TW200714408A - Apparatus for endpoint detection during polishing - Google Patents

Apparatus for endpoint detection during polishing

Info

Publication number
TW200714408A
TW200714408A TW094134910A TW94134910A TW200714408A TW 200714408 A TW200714408 A TW 200714408A TW 094134910 A TW094134910 A TW 094134910A TW 94134910 A TW94134910 A TW 94134910A TW 200714408 A TW200714408 A TW 200714408A
Authority
TW
Taiwan
Prior art keywords
detection
workpiece
polishing
endpoint detection
probe
Prior art date
Application number
TW094134910A
Other languages
Chinese (zh)
Other versions
TWI289091B (en
Inventor
Tsung-Ju Gwo
Ming-Wei Chang
Chung Yang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094134910A priority Critical patent/TWI289091B/en
Priority to US11/338,667 priority patent/US20070082582A1/en
Publication of TW200714408A publication Critical patent/TW200714408A/en
Application granted granted Critical
Publication of TWI289091B publication Critical patent/TWI289091B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

An apparatus for endpoint detection during polish, being used to monitor the surface polishing status of a polishing surface of a workpiece, is disclosed, which comprises: a probe, being positioned above the workpiece by a height; and at least a sensing element, being disposed on the probe at a position corresponding to the polishing surface, capable of sensing the thickness variation of the workpiece during a polishing process as it is performing a surface dynamic scan upon the working in rotating while it is being driven to proceed a linear motion of displacement. Preferably, the sensing element can be a device selected from the group consisting of an optical sensor, an eddy current sensor and the combination of the two for carrying out optical detection and magnetic flux detection. It is noted that the apparatus for endpoint detection of the invention not only is advantaged in its all-zone detection ability, but also it has enhanced detection accuracy with respect to different metal layer of different thickness.
TW094134910A 2005-10-06 2005-10-06 Apparatus for endpoint detection during polishing TWI289091B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094134910A TWI289091B (en) 2005-10-06 2005-10-06 Apparatus for endpoint detection during polishing
US11/338,667 US20070082582A1 (en) 2005-10-06 2006-01-25 Apparatus for endpoint detection during polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094134910A TWI289091B (en) 2005-10-06 2005-10-06 Apparatus for endpoint detection during polishing

Publications (2)

Publication Number Publication Date
TW200714408A true TW200714408A (en) 2007-04-16
TWI289091B TWI289091B (en) 2007-11-01

Family

ID=37911537

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134910A TWI289091B (en) 2005-10-06 2005-10-06 Apparatus for endpoint detection during polishing

Country Status (2)

Country Link
US (1) US20070082582A1 (en)
TW (1) TWI289091B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5025200B2 (en) * 2006-09-19 2012-09-12 株式会社ディスコ Thickness measurement method during grinding
US8182312B2 (en) * 2008-09-06 2012-05-22 Strasbaugh CMP system with wireless endpoint detection system
CN102175133B (en) * 2011-02-25 2012-07-18 清华大学 Global metal film thickness measuring device
CN102278967A (en) * 2011-03-10 2011-12-14 清华大学 Thickness measuring device and method of polishing solution and chemically mechanical polishing equipment
CN103187328B (en) * 2011-12-27 2015-08-05 中芯国际集成电路制造(上海)有限公司 CMP end-point detection method and phase change memory bottom contact structure formation method
JP6101621B2 (en) * 2013-11-28 2017-03-22 株式会社荏原製作所 Polishing equipment
JP7179586B2 (en) 2018-11-08 2022-11-29 株式会社荏原製作所 Eddy current detection device and polishing device
CN115139190B (en) * 2022-07-12 2024-04-12 中国科学院上海光学精密机械研究所 Detection device for polishing die surface type

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5875559A (en) * 1995-10-27 1999-03-02 Applied Materials, Inc. Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system
US6433541B1 (en) * 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
US6878038B2 (en) * 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US7130029B2 (en) * 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US7196782B2 (en) * 2000-09-20 2007-03-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thin film characteristic and an electrical property of a specimen
US6517413B1 (en) * 2000-10-25 2003-02-11 Taiwan Semiconductor Manufacturing Company Method for a copper CMP endpoint detection system
US6336841B1 (en) * 2001-03-29 2002-01-08 Macronix International Co. Ltd. Method of CMP endpoint detection
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6586337B2 (en) * 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
US6929531B2 (en) * 2002-09-19 2005-08-16 Lam Research Corporation System and method for metal residue detection and mapping within a multi-step sequence
US7308367B2 (en) * 2003-02-03 2007-12-11 Qcept Technologies, Inc. Wafer inspection system
US6815958B2 (en) * 2003-02-07 2004-11-09 Multimetrixs, Llc Method and apparatus for measuring thickness of thin films with improved accuracy

Also Published As

Publication number Publication date
US20070082582A1 (en) 2007-04-12
TWI289091B (en) 2007-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees