JP5184427B2 - Electronic component package and method of manufacturing electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package which can increase the number of chips to be obtained from a wafer and facilitate an electrical connection between the electrodes of the electronic components. <P>SOLUTION: In a casing 9, there is formed a groove part 14 which is connected with an electrode formed in an electronic component 4. By filling the space between a spacer 5 and the groove part 14 with a conductive material, an electric wiring 2 for leading out the electrical connection from the electrode is formed. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component package in which an electronic component is mounted and a method for manufacturing the electronic component package.

  2. Description of the Related Art In recent years, electronic components having electrodes arranged on both sides have been used to improve the performance and compactness of electronic components. And when connecting the electrodes arrange | positioned on both surfaces of this electronic component, the side electrode penetrated from the electronic component (for example, refer patent document 1) and the side electrode formed so that it might wrap around from the edge part of an electronic component is provided. It is used.

  The through electrode is generally formed by opening a hole penetrating an electronic component, forming an insulating film on the surface of the hole, and then filling the hole with a conductive material. The side electrode is formed at the end of the electronic component by bending a metal rod or plate at the end of the electronic component or by depositing the electronic component while rotating the electronic component around its end. ing.

JP 2002-170919 A

  However, since a hole is made in the electronic component when forming the through electrode, the electronic component, which is a precision component, may be chipped or damaged. Also, the method of bending the metal for forming the side electrode may damage the electronic component due to a large load, and the method of vapor deposition while rotating the electronic component requires complicated introduction of a mechanism for rotating the electronic component. In other words, it is difficult to form the side electrode.

  The present invention has been made in view of such problems, and an electronic component package and an electronic component package that can easily draw out an electrical connection from a plurality of electrodes without processing the electronic component itself The manufacturing method of this is provided.

  In order to solve the above problems, the present invention proposes the following means.

  An electronic component package according to the present invention includes an electronic component on which an electrode is formed, a casing formed by joining a plurality of components so as to cover the electronic component, and a spacer formed in close contact with the casing. In the electronic component package, the functional surface of the electronic component and the joint surface between the constituent members of the casing are arranged so as to intersect with each other, the casing is formed on the electronic component A groove portion connected to the electrode is formed, and an electric wiring capable of extracting an electrical connection from the electrode is formed by filling a conductive material between the spacer and the groove portion. It is said.

  According to this invention, the electrical connection from the electrode of the electronic component is drawn out to an arbitrary place by the electrical wiring formed by filling the conductive material between the spacer and the groove formed in the casing. Or a plurality of electrodes can be electrically connected to each other. Therefore, the electrical connection from the electrodes of the electronic component can be drawn out to any place without processing the electronic component itself or performing a complicated process such as forming a side electrode on the package.

  In addition, since the functional surface having a large area in the electronic component is generally not parallel to the joint surface between the constituent members of the casing composed of a plurality of constituent members, for example, when the casing is made of a wafer, On the other hand, the number of electronic components arranged can be increased, and the manufacturing cost of the electronic component package can be reduced.

  In the electronic component package, an engaging portion between the spacer and the casing extends along the electric wiring, and the engaging portion is provided on one of the spacer and the casing. It is more preferable that the convex portion and the concave portion provided on the other side are engaged with each other.

  According to this invention, even when the conductive material flows out from between the plurality of spacers and the coupling surface and the groove when filling the conductive material between the plurality of spacers and the coupling surface and the groove, The engaging portion formed by engaging the convex portion and the concave portion provided in the spacer and the casing prevents the conductive material from flowing through the engaging portion, and the electric wiring is another member. And can prevent short circuit.

In the electronic component package, it is more preferable that the electronic component package is disposed inside the casing in a state where a gap is formed between the electronic component and the spacer.
According to the present invention, since the gap is formed around the electronic component, it is possible to mount the mechanically operated electronic component in the package.

In the electronic component package described above, it is more preferable that a part of the electrical wiring is drawn out of the casing.
According to this invention, the electrode formed in the electronic component can be pulled out to the outside of the casing through the electric wiring.

  The electronic component package manufacturing method of the present invention includes an electronic component on which an electrode is formed, a casing formed by joining a plurality of components so as to cover the electronic component, and a state in close contact with the casing. A first casing in which a through hole capable of accommodating the electronic component is formed, and a second casing and a third casing that cover both end openings of the through hole. In the method of manufacturing an electronic component package, the step of forming a plurality of the through holes in the first wafer forming the first casing, and the step of forming a plurality of recesses in the second wafer forming the second casing; , The step of bonding the first wafer and the second wafer constituting the second casing, the step of mounting the spacer, the functional surface and the front of the electronic component After the step of mounting the electronic component such that the joint surface of the casing intersects and the step of arranging the electronic component, the conductive material is conductive in the groove formed by the first casing, the second casing, and the spacer. A step of forming an electrical wiring that draws an electrical connection from the electrode by filling the material, a step of bonding the first wafer and a third wafer constituting the third casing, and the bonded And a step of separating the wafer into individual pieces.

  According to the present invention, the spacer and the electronic component are arranged on the casing formed by joining the first wafer in which the through hole for accommodating a plurality of electronic components is formed and the second wafer in which the concave portion is formed. Subsequently, a conductive material is filled in a groove formed by the first casing, the second casing, the spacer, and the electronic component, and an electric wiring that draws out an electrical connection from the electrode can be formed by bonding a third wafer. . Therefore, it is possible to easily form an electrical wiring that electrically connects a plurality of electrodes to each other without processing the electronic component itself.

  In addition, since the functional surface having a large area among the electronic components is generally not parallel to the joint surface between the constituent members of the casing composed of a plurality of constituent members, the number of electronic components arranged on the first wafer should be increased. Can do. As a result, the number of electronic component packages extracted from the wafer can be increased, and the manufacturing cost of the electronic component package can be reduced.

  The electronic component package manufacturing method of the present invention includes an electronic component on which an electrode is formed, a casing formed by joining a plurality of components so as to cover the electronic component, and a state in close contact with the casing. An electronic component comprising: a first casing formed with a recess capable of accommodating the electronic component; and a second casing covering the opening of the first casing. In the package manufacturing method, a step of forming a plurality of the recesses in the first wafer forming the first casing, a step of mounting a spacer in the plurality of recesses, a functional surface of the electronic component, and a bonding surface of the casing Are formed by the first casing and the spacer after the step of mounting the electronic component and the step of arranging the electronic component so as to intersect each other. Filling the groove with a conductive material to form an electrical wiring that draws electrical connection from the electrode; and joining the first wafer and the second wafer constituting the second casing; Separating the bonded wafers into individual pieces.

  According to this invention, first, a plurality of recesses are formed in the first wafer. Next, a spacer and an electronic component are arranged. Subsequently, by filling the groove formed by the first casing and the spacer with a conductive material and joining the second wafer, an electrical wiring can be formed to draw out an electrical connection from the electrode. Therefore, it is possible to easily form an electrical wiring that electrically connects a plurality of electrodes to each other without processing the electronic component itself.

  In addition, since the functional surface having a large area among the electronic components is generally not parallel to the joint surface between the constituent members of the casing composed of a plurality of constituent members, the number of electronic components arranged on the first wafer should be increased. Can do. As a result, the number of electronic component packages extracted from the wafer can be increased, and the manufacturing cost of the electronic component package can be reduced.

  According to the electronic component package and the electronic component package manufacturing method of the present invention, electrical connection can be easily drawn from a plurality of electrodes without processing the electronic component itself.

It is a perspective view of the electronic component package in 1st embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 1st embodiment of this invention. It is a fragmentary sectional view of the electronic component package in a first embodiment of the present invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is the perspective view which abbreviate | omitted some components of the electronic component package in 2nd embodiment of this invention. It is the top view which abbreviate | omitted some components of the electronic component package in 2nd embodiment of this invention. It is a perspective view of the electronic component package in 3rd embodiment of this invention. It is a fragmentary sectional view of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is a fragmentary top view of the electronic component package in the modification of 3rd embodiment of this invention. It is explanatory drawing which partially decomposed | disassembled the electronic component package in the modification of 3rd embodiment of this invention.

(First embodiment)
Hereinafter, a first embodiment of an electronic component package according to the present invention will be described with reference to FIGS. In FIG. 2, a third casing, which will be described later, is omitted for convenience of explanation.

  As shown in FIGS. 1 to 3, the electronic component package 1 includes an electronic component 4 on which electrodes are formed, a spacer 5, a first casing 11, a second casing 12, and a third casing 13 that are constituent members. And a casing 9 formed so as to cover the electronic component 4 and the spacer 5.

  The electronic component 4 is composed of, for example, an IC or a crystal resonator, and is formed in a substantially rectangular parallelepiped shape. An electrode (not shown) is formed on a part of the surface of the electronic component 4.

  The casing 9 is formed of, for example, silicon, and has an approximately rectangular parallelepiped shape. The casing 9 is formed in a hollow state. In the present embodiment, a first casing 11 in which a through hole is formed so that the electronic component 4 and the spacer 5 can be accommodated, and a plate-like second casing 12 that forms the casing 9 in a state in which both ends of the substantially through hole are blocked. The third casing 13 is joined to the end face of the first casing 11 by adhesive bonding, solder bonding using gold or tin, anodic bonding, or the like.

  And in this embodiment, it arrange | positions so that the functional surface of the electronic component 4 and the joining surface of the 2nd casing 12 may orthogonally cross.

  A groove 14 is formed on the inner surface of the first casing 11 and a recess 15 is formed on the second casing.

  In more detail, the groove part 14 is comprised in the 1st casing 11 inner surface by the 1st groove part 14a and the 2nd groove part 14b (not shown in FIGS. 1-3). Moreover, the recessed part 15 is comprised in the 2nd casing by the 1st recessed part 15a and the 2nd recessed part 15b.

  The first groove portion 14a and the first recess portion 15a, the second groove portion 14b and the second recess portion 15b are integrated with the first casing 11 and the second casing 12 being joined together to form the electronic component 4. It is formed in a state where it can be connected to the electrode formed on the substrate and can be electrically connected.

  Further, in the first casing 11, a first auxiliary groove part 16 a and a second auxiliary groove part 16 b connected to the first groove part 14 a and the second groove part 14 b are formed on the surface to be joined to the third casing, respectively. Yes.

Then, by filling a conductive material such as silver paste between the groove portion 14, the concave portion 15, and the auxiliary groove portion 16, the electric wiring 2 partially drawn out to the outside of the casing 9 is formed.
As shown in FIG. 4, three first wafers 21, second wafers 22 and third wafers 23 having substantially the same size in plan view are prepared.
The first wafer 21 is a constituent material of the first casing 11, the second wafer 22 is a constituent material of the second casing 12, and the third wafer 23 is a constituent material of the third casing 12.

FIG. 5 is a partial perspective view of the first casing 11. As shown in the figure, the first casing 11 is formed by forming a plurality of through holes 6 in the first wafer 21.
FIG. 6 is a partial perspective view of the second casing 12. As illustrated, the second casing 12 has a first recess 15a and a second recess 15b.

  FIG. 7 is a partial perspective view showing a state in which the first casing 11 and the second casing 12 are joined, FIG. 8 is a partial top view showing a state in which the first casing 11 and the second casing 12 are joined, FIG. 9 is a partial cross-sectional view showing a state in which the first casing 11 and the second casing 12 are joined. As illustrated, the first casing 11 and the second casing 12 are joined to each other so that the first groove 14a and the first recess 15a, and the second groove 14b and the second recess 15b are connected to each other.

  10 is a partial perspective view showing a state where the spacer 5 is mounted on the casing 9, FIG. 11 is a partial top view showing a state where the spacer 5 is mounted on the casing 9, and FIG. It is a fragmentary sectional view which shows the state which carried out. As illustrated, the spacer 5 is inserted into a box-shaped structure formed by joining the first casing 11 and the second casing 12. At this time, by mounting the first groove portion 14a and the second groove portion 14b on the inner surface of the first casing 11 and covering the first recess portion 15a and a part of the second recess portion 15b on the second casing. A gap capable of forming an electrical wiring can be formed.

  13 is a partial perspective view showing a state in which the electronic component 4 is mounted on the casing 9, FIG. 14 is a partial top view showing a state in which the electronic component 4 is mounted on the casing 9, and FIG. It is a fragmentary sectional view showing the state where 4 was mounted. As illustrated, the electronic component 4 is inserted into a box-like structure formed by joining the first casing 11 and the second casing 12. At this time, the electronic component 4 is mounted in alignment with the electrode (not shown) of the electronic component 4 and the first recess 15a and the second recess 15b formed in the second casing. Subsequently, a conductive material is filled in the gaps between the first groove part 14a and the second groove part 14b and the spacer 5, the gaps between the first concave part 15a and the second concave part 15b and the spacer 5, and the auxiliary groove part 16. Then, by drying the conductive material for a certain period of time, the electrode (not shown) of the electronic component 4 and the electric wiring are electrically and physically connected.

  The third casing 13 is joined to a box-like structure formed by joining the first casing 11 and the second casing 12 as shown in FIG. 16, and the electronic parts 4 are separated by separating them individually as shown in FIG. The manufacturing of the electronic component package 1 is completed in a state where is enclosed.

  As shown in FIG. 17, the electronic component package 1 is completely manufactured by individual separation. In FIG. 17, the third casing is omitted for convenience of explanation.

Thus, according to the electronic component package 1 of the present embodiment, the functional surface having a large area in the electronic component 4 is generally parallel to the joint surface of the casing 9 composed of the first casing 11 and the second casing 12. Therefore, the number of electronic components 4 arranged on the first wafer 22 can be increased. As a result, the number of electronic component packages 1 taken out from the wafer can be increased, and the manufacturing cost of the electronic component package 1 can be reduced.
Moreover, the electrode of the electronic component 4 can be easily pulled out to the outside of the casing 9 through the electric wiring formed in the second casing.

  In this embodiment, two electrical wires are taken out, but this is not a limitation, and the number may be increased according to the number of electrodes of the electronic component to be enclosed.

  In the above embodiment, the first auxiliary groove portion 16a and the second auxiliary groove portion 16b may not be formed. For example, by providing a through electrode (not shown) from the groove portion 14 of the first casing 11 to the outside of the first casing 11 or from the concave portion 15 of the second casing 12 to the outside of the second casing 12, the electrode of the electronic component 4 can be provided. This is because it can be pulled out to the outside of the casing 9 through the through electrode.

(Second embodiment)
Next, a second embodiment of the electronic component package according to the present invention will be described below with reference to FIGS. Note that. Since the present embodiment is different from the first embodiment only in the configuration of the spacers, the same parts as those in the first embodiment are denoted by the same reference numerals, the description thereof is omitted, and only different points will be described. .

  As shown in FIG. 18, the electronic component package 10 includes an electronic component 4, a spacer 51, a first casing 111, a second casing 121, and a third casing 131 (not shown) that are constituent members. And a casing 91 formed so as to cover the component 4 and the spacer 51.

  The present embodiment is characterized in that the shape of the spacer 51 is formed so as to surround the electronic component 4 along the inner wall surface of the first casing 111. The manufacturing method is the same as in the first embodiment.

Thus, according to the electronic component package of the present embodiment, the functional surface having a large area in the electronic component 4 is generally not parallel to the joint surface of the casing 91 including the first casing 111 and the second casing 121. Therefore, the arrangement number of the electronic components 4 can be increased. As a result, the number of electronic component packages 10 taken out can be increased, and the manufacturing cost of the electronic component package 10 can be reduced.
Further, the mounting process can be shortened by integrating the spacer 51.

  In this embodiment, two electrical wires are taken out, but this is not a limitation, and the number may be increased according to the number of electrodes of the electronic component to be enclosed.

(Third embodiment)
Next, although 3rd embodiment which concerns on this invention is described, the same code | symbol is attached | subjected to the site | part same as said 1st embodiment, the description is abbreviate | omitted, and only a different point is demonstrated.

  As shown in FIGS. 20 to 21, the electronic component package 100 of the present embodiment joins the electronic component 4, the spacer 5, the first casing 112 and the second casing 122, which are constituent members, and the electronic component 4 and And a casing 92 formed to cover the spacer 5.

  In the first embodiment, the casing 9 constituting the electronic component package 1 includes the first casing 11 and the second casing 12. On the other hand, in the electronic component package 100 of the present embodiment, the casing 92 is configured to close the first casing 112 and the first casing 112 formed with a concave accommodating portion capable of accommodating the electronic component 4 and the spacer 5. It is comprised by the 2nd casing 122 joined.

  In the present embodiment, a first casing 112 in which a concave housing portion is formed so that the electronic component 4 and the spacer 5 can be housed, and a plate-like second casing 122 that forms the casing 92 in a state of closing the general housing portion. Are bonded to the end face of the first casing 112 by adhesive bonding, solder bonding using gold or tin, anodic bonding, or the like.

And in this embodiment, it arrange | positions so that the functional surface of the electronic component 4 and the joint surface of the 2nd casing 122 may orthogonally cross.
A groove 142a and a groove 142b (not shown) are formed on the inner surface of the first casing 112.

  A conductive material is filled in the gap between the first groove 142a and the second groove 142b (not shown) and the spacer 5, and the auxiliary groove 162. Then, by drying the conductive material for a certain period of time, the electrode (not shown) of the electronic component 4 and the electric wiring are electrically and physically connected.

As shown in FIG. 22, two first wafers 211 and second wafers 221 having the same size in plan view are prepared.
The first wafer 211 is a constituent material of the first casing 112, and the second wafer 221 is a constituent material of the second casing 122.

FIG. 23 is a partial perspective view of the first casing 112. As shown in the figure, the first casing 112 is formed by forming a plurality of grooves 142 a and 142 b and auxiliary grooves 162 a and 162 b associated with the concave accommodating portion 7 on the first wafer 211.
The manufacturing method is the same as in the first embodiment.

  Thus, according to the electronic component package of the present embodiment, the functional surface having a large area in the electronic component 4 is generally not parallel to the joint surface of the casing 92 composed of the first casing 112 and the second casing 122. Therefore, the arrangement number of the electronic components 4 can be increased. As a result, the number of electronic component packages 100 taken out can be increased, and the manufacturing cost of the electronic component package 100 can be reduced.

In this embodiment, two electrical wires are taken out, but this is not a limitation, and the number may be increased according to the number of electrodes of the electronic component to be sealed.
In the present embodiment, the concave housing portion has a rectangular parallelepiped shape, but is not limited thereto, and may have a shape that matches the shape of the electronic component to be housed.

In the above embodiment, as shown in FIG. 24, the engaging portion 30 may be extended alongside the groove portion and the concave portion constituting the electric wiring.
The engaging portion 30 includes, for example, a convex portion 30 a provided on the spacer 52 and having a rectangular cross section by a surface perpendicular to the extending direction, and a convex portion provided on the inner surface of the first casing that is a contact surface. It is comprised with the recessed part 30b engaged with the part 30a.

With this configuration, even when the conductive material flows out from between the spacer 52 and the groove 143 when the conductive material is filled between the spacer 52 and the groove 143, the engagement portion 30 It is possible to prevent the conductive material from flowing through the engaging portion 30.
Therefore, it is possible to prevent one electrical wiring from being short-circuited with the other electrical wiring disposed adjacently.

  In addition, the cross section by a surface perpendicular | vertical to the direction where the convex part 30a is extended is not restricted to a rectangle, A triangle shape and semicircle shape may be sufficient. Further, the convex portion may be provided on the inner surface of the first casing 113 and the concave portion may be provided on the spacer 52.

  The first embodiment to the third embodiment of the present invention have been described in detail above with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the configuration does not depart from the gist of the present invention. Changes are also included.

  For example, in the first to third embodiments, the functional surface of the electronic component and the joint surface of the second casing are arranged so as to be orthogonal to each other. However, the functional surface of the electronic component and the joint surface of the second casing may be arranged so as to intersect each other.

  In the first to third embodiments, each groove is formed to be linear on a certain axis. However, the shape of the groove is not limited to this, and the shape of the groove may be bent as long as the electrical wiring can be taken out from the electrically connected electrode.

  Further, the positions of the auxiliary groove portions are not limited to this, and the auxiliary groove portions may be formed in a state of being arranged in parallel or in a state of being orthogonal to each other on the same plane.

1, 10, 100 Electronic component package 2 Electrical wiring 4 Electronic component 5, 51, 52 Spacer 6 Through hole 7 Housing portion 9, 92 Casing 11, 111, 112, 113 First casing 12, 121, 122 Second casing 13 First Three casings 14, 142, 143 Grooves 14a, 142a, 143a First groove 14b, 142b, 143b Second groove 15 Recess 15a First recess 15b Second recess 16, 162 Auxiliary groove 16a, 162a First auxiliary Groove parts 16b, 162b Second auxiliary groove parts 21, 211 First wafer 22, 221 Second wafer 23 Third wafer 30 Engaging part 30a Convex part 30b Concave part

Claims (6)

An electronic component having electrodes formed thereon;
A casing formed by joining a plurality of constituent members so as to cover the electronic component;
A spacer formed in close contact with the casing,
In the electronic component package in which the functional surface of the electronic component and the bonding surface between the constituent members of the casing intersect with each other,
The casing is formed with a groove portion connected to the electrode formed in the electronic component,
An electronic component package in which electrical wiring is formed to draw electrical connection from the electrode by filling a conductive material between the spacer and the groove. The electronic component package according to claim 1,
Along with the electrical wiring, an engagement portion between the spacer and the casing is extended,
The engaging part is an electronic component package configured by engaging a convex part provided on one of the spacer and the casing and a concave part provided on the other. The electronic component package according to claim 1 or 2,
An electronic component package in which a gap is formed between the electronic component and the spacer. In the electronic component package according to any one of claims 1 to 3,
An electronic component package in which a part of the electrical wiring is drawn out of the casing. An electronic component having electrodes formed thereon;
A casing formed by joining a plurality of constituent members so as to cover the electronic component;
A spacer formed in close contact with the casing,
A method of manufacturing an electronic component package, wherein the casing includes a first casing in which a through hole capable of accommodating the electronic component is formed, and a second casing and a third casing that cover both end openings of the through hole. In
Forming a plurality of the through holes in the first wafer forming the first casing;
Forming a plurality of grooves on the second wafer forming the second casing;
Bonding the first wafer and the second wafer constituting the second casing;
Mounting the spacer;
Mounting the electronic component such that the functional surface of the electronic component and the joint surface of the casing intersect;
After the step of disposing the electronic component, an electrical wiring that draws an electrical connection from the electrode is formed by filling a conductive material in a groove formed by the first casing, the second casing, and the spacer. Process,
Bonding the first wafer and the third wafer constituting the third casing;
Separating the bonded wafers into individual pieces;
An electronic component package manufacturing method comprising: An electronic component having electrodes formed thereon;
A casing formed by joining a plurality of components so as to cover the electronic component;
A spacer formed in close contact with the casing,
In the method of manufacturing an electronic component package, wherein the casing includes a first casing formed with a recess capable of accommodating the electronic component, and a second casing covering the opening of the first casing.
Forming a plurality of the recesses in the first wafer forming the first casing;
Mounting a spacer in the plurality of recesses;
Mounting the electronic component such that the functional surface of the electronic component and the joint surface of the casing intersect;
After the step of arranging the electronic component, forming an electrical wiring that draws out an electrical connection from the electrode by filling a conductive material in the groove formed by the first casing and the spacer; and
Bonding the first wafer and the second wafer constituting the second casing;
Separating the bonded wafers into individual pieces;
An electronic component package manufacturing method comprising:

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