JP5376491B2 - Manufacturing method of electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package which allows more electronic components to be used through a wafer, and allows even an electronic component having functional surfaces on both sides to be electrically connected easily and surely, and to provide a method of manufacturing the electronic component package. <P>SOLUTION: In the electronic component package 10 having an electronic component 11 and a casing 13 formed by bonding a plurality of structural components so that the electronic component is covered, the functional surfaces 11a and 11b of the electronic component and bonding surfaces 21a and 21b between the structural members 21, 22 and 23 of the casing are disposed so as to cross each other. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention relates to a method for manufacturing an electronic component package.

  In recent years, attention has been paid to MEMS (Micro Electro Mechanical System) devices, which are micro devices in which a mechanical structure and an electronic circuit are integrated on a single substrate using semiconductor process technology. Since this MEMS device is manufactured using semiconductor technology, it has advantages such as high processing accuracy, ease of mass production, and precise operation control by integrally forming an electronic circuit and a mechanical structure. It is beginning to be applied not only to IT but also to various fields such as communication, chemistry, medicine and biotechnology.

Electronic components such as MEMS devices are generally accommodated in a package having a cavity formed therein (see, for example, Patent Document 1). The surface-mount type piezoelectric device of Patent Document 1 is an inverted saddle-like shape that is fixed in a state of surrounding a space on a package body including a flat package body and a piezoelectric vibration element (electronic component) supported on the package body. A metal lid formed on the upper surface of the package main body so as to close each upper opening of the through hole inside the metal plated wall, and a piezoelectric plate. An internal electrode that supports the vibration element, and a metal-plated external electrode disposed on the lower surface of the package body are provided.
JP 2003-87071 A

  By the way, in the surface mount type piezoelectric device of Patent Document 1, a piezoelectric vibration element (electronic component) is arranged substantially parallel to the flat package body, and a reverse lid-shaped metal lid is covered from above the piezoelectric vibration element. Is formed. That is, the joint surface between the package body and the metal lid is substantially parallel to the functional surface of the piezoelectric vibration element. With this configuration, there is a problem that the surface of the wafer constituting the package body and the functional surface having a large area in the electronic component are arranged in parallel, and the number of electronic components that can be placed on the wafer is limited. is there. In addition, when mounting an electronic component having both functional surfaces, in order to electrically connect to both surfaces of the electronic component, a through electrode that can be electrically connected between the functional surface of the electronic component and the internal electrode It is necessary to newly form wiring such as wire bonding. Therefore, in the case of an electronic component having both functional surfaces, the production efficiency is poor in the conventional manufacturing method.

Accordingly, the present invention has been made in view of the above-described circumstances, and can increase the number of wafers taken out from a wafer and can easily and reliably electrically conduct even an electronic component having functional surfaces on both sides. An electronic component package manufacturing method is provided.

In order to solve the above problems, the present invention provides the following means.
An electronic component package manufacturing method according to the present invention includes an electronic component and a casing formed by joining a plurality of constituent members so as to cover the electronic component, and the functional surface of the electronic component, the bonding surface between casing components may Rutotomoni are arranged to intersect, and the functional surface of the electronic part, the mounting surface of the electronic component in the casing is arranged so as to intersect the casing The first casing formed with a through-hole capable of accommodating the electronic component, and the second casing and the third casing covering both end openings of the through-hole, and the functional surface of the electronic component is the through-hole. inner in arranged a method for producing an electronic component package so as to face the circumferential surface, a step of forming a plurality of the through hole in the first wafer to form the said first casing, said first A step of bonding the air-conditioner and a second wafer constituting the second casing, a step of mounting the electronic component such that a functional surface of the electronic component and a bonding surface of the casing intersect, and the first The method includes a step of bonding the wafer and a third wafer constituting the third casing, and a step of separating the bonded wafer into individual pieces.

  With this configuration, a through hole for accommodating electronic components is formed in the first wafer, and the second wafer and the third wafer form a casing simply by joining to the first wafer without being processed. be able to. Therefore, the casing can be easily manufactured. Moreover, what is necessary is just to form a through-hole so that the functional surface with a large area may generally oppose the inner peripheral surface of a through-hole in an electronic component. That is, the size of the through-hole formed in the first wafer in a plan view can be minimized, and the number of through-holes can be increased with respect to the wafer. Therefore, the number of electronic component packages extracted from the wafer can be increased. When both the front and back surfaces of the electronic component are functional surfaces, the side surface of the electronic component and the surface of the second or third wafer are configured to contact each other. While being formed in the vicinity, electrical conduction can be easily and reliably achieved by disposing a conductive material such as a conductive paste between the surface of the second wafer or the third wafer.

Further, in the step of mounting the electronic component, the electronic component is inserted into the through hole, and the conductive material formed on the mounting surface of the electronic component in the casing is an electrode formed on the functional surface. The electronic component is pushed in until it goes around .

According to the method for manufacturing an electronic component package according to the present invention, a functional surface having a large area in an electronic component is generally not parallel to a joint surface between members of a casing made of a plurality of members. When the wafer is formed with a wafer, the number of electronic components arranged on the wafer can be increased. That is, the number of electronic component packages extracted from the wafer can be increased. In addition, when both the front and back surfaces of the electronic component are functional surfaces, since the side surface of the electronic component and the inner surface of the casing are in contact, while forming the electrodes on the front and back surfaces of the electronic component near the side surface, By providing a conductive material such as a conductive paste between the inner surface of the casing and the inner surface of the casing, electrical conduction can be easily and reliably obtained.

(First embodiment)
Next, a first embodiment of an electronic component package according to the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 3, the electronic component package 10 includes a flat electronic component 11, a casing 13 that covers the electronic component 11, and a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 13. And an external electrode 17 disposed on the outer peripheral surface of the casing 13, and a wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17.

  The electronic component 11 is composed of, for example, an IC or a crystal resonator, and has functional surfaces on the front surface 11a and the back surface 11b. Further, the side surface 11 c of the electronic component 11 is joined to a conductive material 15 made of a conductive paste provided on the surface 22 c of the second casing 22. Further, an electrode 12 is formed in the vicinity of the side surface 11c on the front surface 11a and the back surface 11b.

  The casing 13 is a member having a substantially rectangular parallelepiped shape made of, for example, silicon and having a cavity formed therein. In the present embodiment, a first casing 21 in which a through hole 20 that can accommodate the electronic component 11 is formed, a second casing 22 and a third casing 23 that respectively close both ends of the through hole 20 of the first casing 21, It consists of

  It arrange | positions so that the internal peripheral surface 31 of the through-hole 20 of the 1st casing 21 and the surface 11a of the electronic component 11 may oppose, and the internal peripheral surface 32 of the through-hole 20 and the back surface 11b of the electronic component 11 oppose. . The inner peripheral surfaces 31 and 32 are surfaces facing each other, and are inner peripheral surfaces having a larger area among the four inner peripheral surfaces of the through hole 20.

  The second casing 22 and the third casing 23 are flat members, and are joined to the end faces 21a and 21b of the first casing 21 by anodic bonding, adhesive bonding, or solder bonding using gold or tin, respectively. Yes. The second casing 22 has through holes 25 (two in the present embodiment), and the through electrodes 27 are formed by filling the through holes 25 with a conductive paste or the like.

  Moreover, the notch part 21d is formed in the area | region in which the external electrode 17 is formed in the outer surface 21c of the first casing 21 (in this embodiment, two places). Further, a notch 22 b is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 22 a of the second casing 22. A wiring portion 19 made of a conductive paste or the like is formed in the cutout portion 22b. The conductive material 15 and the external electrode 17 are electrically connected by the wiring portion 19.

Next, a method for manufacturing the electronic component package 10 will be described with reference to FIGS.
As shown in FIG. 4, three first to third wafers 51, 52, 53 having substantially the same size in plan view are prepared. Note that the thickness of the first wafer 51 is larger than the width of the front surface 11 a (back surface 11 b) having the functional surface of the electronic component 11. That is, the first wafer 51 is a constituent member of the first casing 21, and the second wafer 52 and the third wafer 53 are constituent members of the second casing 22 and the third casing 53, respectively.

  As shown in FIG. 5, a plurality of through holes 20 are formed in the first wafer 51 and a plurality of through holes 25 are formed in the second wafer 52. In the present embodiment, two through holes 25 are formed for one through hole 20.

  As shown in FIG. 6, the one surface 51a of the first wafer 51 and the surface 52a of the second wafer 52 are bonded.

  As shown in FIG. 7, a conductive material 15 made of silver paste or the like is formed at a position corresponding to the through hole 25 on the surface 52 a of the second wafer 52.

  As shown in FIG. 8, the electronic component 11 is inserted into the through hole 20. At this time, the electronic component 11 is inserted so that the front surface 11 a and the rear surface 11 b having the functional surfaces face the inner peripheral surfaces 31 and 32 of the through-hole 20. Further, the side surface 11c of the electronic component 11 is brought into contact with the conductive material 15, and further, the paste-like conductive material 15 is pushed in until it wraps around the front surface 11a and the back surface 11b of the electronic component 11. By doing in this way, the electrode 12 formed on both surfaces of the electronic component 11 and the conductive material 15 are electrically connected.

  As shown in FIG. 9, the other surface 51 b of the first wafer 51 and the surface 53 a of the third wafer 53 are bonded.

  As shown in FIG. 10, the notch 21 d is formed in the first wafer 51 and the notch 22 b is formed in the second wafer 52.

  As shown in FIG. 11, silver paste is poured into the through hole 25, the cutout portion 21 d and the cutout portion 22 b to form the through electrode 27, the external electrode 17 and the wiring portion 19.

  As shown in FIG. 12, the first wafer 51 to the third wafer 53 are separated into individual pieces, and the manufacture of the electronic component package 10 is completed.

  According to the present embodiment, the functional surfaces (front surface 11 a and back surface 11 b) having a large area in the substantially flat electronic component 11 are members of the casing 13 including the first casing 21, the second casing 22, and the third casing 23. Therefore, the number of electronic components 11 can be increased with respect to the wafer (first wafer 51) constituting the casing 13. Therefore, the number of electronic component packages 10 taken out from the wafer can be increased. That is, the electronic components 11 can be arranged with high density with respect to the first wafer 51 to the third wafer 53, and the first wafer 51 to the third wafer 53 can be used effectively.

  In addition, since both the front surface 11a and the back surface 11b of the electronic component 11 are functional surfaces, the side surface 11c of the electronic component 11 and the surface of the second casing 22 (the surface 52a of the second wafer 52) are in contact with each other. By disposing the conductive material 15 made of a conductive paste between the side surface 11c of the component 11 and the surface of the second casing 22, electrical conduction can be easily and reliably achieved.

  Moreover, since the functional surface (front surface 11a and back surface 11b) of the electronic component 11 and the mounting surface (front surface 52a of the second wafer 52) of the electronic component 11 in the casing 13 are arranged so as to be substantially orthogonal, the electronic component 11 is disposed. When mounted on the casing 13, the mounting area can be reduced. Therefore, a large number of electronic components 11 can be arranged on the wafer constituting the casing 13, and the number of wafers taken out from the wafer can be increased.

  Further, according to the manufacturing method described above, the through-hole 20 for accommodating the electronic component 11 is formed in the first wafer 51, and the second wafer 52 and the third wafer 53 are processed to accommodate the electronic component 11. The casing 13 can be formed simply by bonding to the first wafer 51 without being applied. Therefore, the casing 13 can be easily manufactured. In addition, since the electronic component package 10 is manufactured at the wafer level in this way, the manufacturing process can be simplified.

  Furthermore, unlike the substantially cylindrical can package in which the crystal resonator is accommodated, the electronic component package 10 of the present embodiment is easy to mount because no protruding electrode (external electrode) is formed. Moreover, since the electronic component package 10 accommodates the substantially flat plate-like electronic component 11 in the substantially rectangular parallelepiped through-hole 20, the affinity as a surface-mounted component can be increased. Furthermore, when the third casing 23 of the casing 13 is formed of a metal lid, the third casing 23 and the functional surface of the electronic component 11 are arranged and configured in a direction orthogonal to each other, and are parallel to the third casing 23. Is small, the parasitic capacitance is small.

(Second embodiment)
Next, a second embodiment of the electronic component package according to the present invention will be described with reference to FIGS. Note that the present embodiment is different from the first embodiment only in the configuration of the casing, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in FIGS. 13 and 14, the electronic component package 110 includes an electronic component 11, a casing 113 that covers the electronic component 11, a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 113, and a casing. The external electrode 17 disposed on the outer peripheral surface of the 113 and a wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17 are provided.

  The casing 113 includes a fourth casing 124 in which a recess 120 capable of accommodating approximately half of the electronic component 11 is formed, and a fifth casing 125 in which a recess 121 capable of accommodating approximately half of the electronic component 11 is formed. It is configured.

  The side surface 131 of the concave portion 120 of the fourth casing 124 and the front surface 11a of the electronic component 11 are opposed to each other, and the side surface 132 of the concave portion 120 and the back surface 11b of the electronic component 11 are opposed to each other. Similarly, the side surface 133 of the concave portion 121 of the fifth casing 125 and the surface 11a of the electronic component 11 are opposed to each other, and the side surface 134 of the concave portion 121 and the back surface 11b of the electronic component 11 are opposed to each other. Note that the side surface 131 and the side surface 132, and the side surface 133 and the side surface 134 are surfaces facing each other, and are the side surfaces having the larger area among the four side surfaces of the recess 120 and the recess 121.

  The 4th casing 124 and the 5th casing 125 are joined in each end surface 124a and 125a. The fourth casing 124 has through holes 25 (two in this embodiment), and the through electrodes 27 are formed by filling the through holes 25 with a conductive paste or the like.

  Further, a notch 124d is formed in a region where the external electrode 17 is formed on the outer surface 124c of the fourth casing 124. Furthermore, a notch 124e is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 124b of the fourth casing 124. The wiring part 19 is formed in the notch part 124e.

Next, a method for manufacturing the electronic component package 110 will be described with reference to FIGS.
As shown in FIG. 15, two fourth and fifth wafers 154 and 155 having substantially the same size in plan view are prepared. The fourth wafer 154 is a constituent member of the fourth casing 124, and the fifth wafer 155 is a constituent member of the fifth casing 125.

  As shown in FIG. 16, a plurality of recesses 120 are formed on the fourth wafer 154 and a plurality of recesses 121 are formed on the fifth wafer 155. Further, a through hole 25 is further formed in the bottom surface 120 a of the recess 120 of the fourth wafer 154. In the present embodiment, two through holes 25 are formed for one recess 120.

  As shown in FIG. 17, the conductive material 15 made of silver paste or the like is formed at a position corresponding to the through hole 25 in the bottom surface 120 a of the concave portion 120 of the fourth wafer 154.

  As shown in FIG. 18, the electronic component 11 is inserted into the recess 120. At this time, the electronic component 11 is inserted so that the front surface 11a and the back surface 11b having the functional surfaces face the side surfaces 131 and 132 of the recess 120, respectively. Further, the side surface 11c of the electronic component 11 is brought into contact with the conductive material 15, and further, the paste-like conductive material 15 is pushed in until it wraps around the front surface 11a and the back surface 11b of the electronic component 11. By doing in this way, the electrode 12 formed on both surfaces of the electronic component 11 and the conductive material 15 are electrically connected.

  As shown in FIG. 19, the fourth wafer 154 and the fifth wafer 155 are bonded.

  As shown in FIG. 20, notches 124 d and 124 e are formed in the fourth wafer 154.

  As shown in FIG. 21, silver paste is poured into the through hole 25, the cutout part 124 d and the cutout part 124 e to form the through electrode 27, the external electrode 17 and the wiring part 19.

  As shown in FIG. 22, the fourth wafer 154 and the fifth wafer 155 are separated into individual pieces, and the manufacture of the electronic component package 110 is completed.

  According to the present embodiment, the functional surfaces (the front surface 11 a and the back surface 11 b) having a large area in the substantially flat electronic component 11 are parallel to the joint surfaces of the members of the casing 113 including the fourth casing 124 and the fifth casing 125. In addition, since they are arranged in a substantially orthogonal direction, the number of electronic components 11 can be increased with respect to the wafers (fourth wafer 154 and fifth wafer 155) constituting casing 113. That is, the electronic components 11 can be arranged with high density with respect to the fourth wafer 154 and the fifth wafer 155, and the fourth wafer 154 and the fifth wafer 155 can be used effectively.

  Moreover, since it has functional surfaces on both the front surface 11a and the back surface 11b of the electronic component 11 and the side surface 11c of the electronic component 11 and the bottom surface 120a of the recess 120 of the fourth casing 124 are in contact with each other, the side surface of the electronic component 11 By arranging the conductive material 15 made of a conductive paste between 11c and the bottom surface 120a of the recess 120, electrical conduction can be easily and reliably achieved.

  Further, since the functional surfaces of the electronic component 11 (the front surface 11a and the back surface 11b) and the mounting surface of the electronic component 11 in the casing 113 (the bottom surface 120a of the concave portion 120 of the fourth wafer 154) are arranged so as to be substantially orthogonal, When the component 11 is mounted on the casing 113, the mounting area can be reduced. Therefore, a large number of electronic components 11 can be arranged on the wafer constituting the casing 113, and the number of wafers taken out from the wafer can be increased.

  Further, according to the above-described manufacturing method, the concave portion 120 and the concave portion 121 for accommodating the electronic component 11 are formed in the fourth wafer 154 and the fifth wafer 155, respectively, and the fourth wafer 154 and the fifth wafer 155 are bonded. The casing 113 can be formed simply by doing so. Therefore, the casing 113 can be easily manufactured. In addition, since the electronic component package 110 is manufactured at the wafer level in this way, the manufacturing process can be simplified.

(Third embodiment)
Next, a third embodiment of the electronic component package according to the present invention will be described with reference to FIGS. Note that the present embodiment is different from the first embodiment only in the configuration of the casing, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals, and detailed description thereof is omitted.
As shown in FIGS. 23 and 24, the electronic component package 210 includes an electronic component 11, a casing 213 that covers the electronic component 11, a conductive material 15 that is disposed at a joint between the electronic component 11 and the casing 213, and a casing. The external electrode 17 arranged on the outer peripheral surface of 213, and the wiring portion 19 that electrically connects the conductive material 15 and the external electrode 17 are provided.

  The casing 213 includes a sixth casing 226 in which a recess 220 capable of accommodating the electronic component 11 is formed, and a substantially flat seventh casing 227 that closes the recess 220.

  It arrange | positions so that the side surface 231 of the recessed part 220 of the 6th casing 226 and the surface 11a of the electronic component 11 may oppose, and the side surface 232 of the recessed part 220 and the back surface 11b of the electronic component 11 may oppose. The side surface 231 and the side surface 232 are surfaces facing each other, and are the side surfaces having the larger area among the four side surfaces of the recess 220.

  The sixth casing 226 and the seventh casing 227 are joined at the end face 226a of the sixth casing 226. The sixth casing 226 has through holes 25 (two in the present embodiment), and the through electrodes 27 are formed by filling the through holes 25 with a conductive paste or the like.

  Further, a notch 226d is formed in a region where the external electrode 17 is formed on the outer surface 226c of the sixth casing 226. Further, a notch 226 e is formed in a region between the through electrode 27 and the external electrode 17 on the outer surface 226 b of the sixth casing 226. A wiring portion 19 is formed in the notch 226e.

Next, a method for manufacturing the electronic component package 210 will be described with reference to FIGS.
As shown in FIG. 25, two sixth and seventh wafers 256 and 257 having the same size in plan view are prepared. The sixth wafer 256 is a constituent member of the sixth casing 226, and the seventh wafer 257 is a constituent member of the seventh casing 227.

  As shown in FIG. 26, a plurality of recesses 220 are formed in the sixth wafer 256. Further, a through hole 25 is further formed in the bottom surface 220 a of the recess 220 of the sixth wafer 256. In the present embodiment, two through holes 25 are formed for one recess 220.

  As shown in FIG. 27, the conductive material 15 made of silver paste or the like is formed at a position corresponding to the through hole 25 in the bottom surface 220a of the recess 220 of the sixth wafer 256.

  As shown in FIG. 28, the electronic component 11 is inserted into the recess 220. At this time, the electronic component 11 is inserted so that the front surface 11 a and the rear surface 11 b having the functional surfaces face the side surfaces 231 and 232 of the recess 220, respectively. Further, the side surface 11c of the electronic component 11 is brought into contact with the conductive material 15, and further, the paste-like conductive material 15 is pushed in until it wraps around the front surface 11a and the back surface 11b of the electronic component 11. By doing in this way, the electrode 12 formed on both surfaces of the electronic component 11 and the conductive material 15 are electrically connected.

  As shown in FIG. 29, the sixth wafer 256 and the seventh wafer 257 are bonded.

  As shown in FIG. 30, notches 226 d and 226 e are formed in the sixth wafer 256.

  As shown in FIG. 31, silver paste is poured into the through hole 25, the cutout part 226 d, and the cutout part 226 e to form the through electrode 27, the external electrode 17, and the wiring part 19.

  As shown in FIG. 32, the sixth wafer 256 and the seventh wafer 257 are separated into individual pieces, and the manufacture of the electronic component package 210 is completed.

  According to the present embodiment, the functional surfaces (the front surface 11 a and the back surface 11 b) having a large area in the substantially flat electronic component 11 are parallel to the joint surfaces between the members of the casing 213 including the sixth casing 226 and the seventh casing 227. In addition, the arrangement of the electronic components 11 can be increased with respect to the wafers (sixth wafer 256 and seventh wafer 257) constituting the casing 213 because they are arranged in a substantially orthogonal direction. That is, the electronic components 11 can be arranged with high density with respect to the sixth wafer 256 and the seventh wafer 257, and the sixth wafer 256 and the seventh wafer 257 can be used effectively.

  Moreover, since it has functional surfaces on both the front surface 11a and the back surface 11b of the electronic component 11 and the side surface 11c of the electronic component 11 and the bottom surface 220a of the recess 220 of the sixth casing 226 are in contact with each other, the side surface of the electronic component 11 By arranging the conductive material 15 made of a conductive paste between 11c and the bottom surface 220a of the concave portion 220, electrical conduction can be easily and reliably achieved.

  In addition, since the functional surfaces of the electronic component 11 (the front surface 11a and the back surface 11b) and the mounting surface of the electronic component 11 in the casing 213 (the bottom surface 220a of the recess 220 of the sixth wafer 256) are arranged so as to be substantially orthogonal, When the component 11 is mounted on the casing 213, the mounting area can be reduced. Therefore, a large number of electronic components 11 can be arranged on the wafer constituting the casing 213, and the number of wafers taken out from the wafer can be increased.

  Further, according to the manufacturing method described above, the recess 220 for accommodating the electronic component 11 is formed in the sixth wafer 256, and the casing 213 is formed simply by joining the sixth wafer 256 and the seventh wafer 257. Can do. Therefore, the casing 213 can be easily manufactured. In addition, since the electronic component package 210 is manufactured at the wafer level in this way, the manufacturing process can be simplified.

Note that the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in the present embodiment, the case where a silicon wafer is used for the casing has been described, but a glass substrate, ceramic, or metal substrate can also be used.

It is a perspective view of the electronic component package in 1st embodiment of this invention. It is sectional drawing which follows the AA line of FIG. It is sectional drawing which follows the BB line of FIG. It is explanatory drawing (1) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (2) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (3) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (4) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (5) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (6) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (7) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (8) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is explanatory drawing (9) which shows the manufacturing method of the electronic component package in 1st embodiment of this invention. It is a perspective view of the electronic component package in 2nd embodiment of this invention. It is sectional drawing which follows the CC line of FIG. It is explanatory drawing (1) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (2) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (3) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (4) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (5) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (6) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (7) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is explanatory drawing (8) which shows the manufacturing method of the electronic component package in 2nd embodiment of this invention. It is a perspective view of the electronic component package in 3rd embodiment of this invention. It is sectional drawing which follows the DD line | wire of FIG. It is explanatory drawing (1) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (2) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (3) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (4) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (5) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (6) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (7) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention. It is explanatory drawing (8) which shows the manufacturing method of the electronic component package in 3rd embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic component package 11 ... Electronic component 11a ... Front surface (functional surface) 11b ... Back surface (functional surface) 13 ... Casing 20 ... Through-hole 21 ... First casing 21a ... End surface (joint surface) 21b ... End surface (joint surface) 22 ... second casing 22c ... surface (mounting surface) 23 ... third casing 31 ... inner peripheral surface 32 ... inner peripheral surface 51 ... first wafer 52 ... second wafer 53 ... third wafer 110 ... electronic component package 120 ... concave 121 ... concave portion 124 ... fourth casing 125 ... fifth casing 131, 132 ... side surface 133, 134 ... side surface 154 ... fourth wafer 155 ... fifth wafer 210 ... electronic component package 220 ... concave portion 226 ... sixth casing 227 ... seventh casing 231,232 ... side surface 256 ... sixth wafer 257 ... seventh wafer

Claims (2)

Electronic components,
A casing formed by joining a plurality of components so as to cover the electronic component,
Said functional surface of the electronic component, the joint surface between the components of the casing, Rutotomoni are arranged to intersect, and the functional surface of the electronic part, the mounting surface of the electronic component in the casing, cross Arranged to
The casing is composed of a first casing in which a through-hole capable of accommodating the electronic component is formed, and a second casing and a third casing that cover both end openings of the through-hole, and the functional surface of the electronic component is In the manufacturing method of the electronic component package arranged to face the inner peripheral surface of the through hole ,
Forming a plurality of the through holes in the first wafer forming the first casing;
Bonding the first wafer and the second wafer constituting the second casing;
Mounting the electronic component such that the functional surface of the electronic component and the joint surface of the casing intersect;
Bonding the first wafer and the third wafer constituting the third casing;
Separating the bonded wafers into individual pieces, and a method of manufacturing an electronic component package. In the step of mounting the electronic component, the electronic component is inserted into the through hole, and the conductive material formed on the mounting surface of the electronic component in the casing wraps around the electrode formed on the functional surface. The method of manufacturing an electronic component package according to claim 1, wherein the electronic component is pushed in to a position.

Images