JP5805471B2 - Piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device used in electronic equipment and the like.

  As a conventional piezoelectric device, for example, a structure mainly composed of an element mounting member, a piezoelectric vibration element, and an electronic component is known (see, for example, Patent Document 1). A piezoelectric vibration element and an electronic component are mounted in one recessed space provided in the element mounting member. There exists a thermistor element as an electronic component. The thermistor element is used to obtain temperature information of the piezoelectric vibration element.

JP 2008-205938 A

  However, in the conventional piezoelectric device, the piezoelectric vibration element and the thermistor element are mounted in one recessed space, and the recessed space is hermetically sealed. Therefore, for example, when a heat treatment process such as reflow heating when mounting the piezoelectric device on the mounting substrate is performed on the piezoelectric device, gas generated from the connection electrode provided in the thermistor element adheres to the piezoelectric vibration element. There is a problem that the oscillation frequency of the piezoelectric device may fluctuate.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the piezoelectric device which can reduce the fluctuation | variation of an oscillation frequency.

According to one aspect of the present invention, a piezoelectric device includes four corners of a substrate portion, a frame portion provided on the first principal surface of the substrate portion, and a second principal surface of the substrate portion that is rectangular in plan view. A pair of piezoelectric vibration elements mounted on the principal surface of the substrate portion exposed in the recessed space formed by the substrate portion and the frame portion and the element mounting member provided with the electrode for connecting the terminal member provided on the substrate A piezoelectric vibrator comprising a piezoelectric vibration element mounted on a pad, a lid that hermetically seals a recessed space, and four terminals that are joined and electrically connected to each terminal member connection electrode The two pairs of piezoelectric vibration element mounting pads, each of which includes a member and an electronic component, are electrically connected to only two terminal member connection electrodes among the four terminal member connection electrodes. Are two terminal members that are not electrically connected to the piezoelectric vibration element mounting pad. Two terminal members joined to connection electrode, and is characterized in that it is equipped with electrical connection.

  A piezoelectric device according to one aspect of the present invention includes a piezoelectric vibration element that includes an electronic component that is fixed to a plurality of terminal members provided in a piezoelectric vibrator and electrically connected to the terminal member. And the electronic component are mounted separately in the recess space of the piezoelectric vibrator and the terminal member provided outside the recess space of the piezoelectric vibrator, respectively, so that heating such as reflow heat treatment when mounting the piezoelectric device Even if the processing step is performed, the gas generated from the connection electrode provided in the electronic component does not adhere to the piezoelectric vibration element. Therefore, fluctuations in the oscillation frequency of the piezoelectric device can be reduced.

1 is an exploded perspective view showing a piezoelectric device according to a first embodiment. (A) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. (A) is the top view seen from the 1st main surface of the element mounting member which comprises the piezoelectric device which concerns on embodiment, (b) is the board | substrate part of the element mounting member which comprises the piezoelectric device which concerns on embodiment It is the top view seen from the 1st main surface of this, (c) is the top view seen from the 2nd main surface of the element mounting member which comprises the piezoelectric device which concerns on embodiment. It is sectional drawing which shows the piezoelectric device which concerns on 2nd Embodiment. It is sectional drawing which shows the piezoelectric device which concerns on 3rd Embodiment. It is a disassembled perspective view which shows the piezoelectric device which concerns on 4th Embodiment. (A) is CC sectional drawing of FIG. 6, (b) is DD sectional drawing of FIG. It is a disassembled perspective view which shows the piezoelectric device which concerns on 5th Embodiment. It is the top view which looked at the terminal member which comprises the piezoelectric device which concerns on 5th Embodiment from the joint surface. It is a disassembled perspective view which shows the piezoelectric device which concerns on 6th Embodiment. (A) is EE sectional drawing of FIG. 10, (b) is FF sectional drawing of FIG.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described.

(First embodiment)
As shown in FIGS. 1 and 2, the piezoelectric device 100 according to the first embodiment mainly includes a piezoelectric vibrator 10, a terminal member 150, and an electronic component 140. A plurality of terminal members 150 are joined to the second main surface of the piezoelectric vibrator 10, and an electronic component 140 is fixed and electrically connected to at least two of the plurality of terminal members 150.

  The piezoelectric vibrator 10 includes an element mounting member 110, a piezoelectric vibration element 120, and a lid 130. The piezoelectric vibration element 120 is mounted in a recessed space K1 formed in the element mounting member 110, and the recessed space K1 is hermetically sealed with a lid 130.

  As shown in FIGS. 1 and 2, the element mounting member 110 is mainly configured by a substrate portion 110a and a frame portion 110b provided on the first main surface of the substrate portion 110a. A recessed space K1 is formed by the first main surface and the frame portion 110b.

  The substrate part 110a has, for example, a rectangular flat plate shape in plan view, and is made of a ceramic material such as alumina ceramics or glass-ceramics. A frame-shaped sealing conductor film HB is provided on the outer peripheral edge of the first main surface of the substrate portion 110a, and a pair of piezoelectric vibration element mounting pads 111 are provided inside the sealing conductor film HB. It has been.

  As shown in FIG. 3, terminal member connection electrodes G are provided at the four corners of the second main surface of the substrate portion 110a. The terminal member connection electrode G includes a pair of piezoelectric vibration element electrodes G1 and a pair of electronic component electrodes G2. The pair of piezoelectric vibration element electrodes G <b> 1 is provided at corners at both ends of the short side of the second main surface of the substrate portion 110 a of the element mounting member 110. Further, the pair of electronic component electrodes G2 is provided at corners at both ends of the short side of the substrate portion 110a different from the short side on which the piezoelectric vibrating element electrode G1 is provided.

  The piezoelectric vibration element mounting pad 111 and the piezoelectric vibration element electrode G1 are electrically connected by a first via conductor 112 formed inside the substrate portion 110a.

  One of the electronic component electrodes G2 may be connected to the sealing conductor film HB by a second via conductor 113 formed in the substrate portion 110a. The electronic component electrode G2 is connected to a terminal member 150 described later, and this terminal member 150 serves as a ground terminal by being connected to a mounting pad connected to the ground on the mounting substrate. Therefore, the metal frame portion 110b joined to the sealing conductor film HB via the brazing material and the lid body 130 joined to the frame portion 110b are connected to the ground, and the frame portion 110b and the lid body are connected. The shield property in the recessed space K1 by 130 is improved.

  When the element mounting member 110 is made of, for example, alumina ceramics, first, a ceramic green sheet is formed by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder, and punching or the like is performed on the ceramic green sheet. A conductor paste that becomes the first via conductor 112, the second via conductor 113, and the like is applied to the through-hole provided by conventional well-known screen printing, and the piezoelectric vibration element mounting pad 111 and the sealing conductor film HB are formed on the surface. A conductor paste to be used as the terminal member connection electrode terminal G is printed and applied in these shapes, and a predetermined number of layers are laminated and pressure-bonded, followed by firing at a high temperature.

  The frame part 110b is made of, for example, a metal such as a frame-like Fe—Ni—Co alloy, and is joined to the sealing conductor film HB provided on the first main surface of the substrate part 110a by brazing or the like.

  By providing the frame portion 110b on the first main surface of the substrate portion 110a, a recessed space K1 is formed in a region surrounded by the substrate portion 110a and the inner wall of the frame body 110b, and the piezoelectric vibration element 120 is formed in the recessed space K1. Be contained.

  As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by depositing an excitation electrode 122 on a quartz base plate 121, and when an alternating voltage from the outside is applied to the excitation electrode 122, Excitation is generated at a predetermined vibration mode and frequency. The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle. The excitation electrode 122 is formed by depositing and forming metal in a predetermined pattern on both the front and back main surfaces of the quartz base plate 121. In addition, an extraction electrode 123 that is connected to each of the excitation electrodes 122 that are attached to both main surfaces and extends to the end of the quartz base plate 121 is formed.

  Such a piezoelectric vibration element 120 is obtained by electrically and mechanically connecting the lead electrode 123 and the piezoelectric vibration element mounting pad 111 formed on the inner bottom surface of the recessed space K1 through the conductive adhesive DS. It is mounted in the recessed space K1. Then, the lid 130 is joined to the frame part 110 b, whereby the piezoelectric vibration element 120 in the recessed space K <b> 1 is hermetically sealed and becomes the piezoelectric vibrator 10.

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W) , Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used.

  The lid 130 is a flat plate made of, for example, a rectangular Fe—Ni alloy or Fe—Ni—Co alloy. Such a lid 130 is for hermetically sealing the recessed space K1 in a vacuum state or the recessed space K1 filled with nitrogen gas or the like. For example, the lid 130 is placed on the frame portion 110b of the element mounting member 110 in a predetermined atmosphere, and is joined to the frame portion 110b by performing seam welding.

  A plurality of terminal members 150 are joined to the second main surface of the element mounting member 110 of the piezoelectric vibrator 10, and the electronic component 140 is fixed and electrically connected to at least two of the plurality of terminal members 150. Thus, the piezoelectric device 100 is obtained.

  The terminal member 150 functions as an electronic component electrode terminal for mounting the electronic component 140 and an external connection electrode terminal of the piezoelectric device 100. The terminal member connection electrode G formed on the element mounting member 110 of the piezoelectric vibrator 10 is bonded via a conductive bonding material HD such as solder.

  The terminal member 150 is made of, for example, a metal material having relatively high conductivity such as copper, and has a connection portion 151 on the side connected to the mounting substrate and the electrode portion 152 on the side connected to the piezoelectric vibrator 10. And a step portion is formed by the connection portion 151 and the electrode portion 152 having different sizes in plan view. In the present embodiment, as shown in FIG. 1 and FIG. 2, the connection portion 151 is larger than the electrode portion 152, and the portion where they do not overlap becomes the joint portion 154 to which the electronic component 140 is joined. The electronic component 140 is connected to the main surface of the step portion of the joint portion 154 located on the piezoelectric vibrator 10 side, but is mounted across the joint portions 154 of the two adjacent terminal members 150.

  Further, on the surface of the terminal member 150, for example, an electrode film 153 configured by sequentially depositing a metal film made of Ni plating and a metal film made of gold plating is provided. Thereby, corrosion of the terminal member 150 can be prevented and connection strength between the conductive bonding material HD and the terminal member 150 can be maintained.

  As the electronic component 140, for example, a thermistor element is used. The thermistor element 140 shows a remarkable change in electrical resistance due to a temperature change, and the voltage changes due to the change in resistance value. By converting the obtained resistance value into a voltage, temperature information can be obtained from the voltage obtained by the conversion. The thermistor element 140 converts the resistance value output from a main IC (not shown) such as an electronic device into a voltage by outputting the resistance value to the outside of the piezoelectric device 100 via the terminal member 150. By doing so, temperature information can be obtained. Such a thermistor element 140 is arranged in the vicinity of the piezoelectric vibrator 10, and a voltage for driving the piezoelectric vibrator is controlled by an IC in accordance with temperature information of the piezoelectric vibrator 10 obtained thereby, so-called temperature compensation. Can do.

  The electronic component 140 has a connection electrode 141. As shown in FIG. 2, a step main surface (joint portion 154) in which the first connection electrode 141a of the electronic component 140 is provided on the first terminal member 150a. The second connecting electrode 141b of the electronic component 140 is connected to the first terminal member 150b adjacent to the first terminal member 150b by the main surface of the step portion. The electronic component 140 is mounted over two adjacent terminal members 150 by being connected to the (joining portion 154) via a conductive joining material HD such as solder.

  The electronic component 140 may be connected to the terminal member 150 after the terminal member 150 is bonded to the piezoelectric vibrator 10. Alternatively, the terminal member 150 to which the electronic component 140 is connected in advance may be bonded to the piezoelectric vibrator 10. Well, in the case of this embodiment, the latter is easier.

  The piezoelectric device 100 according to one aspect of the present invention includes the electronic component 140 that is fixed to at least two of the plurality of terminal members 150 and is electrically connected to the terminal member 150, thereby providing piezoelectric vibration. Since the element 120 and the electronic component 140 are separately mounted inside and outside the recessed space K1 of the element mounting member 110, an electronic device or the like is mounted on the piezoelectric device 100 in a state where the recessed space K1 is hermetically sealed. Even when a process of applying heat such as a reflow process is performed when mounting on the substrate, the gas generated from the connection electrode 141 provided on the electronic component 140 does not adhere to the piezoelectric vibration element 120. Therefore, fluctuations in the oscillation frequency of the piezoelectric device 100 can be reduced.

  In addition, since the electronic component 140 is mounted on the terminal member 150 provided on the outer surface of the piezoelectric vibrator 10, it is not necessary to newly design the element mounting member 110 provided with a terminal or the like for mounting the electronic component 140. . Further, according to the piezoelectric device 100 according to the first embodiment, the electronic component 140 is the lid 130 and the ground terminal by arranging the electronic component 140 between the terminal member 150 and the piezoelectric vibrator 140. Since it is sandwiched between the terminal members 150, it is possible to mitigate the influence of external noise or the like on the electronic component 140.

(Second Embodiment)
Next, a piezoelectric device 200 according to the second embodiment will be described. The piezoelectric device 200 according to the second embodiment is different from the first embodiment in that the electronic component 140 is in contact with the piezoelectric vibrator 10 as shown in FIG.

  According to the piezoelectric device 200 according to the second embodiment, when the electronic component 140 is in contact with the piezoelectric vibrator 10, heat is directly transmitted from the element mounting member 110 constituting the piezoelectric vibrator 10, thereby causing piezoelectric vibration. Since the temperature of the element 120 and the temperature of the electronic component 140 are approximate values, that is, more accurate temperature information of the piezoelectric vibration element 120 can be obtained, the piezoelectric device 200 capable of more accurate temperature compensation is obtained.

  In order to place the electronic component 140 in contact with the piezoelectric vibrator 10, the thickness of the electrode portion 252 of the terminal member 250 (250 a and 250 b), the thickness of the electronic component 140, and the conductivity between the terminal member 250 and the piezoelectric vibrator 10. The thickness of the conductive bonding material HD and the thickness of the conductive bonding material HD between the electronic component 140 and the terminal member 250 may be adjusted. Specifically, the thickness of the electrode part 252 of the terminal member 250 is added to the thickness of the conductive bonding material HD between the terminal member 150 and the piezoelectric vibrator 10, and the thickness of the electronic component 140 is the electronic component 140 and the terminal. What is necessary is just to make it the thickness which added the thickness of the electroconductive joining material HD between the members 250 equal.

(Third embodiment)
Next, a piezoelectric device 300 according to a third embodiment will be described. The piezoelectric device 300 according to the third embodiment is different from the first embodiment in that a heat transfer member 360 is provided between the electronic component 140 and the piezoelectric vibrator 10.

  As shown in FIG. 5, the electronic component 140 is fixed to at least two of the plurality of terminal members 350 via the conductive bonding material HD, and is electrically connected to the terminal member 350. A heat transfer member 360 is provided between the vibrator 10.

  The heat transfer member 360 is made by mixing a resin such as an epoxy resin, a silicone resin, or a grease based on polyalphaolefin with a metal filler such as aluminum or copper, or an inorganic filler such as alumina, aluminum nitride, or boron nitride. Etc. are used. It is preferable that the heat transfer member 360 is insulative because the heat transfer member 360 does not cause a short circuit between the two connection electrodes 141.

  According to the piezoelectric device 300 according to the third embodiment, since the heat transfer member 360 is provided between the electronic component 140 and the piezoelectric vibrator 10, the element mounting member 110 constituting the piezoelectric vibrator 10 can be used. Since the thermal conductivity to the electronic component 140 is further improved, the temperature of the piezoelectric vibration element 120 and the temperature of the electronic component 140 become more approximate values, and the piezoelectric device 200 capable of more accurate temperature compensation. It becomes.

  Such a piezoelectric device 300 is, for example, in a liquid state in a gap between the electronic component 140 and the piezoelectric vibrator 10 after the joining of the terminal member 350 to the piezoelectric vibrator 10 and the joining of the electronic component 140 to the terminal member 350. It can be produced by injecting the heat transfer member 360. If the heat transfer member 360 is composed of a thermosetting epoxy resin and a filler, after injecting the heat transfer member 360 into the gap between the electronic component 140 and the piezoelectric vibrator 10 with the epoxy resin in a liquid state, What is necessary is just to heat and harden.

  In the example shown in FIG. 5, the heat transfer member 360 is provided in a part of the space between the electronic component 140 and the piezoelectric vibrator 10, but the heat transfer member 360 is transmitted through the space between the electronic component 140 and the piezoelectric vibrator 10. A space surrounded by the piezoelectric vibrator 10 and the side surface of the electronic component 140, the electrode portion 352 of the terminal member 350, and the connection portion 351 may be filled with the heat member 360. You may fill with the heat-transfer member 360. FIG. By doing so, the heat transfer path from the piezoelectric vibrator 10 to the electronic component 140 can be further increased.

(Fourth embodiment)
Next, a piezoelectric device 400 according to a fourth embodiment will be described. As shown in FIGS. 6 and 7, the piezoelectric device 400 according to the fourth embodiment includes a terminal member 450 having a larger size in the connection part 451 than in the electrode part 452 in a plan view. Is provided on the piezoelectric vibrator 10 side, and is different from the first embodiment in that the main surface of the stepped portion on which the electronic component 140 is mounted faces away from the piezoelectric vibrator 10.

  According to the piezoelectric device 400 according to the fourth embodiment, the heat transfer path from the piezoelectric vibration element 120 to the electronic component 140 does not pass through the electrode portion 452, and is between the piezoelectric vibration element 120 and the electronic component 140. Since it becomes linear and shortens, it becomes possible to make the temperature of the piezoelectric vibration element 120 and the temperature of the electronic component 140 more approximate values.

  In addition, according to the piezoelectric device 400 according to the fourth embodiment, the step main surface of the joint portion 454 on which the electronic component 140 is mounted is exposed even after the terminal member 450 is joined to the piezoelectric vibrator 10. Therefore, it becomes easy to mount the terminal member 450 of the electronic component 140 on the joint portion 454. Further, the electronic component 140 can be bonded by the conductive bonding material HD at a lower temperature.

(Fifth embodiment)
Next, a piezoelectric device 500 according to a fifth embodiment will be described. A piezoelectric device 500 according to the fifth embodiment is different from the first embodiment in that an electronic component 140 is mounted on a terminal member 550 arranged diagonally to the element mounting member 110 of the piezoelectric vibrator 10.

  As shown in FIGS. 8 and 9, the terminal member 550 includes a connection portion 551 and an electrode portion 552, and a step main surface, that is, a joint portion, is provided at one corner in the plan view of the terminal member 550. The shape is provided in a triangular shape. Then, the terminal member 550 is arranged with the joint portion inside, and is joined to the four corners of the second main surface of the substrate portion 110a of the element mounting member 110. Of the four terminal members 550, the pair of terminal members 550 arranged diagonally becomes an electrode terminal for electronic components on which the electronic component 140 is mounted, and the pair of terminal members 550 arranged on the other diagonal are It becomes an electrode terminal for external connection of the piezoelectric device 500.

  The piezoelectric device 500 according to the fifth embodiment has the same effects as those of the first embodiment. And it becomes possible to mount a larger electronic component 140 without increasing the size of the piezoelectric device 500.

  Also in the fifth embodiment, the electronic component 140 is mounted so as to be in contact with the piezoelectric vibrator 10 as in the second embodiment, or the electronic component 140 and the piezoelectric vibrator 10 are connected as in the third embodiment. A heat transfer member 360 may be provided between them. Further, as in the fourth embodiment, the terminal member 550 having a larger size in the plan view than the electrode portion 552 may be used as the terminal member 550. In such a case, if the electronic component 140 is large, the heat transfer path from the piezoelectric vibration element 120 to the electronic component 140 can be increased.

(Sixth embodiment)
Next, a piezoelectric device 600 according to a sixth embodiment will be described. The piezoelectric device 600 according to the sixth embodiment is the first in that the electronic component 140 is fixed to the terminal member 650 provided under the terminal member connection electrode G in the portion to which the piezoelectric vibration element 120 is connected. Different from the first embodiment.

  As shown in FIGS. 10 and 11, the terminal member 650 includes an external connection electrode terminal of the pair of piezoelectric devices 100 and an electronic component electrode terminal on which the pair of electronic components 140 are mounted. The electrode terminal is provided under the piezoelectric vibration element mounting pad 111 to which the piezoelectric vibration element 120 is connected.

  The terminal member 650 is joined to the terminal member connection electrodes G provided at the four corners of the second main surface of the substrate portion 110a of the element mounting member 110 via a conductive joining material HD such as solder. The terminal member connection electrode G is composed of a pair of piezoelectric vibration element electrodes and a pair of electronic component electrodes. The pair of electrodes for electronic components is provided at the corners at both ends of the short side on the side where the piezoelectric vibration element mounting pad 111 is provided. In addition, the pair of piezoelectric vibration element electrodes are provided at corners on both ends of the short side of the substrate portion 110a different from the short side on which the electrodes for electronic components are provided. In other words, the piezoelectric vibration element 120 is provided below the tip which is the free end.

  According to the piezoelectric device 600 according to the sixth embodiment, the piezoelectric vibrator 10 includes the piezoelectric vibrating element 120 connected to the element mounting member 110, and the terminal member connecting electrode in the portion to which the piezoelectric vibrating element 120 is connected. Since the electronic component 140 is fixed to the terminal member 650 provided under G, the distance between the piezoelectric vibration element 120 and the electronic component 140 is reduced, and the heat conduction therebetween is improved. It is possible to make the temperature of the vibration element 120 and the temperature of the electronic component 140 closer to each other.

  The present invention is not limited to the embodiment as described above, and various changes and improvements can be made without departing from the scope of the present invention. For example, in the above embodiment, the case where crystal is used as the piezoelectric material constituting the piezoelectric vibration element 120 has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element may be used.

  Moreover, although the case where the frame part 110b was metal was demonstrated in the said embodiment, you may form with a ceramic material similarly to the board | substrate part 110a. In this case, an annular sealing conductor pattern is formed on the entire circumference of the opening-side top surface of the frame portion 110b, and the lid is disposed and joined on the sealing conductor pattern. In this case, the lid is provided with a sealing member at a location facing the sealing conductor pattern provided so as to surround the recessed space of the element mounting member. At this time, one of the electronic component electrodes G2 of the terminal member connection electrode terminal G is the second via conductor 113 formed inside the substrate portion 110a and the second via conductor 113 formed inside the frame portion 110. 3 via conductors may be connected to the sealing conductor pattern.

DESCRIPTION OF SYMBOLS 110 ... Element mounting member 110a ... Substrate part 110b ... Frame part 111 ... Piezoelectric vibration element mounting pad 120 ... Piezoelectric vibration element 121 ... Crystal element plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Cover body 10 ... Piezoelectric vibrator 140 ... Electronic component (thermistor element)
141 ... Connection electrode 150, 250, 350, 450, 550, 650 ... Terminal member 151, 251, 351, 451, 551, 661 ... Connection part 152, 252, 352, 452, 552, 652,. .. Electrode part 154, 254, 354, 454, 654 ... Junction part 100, 200, 300, 400, 500, 600 ... Piezoelectric device K1 ... Recessed space DS ... Conductive adhesive HD・ ・ Conductive bonding material HB ・ ・ ・ Conductive film for sealing G ・ ・ ・ Electrode terminal for connecting terminal member G1 ・ ・ ・ Connecting terminal for piezoelectric vibration element G2 ・ ・ ・ Connecting terminal for electronic parts

Claims (6)

A device comprising: a substrate portion; a frame portion provided on a first main surface of the substrate portion; and terminal member connection electrodes provided at four corners of a second main surface of the substrate portion that is rectangular in plan view. A mounting member;
A piezoelectric vibration element mounted on a pair of two piezoelectric vibration element mounting pads provided on a main surface of the substrate part exposed in a recessed space formed by the substrate part and the frame part;
A lid for hermetically sealing the recessed space;
A piezoelectric vibrator comprising:
Four terminal members joined and electrically connected to each of the terminal member connecting electrodes;
Electronic components,
Two pairs of the piezoelectric vibration element mounting pads are electrically connected only to two of the four terminal member connection electrodes among the four terminal member connection electrodes,
The electronic component is mounted while being electrically connected to two terminal members joined to two terminal member connecting electrodes not electrically connected to the piezoelectric vibration element mounting pad. Piezoelectric device.   The piezoelectric device according to claim 1, wherein the electronic component is in contact with the piezoelectric vibrator.   The piezoelectric device according to claim 1, wherein a heat transfer member is provided between the electronic component and the piezoelectric vibrator.   The piezoelectric device according to claim 1, wherein the terminal member has a joint portion to which the electronic component is joined, and the electronic component is disposed between the joint portion and the piezoelectric vibrator.   The piezoelectric device according to claim 1, wherein the terminal member has a joint portion to which the electronic component is joined, and the joint portion is disposed between the piezoelectric vibrator and the electronic component.   In the piezoelectric vibrator, a piezoelectric vibration element is connected to an element mounting member, and the electronic component is fixed to a terminal member provided under a terminal member connection electrode in a portion to which the piezoelectric vibration element is connected. The piezoelectric device according to claim 1, wherein:

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