JP5689703B2 - Piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device used in electronic equipment and the like.

As a conventional piezoelectric device, for example, a structure mainly composed of an element mounting member, a piezoelectric vibration element, a thermistor element, and a lid member is known (see, for example, Patent Document 1).
The element mounting member includes a substrate part, a first frame part, and a second frame part.
A second frame portion is provided on the main surface of the substrate portion to form a second recess space, and a first frame portion is provided to the second frame portion to form a first recess space.
Two pairs of piezoelectric vibration element mounting pads are provided on one main surface of the second frame exposed in the first recess space.
A thermistor element mounting pad is provided on one main surface of the substrate portion exposed in the second recess space.
Also, external connection electrode terminals are provided at the four corners of the other main surface of the substrate portion.
On the piezoelectric vibration element mounting pad, a piezoelectric vibration element having a pair of excitation electrodes electrically connected via a conductive adhesive on the front and back main surfaces is mounted. A metal lid member is put on and joined to the top surface of the first frame portion of the element mounting member surrounding the piezoelectric vibration element. Thereby, the first recess space and the second recess space are hermetically sealed.
A thermistor element connected via a conductive bonding material such as solder is mounted on the thermistor element mounting pad.
The thermistor element outputs a resistance value to the outside of the piezoelectric device via the external connection electrode terminal. Since the voltage changes due to the change in the output resistance value, the temperature information can be obtained from the voltage at that time by converting the output resistance value into a voltage according to the relationship between the voltage and the temperature. For example, it can be converted into temperature information in a main IC such as an electronic device.
In addition, the external connection electrode terminal includes two pairs of crystal vibration element electrode terminals and two pairs of thermistor element electrode terminals. The crystal vibration element electrode terminals are arranged diagonally. Similarly, the thermistor element electrode terminals are also arranged diagonally.

JP 2008-205938 A

  However, in conventional piezoelectric devices, even if thermistor elements having different resistance values cannot be used in appearance, it is impossible to visually distinguish them. Therefore, when thermistor elements having different resistance values are mixed, all products must be measured. There was a problem. In addition, since it is necessary to remeasure all products, there is a problem that productivity is lowered.

  In addition, in the conventional piezoelectric device, when two thermistor elements having different shapes are used and mounted on the element mounting member, two types of element mounting members are required, resulting in an increase in the number of parts and productivity. There has been a problem that has been reduced.

The present invention has been made in view of the above problems, and a piezoelectric device that can be discriminated in appearance even when using thermistor elements having different resistance values without increasing the number of parts of the element mounting member, and improving productivity. The issue is to provide.

The piezoelectric device of the present invention is an element mounting comprising a substrate portion, a first frame portion provided on one main surface of the substrate portion, and a second frame portion provided on the other main surface of the substrate portion. Piezoelectric vibration element mounted on a piezoelectric vibration element mounting pad provided on a main surface of the substrate portion exposed in a first recess space formed by a member, the substrate portion, and the first frame portion A thermistor element mounted on a thermistor element mounting pad provided on the main surface of the substrate portion exposed in a second recessed space formed by the substrate portion and the second frame portion, and A lid that hermetically seals the first recess space; and a third recess space that projects between two external connection electrode terminals adjacent to each other on the same side of the second frame portion of the element mounting member; , wherein the electrode terminal for external connection, the electrode terminal pair of two piezoelectric vibrating element Consists electrode terminals for two pair of thermistor elements is constituted by said first thermistor element mounting pad thermistor mounting pad of the two pairs and two pair of second thermistor element mounting pad, said first The first thermistor element mounting pad is provided so that the mounted thermistor element is parallel to the outer peripheral edge of the long side of the element mounting member, and the second thermistor element mounting pad is mounted. The thermistor element is provided so as to be parallel to the outer peripheral edge on the short side of the element mounting member, and the first thermistor element mounting pad and the second thermistor element mounting pad are wiring for the thermistor element. Connect to one end of the pattern, and connect the other end of the thermistor element wiring pattern to the thermistor element electrode terminal via a via conductor. It is characterized in that that.

  According to the piezoelectric device of the present invention, the thermistor element mounting pad is composed of two pairs of first thermistor element mounting pads and two pairs of second thermistor element mounting pads. If different thermistors are used, they can be discriminated in appearance, and even if thermistor elements with different resistance values are mixed, they can be discriminated by the mounting position of the thermistor elements, so there is no need to measure all products. Can be produced stably.

  Further, according to the piezoelectric device of the present invention, the substrate portion, the first frame portion provided on one main surface of the substrate portion, and the second frame portion provided on the other main surface of the substrate portion, And mounted on a thermistor element mounting pad provided on the main surface of the substrate portion exposed in a second recessed space formed by the substrate mounting portion and the substrate portion and the second frame portion. A thermistor element and a third recessed space projecting between two external connection electrode terminals adjacent to each other on the same side of the second frame portion of the element mounting member, and the thermistor element mounting pad By being composed of two pairs of first thermistor element mounting pads and two pairs of second thermistor element mounting pads, even if two thermistor elements having different shapes are used, they are mounted on the element mounting member. In the case of two kinds of element mounting parts No need, because the number of parts is not increased, it is possible to stably productivity.

1 is an exploded perspective view showing a piezoelectric device according to an embodiment of the present invention. It is AA sectional drawing of FIG. (A) is the top view seen from one main surface of the board | substrate part of the element mounting member which comprises the piezoelectric device which concerns on the 1st Embodiment of this invention, (b) is 1st implementation of this invention It is the top view seen from one main surface of the inner layer of the element mounting member which comprises the piezoelectric device which concerns on a form. (A) is the top view seen from the other main surface of the board | substrate part of the element mounting member which comprises the piezoelectric device which concerns on the 1st Embodiment of this invention, (b) is 1st implementation of this invention It is the top view which looked at the element mounting member which comprises the piezoelectric device which concerns on a form from the other main surface. (A) is a top view which shows the state in which the thermistor element which comprises the piezoelectric device which concerns on the 1st Embodiment of this invention is mounted in the 1st thermistor element mounting pad, (b) is this invention. It is a top view which shows the state in which the thermistor element which comprises the piezoelectric device which concerns on 1st Embodiment of this invention is mounted in the 2nd thermistor element mounting pad. (A) is the top view seen from the other main surface of the board | substrate part of the element mounting member which comprises the piezoelectric device which concerns on the 2nd Embodiment of this invention, (b) is 2nd implementation of this invention. It is the top view which looked at the element mounting member which comprises the piezoelectric device which concerns on a form from the other main surface. (A) is a top view which shows the state in which the thermistor element which comprises the piezoelectric device which concerns on the 2nd Embodiment of this invention is mounted in the 1st thermistor element mounting pad, (b) is this invention. It is a top view which shows the state in which the thermistor element which comprises the piezoelectric device which concerns on 2nd Embodiment is mounted in the 2nd thermistor element mounting pad.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described.

(First embodiment)
As shown in FIGS. 1 and 2, the piezoelectric device 100 according to the first embodiment of the present invention mainly includes an element mounting member 110, a piezoelectric vibration element 120, a lid member 130, and a thermistor element 140. In the piezoelectric device 100, the piezoelectric vibration element 120 is mounted in the first recessed space K1 formed in the element mounting member 110, and the thermistor element 140 is mounted in the second recessed space K2. . The first recess space K1 is hermetically sealed by the lid member 130.

As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 121.
Such a piezoelectric vibration element 120 includes a lead electrode 123 extending from the excitation electrode 122 attached to both main surfaces of the piezoelectric vibration element 120 and a piezoelectric vibration element mounting pad 111 formed on the inner bottom surface of the first recess space K1. Are electrically and mechanically connected via the conductive adhesive DS to be mounted in the first recess space K1. At this time, an end side that is a free end opposite to the side on which the extraction electrode 123 is provided is defined as a tip portion of the piezoelectric vibration element 120.

The thermistor element 140 shown in FIGS. 1 to 2 shows a remarkable change in electrical resistance due to a temperature change. Since the voltage changes due to the change in resistance value, the relationship between the resistance value and the voltage, and the voltage and temperature. Therefore, by converting the output resistance value into a voltage, temperature information can be obtained from the voltage obtained by the conversion. The thermistor element 140 outputs a resistance value output from a main IC (not shown) such as an electronic device by the resistance value being output to the outside of the piezoelectric device 100 via the external connection electrode terminal G. Temperature information can be obtained by converting the voltage.
2 and 5, the thermistor element 140 includes a first thermistor element mounting pad 112 a and a second thermistor element mounting pad 112 a provided in a substrate part 110 a (described later) exposed in the second recessed space K 2 of the element mounting member 110. The thermistor element mounting pad 112b is mounted via a conductive bonding material HD such as solder.

As shown in FIG. 5A, the thermistor element 140 is mounted so as to be parallel to the short side wall portion of the second recessed space K2 of the element mounting member 110. That is, the thermistor element 140 is mounted so as to be parallel to the outer peripheral edge on the short side of the element mounting member 110.
Further, as shown in FIG. 5B, the thermistor element 140 is mounted so as to be parallel to the long side wall portion of the second recessed space K <b> 2 of the element mounting member 110. That is, the thermistor element 140 is mounted so as to be parallel to the outer peripheral edge on the long side of the element mounting member 110.
As described above, two types of thermistor elements 140 having different resistance values can be mounted on either the first thermistor element mounting pad 112a or the second thermistor element mounting pad 112b.

As shown in FIGS. 1 to 2, the element mounting member 110 is mainly composed of a substrate portion 110 a, a first frame portion 110 b, and a second frame portion 110 c.
In the element mounting member 110, a first frame portion 110b is provided on one main surface of the substrate portion 110a to form a first recess space K1, and on the other main surface of the element mounting member 110. A second frame portion 110c is provided to form a second recessed space K2.
In addition, the board | substrate part 110a and the 2nd frame part 110c which comprise this element mounting member 110 are formed by laminating | stacking multiple ceramic materials, such as an alumina ceramic and glass-ceramics, for example.
The first frame portion 110b is made of a metal such as 42 alloy or Kovar, and has a frame shape with a punched center.
The first frame portion 110b is connected to the sealing conductor film HB provided so as to surround the outer periphery of one main surface of the substrate portion 110a by brazing or the like.
Two pairs of piezoelectric vibration element mounting pads 111 are provided on one main surface of the substrate portion 110a exposed in the first recess space K1.
1 to 3, the element mounting member 110 has a second recessed space K2 formed by the other main surface of the substrate portion 110a and the second frame portion 110c.
A first thermistor element mounting pad 112a and a second thermistor element mounting pad 112b are provided on the other main surface of the substrate part 110a exposed in the second recess space K2.

The thermistor element mounting pad 112 is composed of two pairs of first thermistor element mounting pads 112a and two pairs of second thermistor element mounting pads 112b.
In the first thermistor element mounting pad 112 a, the thermistor element 140 is provided in parallel with the outer periphery on the long side of the element mounting member 110.
Further, the two pairs of first thermistor element wiring patterns 116a are connected to the first thermistor element mounting pad 112a and exposed at the inner bottom surface of the second recess space K2. The two pairs of first thermistor element wiring patterns 116a are provided in the third recess space K3 so as to be parallel to the outer peripheral edge of the element mounting member 110 on the long side.
In the second thermistor element mounting pad 112 b, the thermistor element 140 is provided in parallel with the outer peripheral edge on the short side of the element mounting member 110.
The two pairs of second thermistor element wiring patterns 116b are connected to the second thermistor element mounting pad 112b and exposed at the inner bottom surface of the second recess space K2. The two pairs of second thermistor element wiring patterns 116b are provided in the third recess space K3 so as to be parallel to the outer peripheral edge on the short side of the element mounting member 110.

External connection electrode terminals G are provided at the four corners of the main surface opposite to the surface on which the piezoelectric vibration element mounting pad 111 of the second frame portion 110c of the element mounting member 110 is provided.
The external connection electrode terminal G includes two pairs of piezoelectric vibration element electrode terminals G1 and two pairs of thermistor element electrode terminals G2.
The two pairs of piezoelectric vibration element electrode terminals G <b> 1 are provided diagonally to the other main surface of the second frame portion 110 c of the element mounting member 110.
The two pairs of thermistor element electrode terminals G2 are provided at two corners of the second frame part 110c different from the positions where the piezoelectric vibration element electrode terminals G1 are provided. In other words, the thermistor element electrode terminal G2 is provided at a diagonal of the second frame portion 110c different from the diagonal at which the piezoelectric vibration element electrode terminal G1 is provided.

As shown in FIG. 4, the third recessed space K3 is provided between two external connection electrode terminals G that are adjacent to each other on the same side of the second frame portion 110c of the element mounting member 110. .
The third recess space K3 is provided between two adjacent external connection electrode terminals G so that a part of the second recess space K2 extends. That is, the third recessed space K3 is provided so as to be connected to the second recessed space K2.
In the third recess space K3, a portion of the thermistor element wiring pattern 116 is exposed.

The piezoelectric vibration element mounting pad 111 and any one of the external connection electrode terminals G include a piezoelectric vibration element wiring pattern 113 having a portion formed on the substrate portion 110a in the second recess space K2 of the element mounting member 110. The first via conductor 114 provided in the substrate part 110a is connected to the second via conductor 115 formed inside the substrate part 110a and the second frame part 110c.
That is, as shown in FIGS. 3 and 5, the piezoelectric vibration element mounting pad 111 is connected to one end of the piezoelectric vibration element wiring pattern 113 via the first via conductor 114. The other end of the piezoelectric vibration element wiring pattern 113 is connected to the piezoelectric vibration element electrode terminal G <b> 1 via the second via conductor 115. Therefore, the piezoelectric vibration element mounting pad 111 is electrically connected to the piezoelectric vibration element electrode terminal G1.

Further, the first thermistor element mounting pad 112a, the second thermistor element mounting pad 112b, and the thermistor element electrode terminal G2 are portions formed in the substrate portion 110a in the second recess space K2 of the element mounting member 110. Are connected by a third via conductor 117 formed inside the second frame portion 110c.
That is, as shown in FIGS. 6A and 6B, the first thermistor element mounting pad 112a and the second thermistor element mounting pad 112b are connected to one end of the thermistor element wiring pattern 116. The other end of the thermistor element wiring pattern 116 is connected to the thermistor element electrode terminal G <b> 2 via the third via conductor 117. Therefore, the first thermistor element mounting pad 112a and the second thermistor element mounting pad 112b are electrically connected to the thermistor element electrode terminal G2.

Further, as shown in FIG. 3B, the first frame portion 110b is electrically connected to the pair of thermistor element electrode terminals G2 via the third via conductor 117. .
That is, one end of the first frame portion 110 b and the thermistor element 140 is electrically connected via the third via conductor 117.

  The lid member 130 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. Such a lid member 130 hermetically seals the first recessed space K1 with nitrogen gas or vacuum. Specifically, the lid member 130 is placed on the first frame portion 110b of the element mounting member 110 in a predetermined atmosphere, and a part of the metal of the surface of the first frame portion 110b and the metal of the lid member 130. By applying a predetermined current so as to be welded and performing seam welding, the first frame portion 110b is joined.

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W ), Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used. .

  When the element mounting member 110 is made of alumina ceramic, the piezoelectric vibration element mounting pad 111 and the thermistor element are mounted on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder. A first via conductor is formed in a through-hole previously formed by punching a ceramic green sheet with a conductive paste to be used as the pad 112, the sealing conductive film HB, the electrode terminal G for external connection, etc. 114, the second via conductor 115, the third via conductor 117, etc. are manufactured by applying a conventional paste by screen printing, laminating a plurality of these, press molding, and firing at a high temperature. Is done.

  Thus, according to the piezoelectric device 100 of the present invention, the thermistor element mounting pad 112 is composed of two pairs of first thermistor element mounting pads 112a and two pairs of second thermistor element mounting pads 112b. Thus, when the thermistor elements 140 having different resistance values are used, the appearance can be distinguished, and even if the thermistor elements 140 having different resistance values are mixed, the appearance is determined according to the mounting position of the thermistor element 140. Therefore, it is not necessary to measure all products and can be produced stably.

(Second Embodiment)
The piezoelectric device according to the second embodiment of the present invention includes a pair of first thermistor element mounting pads 212a having different shapes in the second recess space K2 of the element mounting member 210, and a pair of second elements. This is different from the first embodiment in that a thermistor element mounting pad 212b is provided.

The element mounting member 210 is mainly composed of a substrate part, a first frame part, and a second frame part.
In the element mounting member 210, a first frame portion is provided on one main surface of the substrate portion, and a first recess space K1 is formed. In addition, a second frame portion is provided on the other main surface of the element mounting member 210 to form a second recessed space K2.
In addition, the board | substrate part and 2nd frame part which comprise this element mounting member 210 are formed by laminating | stacking multiple ceramic materials, such as an alumina ceramic and glass-ceramics, for example.
The first frame portion is made of a metal such as 42 alloy or Kovar, and has a frame shape with the center punched out.
The first frame portion is connected to the sealing conductor film HB provided so as to surround the outer periphery of one main surface of the substrate portion by brazing or the like.
A pair of piezoelectric vibration element mounting pads is provided on one main surface of the substrate portion exposed in the first recess space.
Further, as shown in FIGS. 6 to 7, in the element mounting member 210, a second recessed space K <b> 2 is formed by the other main surface of the substrate portion and the second frame portion.
A thermistor element mounting pad 212 is provided on the other main surface of the substrate portion 210a exposed in the second recess space K2.

As shown in FIGS. 6 to 7, the thermistor element mounting pad is composed of two pairs of first thermistor element mounting pads 212a and two pairs of second thermistor element mounting pads 212b.
The second thermistor element mounting pad 212b is provided to be smaller than the first thermistor element mounting pad 212a.
In the first thermistor element mounting pad 212 a, the thermistor element 140 is provided in parallel with the outer periphery on the long side of the element mounting member 210.
Further, the two pairs of first thermistor element wiring patterns 216a are connected to the first thermistor element mounting pad 212a and are exposed at the inner bottom surface of the second recess space K2. Also, the two pairs of first thermistor element wiring patterns 216a are provided in the third recess space K3 so as to be parallel to the outer periphery of the long side of the element mounting member 210.
In the second thermistor element mounting pad 212 b, the thermistor element 140 is provided in parallel with the outer peripheral edge on the short side of the element mounting member 210.
The two pairs of second thermistor element wiring patterns 216b are connected to the second thermistor element mounting pad 212b and exposed at the inner bottom surface of the second recess space K2. The two pairs of second thermistor element wiring patterns 216b are provided in the third recess space K3 so as to be parallel to the outer peripheral edge on the short side of the element mounting member 210.

  According to the piezoelectric device according to the second embodiment of the present invention, the substrate portion, the first frame portion provided on one main surface of the substrate portion, and the first surface provided on the other main surface of the substrate portion. Thermistor element mounting provided on the main surface of the substrate portion exposed in the second recess space K2 formed by the element mounting member composed of two frame portions and the substrate portion and the second frame portion. A third recessed space projecting between the thermistor element 140 mounted on the pad 212 and two external connection electrode terminals G adjacent to each other on the same side of the second frame portion 210c of the element mounting member 210. K3, and the thermistor element mounting pads are composed of two pairs of the first thermistor element mounting pads 212a and two pairs of thermistor element mounting pads 212b, thereby providing two thermistors having different shapes. element Be used 40, when mounting the element mounting member 210, two element mounting member 210 is not required, since the number of parts is not increased, it is possible to stably productivity.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where crystal is used as the piezoelectric material constituting the piezoelectric vibration element 120 has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used may be used.

  In the above-described embodiment, the first frame portion 110b constituting the element mounting member 110 is made of a metal such as 42 alloy or Kovar, and has a frame shape in which the center is punched. The first frame portion 110b may be made of a ceramic material and may have a frame shape with a punched center. In this case, a sealing conductor pattern is provided on the main surface of the first frame portion 110b, and the first recess portion is bonded to the sealing member 131 provided on the lid member 130. The space K1 is hermetically sealed.

DESCRIPTION OF SYMBOLS 110 ... Element mounting member 110a ... Board | substrate part 110b ... 1st frame part 110c ... 2nd frame part 111 ... Piezoelectric vibration element mounting pad 112 ... Thermistor element mounting pad 120. ..Piezoelectric vibration element 121... Quartz element plate 122... Excitation electrode 123... Extraction electrode 130 .. Lid member 140 .. Thermistor element 100 ... Piezoelectric device K1. Recessed space K2 ... Second recessed space DS ... Conductive adhesive HD ... Conductive bonding material HB ... Sealing conductor film G ... External connection electrode terminal G1 ... Piezoelectric Electrode terminal for vibration element G2 ... Electrode terminal for thermistor element

Claims (1)

An element mounting member comprising a substrate portion, a first frame portion provided on one main surface of the substrate portion, and a second frame portion provided on the other main surface of the substrate portion;
A piezoelectric vibration element mounted on a piezoelectric vibration element mounting pad provided on the main surface of the substrate part exposed in a first recess space formed by the substrate part and the first frame part;
A thermistor element mounted on a thermistor element mounting pad provided on the main surface of the substrate part exposed in a second recessed space formed by the substrate part and the second frame part;
A lid for hermetically sealing the first recessed space;
A third recessed space projecting between two external connection electrode terminals adjacent to each other on the same side of the second frame portion of the element mounting member,
The external connection electrode terminal comprises two pairs of piezoelectric vibration element electrode terminals and two pairs of thermistor element electrode terminals,
The thermistor element mounting pad is composed of two pairs of first thermistor element mounting pads and two pairs of second thermistor element mounting pads ;
The first thermistor element mounting pad is provided such that the mounted thermistor element is parallel to the outer peripheral edge of the long side of the element mounting member,
The second thermistor element mounting pad is provided so that the mounted thermistor element is parallel to the outer peripheral edge on the short side of the element mounting member,
The first thermistor element mounting pad and the second thermistor element mounting pad are connected to one end of the thermistor element wiring pattern, and the other end of the thermistor element wiring pattern is connected to the thermistor element via a via conductor. A piezoelectric device characterized by being connected to an electrode terminal for use .

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