JP2010087932A - Integrated circuit for piezoelectric device, and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized and inexpensive piezoelectric device. <P>SOLUTION: In an integrated circuit 100 for a piezoelectric device with at least a circuit for controlling a piezoelectric vibrating reed formed on a semiconductor substrate, on a circuit formation surface of the integrated circuit 100, a terminal 102 for piezoelectric vibrating reed connection is formed for connecting the piezoelectric vibrating reed and the integrated circuit and on a surface opposite to the circuit formation surface of the integrated circuit 100, a mounting terminal 105 for mounting the piezoelectric vibrating reed is formed while being electrically connected with the terminal 102 for piezoelectric vibrating reed connection by a through-electrode 106 passed through the semiconductor substrate. The terminal 102 for piezoelectric vibrating reed connection and the mounting terminal 105 are disposed while facing each other on a straight line perpendicular to the integrated circuit formation surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an integrated circuit used in a piezoelectric device and a piezoelectric device.

  Conventionally, a piezoelectric device such as a piezoelectric oscillator generally has a structure in which a piezoelectric resonator and an integrated circuit for control are loaded in a cavity of a package in which ceramic sheets are laminated. In order to cope with the price increase, a configuration in which a piezoelectric vibrator is directly fixed to a control integrated circuit and loaded in a package has been proposed.

The integrated circuit used in this configuration has a mounting terminal for mounting the piezoelectric vibrator on the back surface and a piezoelectric vibrator connecting terminal on the integrated circuit surface, and further between the mounting terminal and the connecting terminal. A through-hole wiring for providing electrical continuity is provided (for example, see Patent Document 1).
As another example of the above configuration, a cavity for mounting the piezoelectric vibrator is formed on the back surface of the integrated circuit, and a wiring is provided between the cavity and the integrated circuit surface, so that the electrical conduction between the piezoelectric vibrator and the integrated circuit is achieved. The piezoelectric oscillator which comprises a piezoelectric device by taking is developed (for example, refer patent document 2).

JP-A-2005-311769 JP 2004-214787 A

  However, in the integrated circuit having the above configuration, in order to effectively use the circuit formation area of the integrated circuit, the piezoelectric vibrator connection terminals formed on the circuit forming surface of the integrated circuit are arranged on the outer periphery of the integrated circuit (along each side of the integrated circuit). A piezoelectric vibrator mounting terminal formed on one surface of the integrated circuit and a piezoelectric vibrator connecting terminal formed on the other surface of the integrated circuit surface. There is a problem that a wiring for obtaining electrical continuity becomes long, and a process and a cost for manufacturing a device increase.

  The present invention has been made to solve the above problems and to provide a small and low-cost piezoelectric device.

  In an integrated circuit for a piezoelectric device in which a circuit for controlling at least a piezoelectric vibrating piece is formed on a semiconductor substrate, a piezoelectric vibrating piece connection for connecting the piezoelectric vibrating piece and the integrated circuit is provided on a circuit forming surface of the integrated circuit. For mounting the piezoelectric vibrating reed on the surface facing the circuit forming surface of the integrated circuit, which is electrically connected to the piezoelectric vibrating reed connecting terminal by a through electrode penetrating the semiconductor substrate. The piezoelectric vibrating piece connecting terminal and the mounting terminal are formed as an integrated circuit for a piezoelectric device that is disposed to face each other on a vertical straight line on the integrated circuit forming surface. .

  Further, the piezoelectric vibrating reed connection terminal is an integrated circuit for a piezoelectric device larger than the diameter of the through electrode.

  In a piezoelectric device in which a piezoelectric vibrating piece is connected to an integrated circuit in which an oscillation circuit for controlling at least the piezoelectric vibrating piece is formed on a semiconductor substrate, the piezoelectric vibrating piece and the integrated circuit are connected to a circuit forming surface of the integrated circuit. A piezoelectric vibrating reed connecting terminal is formed, and a surface facing the circuit forming surface of the integrated circuit is electrically connected to the piezoelectric vibrating reed connecting terminal by a through electrode penetrating the semiconductor substrate, A mounting terminal for mounting the piezoelectric vibrating piece is formed, and the piezoelectric vibrating piece connecting terminal and the mounting terminal are arranged to face each other on a vertical straight line on the integrated circuit forming surface, The piezoelectric device is formed by mounting a piezoelectric device on the mounting terminal.

  Further, the piezoelectric vibrating piece connecting terminal is a piezoelectric device larger than the diameter of the through electrode.

  Further, a plurality of user electrode connection terminals connected to the integrated circuit are formed on the circuit forming surface of the integrated circuit, and the wiring is electrically connected to the integrated circuit and an insulating film on the integrated circuit. A wiring layer is formed, and a plurality of user electrodes connected to each one of the plurality of user electrode connection terminals via a predetermined wiring of the wiring layer are formed on the wiring layer, and The piezoelectric vibrating piece connecting terminal is a piezoelectric device arranged at a position where shadows do not overlap each other when projected onto a plane parallel to the circuit forming surface of the integrated circuit.

  Furthermore, the user electrode connection terminal and the user electrode that are connected to each other are piezoelectric devices that are arranged to face each other on a straight line perpendicular to the integrated circuit formation surface.

  In addition, a plurality of input / output electrode connection terminals connected to the integrated circuit are formed on a circuit formation surface of the integrated circuit, and wiring and an insulating film electrically connected to the integrated circuit on the integrated circuit A plurality of input / output electrodes connected to each one of the plurality of input / output electrode connection terminals via a predetermined wiring of the wiring layer, and the plurality of input / output electrodes. A plurality of wirings connected to one electrode each is a piezoelectric device in which shadows of the respective wirings do not overlap when projected onto a plane parallel to the circuit formation surface of the integrated circuit.

  According to the present invention, it becomes possible to connect the piezoelectric vibrating piece connecting terminal and the piezoelectric vibrating piece mounting terminal by the shortest path, and the man-hour and cost required for manufacturing the piezoelectric device are greatly reduced as compared with the prior art. Therefore, it is possible to provide a small and low-cost piezoelectric device.

  Hereinafter, the best mode for carrying out the present invention will be specifically described with reference to the drawings.

[First Embodiment: FIG. 1]
1A and 1B are diagrams illustrating an integrated circuit according to a first embodiment, in which FIG. 1A is a front view and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1, reference numeral 100 denotes an integrated circuit, and the integrated circuit 100 is formed with a circuit pattern 101 for controlling a piezoelectric vibrating piece on one surface of a semiconductor substrate. The circuit pattern 101 includes a piezoelectric vibrating piece connecting terminal 102 and a user. Electrode connection terminals 103 and data write electrode connection terminals 104 are formed. In addition, a piezoelectric vibrating reed mounting terminal 105 is formed on a surface of the integrated circuit 100 that faces the surface on which the circuit pattern 101 is formed. The piezoelectric vibrating reed connecting terminal 102 and the piezoelectric vibrating reed mounting terminal 105 are formed in the semiconductor substrate. They are electrically connected by a through electrode 106 that penetrates.
The user electrode connection terminal 103 is a terminal for connecting to an electrode such as a power source or a signal output used by the user when the piezoelectric device is configured. The data write electrode connection terminal 104 is used for applications such as writing temperature compensation data to an integrated circuit when the piezoelectric device is a temperature compensation type, and is manufactured in a memory in the integrated circuit to improve the performance of the piezoelectric device. This terminal is provided when it is necessary to write data in the process.

  In the conventional integrated circuit for piezoelectric devices, the piezoelectric vibrating reed connection terminal 102 is arranged at the periphery of the integrated circuit 100 like the other terminals. In the present invention, this piezoelectric vibrating reed connecting terminal 102 is connected to the back surface of the integrated circuit 100. The piezoelectric vibrating reed mounting terminal 105 is provided at approximately the center of the integrated circuit 100 (the piezoelectric vibrating reed connecting terminal 102 and the piezoelectric vibrating reed mounting terminal 105 are straight lines perpendicular to the circuit forming surface of the integrated circuit 100. The electrodes are electrically connected to each other through the through electrode 106. By adopting such a configuration, it becomes possible to connect the piezoelectric vibrating piece connecting terminal 102 and the piezoelectric vibrating piece mounting terminal 105 by the shortest path, which reduces the man-hour and cost required for manufacturing the piezoelectric device. It becomes possible to reduce significantly compared with. In addition, by reducing the number of wires, the number of connection points is reduced, and a higher quality piezoelectric device can be provided. Here, the arrangement of the piezoelectric vibrating reed mounting terminals 105 is determined by the size and shape of the piezoelectric vibrating reed, and in this embodiment, the piezoelectric vibrating reed mounting terminal 105 is positioned approximately at the center of the integrated circuit 100, but the present invention is not limited to this. Needless to say, the piezoelectric vibrating reed connecting terminals 102 and the piezoelectric vibrating reed mounting terminals 105 respectively formed on the front and back surfaces of the integrated circuit may be connected by the shortest path.

[Second Embodiment: FIGS. 2 and 3]
FIG. 2 is a diagram illustrating a piezoelectric device according to the second embodiment. In FIG. 2, 200 is an integrated circuit having a circuit pattern formed on a semiconductor substrate, 201 is a cavity, 202 is a piezoelectric vibrating piece, 203 is a circuit pattern of the integrated circuit 200, 206 is a wiring layer, and 207 is a user electrode. , 208 represents a lid.

As the piezoelectric device that can be realized with this configuration, any product can be used as long as it is a combination of a piezoelectric vibrator and an integrated circuit that controls the piezoelectric vibrator, such as a piezoelectric oscillator or a piezoelectric sensor.
The cavity 201 is formed by chemically or mechanically processing a surface facing the surface on which the circuit pattern 203 of the integrated circuit 200 is formed so that the piezoelectric vibrating piece 202 can be accommodated. The wiring layer 206 is obtained by forming an insulating film on the circuit pattern 203 and providing electrical wiring therein.
A piezoelectric vibrating piece connecting terminal 209 is provided immediately below the piezoelectric vibrating piece mounting terminal 204 (the piezoelectric vibrating piece connecting terminal 209 and the piezoelectric vibrating piece mounting terminal 204 are arranged on a straight line perpendicular to the circuit forming surface of the integrated circuit 100. By arranging them at the opposed positions, the connection between the vibrator piece connecting terminal 209 and the piezoelectric vibrating piece mounting terminal 204 can be made by the through electrode 205 through the shortest path.

  Further, by making the piezoelectric vibrating reed connecting terminal 209 larger than the diameter of the through electrode 205, the axial processing of the through electrode 205 can be performed with a sufficient condition, and the formation thereof can be facilitated. Further, the connection between the piezoelectric vibrating reed connecting terminal 209 and the piezoelectric vibrating reed mounting terminal 204 is performed only by the through electrode 205 perpendicular to the circuit forming surface of the integrated circuit 200, and there is no wiring process on a surface parallel to the circuit forming surface. Therefore, the processing for connecting the piezoelectric vibrating piece connecting terminal 209 and the piezoelectric vibrating piece connecting terminal 204 does not damage the integrated circuit pattern 203 other than the piezoelectric vibrating piece connecting terminal 209.

  FIG. 3 is a horizontal sectional view taken along line BB in FIG. In FIG. 3, reference numeral 301 denotes a vibrator electrode, 302 denotes a data write electrode, and 303 denotes a wiring arranged in a direction parallel to the circuit formation surface of the integrated circuit 200. The user electrode 207, the vibrator electrode 301, and the data write The electrode exposed on the outer surface of the piezoelectric device of the electrode 302 is indicated by a broken line. The vibrator electrode 301 is provided when it is necessary to inspect the characteristics of the piezoelectric vibrating piece 202 from the outside in a state where the piezoelectric device is completed.

The piezoelectric vibrating reed connecting terminal 209 connected to the piezoelectric vibrating reed 202 mounted on the back surface is very easily affected by external parasitic capacitance.
As shown in FIG. 3, when the piezoelectric vibrating reed connection terminal 209 and the user electrode 207 formed on the circuit formation surface of the integrated circuit 200 are projected on a plane parallel to the circuit formation surface of the integrated circuit 200, the shadows of each other are reflected. By disposing them at positions where they do not overlap, the parasitic capacitance generated between the piezoelectric vibrating piece connecting terminal 209 and the user electrode 207 can be reduced. Thereby, it is possible to minimize the influence on characteristics such as the oscillation frequency and the oscillation start time of the piezoelectric device.

Further, the user electrode connection terminal 103 and the user electrode 207 are arranged on a straight line perpendicular to the circuit formation surface of the integrated circuit 200, so that the user electrode connection terminal 103 and the user electrode 207 are connected with the shortest path. Wiring becomes possible.
In the present embodiment, the four user electrodes 207 of the piezoelectric device are arranged at the four corners of the piezoelectric device. Therefore, the user electrode connection terminals 103 are also provided at the four corners of the integrated circuit 200. In addition, when a large number of user electrodes 207 are required and the electrodes are placed, for example, in the center of the long side end of the integrated circuit 200, the user electrode connection terminals 103 may be provided immediately below the user electrodes.

  Further, the positional relationship between the piezoelectric vibrating reed connecting terminal 209 and the data write electrode connecting terminal 104 and the transducer electrode 301 and the data write electrode 302 is arranged at a position where no crossing occurs between the wirings during each wiring (integrated) The piezoelectric vibrator connecting terminal 209, the vibrator electrode 301, the data write electrode connecting terminal 104, and the like are arranged at positions where shadows do not overlap each other when projected onto a plane parallel to the circuit forming surface of the circuit 200. The wiring length of the wiring with the data write electrode 302 can be minimized, and only one wiring layer can be formed on the circuit pattern of the integrated circuit 200.

[Third Embodiment: FIG. 4]
FIG. 4 is a diagram illustrating a piezoelectric device according to the third embodiment.
In the piezoelectric device according to the second embodiment, the integrated circuit 200 is provided with the cavity 201 and the opening of the cavity 201 is covered with the flat lid 208. However, in the present embodiment, the flat plate is thinly cut. The integrated vibrating circuit 400 is covered with a lid 402 provided with a cavity 401 to seal the piezoelectric vibrating piece 202. Also in the present embodiment, the effects of the present invention can be obtained by making the configurations of various terminals and wirings of the integrated circuit 400 the same as those in the first and second embodiments.

The figure which shows the integrated circuit in 1st Embodiment. The figure explaining the piezoelectric device in 2nd Embodiment. The horizontal sectional view in the BB line of FIG. The figure explaining the piezoelectric device in 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Integrated circuit 101 Circuit pattern 102 Piezoelectric vibrating piece connection terminal 103 User electrode connecting terminal 104 Data write electrode connecting terminal 105 Piezoelectric vibrating piece mounting terminal 106 Through electrode 200 Integrated circuit 201 Cavity 202 Piezoelectric vibrating piece 203 Circuit pattern 204 Piezoelectric vibration Single mounting terminal 205 Through hole 206 Wiring layer 207 User electrode 208 Lid 209 Piezoelectric vibrating piece connection terminal 301 Vibrator electrode 302 Data write electrode 303 Wiring 400 Integrated circuit 401 Cavity 402 Lid

Claims (7)

In an integrated circuit for a piezoelectric device in which a circuit for controlling at least a piezoelectric vibrating piece is formed on a semiconductor substrate,
On the circuit forming surface of the integrated circuit, a piezoelectric vibrating piece connecting terminal for connecting the piezoelectric vibrating piece and the integrated circuit is formed,
A mounting terminal for mounting the piezoelectric vibrating reed is formed on the surface of the integrated circuit opposite to the circuit forming surface, which is electrically connected to the piezoelectric vibrating reed connecting terminal by a through electrode penetrating the semiconductor substrate. Has been
2. The piezoelectric device integrated circuit according to claim 1, wherein the piezoelectric vibrating reed connecting terminal and the mounting terminal are arranged to face each other on a straight line perpendicular to the integrated circuit forming surface.   2. The integrated circuit for a piezoelectric device according to claim 1, wherein the piezoelectric vibrating piece connecting terminal is larger than a diameter of the through electrode. In a piezoelectric device in which a piezoelectric vibrating piece is connected to an integrated circuit in which an oscillation circuit for controlling at least the piezoelectric vibrating piece is formed on a semiconductor substrate,
On the circuit forming surface of the integrated circuit, a piezoelectric vibrating piece connecting terminal for connecting the piezoelectric vibrating piece and the integrated circuit is formed,
A mounting terminal for mounting the piezoelectric vibrating reed is formed on the surface of the integrated circuit opposite to the circuit forming surface, which is electrically connected to the piezoelectric vibrating reed connecting terminal by a through electrode penetrating the semiconductor substrate. And
The piezoelectric vibrating reed connection terminal and the mounting terminal are arranged to face each other on a straight line perpendicular to the integrated circuit formation surface,
A piezoelectric device comprising a piezoelectric device mounted on the mounting terminal.   The piezoelectric device according to claim 3, wherein the piezoelectric vibrating piece connecting terminal is larger in diameter than the through electrode. A plurality of user electrode connection terminals connected to the integrated circuit are formed on a circuit forming surface of the integrated circuit, and a wiring made of an insulating film and a wiring electrically connected to the integrated circuit on the integrated circuit A layer is formed,
A plurality of user electrodes connected to each one of the plurality of user electrode connection terminals via a predetermined wiring of the wiring layer is formed on the wiring layer,
The said user electrode and the said piezoelectric vibrating piece connection terminal are arrange | positioned in the position where a mutual shadow does not overlap, when it projects on the plane parallel to the circuit formation surface of the said integrated circuit. 4. The piezoelectric device according to 4.   6. The user electrode connection terminal and the user electrode connected to each other are arranged opposite to each other on a straight line perpendicular to the integrated circuit formation surface. The piezoelectric device described. A plurality of input / output electrode connection terminals connected to the integrated circuit are formed on a circuit formation surface of the integrated circuit, and the wiring is electrically connected to the integrated circuit and an insulating film on the integrated circuit. A wiring layer is formed,
A plurality of input / output electrodes connected to each one of the plurality of input / output electrode connection terminals via a predetermined wiring of the wiring layer;
4. The plurality of wirings connected to each of the plurality of input / output electrodes, when projected onto a plane parallel to a circuit formation surface of the integrated circuit, do not overlap shadows of the wirings. The piezoelectric device according to any one of -6.

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