JP2010087425A5 - - Google Patents
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- Publication number
- JP2010087425A5 JP2010087425A5 JP2008257722A JP2008257722A JP2010087425A5 JP 2010087425 A5 JP2010087425 A5 JP 2010087425A5 JP 2008257722 A JP2008257722 A JP 2008257722A JP 2008257722 A JP2008257722 A JP 2008257722A JP 2010087425 A5 JP2010087425 A5 JP 2010087425A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- contact
- holding member
- substrate holding
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 32
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000002040 relaxant effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008257722A JP2010087425A (ja) | 2008-10-02 | 2008-10-02 | 基板保持部材および接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008257722A JP2010087425A (ja) | 2008-10-02 | 2008-10-02 | 基板保持部材および接合装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014053022A Division JP6044570B2 (ja) | 2014-03-17 | 2014-03-17 | 基板保持部材および接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010087425A JP2010087425A (ja) | 2010-04-15 |
| JP2010087425A5 true JP2010087425A5 (cg-RX-API-DMAC7.html) | 2012-05-17 |
Family
ID=42251058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008257722A Pending JP2010087425A (ja) | 2008-10-02 | 2008-10-02 | 基板保持部材および接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010087425A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012089623A (ja) * | 2010-10-18 | 2012-05-10 | Tokyo Electron Ltd | 押圧用アダプタ |
| JP2013102080A (ja) * | 2011-11-09 | 2013-05-23 | Disco Abrasive Syst Ltd | ウエーハの支持基板およびウエーハの加工方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6343327A (ja) * | 1986-08-11 | 1988-02-24 | Canon Inc | エピスパイククラツシユ装置 |
| JP4954663B2 (ja) * | 2005-10-17 | 2012-06-20 | 東京エレクトロン株式会社 | 貼り合せ装置 |
| JP2007300033A (ja) * | 2006-05-02 | 2007-11-15 | Hitachi Cable Ltd | ウェハ接合用ジグ及び発光素子用ウェハの製造方法 |
| JP5061515B2 (ja) * | 2006-06-29 | 2012-10-31 | 株式会社ニコン | ウェハ接合装置及びウェハ接合方法 |
-
2008
- 2008-10-02 JP JP2008257722A patent/JP2010087425A/ja active Pending
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