KR20150062792A - Solar cell module and solar cell - Google Patents

Abstract

The present invention relates to a solar cell module and a solar cell. The solar cell module according to an embodiment of the present invention comprises: a first solar cell and a second solar cell including a semiconductor substrate and a first electrode and a second electrode spaced apart from each other on a rear surface of the semiconductor substrate; and an interconnector for electrically connecting the first solar cell and the second solar cell. A protrusion protruding from a first surface of the interconnector is formed in the circumference in the end of a first surface edge of the interconnector. The interconnector comes in contact with the first solar cell and the second solar cell so that a first surface where the protrusion is formed faces an opposite direction of a contact surface of the first solar cell or the second solar cell. The solar cell according to an embodiment of the present invention comprises a first assisting electrode contacting a plurality of first electrodes and a second assisting electrode contacting a plurality of second electrodes. A protrusion is formed in the circumference in the end of an edge of each of the first assisting electrode and the second assisting electrode, and each of the first assisting electrode and the second assisting electrode may be connected to a rear surface of the semiconductor substrate so that the protrusion faces an opposite direction of a contact surface of the semiconductor substrate.

Description

SOLAR CELL MODULE AND SOLAR CELL [0002]

The present invention relates to a solar cell module and a solar cell.

A typical solar cell has a substrate made of different conductivity type semiconductors, such as p-type and n-type, an emitter, and an electrode connected to the substrate and the emitter, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter.

Particularly, research and development on a back electrode type solar cell having an n-electrode and a p-electrode formed only on the back surface of a silicon substrate without forming an electrode on the light receiving surface of a silicon substrate for increasing the efficiency of the solar cell is underway. A modularization technique of connecting a plurality of such back electrode type solar cell cells and electrically connecting them is also in progress.

The module and the technique are typical of a method of electrically connecting a plurality of solar cells with a metal interconnection, and a method of electrically connecting a plurality of solar cells with a metal interconnection using a wiring board on which wiring is previously formed.

An object of the present invention is to provide a solar cell module and a solar cell.

An example of a solar cell module according to the present invention includes a semiconductor substrate, a first solar cell and a second solar cell including a first electrode and a second electrode spaced apart from each other on a rear surface of a semiconductor substrate; And an interconnection for electrically connecting the first solar cell and the second solar cell to each other. A protrusion protruding from the first surface of the interconnector is formed around the edge of the first surface of the interconnector, The interconnector is connected to the first solar cell and the second solar cell such that the first surface formed with the protrusion is directed in the opposite direction to the connection surface of the first solar cell or the second solar cell.

Here, the projecting portion may not be formed on the second surface located on the opposite side of the first surface of the interconnector, and the second surface of the interconnector may be connected to the rear surface of the first solar cell and the second solar cell.

Specifically, the interconnector may be connected to the first electrode of the first solar cell and the second electrode of the second solar cell, or may be connected to the second electrode of the first solar cell and the first electrode of the second solar cell, The interconnector may be connected to the first electrode or the second electrode so that the protrusion is directed in the opposite direction to the connection surface of the first electrode or the second electrode.

Here, the protrusion height of the protrusion may be between 10: 1 and 3 in relation to the thickness of the interconnector.

Each of the first solar cell and the second solar cell further includes a first auxiliary electrode connected to the plurality of first electrodes and a second auxiliary electrode connected to the plurality of second electrodes, And may be connected to the first solar cell and the second solar cell so as to be opposite to the connection surface of the first auxiliary electrode or the connection surface of the second auxiliary electrode.

Here, the first electrode and the first auxiliary electrode, and the second electrode and the second auxiliary electrode are connected to each other by an electrode connection material of a conductive material, and the interconnector is connected to the first auxiliary electrode of the first solar cell or the second auxiliary electrode, And can be connected to the second auxiliary electrode.

In addition, an example of a solar cell according to the present invention includes a semiconductor substrate; A plurality of first electrodes and a plurality of second electrodes formed on a rear surface of the semiconductor substrate; And a second auxiliary electrode connected to the plurality of first electrodes and connected to the plurality of second electrodes, wherein a protruding portion is formed around the edge of each of the first auxiliary electrode and the second auxiliary electrode And each of the first auxiliary electrode and the second auxiliary electrode may be connected to the rear surface of the semiconductor substrate such that the protruding portion is directed in the opposite direction to the connection surface of the semiconductor substrate.

As such, the solar cell module according to the present invention can prevent the semiconductor substrate of the solar cell from being damaged by allowing the protrusions formed on the interconnector to be directed to the solar cell in the opposite direction to the connection surface, And furthermore, the contact resistance of the interconnector can be further reduced.

1 and 2 are views for explaining an example of a solar cell module according to the present invention.
FIG. 3 is an example of a partial perspective view of a solar cell applied to the solar cell module shown in FIG.
4 is a view for explaining patterns of the first electrode C141 and the second electrode C142 in the solar cell shown in FIG.
5 and 6 are views for explaining an example of connection of an interconnector (IC) when each solar cell has an auxiliary electrode in the solar cell module according to the present invention.
FIGS. 7 to 11C are views for explaining an example of a solar cell applied to the solar cell module shown in FIG.
FIGS. 12 to 14D are views for explaining another example of a solar cell applied to the solar cell module shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention in the drawings, portions not related to the description are omitted, and like reference numerals are given to similar portions throughout the specification.

Hereinafter, the front surface may be a surface of a semiconductor substrate or a front surface of a front glass substrate to which direct light is incident, and the rear surface may be a surface of a semiconductor substrate on which direct light is not incident, The opposite side of one side of the first side.

Hereinafter, a solar cell module and a solar cell according to embodiments of the present invention will be described with reference to the accompanying drawings.

1 and 2 are views for explaining an example of a solar cell module according to the present invention.

As shown in Fig. 1 (a), the solar cell module according to the present invention includes a first solar cell CE1, a second solar cell CE2, and an interconnector IC.

2, each of the first solar cell CE1 and the second solar cell CE2 includes first and second solar cells CE1 and CE2 spaced from each other on the rear surface of the semiconductor substrate 110 and the semiconductor substrate 110, (C141) and a second electrode (C142). An example of such a solar cell will be described in detail with reference to FIG.

The interconnection IC functions to electrically connect the first solar cell CE1 and the second solar cell CE2 to each other in the first direction, as shown in Fig. 1 (a).

In such an inter-connector (IC), an inter-connector (IC) is formed along the edge of the inter-connector (IC) around the edge of the first face (IC- A protrusion IC-P protruding from the first surface (IC-f1) Here, the projecting direction of the projecting portion IC-P may protrude from the first surface IC-f1 in the vertical direction or diagonally to the first surface IC-f1.

In addition, a protrusion IC-P may not be formed on the second surface (IC-f2) located on the opposite side of the first surface (IC-f1) in the interconnector (IC).

1 (a), the first surface (IC-f1) on which the projecting portion IC-P is formed is connected to the first solar cell CE1 or the second solar cell The first solar cell CE1 and the second solar cell CE2 can be connected so as to face the connection surface of the first solar cell CE1 and the second solar cell CE2.

The reason why the projecting portion IC-P is formed along the edge of the IC in only one side of the interconnector (IC) is due to the manufacturing process characteristic of the IC.

That is, the inter-connector (IC) can be formed in a specific pattern by cutting a plate-shaped material formed of a conductive material with a cutting press apparatus. At this time, the inter- (IC-P) can be formed along the edge of the inter-connector (IC) formed in a specific pattern when a plate-shaped material to be used as a projection lens (IC) is to be formed.

In FIG. 1 (b), an interconnector (IC) having a rectangular shape is shown as an example. Alternatively, the interconnector (IC) may have various shapes. However, the protrusions IC-P as described above can be formed along the edge of the interconnector IC at the most geographical end of the interconnector IC during the manufacturing process, whatever the shape of the interconnector IC is .

However, in the case where the thickness of the solar cell is small, the protrusion (IC-P) of the interconnector (IC) The battery may be damaged.

Accordingly, in order to prevent this, the solar cell module according to the present invention is arranged such that the protrusion (IC-P) is directed in the direction opposite to that of the first solar cell CE1 or the second solar cell CE2, ) And the second solar cell CE2.

1 (a), the present invention is characterized in that the second surface (IC-f2) of the interconnector (IC) is provided on the rear surface of the first solar cell CE1 and the second solar cell CE2 It can be connected by a conductive adhesive material such as solder.

Referring to FIG. 2, an interconnector (IC) may be connected to the first electrode C141 and the second electrode C142 of each solar cell. That is, the interconnector IC is connected to the first electrode C141 of the first solar cell CE1 and the second electrode C142 of the second solar cell CE2, or to the second electrode C142 of the first solar cell CE1 Electrode C142 of the second solar cell CE2 and the first electrode C141 of the second solar cell CE2.

2 shows an example in which the interconnector IC is connected to the end surfaces of the first electrode C141 of the first solar cell CE1 and the second electrode C142 of the second solar cell CE2 .

Here, the protrusion height (ICP) of the protrusion (IC-P) to the thickness (TIC) of the inter connector (IC) may be between 10: 1 and 3. Therefore, if the thickness TIC of the interconnection IC is, for example, 200 mu m, the protrusion height HICP of the protrusion IC-P can be formed between 20 mu m and 60 mu m.

The first electrode C141 and the second electrode C142 may be formed on the rear surface of the semiconductor substrate 110. The first electrode C141 and the second electrode C142 may be formed on the back surface of the semiconductor substrate 110, (TCE) of about 0.1 탆 to about 50 탆.

In the solar cell module according to the present invention, as described above, the projecting portion (IC-P) of the inter connector IC is connected to the connection surface of the first electrode C141 of the first solar cell CE1, May be connected to the first solar cell (CE1) and the second solar cell (CE2) so as to face the connection surface of the second electrode (C142) of the second solar cell (CE2).

Accordingly, in the solar cell module according to the present invention, the second surface (IC-f2) of the interconnector (IC) in which the projecting portion IC-P is not formed is connected to the first electrode C141 of the first solar cell CE1 And may be connected to the second electrode C142 of the second solar cell CE2.

This makes it possible to prevent the semiconductor substrate 110 from being damaged by the projecting portion IC-P of the interconnector IC when the interconnector IC is connected to each solar cell. That is, unlike the present invention, when the first surface (IC-f1) on which the projection IC-P of the interconnection IC is formed is connected to the first electrode C141 or the second electrode C142, IC may penetrate the first electrode C141 or the second electrode C142 to damage the semiconductor substrate 110. The present invention can prevent such a problem.

The present invention is also applicable to the case where the first electrode C141 is formed by the projecting portion IC-P by connecting the second surface (IC-f2) of the interconnector IC on which the projecting portion IC- And the adhesive force between the second electrode C142 and the inter connector IC can be further improved. Thus, the contact resistance between the interconnector (IC) and the solar cell can be further improved.

Hereinafter, an example of a solar cell applied to the solar cell module according to the present invention will be described.

FIG. 3 is an example of a partial perspective view of a solar cell applied to the solar cell module shown in FIG. 1, and FIG. 4 is a cross-sectional view of a solar cell according to a third embodiment of the present invention in which the pattern of the first electrode C141 and the second electrode C142 Fig.

3, an example of a solar cell according to the present invention includes a semiconductor substrate 110, an antireflection film 130, an emitter section 121, a back surface field (BSF) 172, a first electrode (C141) and a second electrode (C142).

Here, the antireflection film 130 and the backside electrical part 172 may be omitted. Hereinafter, the antireflection film 130 and the backside electrical part 172 will be described with reference to FIG. 3 as an example.

The semiconductor substrate 110 may be a semiconductor substrate 110 of a first conductivity type, for example, n-type conductivity type silicon. The semiconductor substrate 110 may be formed by doping a first conductivity type impurity into a wafer formed of a silicon material.

The emitter portions 121 are spaced apart from each other in the rear surface of the semiconductor substrate 110 facing the front surface, and extend in a direction parallel to each other. The plurality of emitter portions 121 may be a second conductive type which is opposite to the conductive type of the semiconductor substrate 110.

The plurality of emitter portions 121 may be disposed in the same direction as the plurality of emitter portions 121. The plurality of emitter portions 121 may be spaced apart from each other in a direction parallel to the emitter portions 121, have. Accordingly, as shown in FIGS. 3 and 2, a plurality of emitter portions 121 and a plurality of rear electric sections 172 may be alternately arranged on a rear surface of the semiconductor substrate 110. [

The plurality of rear electric fields 172 are impurities, for example, n ++ parts, which contain impurities of the same conductivity type as that of the semiconductor substrate 110 at a higher concentration than the semiconductor substrate 110.

The first electrode C141 may be physically and electrically connected to the emitter section 121 and may be formed on the rear surface of the semiconductor substrate 110 along the emitter section 121. [

The first electrode C141 may include a plurality of first finger electrodes C141F and a first electrode C141 pad C141P as shown in FIG.

Here, the plurality of first finger electrodes C141F may be spaced apart from each other along the plurality of emitter portions 121 on the rear surface of the semiconductor substrate 110. The first finger electrode C141F may also be formed along the first direction x when the plurality of emitter portions 121 are formed along the first direction x and the plurality of emitter portions 121 may be formed along the first direction x. When formed along the second direction y, the first finger electrode C141F may also be formed along the second direction y.

The first electrode (C141) pad (C141P) is formed at the rear end of the semiconductor substrate (110) in a second direction (y) intersecting with the plurality of first finger electrodes (C141F) (C141F), and the other end thereof may be connected to the interconnector (IC).

The plurality of second electrodes C142 are physically and electrically connected to the semiconductor substrate 110 through the rear electric part 172 and are electrically connected to the rear surface of the semiconductor substrate 110 along the plurality of rear electric parts 172 .

Here, on the rear surface of the semiconductor substrate 110, the first electrode C141 and the second electrode C142 may be physically separated from each other and electrically isolated.

The second electrode C142 may include a plurality of second finger electrodes C142F and a second electrode C142 pad C142P.

Here, the plurality of second finger electrodes C142F may be formed on the rear surface of the semiconductor substrate 110 along the plurality of rear electric fields 172. The second finger electrode C142F may be spaced apart from the plurality of first electrodes C141 and may be formed in the first direction x, The plurality of second finger electrodes C142F may be spaced apart from the plurality of first electrodes C141 and may be formed in a second direction y, .

The second electrode (C142) pad (C142P) is formed on the rear end of the semiconductor substrate (110) in a second direction (y) intersecting the plurality of second finger electrodes (C142F) (C142F), and the other end thereof may be connected to the interconnector (IC).

The holes collected through the first electrode (C141) and the electrons collected through the second electrode (C142) in the solar cell according to the present invention manufactured using the above structure are used as electric power of the external device through the external circuit device .

As described above with reference to FIG. 4, a plurality of solar cells having such a structure are electrically connected to the first electrode (C141) pad (C141P) or the second electrode (C142) pad (C142P) IC) in a first direction (x).

1 and 2, the interconnection IC has a protrusion IC-P on the connection surface of the pad C141P of the first electrode C141 or the pad C142P of the second electrode C142, And may be connected to the first electrode (C141) pad (C141P) or the second electrode (C142) pad (C142P) so as to face in the opposite direction.

Accordingly, in the solar cell module according to the present invention, the second surface (IC-f2) of the interconnector (IC) in which the projecting portion IC-P is not formed is connected to the first electrode C141 pad C141P or the second electrode C142) pad C142P.

In the solar cell module according to the present invention, the auxiliary electrode is further formed on the rear surface of the semiconductor substrate 110. In the solar cell module according to the present invention, Which will be described below.

5 and 6 are views for explaining an example of connection of an interconnector (IC) when each solar cell has an auxiliary electrode in the solar cell module according to the present invention.

5, each of the first solar cell CE1 and the second solar cell CE2 in the solar cell module according to the present invention includes a semiconductor substrate having a first electrode C141 and a second electrode C142 formed thereon, And the insulating member 200 having the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the insulating substrate 110. The semiconductor substrate 110 and the insulating member 200 are connected to each other, An integral individual element can be formed.

Hereinafter, an example in which the semiconductor substrate 110 and the insulating member 200 are connected to each other to form one integral individual element will be described in detail with reference to FIG.

When a solar cell in which a semiconductor substrate 110 and an insulating member 200 are individually connected to a solar cell module to form a single unitary discrete element is applied, the interconnector (IC) according to the present invention has a protrusion IC-P are connected to the first solar cell CE1 and the second solar cell CE2 so as to face the connection surface of the first auxiliary electrode P141 or the connection surface of the second auxiliary electrode P142 .

Here, the connection surface of the first auxiliary electrode P141 or the second auxiliary electrode P142 means one surface on which the interconnector IC is connected to the first auxiliary electrode P141 or the second auxiliary electrode P142.

Therefore, when the interconnector IC is connected to the front surface of the first auxiliary electrode P141 or the second auxiliary electrode P142, the connection surface may be the front surface, and the interconnector IC may be connected to the first auxiliary electrode P141 ) Or the rear surface of the second auxiliary electrode P142, the connection surface may be the rear surface.

Therefore, in the solar cell module according to the present invention, the second surface (IC-f2) of the interconnector (IC) in which the projecting portion IC-P is not formed is electrically connected to the end surface of the first auxiliary electrode P141, (P142).

Accordingly, when the interconnector IC is connected to one surface of the first auxiliary electrode P141 of each solar cell or one surface of the second auxiliary electrode P142, the adhesion with the interconnector IC can be further improved . Thus, the contact resistance between the interconnector (IC) and the solar cell can be further improved.

5 illustrates a case where the insulating member 200 is provided in each solar cell and the interconnector IC is connected to the entire surface of the first auxiliary electrode P141 or the entire surface of the second auxiliary electrode P142. The insulating member 200 may be removed after the insulating member 200 is integrally formed on the semiconductor substrate 110 before the interconnection IC is connected.

6, the interconnector IC may be connected to the rear surface of the first auxiliary electrode P141 or the rear surface of the second auxiliary electrode P142.

6, the interconnector IC is arranged such that the protruding portion IC-P faces the reverse side of the first auxiliary electrode P141 or the rear side of the second auxiliary electrode P142, CE1 and the second solar cell CE2. Thus, the contact resistance between the interconnector (IC) and the solar cell can be further improved.

In the following Figs. 7 to 11C, the solar cell applied to Fig. 5 will be described as an example.

FIGS. 7 to 11C are views for explaining an example of a solar cell applied to the solar cell module shown in FIG.

7 is a cross-sectional view taken along line 8-8 of FIG. 7, and FIG. 9 is a cross-sectional view taken along line 8-8 of FIG. 7. FIG. FIG. 10 is a view for explaining an example of electrode patterns of the semiconductor substrate 110 and the insulating member 200 to be individually connected to each other in the solar cell shown in FIG. 8. FIG. 10 is a cross- FIG. 11A is a cross-sectional view taken along line 11A-11A in FIG. 10, FIG. 11B is a cross-sectional view taken along line 11B-11B in FIG. 10 And Fig. 11C is a cross-sectional view taken along line 11c-11c in Fig.

7 and 8, an example of a solar cell according to the present invention includes a semiconductor substrate 110, an emitter section 121, a rear electric section 172, a plurality of first electrodes A first auxiliary electrode P141, a second auxiliary electrode P142 and an insulating member 200 in addition to the first electrode C141 and the plurality of second electrodes C142.

Here, the semiconductor substrate 110, the antireflection film 130, the emitter section 121, and the rear electric field section 172 are the same as those described with reference to FIGS.

4, the first electrode C141 includes a first finger electrode C141F and a first electrode C141P pad C141P, a second electrode C142 includes a second finger electrode C142, The first electrode C141 and the second electrode C142 are provided with the first electrode C141 and the second electrode C142 and the second electrode C142 and the pad C142P. However, as shown in FIG. 9A, The pad C141P and the pad C142P of the second electrode C142 may be omitted.

In addition, the thickness of the first electrode C141 and the second electrode C142 in the solar cell shown in FIGS. 7 to 11C may be, for example, about 50 nm to 200 nm.

9 (c), the first auxiliary electrode P141 includes a first connection part PC141 and a first pad part PP141, wherein the first connection part PC141 is connected to the first pad part PP141, 9, the first pad portion PP141 is connected to a plurality of first electrodes C141 as shown in FIG. 9 (c). One end of the first pad portion PP141 is connected to the end of the first connection portion PC141 And the other end can be connected to the inter-connector (IC). The first pad portion PP141 will be described in more detail with reference to FIG.

The second auxiliary electrode P142 may include a second connecting portion PC142 and a second pad portion PP142 as shown in FIG. 9 (c). 7 and 8, the second connection part PC 142 is connected to the plurality of second electrodes C 142, and the second pad part PP 142 is connected to the plurality of second electrodes C 142, as shown in FIG. 9 (c) Similarly, one end may be connected to the end of the second connection unit (PC 142), and the other end may be connected to the interconnector (IC). The second pad portion PP142 will be described in more detail with reference to FIG.

The first auxiliary electrode P141 and the second auxiliary electrode P142 may be formed of at least one of Cu, Au, Ag and Al. The first auxiliary electrode P141 and the second auxiliary The thickness of the electrode P142 may be, for example, between 20um and 60um.

The first auxiliary electrode P141 may be electrically connected to the first electrode C141 through an electrically conductive electrode coupling material ECA and the second auxiliary electrode P142 may be electrically connected to the electrode coupling material ECA To the second electrode (C142).

The material of the electrode connection material (ECA) is not particularly limited as long as it is a conductive material, but a conductive material having a melting point of 130 ° C to 250 ° C, which is a relatively low temperature, is more preferable. In addition, the material of the IC connector (ICA) may be the same as that of the electrode connector (ECA).

An insulating layer IL for preventing a short circuit may be disposed between the first electrode C141 and the second electrode C142 and between the first auxiliary electrode P141 and the second auxiliary electrode P142 . The insulating layer IL may be an epoxy resin.

7 and 8, the first connection C141 of the first auxiliary electrode P141 overlaps with the first connection C141 of the first auxiliary electrode P141, and the first connection C141 of the second auxiliary electrode P142 overlaps the first connection C141 of the first auxiliary electrode P141. The first electrode C141 and the second connecting portion PC142 of the second auxiliary electrode P142 may overlap each other and the second electrode C142 may overlap with the second connecting portion PC142. And the first connection unit (PC141) of the first auxiliary electrode (P141) may be overlapped with each other. In this case, between the first electrode C141 and the second connection unit PC 142 of the second auxiliary electrode P142 and between the second electrode C142 and the first connection unit PC141 of the first auxiliary electrode P141 An insulating layer (IL) may be located to prevent shorting.

The insulating member 200 may be disposed on the rear surface of the first auxiliary electrode P141 and the second auxiliary electrode P142.

The melting point of the insulating member 200 is preferably not less than 300 DEG C, more preferably not less than 300 DEG C, more preferably not less than 300 DEG C, As shown in Fig. More specifically, it may be formed of at least one material selected from the group consisting of heat resistant polyimide, epoxy-glass, polyester, and BT (bismaleimide triazine) resin.

Such an insulating member 200 may be formed in the form of a flexible film or in the form of a hard plate rather than a flexible one.

In the solar cell according to the present invention, a first auxiliary electrode P141 and a second auxiliary electrode P142 are formed in advance on the entire surface of the insulating member 200, and a plurality of first electrodes The insulating member 200 and the semiconductor substrate 110 may be connected to each other to form a single discrete element in a state in which the plurality of second electrodes C141 and the plurality of second electrodes C142 are formed in advance.

That is, there may be one semiconductor substrate 110 attached to and connected to one insulating member 200, and one insulating member 200 and one semiconductor substrate 110 are attached to each other to form one integrated type So that one solar cell can be formed.

As described above, when the solar cell is formed as one integrated type element by attaching one insulating member 200 and one semiconductor substrate 110 to each other, a plurality of first electrodes (not shown) formed on the rear surface of the semiconductor substrate 110, An example of the pattern of the first electrode C141 and the plurality of second electrodes C142 and an example of the patterns of the first auxiliary electrode P141 and the second auxiliary electrode P142 formed on the entire surface of the insulating member 200 As follows.

9A is a view for explaining an example of a pattern of the first electrode C141 and the second electrode C142 disposed on the rear surface of the semiconductor substrate 110. FIG 9B is a cross- 9C is a sectional view taken along the line 9 (b) -9 (b) in FIGS. 9A to 9C. FIG. 9C is a sectional view of the first auxiliary electrode P141 and the second auxiliary electrode P142 disposed on the front surface of the insulating member 200, 9 (d) is a cross-sectional view taken along line 9 (d) -9 (d) in FIG. 9 (c).

A front surface of one insulating member 200 as shown in FIGS. 9 (c) and 9 (d) is formed on the rear surface of one semiconductor substrate 110 as shown in FIGS. 9 (a) and 9 (b) By attaching and connecting, the solar cell according to the present invention can form one integrated discrete element. That is, the insulating member 200 and the semiconductor substrate 110 may be bonded or attached at a ratio of 1: 1.

9A and 9B, a plurality of first electrodes C141 and a plurality of second electrodes C141 are formed on the rear surface of the semiconductor substrate 110 of the solar cell illustrated in FIGS. 7 and 8, (C142) may be spaced apart from each other and elongated in the first direction (x).

9 (c) and 9 (d), the first auxiliary electrode P141 and the second auxiliary electrode P142 may be formed on the front surface of the insulating member 200 according to the present invention .

Here, as described above, the first auxiliary electrode P141 includes the first connecting portion PC141 and the first pad portion PP141, and the first connecting portion PC141, May be elongated in the first direction x. The first pad portion PP141 may be elongated in the second direction y and may have one end connected to the end of the first connection portion PC141, And can be connected to an inter-connector (IC).

In addition, the second auxiliary electrode P142 also includes a second connecting portion PC142 and a second pad portion PP142. As shown in FIG. 9C, the second connecting portion PC142 includes a first connecting portion The second pad portion PP142 may be formed to be elongated in the second direction y and may have one end connected to the end of the second connection portion PC142, And the other end can be connected to the inter-connector (IC).

Here, the first connection portion PC141 and the second pad portion PP142 may be spaced from each other, and the second connection portion PC142 and the first pad portion PP141 may be spaced apart from each other.

Therefore, on the front surface of the insulating member 200, the first pad portion PP141 may be formed at one end of the both ends of the first direction x and the second pad portion PP142 may be formed at the other end thereof.

As described above, in the solar cell according to the present invention, only one insulating member 200 is coupled to one semiconductor substrate 110 to form one integrated individual element, thereby making it easier to manufacture the solar cell module, Even if the semiconductor substrate 110 included in one of the solar cells is broken or defects are generated during the manufacturing process of the solar cell module, only the corresponding solar cell formed by one integrated type individual element can be replaced and the process yield can be further improved have.

In addition, the solar cell formed by the single integrated device can minimize the thermal stress applied to the semiconductor substrate 110 during the manufacturing process.

Here, when the area of the insulating member 200 is equal to or larger than the area of the semiconductor substrate 110, an interconnector (IC) may be attached to the front surface of the insulating member 200 when the solar cell and the solar cell are connected to each other It is possible to secure a sufficient area. For this, the area of the insulating member 200 may be larger than the area of the semiconductor substrate 110.

The rear surface of the semiconductor substrate 110 and the front surface of the insulating member 200 are adhered to each other so that the first electrode C141 and the first auxiliary electrode P141 are connected to each other and the second electrode C142 and the second The auxiliary electrode P142 may be connected to each other.

As described above, an example in which the solar cell is formed by combining only one insulating member 200 on one semiconductor substrate 110 and forming one integrated discrete element is as follows.

As shown in FIG. 10, one semiconductor substrate 110 may be completely overlapped with one insulating member 200 to form one solar cell individual element.

11A, the first electrode C141 formed on the rear surface of the semiconductor substrate 110 and the first connection portion PC141 formed on the front surface of the insulating member 200 are overlapped with each other, (ECA). ≪ / RTI >

The second electrode C142 formed on the rear surface of the semiconductor substrate 110 and the second connection part PC142 formed on the front surface of the insulating member 200 are overlapped with each other and electrically connected to each other by the electrode connector ECA. have.

The spacing between the first electrode C141 and the second electrode C142 may be filled with an insulating layer IL and the spacing between the first connecting portion PC141 and the second connecting portion PC 142 The insulating layer IL may be filled.

11B, the insulating layer IL may be filled in the spaced space between the second connection portion PC 142 and the first pad portion PP141. As shown in FIG. 11C, The insulating layer IL may be filled in the spaced space between the connection portion PC141 and the second pad portion PP142.

10, each of the first pad portion PP141 and the second pad portion PP142 includes first regions PP141-S1 and PP142-S1 overlapping the semiconductor substrate 110, And a second region PP141-S2, PP142-S2 that do not overlap with the substrate 110. [

As described above, the second region PP141-S2 of the first pad portion PP141 and the second region PP142-S2 of the second pad portion PP142, which are provided for securing a space to be connected to the interconnector IC, (IC) can be connected.

Since the first pad portion PP141 and the second pad portion PP142 according to the present invention include the second regions PP141-S2 and PP142-S2, the interconnector IC can be connected more easily, In addition, thermal expansion stress on the semiconductor substrate 110 can be minimized when the interconnector (IC) is connected.

In addition, as described above, in order to connect a plurality of solar cells, an interconnector (IC) may be connected to the first pad portion PP141 or the second pad portion PP142, The first solar cell CE1 is arranged such that the projecting portion IC-P is directed in the opposite direction to the connection surface of the first pad portion PP141 or the connection surface of the second pad portion PP142, ) And the second solar cell CE2. Thus, the connection resistance of the interconnector (IC) can be minimized.

6, if the protrusion IC-P is formed on the rear surface of the first pad portion PP141 or on the rear surface of the first pad portion PP141, as shown in FIG. 6, 2 pad unit PP142.

At this time, the interconnection IC is connected to the first solar cell CE1 and the second solar cell unit PP142 so that the projecting portion IC-P is directed in the opposite direction to the connection surface of the first pad portion PP141 or the second pad portion PP142. 2 solar cell CE2.

The first electrode C141 and the second electrode C142 formed on the semiconductor substrate 110 are overlapped in the direction parallel to the first connecting portion PC141 and the second connecting portion PC142 formed on the insulating member 200, The first electrode C141 and the second electrode C142 formed on the semiconductor substrate 110 are electrically connected to the first connection portion PC141 and the second connection portion PC142 formed on the insulating member 200, In the direction intersecting with the direction of the arrows.

In addition, as shown in the drawing, the first connection unit PC141 and the second connection unit PC142 may not be formed in plural, but may be formed as a single tubular electrode, and a plurality of first electrodes C141 and / And the second electrode C142 may be connected.

The first auxiliary electrode P141 and the second auxiliary electrode P142 may be formed in the solar cell according to the present invention. In this case, protrusions may be formed at the ends of the first and second auxiliary electrodes P141 and P142, respectively.

The protrusions of the first auxiliary electrode P141 and the second auxiliary electrode P142 may also occur due to the characteristics of the manufacturing process as described with reference to FIGS.

In the case where the first auxiliary electrode P141 and the second auxiliary electrode P142 have protrusions as described above, the structure of the solar cell will be described as follows.

FIGS. 12 to 14D are views for explaining another example of a solar cell applied to the solar cell module shown in FIG.

12 illustrates an example of patterns of the first electrode C141, the second electrode C142, the first auxiliary electrode P141, and the second auxiliary electrode P142 in the solar cell according to another example of the present invention 13 is a view for explaining a state in which the first auxiliary electrode P141 and the second auxiliary electrode P142 are connected to the semiconductor substrate 110 shown in FIG. 12, and FIG. 14A is a cross- Fig. 14B is a cross-sectional view taken along the line 14B-14B in Fig. 13, and Fig. 14C is a cross-sectional view taken along line 14C-14C in Fig.

The patterns of the first electrode C141 and the second electrode C142 formed on the back surface of the semiconductor substrate 110 shown in FIGS. 12A and 12B are the same as those described with reference to FIG.

As described above, when the first connection part PC141 and the second connection part PC142 are formed as one barrel electrode, for example, they may be formed as shown in FIGS. 12C and 12D.

12 (c), the first auxiliary electrode P141 and the second auxiliary electrode P142 may be spaced apart from each other by a distance GP1. In this case, the back surface of the semiconductor substrate 110 shown in Figs. 2A and 2B can be connected.

In addition, since the second auxiliary electrode P142 including the first auxiliary electrode P141 and the second auxiliary electrode P142 including the first connecting portion PC141 is formed as a single tubular electrode, In order to form the pattern of the electrode P141 and the second auxiliary electrode P142, the pattern may be formed in a specific pattern by a cutting press apparatus as described above with reference to FIGS.

Therefore, as shown in FIG. 12 (d), the projection PP is also formed around the edge of the first surface of each of the first auxiliary electrode P141 and the second auxiliary electrode P142, .

The thickness TC of the first electrode C141 and the second electrode C142 may be about 50 nm to 200 nm and the thickness T14 of the first auxiliary electrode P141 and the thickness of the second auxiliary electrode P142 For example, between 20 um and 60 um, and the protrusion height HICP of the protrusion PP may be formed between 2 um and 18 um, for example.

When the first auxiliary electrode P141 and the second auxiliary electrode P142 are connected to the rear surface of the semiconductor substrate 110 such that the protruding portion PP faces the semiconductor substrate 110, The adhesive force between the first and second auxiliary electrodes P141 and P142 and the contact resistance between the first and second auxiliary electrodes P141 and P142 may become excessively large and the semiconductor substrate 110 may be damaged.

Therefore, in order to minimize the damage of the semiconductor substrate 110 by the projecting portions PP formed on the first auxiliary electrode P141 and the second auxiliary electrode P142, The first auxiliary electrode P141 and the second auxiliary electrode P142 are connected to the rear surface of the semiconductor substrate 110 such that the protruding portion PP is directed in the direction opposite to the semiconductor substrate 110 as shown in FIG. .

Therefore, when the first and second auxiliary electrodes P141 and P142 are bonded to the rear surface of the semiconductor substrate 110, damage to the semiconductor substrate 110 by the protruding portion PP can be minimized.

This will be described in more detail with reference to FIGS. 13 to 14D as follows.

 The first auxiliary electrode P141 and the second auxiliary electrode P142 formed as a single tube electrode may be connected to the rear surface of the semiconductor substrate 110 as shown in FIG.

13, 14A, and 14C, in the region where the second auxiliary electrode P142 is formed, the second connecting portion PC142 and the second electrode C142 are connected to each other by the electrode connecting material ECA And an insulating layer IL may be formed between the second connection part PC 142 and the first electrode C141.

13, 14B and 14D, in the region where the first auxiliary electrode P141 is formed, the first connecting portion PC141 and the first electrode C141 are connected to each other by the electrode connecting material ECA And an insulating layer IL may be formed between the first connection part PC141 and the second electrode C142.

14A to 14D, the protrusions PP formed on the first auxiliary electrode P141 and the second auxiliary electrode P142 are arranged in a direction opposite to the semiconductor substrate 110, And two auxiliary electrodes P141 and P142 may be connected to the semiconductor substrate 110. [

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (10)

1. A solar cell comprising: a semiconductor substrate; a first solar cell and a second solar cell including a first electrode and a second electrode spaced apart from each other on a rear surface of the semiconductor substrate; And
And an interconnector electrically connecting the first solar cell and the second solar cell to each other,
A protrusion protruding from the first surface of the interconnector is formed around the edge of the first surface of the interconnector,
Wherein the interconnector is connected to the first solar cell and the second solar cell such that the first surface formed with the protrusion is directed in a direction opposite to the connection surface of the first solar cell or the second solar cell. The method according to claim 1,
And the protrusion is not formed on a second surface of the interconnector which is opposite to the first surface. 3. The method of claim 2,
And the second surface of the interconnector is connected to the rear surface of the first solar cell and the second solar cell. The method according to claim 1,
The inter-
A first electrode of the first solar cell and a second electrode of the second solar cell,
And a second electrode of the first solar cell and a first electrode of the second solar cell. 5. The method of claim 4,
And the interconnection is connected to the first electrode or the second electrode so that the protrusion is directed in a direction opposite to the connection surface of the first electrode or the second electrode. The method according to claim 1,
Wherein a protrusion height of the protrusion is between 10: 1 and 3 with respect to a thickness of the interconnector. Wherein each of the first solar cell and the second solar cell
A first auxiliary electrode connected to the plurality of first electrodes, and a second auxiliary electrode connected to the plurality of second electrodes,
Wherein the interconnector is connected to the first solar cell and the second solar cell such that the projecting portion faces the connection surface of the first auxiliary electrode or the connection surface of the second auxiliary electrode. 8. The method of claim 7,
Wherein the first electrode, the first auxiliary electrode, the second electrode, and the second auxiliary electrode are connected to each other by a conductive electrode material. 8. The method of claim 7,
Wherein the interconnector is connected to a first auxiliary electrode of the first solar cell or a second auxiliary electrode of the second solar cell. A semiconductor substrate;
A plurality of first electrodes and a plurality of second electrodes formed on a rear surface of the semiconductor substrate; And
A first auxiliary electrode connected to the plurality of first electrodes and a second auxiliary electrode connected to the plurality of second electrodes,
Wherein protrusions are formed around edge portions of the first auxiliary electrode and the second auxiliary electrode, respectively,
Wherein each of the first auxiliary electrode and the second auxiliary electrode is connected to the rear surface of the semiconductor substrate so that the protruding portion is directed in a direction opposite to the connection surface of the semiconductor substrate.

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