JP2010056377A - Electronic component package, and method of manufacturing electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package having a plurality of electronic components packaged, wherein the yield is improved, and to provide a method of manufacturing the electronic component package. <P>SOLUTION: In the electronic component package 10 having a plurality of electronic components 11 and a casing 13 formed by bonding a plurality of structural components so that the plurality of electronic components are covered, functional surfaces 11a, 11b of the electronic components and a bonding surface 21b between the structural components of the casing are disposed crossing each other, the functional surfaces of the electronic components and a packaging surface 20a of the casing for the electronic components are disposed crossing each other, and a wire 17 for electrically connecting the plurality of electronic components to each other is formed in a surface parallel to the bonding surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component package and a method for manufacturing the electronic component package.

  In recent years, attention has been paid to MEMS (Micro Electro Mechanical System) devices, which are micro devices in which a mechanical structure and an electronic circuit are integrated on a single substrate using semiconductor process technology. Since this MEMS device is manufactured using semiconductor technology, it has advantages such as high processing accuracy, ease of mass production, and precise operation control by integrally forming an electronic circuit and a mechanical structure. It is beginning to be applied not only to IT but also to various fields such as communication, chemistry, medicine and biotechnology.

  Electronic parts such as MEMS devices are generally accommodated in a package having a cavity formed therein. However, when a single electronic part cannot perform a desired function, a plurality of electronic parts are connected to each other. There has been proposed a system-in-package method for realizing a desired function by mounting in a single package while being electrically connected to each other (see, for example, Patent Documents 1 and 2). Specifically, a temperature-compensated crystal oscillator in which a crystal oscillator and circuit components are housed in a package is known (for example, see Patent Document 3).

In the stacked semiconductor device of Patent Document 1, a plurality of semiconductor chips (electronic components) are formed with through electrodes penetrating between a circuit surface (front surface) and a back surface of the semiconductor chip, and the plurality of semiconductor chips are mutually connected. Are electrically connected. In the stacked semiconductor device of Patent Document 2, a plurality of semiconductor chips (electronic components) are bonded and laminated with an adhesive film, and the electrodes of each semiconductor chip and the electrodes on the mounting substrate are connected by bonding wires. The semiconductor chips are electrically connected to each other. Thus, the package is miniaturized by stacking and arranging the semiconductor chips in the thickness direction.
JP 2002-170919 A JP 2003-224242 A JP 2003-347846 A

  By the way, in the stacked semiconductor device of Patent Document 1, since a plurality of semiconductor chips are electrically connected to each other by through electrodes, when a through hole for a through electrode is formed in the semiconductor chip, due to processing defects or the like. The characteristics of the through electrode may become unstable, for example, a conduction failure of the through electrode may occur, and the electrical characteristics may be deteriorated. In addition, since the through electrode is formed in the semiconductor chip, there are problems that the manufacturing process is complicated, the productivity is poor, and the yield is lowered.

  In the stacked semiconductor device of Patent Document 2, since a plurality of semiconductor chips are electrically connected to each other by bonding wires, a large number of bonding wires are provided between the semiconductor chips or between the semiconductor chip and the mounting substrate. It is necessary to form it, and there is a possibility that the electrical characteristics may be deteriorated, for example, the stray capacitance between the wires increases. In addition, since a large number of bonding wires are formed, there are problems that the manufacturing process is complicated, the productivity is poor, and the yield is lowered.

  Therefore, the present invention has been made in view of the above-described circumstances, and provides an electronic component package and an electronic component package manufacturing method capable of improving yield in an electronic component package in which a plurality of electronic components are mounted. Is.

In order to solve the above problems, the present invention provides the following means.
The electronic component package according to the present invention is an electronic component package having a plurality of electronic components and a casing formed by joining a plurality of constituent members so as to cover the plurality of electronic components. The surface and the joint surface between the constituent members of the casing are arranged so as to intersect with each other, and the functional surface of the electronic component and the mounting surface of the electronic component in the casing are arranged so as to intersect with each other. A wiring for electrically connecting the plurality of electronic components is formed in a plane perpendicular to the functional surface.

  By configuring in this way, the functional surface having a large area in the electronic component is generally not parallel to the joint surface between the members of the casing made of a plurality of members, so the mounting area of the electronic component is reduced. For example, when the casing is formed of a wafer, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the inner surface (mounting surface) of the casing are in contact with each other. While being formed, it can be easily and reliably electrically connected by arranging a conductive material such as a conductive paste between the inner surface of the casing and the like. In addition, by forming the wiring in a plane perpendicular to the functional surface of the electronic component, a plurality of electronic components stacked and arranged in the thickness direction are electrically connected. In addition, a plurality of electronic components can be electrically connected more easily than the conventional method, and the yield can be improved.

Further, the casing is characterized in that an engaging portion capable of positioning the electronic component with respect to the mounting surface is formed.
By forming the engaging portion in the casing as described above, the electronic component can be easily positioned when the electronic component is mounted. That is, electronic components can be mounted with high efficiency in a short time.

Further, the engaging portion is tapered, and the electronic component can be positioned in a horizontal direction and a vertical direction with respect to the mounting surface.
By comprising in this way, when an electronic component is conveyed to the vicinity of a mounting location, an electronic component is guided to a taper and an electronic component can be mounted in a desired position. Further, when mounting electronic components, it is not necessary to position the electronic components while sequentially confirming with a microscope, so that the electronic components can be mounted with high efficiency in a short time.

Further, the wiring is formed on the mounting surface of the casing.
With this configuration, the plurality of electronic components can be electrically connected by simply placing the plurality of electronic components at a desired position in the casing, making it easier to electrically connect than conventional methods. And the yield can be improved.

In the casing, a pair of surfaces facing each other with the electronic component interposed therebetween are the mounting surfaces.
By comprising in this way, after mounting a plurality of electronic parts in the desired position in a casing (constituent member), by joining another casing (constituent member) provided with the field which counters the mounting side. In addition, since a plurality of electronic components are electrically connected to each other on a pair of mounting surfaces facing each other with the electronic components interposed therebetween, electrical connection can be made more easily than the conventional method, and the yield can be improved. . In addition, since the wiring amount can be increased by forming the wiring on the mounting surface, the wiring capacity per one can be reduced. Further, since the area where the wiring can be formed increases, the degree of freedom in designing the wiring can be improved.

The wiring is formed on an outer surface of the mounting surface of the casing, and a through electrode is formed between the mounting surface and the outer surface.
With this configuration, when wiring is formed on the outer surface on the opposite side where the mounting surface is formed in the casing, and the wiring and the electrode of the electronic component are electrically connected by the through electrode, a plurality of electronic components are electrically connected. Can be connected. That is, since it is only necessary to form the wiring on the exposed outer surface of the casing, the wiring can be easily formed and can be electrically connected more easily than the conventional method. Therefore, the yield can be improved. In addition, since the wiring amount can be increased by forming the wiring on the mounting surface, the wiring capacity per one can be reduced. Further, since the area where the wiring can be formed increases, the degree of freedom in designing the wiring can be improved.

The casing includes a first casing in which a recess capable of accommodating the plurality of electronic components is formed, and a second casing that covers the opening of the recess, and the functional surface of the electronic component is the recess. It is characterized by being arranged to face the side surface.
With this configuration, the functional surface of the electronic component is not parallel to the joint surface between the first casing and the second casing. For example, when forming the first and second casings with a wafer, On the other hand, the number of electronic components can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. Also, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the bottom surface of the recess of the first casing are in contact with each other. While being formed, it can be easily and reliably electrically connected by arranging a conductive material such as a conductive paste between the bottom surface of the concave portion of the first casing. In addition, since a plurality of electronic components are electrically connected by forming a wiring in a plane parallel to the joint surface between the first casing and the second casing, a plurality of electrons can be more easily obtained than in the conventional method. The parts can be electrically connected, and the yield can be improved.

Further, each of the plurality of electronic components includes a device whose output signal has temperature dependence and a temperature sensor.
With this configuration, the device and the temperature sensor can be accommodated in the same package, so that the accuracy of temperature correction can be improved.

  The electronic component package manufacturing method according to the present invention includes a plurality of electronic components, and a casing formed by joining a plurality of constituent members so as to cover the plurality of electronic components, and the electronic component The functional surface of the casing and the joint surface between the constituent members of the casing are arranged so as to intersect with each other, and the functional surface of the electronic component and the mounting surface of the electronic component in the casing intersect with each other. A first casing in which a wiring that electrically connects the plurality of electronic components is formed in a plane that is arranged and parallel to the joint surface, and the casing is formed with a recess that can accommodate the plurality of electronic components. And a method of manufacturing an electronic component package comprising a second casing that covers the opening of the recess, the step of forming a plurality of the recesses in a first wafer that forms the first casing; The step of forming the wiring on the bottom surface of the recess and disposing a conductive material that electrically connects the wiring and the electronic component, and the functional surface of the electronic component and the joint surface of the casing intersect each other. A step of mounting the electronic component, a step of bonding the first wafer and a second wafer constituting the second casing, and a step of separating the bonded wafers into pieces. It is characterized by being.

  By comprising in this way, the recessed part for accommodating several electronic components can be formed in a 1st wafer, and a 2nd wafer can form a casing only by joining with a 1st wafer, without processing. . Therefore, the casing can be easily manufactured. Further, in general, the concave portion may be formed so that a functional surface having a large area in the electronic component faces the side surface of the concave portion. That is, the size of the recesses formed in the first wafer in a plan view can be minimized, and a large number of recesses can be formed on the wafer. Therefore, the number of electronic component packages extracted from the wafer can be increased. Also, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the bottom surface of the recess of the first wafer are in contact with each other. While being formed, electrical conduction can be easily and reliably established by disposing a conductive material such as a conductive paste between the bottom surface of the concave portion of the first wafer. In addition, if the wiring is formed in a plane parallel to the joint surface between the first casing and the second casing so that the functional surface of the electronic component and the mounting surface of the electronic component in the casing intersect, Since these electronic components are electrically connected, a plurality of electronic components can be electrically connected more easily than the conventional method, and the yield can be improved.

  According to the electronic component package according to the present invention, the functional surface having a large area in the electronic component is generally not parallel to the joint surface between the casing members made of a plurality of members. For example, when the casing is formed of a wafer, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the inner surface (mounting surface) of the casing are in contact with each other. While being formed, it can be easily and reliably electrically connected by arranging a conductive material such as a conductive paste between the inner surface of the casing and the like. In addition, by forming the wiring in a plane parallel to the joint surface of the casing, the plurality of electronic components are electrically connected, so that the plurality of electronic components can be electrically connected more easily than the conventional method. And the yield can be improved.

(First embodiment)
Next, a first embodiment of an electronic component package according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 3, the electronic component package 10 includes a plurality of flat electronic components 11 (three in this embodiment), a casing 13 that covers the electronic components 11, an electronic component 11, and a casing 13. The conductive material 15 disposed at the joint portion and the wiring 17 that electrically connects the plurality of electronic components are provided. For convenience of illustration, a through electrode electrically connected to the conductive material 15 and an external electrode electrically connected to the through electrode are omitted.

  The electronic component 11 is composed of, for example, an IC or a crystal resonator, and has functional surfaces on the front surface 11a and the back surface 11b. An electrode 12 is formed in the vicinity of the side surface 11c on the front surface 11a and the back surface 11b. Further, the side surface 11c of the electronic component 11 is joined to a conductive material 15 made of a conductive paste provided on the bottom surface (mounting surface) 20a of the recess 20 of the first casing 21, and the electrode 12 and the conductive material 15 are electrically connected. It is connected to the.

  The casing 13 is a member having a substantially rectangular parallelepiped shape made of, for example, glass and having a cavity formed therein. In this embodiment, it is comprised by the 1st casing 21 in which the recessed part 20 which can accommodate the electronic component 11 was formed, and the 2nd casing 22 which obstruct | occludes opening of the recessed part 20 of the 1st casing 21. FIG.

  It arrange | positions so that the side surface 31 of the recessed part 20 and the surface 11a of the electronic component 11 of the 1st casing 21 may oppose, and the side surface 32 of the recessed part 20 and the back surface 11b of the electronic component 11 may oppose.

  The second casing 22 is a flat member, and the first casing 21 and the second casing 22 are connected to each other on the end surface 21b of the first casing 21 by anodic bonding, adhesive bonding, soldering using gold or tin, or the like. It is joined.

  Here, on the side surfaces 33 and 34 of the recess 20 of the first casing 21, the same number of the pair of engagement recesses 36 and 36 for guiding the electronic component 11 to a desired mounting position is formed. . The engagement recess 36 is formed in a tapered shape whose width gradually decreases from the side surfaces 33 and 34 toward the outer peripheral surface in plan view, and gradually increases in width from the end surface 21b toward the bottom surface 20a of the recess 20 in front view. Is formed in a tapered shape. That is, the electronic component 11 can be positioned in the horizontal direction and the vertical method with respect to the mounting surface (bottom surface 20a).

  Specifically, a first taper 37 that gradually decreases in width from the side surfaces 33 and 34 toward the outer circumferential surface is formed in each of the pair of engaging recesses 36 and 36 in plan view, A second taper 38 whose width gradually decreases from the end surface 21 b toward the bottom surface 20 a of the recess 20 is formed in each of the engagement recesses 36, 36.

  A wiring 17 for electrically connecting the plurality of electronic components 11 is formed on the bottom surface 20a of the recess 20. The wiring 17 is formed so as to cross the functional surfaces 11 a and 11 b of the electronic component 11. In other words, the electronic components 11 can be electrically connected to each other without forming through electrodes in the electronic component 11.

Next, a method for manufacturing the electronic component package 10 will be described with reference to FIGS.
As shown in FIG. 4, two first and second wafers 51 and 52 having substantially the same size in plan view are prepared. Note that the thickness of the first wafer 51 is larger than the width of the front surface 11 a (back surface 11 b) having the functional surface of the electronic component 11. That is, the first wafer 51 is a constituent member of the first casing 21, and the second wafer 52 is a constituent member of the second casing 22.

  As shown in FIG. 5, a plurality of recesses 20 are formed on the first wafer 51, and a plurality of engagement recesses 36, 36 are formed on the side surfaces 33, 34 of the recess 20. At this time, a first taper 37 and a second taper 38 are formed in the engaging recess 36. In order to form the recess 20 and the engagement recess 36 in the first wafer 51, for example, they may be formed by pressing.

  As shown in FIG. 6, wiring 17 for electrically connecting the plurality of electronic components 11 is formed on the bottom surface 20 a of the recess 20 of the first wafer 51. The wiring 17 can be formed using, for example, an ink jet printer. Further, the conductive material 15 made of silver paste or the like is formed on the bottom surface 20a of the recess 20 of the first wafer 51 at the position where the electrode 12 of the electronic component 11 is formed.

  As shown in FIG. 7, the electronic component 11 is inserted into the recess 20. At this time, the electronic component 11 is inserted so that the front surface 11 a and the rear surface 11 b having the functional surfaces face the side surfaces 31 and 32 of the recess 20. At this time, the electronic component 11 is inserted while being positioned between the pair of engaging recesses 36 and 36. When the electronic component 11 comes into contact with the first taper 37 and the second taper 38 of the engagement recess 36, the electronic component 11 is mounted at a desired position so as to slide down along the tapers 37, 38 of the engagement recess 36. The Further, the side surface 11c of the electronic component 11 is brought into contact with the conductive material 15, and further, the paste-like conductive material 15 is pushed in until it wraps around the front surface 11a and the back surface 11b of the electronic component 11. By doing in this way, the electrode 12 formed on both surfaces of the electronic component 11 and the conductive material 15 are electrically connected. If there is a possibility that the side surface 11c of the electronic component 11 and the wiring 17 are in contact with each other, an insulating film may be formed on the surface of the wiring 17 at the contact portion, for example.

  As shown in FIG. 8, the first wafer 51 and the second wafer 52 are bonded.

  As shown in FIG. 9, the first wafer 51 and the second wafer 52 are separated into individual pieces, and the manufacture of the electronic component package 10 is completed.

  According to the present embodiment, the functional surfaces (front surface 11 a and back surface 11 b) having a large area in the substantially flat electronic component 11 are joined surfaces (first surfaces) of the members of the casing 13 including the first casing 21 and the second casing 22. Since it is not parallel to the end face 21 b) of the casing 21 but is arranged in a direction substantially orthogonal, the number of electronic components 11 can be increased with respect to the wafer (first wafer 51) constituting the casing 13. . Therefore, the number of electronic component packages 10 taken out from the wafer can be increased. That is, the electronic components 11 can be arranged with high density with respect to the first wafer 51 and the second wafer 52, and the first wafer 51 and the second wafer 52 can be used effectively.

  Further, since both the front surface 11a and the back surface 11b of the electronic component 11 are functional surfaces and the side surface 11c of the electronic component 11 and the bottom surface 20a of the recess 20 of the first casing 21 are in contact with each other, the side surface 11c of the electronic component 11 is configured. By arranging the conductive material 15 made of a conductive paste between the first casing 21 and the bottom surface 20a of the concave portion 20 of the first casing 21, electrical conduction can be easily and reliably achieved.

  Moreover, since the functional surfaces (front surface 11a and back surface 11b) of the electronic component 11 and the mounting surface of the electronic component 11 in the casing 13 (the bottom surface 20a of the recess 20 of the first casing 21) are arranged so as to be substantially orthogonal, the electronic When the component 11 is mounted on the casing 13, the mounting area can be reduced. Therefore, a large number of electronic components 11 can be arranged on the wafer constituting the casing 13, and the number of wafers taken out from the wafer can be increased.

  In addition, since the plurality of electronic components 11 can be accommodated in the recess 20 of the first casing 21 and the wiring 17 that electrically connects the plurality of electronic components 11 is formed on the bottom surface 20a of the recess 20, the electronic component The plurality of electronic components 11 can be electrically connected by simply mounting 11 at a desired position of the recess 20. Therefore, it is possible to improve the yield for manufacturing the electronic component package 10 on which the plurality of electronic components 11 are mounted.

  In addition, since the pair of engaging recesses 36 and 36 that can engage the electronic component 11 is formed on the side surfaces 33 and 34 of the recess 20 of the first casing 21, the electronic component 11 can be placed in an accurate position in a short time. It can be mounted with high efficiency.

  Furthermore, since the first taper 37 and the second taper 38 are formed in the engaging recess 36, when the electronic component 11 is transported to the vicinity of the mounting location, the electronic tape is guided to the first taper 37 and the second taper 38, and then the electronic component. 11 can be guided to an accurate position and can be mounted at a desired position. Note that a taper portion capable of contacting the first taper 37 and the second taper 38 may be formed on the side surface of the electronic component 11.

  Further, according to the manufacturing method described above, the concave portion 20 for accommodating the electronic component 11 is formed in the first wafer 51, and the second wafer 52 is processed without being processed for accommodating the electronic component 11. The casing 13 can be formed simply by joining to 51. Therefore, the casing 13 can be easily manufactured. In addition, since the electronic component package 10 is manufactured at the wafer level in this way, the manufacturing process can be simplified.

  Furthermore, unlike the substantially cylindrical can package in which the crystal resonator is accommodated, the electronic component package 10 of the present embodiment is easy to mount because no protruding electrode (external electrode) is formed. In addition, since the electronic component package 10 accommodates the substantially flat plate-like electronic component 11 in the substantially rectangular parallelepiped concave portion 20, the affinity as a surface-mounted component can be increased. Further, when the second casing 52 of the casing 13 is configured by a metal lid, the second casing 52 and the functional surface of the electronic component 11 are arranged and configured in a direction orthogonal to each other, and are surfaces parallel to the second casing 52. Is small, the parasitic capacitance is small.

  Note that the electronic component package 10 containing a plurality of electronic components 11 as in this embodiment includes a device (for example, a crystal resonator, an acceleration sensor, an angular velocity sensor, an IC, etc.) that needs to correct changes in characteristics due to temperature. Therefore, it can be used for mounting a temperature sensor at the same time, and the accuracy of temperature correction can be improved. Further, by mounting the MEMS device and the driver IC in the same package, the electrical characteristics between the MEMS and the IC can be improved, and the power consumption can be reduced.

(Second embodiment)
Next, a second embodiment of the electronic component package according to the present invention will be described with reference to FIG. Note that the present embodiment is different from the first embodiment only in the location where the wiring is formed, and the other configurations are substantially the same, so the same portions are denoted by the same reference numerals and detailed description thereof is omitted.
As shown in FIG. 10, the electronic component package 110 includes a plurality of electronic components 11, a casing 13 that covers the electronic components 11, and a conductive material 15 that is disposed at a joint portion between the electronic components 11 and the casing 13. ing.

  Here, the wiring 17 that electrically connects the plurality of electronic components 11 is formed on the bottom surface 20a (mounting surface) of the recess 20, and the surface facing the bottom surface 20a via the electronic components 11 in the second casing 22 22a is also formed. Further, an electrode 12 is appropriately formed in the vicinity of the side surface 11d facing the side surface 11c of the electronic component 11 and is electrically connected to the conductive material 15 applied to the surface 22a of the second casing 22.

  In the present embodiment, after mounting the plurality of electronic components 11 at desired positions in the first casing 21, the second casing 22 is joined, so that the side surfaces 11 c of the electronic components 11 and the plurality of electronic components 11 are connected. Since the side surface 11d is electrically connected, the amount of wiring can be increased, so that the wiring capacity per line can be reduced. Further, since the area where the wiring 17 can be formed increases, the degree of freedom in designing the wiring 17 can be improved.

  Further, after the wiring 17 is formed on the bottom surface 20a of the recess 20 and the surface 22a of the second casing 22 by an ink jet printer or the like, the electronic component package 110 is formed by simply applying the conductive material 15 and mounting the electronic component 11. Therefore, the electronic component package 110 can be manufactured more easily than the conventional method, and the yield can be improved.

(Third embodiment)
Next, a third embodiment of the electronic component package according to the present invention will be described with reference to FIG. Note that the present embodiment is different from the first embodiment only in the location where the wiring is formed, and the other configurations are substantially the same, so the same portions are denoted by the same reference numerals and detailed description thereof is omitted.
As shown in FIG. 11, the electronic component package 210 includes a plurality of electronic components 11, a casing 13 that covers the electronic components 11, and a conductive material 15 that is disposed at a joint portion between the electronic components 11 and the casing 13. ing.

  Here, the wiring 17 that electrically connects the plurality of electronic components 11 is formed not on the bottom surface 20 a (mounting surface) of the recess 20 but on the outer surface 21 a of the bottom surface 20 a of the first casing 21. Further, a through electrode 18 is formed at a position where the conductive material 15 is formed in the first casing 21, and the conductive material 15 and the wiring 17 are electrically connected.

In the present embodiment, the wiring 17 is formed on the outer surface 21a opposite to the mounting surface (the bottom surface 20a of the recess 20) in the first casing 21, and the wiring 17 and the electrode 12 of the electronic component 11 are connected to the through electrode. When conducting at 18, the plurality of electronic components 11 can be electrically connected. That is, since the wiring 17 may be formed on the exposed outer surface 21a of the first casing 21, the wiring 17 can be easily formed, and the plurality of electronic components 11 can be electrically connected more easily than the conventional method. Can be connected. Therefore, the yield can be improved.
Moreover, since the wiring amount can be increased by forming the wiring 17 also on the mounting surface (the bottom surface 20a of the recess 20), the wiring capacity per one can be reduced. Further, since the area where the wiring 17 can be formed increases, the degree of freedom in designing the wiring 17 can be improved.

Note that the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in this embodiment, the case where a glass substrate is used for the casing has been described, but silicon, ceramic, or a metal substrate can also be used.
Further, in the present embodiment, the case where the recess and the engaging portion are formed on the wafer by the press working has been described. However, the recess and the engaging portion may be formed by etching (dry etching).
In the present embodiment, the case where a plurality of electronic components are stacked in parallel is described. However, the arrangement of electronic components is not limited to this, and the electronic components can be freely arranged.
Furthermore, in the present embodiment, a case has been described in which a taper is provided on the casing so that the electronic component can be easily guided to a predetermined position. However, a guide such as a taper is not necessarily provided. By not providing the guide, the casing can be easily manufactured (processed).

  And in this embodiment, although the case where the casing 13 was comprised with the 1st casing 21 and the 2nd casing 22 was demonstrated, as shown in FIG. 12, the 1st casing 21 is divided | segmented into two and casing 21A, 21B and 22 may be used. With this configuration, the wiring 17 is formed on the bottom surface of the recess in the above-described embodiment. However, when forming the wiring 17, the wiring is not formed on the bottom surface of the recess having a deep depth, but on a flat surface (the surface of the casing 21A). Since 17 can be formed, the wiring 17 can be formed more easily.

It is a disassembled perspective view of the electronic component package in 1st embodiment of this invention. It is a top view of the electronic component package in the first embodiment of the present invention (a top view of the first casing). It is sectional drawing which follows the AA line of FIG. It is explanatory drawing (1) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (2) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (3) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (4) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (5) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (6) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is side surface sectional drawing of the electronic component package in 2nd embodiment of this invention. It is side surface sectional drawing of the electronic component package in 3rd embodiment of this invention. It is side surface sectional drawing which shows another aspect of the electronic component package in embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic component package 11 ... Electronic component 11a ... Front surface (functional surface) 11b ... Back surface (functional surface) 13 ... Casing 17 ... Wiring 18 ... Through-electrode 20 ... Recess 20a ... Bottom surface (mounting surface) 21 ... First casing (Configuration) 21a ... Outer surface 21b ... End surface (joint surface) 22 ... Second casing (component) 22a ... Front surface (surface facing the mounting surface) 31 ... Side surface 32 ... Side surface 36 ... Engaging recess (engaging portion) 37 ... first taper (taper) 38 ... second taper (taper)

Claims (9)

Multiple electronic components,
In an electronic component package having a casing formed by joining a plurality of constituent members so as to cover the plurality of electronic components,
The functional surface of the electronic component and the joint surface between the constituent members of the casing are arranged so as to intersect,
The functional surface of the electronic component and the mounting surface of the electronic component in the casing are arranged to intersect,
An electronic component package, wherein wiring for electrically connecting the plurality of electronic components is formed in a plane perpendicular to the functional surface.   The electronic component package according to claim 1, wherein an engagement portion capable of positioning the electronic component with respect to the mounting surface is formed in the casing.   3. The electronic component package according to claim 1, wherein a taper is formed in the engaging portion so that the electronic component can be positioned in a horizontal direction and a vertical direction with respect to the mounting surface.   The electronic component package according to claim 1, wherein the wiring is formed on the mounting surface of the casing.   5. The electronic component package according to claim 1, wherein a pair of surfaces facing each other with the electronic component interposed therebetween are the mounting surfaces. The wiring is formed on an outer surface of the mounting surface of the casing;
The electronic component package according to claim 1, wherein a through electrode is formed between the mounting surface and the outer surface. The casing is composed of a first casing formed with a recess capable of accommodating the plurality of electronic components, and a second casing covering the opening of the recess,
The electronic component package according to claim 1, wherein a functional surface of the electronic component is disposed so as to face a side surface of the recess.   The electronic component package according to claim 1, wherein the plurality of electronic components include a device whose output signal has temperature dependence and a temperature sensor. Multiple electronic components,
A casing formed by joining a plurality of constituent members so as to cover the plurality of electronic components,
The functional surface of the electronic component and the joint surface between the constituent members of the casing are arranged so as to intersect,
The functional surface of the electronic component and the mounting surface of the electronic component in the casing are arranged to intersect,
A wiring for electrically connecting the plurality of electronic components is formed in a plane parallel to the bonding surface,
The casing is a method of manufacturing an electronic component package comprising a first casing formed with a recess capable of accommodating the plurality of electronic components, and a second casing covering the opening of the recess,
Forming a plurality of the recesses in the first wafer forming the first casing;
Forming the wiring on the bottom surface of the recess, and disposing a conductive material that electrically connects the wiring and the electronic component;
Mounting the electronic component such that the functional surface of the electronic component and the joint surface of the casing intersect;
Bonding the first wafer and the second wafer constituting the second casing;
Separating the bonded wafers into individual pieces, and a method of manufacturing an electronic component package.

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