JP5672928B2 - Electronic component device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component device in which an electronic component element is housed in an internal space composed of a substrate and a lid material, and a manufacturing method thereof, and more specifically, an electronic component in which the internal space is electromagnetically shielded by a lid material The present invention relates to an apparatus and a manufacturing method thereof.

  Conventionally, various electronic component devices in which electronic component elements such as piezoelectric vibrators are accommodated in an internal space have been proposed. For example, Patent Document 1 below discloses an electronic component device shown in a sectional view in FIG. In the electronic component device 1001 shown in FIG. 3, a package is constituted by a ceramic plate 1002 made of insulating ceramics and a lid member 1003. In this package, a sealed internal space 1004 is formed.

  The ceramic plate 1002 has a recess 1002a opened on the upper surface. The lid member 1003 is made of a metal such as Kovar. The lid member 1003 has a top plate portion and a side portion extending downward from the periphery of the top plate portion. An internal space 1004 is formed by the space surrounded by the side surface portion and the top plate portion of the lid member 1003 and the concave portion 1002 a of the ceramic plate 1002.

  An electrode land 1005 is formed on the ceramic plate 1002. The electrode land 1005 is connected to the upper end of the through electrode 1006. The lower end of the through electrode 1006 is electrically connected to the external electrode 1007.

  One end side of the crystal unit 1009 is bonded to the electrode land 1005 via a conductive bonding material 1008. Thereby, the crystal unit 1009 is supported by a cantilever beam. The electrode land 1005, the conductive bonding material 1008, and the crystal resonator 1009 are disposed in the internal space 1004. On the other hand, a frame-like electrode 1011 is formed on the upper surface of the ceramic plate 1002 so as to surround the internal space 1004. The lower end of the side surface of the lid member 1003 is electrically connected to the electrode 1011 by a frame-shaped conductive bonding material 1010.

WO03 / 017364A1

  There is a strong demand for downsizing of various electronic components such as the electronic component device 1001. When the miniaturization is advanced, the crystal unit 1009 and the lid member 1003 are also miniaturized. On the other hand, the frame-like electrode 1011 is used so as to be electrically connected to an external ground potential in order to perform an electromagnetic shielding function by the lid member 1003.

  However, when downsizing is advanced, the width of the frame-shaped electrode 1011 and the conductive bonding material 1008 provided in the frame shape is also reduced. Therefore, it is difficult to reliably electrically connect the frame-shaped electrode 1011.

  On the other hand, various methods for reducing the size by providing an electrical connection structure in the substrate have been proposed. For example, in the electronic component device 1001, a through electrode electrically connected to the frame-shaped electrode 1011 is formed on the ceramic plate 1002, and an external electrode connected to an external ground potential is formed on the lower surface of the ceramic plate 1002. Can be considered.

  However, when downsizing is advanced, the width of the frame-shaped electrode 1011 is also narrowed. Therefore, the frame-shaped electrode 1011 and the through electrode electrically connected to the frame-shaped electrode 1011 may not be reliably connected. That is, if a displacement occurs in the surface direction of the electrode land 1005, particularly in the direction from the inner side to the outer side of the internal space 1004, the through electrode 1006 may not be electrically connected to the narrow frame-shaped electrode 1011.

  An object of the present invention is to ensure electrical connection between a lid member that performs an electromagnetic shielding function and a through electrode provided on a substrate that constitutes a package together with the lid member, even when further miniaturization is promoted. It is an object of the present invention to provide an electronic component device having a structure that can be performed in the same manner.

  An electronic component device according to the present invention includes a substrate having first and second main surfaces facing each other, an electronic component element mounted on the first main surface of the substrate, and the first main surface of the substrate. The lower end is fixed to the electronic component element, is provided so as to surround the electronic component element, and has a conductive sealing frame material, together with the first main surface of the substrate and the sealing frame material. A lid member bonded to the upper end of the sealing frame member and having a conductive layer so as to form an internal space in which the electronic component element is disposed. In the present invention, the first electrode land is formed on the first main surface of the substrate, and the first electrode land is electrically connected to the electronic component element. Further, a first through electrode is provided so as to penetrate from the first main surface of the substrate to the second main surface, and the first through electrode is electrically connected to the first electrode land. . A first external electrode is formed on the second main surface of the substrate, and the first external electrode is electrically connected to the first through electrode.

Furthermore, in the present invention, the lower end of the sealing frame member and the first main surface of the substrate are bonded together by a frame-shaped conductive bonding material layer. On the first main surface of the substrate, a connection electrode is formed so as to face the internal space, and the connection electrode is connected to the conductive bonding material layer. Further, a second through electrode is provided so as to penetrate the second main surface from the first main surface of the substrate, and the second through electrode is electrically connected to the connection electrode. A second external electrode that is a ground electrode is provided on the second main surface of the substrate so as to be electrically connected to the second through electrode.

  In a specific aspect of the electronic component device according to the present invention, the connection electrode is located in the internal space, and the second through electrode is electrically connected to the connection electrode in the internal space. ing. Therefore, further miniaturization can be achieved.

In another specific aspect of the electronic component device according to the present invention, the dimension of the connection electrode in a direction orthogonal to the portion extending from the conductive bonding material layer toward the internal space is set to the width of the connection electrode. In this case, the width of the connection electrode is larger than the width of the conductive bonding material layer. In this case, the connection electrode and the conductive bonding material layer can be more reliably electrically connected.

  In still another specific aspect of the electronic component device according to the present invention, the electronic component device is provided on the first main surface so as to protrude upward from the first main surface of the substrate. A pedestal member supported like a cantilever is further provided. In this case, even if the electronic component element is displaced, the electronic component element can be supported by the base member without hindering the displacement of the electronic component element.

  In still another specific aspect of the electronic component device according to the present invention, the electronic component element is a piezoelectric vibrator, and the lower surface of the lid member and the portion of the first main surface of the substrate facing the internal space are stepped. The distance between the lower surface of the lid member and the first main surface of the substrate is such that the piezoelectric vibrator is in contact with the piezoelectric vibrator supported by the pedestal member. It is not long. In this case, the piezoelectric vibrator can be vibrated in the internal space without hindering the displacement of the piezoelectric vibrator.

  In still another specific aspect of the electronic component device according to the present invention, the sealing frame member is a first sealing frame member positioned on the first main surface side of the substrate, and the lid. A second sealing frame member positioned on the lower surface side of the material, and the upper end of the first sealing frame member and the lower end of the second sealing frame member are joined. In this case, it is possible to easily assemble the electronic component device by joining the structure in which the first sealing frame member is joined to the structure in which the second sealing frame member is joined to the lid member. it can.

  In still another specific aspect of the electronic component device according to the present invention, the first sealing frame member and the base member are made of the same material. In this case, it is possible to reduce the material cost and consequently the cost of the electronic component device.

  In still another specific aspect of the electronic component device according to the present invention, at least a part of the connection electrode is located in a region immediately below the piezoelectric vibrator. In this case, further downsizing can be achieved.

The method for manufacturing an electronic component device according to the present invention includes first and second through electrodes having first and second main surfaces facing each other and extending from the first main surface to the second main surface. the is formed on the first main surface, said first electrode lands connected to the through electrode, the first main front Stories second to be connected respectively to the second through electrode a second external electrode which is a first external electrode and a ground electrode formed on the surface, the electrode lands and first, frame the second through electrode provided so as to surround the area provided Prepared a substrate having a conductive conductive material layer and a connection electrode connected to the conductive joint material layer and provided in a region surrounded by the conductive joint material layer And an electronic component electrically connected to the electrode land on the first main surface of the substrate. A step of mounting a child, a step of bonding a sealing frame member to the first main surface of the substrate so as to surround the electronic component element via the conductive bonding material layer, and the sealing Joining a lid material to the upper surface of the frame material.

  In a specific aspect of the method for manufacturing an electronic component device according to the present invention, after the sealing frame member is bonded to the first main surface of the substrate by the conductive bonding material layer, the lid member is sealed. Secure to the top edge of the frame. However, in the present invention, after the sealing frame member is bonded to the lower surface of the lid member, the lower end of the sealing frame member is attached to the first main surface of the substrate via the conductive bonding material layer. You may join.

  In still another specific aspect of the method for manufacturing an electronic component device according to the present invention, the electronic component element is a piezoelectric vibrator, and a portion of the substrate facing the internal space is flat, and the lid member A lid member having a flat portion facing the internal space is used, and a pedestal member is provided on the substrate so as to protrude from the first main surface of the substrate, and then the piezoelectric vibrator is cantilevered on the pedestal member. And fixed so as to be supported by the base member. In this case, the piezoelectric vibrator can be reliably supported by the base member without hindering the displacement of the piezoelectric vibrator.

  In still another specific aspect of the method for manufacturing an electronic component device according to the present invention, as the sealing frame material, a first sealing frame material positioned on the first main surface side of the substrate, and A step of preparing a second sealing frame member positioned on the lid member side and joining the first and second sealing frame members is further provided. In this case, the first and second sealing frame members can reliably form an internal space having a high height direction dimension.

  In still another specific aspect of the method for manufacturing an electronic component device according to the present invention, the first and second sealing frame members are joined by metal diffusion. In this case, the first and second sealing frame members can be easily attached in a state where the first and second sealing frame members are in contact with each other, that is, in a state where both are positioned reliably. And it can connect reliably and can aim at conduction | electrical_connection of the 1st, 2nd sealing frame material reliably.

  In still another specific aspect of the electronic component device according to the present invention, the sealing frame material is formed by a photolithography method. Therefore, the sealing frame material can be easily formed with high accuracy.

In the electronic component device according to the present invention, the lid member having the conductive layer is securely attached to the conductive sealing frame member, the conductive bonding material layer, the connection electrode, the second through electrode, and the second external electrode. Since it can be electrically connected, the inside space can be reliably electromagnetically shielded. In addition, since the connection electrode is formed on the first main surface of the substrate so as to face the internal space, the electronic component device can be downsized even if a connection portion between the conductive bonding material layer and the connection electrode is provided. Is not disturbed.

  In addition, since the connection electrode may be bonded to the second through electrode in the internal space, even when the width of the conductive bonding material layer is small, that is, from the inside of the internal space of the conductive bonding material layer. Even if the positional deviation in the outward direction occurs, the connection electrode and the second through electrode can be reliably electrically connected. Therefore, the reliability of electrical connection between the frame-shaped conductive bonding material layer and the second through electrode can be effectively increased, and the electronic component device can be greatly reduced in size.

(A) is a schematic top view which shows the state which removed the cover material in the electronic component apparatus of one Embodiment of this invention, (b) and (c) are the electronic components of one Embodiment of this invention. It is sectional drawing of an apparatus, and is sectional drawing of the electronic component apparatus corresponded in the part in alignment with the AA line and BB line in (a). It is front sectional drawing of the electronic component apparatus which concerns on the modification of this invention. It is front sectional drawing which shows an example of the conventional electronic component apparatus.

  Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

  As shown in FIGS. 1A to 1C, the electronic component device 1 has a substrate 2 made of an insulating material. The substrate 2 has first and second main surfaces 2a and 2b facing each other. In the present embodiment, the first main surface 2a, that is, the upper surface of the substrate 2 is a flat surface and has no recess. Similarly, the 2nd main surface 2b, ie, a lower surface, is also a flat surface, and does not have a recessed part. The substrate 2 is made of an appropriate insulating material such as insulating ceramics such as alumina or synthetic resin.

  On the first main surface 2a of the substrate 2, a first electrode land 3a, a second electrode land 3b and a rectangular frame-shaped conductive bonding material layer 5 are formed.

  A first through electrode 6 is formed on the substrate 2 so as to penetrate the first main surface 2a and the second main surface 2b. The upper end of the first through electrode 6 is electrically connected to the first electrode land 3a. A first external electrode 7 is formed on the second main surface 2b. The first external electrode 7 is electrically connected to the lower end of the first through electrode 6.

  On the other hand, a second through electrode 8 is formed on the substrate 2 so as to penetrate between the first main surface 2a and the second main surface 2b. The second through electrode 8 is electrically connected to the connection electrode 4. A second external electrode 9 is formed on the second main surface 2 b so as to be electrically connected to the lower end of the second through electrode 8.

  As shown in FIGS. 1A and 1C, the connection electrode 4 is connected to and electrically connected to the inner edge of the frame-shaped conductive bonding material layer 5. In the present embodiment, at least a part of the connection electrode 4 is located in a region immediately below the piezoelectric vibrator 11 described later. Therefore, the connection electrode 4 can be formed without increasing the size of the electronic component device 1.

  The substrate 2 having the first and second through electrodes 6 and 8 can be obtained by an appropriate method such as a method of filling a conductive paste after forming a through hole in the substrate 2. The electrode lands 3a and 3b and the connection electrode 4 can be formed by an appropriate method such as a photolithography method or printing of a conductive paste. Similarly, the first and second external electrodes 7 and 9 can be easily formed by a photolithography method, printing of a conductive paste, or the like.

  The first and second electrode lands 3a and 3b, the connection electrode 4, the first and second through electrodes 6 and 8, and the first and second external electrodes 7 and 9 are made of Ag, Cu, Al, or these It can be formed of an appropriate metal such as an alloy.

  In the electronic component device 1 of this embodiment, the base members 10 and 10 are provided on the first main surface 2a of the substrate 2 so as to protrude upward from the first main surface 2a. A piezoelectric vibrator 11 is fixed to the upper surfaces of the base members 10 and 10 at one end side thereof. Therefore, the tip 11a of the piezoelectric vibrator 11 is a free end, and the piezoelectric vibrator 11 is supported in a cantilever manner. Here, the distance between the lower surface of the lid member 14 and the first main surface 2a of the substrate 2 is the length that the piezoelectric vibrator 11 does not contact in the vibration state of the piezoelectric vibrator 11 supported by the pedestal member 10. Has been. Therefore, the piezoelectric vibrator 11 and the substrate 2 can be displaced so as not to interfere with each other. Furthermore, since the recess is not formed in the substrate 2 and is flat, when a force is applied to the substrate 2, stress concentration does not occur at the corner of the bottom surface of the recess of the substrate 2, so that the substrate 2 can be prevented from cracking. Furthermore, in the present invention, the member required for preventing the interference between the piezoelectric vibrator 11 and the substrate 2 may be a member that makes the base member 10 longer, so that compared with the case where the thickness of the substrate 2 is increased in order to provide the recess. The resources necessary for manufacturing the electronic component device 1 can be suppressed.

  On the other hand, a sealed internal space 12 is formed on the substrate 2 so as to surround the piezoelectric vibrator 11. The internal space 12 includes a substrate 2, a sealing frame member 13 bonded onto the substrate 2, and a lid member 14.

  The sealing frame member 13 is made of a metal such as Kovar, Al, or Cu, and has conductivity. Similar to the conductive bonding material layer 5, the sealing frame member 13 has a substantially rectangular frame-like planar shape. The lower end of the sealing frame member 13 is bonded to the substrate 2 by the conductive bonding material layer 5.

  In the present embodiment, the sealing frame member 13 includes first and second sealing frame members 13a and 13b. The first sealing frame member 13a has a lower end bonded to the conductive bonding material layer 5 and an upper end bonded to the lower end of the second sealing frame member 13b. In the present embodiment, the sealing frame members 13a and 13b are made of metal, and both are joined by metal diffusion.

  Preferably, the first sealing frame member 13 a is made of the same material as the base member 10. In that case, the first sealing frame member 13a and the base member 10 can be formed in the same process on the upper surface of the substrate 2, and the manufacturing process can be simplified.

  In particular, when the height of the base member 10 and the first sealing frame member 13a is the same, it is desirable that the manufacturing process can be further simplified.

  On the other hand, the upper end of the second sealing frame member 13 b is joined to and electrically connected to the conductive layer 14 a provided below the lid member 14. In this embodiment, the lid member 14 is made of an insulating ceramic such as alumina and has a conductive layer 14a on the lower surface. But the cover material 14 may have the conductive layer 14a inside, and the cover material 14 whole may be a conductive layer. In any case, the lower surface of the lid member 14 is flat and has no recess.

  Therefore, a sealed internal space 12 is formed by the first main surface 2 a of the substrate 2, the sealing frame member 13, and the lower surface of the lid member 14. Further, the side of the internal space 12 is surrounded by a sealing frame member 13 having conductivity, and a conductive layer 14a exists above. Therefore, the internal space 12 for sealing can be electromagnetically shielded.

  When using the electronic component device 1 of the present embodiment, the piezoelectric vibrator 11 can be driven by electrically connecting the first external electrode 7 to the outside. In this case, since the piezoelectric vibrator 11 is supported by the pedestal member 10 in a cantilever manner in the internal space 12, even when the tip 11a of the piezoelectric vibrator 11 has a large displacement, the displacement is prevented. hard.

  Moreover, even if the dimension in the surface direction of the substrate 2 is reduced in order to reduce the size, electrical connection between the second external electrode 9, the conductive layer 14a, and the sealing frame member 13 is reliably achieved. be able to.

  More specifically, when the size is reduced, the width of the conductive bonding material layer 5, that is, the direction perpendicular to the direction extending in the rectangular frame shape of the conductive bonding material layer 5 is defined as the width. Becomes smaller. In that case, in the conventional electronic component device 1001, for example, when an electrical connection is made with a conductive bonding material layer using a through electrode such as the second through electrode 8 of the present embodiment, the conductive bonding material layer There was a risk of poor conduction due to the positional deviation in the surface direction of No. 5.

  On the other hand, according to the electronic component device 1 of the present embodiment, even if the width of the conductive bonding material layer 5 is reduced, the second through electrode 8 is not connected to the conductive bonding material layer 5 but is connected. It is electrically connected to the electrode 4. The connection electrode 4 need only be formed so as to be continuous with the conductive bonding material layer 5 and so as to face the internal space 12. Therefore, even if the width of the conductive bonding material layer 5 becomes narrow and a positional shift in the direction connecting the inner side and the outer side of the inner space 12 of the conductive bonding material layer 5 occurs, the connection electrode is independent of the positional shift. 4 and the 2nd penetration electrode 8 can be electrically connected reliably. Thereby, since the rectangular frame-shaped electroconductive joining material layer 5 can be made small, the mounting area of the electronic component apparatus 1 can be made small. Further, since the electrical connection portion between the connection electrode 4 and the second through electrode 8 is reliably disposed in the internal space 12, the influence of the external environment applied to the electrical connection portion, for example, the external environment of humidity or temperature It is possible to suppress an increase in the resistance value of the joint portion due to the change of. Furthermore, since the position of the second through electrode 8 can be separated from the end surface of the substrate 2, the periphery of the second through electrode 8 can be compared to when the second through electrode 8 is adjacent to the end surface of the substrate 2. The strength of the substrate 2 is improved.

  Therefore, in order to enhance the electromagnetic shielding function, when the second external electrode 9 is connected to an external ground potential, the sealing frame member 13 and the conductive layer 14a are reliably connected to the ground potential, It is possible to reliably shield the electromagnetic wave.

  The width of the connection electrode 4, that is, the dimension of the connection electrode 4 in the direction orthogonal to the portion extending from the conductive bonding material layer 5 toward the internal space 12 side is larger than the width of the conductive bonding material layer 5. Is preferred. The width of the conductive bonding material layer 5 refers to a dimension in a direction perpendicular to the circumferential direction of the frame-shaped conductive bonding material layer 5. When the width of the connection electrode 4 is larger than the width of the conductive bonding material layer 5 as described above, the connection electrode 4 is made conductive even when the width of the conductive bonding material layer 5 becomes narrow as the size is reduced. The conductive bonding material layer 5 and the second through electrode 8 can be reliably electrically connected. That is, even when the width of the conductive bonding material layer 5 becomes narrow, the connection electrode 4 is reliably electrically connected to the conductive bonding material layer 5. In addition, in the conventional electronic component device shown in FIG. 3, when the width of the frame-shaped bonding material layer is narrowed and the position of the frame-shaped bonding material layer is shifted, the electrical connection with the through electrode is poor. Could occur. On the other hand, in this embodiment, when the width of the connection electrode 4 is relatively large as described above, the positional deviation tolerance between the second through electrode 8 and the connection electrode 4 is as described above. It can be made larger than the tolerance of displacement in the conventional electronic component device 1001. Accordingly, the connection electrode 4 can be reliably electrically connected to the second through electrode 8.

  In the electronic component device 1 of the present embodiment, the substrate 2 having a flat upper surface and the lid member 14 having a flat lower surface are used, so that the cost for processing the substrate 2 and the lid member 14 is not required. Therefore, an inexpensive and small electronic component device 1 can be obtained. However, as in the conventional example shown in FIG. 3, a recess may be formed on the upper surface of the substrate 2, and a recess may be formed on the lower surface of the lid member 14. Therefore, in the electronic component device 1 of the present embodiment, the sealing structure and the electromagnetic shielding function are achieved through an assembly process that uses the substrate 2, the lid member 14 and the like that do not have a complicated shape and does not require complicated operations. A structure can be constructed. In addition, since the connection electrode 4 is disposed in the internal space 12, the internal space 12 can be reliably electromagnetically shielded from the outside even when downsizing is promoted.

  In the above embodiment, the piezoelectric vibrator 11 is shown as the electronic component element. However, an electronic component element other than the piezoelectric vibrator may be sealed in the internal space 12. Further, an electronic component element such as the piezoelectric vibrator 11 may be mounted on the substrate 2 without using the base member 10. However, by using the pedestal member 10, the piezoelectric vibrator 11 having a large displacement can be mounted.

  Furthermore, the electronic component element including the piezoelectric vibrator 11 may be supported in a mode other than the cantilever.

  Next, a method for manufacturing the electronic component device 1 according to the above embodiment will be described. In manufacturing the electronic component device 1 of the present embodiment, the first and second through electrodes 6 and 8, the first and second electrode lands 3a and 3b, the connection electrode 4, the conductive bonding material layer 5, and the first 1. A substrate 2 having second external electrodes 7 and 9 is prepared. A base member 10 is formed on the substrate 2 and a piezoelectric vibrator 11 is mounted thereon. Note that the connection electrode 4 and the conductive bonding material layer 5 are preferably formed at the same time by a normal plating process or the like using the same material. In this case, a step does not occur at the junction between the connection electrode 4 and the conductive bonding material layer 5. Therefore, compared with the case where the connection electrode 4 and the conductive bonding material layer 5 are individually formed and bonded, the bonding surface between the first sealing frame material 13a and the second sealing frame material 13b described later. Becomes flat. Thereby, the joining of the 1st frame material 13a for sealing mentioned later and the frame material 13b for 2nd sealing can be strengthened. Preferably, the main surface 2a of the substrate 2 on which the conductive bonding material layer 5 and the bonding portion between the conductive bonding material layer 5 and the connection electrode 4 are formed in order to make the above-described bonding surface flatter, is flat. More preferably, since the formation process of the connection electrode 4 and the conductive bonding material layer 5 becomes easy, the main surface 2a of the substrate 2 may be flat as a whole.

  Next, the first sealing frame member 13 a is formed so as to be bonded to the conductive bonding material layer 5. In this case, even if the width of the conductive bonding material layer 5 is narrow, the upper surface of the conductive bonding material layer 5 is exposed, so that the first sealing frame member 13a can be reliably connected to the conductive bonding material 5a. Can be bonded to layer 5. The first sealing frame member 13a is preferably formed by photolithography. Thereby, the first sealing frame member 13a can be formed with high accuracy.

  However, the first sealing frame member 13 a may be formed in advance and bonded to the conductive bonding material layer 5.

  On the other hand, a lid member 14 is prepared, and a second sealing frame member 13 b is formed on the lower surface of the lid member 14. Next, a second sealing frame member 13b is formed on the conductive layer 14a on the lower surface of the lid member 14 by photolithography or the like. When the photolithography method is used, the second sealing frame member 13b can be formed with high accuracy. However, a sealing frame member 13 b prepared in advance may be joined to the lower surface of the lid member 14. In this way, after preparing the lid member 14 to which the second sealing frame member 13b is joined, the lower end of the second sealing frame member 13b is replaced with the upper end of the first sealing frame member 13a. The first sealing frame member 13a and the second sealing frame member 13b are joined by diffusion of the metal by heating. Thereby, the electronic component device 1 can be obtained.

  In the above manufacturing method, the first sealing frame member 13a is formed in advance on the substrate 2 side, and the second sealing frame member 13b is formed on the lid member 14 side. After the fixing frame member 13a is formed on the substrate 2, the second sealing frame member 13b may be formed, and the lid member 14 may be further bonded onto the second sealing frame member 13b. However, by preparing a structure in which the second sealing frame member 13b is formed on the lid member 14 in advance, it is possible to improve the handleability during the joining operation. Even in that case, the first, second, and second sealing frame members 13 a and 13 b may be prepared in advance as separate members and bonded to the substrate 2 and the lid member 14.

  Further, the first and second sealing frame members 13a and 13b may be joined by a joining method using a conductive adhesive or the like without depending on metal diffusion. According to the joining method by metal diffusion, the electrical connection between the first and second sealing frame members 13a and 13b is further ensured without requiring other materials such as a conductive adhesive and solder. Can be planned.

  In the above embodiment, the sealing frame member 13 has the first and second sealing frame members 13a and 13b. However, as in the modification shown in FIG. The internal space 12 may be sealed with the material 13A. In this case, after forming or joining the sealing frame member 13A on the substrate 2, the lid member 14 may be joined, or the sealing frame member 13A is formed or joined to the lower surface of the lid member 14. After that, the lower end of the sealing frame member 13 </ b> A may be joined to the substrate 2.

  When the sealing frame member 13A is used, the number of parts can be reduced. However, in the above-described embodiment having the first and second sealing frame members 13a and 13b, the internal space is adjusted by adjusting the height direction dimensions of the first and second sealing frame members 13a and 13b. The height of 12 can be easily adjusted. In addition, since the internal space 12 having a sufficient height dimension can be formed, the periphery thereof can be surrounded so as not to inhibit the vibration of the piezoelectric vibrator 11 having a large displacement amount.

DESCRIPTION OF SYMBOLS 1 ... Electronic component apparatus 2 ... Board | substrate 2a ... 1st main surface 2b ... 2nd main surface 3a ... 1st electrode land 3b ... 2nd electrode land 4 ... Connection electrode 5 ... Conductive joining material layer 6 ... 1st DESCRIPTION OF SYMBOLS 1 1 through electrode 7 ... 1st external electrode 8 ... 2nd through electrode 9 ... 2nd external electrode 10 ... Base member 11 ... Piezoelectric vibrator 11a ... Tip 12 ... Internal space 13 ... Frame material 13A ... Sealing frame member 13a ... First sealing frame member 13b ... Second sealing frame member 14 ... Lid member 14a ... Conductive layer

Claims (15)

A substrate having first and second main surfaces facing each other;
An electronic component element mounted on the first main surface of the substrate;
A lower end is fixed to the first main surface of the substrate, is provided so as to surround the electronic component element, and has a conductive sealing frame member,
The first main surface of the substrate and the sealing frame member are joined to the upper end of the sealing frame member so as to form an internal space in which the electronic component element is disposed, and conductive A lid having a layer;
A first electrode land formed on the first main surface of the substrate and electrically connected to the electronic component element;
A first through electrode that is electrically connected to the first electrode land and is provided so as to penetrate from the first main surface of the substrate to the second main surface;
A first external electrode electrically connected to the first through electrode and formed on the second main surface of the substrate;
Bonding the lower end of the sealing frame and the first main surface of the substrate, and a frame-shaped conductive bonding material layer;
A connection electrode formed on the first main surface of the substrate so as to face the internal space and connected to the conductive bonding material layer;
A second through electrode provided so as to penetrate the second main surface from the first main surface of the substrate and electrically connected to the connection electrode;
An electronic component device comprising: a second external electrode which is a ground electrode electrically connected to the second through electrode and provided on a second main surface of the substrate.   The electronic component device according to claim 1, wherein the connection electrode is located in the internal space, and the second through electrode is electrically connected to the connection electrode in the internal space.   When the dimension of the connection electrode in the direction orthogonal to the portion extending from the conductive bonding material layer toward the internal space side is the width of the connection electrode, the width of the connection electrode is the conductive bond. The electronic component device according to claim 1, wherein the electronic component device is larger than a width of the material layer.   The base member further provided on the first main surface so as to protrude upward from the first main surface of the substrate and supporting the electronic component element in a cantilever shape. The electronic component device according to any one of 1 to 3. The electronic component element is a piezoelectric vibrator, a lower surface of the lid material and a portion of the first main surface of the substrate facing the internal space are flat without a step, and the lower surface of the lid material and the 5. The electronic component device according to claim 4, wherein a distance between the first main surface of the substrate and the piezoelectric vibrator supported by the pedestal member is such that the piezoelectric vibrator does not contact in a vibration state. 6. . The sealing frame member is positioned on the first main surface side of the substrate, and the second sealing frame is positioned on the lower surface side of the lid member. The electronic component device according to claim 4 , wherein an upper end of the first sealing frame member and a lower end of the second sealing frame member are joined to each other.   The electronic component device according to claim 6, wherein the first sealing frame member and the base member are made of the same material.   The electronic component device according to claim 1, wherein at least a part of the connection electrode is located in a region immediately below the piezoelectric vibrator. First and second through electrodes having first and second main surfaces facing each other and extending from the first main surface to the second main surface, and formed on the first main surface , said first electrode lands connected to the through electrodes of the first, and the first external electrode which is formed before Symbol second major surface to be connected respectively to the second through electrode a second external electrode is a ground electrode, wherein the electrode land and the first and second through-frame shape electrode is provided so as to surround the area provided for conductive bonding material layer, conductive Preparing a substrate having a connection electrode connected to the bonding material layer and provided so as to reach a region surrounded by the conductive bonding material layer;
Mounting an electronic component element on the first main surface of the substrate so as to be electrically connected to the electrode land;
Bonding a sealing frame member to the first main surface of the substrate so as to surround the electronic component element via the conductive bonding material layer;
The manufacturing method of an electronic component apparatus provided with the process of joining a cover material to the upper surface of the said frame material for sealing.   The electron according to claim 9, wherein the lid member is fixed to an upper end of the sealing frame material after the sealing frame material is bonded to the first main surface of the substrate by the conductive bonding material layer. A method for manufacturing a component device.   10. After joining the sealing frame material to the lower surface of the lid member, the lower end of the sealing frame material is joined to the first main surface of the substrate via the conductive joining material layer. The manufacturing method of the electronic component apparatus as described in 2.   The electronic component element is a piezoelectric vibrator, and a substrate having a flat portion facing the internal space of the substrate and a lid member having a flat portion facing the internal space of the lid member are formed on the substrate. The pedestal member is provided so as to protrude from the first main surface of the substrate, and then the piezoelectric vibrator is fixed to the pedestal member so as to be supported by the pedestal member with a cantilever. The manufacturing method of the electronic component apparatus of Claim 1.   As the sealing frame material, a first sealing frame material located on the first main surface side of the substrate and a second sealing frame material located on the lid material side are prepared, The manufacturing method of the electronic component apparatus of any one of Claims 9-12 further equipped with the process of joining the 1st, 2nd sealing frame material.   The method of manufacturing an electronic component device according to claim 13, wherein the first and second sealing frame members are joined by metal diffusion. The method for manufacturing an electronic component device according to claim 9, wherein the sealing frame member is formed by a photolithography method.

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