JP2010064220A5

JP2010064220A5 -

Info

Publication number: JP2010064220A5
Application number: JP2008234991A
Authority: JP
Filing date: 2008-09-12
Publication date: 2011-10-13
Anticipated expiration: 2028-09-12

Claims

Hold the substrate by the substrate holder,
Press the substrate against the polishing surface of the polishing pad attached to the polishing table,
Polishing the surface of the substrate by relatively moving the substrate holding unit and the polishing table;
During polishing, measure at least one of amplitude and frequency of vibration of the target that contacts the surface of the substrate;
A polishing method, wherein polishing processing is controlled based on at least one of the measured amplitude and frequency.

The polishing method according to claim 1 , wherein it is determined that the polishing end point has been reached when at least one of the amplitude and frequency increases or decreases to a predetermined value.

It said measured based on at least one of amplitude and frequency, the polishing method according to claim 1, characterized in that to control the pressing force against the plurality of regions of the substrate.

The polishing method according to claim 1, characterized in that the while maintaining the contact pressure of the target and the substrate constant, to measure at least one of the amplitude and frequency of vibration of the target.

During polishing, the polishing method according to claim 1, the light irradiated on the surface of the substrate, and measuring the intensity of the reflected light returned from the substrate.

The polishing method according to claim 5 , wherein a portion of the substrate that contacts the target is the same as a portion of the substrate that is irradiated with the light.

The polishing method according to claim 5 , wherein at least one of the amplitude and frequency and the intensity of the reflected light are selectively monitored.

During polishing, acquire an image of the surface of the substrate,
The polishing method according to claim 1 , wherein the structure of the surface of the substrate is analyzed from the image.

During polishing, acquire an image of the target,
The polishing method according to claim 1 , wherein at least one of an amplitude and a frequency of vibration of the target is analyzed from the image.

A polishing table to which a polishing pad having a polishing surface is attached;
A polishing apparatus that has a substrate holding part that presses the substrate against the polishing surface, and polishes the surface of the substrate by relative movement of the polishing table and the substrate holding part,
A target in contact with the surface of the substrate;
A vibration measuring unit that measures at least one of amplitude and frequency of vibration of the target;
A polishing apparatus comprising: a control unit that controls polishing processing based on at least one of the amplitude and frequency measured by the vibration measuring unit.

The polishing apparatus according to claim 10 , wherein the control unit determines that a polishing end point has been reached when at least one of the amplitude and frequency increases or decreases to a predetermined value.

The substrate holding part has a plurality of pressing mechanisms that independently press a plurality of regions of the substrate,
The polishing apparatus according to claim 10 , wherein the control unit controls the pressing force of the plurality of pressing mechanisms based on at least one of the amplitude and frequency measured by the vibration measuring unit.

The polishing apparatus according to claim 10 , wherein the target includes an elastic bag in which a fluid is sealed.

The polishing apparatus according to claim 13 , wherein the vibration measuring unit measures at least one of an amplitude and a frequency of vibration of the elastic bag.

The polishing apparatus according to claim 13 , further comprising a pressure adjusting mechanism that adjusts a pressure of a fluid supplied to the elastic bag.

The polishing apparatus according to claim 13 , wherein the vibration measuring unit is a pressure sensor that measures a pressure of a fluid sealed in the elastic bag.

The target further includes a contact pad that contacts the surface of the substrate;
The contact pad is attached to the elastic bag;
The polishing apparatus according to claim 13 , wherein the vibration measuring unit measures at least one of an amplitude and a frequency of vibration of the contact pad.

The elastic bag is made of a light transmissive material,
The polishing apparatus according to claim 13 , further comprising image acquisition means for acquiring an image of the surface of the substrate through the elastic bag.

The polishing apparatus according to claim 18 , further comprising an image analysis unit that analyzes a structure of a surface of the substrate from an image acquired by the image acquisition unit.

The polishing apparatus according to claim 10 , further comprising a contact pressure adjusting mechanism that adjusts a contact pressure between the target and the substrate.

The polishing apparatus according to claim 20 , wherein the control unit controls the contact pressure to be constant through the contact pressure adjusting mechanism.

The vibration measuring unit is
Image acquisition means for acquiring an image of the target;
The polishing apparatus according to claim 10 , further comprising: an image analysis unit that analyzes at least one of an amplitude and a frequency of vibration of the target from an image acquired by the image acquisition unit.

The vibration measuring unit is
A light projecting unit for irradiating the target with light;
A light receiving unit for receiving light reflected by the target;
The polishing apparatus according to claim 10 , further comprising a measuring unit that measures the intensity of light received by the light receiving unit.

The polishing table is provided with a liquid chamber that opens on its upper surface,
The polishing apparatus according to claim 10 , wherein the target is disposed in the liquid chamber.

The polishing apparatus according to claim 10 , wherein the target is a part of the polishing pad.

The polishing apparatus according to claim 25 , wherein a cut line is formed in the polishing pad, and the target is a region surrounded by the cut line.

26. The polishing apparatus according to claim 25 , wherein a part of the polishing pad constituting the target is a part having a smaller thickness than other parts.

The polishing apparatus according to claim 10 , further comprising a reflection intensity measuring unit that irradiates the surface of the substrate with light and measures the intensity of reflected light returning from the substrate.

29. The polishing apparatus according to claim 28 , wherein a portion of the substrate that is in contact with the target is the same as a portion of the substrate that is irradiated with light by the reflection intensity measuring unit.

The polishing apparatus according to claim 28 , wherein the control unit selectively monitors at least one of the amplitude and frequency and the intensity of the reflected light.

A reference measurement unit for measuring at least one of amplitude and frequency of vibration of the polishing table;
The vibration measuring unit is provided on the polishing table,
The polishing apparatus according to claim 10 , wherein the control unit divides the measurement value of the reference measurement unit from the measurement value of the vibration measurement unit.