JP2003198310A - Accommodation package for piezoelectric vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for piezoelectric vibrators which accurately vibrates the accommodated piezoelectric vibrator, by preventing a short circuit of wiring lines between a check terminal and an external electric circuit substrate when the package is installed in the substrate. <P>SOLUTION: An accommodation package for piezoelectric vibrators comprises a rectangle insulator 1 that has a concave mounting portion 5 for mounting the piezoelectric vibrator 3 and a semiconductor 4 on the surface, a cut-in portions 6a being cut-in at the side of the insulator 1 from the upper surface to the bottom surface, and a check terminal 9 to check oscillation frequency characteristics of the piezoelectric vibrator 3 by electrically connecting an external frequency characteristic measuring instrument to the vibrator 3 via a wiring conductor 8a formed at a location apart from the bottom of the insulator 1. The package enables the piezoelectric vibrator 3 and the semiconductor 4 to work accurately due to no contact between the check terminal 9 and wiring parts for an external electric circuit substrate. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator and a package for accommodating a piezoelectric vibrator for mounting a semiconductor element for suppressing frequency fluctuation of the piezoelectric vibrator. Things. 2. Description of the Related Art Conventionally, a piezoelectric vibrator and a package for accommodating a piezoelectric vibrator for accommodating a semiconductor element for suppressing frequency fluctuation of the piezoelectric vibrator are shown in an exploded perspective view in FIG. For example, it is made of a ceramic material such as an aluminum oxide-based sintered body, an aluminum nitride-based sintered body, a mullite-based sintered body, or a glass-ceramic sintered body, and has a concave shape in which the piezoelectric vibrator 23 and the semiconductor element 24 are mounted on the upper surface. It comprises a substantially rectangular insulating base 21 having a mounting portion 25, and a metal lid 22 made of an iron-nickel-cobalt alloy, an iron-nickel alloy, or the like. The insulating base 21 has a pair of steps 26 for mounting the piezoelectric vibrator 23 on one end side of the mounting section 25, and the piezoelectric vibrator 23 is mounted on the step 26. Further, the semiconductor element 24 is mounted on the bottom surface of the mounting portion 25 remote from the step 26. A wiring conductor 27a to which the piezoelectric vibrator 23 is connected is attached on the step portion 26, and a wiring conductor 27 connected to the semiconductor element 24 is provided on the bottom surface of the mounting portion 25 remote from the step portion 26.
b is applied. The wiring conductor 27a to which the piezoelectric vibrator 23 is connected and the wiring conductor 27b to which the semiconductor element 25 is connected
Are electrically connected to each other inside the insulating base 21. Further, the insulating base 21 has a pair of cutouts 28a from the upper surface to the lower surface on the outer peripheral side at one end where the stepped portion 26 is formed, and cutouts 28b from the upper surface to the lower surface at each outer peripheral corner. ing. On the surface of the notch portion 28a, a check terminal electrically connected to the wiring conductor 27a attached on the step portion 26 in the mounting portion 25 via the inside of the insulating base 21.
29 is formed from the middle to the lower end. The check terminal 29 is for checking the oscillation frequency characteristic of the piezoelectric vibrator 23 connected to the wiring conductor 27a. The piezoelectric vibrator 23 is connected to the step portion 26 of the mounting portion 25 by the wiring conductor 27a.
a while being electrically connected to a, and by bringing a probe of an external frequency measuring device into contact with the check terminal 29 to measure the oscillation frequency of the piezoelectric vibrator 23, the oscillation frequency of the piezoelectric vibrator 23 is measured. The characteristics can be confirmed. Further, the external connection conductor 30 connected to the wiring conductor 27b attached to the bottom surface of the mounting portion 25 is formed in the notch portion 28b from the middle to the lower end thereof. Element 23 and semiconductor element
After the mounting of the piezoelectric vibrator 23 and the semiconductor element 24, the external connection conductor 30 is bonded to the wiring conductor of the external electric circuit board via a conductive bonding member such as solder. To be electrically connected. In the package for accommodating the piezoelectric vibrator, the piezoelectric vibrator 23 and the semiconductor element 24 are mounted on the mounting portion 25 of the insulating base 21 so as to be electrically connected to the wiring conductors 27a and 27b, respectively. An electronic device is formed by joining a metal lid 22 to the upper surface of the base 21. This electronic device is configured to contact a probe connected to an external frequency measuring device with a check terminal 29 and to oscillate the oscillation frequency of the piezoelectric vibrator 23. After confirming the characteristics, the piezoelectric vibrator 23 is attached to the semiconductor element 25 based on the measured oscillation frequency characteristics of the piezoelectric vibrator 23.
Write a program to control the oscillation frequency of
The program makes it possible to suppress fluctuations in the oscillation frequency of the piezoelectric vibrator 23. Then, the external connection conductor 30 is bonded to the wiring conductor of the external electric circuit board via a conductive bonding material such as solder, so that the external connection circuit 30 is mounted on the external electric circuit board. The check terminal 29 is only for connecting the terminal to an external frequency measuring device to check the oscillation frequency characteristic of the piezoelectric vibrator 24. Not required after checking. However, in such a conventional package for accommodating a piezoelectric vibrator, the check terminal 29 is formed in the notch 28b from the middle to the lower end thereof. When the electronic device is mounted on the piezoelectric vibrator 23 and the semiconductor element 24 and mounted on an external electric circuit board, the check terminals 29 and the wiring and solder parts of the external electric circuit board do not needlessly contact with each other. It is easy to cause a short circuit, and when such a short circuit occurs,
There is a problem that the piezoelectric vibrator 23 and the semiconductor element 24 mounted inside cannot be normally operated. The present invention has been devised in view of such a conventional problem, and has as its object to mount a piezoelectric vibrator housing package on a wiring conductor of an external electric circuit board.
The check terminals for checking the oscillation frequency characteristics of the piezoelectric vibrator housed inside do not cause a short circuit due to contact with the wiring part or solder part of the external electric circuit board, and the mounted piezoelectric vibrator and semiconductor element It is an object of the present invention to provide a package for accommodating a piezoelectric vibrator that can operate normally. A package for accommodating a piezoelectric vibrator according to the present invention has a concave mounting for mounting a piezoelectric vibrator and a semiconductor element electrically connected to the piezoelectric vibrator on an upper surface. A notch is provided on the side surface of the substantially rectangular insulating base having a portion from the upper surface to the lower surface of the insulating base, and the piezoelectric vibrator is provided on the insulating base at a position separated from the lower surface in the notch. It is electrically connected via the formed wiring conductor, and is provided with a check terminal for checking the oscillation frequency characteristic of the piezoelectric vibrator by electrically connecting an external frequency characteristic measuring device. It is a feature. According to the package for housing the piezoelectric vibrator of the present invention, since the check terminal for checking the oscillation frequency characteristic of the piezoelectric vibrator is provided at a position separated from the lower surface in the notch, the package can be externally mounted. When mounted on an electric circuit board, the check terminals do not short-circuit due to contact with the wiring and solder parts of the external electric circuit board, and the mounted piezoelectric vibrator and semiconductor element can always operate normally. it can. Next, a package for accommodating a piezoelectric vibrator according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing an embodiment of a package for accommodating a piezoelectric vibrator according to the present invention, wherein 1 is an insulating base, and 2 is a metal lid. The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. And a substantially rectangular concave portion for mounting the piezoelectric vibrator 3 and the semiconductor element 4 for suppressing the fluctuation of the oscillation frequency of the piezoelectric vibrator 3 at the center of the upper surface thereof. A (substantially rectangular parallelepiped concave) mounting portion 5 is provided. Insulating substrate 1
Are formed with a plurality of notches 6a and 6b extending from the upper surface to the lower surface. In this example, the notch 6a
Are formed on one side of the insulating base 1 and the cutouts 6b are formed at four corners. A pair of step portions 7 on which the piezoelectric vibrator 3 is mounted are formed on one end side of the mounting portion 5 of the insulating base 1, and electrodes of the piezoelectric vibrator 3 are provided on the upper surface of the step portion 7. A pair of wiring conductors 8a to be connected is formed. A plurality of wiring conductors 8b to which the semiconductor element 4 is connected are formed on the bottom surface of the mounting portion 5 remote from the step portion 7. The wiring conductor 8a is led out to the notch 6a and is electrically connected to a check terminal 9 described later. Two of the wiring conductors 8b are electrically connected to the wiring conductor 8a via the inside of the insulating base 1, and the rest of the wiring conductors 8b are led out to the notch portions 6b and electrically connected to the external connection conductors 10 described later. It is connected to the. A check terminal 9 connected to the wiring conductor 8a is attached to the surface of the notch 6a at a position separated from the lower surface of the insulating base 1, and the notch 6b
The external connection conductor 10 connected to the wiring conductor 8b
Is attached. The wiring conductors 8a and 8b, the check terminal 9 and the external connection conductor 10 are formed of metal powder of metal such as tungsten, molybdenum, copper, or silver. Note that the check terminal 9 and the external connection conductor 10 are not electrically connected. The wiring conductor 8a functions as a conductive path for electrically connecting the piezoelectric vibrator 3 mounted on the step portion 7 of the mounting portion 5 to the check terminal 9, and the wiring conductor 8b is connected to the mounting portion 5. It functions as a conductive path for electrically connecting the mounted semiconductor element 4 to the external connection conductor 10. And
Each electrode of the piezoelectric vibrator 3 is electrically connected to the wiring conductor 8a via a solder or a conductive resin.
The electrodes of the semiconductor element 4 are electrically connected to each other via electrical connection means such as bonding wires. Thereby, the piezoelectric vibrator 3 and the semiconductor element 4 are electrically connected to each other. The check terminal 9 functions as a terminal for measuring the oscillation frequency characteristic of the piezoelectric vibrator 3 mounted on the step portion 7 of the mounting portion 5 of the insulating base 1, and the piezoelectric vibrator 3 is provided inside the package. After housing the element 3, the oscillation frequency characteristic of the piezoelectric vibrator 3 can be measured by electrically connecting an external frequency characteristic measuring device to the check terminal 9 by, for example, contacting a probe. The external connection conductor 10 functions as a connection terminal for electrically connecting an electrode of the semiconductor element 4 mounted on the mounting portion 5 to a wiring conductor of an external electric circuit board,
After mounting the semiconductor element 4 on the mounting portion 5 of the insulating base 1 and electrically connecting each electrode of the semiconductor element 4 to the wiring conductor 8b, the external connection conductor 10 is soldered to the wiring conductor of the external electric circuit board. The package is mounted on the external electric circuit board, and the semiconductor element 4 mounted on the mounting portion 5 is electrically connected to the wiring conductor of the external electric circuit board. The surfaces of the wiring conductors 8a and 8b, the check terminal 9 and the external connection conductor 10 are oxidized and corroded by the wiring conductors 8a and 8b, the check terminal 9 and the external connection conductor 10. The wiring conductors 8a and 8b and the piezoelectric vibrator 3 and the semiconductor element 4
In order to improve the connection between the external connection conductor 10 and the connection between the external connection conductor 10 and the wiring conductor of the external electric circuit board and the good contact between the check terminal 9 and the probe of the external frequency measuring device, A nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm are sequentially applied by a conventionally known electrolytic plating method or electroless plating method. The insulating base 1 having the wiring conductors 8a and 8b, the check terminals 9 and the external connection conductors 10 is composed of a large number of insulating bases 1 arranged vertically and horizontally in a substantially flat ceramic mother substrate having a large area. It is manufactured from a multi-piece substrate that is integrally formed and arranged. Specifically, for example, when the insulating substrate 1 is made of an aluminum oxide sintered body, a suitable organic binder and a solvent are added to and mixed with raw material powders of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, and the like. A plurality of ceramic green sheets for a ceramic mother board are obtained by forming the sheet into a sheet shape by employing a doctor blade method or the like which is well known in the art, and thereafter, insulating each of these ceramic green sheets. A punched hole for forming a concave portion serving as the mounting portion 5 is formed in the region serving as the base 1 as necessary, and a through hole serving as the cutout portions 6a and 6b is formed at the boundary between the regions serving as the insulating bases 1. Next, upper and lower surfaces of these ceramic green sheets and notches 6a and 6
In the through hole b, the metal conductor paste for the wiring conductors 8a and 8b, the check terminals 9 and the external connection conductors 10 is printed and applied and laminated vertically to form a green ceramic molded body for the ceramic mother board, Next, the green ceramic molded body is fired to form an insulating substrate 1 in a ceramic mother substrate.
To obtain a multi-cavity board in which a plurality of vertical and horizontal arrangements are integrally formed. Then, the wiring conductors 8a and 8b and the check terminals 9 of the insulating bases 1 arranged and formed in the multi-cavity board and It is manufactured by depositing a plating metal layer on the external connection conductor 10 by an electrolytic plating method or an electroless plating method, and finally dividing the ceramic mother substrate into the respective insulating substrates 1. At this time, the through holes serving as the notches 6a and 6b formed in the ceramic mother substrate are divided, and the notches 6a and 6b are formed on the side surfaces of the insulating base 1. Further, in order to divide the ceramic mother substrate into the respective insulating bases 1,
For example, a method is used in which division grooves for dividing the insulating bases 1 are formed in advance on the upper and lower surfaces of the ceramic mother substrate, and the ceramic mother substrate is bent along the division grooves. In the package for accommodating the piezoelectric vibrator of the present invention, the check terminal 9 formed on the cutout 6a formed on the side surface on one side from the upper surface to the lower surface of the insulating substrate 1 is provided on the insulating substrate 1. It is provided at a position separated from the lower surface of the first device 1, which is important. As described above, since the check terminals 9 are provided separately from the lower surface of the insulating base 1 in the cutouts 6a formed on the side surfaces of the insulating base 1 from the upper surface to the lower surface, the package for housing the piezoelectric vibrator is provided. After the piezoelectric vibrator 3 and the semiconductor element 4 are mounted therein to form an electronic device, a probe connected to an external frequency characteristic measuring device is brought into contact with the check terminal 9 to mount the piezoelectric vibrator 3 therein. After measuring the oscillation frequency characteristics, the external connection conductor of the package for storing the piezoelectric vibrator
Even if 10 is connected to the wiring conductor of the external electric circuit board via the electric connection means made of solder or the like, the check terminal 9 does not come into contact with the wiring conductor or solder of the external electric circuit board. Therefore, the piezoelectric vibrator 3 and the semiconductor element 4 mounted inside can always be normally operated. The check terminal 9 is attached to a side surface of the insulating base 1 in a notch 6a formed from the upper surface to the lower surface of the insulating base 1, so that the notch 6a is used for the probe. Since the probe can be used as a guide for positioning, the probe can be easily and accurately brought into contact with the check terminal 9. Further, when the insulating substrate 1 is manufactured, the through holes for the cutouts 6a provided in the ceramic mother substrate for obtaining the same are vertically opened, and the plating solution can well penetrate into the inside. Since it is possible, the plated metal layer can be satisfactorily adhered to the check terminals 9. In order to provide the check terminal 9 at a position separated from the lower surface of the insulating base 1, when obtaining the insulating base 1, a plurality of ceramic green sheets serving as a ceramic mother substrate for obtaining the insulating base 1 must be provided. Of the through holes for the notch 6a provided, for example, the through holes for the notch 6a provided in the ceramic green sheet for the lowermost layer need not be coated with the metallization paste for the check terminal 9. . Thus, in the package for accommodating the piezoelectric vibrator of the present invention, the piezoelectric vibrator 3 and the semiconductor element 4 are electrically connected to the wiring conductors 8a and 8b on the mounting portion 5 of the insulating base 1. After mounting, a metal lid 2 is attached so as to cover the piezoelectric vibrator 3 and the semiconductor element 4, thereby providing an electronic device in which the piezoelectric vibrator 3 and the semiconductor element 4 are hermetically sealed. . In such an electronic device, the notch 6 formed on the side surface of the insulating base 1 is provided.
a. A probe connected to an external frequency characteristic measuring device is brought into contact with a check terminal 9 provided at a, and an oscillation frequency characteristic of the piezoelectric vibrator 3 mounted inside is measured. A program for controlling the oscillation frequency of the piezoelectric vibrator 3 is written in the element 4, and the program makes it possible to suppress the fluctuation of the oscillation frequency of the piezoelectric vibrator 3. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the ceramic green sheet constituting the insulating base 1 has a three-layer structure. However, the number of the ceramic green sheets may be two or four or more. Although the plurality of cutouts 6a formed on the side surface of the insulating base 1 are provided on the side of one side of the substantially rectangular insulating base 1 in FIG. 1, the positions where the cutouts 6a are provided are shown. May be a corner of the insulating base 1 or may be provided on each side. As described above, according to the package for accommodating the piezoelectric vibrator of the present invention, the piezoelectric vibrator and the semiconductor element electrically connected to the piezoelectric vibrator are mounted on the upper surface. A piezoelectric vibrator was formed on the insulating substrate at a position separated from the lower surface of the insulating substrate in a notch formed on the side surface of the substantially rectangular insulating substrate having a concave mounting portion from the upper surface to the lower surface of the insulating substrate. The package for storing the piezoelectric vibrator is provided with a check terminal that is electrically connected through the wiring conductor and that checks the oscillation frequency characteristic of the piezoelectric vibrator by electrically connecting an external measuring device. After the piezoelectric vibrator and the semiconductor element are housed in the electronic device, the external frequency characteristic measuring device is easily and satisfactorily brought into contact with the check terminal by an electric probe. When connected to an external electric circuit board, the characteristics of the piezoelectric vibrator can be measured and checked, and when this is mounted on an external electric circuit board, the check terminals come into contact with the wiring conductors, solder, etc. of the external electric circuit board. There is no short circuit. Therefore, it is possible to provide a package for accommodating a piezoelectric vibrator that can always normally operate the piezoelectric vibrator and the semiconductor element housed therein.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing an example of a piezoelectric vibrator housing package according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing an example of a conventional package for storing a piezoelectric vibrator. [Description of Signs] 1... Insulating base 2... Lid 3... Piezoelectric vibrator 4... Semiconductor element 5... ..Notch 8a ····· Wiring conductor 9 ··· Check terminal

Claims (1)

Claims 1. A side surface of a substantially quadrangular insulating base having an upper surface having a piezoelectric vibrator and a concave mounting portion for mounting a semiconductor element electrically connected to the piezoelectric vibrator. A notch is provided from the upper surface to the lower surface of the insulating base, and the piezoelectric vibrator is electrically connected to a position in the notch separated from the lower surface via a wiring conductor formed on the insulating base. A package for accommodating a piezoelectric vibrator, comprising a check terminal for checking an oscillation frequency characteristic of the piezoelectric vibrator by electrically connecting an external frequency characteristic measuring device.