04 2010-11-10 エプソントヨコム株式会社 圧電振動子
JP2004208236A (ja) * 2002-12-26 2004-07-22 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器

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