JP2010092981A - Solar battery, backside contact solar battery, wiring substrate, and method of manufacturing solar battery - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solar battery, a backside contact solar battery, a wiring substrate, and a method of manufacturing a solar battery, which are capable of easily positioning the backside contact solar battery and efficiently suppressing a displacement of the backside contact solar battery. <P>SOLUTION: In the solar battery, a backside contact solar battery, a wiring substrate, and a method of manufacturing a solar battery, a first conductivity type electrode of the backside contact solar battery is connected to a first conductivity type wiring of the wiring substrate; a second conductivity type electrode of the backside contact solar battery is connected to a second conductivity type wiring of the wiring substrate; at least one of the backside contact solar battery and the wiring substrate has a positioning part for deciding a relative position relation of the backside contact solar battery to the wiring substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a solar cell, a back electrode type solar cell, a wiring board, and a method for manufacturing a solar cell. In particular, the back electrode type solar cell can be easily aligned and the back electrode type solar cell can be misaligned. It is related with the manufacturing method of the solar cell which can suppress effectively, a back-electrode-type solar cell, a wiring board, and a solar cell.

  In recent years, especially from the viewpoint of protecting the global environment, solar cells that convert solar energy into electrical energy have been rapidly expected as next-generation energy sources. There are various types of solar cells, such as those using compound semiconductors and those using organic materials. Currently, solar cells using silicon crystals are the mainstream. And most solar cells currently manufactured and sold have an n-electrode on the surface on which sunlight is incident (light-receiving surface), and a p-electrode on the surface opposite to the light-receiving surface (back surface). Is formed. The n-electrode formed on the light-receiving surface of such a solar cell is indispensable for taking out the current generated by the incidence of sunlight to the outside, but no sunlight enters the portion below the n-electrode. Therefore, no current is generated in that portion. Therefore, there is a problem that the characteristics of the solar cell are deteriorated when the area of the n-electrode is increased.

Thus, for example, Patent Document 1 discloses a back electrode type solar cell in which an electrode is not formed on the light receiving surface of the solar cell, and an n electrode and a p electrode are formed only on the back surface of the solar cell.
JP 2005-310830 A

  Since the electric energy that can be used with a single back electrode type solar cell having the configuration disclosed in Patent Document 1 is limited, a plurality of back electrode type solar cells having the above configuration are electrically connected to produce a solar cell. To be considered.

  Here, as a method of manufacturing a solar cell by electrically connecting a plurality of back electrode type solar cells, for example, as shown in the schematic cross-sectional view of FIG. A method of installing on the substrate 100 is considered.

  In this method, as shown in FIG. 51A, the first conductivity type electrode 6 in contact with the first conductivity type impurity diffusion region 2 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 80 is insulated from the wiring substrate 100. The second conductivity type electrode 7 is disposed on the first conductivity type wiring 13 formed on the conductive substrate 11 and is in contact with the second conductivity type impurity diffusion region 3 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 80. Is installed on the second conductive type wiring 12 formed on the insulating substrate 11 of the wiring substrate 100 to join the back electrode type solar cell 80 and the wiring substrate 100 with the insulating adhesive 341 and thereby the solar cell. It is a method of producing.

  A texture structure is formed on the light receiving surface of the semiconductor substrate 1 of the back electrode type solar cell 80, and the antireflection film 5 is formed on the texture structure. A passivation film 4 is formed on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 80.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 51 (b), after joining the back electrode type solar cell 80 and the wiring substrate 100 with an insulating adhesive 341, a glass substrate 342 provided with ethylene vinyl acetate 343; The solar cell, which is a joined body of the back electrode type solar cell 80 and the wiring substrate 100, is sandwiched between the back film 345 having the ethylene vinyl acetate 344, and the solar cell is sealed in the ethylene vinyl acetate. The

  As another example of the above method, as shown in the schematic cross-sectional view of FIG. 52 (a), the back electrode type solar cell 80 and the wiring substrate 100 are joined together with a conductive adhesive 351 to form a solar cell. There is also a production method. In this method, the connection between the first conductivity type electrode 6 of the back electrode type solar cell 80 and the first conductivity type wiring 13 of the wiring substrate 100, and the second conductivity type electrode 7 of the back electrode type solar cell 80. The back electrode type solar cell 80 and the wiring substrate 100 are bonded to each other by connecting the second conductive type wiring 12 of the wiring substrate 100 to the second conductive type wiring 12 using the conductive adhesive 351, thereby producing a solar cell.

  Thereafter, in the same manner as described above, as shown in the schematic cross-sectional view of FIG. 52 (b), between the glass substrate 342 provided with ethylene vinyl acetate 343 and the back film 345 provided with ethylene vinyl acetate 344. The solar cell, which is a joined body of the back electrode type solar cell 80 and the wiring substrate 100, is sandwiched, and the solar cell is sealed in ethylene vinyl acetate.

  As still another example of the above method, as shown in the schematic cross-sectional view of FIG. 53 (a), the back electrode type solar cell 80 and the wiring substrate 100 are connected with a conductive adhesive 351 and an insulating adhesive 341. There is also a method for producing a solar cell by joining both of them. In this method, the connection between the first conductivity type electrode 6 of the back electrode type solar cell 80 and the first conductivity type wiring 13 of the wiring substrate 100, and the second conductivity type electrode 7 of the back electrode type solar cell 80. And the second conductive type wiring 12 of the wiring substrate 100 are respectively connected using the conductive adhesive 351, and the insulating film 341 is used for the other portions, so that the back electrode type solar cell 80 and A solar cell is manufactured by bonding to the wiring substrate 100.

  Thereafter, in the same manner as described above, as shown in the schematic cross-sectional view of FIG. 53 (b), between the glass substrate 342 provided with ethylene vinyl acetate 343 and the back film 345 provided with ethylene vinyl acetate 344. The solar cell, which is a joined body of the back electrode type solar cell 80 and the wiring substrate 100, is sandwiched, and the solar cell is sealed in ethylene vinyl acetate.

  In any of the above methods, the insulating adhesive 341 and the conductive adhesive 351 are each applied by a method such as screen printing, dispenser application, or inkjet application. Here, the insulating adhesive 341 is provided between the electrodes of the back electrode type solar cell 80 (the first conductivity type electrode 6 and the second conductivity type electrode 7) and on the wiring substrate 100 (the first conductivity type wiring 13). The conductive adhesive 351 is applied to a portion where the electrode of the back electrode type solar cell 80 and the wiring of the wiring substrate 100 are connected.

  In any of the above methods, the insulating adhesive 341 and the conductive adhesive 351 are cured by a treatment such as ultraviolet irradiation or heating. Here, in the case where the insulating adhesive 341 and the conductive adhesive 351 are cured using ultraviolet irradiation, the solar cell is cured before being sealed in ethylene vinyl acetate. In addition, in the case where the insulating adhesive 341 and the conductive adhesive 351 are cured by heating, the solar cell is cured before or simultaneously with sealing in the ethylene vinyl acetate.

  According to the method for manufacturing a solar cell as described above, a solar cell is manufactured by electrically connecting a plurality of back electrode type solar cells 80 only by installing the back electrode type solar cell 80 on the wiring substrate 100. be able to.

  However, in any of the above methods, when the interelectrode pitch of the back electrode type solar cell 80 (distance between the first conductivity type electrode 6 and the second conductivity type electrode 7) is very narrow. There is a problem that considerable accuracy is required for alignment of the back electrode type solar cell 80.

  In addition, even when the electrodes of the back electrode solar cell 80 are installed on the wiring of the wiring substrate 100, there is a problem that the back electrode solar cell 80 is likely to be misaligned.

  Furthermore, even when the back electrode type solar cell 80 and the wiring substrate 100 can be bonded to each other without producing a positional deviation and a solar cell can be manufactured, heat is applied in a sealing process or the like, and the wiring substrate 100 is insulated. There is also a problem that the displacement of the back electrode type solar cell 80 is caused by expansion or contraction of a member such as the conductive substrate 11.

  In view of the above circumstances, an object of the present invention is to provide a solar cell and a back surface that can easily align the back electrode type solar cell and can effectively suppress positional deviation of the back electrode type solar cell. It is providing the manufacturing method of an electrode type solar cell, a wiring board, and a solar cell.

  The present invention includes a back electrode type solar cell and a wiring substrate. The back electrode type solar cell includes a semiconductor substrate, a first conductivity type impurity diffusion region and a second conductivity type impurity formed on the back side of the semiconductor substrate. A diffusion region; a first conductivity type electrode provided corresponding to the first conductivity type impurity diffusion region; and a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region; The wiring board has an insulating substrate, a first conductive type wiring and a second conductive type wiring installed on the insulating substrate, and the first conductive type electrode of the back electrode type solar cell is wired. Connected to the first conductive type wiring of the substrate, the second conductive type electrode of the back electrode type solar cell is connected to the second conductive type wiring of the wiring substrate, and at least of the back electrode type solar cell and the wiring substrate On the other hand, the relative position of the back electrode type solar cell with respect to the wiring board A solar cell having a positioning portion for determining.

  Here, in the solar cell of the present invention, the positioning portion is at least one of a concave portion formed on the surface of the first conductive type wiring of the wiring substrate and a concave portion formed on the surface of the second conductive type wiring of the wiring substrate. It can be.

  In the solar cell of the present invention, the positioning portion includes at least a convex portion installed on the surface of the first conductive type wiring of the wiring substrate and a convex portion installed on the surface of the second conductive type wiring of the wiring substrate. One can be.

  Further, in the solar cell of the present invention, the positioning portion is divided into a plurality of first conductivity type separation wires formed by separating the first conductivity type wires of the wiring substrate and a plurality of second conductivity type wires of the wiring substrate. Thus, at least one of the separated wirings for the second conductivity type can be obtained.

  Further, in the solar cell of the present invention, the positioning portion is formed by a recess on the surface of the first conductivity type wiring and a recess on the surface of the second conductivity type wiring provided in the recess on the surface of the insulating substrate of the wiring substrate. It can be at least one.

  Moreover, the solar cell of this invention WHEREIN: A positioning part can be made into the convex part which is installed in the surface of the insulating board | substrate of a wiring board, and protrudes in the back electrode type solar cell side. Here, at least one of a part of the surface of the first conductivity type wiring and a part of the surface of the second conductivity type wiring may be covered with a convex portion.

  Moreover, the solar cell of this invention WHEREIN: A positioning part can be made into the convex part which is installed in the back surface side of the semiconductor substrate of a back electrode type solar cell, and protrudes in the wiring board side.

  In the solar cell of the present invention, the positioning portion is formed on the concave portion formed on the surface of the first conductivity type electrode of the back electrode type solar cell and on the surface of the second conductivity type electrode of the back electrode type solar cell. It may be at least one of the concave portions.

  Further, in the solar cell of the present invention, the positioning portion includes a first conductivity type separation electrode in which the first conductivity type electrode of the back electrode type solar cell is separated into a plurality and a second conductivity type of the back electrode type solar cell. It can be set as at least one of the 2nd conductivity type separation electrodes formed by separating the electrodes for use into a plurality.

  Moreover, the solar cell of this invention WHEREIN: A positioning part can be made into the recessed part of the back surface of a back electrode type solar cell.

  Further, in the solar cell of the present invention, the positioning portion is disposed on the back surface side of the semiconductor substrate of the back electrode type solar cell and protrudes toward the wiring substrate side, and is disposed on the surface of the insulating substrate of the wiring substrate. It can be set as the convex part which protrudes in the electrode type solar cell side.

  Further, in the solar cell of the present invention, the positioning portion can be a convex portion that is installed on the surface of the insulating substrate of the wiring board and protrudes toward the back electrode type solar cell, and the back electrode is between the convex portions. A semiconductor substrate of a type solar cell may be fitted.

  Further, in the solar cell of the present invention, the positioning portion is disposed on the back surface side of the semiconductor substrate of the back electrode type solar cell and protrudes toward the wiring substrate side, and is disposed on the surface of the insulating substrate of the wiring substrate. It can be a convex part protruding to the electrode type solar cell side, a convex part installed on the back side of the semiconductor substrate of the back electrode type solar cell, and a convex part installed on the surface of the insulating substrate of the wiring board, However, it may carry at least one of magnetism and static electricity.

  Further, the present invention is provided corresponding to the semiconductor substrate, the first conductivity type impurity diffusion region and the second conductivity type impurity diffusion region formed on the back surface side of the semiconductor substrate, and the first conductivity type impurity diffusion region. A back electrode type solar cell having a first conductivity type electrode and a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region, wherein the wiring is connected to the back electrode type solar cell. It is a back electrode type solar cell which has a positioning part for determining the relative positional relationship with respect to a board | substrate.

  In addition, the present invention is a wiring board for connecting to a back electrode type solar cell, and includes an insulating substrate, a first conductive type wiring and a second conductive type wiring installed on the insulating substrate. The wiring board has a positioning portion for determining a relative positional relationship with respect to the back electrode type solar cell connected to the wiring board.

  Furthermore, the present invention includes a step of connecting the back electrode type solar cell to a wiring substrate, the back electrode type solar cell comprising a semiconductor substrate, a first conductivity type impurity diffusion region formed on the back side of the semiconductor substrate, and a first electrode. A second conductivity type impurity diffusion region; a first conductivity type electrode provided corresponding to the first conductivity type impurity diffusion region; and a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region. The wiring board has an insulating substrate, a first conductive type wiring and a second conductive type wiring installed on the insulating substrate, and the back electrode type solar cell and the wiring substrate At least one has a positioning part for determining the relative positional relationship of the back electrode type solar cell with respect to the wiring substrate, and in the connecting step, the positioning unit sets the positional relationship between the back electrode type solar cell and the wiring substrate. Decide, back electrode type solar power The first conductivity type electrode is connected to the first conductivity type wiring of the wiring substrate, and the second conductivity type electrode of the back electrode type solar cell is connected to the second conductivity type wiring of the wiring substrate. It is a manufacturing method.

  Here, the manufacturing method of the solar cell of the present invention includes a step of forming the first conductivity type electrode of the back electrode type solar cell and a step of forming the second conductivity type electrode of the back electrode type solar cell. It is preferable that the positioning portion is formed in the same step or a continuous step as at least one of the step of forming the first conductivity type electrode and the step of forming the second conductivity type electrode.

  Moreover, the manufacturing method of the solar cell of this invention includes the process of forming the wiring for 1st conductivity types of a wiring board, and the process of forming the wiring for 2nd conductivity types of a wiring board, The wiring for 1st conductivity types It is preferable to form the positioning portion in the same step as or a continuous step with at least one of the step of forming the second conductive type wiring and the step of forming the second conductivity type wiring.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to perform alignment of a back electrode type solar cell easily, the solar cell which can suppress effectively the position shift of a back electrode type solar cell, a back electrode type solar cell, a wiring board In addition, a method for manufacturing a solar cell can be provided.

  Embodiments of the present invention will be described below. In the drawings of the present invention, the same reference numerals represent the same or corresponding parts.

<Embodiment 1>
In FIG. 1, typical sectional drawing of an example of the solar cell of this invention is shown. The solar cell having the configuration shown in FIG. 1 includes a back electrode type solar cell 8 and a wiring substrate 10, and the back electrode type solar cell 8 is installed on the wiring substrate 10.

  The back electrode type solar cell 8 includes a semiconductor substrate 1, a first conductivity type impurity diffusion region 2 and a second conductivity type impurity diffusion region 3 formed on the back surface of the semiconductor substrate 1, and a first conductivity type impurity diffusion region 2. A first conductivity type electrode 6 formed so as to be in contact with each other and a second conductivity type electrode 7 formed so as to be in contact with the second conductivity type impurity diffusion region 3 are included.

  In this example, the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are each formed in a strip shape extending to the front side and / or the back side of the paper surface of FIG. The diffusion regions 2 and the second conductivity type impurity diffusion regions 3 are alternately arranged at predetermined intervals on the back surface of the semiconductor substrate 1.

  Further, an uneven structure such as a texture structure is formed on the light receiving surface of the semiconductor substrate 1 of the back electrode type solar cell 8, and an antireflection film 5 is formed so as to cover the uneven structure. A passivation film 4 is formed on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8.

  Further, in this example, the first conductivity type electrode 6 and the second conductivity type electrode 7 are also formed in strips extending to the front side and / or the back side of the paper surface of FIG. The electrode 6 and the second conductivity type electrode 7 pass through the opening provided in the passivation film 4 along the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 on the back surface of the semiconductor substrate 1, respectively. The first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are formed in contact with each other.

  On the other hand, the wiring substrate 10 includes an insulating substrate 11, and a first conductivity type wiring 13 and a second conductivity type wiring 12 formed in a predetermined shape on the surface of the insulating substrate 11.

  In this example, the first conductive type wiring 13 and the second conductive type wiring 12 are also formed in a strip shape extending to the front side and / or the back side of the paper surface of FIG. Each of the surface and the surface of the second conductivity type wiring 12 is formed with a concave portion which is a concave portion. Therefore, the recesses on the surface of the first conductivity type wiring 13 and the recesses on the surface of the second conductivity type wiring 12 are also formed in strips extending to the back side of the paper surface of FIG.

  The first conductivity type electrode 6 of the back electrode type solar cell 8 is disposed so as to be accommodated in the recess of the concave portion on the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductivity type electrode 7 of the battery 8 is disposed so as to be accommodated in the recess of the recess on the surface of the second conductivity type wiring 12 of the wiring substrate 10.

  As a result, the first conductivity type electrode 6 of the back electrode type solar cell 8 is in contact with and electrically connected to the first conductivity type wire 13 of the wiring substrate 10, and the second conductivity type of the back electrode type solar cell 8. The electrode 7 is in contact with and electrically connected to the second conductivity type wiring 12 of the wiring substrate 10 to constitute a solar cell.

  In the drawings of the present invention, for convenience of explanation, there are two first conductivity type impurity diffusion regions 2, second conductivity type impurity diffusion regions 3, first conductivity type wires 13, and second conductivity type wires 12. Although only shown one by one, the present invention is not limited to this configuration, and the number of the first conductivity type impurity diffusion region 2, the second conductivity type impurity diffusion region 3, the first conductivity type wiring 13, and the second conductivity type wiring 12. It goes without saying that each is not limited to two.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 1 will be described. In the following description, after the method for forming the back electrode solar cell 8 is first described, the method for forming the wiring substrate 10 is described next, and finally the back electrode solar cell 8 and the wiring substrate 10 are joined. In the present invention, the order of forming the back electrode type solar cell 8 and the wiring substrate 10 is not particularly limited.

  First, as shown in the schematic cross-sectional view of FIG. 2A, a semiconductor substrate 1 in which slice damage 1a is formed on the surface of the semiconductor substrate 1 is prepared by, for example, slicing from an ingot.

  Here, the semiconductor substrate 1 can be used without particular limitation as long as it is a substrate made of a semiconductor material. For example, a silicon substrate made of polycrystalline silicon or single crystal silicon can be used. Further, the semiconductor substrate 1 may have either n-type or p-type conductivity, and the semiconductor substrate 1 may not have any n-type or p-type conductivity.

  Next, as shown in the schematic cross-sectional view of FIG. 2B, the slice damage 1a on the surface of the semiconductor substrate 1 is removed. Here, the removal of the slice damage 1a is performed, for example, when the semiconductor substrate 1 is made of the above silicon substrate, the surface of the silicon substrate after the above slice is mixed with an aqueous solution of hydrogen fluoride and nitric acid, sodium hydroxide, or the like. It can be performed by etching with an alkaline aqueous solution or the like.

  Here, the size and shape of the semiconductor substrate 1 after removal of the slice damage 1a are not particularly limited, but the thickness of the semiconductor substrate 1 can be set to, for example, 50 μm or more and 400 μm or less, and particularly preferably about 160 μm. .

  Next, as shown in the schematic cross-sectional view of FIG. 2C, the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are formed on the back surface of the semiconductor substrate 1, respectively. Here, the first conductivity type impurity diffusion region 2 can be formed, for example, by a method such as vapor phase diffusion using a gas containing the first conductivity type impurity, and the second conductivity type impurity diffusion region 3 is, for example, Further, it can be formed by a method such as vapor phase diffusion using a gas containing a second conductivity type impurity.

  Here, the first conductivity type impurity diffusion region 2 is not particularly limited as long as it includes the first conductivity type impurity and exhibits n-type or p-type conductivity. As the first conductivity type impurity, for example, an n-type impurity such as phosphorus can be used when the first conductivity type is n-type, and when the first conductivity type is p-type, for example, boron or A p-type impurity such as aluminum can be used.

  The second conductivity type impurity diffusion region 3 is not particularly limited as long as it contains the second conductivity type impurity and has a conductivity type opposite to that of the first conductivity type impurity diffusion region 2. As the second conductivity type impurity, for example, an n-type impurity such as phosphorus can be used when the second conductivity type is n-type, and when the second conductivity type is p-type, for example, boron or A p-type impurity such as aluminum can be used.

  The first conductivity type may be either n-type or p-type, and the second conductivity type may be any conductivity type opposite to the first conductivity type. That is, when the first conductivity type is n-type, the second conductivity type is p-type, and when the first conductivity type is p-type, the second conductivity type is n-type.

As the gas containing the first conductivity type impurity, when the first conductivity type is n-type, for example, a gas containing an n-type impurity such as phosphorus such as POCl ₃ can be used. When the type is p-type, for example, a gas containing p-type impurities such as boron such as BBr ₃ can be used.

Further, as the gas containing the second conductivity type impurity, when the second conductivity type is n-type, for example, a gas containing an n-type impurity such as phosphorus such as POCl ₃ can be used. When the type is p-type, for example, a gas containing p-type impurities such as boron such as BBr ₃ can be used.

  Next, as shown in the schematic cross-sectional view of FIG. 2D, a passivation film 4 is formed on the back surface of the semiconductor substrate 1. Here, the passivation film 4 can be formed by a method such as a thermal oxidation method or a plasma CVD (Chemical Vapor Deposition) method.

  Here, as the passivation film 4, for example, a silicon oxide film, a silicon nitride film, or a stacked body of a silicon oxide film and a silicon nitride film can be used, but is not limited thereto.

  The thickness of the passivation film 4 can be set to, for example, 0.05 μm or more and 1 μm or less, and particularly preferably about 0.2 μm.

  Next, as shown in the schematic cross-sectional view of FIG. 2E, after forming an uneven structure such as a texture structure on the entire light receiving surface of the semiconductor substrate 1, an antireflection film 5 is formed on the uneven structure. .

  Here, the texture structure can be formed, for example, by etching the light receiving surface of the semiconductor substrate 1. For example, when the semiconductor substrate 1 is a silicon substrate, the semiconductor is used by using an etching solution in which a solution obtained by adding isopropyl alcohol to an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide is heated to 70 ° C. or higher and 80 ° C. or lower, for example. It can be formed by etching the light receiving surface of the substrate 1.

  The antireflection film 5 can be formed by, for example, a plasma CVD method. As the antireflection film 5, for example, a silicon nitride film or the like can be used, but is not limited thereto.

  Next, as shown in the schematic cross-sectional view of FIG. 2F, a part of the passivation film 4 on the back surface of the semiconductor substrate 1 is removed to form a contact hole 4a and a contact hole 4b. Here, the contact hole 4 a is formed so as to expose at least part of the surface of the first conductivity type impurity diffusion region 2, and the contact hole 4 b is at least part of the surface of the second conductivity type impurity diffusion region 3. It is formed so as to be exposed.

  The contact hole 4a and the contact hole 4b are formed after a resist pattern having openings at portions corresponding to the formation positions of the contact hole 4a and the contact hole 4b is formed on the passivation film 4 by using, for example, photolithography technology. The method of removing the passivation film 4 from the opening of the pattern by etching or the like, or etching the passivation film 4 by applying an etching paste to the portion of the passivation film 4 corresponding to the location where the contact hole 4a and the contact hole 4b are formed and then heating. Then, it can be formed by a removal method or the like.

  Next, as shown in the schematic cross-sectional view of FIG. 2G, the first conductivity type electrode 6 in contact with the first conductivity type impurity diffusion region 2 through the contact hole 4a and the second conductivity type impurity through the contact hole 4b. A second conductivity type electrode 7 in contact with the diffusion region 3 is formed, and a back electrode type solar cell 8 is produced.

  Here, as the first conductivity type electrode 6 and the second conductivity type electrode 7, for example, an electrode made of a metal such as silver can be used, but is not limited thereto.

  The height of each of the first conductivity type electrode 6 and the second conductivity type electrode 7 can be, for example, not less than 5 μm and not more than 50 μm, particularly preferably about 15 μm.

  In FIG. 3, the typical top view of an example of the back surface of the back electrode type solar cell 8 produced as mentioned above is shown. Here, on the back surface of the back electrode type solar cell 8, the first conductivity type electrode 6 and the second conductivity type electrode 7 are each formed in a strip shape. Each of the plurality of strip-shaped first conductivity type electrodes 6 is connected to one strip-shaped first conductivity type collector electrode 60, and each of the plurality of strip-shaped second conductivity type electrodes 7 is formed of one strip-shaped electrode. To the second conductivity type collector electrode 70. In this example, the first conductivity type collector electrode 60 is formed to extend in a direction perpendicular to the first conductivity type electrode 6, and the second conductivity type collector electrode 70 is It is formed to extend in a direction perpendicular to the second conductivity type electrode 7.

  Therefore, on the back surface of the back electrode type solar cell 8 having the configuration shown in FIG. 3, one comb-shaped electrode is formed by one first conductivity type collector electrode 60 and a plurality of first conductivity type electrodes 6. One comb-shaped electrode is formed by one second-conductivity-type collecting electrode 70 and a plurality of second-conductivity-type electrodes 7. The first conductivity type electrode 6 and the second conductivity type electrode 7 corresponding to the comb teeth of the comb-shaped electrode are arranged so as to face each other and mesh the comb teeth one by one. Then, the first conductive impurity diffusion region 2 in the form of a band is disposed on the back surface portion of the semiconductor substrate 1 in contact with the first conductive electrode 6 in the form of a band, and the semiconductor substrate 1 in contact with the second conductive type electrode 7 in the form of a band. A belt-like second conductivity type impurity diffusion region 3 is disposed on the back surface portion of the substrate.

  The electrodes on the back surface of the back electrode type solar cell 8 (first conductivity type electrode 6, second conductivity type electrode 7, first conductivity type current collecting electrode 60, second conductivity type current collection electrode 70) and Needless to say, the shape, arrangement, and number of the impurity diffusion regions (the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3) are not limited to the above shapes.

  Moreover, the wiring board 10 can be manufactured as follows, for example. First, as shown in the schematic cross-sectional view of FIG. 4A, the conductive layer 19 is formed on the surface of the insulating substrate 11. Here, as the insulating substrate 11, for example, a substrate made of a resin such as polyester, polyethylene naphthalate, or polyimide can be used, but is not limited thereto. The thickness of the insulating substrate 11 can be, for example, 10 μm or more and 200 μm or less, and particularly preferably about 25 μm.

  In addition, as the conductive layer 19, for example, a layer made of a metal such as copper can be used, but is not limited thereto.

  Next, as shown in the schematic cross-sectional view of FIG. 4B, a resist pattern 15 a is formed on the conductive layer 19 on the surface of the insulating substrate 11. Here, the resist pattern 15a is formed in a shape having an opening at a place other than the place where the first conductive type wiring 13 and the second conductive type wiring 12 are formed. As the resist constituting the resist pattern 15a, for example, a conventionally known resist can be used, and it is applied by a method such as screen printing, dispenser application or ink jet application.

  Next, as shown in the schematic cross-sectional view of FIG. 4C, the conductive layer 19 is patterned by removing the conductive layer 19 exposed from the resist pattern 15a in the direction of the arrow 16a. First conductive type wiring 13 and second conductive type wiring 12 are formed.

  Here, as the first conductive type wiring 13 and the second conductive type wiring 12, a material made of a metal such as copper can be used as in the conductive layer 19. The conductive layer 19 can be removed by, for example, wet etching using an acid or alkali solution. The height of each of the first conductivity type wiring 13 and the second conductivity type wiring 12 can be, for example, not less than 10 μm and not more than 100 μm, and preferably about 35 μm.

  Next, as shown in the schematic cross-sectional view of FIG. 4D, the resist pattern 15 a is all removed from the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12.

  Next, as shown in the schematic cross-sectional view of FIG. 4E, the resist pattern 15b is exposed so that a part of the surface of the first conductive type wiring 13 and the surface of the second conductive type wiring 12 are exposed. Form. Since the description regarding the resist pattern 15b is the same as the description regarding the resist pattern 15a, it is omitted here.

  Next, as shown in the schematic cross-sectional view of FIG. 4F, a part of the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 exposed from the resist pattern 15b. Each part is removed in the direction of arrow 16b. Thereby, recesses are formed on the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 respectively. The description regarding the removal of a part of the surface of the first conductivity type wiring 13 and the part of the surface of the second conductivity type wiring 12 is the same as the description regarding the removal of the conductive layer 19, and is omitted here.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 4G, all of the resist pattern 15b is removed from the surface of the insulating substrate 11, the surface of the first conductive type wiring 13, and the surface of the second conductive type wiring 12. By doing so, the wiring board 10 is produced.

  FIG. 5 shows a schematic plan view of an example of the surface of the wiring board 10 manufactured as described above. Here, on the surface of the insulating substrate 11 of the wiring board 10, the first conductive type wiring 13 and the second conductive type wiring 12 are each formed in a strip shape. In addition, a strip-shaped connection wiring 14 is formed on the surface of the insulating substrate 11 of the wiring substrate 10, and the first conductive type wiring 13 and the second conductive type wiring 12 are electrically connected by the connection wiring 14. Connected. The connection wiring 14 can be formed simultaneously with the first conductivity type wiring 13 and the second conductivity type wiring 12, for example, and is the same as the first conductivity type wiring 13 and the second conductivity type wiring 12. The material can be used.

  In addition, the shape, arrangement, and number of the wirings on the surface of the wiring board 10 (the first conductive type wiring 13, the second conductive type wiring 12, and the connecting wiring 14) are not limited to the above.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 6, the first conductivity type electrode 6 of the back electrode type solar cell 8 manufactured as described above is formed on the surface of the first conductivity type wiring 13 of the wiring substrate 10. The configuration shown in FIG. 1 is provided by being installed so as to fit in the recess of the recess and so that the second conductivity type electrode 7 may be installed in the recess of the recess on the surface of the second conductivity type wiring 12. An example of the solar cell of the present invention is prepared.

  In the solar cell manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 is accommodated in the recess of the concave portion on the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductivity type electrode 7 of the back electrode type solar cell 8 is installed so as to fit in the recess of the recess on the surface of the second conductivity type wiring 12 of the wiring substrate 10.

  Therefore, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is installed in the recess of the concave portion on the surface of the first conductivity type wiring 13 of the wiring substrate 10, Since the second conductivity type electrode 7 of the back electrode type solar cell 8 only needs to be installed in the recess of the surface of the second conductivity type wiring 12 of the wiring substrate 10, the alignment of the back electrode type solar cell 8 is easy. In addition, the back electrode solar cell 8 is less likely to be displaced due to the concave portions on the surfaces of the first conductive type wiring 13 and the second conductive type wiring 12.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in a subsequent sealing step or the like, Since the movement of the first conductive type electrode 6 and the second conductive type electrode 7 of the back electrode type solar cell 8 is hindered by the side wall, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the concave portion on the surface of the first conductive type wiring 13 and the concave portion on the surface of the second conductive type wiring 12 of the wiring substrate 10 are respectively formed on the wiring substrate 10 of the back electrode type solar cell 8. It becomes a positioning part for determining a relative positional relationship.

  In the above description, the concave portions are formed on both the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 of the wiring substrate 10. The recess may be formed only on one of the surfaces of the conductive type wiring 12.

  In the above description, the concave portions are formed on the surfaces of all the first conductivity type wires 13 and all the second conductivity type wires 12 of the wiring board 10. It is sufficient that a recess is formed on at least one surface of the two-conductivity type wiring 12.

  Further, the solar cell of the present invention having the above-described configuration may be sealed in a transparent resin such as ethylene vinyl acetate between a transparent substrate such as a glass substrate and a back film such as a polyester film. Needless to say, it is good.

  Further, the present invention has a configuration in which a plurality of back electrode type solar cells 8 are installed on one wiring substrate 10, a configuration in which one back electrode type solar cell 8 is installed on one wiring substrate 10, and a plurality of back surfaces. A configuration in which the electrode type solar cell 8 is installed on a plurality of wiring boards 10 is included.

<Embodiment 2>
In FIG. 7, typical sectional drawing of another example of the solar cell of this invention is shown. In the solar cell having the configuration shown in FIG. 7, the both ends of the surface of the first conductive type wiring 13 of the wiring substrate 10 protrude toward the back electrode type solar cell 8 and protrude to the back electrode type solar cell 8 side. 7 projecting toward the back electrode type solar cell 8 at both ends of the surface of the convex portion 18 and the second conductive type wiring 12 extending toward the side, and extending toward the front surface side and / or the back surface side of FIG. The point is that each of the portions 18 is a positioning portion.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 7 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 7 is manufactured in the same manner as in the first embodiment.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 7 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 8A, after forming the conductive layer 19 on the surface of the insulating substrate 11, as shown in the schematic cross-sectional view of FIG. A resist pattern 15 a is formed on the conductive layer 19 on the surface of the substrate 11.

  Next, as shown in the schematic cross-sectional view of FIG. 8C, the conductive layer 19 is patterned by removing the conductive layer 19 exposed from the resist pattern 15a in the direction of the arrow 16a. After forming the first conductivity type wiring 13 and the second conductivity type wiring 12, as shown in the schematic sectional view of FIG. 8D, the surface of the first conductivity type wiring 13 and the second conductivity type wiring The resist pattern 15a is completely removed from the surface of the wiring 12. The steps so far are the same as those in the first embodiment.

  Next, as shown in the schematic cross-sectional view of FIG. 8E, a metal containing a metal such as copper, for example, on the surface of the first conductivity type wiring 13 and on the surface of the second conductivity type wiring 12 respectively. Paste 17 is applied. Here, as the metal paste 17, for example, a paste-like material containing metal particles and an organic solvent can be used, and the metal paste 17 is applied by a method such as screen printing, dispenser application, or inkjet application, for example. be able to.

  The metal paste 17 is applied to both ends of the surface of the first conductivity type wiring 13 and both ends of the surface of the second conductivity type wiring 12. Further, the metal paste 17 is applied so as to protrude on the opposite side of the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 and to extend to the back side of the paper surface of FIG. Further, the metal paste 17 is applied to both ends of the surface of the first conductive type wiring 13 and the metal paste 17 applied to both ends of the surface of the second conductive type wiring 12 is also mutually connected. It is applied so as to face each other.

  Thereafter, by firing the metal paste 17 applied as described above, both ends of the surface of the first conductivity type wiring 13 and the second conductivity type as shown in the schematic sectional view of FIG. By forming convex portions 18 at both ends of the surface of the wiring 12 for wiring, the wiring substrate 10 is manufactured.

  Here, since the convex part 18 is comprised from the remainder which removed the organic solvent etc. from the metal paste 17, the shape of the convex part 18 can be made into the same shape as the metal paste 17. FIG. That is, in this example, the protrusion 18 protrudes on the opposite side of the surface of the first conductive type wiring 13 and the surface of the second conductive type wiring 12, and is on the front side and / or the back side of the paper surface of FIG. It is formed to extend to the side. Further, the protrusions 18 are formed at both ends of the surface of the first conductivity type wiring 13 and at both ends of the surface of the second conductivity type wiring 12, respectively.

  Thereafter, as shown in the schematic sectional view of FIG. 9, the first conductivity type electrode 6 of the back electrode type solar cell 8 produced as described above is formed on the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductive type electrodes 7 are installed so as to fit between the convex portions 18 formed at both ends, and the convex portions 18 formed at both ends of the surface of the second conductive type wiring 12 of the wiring substrate 10. The solar cell of the present invention having the configuration shown in FIG.

  In the solar cell of the present embodiment manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 is respectively provided at both ends of the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductive type electrodes 7 of the back electrode type solar cell 8 were respectively formed at both ends of the surface of the second conductive type wiring 12 of the wiring substrate 10 so as to fit between the formed convex portions 18. It is installed so as to fit between the convex portions 18.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is connected to the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductive type electrode 7 of the back electrode type solar cell 8 is formed on both ends of the surface of the second conductive type wiring 12 of the wiring substrate 10, respectively. Since it suffices to install it between the convex portions 18, the alignment of the back electrode type solar cell 8 is facilitated, and the positional deviation of the back electrode type solar cell 8 is hardly caused by the convex portion 18.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 is hindered by 18, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portion 18 on the surface of the first conductive type wiring 13 of the wiring substrate 10 and the convex portion 18 on the surface of the second conductive type wiring 12 are respectively formed on the back electrode solar cell 8. It becomes a positioning part for determining the relative positional relationship with respect to the wiring board 10.

  In the above description, the protrusions 18 are formed on both the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 of the wiring substrate 10, but the surface of the first conductivity type wiring 13 or The convex portion 18 may be formed only on one of the surfaces of the second conductivity type wiring 12.

  In the above description, the protrusions 18 are formed on the surfaces of all the first conductivity type wires 13 and all the second conductivity type wires 12 of the wiring board 10. The protrusion 18 may be formed on at least one surface of the second conductivity type wiring 12.

  In the present embodiment, since the convex portion 18 is formed from the metal paste 17, the convex portion 18 is formed of a conductive material, but the material of the convex portion 18 is not limited to the conductive material. However, when the convex part 18 is formed from an electroconductive substance, it is preferable at the point which the reliability of the electrical connection of the electrode of the back surface electrode type solar cell 8 and the wiring of the wiring board 10 improves.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 3>
In FIG. 10, typical sectional drawing of another example of the solar cell of this invention is shown. In the solar cell having the configuration shown in FIG. 10, a first conductivity type separation wiring 13 a formed by separating a plurality of first conductivity type wirings 13 at one end of the surface of the insulating substrate 11 of the wiring substrate 10, and The first conductivity type separation wiring 13b is formed, and the second conductivity type wiring 12 is separated into a plurality of parts at the other end of the surface of the insulating substrate 11 of the wiring substrate 10. An isolation wiring 12a and a second conductivity type isolation wiring 12b are formed. The first conductivity type isolation wiring 13a, the first conductivity type isolation wiring 13b, the second conductivity type isolation wiring 12a and the second conductivity type are formed. The feature is that each of the separation wirings 12b is a positioning portion.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 10 will be described. Back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 10 is manufactured in the same manner as in the first embodiment.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 10 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 11A, after forming the conductive layer 19 on the surface of the insulating substrate 11, the insulating property as shown in the schematic cross-sectional view of FIG. A resist pattern 15 a is formed on the conductive layer 19 on the surface of the substrate 11. Here, the resist pattern 15a includes the first conductivity type wiring 13, the first conductivity type separation wiring 13a, the first conductivity type separation wiring 13b, the second conductivity type wiring 12, and the second conductivity type separation wiring 12a. And it forms so that it may have an opening in locations other than the formation location of the 2nd conductivity type separation wiring 12b.

  Next, as shown in the schematic sectional view of FIG. 11C, the conductive layer 19 is patterned by removing the conductive layer 19 exposed from the resist pattern 15a in the direction of the arrow 16a. First conductivity type wiring 13, first conductivity type separation wiring 13a, first conductivity type separation wiring 13b, second conductivity type wiring 12, second conductivity type separation wiring 12a, and second conductivity type separation A wiring 12b is formed. Here, the first conductive type separation wiring 13a and the first conductive type separation wiring 13b form a pair of first conductive type wirings 13, and the second conductive type separation wiring 12a and the second conductive type separation wiring 12b. Are a pair of second conductivity type wirings 12.

  Next, as shown in the schematic cross-sectional view of FIG. 11D, the first conductive type wiring 13, the first conductive type separating wiring 13a, the first conductive type separating wiring 13b, and the second conductive type wiring. 12, the wiring substrate 10 can be produced by removing all the resist patterns 15a from the surfaces of the second conductive type separation wiring 12a and the second conductive type separation wiring 12b.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 12, the first conductivity type electrode 6 at the end of the back electrode type solar cell 8 produced as described above is the first conductivity type separation wiring of the wiring substrate 10. The second conductive type electrode 7 at the end of the back electrode type solar cell 8 is installed in the gap between the first conductive type separated wiring 13b and the second conductive type separated wiring 13b. 12a and the second conductive type separation wiring 12b. As a result, the first conductivity type electrode 6 inside the back electrode type solar cell 8 is in contact with and electrically connected to the first conductivity type wire 13 inside the wiring substrate 10, and the inside of the back electrode type solar cell 8. The second conductivity type electrode 7 is in contact with and electrically connected to the second conductivity type wiring 12 inside the wiring substrate 10 to produce an example of the solar cell of the present invention having the configuration shown in FIG.

  In the solar cell of the present embodiment manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 is connected to the first conductivity type separation wiring 13a of the wiring substrate 10 and the first conductivity type. The second conductive type electrode 7 of the back electrode type solar cell 8 is disposed so as to fit in the gap between the second conductive type separated wiring 12a and the second conductive type separated wiring 12b. It is installed to fit in the gap.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is connected to the first conductivity type separation wiring 13a of the wiring substrate 10 and the first type. The second conductive type electrode 7 of the back electrode type solar cell 8 is installed in the gap with the first conductive type separated wiring 13b, and the second conductive type separated wiring 12a and the second conductive type separated wiring 12b of the wiring substrate 10 are used. Therefore, the back electrode type solar cell 8 can be easily aligned, and the back electrode type solar cell 8 is less likely to be misaligned by these separated wirings.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, The first conductivity type electrode 6 of the back electrode solar cell 8 and the first conductivity type separation wiring 13a, the first conductivity type separation wiring 13b, the second conductivity type separation wiring 12a, and the second conductivity type separation wiring 12b Since the movement of the second conductivity type electrode 7 is hindered, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  In other words, in the present embodiment, the first conductivity type isolation wiring 13a, the first conductivity type isolation wiring 13b, the second conductivity type isolation wiring 12a, and the second conductivity type isolation wiring 12b of the wiring substrate 10 are respectively provided. The positioning portion determines the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10.

  In the above description, the first conductivity type isolation wiring 13a and the first conductivity type isolation wiring are formed by separating the first conductivity type wiring 13 at one end of the surface of the insulating substrate 11 of the wiring substrate 10. 13b, and the second conductivity type separation wiring 12a and the second conductivity type separation wiring formed by separating the second conductivity type wiring 12 from the other end of the surface of the insulating substrate 11 of the wiring substrate 10. In the present invention, at least one of the first conductivity type wiring 13 and the second conductivity type wiring 12 formed on the surface of the insulating substrate 11 of the wiring substrate 10 is separated and predetermined. The first conductivity type separation wiring and / or the second conductivity type separation wiring having a gap of 2 mm may be used.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 4>
In FIG. 13, typical sectional drawing of the other example of the solar cell of this invention is shown. In the solar cell having the configuration shown in FIG. 13, a recess is provided on the surface of the insulating substrate 11 of the wiring substrate 10, and a conductive seed layer 82 and a metal plating layer 84 are stacked in the recess on the surface of the insulating substrate 11. The first conductive type wiring 13 and the second conductive type wiring 12 made of a body are alternately provided, and the concave portion on the surface of the first conductive type wiring 13 and the concave portion on the surface of the second conductive type wiring 12 are provided. Each is characterized by a positioning part.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. 13 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 13 is manufactured in the same manner as in the first embodiment.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 13 can be manufactured as follows, for example.

  First, as shown in the schematic cross-sectional view of FIG. 14A, a depression 11 a that is a depression is formed on the surface of the insulating substrate 11 by pressing the embossing machine 81 against the surface of the insulating substrate 11. In this example, the concave portion 11a is formed in a band shape toward the back side of the paper surface of FIG. 14A, for example, but is not limited to this shape.

  Next, as shown in the schematic cross-sectional view of FIG. 14B, a conductive seed layer 82 is formed on the surface of the insulating substrate 11. Here, the conductive seed layer 82 can be formed by laminating a conductive film such as a metal on the surface of the insulating substrate 11 by, for example, a PVD (Physical Vapor Deposition) method or an electroless plating method. The material of the conductive seed layer 82 is not particularly limited as long as it is a conductive substance.

  Next, as shown in the schematic cross-sectional view of FIG. 14C, a resist pattern 83 having openings at positions corresponding to the recesses 11a on the surface of the insulating substrate 11 is formed. Note that the description of the resist pattern 83 is the same as the description of the resist pattern 15a of the first embodiment, and is omitted here.

  Next, as shown in the schematic cross-sectional view of FIG. 14D, a metal plating layer 84 is formed on the conductive seed layer 82 by plating a metal such as copper. Although the metal plating layer 84 is formed on the conductive seed layer 82 here, a conductive layer made of a conductive material may be formed on the conductive seed layer 82 instead of the metal plating layer 84.

  Next, as shown in the schematic cross-sectional view of FIG. 14E, a laminate of the conductive seed layer 82 and the metal plating layer 84 is formed on the surface of the insulating substrate 11 by removing the resist pattern 83. The wiring substrate 10 on which the first conductive type wiring 13 and the second conductive type wiring 12 made of the above are formed can be manufactured.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 15, the first conductivity type electrode 6 at the end of the back electrode type solar cell 8 produced as described above is connected to the first conductivity type wiring 13 of the wiring substrate 10. The second conductivity type electrode 7 of the back electrode type solar cell 8 is placed in the recess of the surface of the second conductivity type wiring 12 of the wiring substrate 10. Installed to fit. As a result, the first conductivity type electrode 6 inside the back electrode type solar cell 8 is in contact with and electrically connected to the first conductivity type wire 13 inside the wiring substrate 10, and the inside of the back electrode type solar cell 8. The second conductivity type electrode 7 is in contact with and electrically connected to the second conductivity type wiring 12 inside the wiring substrate 10 to produce an example of the solar cell of the present invention having the configuration shown in FIG.

  In the solar cell manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 fits in the recess of the recess of the surface of the first conductivity type wiring 13 of the wiring substrate 10. The second conductivity type electrode 7 of the back electrode type solar cell 8 is installed so as to fit in the recess of the recess on the surface of the second conductivity type wiring 12 of the wiring substrate 10.

  Therefore, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is installed in the recess of the concave portion on the surface of the first conductivity type wiring 13 of the wiring substrate 10, Since the second conductivity type electrode 7 of the back electrode type solar cell 8 only needs to be installed in the recess of the surface of the second conductivity type wiring 12 of the wiring substrate 10, the alignment of the back electrode type solar cell 8 is easy. In addition, the back electrode solar cell 8 is less likely to be misaligned by the concave portions on the surfaces of the first conductivity type wiring 13 and the second conductivity type wiring 12.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in a subsequent sealing step or the like, Since the movement of the first conductive type electrode 6 and the second conductive type electrode 7 of the back electrode type solar cell 8 is hindered by the side wall, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the concave portion on the surface of the first conductive type wiring 13 and the concave portion on the surface of the second conductive type wiring 12 of the wiring substrate 10 are respectively formed on the wiring substrate 10 of the back electrode type solar cell 8. It becomes a positioning part that determines the relative positional relationship.

  In the above description, the concave portions are formed on both the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 of the wiring substrate 10. The recess may be formed only on one of the surfaces of the conductive type wiring 12.

  In the above description, the concave portions are formed on the surfaces of all the first conductivity type wires 13 and all the second conductivity type wires 12 of the wiring board 10. It is sufficient that a recess is formed on at least one surface of the two-conductivity type wiring 12.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 5>
FIG. 16 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 16, each region between the first conductivity type wiring 13 and the second conductivity type wiring 12 of the wiring substrate 10 protrudes toward the back electrode type solar cell 8 side. There is a feature in that the insulating convex portion 101 extending toward the front surface side and / or the back surface side of the paper is a positioning portion.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 16 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 16 is manufactured in the same manner as in the first embodiment.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 16 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 17A, after forming the conductive layer 19 on the surface of the insulating substrate 11, the insulating property as shown in the schematic cross-sectional view of FIG. A resist pattern 15 a is formed on the conductive layer 19 on the surface of the substrate 11.

  Next, as shown in the schematic cross-sectional view of FIG. 17C, the conductive layer 19 is patterned by removing the conductive layer 19 exposed from the resist pattern 15a in the direction of the arrow 16a. After forming the first conductivity type wiring 13 and the second conductivity type wiring 12, as shown in the schematic sectional view of FIG. 17D, the surface of the first conductivity type wiring 13 and the second conductivity type wiring The resist pattern 15a is completely removed from the surface of the wiring 12. The steps so far are the same as those in the first embodiment.

  Next, as shown in the schematic cross-sectional view of FIG. 17 (e), insulative regions are formed in regions between the first conductive type wiring 13 and the second conductive type wiring 12 on the surface of the insulating substrate 11. By forming the convex portion 101, the wiring substrate 10 is manufactured. Here, the insulating convex portion 101 is not particularly limited as long as it is made of an insulating material and is formed taller than each of the first conductive type wiring 13 and the second conductive type wiring 12. For example, a paste-like glass paste containing glass or an insulating resist is applied by a method such as screen printing, dispenser application or inkjet application, and then cured by treatment such as ultraviolet irradiation or heating. Can do.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 18, the first conductivity type electrode 6 of the back electrode type solar cell 8 produced as described above is located between the adjacent insulating projections 101 of the wiring substrate 10. 16 and the second conductivity type electrode 7 so as to fit between the adjacent insulating projections 101 of the wiring board 10, so that the solar cell of the present invention having the configuration shown in FIG. An example is made.

  In the solar cell according to the present embodiment manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 fits between the adjacent insulating projections 101 of the wiring board 10. The second conductive type electrode 7 of the back electrode type solar cell 8 is installed so as to be fitted between the adjacent insulating convex portions 101 of the wiring board 10.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is disposed between the adjacent insulating projections 101 of the wiring board 10. So that the second conductive type electrode 7 of the back electrode type solar cell 8 can be installed between the adjacent insulating projections 101 of the wiring substrate 10. The alignment of the battery 8 is facilitated, and the back electrode solar cell 8 is less likely to be misaligned by the convex portion 101.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 is hindered by 101, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portions 101 of the wiring substrate 10 are positioning portions that determine the relative positional relationship of the back electrode solar cell 8 with respect to the wiring substrate 10.

  Since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 6>
FIG. 19 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 19, each region of the wiring substrate 10 between the first conductivity type wiring 13 and the second conductivity type wiring 12 protrudes toward the back electrode type solar cell 8 side. Insulating convex portions 101 extending toward the front surface side and / or the back surface side of the paper surface serve as positioning portions, and a part of the surface of the first conductivity type wiring 13 and the surface of the second conductivity type wiring 12 Is characterized in that a part of each is covered with a convex portion 101.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 19 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 19 is manufactured in the same manner as in the first embodiment.

  In addition, the wiring substrate 10 included in the solar cell having the configuration shown in FIG. 19 includes the first conductive type wiring 13 and the first wiring 13 on the surface of the insulating substrate 11 as shown in the schematic cross-sectional view of FIG. Insulating protrusions 101 in the region between the two-conductivity-type wirings 12 are formed so as to cover part of the surface of the first-conductivity-type wiring 13 and part of the surface of the second-conductivity-type wiring 12. Thus, the wiring board 10 is manufactured.

  After that, as shown in the schematic cross-sectional view of FIG. 20B, the first conductive type electrode 6 of the back electrode type solar cell 8 produced as described above is adjacent to the insulating convex portion of the wiring board 10. 19, the second conductive type electrode 7 is installed so as to be accommodated between the adjacent insulating convex portions 101 of the wiring board 10, thereby the present invention having the configuration shown in FIG. 19. An example of a solar cell is produced.

  In the solar cell according to the present embodiment manufactured as described above, the first conductivity type electrode 6 of the back electrode type solar cell 8 fits between the adjacent insulating projections 101 of the wiring board 10. The second conductive type electrode 7 of the back electrode type solar cell 8 is installed so as to be fitted between the adjacent insulating convex portions 101 of the wiring board 10.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type electrode 6 of the back electrode type solar cell 8 is disposed between the adjacent insulating projections 101 of the wiring board 10. So that the second conductive type electrode 7 of the back electrode type solar cell 8 can be installed between the adjacent insulating projections 101 of the wiring substrate 10. The alignment of the battery 8 is facilitated, and the back electrode solar cell 8 is less likely to be misaligned by the convex portion 101.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 is hindered by 101, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portions 101 of the wiring substrate 10 are positioning portions that determine the relative positional relationship of the back electrode solar cell 8 with respect to the wiring substrate 10.

  In the above, a part of the surface of all the first conductivity type wirings 13 and a part of the surface of all the second conductivity type wirings 12 are covered with the convex portions 101, respectively. It is only necessary that at least one surface of the mold wiring 13 and the second conductivity type wiring 12 is covered with the convex portion 101.

  In addition, since the description other than the above in the present embodiment is the same as that in the first and fifth embodiments, the description thereof is omitted here.

<Embodiment 7>
FIG. 21 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 21, a part of the wiring substrate 10 between the first conductivity type wiring 13 and the second conductivity type wiring 12 projects toward the back electrode type solar cell 8 side. Insulating convex portions 101 extending toward the front surface side and / or the back surface side of the paper surface 21 are positioning portions, and a part of the surface of the first conductive type wiring 13 adjacent to the insulating convex portion 101 is used. Further, the second conductive type wiring 12 is characterized in that a part of the surface is covered with the convex portion 101.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 21 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 21 is manufactured in the same manner as in the first embodiment.

  In addition, the wiring substrate 10 included in the solar cell having the configuration shown in FIG. 21 includes the first conductive type wiring 13 and the first wiring 13 on the surface of the insulating substrate 11 as shown in the schematic cross-sectional view of FIG. Insulating protrusions 101 in the region between the two-conductivity-type wirings 12 are formed so as to cover part of the surface of the first-conductivity-type wiring 13 and part of the surface of the second-conductivity-type wiring 12. In addition, the wiring substrate 10 is manufactured by providing a region where the insulating convex portion 101 is not formed between the first conductive type wiring 13 and the second conductive type wiring 12.

  After that, as shown in the schematic cross-sectional view of FIG. 22B, the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 produced as described above are adjacent to each other. The solar cell of the present invention having the configuration shown in FIG. 21 is manufactured by placing the insulating projections 101 of the wiring board 10 so as to be accommodated therebetween.

  In the solar cell of the present embodiment manufactured as described above, an insulating projection is provided between the first conductive type electrode 6 and the second conductive type electrode 7 adjacent to each other in the back electrode type solar cell 8. The unit 101 is installed and installed so as to be accommodated.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the wiring is provided between the adjacent first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8. Since it is sufficient that the insulating convex portion 101 of the substrate 10 is accommodated, the alignment of the back electrode solar cell 8 is facilitated, and the positional deviation of the back electrode solar cell 8 by the insulating convex portion 101 is facilitated. Is less likely to occur.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 is hindered by 101, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portions 101 of the wiring substrate 10 are positioning portions that determine the relative positional relationship of the back electrode solar cell 8 with respect to the wiring substrate 10.

  Note that the description of the present embodiment other than the above is the same as that of the first embodiment, the fifth embodiment, and the sixth embodiment, and thus the description thereof is omitted here.

<Eighth embodiment>
In FIG. 23, typical sectional drawing of another example of the solar cell of this invention is shown. In the solar cell having the configuration shown in FIG. 23, an insulating convex portion 101 that protrudes toward the back electrode type solar cell 8 at the end of the wiring substrate 10 and extends toward the front surface side and / or the back surface side of FIG. Is a positioning portion, and a part of the surface of the first conductive type wiring 13 adjacent to the insulating convex part 101 and a part of the surface of the second conductive type wiring 12 are insulated convex parts 101, respectively. It is characterized by being covered with.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. 23 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 23 is manufactured in the same manner as in the first embodiment.

  In addition, the wiring substrate 10 included in the solar cell having the configuration shown in FIG. 23 has the first conductivity type only at both ends of the surface of the insulating substrate 11, as shown in the schematic cross-sectional view of FIG. The wiring substrate 10 is manufactured by forming the insulating convex portions 101 so as to cover a part of the surface of the wiring 13 for use and a part of the surface of the wiring 12 for the second conductivity type.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 24B, all the first conductivity type electrodes 6 and all the second conductivity type electrodes 7 of the back electrode type solar cell 8 produced as described above. However, the solar cell of the present invention having the configuration shown in FIG. 23 is manufactured by installing the wiring board 10 so as to fit between the insulating convex portions 101 at both ends.

  In the solar cell of the present embodiment manufactured as described above, all the first conductivity type electrodes 6 and all the second conductivity type electrodes 7 of the back electrode type solar cell 8 are connected to both ends of the wiring substrate 10. It installs so that it may be settled between the insulating convex parts 101.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, all the first conductivity type electrodes 6 and all the second conductivity type electrodes 7 of the back electrode type solar cell 8 are connected to the wiring board. 10 so that the back electrode solar cell 8 can be easily positioned and misalignment of the back electrode solar cell 8 is less likely to occur. .

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the back electrode type solar cell 8 is hindered by 101, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portions 101 of the wiring substrate 10 are positioning portions that determine the relative positional relationship of the back electrode solar cell 8 with respect to the wiring substrate 10.

  In the present embodiment, the conductive convex portion 101 may be used instead of the insulating convex portion 101.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the fifth embodiment, and the sixth embodiment, the description thereof is omitted here.

<Embodiment 9>
FIG. 25 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 25, the gap between the first conductivity type electrode 6 and the second conductivity type electrode 7 on the surface of the passivation film 4 on the back surface of the semiconductor substrate 1 of the back electrode type solar cell 8. The region is provided with an insulating convex portion 151 that protrudes on the side opposite to the semiconductor substrate 1 side, and the insulating convex portion 151 is a positioning portion.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. 25 will be described. Wiring substrate 10 included in the solar cell having the configuration shown in FIG. 25 is manufactured in the same manner as in the first embodiment.

  Further, the back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 25 is formed on the surface of the passivation film 4 on the back surface of the semiconductor substrate 1 as shown in the schematic cross-sectional view of FIG. Insulating projections 151 are formed.

  Here, the convex portion 151 is not particularly limited as long as it is made of an insulating material and is formed taller than the first conductivity type electrode 6 and the second conductivity type electrode 7. For example, a paste-like glass paste, an insulating resist, or the like, which has been applied by a method such as screen printing, dispenser application, or inkjet application, and then cured by a process such as ultraviolet irradiation or heating can be used.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 26B, the first conductivity type electrode 6 of the back electrode type solar cell 8 produced as described above is used as the first conductivity type wiring 13 of the wiring substrate 10. FIG. 25 shows that the second conductive type electrode 7 of the back electrode type solar cell 8 is placed so as to be in contact with the second conductive type wiring 12 of the wiring substrate 10. An example of the solar cell of the present invention having the configuration is produced.

  In the solar cell of the present embodiment manufactured as described above, the convex portion 151 on the back surface side of the semiconductor substrate 1 of the back electrode type solar cell 8 is connected to the first conductivity type wiring 13 and the first wiring 13 of the wiring substrate 10. It is installed so as to fit in the gap between the two conductivity type wirings 12.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the convex portion 151 on the back side of the semiconductor substrate 1 of the back electrode type solar cell 8 is replaced with the first conductive type wiring of the wiring substrate 10. 13 and the second conductive type wiring 12 may be installed so as to fit in the gap, and thus the positioning of the back electrode solar cell 8 is facilitated, and the convex portion 151 allows the back electrode solar cell 8 to be aligned. Misalignment is less likely to occur.

  Furthermore, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing step or the like, the convex portion Since the movement of the first conductive type wiring 13 and the second conductive type wiring 12 of the wiring substrate 10 is hindered by 151, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portion 151 of the back electrode type solar cell 8 serves as a positioning portion that determines the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10.

  Since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 10>
FIG. 27 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 27, there are a recess formed on the surface of the first conductivity type electrode 6 on the back surface of the back electrode type solar cell 8 and a recess formed on the surface of the second conductivity type electrode 7. It is characterized in that it is a positioning part.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. 27 will be described. The wiring substrate 10 included in the solar cell having the configuration shown in FIG. 27 is manufactured in the same manner as in the first embodiment.

  Moreover, the back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 27 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 28A, a semiconductor substrate 1 is prepared in which slice damage 1a is formed on the surface of the semiconductor substrate 1, for example, by slicing from an ingot. As shown in the schematic cross-sectional view, the slice damage 1a on the surface of the semiconductor substrate 1 is removed.

  Next, as shown in the schematic cross-sectional view of FIG. 28C, the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are respectively formed on the back surface of the semiconductor substrate 1, and FIG. As shown in the schematic sectional view of d), a passivation film 4 is formed on the back surface of the semiconductor substrate 1.

  Next, as shown in the schematic cross-sectional view of FIG. 28E, after forming an uneven structure such as a texture structure on the entire light receiving surface of the semiconductor substrate 1, an antireflection film 5 is formed on the uneven structure. .

  Next, as shown in the schematic cross-sectional view of FIG. 28 (f), the contact hole 4 a and the contact hole 4 b are formed by removing a part of the passivation film 4 on the back surface of the semiconductor substrate 1. The steps so far are the same as those in the first embodiment.

  Next, as shown in the schematic cross-sectional view of FIG. 28G, the first conductivity type electrode 6 in contact with the first conductivity type impurity diffusion region 2 through the contact hole 4a and the second conductivity type impurity through the contact hole 4b. A second conductivity type electrode 7 in contact with the diffusion region 3 is formed, and a back electrode type solar cell 8 is produced.

  Here, each of the recesses on the surface of the first conductivity type electrode 6 and the recesses on the surface of the second conductivity type electrode 7 is applied with a metal paste containing a metal such as copper, and the sagging of the metal paste is used. After forming a depression on the surface of the applied metal paste, it can be formed by drying. In addition, as a metal paste, the paste-form thing containing a metal can be used, for example, and a metal paste can be apply | coated by methods, such as screen printing, dispenser application | coating, or inkjet application | coating, for example.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 29, the first conductivity type electrode 6 of the back electrode type solar cell 8 produced as described above is brought into contact with the first conductivity type wiring 13 of the wiring substrate 10. 27, the second conductivity type electrode 7 of the back electrode type solar cell 8 is installed so as to be in contact with the second conductivity type wiring 12 of the wiring board 10, and the book having the configuration shown in FIG. An example of the inventive solar cell is made.

  In the solar cell of the present embodiment manufactured as described above, the first conductivity type wiring 13 of the wiring substrate 10 is recessed in the recess of the surface of the first conductivity type electrode 6 of the back electrode type solar cell 8. And the second conductivity type wiring 12 of the wiring substrate 10 is installed in the recess of the concave portion on the surface of the second conductivity type electrode 7 of the back electrode type solar cell 8.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type of the wiring substrate 10 is recessed in the recess of the surface of the first conductivity type electrode 6 of the back electrode type solar cell 8. The wiring 13 is placed so as to be accommodated, and the second conductivity type wiring 12 of the wiring substrate 10 is placed in the recess of the concave portion on the surface of the second conductivity type electrode 7 of the back electrode type solar cell 8. Therefore, the positioning of the back electrode solar cell 8 is facilitated, and the back electrode solar cell 8 is formed by the recesses on the surface of the first conductivity type electrode 6 and the recesses on the surface of the second conductivity type electrode 7. The positional deviation is less likely to occur.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. The first conductive type electrode 6 and the second conductive type electrode 7 of the wiring substrate 10 are moved by the concave portion on the surface of the first conductive type electrode 6 of the solar cell 8 and the concave portion of the surface of the second conductive type electrode 7. Therefore, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the recesses on the surface of the first conductivity type electrode 6 and the recesses on the surface of the second conductivity type electrode 7 of the back electrode type solar cell 8 are respectively connected to the wiring of the back electrode type solar cell 8. This is a positioning unit that determines the relative positional relationship with respect to the substrate 10.

  In the above description, the concave portions are formed on both the surface of the first conductivity type electrode 6 of the back electrode type solar cell 8 and the surface of the second conductivity type electrode 7 of the back electrode type solar cell 8. You may form a recessed part only in either one of the surface of the electrode 6 for conductivity types, or the surface of the electrode 7 for 2nd conductivity types.

  Moreover, in the above, although the recessed part was formed in the surface of all the electrodes 6 and 2 for the 2nd conductivity type 7 of the back electrode type solar cell 8, respectively, the electrode 6 for the 1st conductivity type and the 2nd It is sufficient that a recess is formed on at least one surface of the conductivity type electrode 7.

  Since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 11>
FIG. 30 shows a schematic cross-sectional view of another example of the solar cell of the present invention. In the solar cell having the configuration shown in FIG. 30, the first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b formed by separating the first conductivity type electrode on the back surface of the back electrode type solar cell 8 into a plurality of pieces. In addition, the second conductivity type separation electrode 7a and the second conductivity type separation electrode 7b formed by separating the second conductivity type electrode on the back surface of the back electrode type solar cell 8 into a plurality of portions serve as positioning portions. There are features.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 30 will be described. Wiring substrate 10 included in the solar cell having the configuration shown in FIG. 30 is manufactured in the same manner as in the first embodiment.

  Moreover, the back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 30 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 31A, a semiconductor substrate 1 in which slice damage 1a is formed on the surface of the semiconductor substrate 1 by, for example, slicing from an ingot is prepared, and FIG. ), The slice damage 1a on the surface of the semiconductor substrate 1 is removed.

  Next, as shown in the schematic cross-sectional view of FIG. 31C, the first conductivity type impurity diffusion regions 2 and the second conductivity type impurity diffusion regions 3 are alternately formed on the back surface of the semiconductor substrate 1, respectively. As shown in the schematic cross-sectional view of FIG. 31D, a passivation film 4 is formed on the back surface of the semiconductor substrate 1.

  Next, as shown in the schematic cross-sectional view of FIG. 31 (e), after forming an uneven structure such as a texture structure on the entire light receiving surface of the semiconductor substrate 1, an antireflection film 5 is formed on the uneven structure. . The steps so far are the same as those in the first embodiment.

  Next, as shown in the schematic cross-sectional view of FIG. 31 (f), the contact hole 4 a and the contact hole 4 b are formed by removing a part of the passivation film 4 on the back surface of the semiconductor substrate 1. Here, the contact hole 4a is formed so that the surface of the first conductivity type impurity diffusion region 2 is exposed in the shape of each of the first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b. 4b is formed such that the surface of the second conductivity type impurity diffusion region 3 is exposed in the shape of each of the second conductivity type separation electrode 7a and the second conductivity type separation electrode 7b.

  Next, as shown in the schematic cross-sectional view of FIG. 31 (g), the first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b in contact with the first conductivity type impurity diffusion region 2 through the contact hole 4a, Then, the second conductivity type separation electrode 7a and the second conductivity type separation electrode 7b in contact with the second conductivity type impurity diffusion region 3 are formed, and the back electrode type solar cell 8 is fabricated.

  The first conductivity type electrode 6 is a combination of a pair of first conductivity type separation electrodes 6a and a first conductivity type separation electrode 6b, and the second conductivity type electrode 7 is a pair of second conductivity type electrodes. It consists of a combination of a mold separation electrode 7a and a second conductivity type separation electrode 7b.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 32, between the adjacent first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b of the back electrode type solar cell 8 produced as described above. The first conductive type wiring 13 of the wiring substrate 10 is placed in the gap between the second conductive type separation electrode 7a and the second conductive type separation electrode 7b adjacent to the back electrode type solar cell 8. An example of the solar cell of the present invention having the configuration shown in FIG. 30 is produced by placing the second conductive type wiring 12 of the wiring board 10 in the gap therebetween.

  In the solar cell of the present embodiment manufactured as described above, in the gap between the adjacent first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b of the back electrode type solar cell 8. The first conductive type electrode 13 of the wiring board 10 is installed so as to be accommodated, and a gap between the adjacent second conductive type separation electrode 7a and the second conductive type separation electrode 7b of the back electrode type solar cell 8 is provided. The second conductive type electrode 12 of the wiring board 10 is installed in the housing.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, it is between the first conductivity type separation electrode 6a and the first conductivity type separation electrode 6b adjacent to the back electrode type solar cell 8. The first conductive type electrode 13 of the wiring board 10 is placed in a gap between the second conductive type separation electrode 7a and the adjacent second conductive type separation electrode 7b. Therefore, the back electrode type solar cell 8 can be easily positioned and the back electrode type solar cell 8 can be misaligned by the separation electrodes. It becomes difficult.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. First conductive type separation electrode 6a, first conductive type separation electrode 6b, second conductive type separation electrode 7a, and second conductive type separation electrode 7b of solar cell 8 are connected to the first conductive type wiring of wiring substrate 10. 13 and the movement of the second conductivity type wiring 12 are hindered, so that the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the first conductivity type separation electrode 6a, the first conductivity type separation electrode 6b, the second conductivity type separation electrode 7a, and the second conductivity type separation electrode of the back electrode type solar cell 8 are used. 7b is a positioning portion that determines the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10.

  In the above description, all electrodes on the back surface of the back electrode type solar cell 8 are separated electrodes (first conductivity type separation electrode 6a, first conductivity type separation electrode 6b, second conductivity type separation electrode 7a and second electrode Although the two-conductivity type separation electrode 7b), only a part of the electrodes on the back surface of the back electrode type solar cell 8 may be used as the separation electrode.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 12>
FIG. 33 shows a schematic cross-sectional view of another example of the solar cell of the present invention. The solar cell having the configuration shown in FIG. 33 is characterized in that a concave portion on the back surface of the back electrode type solar cell 8 serves as a positioning portion.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. 33 will be described. The wiring substrate 10 included in the solar cell having the configuration shown in FIG. 33 is manufactured in the same manner as in the first embodiment.

  Moreover, the back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 33 can be manufactured, for example, as follows.

  First, as shown in the schematic cross-sectional view of FIG. 34A, a semiconductor substrate 1 is prepared from which slice damage 1a caused by, for example, slicing from an ingot is removed.

  Next, as shown in the schematic sectional view of FIG. 34 (b), a recess 1 b is provided on the back surface of the semiconductor substrate 1.

  Next, as shown in the schematic cross-sectional view of FIG. 34 (c), the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are alternately formed in the recess 1b on the back surface of the semiconductor substrate 1, respectively. Then, a passivation film 4 is formed on the back surface of the semiconductor substrate 1 as shown in the schematic cross-sectional view of FIG.

  Next, as shown in the schematic cross-sectional view of FIG. 34 (e), after an uneven structure such as a texture structure is formed on the entire light receiving surface of the semiconductor substrate 1, an antireflection film 5 is formed on the uneven structure. .

  Next, as shown in the schematic cross-sectional view of FIG. 34 (f), the surface of the first conductivity type impurity diffusion region 2 and the second conductivity are removed by removing a part of the passivation film 4 on the back surface of the semiconductor substrate 1. The surface of the type impurity diffusion region 3 is exposed.

  Next, as shown in the schematic cross-sectional view of FIG. 34G, the first conductivity type electrode 6 is formed on the surface of the first conductivity type impurity diffusion region 2 exposed from the passivation film 4 on the back surface of the semiconductor substrate 1. And a second conductivity type electrode 7 is formed on the surface of the second conductivity type impurity diffusion region 3 exposed from the passivation film 4 on the back surface of the semiconductor substrate 1, thereby producing a back electrode type solar cell 8. Is done.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 35, the first conductivity type electrode 6 of the back electrode type solar cell 8 manufactured as described above and the first conductivity type wiring 13 of the wiring substrate 10 are brought into contact with each other. FIG. 33 shows that the back electrode type solar cell 8 is placed so that the second conductivity type electrode 7 of the back electrode type solar cell 8 and the second conductivity type wire 12 of the wiring substrate 10 are brought into contact with each other. An example of the solar cell of the present invention having the configuration is produced.

  In the solar cell of the present embodiment manufactured as described above, the first conductive type wiring 13 and the second conductive type wiring 12 of the wiring substrate 10 are housed in the concave portion on the back surface of the back electrode type solar cell 8. In this way, the back electrode type solar cell 8 is installed.

  Therefore, in the present embodiment, when the back electrode type solar cell 8 is installed, the first conductivity type wiring 13 and the second conductivity type wiring of the wiring substrate 10 are formed in the recesses on the back surface of the back electrode type solar cell 8. 12, the back electrode solar cell 8 can be easily positioned, and the back electrode solar cell 8 is less likely to be misaligned by the recess on the back surface of the back electrode solar cell 8. Become.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. Since the movement of the first conductivity type electrode 6 and the second conductivity type electrode 7 of the wiring substrate 10 is hindered by the recesses on the back surface of the solar cell 8, it is possible to effectively suppress the positional deviation of the back electrode type solar cell 8. it can.

  That is, in the present embodiment, the recesses on the back surface of the back electrode type solar cell 8 serve as positioning portions that determine the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10.

  In the above, a plurality of recesses are formed on the back surface of the back electrode type solar cell 8, but at least one recess may be formed on the back surface of the back electrode type solar cell 8.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 13>
FIG. 36 shows a schematic cross-sectional view of an example of the solar cell of the present invention. The solar cell having the configuration shown in FIG. 36 is installed at both ends of the back surface side of the semiconductor substrate 1 of the back electrode type solar cell 8 and protrudes toward the wiring substrate 10 so as to be on the front surface side and / or back surface side of FIG. 36 are positioned on both ends of the surface of the insulating substrate 11 of the wiring substrate 10 and protruded toward the back electrode type solar cell 8 to extend toward the back side of the paper surface of FIG. It is characteristic in that it is a part.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 36 will be described. First, as shown in the schematic cross-sectional view of FIG. 37A, a semiconductor substrate 1 in which slice damage 1a is formed on the surface of the semiconductor substrate 1 by, for example, slicing from an ingot is prepared, and FIG. ), The slice damage 1a on the surface of the semiconductor substrate 1 is removed.

  Next, as shown in the schematic cross-sectional view of FIG. 37C, the first conductivity type impurity diffusion region 2 and the second conductivity type impurity diffusion region 3 are respectively formed on the back surface of the semiconductor substrate 1, and FIG. As shown in the schematic sectional view of d), a passivation film 4 is formed on the back surface of the semiconductor substrate 1.

  Next, as shown in the schematic cross-sectional view of FIG. 37 (e), after an uneven structure such as a texture structure is formed on the entire light receiving surface of the semiconductor substrate 1, an antireflection film 5 is formed on the uneven structure. .

  Next, as shown in the schematic cross-sectional view of FIG. 37 (f), the contact hole 4 a and the contact hole 4 b are formed by removing a part of the passivation film 4 on the back surface of the semiconductor substrate 1. Here, the contact hole 4 a is formed so that the surface of the first conductivity type impurity diffusion region 2 is exposed in the shape of the first conductivity type electrode 6, and the contact hole 4 b is formed in the shape of the second conductivity type electrode 7. The surface of the second conductivity type impurity diffusion region 3 is exposed.

  Next, as shown in the schematic cross-sectional view of FIG. 37 (g), the first conductivity type electrode 6 in contact with the first conductivity type impurity diffusion region 2 through the contact hole 4a, and the second conductivity type impurity through the contact hole 4b. The second conductivity type electrode 7 that is in contact with the diffusion region 3 is formed, and the protrusions 221 that protrude to the opposite side of the semiconductor substrate 1 side from both ends of the surface of the passivation film 4 on the back surface of the semiconductor substrate 1 The back electrode type solar cell 8 is produced by forming in the same process as the electrode. Here, the convex portion 221 is made of the same material as the first conductivity type electrode 6 and the second conductivity type electrode 7.

  On the other hand, as shown in the schematic cross-sectional view of FIG. 38A, a conductive layer 19 is formed on the surface of the insulating substrate 11, and as shown in the schematic cross-sectional view of FIG. A resist pattern 15 a is formed on the conductive layer 19 on the surface of 11.

  Next, as shown in the schematic cross-sectional view of FIG. 38C, the conductive layer 19 is patterned by removing the conductive layer 19 exposed from the resist pattern 15a in the direction of the arrow 16a. Thus, the first conductive type wiring 13, the second conductive type wiring 12, and the convex portion 222 are formed in the same process. Here, the convex portion 222 is made of the same material as the first conductive type wiring 13 and the second conductive type wiring 12.

  Next, as shown in the schematic cross-sectional view of FIG. 38D, all of the resist pattern 15a is removed from the surface of the first conductive type wiring 13 and the surface of the second conductive type wiring 12, and the wiring substrate 10 is formed. Produced.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 39, the convex portion 221 of the back electrode type solar cell 8 produced as described above is different from the convex portion 222 at the end of the surface of the wiring substrate 10 and the first conductivity type. It is installed so as to fit in the gap between the wiring 13 for use and the gap between the convex portion 222 at the end of the surface of the wiring board 10 and the wiring 12 for the second conductivity type.

  Thus, the first conductivity type electrode 6 of the back electrode type solar cell 8 and the first conductivity type wiring 13 of the wiring substrate 10 are in contact with each other, and the second conductivity type electrode 7 and the wiring of the back electrode type solar cell 8 are connected. An example of the solar cell of the present invention having the configuration shown in FIG. 36 is produced by contacting the second conductivity type wiring 12 of the substrate 10.

  Therefore, when the back electrode type solar cell 8 is installed, the convex portion 221 of the back electrode type solar cell 8 is replaced with the gap between the convex portion 222 of the wiring substrate 10 and the first conductive type wiring 13 and the wiring substrate 10. Since it only needs to be installed in the gap between the convex portion 222 and the second conductive type wiring 12, it is easy to align the back electrode solar cell 8 and the position of the back electrode solar cell 8. Misalignment is less likely to occur.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. Since the convex portion 221 of the solar cell 8 and the convex portion 222 of the wiring substrate 10 prevent the movement of the back electrode type solar cell 8, the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portion 221 of the back electrode type solar cell 8 and the convex portion 222 of the wiring substrate 10 determine the relative positional relationship between the back electrode type solar cell 8 and the wiring substrate 10. It becomes a positioning part.

  In addition, the shape, arrangement | positioning, and number of the convex part 221 and the convex part 222 are not limited to the above-mentioned thing, The convex part 221 and the convex part 222 have the relative positional relationship with respect to the wiring board 10 of the back electrode type solar cell 8, respectively. Any shape, arrangement, and number that function as a positioning portion that falls within a predetermined range may be used.

  The convex portion 221 may be formed in the same process as the first conductivity type electrode 6 and / or the second conductivity type electrode 7, and the first conductivity type electrode 6 and the second conductivity type electrode 7 Although the same material may be used, the convex portion 221 and the first conductivity type electrode 6 and the second conductivity type electrode 7 are formed in the same process and the same material as in the present embodiment. The formation is preferable in that the manufacturing efficiency tends to be improved. In addition, the convex part 221 is a process (formation process of the 1st conductivity type electrode 6 and / or 2nd) which continues with the formation process of the electrode 6 for 1st conductivity type, and / or the formation process of the electrode 7 for 2nd conductivity types. You may form in the process immediately before the formation process of the electrode 7 for conductive types, and / or the process immediately after.

  The convex portion 222 may be formed in the same process as the first conductivity type wiring 13 and / or the second conductivity type wiring 12, and the first conductivity type wiring 13 and the second conductivity type wiring 12 Although the same material may be used, the protrusion 222, the first conductive type wiring 13 and the second conductive type wiring 12 are formed in the same process and the same material as in the present embodiment. The formation is preferable in that the production efficiency tends to be improved. The convex portion 222 is a step that continues with the step of forming the first conductive type wiring 13 and / or the step of forming the second conductive type wiring 12 (the step of forming the first conductive type wiring 13 and / or the second step). You may form in the process immediately before the formation process of the wiring 12 for conductive types, and / or the process immediately after.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 14>
In FIG. 40, typical sectional drawing of an example of the solar cell of this invention is shown. The solar cell having the configuration shown in FIG. 40 has convex portions 251 that are installed at both ends of the surface of the wiring substrate 10 and project toward the back electrode type solar cell 8 and extend toward the back side of the paper surface of FIG. There is a feature in that.

  Hereinafter, an example of the manufacturing method of the solar cell having the configuration shown in FIG. 40 will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 40 is manufactured in the same manner as in the first embodiment.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 40 can be manufactured, for example, as follows.

  First, in the same manner as in the first embodiment, as shown in the schematic cross-sectional view of FIG. 41A, the first conductive type wiring 13 patterned in a predetermined shape on the surface of the insulating substrate 11 and The second conductivity type wiring 12 is installed.

  Next, as shown in the schematic cross-sectional view of FIG. 41B, the wiring substrate 10 is manufactured by forming the convex portions 251 at both ends of the surface of the insulating substrate 11 respectively. Here, as the convex portion 251, for example, a paste-like glass paste containing glass or at least one kind of resin such as epoxy, acrylic, polyimide, polyamideimide, and silicone is used, for example, screen printing, dispenser application, inkjet application, or the like. Although what was hardened | cured by the process of ultraviolet irradiation or a heating after apply | coating by the method of this can be used, it is not limited to this. In addition, the convex part 251 can be formed so that the semiconductor substrate 1 of the back electrode type solar cell 8 can be accommodated over the thickness direction.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 42, the semiconductor substrate 1 of the back electrode type solar cell 8 is accommodated in the gap between the convex portions 251 at both ends of the surface of the wiring substrate 10 manufactured as described above. As a result, an example of the solar cell of the present invention having the configuration shown in FIG. 40 is produced.

  Therefore, when the back electrode type solar cell 8 is installed, the semiconductor substrate 1 of the back electrode type solar cell 8 may be installed in the gap between the convex portions 251 at both ends of the surface of the wiring substrate 10. The alignment of the back electrode solar cell 8 is facilitated, and the convex portion 251 makes it difficult for the back electrode solar cell 8 to be misaligned.

  Further, after the back electrode type solar cell 8 is once installed, even if the member such as the insulating substrate 11 of the wiring substrate 10 expands or contracts due to heating in the subsequent sealing process or the like, the wiring substrate 10 Since the movement of the back surface electrode type solar cell 8 is hindered by the convex portions 251 respectively installed at both ends of the surface, the displacement of the back surface electrode type solar cell 8 can be effectively suppressed.

  That is, in the present embodiment, the convex portions 251 respectively installed at both ends of the front surface of the wiring substrate 10 are positioning portions that determine the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10.

  In addition, the shape, arrangement | positioning, and number of the convex parts 251 are not limited to the above, and the convex part 251 is a positioning part that keeps the relative positional relationship of the back electrode type solar cell 8 with respect to the wiring substrate 10 within a predetermined range. Any functional shape, arrangement and number may be used.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 15>
FIG. 43 (a) shows a schematic cross-sectional view of an example of the solar cell of the present invention, and FIG. 43 (b) shows a schematic cross-sectional view along 43b-43b of FIG. 43 (a). 43 (a) and 43 (b), the solar cell having the configuration shown in FIGS. 43 (a) and 43 (b) is provided at both ends on the back surface side of the semiconductor substrate 1 of the back electrode type solar cell 8 and protrudes toward the wiring substrate 10 side. The protrusions 272 and the protrusions 282 that are installed at both ends of the surface of the insulating substrate 11 of the wiring board 10 and the part 282 and protrude toward the back electrode solar cell 8 side are positioning parts, respectively. The convex portion 272 of the battery 8 and the convex portion 282 of the wiring substrate 10 and the convex portion 282 of the back electrode type solar cell 8 and the convex portion 272 of the wiring substrate 10 are characterized by magnetism.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIGS. 43 (a) and 43 (b) will be described. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIGS. 43A and 43B can be manufactured, for example, as follows.

  First, in the same manner as in the first embodiment, the back electrode type solar cell 8 having the configuration shown in the schematic cross-sectional view of FIG.

  Next, as shown in the schematic cross-sectional view of FIG. 44B, a magnetic paste 271 containing magnetic powder is applied to each of both ends of the surface of the passivation film 4 on the back surface of the back electrode type solar cell 8, for example, by screen printing. Application by a method such as dispenser application or inkjet application. Thereafter, the magnetic paste 271 is cured by a process such as ultraviolet irradiation or heating.

  Next, as shown in the schematic cross-sectional view of FIG. 44C, the back surface electrode is obtained by magnetizing the magnetic paste 271 on the surface of the passivation film 4 on the back surface of the back electrode type solar cell 8 with a ferromagnetic material. A convex portion 272 and a convex portion 282 that protrude toward the semiconductor substrate 1 of the solar cell 8 are formed. Thereby, the back surface electrode type solar cell 8 included in the solar cell having the configuration shown in FIGS. 43A and 43B is manufactured.

  Here, the convex portion 272 and the convex portion 282 are made of a magnetic material having opposite magnetic poles. For example, when the magnetic pole of the convex portion 272 is an S pole, the magnetic pole of the convex portion 282 becomes an N pole, and the convex portion 272 When the magnetic pole is an N pole, the magnetic pole of the convex portion 282 is an S pole.

  For example, the wiring substrate 10 included in the solar cell having the configuration shown in FIGS. 43A and 43B can be manufactured as follows.

  Similarly to the first embodiment, as shown in the schematic cross-sectional view of FIG. 45A, the first conductivity type wiring 13 patterned in a predetermined shape on the surface of the insulating substrate 11 and The second conductivity type wiring 12 is installed.

  Next, as shown in the schematic cross-sectional view of FIG. 45 (b), a magnetic paste 281 containing magnetic powder is applied to both ends of the surface of the wiring substrate 10, respectively, for example, by screen printing, dispenser coating or ink jet coating. Apply by. Thereafter, the magnetic paste 281 is cured by a process such as ultraviolet irradiation or heating.

  Next, as shown in the schematic cross-sectional view of FIG. 45C, the back surface electrode is obtained by magnetizing the magnetic paste 271 on the surface of the passivation film 4 on the back surface of the back electrode type solar cell 8 with a ferromagnetic material. A convex portion 272 and a convex portion 282 that protrude toward the semiconductor substrate 1 of the solar cell 8 are formed. Thereby, the wiring board 10 included in the solar cell having the configuration shown in FIGS. 43A and 43B is manufactured.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 46 (a) and the schematic cross-sectional view of FIG. 46 (b), the convex portion 272 and the wiring board on the back surface of the back electrode type solar cell 8 manufactured as described above. By installing the back electrode solar cell 8 so that the convex portion 282 on the front surface of the back surface 10 contacts the convex portion 282 on the back surface of the back electrode solar cell 8 and the convex portion 272 on the surface of the wiring substrate 10 contact each other. An example of the solar cell of the present invention having the configuration shown in FIGS. 43 (a) and 43 (b) is produced. Note that FIG. 46B is a schematic cross-sectional view taken along 46b-46b in FIG.

  Accordingly, when the back electrode type solar cell 8 is installed, the convex portion 272 on the back surface of the back electrode type solar cell 8 and the convex portion 282 on the surface of the wiring substrate 10 attract each other by magnetic force, and the back surface of the back electrode type solar cell 8. The protrusions 282 of the wiring board 10 and the protrusions 272 on the surface of the wiring board 10 attract each other by magnetic force, so that the back electrode solar cell 8 can be easily aligned and the back electrode solar cell 8 is also misaligned by the magnetic force. It becomes difficult.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. The convex portion 272 on the back surface of the solar cell 8 and the convex portion 282 on the surface of the wiring substrate 10 are connected using magnetic force, and the convex portion 282 on the back surface of the back electrode solar cell 8 and the convex portion on the surface of the wiring substrate 10 are connected. Since it is connected with the magnetic field 272 using magnetic force, the movement of the back electrode type solar cell 8 is prevented by these magnetic forces, and the positional deviation of the back electrode type solar cell 8 can be effectively suppressed.

  In other words, in the present embodiment, the convex portions 272 and the convex portions 282 that are magnetized in the back electrode type solar cell 8 and the convex portions 272 and the convex portions 282 that are magnetic in the wiring substrate 10 are respectively provided on the back surface. It becomes a positioning part which determines the relative positional relationship with respect to the wiring board 10 of the electrode type solar cell 8.

  In addition, the shape, arrangement, and number of the convex portions 272 and the convex portions 282 that are magnetized are not limited to those described above, and the convex portions 272 and the convex portions 282 are relative to the wiring substrate 10 of the back electrode type solar cell 8. Any shape, arrangement, and number may be used as long as the positioning portion fits within a predetermined range.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

<Embodiment 16>
FIG. 47 shows a schematic cross-sectional view of an example of the solar cell of the present invention. The solar cell having the configuration shown in FIG. 47 includes protrusions 312 that are installed at both ends of the back surface side of the semiconductor substrate 1 of the back electrode type solar cell 8 and project toward the wiring substrate 10, and the insulating substrate 11 of the wiring substrate 10. Protrusions 322 installed at both ends of the front surface and projecting toward the back electrode solar cell 8 are positioning portions, and the convex portions 312 of the back electrode solar cell 8 and the protrusions 322 of the wiring substrate 10 are respectively static. It is characterized by a point.

  Hereinafter, an example of a method for manufacturing the solar cell having the configuration shown in FIG. The back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 47 can be manufactured as follows, for example.

  First, in the same manner as in the first embodiment, the back electrode type solar cell 8 having the configuration shown in the schematic cross-sectional view of FIG.

  Next, as shown in the schematic cross-sectional view of FIG. 48B, glass paste 311 containing glass is applied to both ends of the surface of the passivation film 4 on the back surface of the back electrode type solar cell 8, for example, by screen printing or dispenser application. Alternatively, it is applied by a method such as inkjet application. Thereafter, the glass paste 311 is cured by a process such as heating.

  Next, as shown in the schematic cross-sectional view of FIG. 48 (c), positive charges are generated on the surface of the glass paste 311 hardened on the passivation film 4 on the back surface of the back electrode type solar cell 8 by generating positive charges. A convex portion 312 having static electricity is formed. Thereby, back electrode type solar cell 8 included in the solar cell having the configuration shown in FIG. 47 is manufactured.

  Here, as a method of generating a positive charge on the surface of the glass paste 311, for example, a method of rubbing the surface of the glass paste 311 with an acrylic plate or a method using an ionizer can be used.

  Moreover, the wiring board 10 included in the solar cell having the configuration shown in FIG. 47 can be manufactured as follows, for example. First, in the same manner as in the first embodiment, as shown in the schematic cross-sectional view of FIG. 49A, the first conductivity type wiring 13 patterned in a predetermined shape on the surface of the insulating substrate 11 and The second conductivity type wiring 12 is installed.

  Next, as shown in the schematic cross-sectional view of FIG. 49B, a resin paste 321 containing an acrylic resin is applied to both ends of the surface of the wiring substrate 10 by a method such as screen printing, dispenser application, or inkjet application, for example. To do. Thereafter, the resin paste 321 is cured by a process such as ultraviolet irradiation or heating.

  Next, as shown in the schematic cross-sectional view of FIG. 49 (c), a negative charge is generated on the surface of the resin paste 321 cured on the surface of the wiring substrate 10, thereby causing negatively charged convex portions 322. Form. Thereby, the wiring board 10 included in the solar cell having the configuration shown in FIG. 47 is manufactured. Here, as a method of generating a negative charge on the surface of the resin paste 321, for example, a method of rubbing the surface of the resin paste 321 with a glass plate can be used.

  Thereafter, as shown in the schematic cross-sectional view of FIG. 50, the back electrode is formed so that the convex portion 312 on the back surface of the back electrode solar cell 8 produced as described above and the convex portion 322 on the surface of the wiring substrate 10 are in contact with each other. By installing the solar cell 8, an example of the solar cell of the present invention having the configuration shown in FIG. 47 is produced.

  Accordingly, when the back electrode type solar cell 8 is installed, the convex portion 312 on the back surface of the back electrode type solar cell 8 and the convex portion 322 on the surface of the wiring substrate 10 attract each other by electrostatic force. Is easily aligned, and the back electrode solar cell 8 is less likely to be misaligned.

  Further, after the back electrode type solar cell 8 is once installed, even if a member such as the insulating substrate 11 of the wiring board 10 expands or contracts due to heating in a subsequent sealing process or the like, the back electrode type solar cell 8 is provided. Since the convex part 312 on the back surface of the solar cell 8 and the convex part 322 on the surface of the wiring substrate 10 are connected using electrostatic force, the movement of the back electrode type solar cell 8 is hindered by this electrostatic force. The positional deviation of the electrode type solar cell 8 can be effectively suppressed.

  In other words, in the present embodiment, the convex portion 312 charged with static electricity of the back electrode type solar cell 8 and the convex portion 322 charged with static electricity of the wiring substrate 10 are respectively connected to the wiring substrate 10 of the back electrode type solar cell 8. It becomes a positioning part which determines the relative positional relationship with respect to.

  The shape, arrangement, and number of the convex portions 312 and the convex portions 322 that are charged with static electricity are not limited to those described above, and the convex portions 312 and the convex portions 322 are relative to the wiring substrate 10 of the back electrode type solar cell 8. Any shape, arrangement, and number may be used as long as the positioning portion fits within a predetermined range.

  In addition, since the description other than the above in the present embodiment is the same as that in the first embodiment, the description is omitted here.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to perform alignment of a back electrode type solar cell easily, the solar cell which can suppress effectively the position shift of a back electrode type solar cell, a back electrode type solar cell, a wiring board In addition, a method for manufacturing a solar cell can be provided.

It is typical sectional drawing of an example of the solar cell of this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the back electrode type solar cell contained in the solar cell of the structure shown in FIG. It is a typical top view of the back surface of an example of the back electrode type solar cell used for this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is a typical top view of the surface of an example of the wiring board used for this invention. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(f) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(d) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing which illustrates a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(e) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(e) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. 19, (b) of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process. It is typical sectional drawing of another example of the solar cell of this invention. (A) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. 21, (b) is a manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process. It is typical sectional drawing of another example of the solar cell of this invention. (A) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. 23, (b) of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process. It is typical sectional drawing of another example of the solar cell of this invention. (A) is typical sectional drawing of an example of the back electrode type solar cell contained in the solar cell of the structure shown in FIG. 25, (b) is a manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing which illustrates a part. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the back surface electrode type solar cell contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the back surface electrode type solar cell contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the back electrode type solar cell contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(g) is typical sectional drawing illustrating an example of the method of manufacturing the back electrode type solar cell contained in the solar cell of the structure shown in FIG. (A)-(d) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A) And (b) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of a structure shown in FIG. (A) is typical sectional drawing of another example of the solar cell of this invention, (b) is typical sectional drawing along 43b-43b of (a). (A)-(c) is typical sectional drawing illustrating an example of the method of manufacturing the back electrode type solar cell contained in the solar cell of the structure shown in FIG. (A)-(c) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. (A) is typical sectional drawing which illustrates a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. 43, (b) is typical sectional drawing in alignment with 46b-46b of (a). FIG. It is typical sectional drawing of another example of the solar cell of this invention. (A)-(c) is typical sectional drawing illustrating an example of the method of manufacturing the back electrode type solar cell contained in the solar cell of the structure shown in FIG. (A)-(c) is typical sectional drawing illustrating an example of the method of manufacturing the wiring board contained in the solar cell of the structure shown in FIG. It is typical sectional drawing illustrating a part of manufacturing process of the manufacturing method of the solar cell of the structure shown in FIG. (A) is typical sectional drawing illustrating an example of the method of producing a solar cell by electrically connecting several back electrode type solar cells, (b) is the solar cell produced in (a). It is typical sectional drawing illustrating an example of the process sealed in transparent resin. (A) is typical sectional drawing illustrating another example of the method of producing a solar cell by electrically connecting a plurality of back electrode type solar cells, and (b) is the sun produced in (a). It is typical sectional drawing illustrating an example of the process of sealing a battery in transparent resin. (A) is typical sectional drawing which illustrates another example of the method of producing a solar cell by electrically connecting several back electrode type solar cells, (b) was produced in (a). It is typical sectional drawing illustrating an example of the process of sealing a solar cell in transparent resin.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Semiconductor substrate, 1a Slice damage, 1b, 11a recessed part, 2 1st conductivity type impurity diffusion area, 3 2nd conductivity type impurity diffusion area, 4 Passivation film, 4a, 4b Contact hole, 5 Antireflection film, 6 1st conductivity Type electrode, 6a, 6b First conductivity type separation electrode, 7 Second conductivity type electrode, 7a, 7b Second conductivity type separation electrode, 8, 80 Back electrode type solar cell, 9 Passivation film, 10, 100 Wiring board, 11 Insulating board, 12 Second conductivity type wiring, 12a Second conductivity type separation wiring, 12b First conductivity type separation wiring, 13 First conductivity type wiring, 14 Connection wiring, 15a, 15b 83, resist pattern, 16a, 16b arrow, 17 metal paste, 18, 101, 151, 221, 222, 251, 272, 282, 312, 322 Convex part, 19 conductive layer, 60 first conductive type current collecting electrode, 70 second conductive type current collecting electrode, 81 embossing machine, 82 conductive seed layer, 84 metal plating layer, 271,281 magnetic paste, 311 Glass paste, 321 Resin paste, 341 Insulating adhesive, 342 Glass substrate, 343, 344 Ethylene vinyl acetate, 345 Back film, 351 Conductive adhesive.

Claims (19)

A back electrode type solar cell;
Including a wiring board,
The back electrode type solar cell corresponds to a semiconductor substrate, a first conductivity type impurity diffusion region and a second conductivity type impurity diffusion region formed on the back side of the semiconductor substrate, and the first conductivity type impurity diffusion region. A first conductivity type electrode provided in correspondence with the second conductivity type impurity diffusion region, and a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region,
The wiring board has an insulating substrate, a first conductive type wiring and a second conductive type wiring installed on the insulating substrate,
The first conductivity type electrode of the back electrode type solar cell is connected to the first conductivity type wiring of the wiring substrate;
The second conductivity type electrode of the back electrode type solar cell is connected to the second conductivity type wiring of the wiring substrate;
A solar cell in which at least one of the back electrode type solar cell and the wiring substrate has a positioning portion for determining a relative positional relationship of the back electrode type solar cell with respect to the wiring substrate.   The positioning portion is at least one of a recess formed on the surface of the first conductivity type wiring of the wiring board and a recess formed on the surface of the second conductivity type wiring of the wiring board. The solar cell according to claim 1.   The positioning part is at least one of a convex part installed on the surface of the first conductive type wiring of the wiring board and a convex part installed on the surface of the second conductive type wiring of the wiring board. The solar cell according to claim 1, wherein:   The positioning portion includes a first conductive type separation wiring formed by separating the first conductive type wiring of the wiring board into a plurality of pieces and a second conductive type wiring of the wiring board divided into a plurality of pieces. The solar cell according to claim 1, wherein the solar cell is at least one of two-conductivity type separation wirings.   The positioning portion is at least one of a concave portion on the surface of the first conductive type wiring and a concave portion on the surface of the second conductive type wiring provided in a concave portion on the surface of the insulating substrate of the wiring substrate. The solar cell according to claim 1, wherein:   2. The solar cell according to claim 1, wherein the positioning portion is a convex portion that is provided on a surface of the insulating substrate of the wiring substrate and protrudes toward the back electrode type solar cell.   7. The sun according to claim 6, wherein at least one of a part of a surface of the first conductive type wiring and a part of a surface of the second conductive type wiring is covered with the convex portion. battery.   2. The solar cell according to claim 1, wherein the positioning portion is a convex portion that is installed on a back surface side of the semiconductor substrate of the back electrode type solar cell and protrudes toward the wiring substrate side.   The positioning portion includes at least a recess formed on the surface of the first conductivity type electrode of the back electrode solar cell and a recess formed on the surface of the second conductivity type electrode of the back electrode solar cell. The solar cell according to claim 1, wherein the solar cell is one side.   The positioning part includes a plurality of first conductivity type separation electrodes formed by separating the first conductivity type electrodes of the back electrode type solar cell and a plurality of second conductivity type electrodes of the back electrode type solar cell. 2. The solar cell according to claim 1, wherein the solar cell is at least one of the second conductivity type separation electrodes separated into two.   The solar cell according to claim 1, wherein the positioning portion is a concave portion on a back surface of the back electrode type solar cell.   The positioning portion is disposed on the back surface side of the semiconductor substrate of the back electrode type solar cell and protrudes toward the wiring substrate side, and is disposed on the surface of the insulating substrate of the wiring substrate and the back electrode type. The solar cell according to claim 1, wherein the solar cell is a convex portion protruding toward the solar cell. The positioning part is a convex part that is installed on the surface of the insulating substrate of the wiring board and protrudes toward the back electrode type solar cell side,
The solar cell according to claim 1, wherein the semiconductor substrate of the back electrode type solar cell is fitted between the convex portions. The positioning portion is disposed on the back surface side of the semiconductor substrate of the back electrode type solar cell and protrudes toward the wiring substrate side, and is disposed on the surface of the insulating substrate of the wiring substrate and the back electrode type. It is a convex part protruding to the solar cell side,
The convex portion provided on the back side of the semiconductor substrate of the back electrode type solar cell and the convex portion provided on the surface of the insulating substrate of the wiring substrate bear at least one of magnetism and static electricity. The solar cell according to claim 1, wherein: A semiconductor substrate;
A first conductivity type impurity diffusion region and a second conductivity type impurity diffusion region formed on the back side of the semiconductor substrate;
A first conductivity type electrode provided corresponding to the first conductivity type impurity diffusion region;
A back electrode type solar cell having a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region,
The back electrode type solar cell which has a positioning part for determining the relative positional relationship with respect to the wiring board connected to the said back electrode type solar cell. A wiring board for connecting to a back electrode type solar cell,
An insulating substrate;
A first conductive type wiring and a second conductive type wiring installed on the insulating substrate;
The wiring board which has a positioning part for determining the relative positional relationship with respect to the back electrode type solar cell connected to the said wiring board. Including a step of connecting the back electrode type solar cell to the wiring board,
The back electrode type solar cell corresponds to a semiconductor substrate, a first conductivity type impurity diffusion region and a second conductivity type impurity diffusion region formed on the back side of the semiconductor substrate, and the first conductivity type impurity diffusion region. A first conductivity type electrode provided in correspondence with the second conductivity type impurity diffusion region, and a second conductivity type electrode provided corresponding to the second conductivity type impurity diffusion region,
The wiring board has an insulating substrate, a first conductive type wiring and a second conductive type wiring installed on the insulating substrate,
At least one of the back electrode type solar cell and the wiring substrate has a positioning part for determining a relative positional relationship of the back electrode type solar cell with respect to the wiring substrate,
In the connecting step, the positional relationship between the back electrode solar cell and the wiring substrate is determined by the positioning portion, and the first conductivity type electrode of the back electrode solar cell is connected to the first electrode of the wiring substrate. A method for manufacturing a solar cell, wherein the second conductivity type electrode of the back electrode type solar cell is connected to the second conductivity type wire of the wiring substrate while being connected to the one conductivity type wire. Forming the first conductivity type electrode of the back electrode type solar cell;
Forming the second conductivity type electrode of the back electrode type solar cell,
The positioning portion is formed in the same step as or a continuous step with at least one of the step of forming the first conductivity type electrode and the step of forming the second conductivity type electrode. Item 18. A method for producing a solar cell according to Item 17. Forming a wiring for the first conductivity type of the wiring board;
Forming a second conductive type wiring of the wiring board,
The positioning portion is formed in the same step as or at least one of the steps of forming the first conductive type wiring and forming the second conductive type wiring. Item 18. A method for producing a solar cell according to Item 17.

Images