JP2010064220A5 - - Google Patents

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Publication number
JP2010064220A5
JP2010064220A5 JP2008234991A JP2008234991A JP2010064220A5 JP 2010064220 A5 JP2010064220 A5 JP 2010064220A5 JP 2008234991 A JP2008234991 A JP 2008234991A JP 2008234991 A JP2008234991 A JP 2008234991A JP 2010064220 A5 JP2010064220 A5 JP 2010064220A5
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JP
Japan
Prior art keywords
polishing
substrate
target
amplitude
polishing apparatus
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Application number
JP2008234991A
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English (en)
Japanese (ja)
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JP5301931B2 (ja
JP2010064220A (ja
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Priority to JP2008234991A priority Critical patent/JP5301931B2/ja
Priority claimed from JP2008234991A external-priority patent/JP5301931B2/ja
Publication of JP2010064220A publication Critical patent/JP2010064220A/ja
Publication of JP2010064220A5 publication Critical patent/JP2010064220A5/ja
Application granted granted Critical
Publication of JP5301931B2 publication Critical patent/JP5301931B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008234991A 2008-09-12 2008-09-12 研磨方法および研磨装置 Expired - Fee Related JP5301931B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008234991A JP5301931B2 (ja) 2008-09-12 2008-09-12 研磨方法および研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008234991A JP5301931B2 (ja) 2008-09-12 2008-09-12 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2010064220A JP2010064220A (ja) 2010-03-25
JP2010064220A5 true JP2010064220A5 (enrdf_load_stackoverflow) 2011-10-13
JP5301931B2 JP5301931B2 (ja) 2013-09-25

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ID=42190253

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JP2008234991A Expired - Fee Related JP5301931B2 (ja) 2008-09-12 2008-09-12 研磨方法および研磨装置

Country Status (1)

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JP (1) JP5301931B2 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
JP2016004903A (ja) 2014-06-17 2016-01-12 株式会社東芝 研磨装置、研磨方法、及び半導体装置の製造方法
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
CN106112810A (zh) * 2016-08-08 2016-11-16 泉州装备制造研究所 石材磨抛系统故障智能检测和分析方法和装置
KR102564376B1 (ko) * 2016-09-15 2023-08-04 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 스마트 링
JP7403213B2 (ja) * 2017-10-31 2023-12-22 株式会社荏原製作所 研磨装置、及び研磨方法
CN111263682A (zh) * 2018-03-13 2020-06-09 应用材料公司 化学机械抛光期间的振动的监测
CN112770872B (zh) 2018-08-31 2023-07-14 应用材料公司 具有电容式剪力传感器的抛光系统
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
JP7306054B2 (ja) * 2019-05-17 2023-07-11 Ａｇｃ株式会社 異常検知装置及び異常検知方法
JP7468856B2 (ja) * 2019-12-03 2024-04-16 株式会社荏原製作所 研磨装置および研磨方法
WO2021112034A1 (ja) * 2019-12-03 2021-06-10 株式会社荏原製作所 研磨装置および研磨方法
CN111002214B (zh) * 2019-12-25 2021-08-06 唐山万士和电子有限公司 一种压电石英晶片凸面研磨频率实时监测装置
JP2021141255A (ja) 2020-03-06 2021-09-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP2021144972A (ja) 2020-03-10 2021-09-24 キオクシア株式会社 半導体製造装置
JP2024526637A (ja) * 2021-07-06 2024-07-19 アプライド マテリアルズ インコーポレイテッド 光学センサを用いた化学機械研磨振動測定
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
JP3894367B2 (ja) * 1995-04-26 2007-03-22 富士通株式会社 研磨装置
JP2006187837A (ja) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4904027B2 (ja) * 2005-08-10 2012-03-28 ニッタ・ハース株式会社 研磨パッド
JP4857659B2 (ja) * 2005-08-24 2012-01-18 富士電機株式会社 膜厚評価方法、研磨終点検出方法及びデバイス製造装置
JP2008068388A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd 静電結合型センサ及びそれを用いた終点検出方法及び終点検出装置

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