JP4587912B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package in which an electronic component such as a semiconductor element or a crystal resonator is stored, and an electronic device.

  2. Description of the Related Art Conventionally, an electronic component storage package for storing an electronic component such as a semiconductor element or a crystal resonator has a plurality of insulating layers made of ceramics such as an aluminum oxide sintered body as shown in FIG. A substrate 401 having an electronic component mounting portion (not shown) on the upper surface, a notch 403 formed on the side surface of the substrate 401 from the upper surface to the lower surface, and a conductor formed on the inner surface of the notch 403 A layer 404 and a wiring conductor (not shown) led out from the periphery of the mounting portion of the substrate 401 to the outside of the mounting portion are provided.

  An electronic component (not shown) is mounted on the mounting portion of the substrate 401, and the electrodes of the electronic component are electrically connected to the wiring conductor 413 via a bonding wire or a conductive bonding material (not shown). Thereafter, a lid 411 is joined to the upper surface of the substrate 401 so as to close the mounting portion, and an electronic component is housed in the mounting portion in an airtight manner, so that an electronic device as a product is obtained. The electronic component is a semiconductor element, a crystal resonator, a surface acoustic wave element, a capacitor, a resistor, an inductor, or the like.

 When the electronic device is used for surface mounting, an external connection electrode 413 for electrically and mechanically connecting to an external circuit board is formed on the lower surface of the substrate 401.

  Furthermore, there are some in which electrical check terminals (side electrodes) for adjusting electrical characteristics of mounted electronic components and writing data information are formed. The electrical check terminal includes, for example, a conductor layer 404 formed on the inner surface of the notch 403, and the conductor layer 404 is electrically connected to the electronic component.

For example, when the conductor layer 404 is made of a metallized conductor formed by simultaneous firing with a substrate 401 made of a ceramic material, the conductor layer 404 is formed as shown in FIG. A plurality of ceramic green sheets 501a and 501b having a substrate region to be a substrate 401 are formed with a through hole 504 to be a notch 403 so as to straddle the outer edge of the substrate region, and a metallized paste is formed inside the through hole 504. The metallized paste is applied to the inner surface of the through hole 504 by pouring and removing the excess metallized paste by suction (FIG. 5A). The plurality of ceramic green sheets are laminated so that the through-holes 504 communicate with each other vertically (FIG. 5B) and fired, and then divided for each substrate region, whereby the through-holes 504 are divided. A conductor layer 404 is formed on the inner surface of the formed notch 403.
JP 2004-214799 A

  However, in the above-described prior art, a portion that protrudes inside the notch portion is likely to be formed on the surface of the conductor layer, so that it is difficult to make an electrical connection between the conductor layer and the probe pin, etc. There was a problem of becoming.

  Such a protruding portion is due to the fact that when the conductor layer is formed, the metallized paste serving as the conductor layer becomes thicker toward the lower side in each ceramic green sheet due to the influence of gravity. That is, the conductor layer is formed thicker toward the lower side in each insulating layer, and the conductor layer enters the inside of the notch by the thickness, so that the width of the notch is reduced.

  In particular, with the recent miniaturization and higher density of electronic devices, the width of the notch has become very small, and the above-mentioned problems tend to occur.

  The present invention has been devised in view of the problems in the prior art, and its purpose is to reduce the protrusions generated on the surface of the conductor layer formed in the notch on the side surface of the substrate, and An object of the present invention is to provide an electronic component storage package and an electronic device that can be easily electrically connected to a probe pin.

The electronic component storage package of the present invention is formed by laminating a plurality of insulating layers, has an electronic component mounting portion on an upper surface, and has a notch formed in a vertical direction across the plurality of insulating layers on a side surface. A substrate and a conductor layer formed on the inner surface of the notch and electrically connected to the electronic component are provided, and the notch gradually increases in width from the upper surface to the lower surface in each insulating layer. The conductor layer is formed so that the thickness gradually increases from the upper surface to the lower surface in each insulating layer.

  An electronic device of the present invention includes the electronic component storage package of the present invention and an electronic component mounted on the mounting portion of the electronic component storage package.

  In the electronic component storage package according to the present invention, the notch is formed so that the width gradually increases from the upper surface to the lower surface in each insulating layer, and the conductor layer gradually increases from the upper surface to the lower surface in each insulating layer. By being formed so as to increase in thickness, the thickness of the conductor layer that gradually increases from the upper surface to the lower surface in each insulating layer can be absorbed by the notch formed so as to gradually increase from the upper surface to the lower surface. It is possible to reduce the protrusion of the conductor layer inside the notch.

  As a result, the conductor layer can be kept from entering the inside of the notch, and electrical connection between the conductor layer formed in the notch and the probe pin can be facilitated.

  An electronic device according to the present invention includes a package for storing an electronic component according to the present invention and an electronic component mounted on the mounting portion of the package for storing the electronic component, thereby providing a conductor layer that is small and serves as an electrical check terminal. It is possible to provide a highly reliable electronic device having excellent electrical connectivity between the probe pin and the probe pin.

  Hereinafter, an electronic component storage package and an electronic device according to the present invention will be described in detail with reference to the accompanying drawings. Fig.1 (a) is a side view which shows an example of embodiment of the electronic component storage package of this invention, (b) is the top view. In FIGS. 1A and 1B, reference numeral 101 denotes a substrate, 103 denotes a groove-shaped notch formed on the side surface of the substrate 101, 104 denotes a conductor layer, and 113 denotes an external connection conductor.

  In this example, the substrate 101 is formed by attaching a metal frame 109 surrounding the mounting portion 102 to the upper surface of a flat plate portion having the mounting portion 102 (concave portion) of the electronic component 107 on the upper surface.

  The substrate 101 is a container for housing the electronic component 107, and the electronic component 107 is mounted on the mounting portion 102. The electronic component 107 is a semiconductor element, a crystal resonator, a surface acoustic wave element, a capacitor, a resistor, an inductor, or the like.

  The substrate 101 is formed by laminating a plurality of insulating layers 112 made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. The substrate 101 is formed by laminating and firing a plurality of plate-like or frame-like ceramic green sheets (three in the example shown in FIG. 1).

  In this embodiment, a wiring conductor 105 made of a metallized conductor such as tungsten, molybdenum, copper, or silver is led out from the periphery of the mounting portion 102 of the substrate 101 to the outer surface such as the lower surface or the side surface of the substrate 101.

  The wiring conductor 105 has a function of leading an electrode (not shown) of the electronic component 107 to the outer surface of the substrate 101. In the wiring conductor 105, the electrode of the electronic component 107 is connected to a portion exposed around the mounting portion 102 via a bonding wire 114 or the like. Thereby, the electrode of the electronic component 107 is led out to, for example, the side surface and the lower surface of the substrate 101 and is electrically connected to a conductor layer 104 and an external terminal electrode 113 described later.

  Further, a cutout portion 103 is formed on the side surface of the substrate 101 in the vertical direction across the plurality of insulating layers 112. A conductor layer 104 is formed on the inner surface of the notch 103. The conductor layer 104 is connected to a portion where the wiring conductor 105 is led out.

  For example, the conductor layer 104 is electrically connected to the electronic component 107 mounted on the mounting unit 102 via the wiring conductor 105, adjusts the electrical characteristics of the electronic component 107, and writes data information to the electronic component 107. Functions as a terminal for dragging.

  The probe pin 110 is brought into contact with and electrically connected to the conductor layer 104, and an external measuring instrument or the like is electrically connected to the electronic component 107 from the probe pin 110 via the conductor layer 104. Signals are exchanged with an external measuring instrument or the like, and measurement, information writing, or the like is performed on the electronic component 107.

  An external terminal electrode 113 is formed on the lower surface of the substrate 101 so as to be electrically connected to the wiring conductor 105.

  By connecting the external terminal electrode 113 to a circuit conductor of an external electric circuit board (not shown) via solder or the like, the electrode of the electronic component 107 is connected to the external electric conductor via the wiring conductor 105 and the external terminal electrode 113. It is electrically connected to the circuit conductor of the circuit board.

In the electronic component storage package of the present invention, in each of the insulating layers 112 in which the conductor layer 104 is formed in the notch 103, the conductor layer 104 is formed so that the width gradually increases from the upper surface to the lower surface. Each insulating layer 112 is formed so that the thickness gradually increases from the upper surface to the lower surface. (Figure 2)
The cross-sectional shape of the notch 103 is, for example, an ellipse, and the width gradually increases as the radius increases gradually from the upper surface to the lower surface of the side surface of the substrate 101.

  Further, the conductor layer 104 is formed so that its thickness gradually increases from the upper surface to the lower surface of each insulating layer 112 in accordance with the gradually increasing width of the widened notch 103.

  Since the shape of the notch 103 and the conductor layer 104 is set as described above, the thickness of the conductor layer 104 that gradually increases from the upper surface to the lower surface in each insulating layer 112 is increased. Can be absorbed in width. Therefore, the conductor layer 104 is effectively prevented from protruding inside the notch 103. In this case, since the conductor layer 104 can be formed so as to gradually increase in thickness from the upper surface to the lower surface in the insulating layer 112, the conductor layer 112 can be easily formed according to gravity.

The width of the notch 103 is wide at the portion where the probe pin 110 abuts, and the probe pin 110 can be easily abutted on the conductor layer 104. Therefore, it is possible to correctly adjust the electrical characteristics and write data information to the electronic component 107 repeatedly from the probe pin 110 through the conductor layer 104.

  For example, when the substrate 101 is made of an aluminum oxide sintered body and the size of the substrate 101 is about 5.0 × 3.2 mm, the width of the notch 103 is about 0.5 mm. The thickness of the conductor layer 104 formed on the inner surface of the portion 103 is about 10 to 40 μm. Depending on the thickness of the conductor layer 104, the notch 103 of each insulating layer 112 is formed so that the width gradually increases from the upper surface to the lower surface. Then, the conductive layer 104 is formed on the surface of the notch 103 of each insulating layer 112 so that the thickness gradually increases from the upper surface to the lower surface, so that each insulating layer 112 continuous from the upper surface to the lower surface of the substrate 101 is formed. The surface of the conductor layer 104 of the notch 103 is formed to have substantially the same diameter.

  In order to adjust the electrical characteristics of electronic components 107 such as elements and semiconductor elements inside the substrate 101 and to write data information, for example, the width of the tip of the conductor layer 104 formed on the side surface of the substrate 101 is 0. A 3 mm needle-like probe pin 110 is abutted so that it can be electrically connected. In addition, the probe pin 110 for performing such electrical connection has a rhodium alloy or the like on its surface so that good electrical connectivity can be obtained even in a short time contact and in consideration of wear resistance. In this structure, the probe pin 110 is pressed against the conductor layer 104 by an elastic member that adheres the metal or an elastic member such as a spring.

Here, a method of forming the conductor layer 104 will be described with reference to FIG. First, as shown in FIG. 3 (a), through holes 304 are formed in the ceramic green sheets 301a and 301b to be the substrate 101 so that the width gradually increases from the upper surface to the lower surface, and then the upper surface from the upper surface to the lower surface is formed. The conductive paste is applied so that the thickness gradually increases over time. At that time,
By making the hole diameter of the receiving mold larger than the punching diameter for punching for forming the through hole 304, the through hole 304 can be formed to have the above shape. In addition, when the conductor paste hangs down to the lower surface side of the ceramic green sheets 301a and 301b by its own weight, the conductor paste can be applied so as to have the shape as described above.

  Then, as shown in FIG. 3B, the ceramic green sheet 301a laminated in the middle is laminated on the ceramic green sheet 301b laminated on the lower side. Thereafter, an upper ceramic green sheet (not shown) in which the conductor layer 104 is not further formed is laminated on the two-layer laminate, and the obtained three-layer laminate is fired to thereby obtain the electronic component of the present invention. A storage package is manufactured.

  Here, the lower surface 302 (a) of the conductor layer 104 formed on the ceramic green sheet 301a laminated in the middle is higher than the upper surface 302 (b) of the conductor layer 104 formed on the ceramic green sheet 301b laminated on the lower side. Since the ceramic green sheet 301a laminated in the middle is laminated on the ceramic green sheet 301b laminated on the lower side, the connection conductor (for improving the electrical connection between the upper and lower conductor layers) It is possible to connect the upper and lower conductor layers electrically well without forming another auxiliary conductor formed on the upper and lower conductor layers.

  Further, since it is not necessary to form a connecting conductor between the ceramic green sheet 301a laminated in the middle and the ceramic green sheet 301b laminated below, the thickness of the laminated body is partially equal to the thickness of the connecting conductor. There is also an effect of preventing the occurrence of delamination in the adhesion layer without increasing the thickness.

  The conductor layer 104 is not limited to the terminals as described above, but can also function as a connection conductor that improves the connection reliability of the electronic component storage package to the external electric circuit board. That is, if the conductor layer 104 is formed so as to reach the lower end of the substrate 101 and be continuous with the external terminal electrode 113, the circuit conductor and solder of the external electric circuit board are connected from the external terminal electrode 113 to the conductor layer 104. It is strongly joined by. At this time, the solder also scoops up on the conductor layer 104 formed on the side surface of the substrate 101, so that the substrate 101 and the wiring conductor of the external electric circuit substrate are more firmly bonded.

  In such an electronic component storage package, the exposed metal layers such as the conductor layer 104, the wiring conductor 105, the external terminal electrode 113, and the sealing metallization layer are prevented from being oxidatively corroded and mounted. In order to improve the electrical connection between the wiring conductor 105 around the electrode 102 and the electrode of the electronic component 107 and the electrical connection between the external terminal electrode 113 and the wiring conductor of the external electric circuit board, the conductor layer 104, the wiring conductor 105, the external terminal electrode 113, and the exposed metal layer such as a sealing metallized layer, for example, a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating having a thickness of about 0.1 to 3 μm. The layers are sequentially deposited by electrolytic plating.

  The electronic device of the present invention is formed by mounting the electronic component 107 on the mounting portion 102 of the electronic component storage package (substrate 101) described above.

  For example, the electronic component 107 is mounted on the mounting portion 102 of the substrate 101 and accommodated inside the frame 109, and the electrodes of the electronic component 107 are bonded to the wiring conductor 105 around the mounting portion 102 with a bonding wire or a conductive bonding material. After that, for example, a metallization layer for sealing is formed in a frame shape in advance on the upper surface of the frame body 111 of the substrate 101, and the metallization layer for sealing is made of metal. The lid body 111 is joined by welding or brazing so as to close the mounting portion 102, and the electronic component 107 is hermetically accommodated in a container composed of the substrate 101 and the lid body 111, whereby an electronic device is obtained.

  The electronic device is mounted on the external electric circuit board by connecting the external terminal electrode 113 formed on the lower surface of the substrate 101 to the wiring conductor of the external electric circuit board via solder, and the electronic device 107 accommodated therein The electrode is electrically connected to the external electric circuit.

  In addition, operations such as adjustment and writing of data are performed on the electrical characteristics of the electronic component through the conductor layer 104 electrically connected to the electronic component 107.

  According to such an electronic device, since the electronic component 107 is mounted on the electronic component storage package of the present invention, the electrical connection between the probe layer 110 and the conductor layer 104 that is small and serves as an electrical check terminal is improved. An excellent and highly reliable electronic device can be provided.

  In addition, this invention is not limited to the example of above-mentioned embodiment, In the range which does not deviate from the summary of this invention, it can deform | transform into various forms.

  For example, in the above example, the cross-sectional shape of the groove-shaped notch 103 formed on the side surface of the substrate 101 from the upper surface to the lower surface is an ellipse, but this cross-sectional shape may be a semicircular shape or a rectangular shape. Needless to say, it is good.

(A) is a side view which shows an example of embodiment of the electronic component storage package of this invention, (b) is the top view. It is an enlarged view of the notch part 103 shown in FIG. It is a figure which shows the manufacturing method of the electronic component storage package of this invention. It is a side view which shows an example of embodiment of the conventional electronic component storage package. It is a figure which shows the manufacturing method of the conventional electronic component storage package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Board | substrate 102 ... Mounting part 103 ... Notch part 104 ... Conductor layer 107 ... Electronic component 108 ... Gold plating layer 111 ·····Probe pin

Claims (2)

A substrate having a plurality of insulating layers stacked and having an electronic component mounting portion on the upper surface, and a side surface formed with a notch in the vertical direction across the plurality of insulating layers, and an inner surface of the notch A conductor layer formed and electrically connected to the electronic component;
The notch is formed so that the width gradually increases from the upper surface to the lower surface in each insulating layer, and the conductor layer is formed so that the thickness gradually increases from the upper surface to the lower surface in each insulating layer. Electronic component storage package characterized by the above. An electronic device comprising: the electronic component storage package according to claim 1; and an electronic component mounted on the mounting portion of the electronic component storage package.

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